A high-precision reciprocating rotary ball spline for a chip mounter

Abstract

The present invention belongs to the technical field of ball splines, and particularly relates to a high-precision reciprocating rotary ball spline for a mounter, which includes a chamber. A bracket is fixed to the inner wall of the chamber. Two motors are fixed to the left side of the bracket. A ball sleeve is installed on the bottom of the bracket through a bearing. A spline shaft is inserted into the interior of the ball sleeve. A connecting block is installed on the upper end of the ball sleeve through a bearing. Two guide wheels are installed in the bracket through bearings. One of the guide wheels is fixed to the output end of one of the motors. A belt is connected between the two guide wheels. The belt is fixed to the connecting block. A connecting belt is connected between the ball sleeve and the output end of the other motor. This device solves the problem that when the current mounter uses a rotary ball spline to perform component placement, the buffer strength cannot be adjusted, thus adjusting the placement speed, and components with different precision requirements can be placed using one mounter.

Description

Technical Field

[0001] The invention belongs to the technical field of ball splines, and particularly relates to a high-precision reciprocating rotary ball spline for a mounter. Background Art

[0002] Due to the special structural design of the ball spline, the spline bush can also perform a linear motion along the axis direction of the spline shaft. When the spline bush is subjected to an axial force, the balls will roll in the raceway to guide the spline bush to perform an accurate linear displacement. Ball splines are mainly applied to medical devices or mounters. The mounter places surface mount components (SMD / SMC) accurately on the corresponding pads of the PCB pre-coated with solder paste or patch glue through a high-speed moving placement head, ensuring reliable electrical connection between the components and the circuit board. However, the accuracy requirements of the components vary. Different mounters with different speeds are used for components with different accuracy requirements. The number of mounters used is large and the cost is high. Moreover, efficient buffering cannot be performed during patching, resulting in poor patching accuracy and low production quality of the components. This phenomenon has become a problem that needs to be solved urgently by those skilled in the art. Summary of the Invention

[0003] The purpose of the invention is to provide a high-precision reciprocating rotary ball spline for a mounter to solve the problems raised in the above background art.

[0004] To solve the above technical problems, the invention provides the following technical solution: A high-precision reciprocating rotary ball spline for a mounter, including a chamber. A bracket is fixed to the inner wall of the chamber. Two motors are fixed to the left side of the bracket. A ball sleeve is installed on the bottom of the bracket through a bearing. A spline shaft is inserted into the interior of the ball sleeve. A connecting block is installed on the upper end of the ball sleeve through a bearing. Two guide wheels are installed in the bracket through bearings. One of the guide wheels is fixed to the output end of one of the motors. A belt is connected between the two guide wheels. The belt is fixed to the connecting block. A connecting belt is connected between the ball sleeve and the output end of the other motor. A patch adsorber is installed at the lower end of the spline shaft. A buffer chamber is fixed to the right side of the inner wall of the chamber. A buffer plate is slidably connected to the inner wall of the buffer chamber. Four flow holes are provided on both the left and right sides of the surface of the buffer plate. Hydraulic oil is filled below the buffer plate. A connecting rod is fixedly connected above the buffer plate. The connecting rod is fixedly connected to one side of the connecting block. Through holes are provided above and below the buffer chamber. The connecting rod is slidably connected in the upper through hole.

[0005] The present invention further illustrates that holes are provided at the bottom of the buffer plate. A slider is slidably connected to the inner wall of the hole. A slide bar is fixed to the bottom of the slider. A spring is provided below the slider. The bottom end of the slide bar is fixed with a disc. Blocks are fixed on both the left and right sides of the disc, and the blocks are in mutual contact with the bottom of the flow hole. A rotating rod is fixed to the bottom of the disc, and an adjusting head is fixed to the bottom end of the rotating rod.

[0006] The present invention further illustrates that the mounter is applied to four types of components, and the four types of components respectively correspond to low-speed, medium-speed, high-speed, and ultra-high-speed mounters.

[0007] The present invention further illustrates that a ring plate is fixed to the outer side of the rotating rod. A trapezoidal groove is provided on the outer ring of the ring plate, and a retaining piece is provided in the middle. A ring shaft is connected between the retaining pieces. There are two ring shafts, which are relatively distributed on the left and right sides of the retaining piece. Arc-shaped discs are connected to the outer rings of the ring shafts.

[0008] The present invention further illustrates that the inner sides of the two arc-shaped discs are sleeved on the outer side of the rotating rod.

[0009] The present invention further illustrates that the spline shaft makes reciprocating up and down movements through one motor and makes rotational movements through another motor.

