Evaporation device, display panel and preparation method of display panel

Abstract

The embodiment of the invention provides an evaporation device, a display panel and a preparation method of the display panel. The evaporation device comprises a plurality of evaporation sources, a carrying table and a shielding mask plate, wherein the carrying table is provided with a carrying surface facing the evaporation sources, and the shielding mask plate is located between the carrying surface and the evaporation sources. The bearing surface is used for bearing a mother board. The shielding mask plate is provided with a main body part and a plurality of evaporation openings defined by the main body part, and at least one second alignment mark corresponding to the at least one first alignment mark on the mother plate is arranged on the main body part. And after the at least one second alignment mark is matched and aligned with the at least one first alignment mark, the panel part is exposed from the corresponding evaporation opening and is opposite to at least part of the evaporation sources. According to the embodiment of the invention, the position alignment deviation of the evaporation source and the mother board can be reduced, so that the alignment precision of the light-emitting device is improved, and the display effect of the display panel is further improved.

Description

Technical Field

[0001] The embodiments of the present application relate to the technical field of evaporation coating, and in particular, to an evaporation coating device, a display panel and a method for manufacturing the same. Background Art

[0002] In the process of manufacturing traditional display panels, light-emitting pixel patterning is usually achieved through a fine metal mask (FMM). The FMM technology is mature and has rich mass production experience. However, the FMM technology also has problems such as limited precision, high development cost, and long development cycle. The fine metal maskless technology eliminates the limitations of the traditional OLED (organic light-emitting diode) process on the display screen size, resolution, and other screen performance, and has the advantages of high performance, full-domain size, and agile delivery.

[0003] Patent applications CN118251982A, CN115666161A, CN116648095A, CN117062489A, CN118678742A, CN118785761A, CN115224220A, CN118678729A, CN118660529A, CN118660589A record the relevant content of the fine metal maskless technology for reference.

[0004] The manufacturing process of the display panel includes an evaporation coating process, and the evaporation coating process requires an evaporation coating device, but the existing evaporation coating devices need to be improved. Summary of the Invention

[0005] In view of this, the embodiments of the present application provide an evaporation coating device, a display panel and a method for manufacturing the same to at least partially solve the above problems.

[0006] According to the first aspect of the embodiments of the present application, an evaporation coating device is provided. The evaporation coating device is used to evaporate coat the mother board of the display panel. The mother board includes a blank part and a plurality of panel parts, and at least two adjacent panel parts are separated by the blank part. The blank part is provided with at least one first alignment mark. The evaporation coating device includes a plurality of evaporation sources, a stage and a shielding mask. The stage has a bearing surface facing the plurality of evaporation sources. The bearing surface is used to bear the mother board. The shielding mask is located between the bearing surface and the plurality of evaporation sources, and has a main body part and a plurality of evaporation openings formed by enclosing the main body part. At least one second alignment mark corresponding to at least one first alignment mark is provided on the main body part. Wherein, after at least one second alignment mark is aligned with at least one first alignment mark, the panel part is exposed from the corresponding evaporation opening and is at least partially opposite to the plurality of evaporation sources.

[0007] In some embodiments, at least one first alignment mark includes a plurality of first alignment marks, the blank portion includes a plurality of first corner regions, and the plurality of first alignment marks are respectively disposed in the plurality of first corner regions. At least one second alignment mark includes a plurality of second alignment marks, the main body portion includes a plurality of second corner regions corresponding to the plurality of first corner regions, and the plurality of second alignment marks are respectively disposed in the plurality of second corner regions corresponding to the plurality of first alignment marks.

[0008] In some embodiments, after the plurality of second alignment marks are aligned with the plurality of first alignment marks, the first shape formed by the orthographic projection of the outer edge of the first alignment mark on the bearing surface has a first area, the second shape formed by the orthographic projection of the outer edge of the second alignment mark on the bearing surface has a second area, and the orthographic projection of the panel portion on the bearing surface has a third area, where: the first area is less than the third area, the second area is less than the third area, and the first area is less than the second area.

[0009] In some embodiments, the number of the plurality of first alignment marks is equal to the number of the plurality of second alignment marks. The first alignment mark has a first pattern, and the second alignment mark has a first opening that matches the first pattern of the corresponding first alignment mark. After at least one second alignment mark is aligned with at least one first alignment mark, the first pattern is exposed from the corresponding first opening.

