High-temperature-resistant and medium-resistant coating and preparation method thereof

Abstract

The invention discloses a high-temperature-resistant and medium-resistant coating and a preparation method thereof. The high-temperature-resistant and medium-resistant coating is prepared from the following raw materials in parts by weight: 320 to 390 parts of modified epoxy phenolic resin, 27 to 71 parts of graphene dispersion, 170 to 285 parts of pigment and filler, 120 to 160 parts of functional filler, 235 to 310 parts of mixed solvent, 44 to 71 parts of auxiliaries and 5 to 9 parts of dispersing agent. The high-temperature-resistant and medium-resistant coating is resistant to heat (250 DEG C, 240 h), steam purging (0.6-0.8 MPa, 4 h), heat conduction oil (250 DEG C, 168 h), high-temperature and high-pressure test (250 DEG C, 10 MPa, 5% NaCl, 168 h), 10% H2SO4 solution (100 DEG C, 480 h), 10% NaOH solution (100 DEG C, 480 h), 20% NaCl solution (100 DEG C, 480 h) and salt mist (2000 h).

Description

Technical Field

[0001] The present invention relates to the field of coatings, and particularly to a high-temperature and medium-resistant coating and a manufacturing method thereof. Background Art

[0002] As an important heat exchange equipment in petrochemical and chemical industries, heat exchangers are generally made of carbon steel. In the complex environment of high temperature, high pressure, high flow rate and harsh corrosion, when heat exchangers and other equipment are under maintenance, they also need to withstand the high temperature and high pressure environment during steam purging stage, which causes corrosion, perforation and thinning in different parts such as heat exchanger tubes, shells and tube boxes. In severe cases, it may lead to the scrapping of heat exchangers. The harsh corrosion environment greatly shortens the service life and efficiency of heat exchangers.

[0003] To solve the above technical problems, currently, heat exchanger tubes are mainly made of high-temperature and corrosion-resistant alloy materials or heat exchanger coatings are used for anti-corrosion to improve the anti-corrosion performance. Due to the characteristics of simple construction and reliable anti-corrosion performance, the use of heat exchanger coatings can effectively improve the anti-corrosion effect of different parts of heat exchanger tubes, shells and tube boxes, which is a relatively economical and efficient anti-corrosion measure. However, currently, the anti-corrosion of heat exchangers mainly focuses on the anti-corrosion environment below 180°C of heat resistance, and there are few high-temperature heat exchanger coatings for the environment of steam purging and high temperature below 250°C, which severely limits the use of high-temperature heat exchangers. Summary of the Invention

[0004] The present invention provides a high-temperature and medium-resistant coating and a manufacturing method thereof, which can withstand steam purging and a high temperature of 250°C.

[0005] The present invention provides a high-temperature and medium-resistant coating, which comprises the following raw materials in parts by weight: 320 - 390 parts of modified epoxy phenolic resin, 27 - 71 parts of graphene dispersion, 170 - 285 parts of pigment and filler, 120 - 160 parts of functional filler, 235 - 310 parts of mixed solvent, 44 - 71 parts of additive, and 5 - 9 parts of dispersant.

[0006] Further, the high-temperature and medium-resistant coating comprises the following raw materials in parts by weight: 320 - 380 parts of modified epoxy phenolic resin, 31 - 64 parts of graphene dispersion, 173 - 268 parts of pigment and filler, 142 - 154 parts of functional filler, 241 - 275 parts of mixed solvent, 47 - 65 parts of additive, and 5 - 9 parts of dispersant.

[0007] Further, the modified epoxy phenolic resin comprises a blend modification premix of epoxy organosilicon resin, epoxy resin, phenolic resin, ethylene glycol phenyl ether and xylene. The weight ratio of epoxy organosilicon resin, epoxy resin, phenolic resin, ethylene glycol phenyl ether and xylene is 60 - 75:87 - 130:73 - 95:36 - 47:69 - 75.

[0008] Further, the solid content of the graphene dispersion is 10%.

[0009] Further, the pigment and filler include at least one of green silicon carbide, silica, barite powder, aluminum oxide, and titanium dioxide.