[0010] The present invention further illustrates that grooves are provided on the inner sides of the two arc-shaped discs, and there is a gap between the grooves and the rotating rod.

[0011] Compared with the prior art, the beneficial effects achieved by the present invention are as follows: In the present invention, during the chip mounting process of the mounter used, compared with directly buffering through a spring, a better buffering effect can be maintained at all times. The elastic ability of the spring decreases after continuous use, so there is no need to frequently replace the spring, thereby reducing costs and improving the stability of chip mounting, and thus improving the chip mounting quality. By adjusting the number of exposed flow holes, the buffering intensity can be freely adjusted, which is applicable to the chip mounting work of components with different precision requirements, has a wide range of applications, and one mounter can be used to handle components with different precision requirements;

[0012] When the spline shaft moves downward for chip mounting, a thrust is applied upward to the rotating rod. The rotating rod drives the block to tightly press against the flow hole through the disc. In the tightly fitting state, it is avoided that the hydraulic oil flows through other flow holes, and it only flows through the exposed flow holes, thereby ensuring the buffering intensity and improving the precision of the buffering intensity. The speed of the spline shaft when moving downward is efficiently adjusted, and the chip mounting quality is further improved. When the spline shaft moves upward for resetting, the rotating rod drives the block to slightly loosen from the flow hole through the disc. When the hydraulic oil flows back and forth through the exposed flow holes, a small part will flow through other flow holes, thereby greatly reducing the buffering intensity, and the reset speed can be relatively increased, thereby accelerating the chip mounting speed and improving the work efficiency;

[0013] Moreover, the hydraulic oil flows back and forth through the gap with high intensity, which can transfer energy more smoothly in the hydraulic system, reduce energy loss during the transfer process, and the highly fluid hydraulic oil can better carry away the heat generated in the buffer chamber, preventing performance degradation or equipment damage caused by excessive oil temperature. Especially in high-intensity and long-term operation of the hydraulic system, the highly fluid hydraulic oil can maintain good fluidity even in low-temperature environments, ensuring that the mounter can start and operate smoothly in cold environments, improving the reliability of the equipment, and reducing the foam and gas dissolution in the system, improving the stability and efficiency of the mounter. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] The drawings are used to provide a further understanding of the present invention and constitute a part of the specification. They are used together with the embodiments of the present invention to explain the present invention and do not constitute a limitation to the present invention. In the drawings:

[0015] Figure 1 is a schematic diagram of the overall structure of the present invention;

[0016] Figure 2 is a plan view of the mounter of the present invention;

[0017] Figure 3 is a schematic diagram of the internal structure of the buffer chamber of the present invention;

[0018] Figure 4 is a schematic diagram of the positional relationship between the stopper and the flow holes of the present invention;

[0019] Figure 5 is a schematic diagram of the connection relationship between the ring shaft and the arc-shaped disc of the present invention;

[0020] Figure 6 is a schematic diagram of the number of exposed flow holes corresponding to the low-speed, medium-speed, high-speed, and ultra-high-speed mounters of the present invention;

[0021] Figure 7 is a schematic diagram of the state of the arc-shaped disc when the spline shaft moves downward of the present invention;

[0022] Figure 8 is a schematic diagram of the state of the arc-shaped disc when the spline shaft moves upward of the present invention;

[0023] In the figures: 1, chamber; 2, bracket; 21, ball sleeve; 22, spline shaft; 23, connecting block; 24, guide wheel; 25, belt; 26, connecting band; 3, motor; 4, buffer chamber; 41, buffer plate; 411, flow hole; 412, hole; 413, slider; 414, slide bar; 415, elastic spring; 42, connecting rod; 43, disc; 431, stopper; 44, rotating rod; 441, ring disc; 442, ring shaft; 45, adjusting head; 46, arc-shaped disc; 461, groove. DETAILED DESCRIPTION OF THE INVENTION

[0024] The technical solution of the present invention will be further described in detail in conjunction with the preferred embodiments and their accompanying drawings in a non-limiting manner. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all of the embodiments. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present invention without creative efforts shall fall within the scope of protection of the present invention.

