Reflow soldering clamp for chip processing

Abstract

The invention discloses a reflow soldering clamp for chip processing, and relates to the technical field of chip processing. The device comprises a supporting assembly; the supporting assembly comprises a base, an adsorption assembly is fixedly matched above the base and comprises a mounting plate, the bottom of the mounting plate is fixedly connected with a vacuum adsorption platform, and the top of the mounting plate is fixedly connected with a slide rheostat; the bottom of the mounting plate is fixedly matched with two clamping assemblies used for clamping and fixing a chip, the top of the mounting plate is fixedly matched with a regulation and control assembly used for adjusting the clamping force of the clamping assemblies, and the regulation and control assembly comprises a heat conduction rod which penetrates through and is fixedly inserted into the top of the mounting plate. The clamping force of the two clamping assemblies in the horizontal direction and the adsorption force of the vacuum adsorption platform in the vertical direction are changed in real time according to the change of the heating degree of the chip, so that the situation that the chip deforms in the reflow soldering process due to thermal expansion of the chip is avoided, and the production quality of the chip is improved.

Description

Technical Field

[0001] The present invention belongs to the technical field of chip processing, and particularly relates to a reflow soldering fixture for chip processing. Background Art

[0002] Reflow soldering of chips is crucial. Reflow soldering of chips is a key process in the production of products by manufacturers. Through reflow soldering, the chips are fixed in the products. In the traditional chip reflow soldering process, generally, a reflow soldering fixture is used to fix the chips, and then reflow soldering is achieved.

[0003] Existing reflow soldering fixtures generally use the method of screw pressing blocks to fix the chips. During the reflow soldering process of the chips, due to heat, the chips will expand. The fixture with a fixed clamping force cannot adapt to the expansion of the chips, which is likely to cause the chips to deform, thereby affecting the quality of chip soldering. Therefore, we provide a reflow soldering fixture for chip processing to solve the above problems. Summary of the Invention

[0004] The purpose of the present invention is to provide a reflow soldering fixture for chip processing. By changing the clamping force of the two clamping components in the horizontal direction and the adsorption force of the vacuum adsorption platform in the vertical direction in real time according to the change in the heat absorption degree of the chips, the expansion of the chips due to heat is avoided, so that the chips do not deform during the reflow soldering process, thereby improving the quality of chip production, and solving the problem that in the reflow soldering process of the existing reflow soldering fixture clamping the chips, the chips expand due to heat, making the fixture with a constant clamping force unable to adapt to the chip expansion, easily causing the chips to deform, and further affecting the quality of the chips after soldering.

[0005] To solve the above technical problems, the present invention is achieved through the following technical solutions: The present invention is a reflow soldering fixture for chip processing, including a support assembly; the support assembly includes a base, an adsorption assembly is fixedly fitted above the base, the adsorption assembly includes a mounting plate, a vacuum adsorption platform is fixedly connected to the bottom of the mounting plate, and a sliding rheostat is fixedly connected to the top of the mounting plate; two clamping assemblies for clamping and fixing the chip are fixedly fitted to the bottom of the mounting plate, and a regulation assembly for adjusting the clamping force of the clamping assembly is fixedly fitted to the top of the mounting plate; the regulation assembly includes a heat conducting rod fixedly inserted through the top of the mounting plate, the regulation assembly further includes a cylindrical tube fixedly connected to the top of the mounting plate and covering the heat conducting rod, and an air bag is sleeved on the outer wall of the heat conducting rod and located inside the cylindrical tube; a piston plate in sliding fit with the inner wall of the cylindrical tube and in contact with the air bag is fixedly connected to the top of the piston plate, a sliding rod penetrating to the outside of the cylindrical tube is fixedly connected to the top of the sliding rod, and a toothed plate is fixedly connected to the top end of the sliding rod; the regulation assembly further includes a fixing plate fixedly connected to the top of the mounting plate, a lead screw is rotatably connected through one side surface of the fixing plate, a spur gear meshing with the toothed plate is fixedly connected to one end of the lead screw, a moving plate is threadedly connected to the circumferential side surface of the lead screw, a connecting rod is fixedly connected to one side surface of the moving plate, and the end of the connecting rod is fixedly connected to the sliding piece on the sliding rheostat.