[0010] Further, the functional filler includes the following raw materials by weight parts: 10 - 16 parts of nano-titanium dioxide, 12 - 23 parts of boron nitride, 36 - 58 parts of ultra-fine thermally conductive aluminum nitride, 16 - 28 parts of iron oxide, 21 - 28 parts of copper oxide, and 10 - 17 parts of zinc oxide.

[0011] Further, the mixed solvent includes the following raw materials by weight parts: 92 - 115 parts of ethylene glycol phenyl ether, 73 - 98 parts of xylene, 30 - 42 parts of n-butanol, and 12 - 19 parts of cyclohexanone.

[0012] Further, the additives include the following raw materials by weight parts: 10 - 13 parts of defoamer, 3 - 10 parts of leveling agent, 10 - 16 parts of wetting agent, 12 - 16 parts of adhesion promoter, and 4 - 7 parts of thixotropic agent.

[0013] The present invention also provides a manufacturing method of the above high-temperature and medium-resistant coating, including the following steps: Prepare modified epoxy phenolic resin. Add the graphene dispersion and additives to the modified epoxy phenolic resin, disperse for 20 - 30 min under the condition of a rotation speed of 800 - 1000 r / min to obtain a mixed solution. Add the pigment and filler, functional filler, and dispersant to the mixed solvent, disperse for 20 - 30 min under the condition of a rotation speed of 800 - 1000 r / min, and grind for 1.0 - 1.5 h under the condition of a temperature ≤ 70°C to obtain a mixed slurry. Mix the mixed solution and the mixed slurry, disperse for 30 - 45 min under the conditions of a rotation speed of 2000 - 2500 r / min and a temperature ≤ 70°C to obtain the high-temperature and medium-resistant coating.

[0014] Further, a modified epoxy phenolic resin is prepared, which includes: adding 40 parts of phenolic resin into a solution of 20 parts of ethylene glycol phenyl ether and 20 parts of xylene, heating and melting for 30 - 45 min under the condition that the temperature is controlled at 110 - 130 °C to obtain a first solution. Cooling the first solution to 70 - 80 °C, adding the formulated amount of epoxy resin and benzyl dimethylamine, dispersing for 5 min, raising the temperature to 150 °C, and dispersing for 30 - 40 min under the condition that the rotation speed is 1000 - 1500 r / min. The benzyl dimethylamine is 1% of the total mass of the first solution to obtain a second solution. After the second solution is cooled to room temperature, add the remaining formulated amount of phenolic resin, the formulated amount of epoxy organosilicon resin, the remaining formulated amount of ethylene glycol phenyl ether, and the remaining formulated amount of xylene, and disperse for 50 - 60 min under the condition that the rotation speed is 1500 - 2000 r / min to obtain the modified epoxy phenolic resin.

[0015] Compared with the prior art, the present invention has the following effects:

[0016] The present invention uses phenolic, epoxy, and epoxy organosilicon resins as the main film-forming substances. The paint film has good appearance, excellent high-temperature, high-pressure, and medium resistance properties. Through the optimization and combination of the filler system, the heat conduction and heat transfer effects of the system are improved, effectively realizing the effective unity of the paint performance and the coating use effect. Among them, through the blending modification of the phenolic, epoxy, and epoxy organosilicon ternary resin system, the degree of polymerization of the film-forming substance system is increased, the glass transition temperature of the coating is increased, and the heat resistance temperature of the paint is increased to 250 °C; through the cooperation of high thermal conductivity fillers such as ultrafine thermal conductive aluminum nitride and boron nitride and high infrared emissivity fillers such as iron oxide, copper oxide, and zinc oxide in the filler, an effective heat conduction path in the coating is formed, improving the heat exchange efficiency of the heat exchanger coating; through the addition of graphene dispersion, using its characteristics of large molecules and large aspect ratio, a shielding maze effect is formed, effectively reducing the penetration of corrosion ions through the coating to improve the medium resistance of the coating. At the same time, graphene can form a bridge for heat conduction between high thermal conductivity fillers and high infrared emissivity fillers to further improve the heat conduction efficiency of the coating.