[0025] Please refer to Figures 1-8 , the present invention provides a technical solution: a high-precision reciprocating rotary ball spline for a chip mounter, including a chamber 1, a bracket 2 is fixed on the inner wall of the chamber 1, two motors 3 are fixed on the left side of the bracket 2, a ball sleeve 21 is installed on the bottom of the bracket 2 by a bearing, a spline shaft 22 is inserted into the inside of the ball sleeve 21, a connecting block 23 is installed on the upper end of the ball sleeve 21 by a bearing, two guide wheels 24 are installed in the bracket 2 by bearings, one of the guide wheels 24 is fixed to the output end of one of the motors 3, a belt 25 is connected between the two guide wheels 24, the belt 25 is fixed to the connecting block 23, a connecting belt 26 is connected between the ball sleeve 21 and the output end of the other motor 3, and a chip adsorber is installed at the lower end of the spline shaft 22;

[0026] A buffer chamber 4 is fixed on the right side of the inner wall of the chamber 1. A buffer plate 41 is slidably connected to the inner wall of the buffer chamber 4. Four flow holes 411 are provided on both the left and right sides of the surface of the buffer plate 41. Hydraulic oil is filled below the buffer plate 41. A connecting rod 42 is fixedly connected above the buffer plate 41. The connecting rod 42 is fixedly connected to one side of the connecting block 23. Through holes are provided above and below the buffer chamber 4. The connecting rod 42 is slidably connected in the upper through hole;

[0027] One of the motors 3 drives the ball sleeve 21 to rotate through the connecting belt 26. The ball sleeve 21 drives the spline shaft 22 to rotate. The spline shaft 22 adsorbs the chip through the chip adsorber and brings it above the component. Then the other motor 3 drives the belt 25 to transmit through the guide wheel 24. The belt 25 drives the spline shaft 22 to make a reciprocating up and down movement through the connecting block 23. The spline shaft 22 drives the chip adsorber to move downward, so that the chip is attached to the component. The chip adsorber releases the chip. Then the spline shaft 22 resets, and the above operation is repeated to perform the chip mounting work;

[0028] During the chip mounting process, the connecting block 23 drives the connecting rod 42 to move up and down. The connecting rod 42 drives the buffer plate 41 to slide up and down along the inner wall of the buffer chamber 4. When the spline shaft 22 moves downward for chip mounting, the buffer plate 41 moves downward, and the hydraulic oil below it is squeezed, and is squeezed through the flow holes 411 to the upper part of the buffer plate 41, thereby buffering the buffer plate 41, avoiding that the chip mounting speed is too fast to ensure the chip mounting accuracy. When the spline shaft 22 resets, the hydraulic oil above the buffer plate 41 is squeezed back to its lower part. By the reciprocating flow of the hydraulic oil in the flow holes 411, compared with directly buffering through a spring, a good buffering effect can be maintained at all times. The elastic ability of the spring decreases after continuous use, so there is no need to frequently replace the spring, thus reducing costs and improving the stability of chip mounting, thereby improving the chip mounting quality.

[0029] A hole 412 is provided at the bottom of the buffer plate 41. A slider 413 is slidably connected to the inner wall of the hole 412. A sliding rod 414 is fixed to the bottom of the slider 413. A elastic spring 415 is provided below the slider 413;

[0030] The bottom end of the sliding rod 414 is fixed with a disc 43. Blocks 431 are fixed on both the left and right sides of the disc 43, and the blocks 431 are in mutual contact with the bottom of the flow holes 411. A rotating rod 44 is fixed to the bottom of the disc 43. An adjusting head 45 is fixed to the bottom end of the rotating rod 44;

[0031] The operator drives the rotating rod 44 to rotate by rotating the adjusting head 45. The rotating rod 44 drives the sliding rod 414 to rotate through the disc 43. The sliding rod 414 drives the slider 413 to rotate in the hole 412. The disc 43 rotates to drive the two blocks 431 to rotate, adjusting the number of exposed flow holes 411. The more the number of exposed flow holes 411, when the buffer plate 41 reciprocates up and down, the hydraulic oil is squeezed, and the amount of hydraulic oil flowing through the flow holes 411 increases, and the pressure relief ability is improved, thereby reducing the buffering intensity. On the contrary, the buffering intensity is increased. The buffering intensity is freely adjustable, suitable for chip mounting work of components with different precision requirements, and has a wide application range. One chip mounter can be used to handle components with different precision requirements.