[0006] Further, the support assembly further includes a solder bath fixedly connected to the top of the base, a control box is fixedly connected to the top of the base, a support column is fixedly connected to the top of the base, a cross plate is fixedly connected to the top end of the support column, and a reinforcing rib is fixedly connected between the cross plate and the support column; a load-bearing plate is hingedly connected to one side surface of the cross plate, a hydraulic cylinder is fixedly connected to the bottom of the load-bearing plate, the output end of the hydraulic cylinder is fixedly fitted with the mounting plate, and a baffle in contact with the load-bearing plate is fixedly connected to one side surface of the cross plate.

[0007] Further, a guiding groove is formed on one side surface of the cross plate, a first slider is slidably connected inside the guiding groove, a supporting rod is hingedly connected to one side surface of the first slider, the supporting rod is hingedly connected to the load-bearing plate, and an electric push rod is fixedly connected to one side surface of the cross plate, and the output end of the electric push rod is fixedly connected to the first slider.

[0008] Further, the adsorption assembly further includes a power supply fixedly connected to the top of the mounting plate, a vacuum pump is fixedly connected to the top of the mounting plate, and L-shaped limiting plates are fixedly connected to both opposite side surfaces of the vacuum adsorption platform.

[0009] Further, the clamping assembly further includes two electromagnetic iron plates fixedly connected to the bottom of the mounting plate, a moving rod is slidably connected through one side surface of the electromagnetic iron plate, a vertical plate is fixedly connected to one end of the moving rod, and a return spring sleeved on the moving rod is fixedly connected between the vertical plate and the electromagnetic iron plate.

[0010] Furthermore, a wedge block is fixedly connected to the other end of the moving rod, and a first fixing rod is fixedly connected between two adjacent wedge blocks. The clamping assembly further includes a vertical plate slidably connected to the bottom of the mounting plate. Elastic blocks that cooperate with the two wedge blocks are symmetrically and fixedly connected to one side of the vertical plate close to the wedge blocks; first notches are symmetrically formed on the other side of the vertical plate away from the wedge blocks, first sliding grooves are formed on the opposite inner sides of the first notches, and second notches located above the first notches are symmetrically formed through one side of the vertical plate.

[0011] Furthermore, a pressing plate is slidably connected inside the first notch. Guide plates that are slidably matched with the first sliding grooves are fixedly connected to opposite sides of the pressing plate. A top rod that slidably penetrates into the second notch is fixedly connected to the top of the pressing plate; rotating shafts are rotatably connected to the opposite inner sides of the second notch, a rotating plate is fixedly connected between the two rotating shafts, a second sliding groove is formed at the bottom of the rotating plate, a second sliding block is slidably connected inside the second sliding groove, the second sliding block is hinged to the top rod, and a second fixing rod is fixedly connected between two adjacent rotating plates.

[0012] Furthermore, a PLC controller is arranged inside the control box, and the PLC controller is electrically connected to a power supply, a vacuum pump, and an electromagnetic iron plate.

[0013] The present invention has the following beneficial effects: 1. In the present invention, the chip is adsorbed and fixed by the adsorption assembly, then the side of the chip is fixed by the two clamping assemblies, and then the height of the chip is adjusted by the support assembly to perform reflow soldering on the chip. During the reflow soldering process of the chip, the heat conducting rod on the regulation assembly is heated in the solder pool, and the heat is transferred to the airbag through the heat conducting rod. The airbag expands due to heat, thereby driving the piston plate to move upward, so that the piston plate drives the toothed plate to move upward through the sliding rod, thereby driving the spur gear to rotate, further driving the lead screw to rotate, thereby driving the moving plate and the connecting rod to move away from the fixed plate, further driving the sliding piece on the sliding rheostat to move away from the fixed plate, thereby increasing the resistance value of the sliding rheostat, further reducing the current in the circuit, thereby reducing the clamping force of the clamping assembly on the chip from the side, and at the same time reducing the adsorption capacity of the vacuum adsorption platform on the chip in the vertical direction. By changing the degree of heat absorption of the chip, the clamping force of the two clamping assemblies in the horizontal direction and the adsorption force of the vacuum adsorption platform in the vertical direction are changed in real time, so as to avoid the chip from expanding due to heat and causing deformation of the chip during the reflow soldering process, thereby improving the quality of chip production.