[0017] The high-temperature and medium-resistant coating of the present invention is heat-resistant (250 °C, 240 h), resistant to steam purging (0.6 - 0.8 MPa, 4 h), resistant to heat-conducting oil (250 °C, 168 h), resistant to high-temperature and high-pressure tests (250 °C, 10 MPa, 5% NaCl, 168 h), resistant to 10% H 2 SO 4 solution (100 °C, 480 h), resistant to 10% NaOH solution (100 °C, 480 h), resistant to 20% NaCl solution (100 °C, 480 h), and resistant to salt spray (2000 h). Detailed implementation manners

[0018] In order to make the objectives, technical solutions and advantages of the present invention more clear and understandable, the present invention will be further described in detail below in conjunction with embodiments. It should be understood that the specific embodiments described herein are only used to explain the present invention and are not used to limit the present invention.

[0019] Currently, ordinary epoxy phenolic resins cannot meet the usage requirements of working conditions with temperatures higher than 200°C in the high-temperature and high-pressure environment of heat exchangers. At the same time, during the high-temperature steam purging process, the crosslinking density of the epoxy phenolic resin coating cannot fully meet the requirement of blocking the penetration of high-temperature gases in the coating, resulting in the failure of the coating during the high-temperature steam purging process. It is necessary to develop a heat exchanger coating that can withstand heat up to 250°C and steam purging, and at the same time improve the chemical resistance and comprehensive performance of the coating.

[0020] The heat exchanger coating needs to have good thermal conductivity in a chemical-resistant environment. However, due to the limitation of the comprehensive performance of the filler system, the coating cannot achieve a good combination of chemical resistance and thermal conductivity. It is necessary to develop an efficient thermal conductivity system for the acid-alkali resistant environment and thermal conductivity to improve the thermal conductivity of the coating.

[0021] Regarding the problems of the above heat exchanger coating with good high-temperature resistance and steam purging resistance, as well as the good chemical resistance and thermal conductivity of the heat exchanger coating

[0022] An embodiment of the present invention provides a high-temperature and chemical-resistant coating, which includes the following raw materials in parts by weight: 320-390 parts of modified epoxy phenolic resin, 27-71 parts of graphene dispersion, 170-285 parts of pigment and filler, 120-160 parts of functional filler, 235-310 parts of mixed solvent, 44-71 parts of auxiliary agent, and 5-9 parts of dispersant.

[0023] Among them, the dosage of the modified epoxy phenolic resin can be 320, 330, 340, 350, 360, 370, 380, 390 and other parts by weight, preferably 320-380 parts by weight.

[0024] The modified epoxy phenolic resin can be a premixed liquid obtained by the co-blending modification of epoxy organosilicon resin, epoxy resin, phenolic resin, ethylene glycol phenyl ether and xylene. The weight ratio of epoxy organosilicon resin, epoxy resin, phenolic resin, ethylene glycol phenyl ether and xylene is 60-75:87-130:73-95:36-47:69-75, preferably 60-72:87-125:73-93:36-45:69-75. The epoxy organosilicon resin can be ES-06 type resin, the epoxy resin can be NPES-901 resin, and the phenolic resin can be Jinan Nuochuang Chemical 2402 resin.

[0025] The dosage of the graphene dispersion can be 27, 31, 50, 64, 71 and other parts by weight, preferably 31-64 parts by weight.

[0026] The solid content of the graphene dispersion can be 10%. The dosage of the graphene dispersion can be 8% - 17% of the dosage of the modified epoxy phenolic resin. It should be noted that the graphene dispersion is a raw material in which graphene is stably dispersed in a solvent. Since graphene forms a dispersion, it will cause its own agglomeration and cannot play a role. Therefore, generally, the manufacturer mixes it with an organic solvent and adds a dispersant to form a dispersion. Generally, graphene is dispersed in a strong organic solvent (such as N-methylpyrrolidone).

[0027] The dosage of the pigment and filler can be 170, 173, 200, 230, 268, 285 and other parts by weight, preferably 173 - 268 parts by weight.

[0028] The pigment and filler can be composed of at least one of green silicon carbide, silica, barite powder, aluminum trioxide, and titanium dioxide. For example, it can be green silicon carbide, or a mixture of silica and barite powder, or a mixture of aluminum trioxide and titanium dioxide.