[0010] In some embodiments, the orthographic projection area of the first opening on the bearing surface is less than the orthographic projection area of the evaporation opening on the bearing surface.

[0011] In some embodiments, the plurality of first alignment marks at least include a first sub-alignment mark and a second sub-alignment mark, and the plurality of second alignment marks at least include a third sub-alignment mark corresponding to the first sub-alignment mark and a fourth sub-alignment mark corresponding to the second sub-alignment mark, where: The shape of the first pattern corresponding to the first sub-alignment mark is different from the shape of the first pattern corresponding to the second sub-alignment mark; The shape of the orthographic projection of the first opening corresponding to the third sub-alignment mark on the bearing surface is different from the shape of the orthographic projection of the first opening corresponding to the fourth sub-alignment mark on the bearing surface.

[0012] In some embodiments, the plurality of first alignment marks at least include a first sub-alignment mark and a second sub-alignment mark, and the plurality of second alignment marks at least include a third sub-alignment mark corresponding to the first sub-alignment mark and a fourth sub-alignment mark corresponding to the second sub-alignment mark, where: The width of the first pattern corresponding to the first sub-alignment mark is less than the width of the first pattern corresponding to the second sub-alignment mark; The width of the orthographic projection of the first opening corresponding to the third sub-alignment mark on the bearing surface is smaller than the width of the orthographic projection of the first opening corresponding to the fourth sub-alignment mark on the bearing surface.

[0013] In some embodiments, the number of each of the plurality of first alignment marks, the plurality of second alignment marks, the plurality of first corner regions, and the plurality of second corner regions is 4. The first alignment marks are disposed in the corresponding first corner regions, and the second alignment marks are disposed in the corresponding second corner regions.

[0014] In some embodiments, the first pattern is at least one of a cross shape, a grid shape, and a rectangular shape, and the shape of the orthographic projection of the first opening corresponding to the first pattern on the bearing surface is at least one of a cross shape, a grid shape, and a rectangular shape.

[0015] In some embodiments, the number of the plurality of first alignment marks is smaller than the number of the plurality of second alignment marks. The plurality of first alignment marks at least includes one fifth sub-alignment mark, and the plurality of second alignment marks at least includes a plurality of sixth sub-alignment marks corresponding to the fifth sub-alignment mark, where: The fifth sub-alignment mark has a second pattern, and the sixth sub-alignment mark has a second opening that cooperates with the second pattern. After the fifth sub-alignment mark and the sixth sub-alignment mark are aligned in cooperation, a part of the second pattern is exposed from the plurality of second openings.

[0016] In some embodiments, after the fifth sub-alignment mark and the sixth sub-alignment mark are aligned in cooperation, the orthographic projection area of the second pattern on the bearing surface is larger than the total area of the shape formed by the orthographic projection of the outer edges of the plurality of second openings on the bearing surface.

[0017] In some embodiments, a plurality of test terminals are provided in the blank portion, and the test terminals are electrically connected to the corresponding panel portions, where: After at least one second alignment mark and at least one first alignment mark are aligned in cooperation, the main body separates the plurality of test terminals from the plurality of evaporation sources.

[0018] In some embodiments, a plurality of test devices are provided in the blank portion. The test devices are disposed beside the corresponding panel portions and include a virtual pixel circuit, a virtual isolation structure, and a virtual first electrode. The virtual isolation structure encloses a separation opening, and a part of the virtual first electrode is exposed from the separation opening and is electrically connected to the virtual pixel circuit, where: After at least one second alignment mark and at least one first alignment mark are aligned in cooperation, the main body separates the plurality of test devices from the plurality of evaporation sources.

[0019] In some embodiments, after at least one second alignment mark is aligned with at least one first alignment mark, the orthographic projection of the main body on the bearing surface covers the orthographic projections of a plurality of test terminals on the bearing surface, and the orthographic projection of the main body on the bearing surface covers the orthographic projections of a plurality of test devices on the bearing surface.

[0020] In some embodiments, the width of the main body located between a plurality of evaporation openings is smaller than the width of the main body located beside a plurality of evaporation openings.