[0032] The chip mounter is applied to four types of components, and the four types of components respectively correspond to low-speed, medium-speed, high-speed and ultra-high-speed chip mounters;

[0033] Example 1: A low-speed chip mounter, which is applied to high-precision components. At this time, the operator rotates the adjusting head 45 to expose two flow holes 411. The precision of the components is high, the buffering intensity is large, and the reciprocating movement speed of the spline shaft 22 is slow. It is used for chip mounting of components with high precision requirements. This type of chip mounter performs well in the production of high-precision products. Although the speed is slow, its application value in specific fields such as the aerospace field cannot be underestimated;

[0034] Example 2: Medium-speed mounter, which is applied to medium-precision components, exposes four flow holes 411, has a medium precision requirement for components, maintains stable buffering strength, and has a stable reciprocating movement speed of the spline shaft 22. The medium-speed mounter achieves a good balance between speed and precision, is widely used in the manufacturing of various electronic products, has a high cost performance, and is the preferred equipment for many small and medium-sized enterprises and R & D laboratories;

[0035] Example 3: High-speed mounter, which is applied to low-precision components, exposes six flow holes 411, has a relatively low precision requirement for components, reduces the buffering strength again, and the reciprocating movement speed of the spline shaft 22 is accelerated again. The high-speed mounter is favored by the market for its high production efficiency and stability, is widely used in large-scale production lines, and can significantly improve production efficiency and reduce production costs;

[0036] Example 4: Ultra-high-speed mounter, which is applied to a large number of low-precision components, exposes eight flow holes 411, usually adopts a rotary multi-head system, can process multiple components simultaneously, has a low precision requirement for components, greatly reduces the buffering strength, and the reciprocating movement speed of the spline shaft 22 is fast, which greatly improves production efficiency and mounting precision. This type of mounter is widely used in high-end electronic products and large-scale production lines and is a cutting-edge equipment in modern electronic manufacturing.

[0037] A ring plate 441 is fixed on the outer side of the rotating rod 44. A trapezoidal groove is formed in the outer ring of the ring plate 441, and a retaining piece is arranged in the middle. The retaining pieces are connected by a ring shaft 442. There are two ring shafts 442, which are relatively distributed on the left and right sides of the retaining piece. Arc-shaped plates 46 are connected to the outer circles of the ring shafts 442.

[0038] The inner sides of the two arc-shaped plates 46 are sleeved on the outer side of the rotating rod 44.

[0039] The spline shaft 22 makes a reciprocating up and down movement through one of the motors 3 and makes a rotational movement through the other motor 3;

[0040] One of the motors 3 makes the spline shaft 22 reciprocate up and down through the belt 25 for the chip mounting work. When the spline shaft 22 moves downward for chip mounting, the buffer plate 41 moves downward, drives the rotating rod 44 to move downward quickly through the disc 43, and a resistance is generated between the bottom of the arc-shaped plate 46 and the hydraulic oil. The arc-shaped plate 46 is pushed to rotate around the ring shaft 442 through the resistance, and the two arc-shaped plates 46 move away from each other and open (as Figure 7), at this time, the resistance increases, so that the rotating rod 44 applies an upward thrust. The rotating rod 44 drives the stopper 431 through the disc 43 to tightly hold against the flow hole 411. In the tightly fitting state, it is possible to prevent the hydraulic oil from flowing through other flow holes 411, and it will only flow through the exposed flow hole 411, thereby ensuring the buffering strength and improving the accuracy of the buffering strength. The speed when the spline shaft 22 moves downward is efficiently adjusted, and the chip mounting quality is further improved. When the spline shaft 22 moves upward for resetting, the buffer plate 41 moves upward, driving the rotating rod 44 to move upward quickly through the disc 43. A resistance is generated between the upper part of the arc-shaped disc 46 and the hydraulic oil. The resistance pushes the arc-shaped disc 46 to rotate around the ring shaft 442, and the two arc-shaped discs 46 approach each other until they fit (as Figure 8 ), at this time, the resistance above the arc-shaped disc 46 increases, so that the rotating rod 44 applies a downward pulling force. The rotating rod 44 drives the stopper 431 through the disc 43 to slightly loosen the connection with the flow hole 411. When the hydraulic oil flows back and forth through the exposed flow hole 411, a small part will flow through other flow holes 411, thereby greatly reducing the buffering strength. The reset speed can be relatively increased, thereby accelerating the chip mounting speed and improving the work efficiency.

[0041] There are grooves 461 provided on the inner sides of the two arc-shaped discs 46, and there is a gap between the grooves 461 and the rotating rod 44;