[0029] The dosage of the functional filler can be 120, 142, 450, 154, 160 and other parts by weight, preferably 142 - 154 parts by weight.

[0030] The functional filler can be composed of the following raw materials by weight: 10 - 16 parts of nano-titanium dioxide, 12 - 23 parts of boron nitride, 36 - 58 parts of ultra-fine thermally conductive aluminum nitride, 16 - 28 parts of iron oxide, 21 - 28 parts of copper oxide, 10 - 17 parts of zinc oxide. Among them, the dosage of nano-titanium dioxide can be 10, 13, 16 and other parts by weight. The dosage of boron nitride can be 12, 17, 23 and other parts by weight. The dosage of ultra-fine thermally conductive aluminum nitride can be 36, 47, 58 and other parts by weight. The dosage of iron oxide can be 16, 22, 28 and other parts by weight. The dosage of copper oxide can be 21, 24, 28 and other parts by weight. The dosage of zinc oxide can be 10, 13, 17 and other parts by weight.

[0031] The dosage of the mixed solvent can be 235, 241, 260, 275, 310 and other parts by weight, preferably 241 - 275 parts by weight.

[0032] The mixed solvent is composed of the following raw materials by weight: 92 - 115 parts of ethylene glycol phenyl ether, 73 - 98 parts of xylene, 30 - 42 parts of n-butanol, 12 - 19 parts of cyclohexanone. Among them, the dosage of ethylene glycol phenyl ether can be 92, 104, 115 and other parts by weight. The dosage of xylene can be 73, 85, 98 and other parts by weight. The dosage of n-butanol can be 30, 36, 42 and other parts by weight. The dosage of cyclohexanone can be 12, 15, 19 and other parts by weight.

[0033] The dosage of the auxiliary agent can be 44, 47, 55, 65, 71 and other parts by weight, preferably 47 to 65 parts by weight.

[0034] The auxiliary agent can be composed of the following raw materials by weight: 10 - 13 parts of defoamer, 3 - 10 parts of leveling agent, 10 - 16 parts of wetting agent, 12 - 16 parts of adhesion promoter, 4 - 7 parts of thixotropic agent. Among them, the dosage of the defoamer can be 10, 11, 13 and other parts by weight. The dosage of the leveling agent can be 3, 6, 10 and other parts by weight. The dosage of the wetting agent can be 10, 13, 16 and other parts by weight. The dosage of the adhesion promoter can be 12, 14, 16 and other parts by weight. The dosage of the thixotropic agent can be 4, 5, 6, 7 and other parts by weight.

[0035] The dosage of the dispersant can be 5, 6, 7, 8, 9 and other parts by weight.

[0036] The embodiment of the present invention also provides a manufacturing method of the above high-temperature and medium-resistant coating, including the following steps:

[0037] (1) Prepare modified epoxy phenolic resin.

[0038] The above steps include the following processes:

[0039] A. Add 40 parts of phenolic resin into a solution of 20 parts of ethylene glycol phenyl ether and 20 parts of xylene, and heat and melt it for 30 - 45 min under the condition that the temperature is controlled at 110 - 130 °C to obtain the first solution.

[0040] In the above process, the addition ratio of phenolic resin, ethylene glycol phenyl ether and xylene is 2:1:1. The heating and melting temperature can be controlled at 110, 120, 130 °C, etc. The heating and melting time can be 30, 37, 45 min, etc.

[0041] B. Cool the first solution to 70 - 80 °C, slowly add the formulated amount of epoxy resin and benzyl dimethylamine, disperse at low speed for 5 min, raise the temperature to 150 °C, and disperse at high speed for 30 - 40 min under the condition that the rotation speed is 1000 - 1500 r / min. The benzyl dimethylamine is 1% of the total mass of the first solution to obtain the second solution.

[0042] In the above process, the cooling temperature of the first solution can be 70, 75, 80 °C, etc. The high-speed dispersion rotation speed can be 1000, 1300, 1500 r / min, etc. The high-speed dispersion time can be 30, 35, 40 min, etc.