[0014] 2. The present invention controls the electric push rod to drive the first slider to move away from the baffle, so that the first slider drives the load-bearing plate to rotate toward the first slider through the support rod, and the cross plate drives the adsorption component and the clamping component to rotate in the direction away from the solder pool, so that the operator can install and disassemble the chip more conveniently, thereby improving the convenience of use.

[0015] 3. The present invention starts by controlling the vacuum pump to generate negative pressure on the vacuum adsorption platform, so that the vacuum adsorption platform adsorbs the chip, and then energizes the electromagnet plate to generate adsorption force, driving the vertical plate to move toward the electromagnet plate, and then drives the wedge block to move toward the vertical plate through the moving rod, so that the wedge block conflicts with the vertical plate, driving the vertical plate to move toward the outer wall of the chip, and the wedge block continues to move toward the vertical plate. At this time, the wedge block compresses the elastic block and at the same time squeezes the rotating plate, driving the rotating plate to rotate, so that the rotating plate drives the pressure plate to move upward through the second slider and the top rod, and the pressure plate moves upward until it conflicts with the bottom of the chip, thereby completing the fixing of the chip by the pressure plate from the bottom. Through the use of the clamping assembly, the clamping assembly can initially fix the chip from the side and bottom of the chip, and cooperate with the adsorption of the vacuum adsorption platform, thereby further improving the stability of chip clamping. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the accompanying drawings required for describing the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other accompanying drawings can be obtained based on these accompanying drawings without paying creative work.

[0017] Figure 1 The figure is a schematic diagram of the structure of a reflow soldering fixture used for chip processing.

[0018] Figure 2 for Figure 1 Schematic diagram of the front view structure.

[0019] Figure 3 It is a schematic diagram of the structure of the support assembly in the present invention.

[0020] Figure 4 It is a schematic diagram of the structure of the adsorption component in the present invention.

[0021] Figure 5 for Figure 4 Schematic diagram of the front view structure.

[0022] Figure 6 It is a schematic diagram of the structure of the vacuum adsorption platform and the L-shaped limit plate connection in the present invention when viewed from above.

[0023] Figure 7This is a schematic structural diagram of the clamping assembly in the present invention.

[0024] Figure 8 It is Figure 7 a side view structural diagram.

[0025] Figure 9 This is a schematic structural diagram of the connection part of the vertical plate, the first notch, and the second notch in the present invention.

[0026] Figure 10 This is a partial bottom view structural diagram of the clamping assembly in the present invention.

[0027] Figure 11 This is a schematic structural diagram of the connection part of the adsorption assembly and the clamping assembly in the present invention.

[0028] Figure 12 This is a schematic structural diagram of the regulation assembly in the present invention.

[0029] In the drawings, the list of components represented by each reference numeral is as follows:

[0030] 1 - Support assembly, 101 - Base, 102 - Solder bath, 103 - Control box, 104 - Support column, 105 - Cross plate, 106 - Reinforcing rib, 107 - Load-bearing plate, 108 - Hydraulic cylinder, 109 - Baffle, 110 - Guide groove, 111 - First slider, 112 - Support rod, 113 - Electric push rod, 2 - Adsorption assembly, 201 - Mounting plate, 202 - Vacuum adsorption platform, 203 - Slide rheostat, 204 - Power supply, 205 - Vacuum pump, 206 - L-shaped limiting plate, 3 - Clamping assembly, 301 - Electromagnetic iron plate, 302 - Moving rod, 303 - Vertical plate, 304 - Return spring, 305 - Wedge block, 306 - First fixing rod, 307 - Vertical plate, 308 - Elastic block, 309 - First notch, 310 - First chute, 311 - Second notch, 312 - Pressing plate, 313 - Guide plate, 314 - Thrust rod, 315 - Second fixing rod, 316 - Rotating shaft, 317 - Rotating plate, 318 - Second chute, 319 - Second slider, 4 - Regulation assembly, 401 - Heat conducting rod, 402 - Cylindrical tube, 403 - Airbag, 404 - Piston plate, 405 - Slide rod, 406 - Rack, 407 - Fixed plate, 408 - Lead screw, 409 - Straight gear, 410 - Moving plate, 411 - Connecting rod. Detailed implementation manners

[0031] Next, the technical solutions in the embodiments of the present invention will be clearly and completely described in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention.