[0042] When the spline shaft 22 moves downward for chip mounting, the two arc-shaped discs 46 move away from each other (as Figure 7 ), the gap between the groove 461 and the rotating rod 44 increases, and the hydraulic oil is squeezed and flows through the gap. The coverage area of the arc-shaped disc 46 is large, and the resistance between it and the hydraulic oil further increases, and the buffering strength is further enhanced. When the spline shaft 22 moves upward for resetting, the two arc-shaped discs 46 approach each other until they fit (as Figure 8 ), the gap between the groove 461 and the rotating rod 44 decreases, and the upper part of the arc-shaped disc 46 is inclined, so that the coverage area is small and the resistance is relatively low, avoiding the relatively fast speed of the spline shaft 22 during resetting from damaging the structure, relatively protecting the chip mounter. Moreover, the hydraulic oil flows back and forth through the gap with high intensity, and can transfer energy more smoothly in the hydraulic system, reducing the energy loss during the transfer process. And the highly fluid hydraulic oil can better take away the heat generated in the buffer chamber 4, preventing performance degradation or equipment damage caused by too high oil temperature. Especially in the hydraulic system with high-intensity and long-time operation, the highly fluid hydraulic oil can also maintain good fluidity in a low-temperature environment, ensuring that the chip mounter can start and run smoothly in a cold environment, improving the reliability of the equipment, and being able to reduce the foam and gas dissolution in the system, improving the stability and efficiency of the chip mounter.

[0043] In the description of the present invention, it should be understood that the orientation or positional relationship indicated by the terms "upper", "lower", "front", "rear", "left", "right", etc. is based on the orientation or positional relationship shown in the drawings, and is only for the convenience of describing the present invention, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be construed as a limitation on the present invention.

[0044] Finally, it should be pointed out that the above embodiments are only used to illustrate the technical solutions of the present invention, rather than limiting them. Although the present invention has been described in detail with reference to the foregoing embodiments, those of ordinary skill in the art should understand that they can still modify the technical solutions described in the foregoing embodiments, or perform equivalent replacements for some of the technical features. These modifications or replacements do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of the present invention.

Claims

1. A high-precision reciprocating rotary ball spline for a chip mounter, comprising a chamber (1), characterized in that: The inner wall of the chamber (1) is fixed with a bracket (2). Two motors (3) are fixed on the left side of the bracket (2). The bottom of the bracket (2) is installed with a ball bushing (21) through bearings. A spline shaft (22) is inserted into the interior of the ball bushing (21). A connecting block (23) is installed at the upper end of the ball bushing (21) through bearings. Two guide wheels (24) are installed in the bracket (2) through bearings. One of the guide wheels (24) is fixed to the output end of one of the motors (3). A belt (25) is connected between the two guide wheels (24). The belt (25) is fixed to the connecting block (23). A connecting belt (26) is connected between the ball bushing (21) and the output end of the other motor (3). A patch adsorber is installed at the lower end of the spline shaft (22); A buffer chamber (4) is fixed to the right side of the inner wall of the chamber (1). A buffer plate (41) is slidably connected to the inner wall of the buffer chamber (4). Four flow holes (411) are provided on both the left and right sides of the surface of the buffer plate (41). Hydraulic oil is filled below the buffer plate (41). A connecting rod (42) is fixedly connected above the buffer plate (41). The connecting rod (42) is fixedly connected to one side of the connecting block (23). Through holes are provided both above and below the buffer chamber (4). The connecting rod (42) is slidably connected in the upper through hole. A hole (412) is provided at the bottom of the buffer plate (41). A slider (413) is slidably connected to the inner wall of the hole (412). A slide rod (414) is fixed to the bottom of the slider (413). A elastic spring (415) is provided below the slider (413); The bottom end of the slide rod (414) is fixed with a disc (43). Blocks (431) are fixed on both the left and right sides of the disc (43), and the blocks (431) are in mutual contact with the bottom of the flow holes (411). A rotating rod (44) is fixed to the bottom of the disc (43). An adjusting head (45) is fixed to the bottom end of the rotating rod (44). The chip mounter is applied to four types of components, and the four types of components respectively correspond to low-speed, medium-speed, high-speed, and ultra-high-speed chip mounters. A ring disc (441) is fixed to the outer side of the rotating rod (44). A trapezoidal groove is formed in the outer ring of the ring disc (441), and a retaining piece is provided in the middle. A ring shaft (442) is connected between the retaining pieces. There are two ring shafts (442), and they are distributed relatively on the left and right sides of the retaining piece. Arc-shaped discs (46) are connected to the outer rings of the ring shafts (442). The inner sides of the two arc-shaped discs (46) are sleeved on the outer side of the rotating rod (44).

2. The high-precision reciprocating rotary ball spline for a chip mounter according to claim 1, wherein: The spline shaft (22) makes reciprocating up and down movements through one of the motors (3) and makes rotational movements through the other motor (3).

3. A high-precision reciprocating rotary ball spline for a mounter, characterized in that: Grooves (461) are provided on the inner sides of the two arc-shaped discs (46), and there is a gap between the grooves (461) and the rotating rod (44).

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