[0043] C. After the second solution is cooled to room temperature, add the remaining formulated amount of phenolic resin, the formulated amount of epoxy organosilicon resin, the remaining formulated amount of ethylene glycol phenyl ether, and the remaining formulated amount of xylene. Under the condition of a rotational speed of 1500 - 2000 r / min, disperse at a high speed for 50 - 60 min to obtain a modified epoxy phenolic resin.

[0044] In the above process, the high-speed dispersion rotational speed can be 1500, 1800, 2000 r / min, etc. The high-speed dispersion time can be 50, 55, 60 min, etc.

[0045] (2) Add the graphene dispersion and the auxiliary agent to the modified epoxy phenolic resin. Under the condition of a rotational speed of 800 - 1000 r / min, disperse at a low speed for 20 - 30 min to obtain a mixed solution.

[0046] In the above steps, the low-speed dispersion rotational speed can be 800, 900, 1000 r / min, etc. The low-speed dispersion time can be 20, 25, 30 min, etc.

[0047] (3) Add the pigment extender, functional filler, and dispersant to the mixed solvent. Under the condition of a rotational speed of 800 - 1000 r / min, disperse at a low speed for 20 - 30 min, and grind with a grinder for 1.0 - 1.5 h under the condition of a temperature ≤ 70°C to obtain a mixed slurry.

[0048] In the above steps, the low-speed dispersion rotational speed can be 800, 900, 1000 r / min, etc. The low-speed dispersion time can be 20, 25, 30 min, etc. The grinding temperature can be 30, 50, 70°C, etc. The grinding time can be 1.0, 1.2, 1.5 h, etc.

[0049] (4) Mix the mixed solution and the mixed slurry. Under the conditions of a rotational speed of 2000 - 2500 r / min and a temperature ≤ 70°C, disperse at a high speed for 30 - 45 min to obtain a high-temperature and medium-resistant coating.

[0050] In the above steps, the high-speed dispersion rotational speed can be 2000, 2200, 2500 r / min, etc. The high-speed dispersion temperature can be 30, 50, 70°C, etc. The high-speed dispersion time can be 30, 37, 45 min, etc.

[0051] The following is a detailed description with specific examples:

[0052] Example 1

[0053] Raw material formula

[0054]

[0055]

[0056] Preparation process:

[0057] (1) Add 40 parts of phenolic resin to a solution of 20 parts of ethylene glycol phenyl ether and 20 parts of xylene, and heat and melt it for 40 min under the condition that the temperature is controlled at 120 °C to obtain the first solution.

[0058] Cool the first solution to 75 °C, slowly add the formulated amount of epoxy resin and benzyldimethylamine, disperse at low speed for 5 min, raise the temperature to 150 °C, and disperse at high speed for 35 min under the condition that the rotation speed is 1200 r / min. The benzyldimethylamine is 1% of the total mass of the first solution to obtain the second solution.

[0059] After the second solution is cooled to room temperature, add the remaining formulated amount of phenolic resin, the formulated amount of epoxy organosilicon resin, the remaining formulated amount of ethylene glycol phenyl ether, and the remaining formulated amount of xylene, and disperse at high speed for 55 min under the condition that the rotation speed is 1800 r / min to obtain the modified epoxy phenolic resin.

[0060] (2) Add the graphene dispersion and the additive to the modified epoxy phenolic resin, and disperse at low speed for 25 min under the condition that the rotation speed is 900 r / min to obtain the mixed solution.

[0061] (3) Add the pigment filler, functional filler, and dispersant to the mixed solvent, disperse at low speed for 25 min under the condition that the rotation speed is 900 r / min, and grind for 1.2 h under the condition that the temperature is 30 °C by a grinding machine to obtain the mixed slurry.

[0062] (4) Mix the mixed solution and the mixed slurry, and disperse at high speed for 40 min under the conditions that the rotation speed is 2200 r / min and the temperature is 30 °C to obtain the high-temperature and corrosion-resistant medium coating.