[0032] Example 1. Please refer to Figure 1-12 , the present invention provides the following technical solution: a reflow soldering fixture for chip processing, including a support assembly 1; the support assembly 1 includes a base 101, and an adsorption assembly 2 is fixedly fitted above the base 101. The adsorption assembly 2 includes a mounting plate 201, and a vacuum adsorption platform 202 is fixedly connected to the bottom of the mounting plate 201 (the vacuum adsorption platform 202 is composed of components such as an adsorption panel, a vacuum groove, a sealing element, a vacuum source interface, a support frame, a pore layout, and an auxiliary system, which is prior art and will not be elaborated in detail here). A sliding rheostat 203 is fixedly connected to the top of the mounting plate 201; two clamping assemblies 3 for clamping and fixing the chip are fixedly fitted to the bottom of the mounting plate 201, and a regulation assembly 4 for adjusting the clamping force of the clamping assembly 3 is fixedly fitted to the top of the mounting plate 201; the regulation assembly 4 includes a heat conducting rod 401 fixedly inserted through the top of the mounting plate 201. The regulation assembly 4 further includes a cylindrical tube 402 fixedly connected to the top of the mounting plate 201 and covering the heat conducting rod 401. An airbag 403 is sleeved on the outer wall of the heat conducting rod 401 and is located inside the cylindrical tube 402 (the airbag 403 is made of silicone material, and its temperature tolerance range is from -60°C to 300°C); a piston plate 404 that is in sliding fit with the inner wall of the cylindrical tube 402 and abuts against the airbag 403 is provided. A slide rod 405 is fixedly connected to the top of the piston plate 404 and penetrates to the outside of the cylindrical tube 402, and a toothed plate 406 is fixedly connected to the top end of the slide rod 405; the regulation assembly 4 further includes a fixing plate 407 fixedly connected to the top of the mounting plate 201. A lead screw 408 is rotatably connected through one side surface of the fixing plate 407. A spur gear 409 that meshes with the toothed plate 406 is fixedly connected to one end of the lead screw 408. A moving plate 410 is threadedly connected to the circumferential surface of the lead screw 408. A connecting rod 411 is fixedly connected to one side surface of the moving plate 410, and the end of the connecting rod 411 is fixedly connected to the sliding piece on the sliding rheostat 203.

[0033] The operation process of this embodiment is as follows: First, the chip is adsorbed and fixed by the adsorption component 2. Then, the two clamping components 3 are used to complete the fixation of the side of the chip. Subsequently, the support component 1 is used to complete the height adjustment of the chip, so that the chip undergoes reflow soldering. During the reflow soldering process of the chip, the heat conducting rod 401 on the regulation component 4 is heated in the solder pool 102, and the heat is transferred to the airbag 403 through the heat conducting rod 401. The airbag 403 expands due to heat, and then drives the piston plate 404 to move upward. Thus, the piston plate 404 drives the toothed plate 406 to move upward through the slide rod 405, and then drives the spur gear 409 to rotate, further driving the lead screw 408 to rotate. Thereby, the moving plate 410 and the connecting rod 411 move away from the fixed plate 407, and then drive the sliding piece on the sliding rheostat 203 to move away from the fixed plate 407, thereby increasing the resistance value of the sliding rheostat 203, and then reducing the current in the circuit, thereby reducing the clamping force of the clamping component 3 on the chip from the side, and at the same time reducing the adsorption ability of the vacuum adsorption platform 202 on the chip in the vertical direction. By changing the degree of heat absorption of the chip, the clamping force of the two clamping components 3 in the horizontal direction and the adsorption force of the vacuum adsorption platform 202 in the vertical direction are changed in real time, so as to avoid the chip from expanding due to heat and causing deformation of the chip during the reflow soldering process, thereby improving the quality of chip production.