[0063] Example 2

[0064] The difference from Example 1 lies in the different raw material formulations, which are specifically as follows:

[0065]

[0066] Example 3

[0067] The difference from Example 1 lies in the different raw material formulations, which are specifically as follows:

[0068]

[0069]

[0070] Example 4

[0071] The difference from Example 1 lies in the different raw material formulations, which are specifically as follows:

[0072]

[0073] Example 5

[0074] The difference from Example 1 lies in the different raw material formulations, which are specifically as follows:

[0075]

[0076]

[0077] Test Example 1

[0078] The coating performance test indexes of the coatings obtained in Examples 1-5 are as follows:

[0079]

[0080]

[0081] For the 5 examples, their main differences are as follows: in Examples 1 to 3, the contents of epoxy organosilicon resin, epoxy resin, and phenolic resin are all within the preferred ranges, and the coatings have good performance, with good high-temperature resistance, high-pressure resistance, medium resistance, steam purging resistance, chloride ion permeability resistance, and good mechanical properties; in Example 4, the content of phenolic resin is low, lower than the preferred range, the crosslinking density of the coating is significantly reduced, and the coating adhesion, high-temperature resistance, and medium resistance are all affected; in Example 5, the content of phenolic resin is high, higher than the preferred range, and after the addition amount of phenolic resin increases, the hardness of the coating increases and the brittleness becomes larger, and the impact resistance and medium resistance of the coating decrease.

[0082] Test Example 2

[0083] The present invention provides 3 comparative examples to effectively compare and evaluate the functions of the epoxy organosilicon resin, phenolic resin, and heat-conducting filler of the present invention.

[0084] The difference between Comparative Example 1 and Example 1 is that: the raw material formulation does not contain epoxy organosilicon resin. Correspondingly, epoxy organosilicon resin is not added during the preparation process.

[0085] The difference between Comparative Example 2 and Example 1 is that: the raw material formulation does not contain phenolic resin. Correspondingly, phenolic resin is not added during the preparation process.

[0086] The difference between Comparative Example 3 and Example 1 is that: the raw material formulation does not contain functional filler. Correspondingly, functional filler is not added during the preparation process.

[0087] The coating performance test indexes of the coatings obtained in Comparative Examples 1-3 are as follows:

[0088]

[0089] The coating performance indicators and related standards provided by the present invention are shown in Table 4 as follows:

[0090]

[0091]

[0092] Comparing Examples 1 to 3 with Comparative Examples 1 to 3, the coatings of Examples 1 to 3 all have good impact resistance, adhesion, flexibility, abrasion resistance, high temperature resistance, high pressure resistance, chemical resistance, salt spray resistance, and chloride ion permeability. However, for the coating of Comparative Example 1, the heat resistance, flexibility, abrasion resistance, high temperature and high pressure resistance, and salt spray resistance of the coating are all reduced, and the indicators do not meet the relevant standards of the test; for the coating of Comparative Example 2, the adhesion of the coating is significantly reduced, and the abrasion resistance, high temperature and high pressure resistance, chemical resistance, and salt spray resistance are lower than the requirements of the test standards; for the coating of Comparative Example 3, the thermal conductivity of the coating is poor, and the alkali resistance does not meet the test standards. It can be seen that the lack of epoxy silicone resin, phenolic resin, and thermal conductive filler has an obvious impact on the performance of the system and cannot meet the use requirements. The technical solution of the present invention using a compound system of epoxy silicone resin, epoxy resin, phenolic resin, and thermal conductive filler can achieve good mechanical properties and comprehensive high temperature and high pressure performance of the coating.

[0093] The above are only the preferred embodiments of the present invention and are not intended to limit the present invention. Any modifications, equivalent replacements, and improvements made within the spirit and principle of the present invention shall be included in the protection scope of the present invention.

Claims

1. A high-temperature and medium-resistant coating, characterized in that, it comprises raw materials in the following parts by weight: 320 - 390 parts of modified epoxy phenolic resin, 27 - 71 parts of graphene dispersion, 170 - 285 parts of pigment filler, 120 - 160 parts of functional filler, 235 - 310 parts of mixed solvent, 44 - 71 parts of auxiliary agent, 5 - 9 parts of dispersant.

2. The high-temperature and medium-resistant coating according to claim 1, characterized in that, it comprises raw materials in the following parts by weight: 320 - 380 parts of modified epoxy phenolic resin, 31 - 64 parts of graphene dispersion, 173 - 268 parts of pigment filler, 142 - 154 parts of functional filler, 241 - 275 parts of mixed solvent, 47 - 65 parts of auxiliary agent, 5 - 9 parts of dispersant.

3. The high-temperature and medium-resistant coating according to claim 1, characterized in that, the modified epoxy phenolic resin comprises a co-blended and pre-mixed liquid of epoxy organosilicon resin, epoxy resin, phenolic resin, ethylene glycol phenyl ether, and xylene; the weight ratio of the epoxy organosilicon resin, the epoxy resin, the phenolic resin, the ethylene glycol phenyl ether, and the xylene is 60 - 75:87 - 130:73 - 95:36 - 47:69 - 75.

4. The high-temperature and medium-resistant coating according to claim 1, characterized in that, the solid content of the graphene dispersion is 10%.

5. The high-temperature and medium-resistant coating according to claim 1, characterized in that, the pigment filler comprises at least one of green silicon carbide, silica, barite powder, aluminum trioxide, and titanium dioxide.

6. The high-temperature and medium-resistant coating according to claim 1, characterized in that, the functional filler comprises the following raw materials by weight: 10 - 16 parts of nano-titanium dioxide, 12 - 23 parts of boron nitride, 36 - 58 parts of ultra-fine thermally conductive aluminum nitride, 16 - 28 parts of iron oxide, 21 - 28 parts of copper oxide, 10 - 17 parts of zinc oxide.

7. The high-temperature and medium-resistant coating according to claim 1, characterized in that, the mixed solvent comprises the following raw materials by weight: 92 - 115 parts of ethylene glycol phenyl ether, 73 - 98 parts of xylene, 30 - 42 parts of n-butanol, 12 - 19 parts of cyclohexanone.

8. The high-temperature and medium-resistant coating according to claim 1, characterized in that, the auxiliary agent comprises the following raw materials by weight: 10 - 13 parts of defoamer, 3 - 10 parts of leveling agent, 10 - 16 parts of wetting agent, 12 - 16 parts of adhesion promoter, 4 - 7 parts of thixotropic agent.

9. A manufacturing method of the high-temperature and medium-resistant coating according to any one of claims 1 - 8, characterized in that, it comprises the following steps: Prepare the modified epoxy phenolic resin; Add the graphene dispersion and the auxiliary agent to the modified epoxy phenolic resin, and disperse for 20 - 30 min under the condition of a rotation speed of 800 - 1000 r / min to obtain a mixed solution; Add pigments, fillers, functional fillers, and dispersants into a mixed solvent, disperse for 20 - 30 min under the condition of a rotation speed of 800 - 1000 r / min, and grind for 1.0 - 1.5 h under the condition of a temperature ≤ 70°C to obtain a mixed slurry; Mix the mixed solution and the mixed slurry, disperse for 30 - 45 min under the conditions of a rotation speed of 2000 - 2500 r / min and a temperature ≤ 70°C to obtain a high-temperature and medium-resistant coating.

10. The manufacturing method according to claim 9, characterized in that, preparing a modified epoxy phenolic resin, including: Add 40 parts of phenolic resin into a solution of 20 parts of ethylene glycol phenyl ether and 20 parts of xylene, heat and melt for 30 - 45 min under the condition of controlling the temperature at 110 - 130°C to obtain a first solution; Cool the first solution to 70 - 80°C, add the formulated amount of epoxy resin and benzyl dimethylamine, disperse for 5 min, raise the temperature to 150°C, and disperse for 30 - 40 min under the condition of a rotation speed of 1000 - 1500 r / min. The benzyl dimethylamine is 1% of the total mass of the first solution to obtain a second solution; After the second solution is cooled to room temperature, add the remaining formulated amount of phenolic resin, the formulated amount of epoxy organosilicon resin, the remaining formulated amount of ethylene glycol phenyl ether, and the remaining formulated amount of xylene, and disperse for 50 - 60 min under the condition of a rotation speed of 1500 - 2000 r / min to obtain a modified epoxy phenolic resin.

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