[0034] Embodiment 2, please refer to Figure 1-12 , on the basis of Embodiment 1, the following improvements are made in this Embodiment 2. The support component 1 further includes a solder pool 102 fixedly connected to the top of the base 101 (the internal temperature of the solder pool 102 is controllable, which is a prior art and will not be elaborated here). A control box 103 is fixedly connected to the top of the base 101, a support column 104 is fixedly connected to the top of the base 101, the top of the support column 104 is fixedly connected to a cross plate 105, and a reinforcing rib 106 is fixedly connected between the cross plate 105 and the support column 104 (the setting of the reinforcing rib 106 further improves the stability of the cross plate 105); One side of the cross plate 105 is hingedly connected to a load-bearing plate 107, the bottom of the load-bearing plate 107 is fixedly connected to a hydraulic cylinder 108, the output end of the hydraulic cylinder 108 is fixedly matched with the mounting plate 201, a baffle 109 that abuts against the load-bearing plate 107 is fixedly connected to one side of the cross plate 105, a guiding groove 110 is opened on one side of the cross plate 105, a first slider 111 is slidably connected inside the guiding groove 110, one side of the first slider 111 is hingedly connected to a support rod 112, the support rod 112 is hingedly connected to the load-bearing plate 107, and an electric push rod 113 is fixedly connected to one side of the cross plate 105, and the output end of the electric push rod 113 is fixedly connected to the first slider 111.

[0035] The operation process of this embodiment is as follows: by controlling the electric push rod 113 to drive the first slider 111 to move away from the baffle 109, the first slider 111 drives the load-bearing plate 107 to rotate toward the first slider 111 through the support rod 112, so that the cross plate 107 drives the adsorption component 2 and the clamping component 3 to rotate away from the solder pool 102, so that the operator can install and remove the chip more conveniently, thereby improving the convenience of use. After the chip is installed in the adsorption component 2 and the clamping component 3, the electric push rod 113 is controlled to drive the first slider 111 Move toward the baffle 109, so that the first slider 111 drives the load-bearing plate 107 to rotate toward the baffle 109 through the support rod 112. When the load-bearing plate 107 rotates to contact with the baffle 109, the chip is just above the solder pool 102. The clamped chip is moved into the solder pool 102, which is filled with molten solder. At this time, the solder on the patch coated on the chip contacts the molten solder. By accurately controlling the temperature of the solder pool 102, the solder on the chip is melted again to form a reliable solder joint.

[0036] For example 3, please refer to Figure 1-12 , the third embodiment is improved as follows on the basis of the first embodiment, the adsorption component 2 also includes a power supply 204 fixedly connected to the top of the mounting plate 201, a vacuum pump 205 is fixedly connected to the top of the mounting plate 201, and L-shaped limit plates 206 are fixedly connected to the two opposite sides of the vacuum adsorption platform 202, and the clamping component 3 also includes two electromagnet plates 301 fixedly connected to the bottom of the mounting plate 201, a moving rod 302 is slidably connected to one side of the electromagnet plate 301, and a vertical plate 303 is fixedly connected to one end of the moving rod 302 (the vertical plate 303 is made of a metal material that can be attracted by the electromagnet plate 301 after power is supplied), a reset spring 304 mounted on the moving rod 302 is fixedly connected between the vertical plate 303 and the electromagnet plate 301, a wedge block 305 is fixedly connected to the other end of the moving rod 302, and a first fixed rod 306 is fixedly connected between two adjacent wedge blocks 305.

[0037] The clamping assembly 3 further includes a vertical plate 307 slidably connected to the bottom of the mounting plate 201. On one side of the vertical plate 307 close to the wedge block 305, elastic blocks 308 that cooperate with the two wedge blocks 305 are symmetrically and fixedly connected; on the side of the vertical plate 307 away from the wedge block 305, first notches 309 are symmetrically formed. First sliding grooves 310 are formed on the opposite inner sides of the first notches 309. On one side of the vertical plate 307, second notches 311 are symmetrically formed through and located above the first notches 309. A pressing plate 312 is slidably connected inside the first notch 309. Guide plates 313 that are slidably engaged with the first sliding grooves 310 are fixedly connected to the opposite sides of the pressing plate 312. A top rod 314 that slidably penetrates into the second notch 311 is fixedly connected to the top of the pressing plate 312; on the opposite inner sides of the second notch 311, rotating shafts 316 are rotatably connected. A rotating plate 317 is fixedly connected between the two rotating shafts 316. A second sliding groove 318 is formed at the bottom of the rotating plate 317. A second sliding block 319 is slidably connected inside the second sliding groove 318. The second sliding block 319 is hinged to the top rod 314. A second fixing rod 315 is fixedly connected between adjacent rotating plates 317. A PLC controller is provided in the control box 103. The PLC controller is electrically connected to the power supply 204, the vacuum pump 205, and the electromagnetic iron plate 301.

[0038] The operation process of this embodiment is as follows: By controlling the start of the vacuum pump 205, a negative pressure is generated on the vacuum adsorption platform 202, so that the vacuum adsorption platform 202 adsorbs the chip. Then, the electromagnetic iron plate 301 is energized, so that the electromagnetic iron plate 301 generates an adsorption force, driving the vertical plate 303 to move towards the electromagnetic iron plate 301. Further, the wedge block 305 is driven to move towards the vertical plate 307 through the moving rod 302, so that the wedge block 305 abuts against the vertical plate 307, driving the vertical plate 307 to move towards the outer wall of the chip. The wedge block 305 continues to move towards the vertical plate 307 (when it is necessary to release the clamping of the chip by the vertical plate 307, after the vertical plate 307 is not stressed, the two vertical plates 307 are controlled to move away from each other, so that the two vertical plates 307 are separated from contact with the chip). At this time, the wedge block 305 compresses the elastic block 308. At the same time, the wedge block 305 squeezes the rotating plate 317, driving the rotating plate 317 to rotate, so that the rotating plate 317 drives the pressing plate 312 to move upward through the second sliding block 319 and the top rod 314. The pressing plate 312 moves upward until it abuts against the bottom of the chip, thereby completing the fixation of the pressing plate 312 to the chip from the bottom. By using the clamping assembly 3, the clamping assembly 3 can initially fix the chip from the side and bottom of the chip, and cooperate with the adsorption of the vacuum adsorption platform 202, further improving the stability of clamping the chip.

[0039] In the description of this specification, the descriptions referring to terms such as "one embodiment", "example", "specific example", etc. mean that the specific features, structures, materials or characteristics described in connection with the embodiment or example are included in at least one embodiment or example of the present invention. In this specification, the schematic representations of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described may be combined in a suitable manner in any one or more embodiments or examples.

[0040] The preferred embodiments of the present invention disclosed above are only used to help illustrate the present invention. The preferred embodiments do not describe all the details in detail, nor do they limit the invention to the specific embodiments described. Obviously, many modifications and variations can be made according to the content of this specification. These embodiments are selected and specifically described in this specification in order to better explain the principles and practical applications of the present invention, so that those skilled in the art can well understand and utilize the present invention. The present invention is only limited by the claims and their full scope and equivalents.

Claims

1. A reflow soldering fixture for chip processing, comprising a support assembly (1); characterized in that: The support assembly (1) comprises a base (101), a suction assembly (2) is fixedly matched above the base (101), the suction assembly (2) comprises a mounting plate (201), a vacuum suction platform (202) is fixedly connected to the bottom of the mounting plate (201), and a sliding rheostat (203) is fixedly connected to the top of the mounting plate (201); The bottom of the mounting plate (201) is fixedly equipped with two clamping components (3) for clamping and fixing the chip, and the top of the mounting plate (201) is fixedly equipped with a regulating component (4) for adjusting the clamping force of the clamping components (3); The regulating component (4) comprises a heat conducting rod (401) which penetrates and is fixedly inserted on the top of the mounting plate (201); the regulating component (4) also comprises a cylindrical tube (402) which is fixedly connected to the top of the mounting plate (201) and covers the heat conducting rod (401); an air bag (403) which is located inside the cylindrical tube (402) is sleeved on the outer wall of the heat conducting rod (401); The inner wall of the cylindrical tube (402) is slidably matched with a piston plate (404) that contacts the airbag (403), the top of the piston plate (404) is fixedly connected with a slide rod (405) that penetrates the outside of the cylindrical tube (402), and the top of the slide rod (405) is fixedly connected with a tooth plate (406); The regulating component (4) also includes a fixed plate (407) fixedly connected to the top of the mounting plate (201); a screw rod (408) is rotatably connected to one side of the fixed plate (407); one end of the screw rod (408) is fixedly connected to a spur gear (409) meshing with the toothed plate (406); a movable plate (410) is threadedly connected to the side surface of the screw rod (408); a connecting rod (411) is fixedly connected to one side of the movable plate (410); and the end of the connecting rod (411) is fixedly connected to a sliding plate on the sliding rheostat (203).

2. A reflow soldering fixture for chip processing according to claim 1, characterized in that: The support assembly (1) further comprises a solder pool (102) fixedly connected to the top of the base (101); a control box (103) is fixedly connected to the top of the base (101); a support column (104) is fixedly connected to the top of the base (101); a cross plate (105) is fixedly connected to the top of the support column (104); and a reinforcing rib (106) is fixedly connected between the cross plate (105) and the support column (104); A side of the transverse plate (105) is hingedly connected to a load-bearing plate (107), a bottom of the load-bearing plate (107) is fixedly connected to a hydraulic cylinder (108), an output end of the hydraulic cylinder (108) is fixedly matched with a mounting plate (201), and a baffle (109) that contacts the load-bearing plate (107) is fixedly connected to a side of the transverse plate (105).

3. A reflow soldering fixture for chip processing according to claim 2, characterized in that: A guide groove (110) is provided on one side of the transverse plate (105), and a first slider (111) is slidably connected inside the guide groove (110). A support rod (112) is hingedly connected to one side of the first slider (111), and the support rod (112) is hingedly connected to the load-bearing plate (107). An electric push rod (113) is fixedly connected to one side of the transverse plate (105), and an output end of the electric push rod (113) is fixedly connected to the first slider (111).

4. A reflow soldering fixture for chip processing according to claim 3, characterized in that: The adsorption assembly (2) further comprises a power supply (204) fixedly connected to the top of the mounting plate (201), a vacuum pump (205) fixedly connected to the top of the mounting plate (201), and L-shaped limit plates (206) fixedly connected to two opposite side surfaces of the vacuum adsorption platform (202).

5. A reflow soldering fixture for chip processing according to claim 4, characterized in that: The clamping assembly (3) further comprises two electromagnet plates (301) fixedly connected to the bottom of the mounting plate (201); a moving rod (302) is slidably connected through one side of the electromagnet plate (301); one end of the moving rod (302) is fixedly connected to a vertical plate (303); a return spring (304) sleeved on the moving rod (302) is fixedly connected between the vertical plate (303) and the electromagnet plate (301).

6. A reflow soldering fixture for chip processing according to claim 5, characterized in that: The other end of the moving rod (302) is fixedly connected to a wedge block (305), and a first fixed rod (306) is fixedly connected between two adjacent wedge blocks (305). The clamping assembly (3) also includes a vertical plate (307) slidably connected to the bottom of the mounting plate (201), and an elastic block (308) matched with the two wedge blocks (305) is symmetrically fixedly connected to the vertical plate (307) near one side of the wedge block (305); The vertical plate (307) is symmetrically provided with a first notch (309) on one side away from the wedge block (305), and the first notch (309) is provided with a first sliding groove (310) on both inner sides thereof. A second notch (311) is symmetrically provided through one side of the vertical plate (307) and is located above the first notch (309).

7. A reflow soldering fixture for chip processing according to claim 6, characterized in that: A pressure plate (312) is slidably connected inside the first slot (309), and two opposite side surfaces of the pressure plate (312) are fixedly connected with guide plates (313) that slidably cooperate with the first slide groove (310), and a top rod (314) that slides through the second slot (311) is fixedly connected to the top of the pressure plate (312); The second notch (311) is rotatably connected to the two inner side surfaces, a rotating plate (317) is fixedly connected between the two rotating shafts (316), a second sliding groove (318) is provided at the bottom of the rotating plate (317), a second sliding block (319) is slidably connected inside the second sliding groove (318), the second sliding block (319) is hingedly connected to the top rod (314), and a second fixing rod (315) is fixedly connected between the two adjacent rotating plates (317).

8. A reflow soldering fixture for chip processing according to claim 7, characterized in that: The control box (103) is provided with a PLC controller, and the PLC controller is electrically connected to the power supply (204), the vacuum pump (205), and the electromagnet plate (301).

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