[0021] According to a second aspect of the embodiments of the present application, a method for manufacturing a display panel is provided. The method for manufacturing a display panel includes: moving a mother board of the display panel to the bearing surface of the stage of the evaporation device as described above, wherein the mother board includes a blank part and a plurality of panel parts, at least two adjacent panel parts are separated by the blank part, and the blank part is provided with at least one first alignment mark; Moving the shielding mask plate to align at least one second alignment mark with at least one first alignment mark, so that the panel part is exposed from the corresponding evaporation opening and faces at least part of a plurality of evaporation sources; Using evaporation materials ejected from a plurality of evaporation sources to evaporate a plurality of panel parts of the mother board.

[0022] In some embodiments, the blank part is provided with a plurality of test terminals and a plurality of test devices. The test terminals are electrically connected to the corresponding panel parts. The test devices are arranged beside the corresponding panel parts and include a virtual pixel circuit, a virtual isolation structure, and a virtual first electrode. The virtual isolation structure encloses an isolation opening, and a part of the virtual first electrode is exposed from the isolation opening and is electrically connected to the virtual pixel circuit; In the step of evaporating a plurality of panel parts of the mother board, the main body separates the plurality of test terminals from the plurality of evaporation sources, and the main body separates the plurality of test devices from the plurality of evaporation sources; After the step of evaporating a plurality of panel parts of the mother board, the method further includes: Performing a lighting test on the corresponding panel part with the test terminal; Performing a cathode lap impedance test on the corresponding panel part with the test device.

[0023] In some embodiments, after the step of performing a cathode lap impedance test on the corresponding panel part with the test device, the method further includes: Performing cutting in the blank part to separate the evaporated plurality of panel parts from each other to obtain a plurality of display panels, and the display panel includes the corresponding evaporated panel parts; Wherein, during the process of separating the evaporated plurality of panel parts from each other, the test terminals are separated from the corresponding evaporated panel parts, and the test devices are separated from the corresponding evaporated panel parts.

[0024] According to a third aspect of the embodiments of the present application, a display panel is provided, and the display panel is prepared by using the method according to any of the above embodiments.

[0025] In some embodiments, the display panel includes a substrate, an isolation structure, and a plurality of light-emitting devices. The isolation structure is located on one side of the substrate, and the isolation structure encloses a plurality of isolation openings. A part of the light-emitting device is located in the corresponding isolation opening. The light-emitting device includes a first electrode, a light-emitting functional layer, and a second electrode sequentially arranged in a direction away from the substrate, and the second electrode overlaps with the isolation structure.

[0026] According to the solution provided by the embodiments of the present application, a shielding mask is arranged between the evaporation source and the stage, and the second alignment mark on the shielding mask cooperates with the first alignment mark on the mother board for alignment, which can reduce the positional alignment deviation between the evaporation source and the mother board, so that the evaporation material can be accurately evaporated at the corresponding position of the mother board, thereby improving the alignment accuracy of the film layer pattern of the mother board, further improving the alignment accuracy of the light-emitting device, and further improving the display effect of the display panel. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the prior art, the following will briefly introduce the drawings required for use in the description of the embodiments or the prior art. Obviously, the drawings in the following description are only some embodiments recorded in the embodiments of the present application. For those of ordinary skill in the art, other drawings can also be obtained according to these drawings.

[0028] Figure 1 Exemplary structural schematic diagram of a display device provided by an embodiment of the present application; Figure 2 Exemplary structural schematic diagram of a display panel provided by an embodiment of the present application; Figure 3 is Figure 2 enlarged view at A in Figure 4 is Figure 3 cross-sectional view taken along section line B1-B2 in Figure 5 Exemplary structural schematic diagram of a mother board provided by an embodiment of the present application; Figure 6 Structural schematic diagram of an evaporation device in some examples; Figure 7 Exemplary structural schematic diagram of an evaporation device provided by an embodiment of the present application; Figure 8 Exemplary structural schematic diagram of a shielding mask provided by an embodiment of the present application; Figure 9Exemplary structural schematic diagram after alignment of the motherboard and the shielding mask provided by the embodiments of the present application; Figure 10 Flowchart of a method for manufacturing a display panel provided by the embodiments of the present application. Detailed implementation manners

[0029] In order to enable those skilled in the art to better understand the technical solutions in the embodiments of the present application, the following will clearly and completely describe the technical solutions in the embodiments of the present application with reference to the accompanying drawings in the embodiments of the present application. Obviously, the described embodiments are only a part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the embodiments of the present application, all other embodiments obtained by those of ordinary skill in the art shall fall within the protection scope of the embodiments of the present application.

[0030] The terms used in the embodiments of the present application are only for the purpose of describing specific embodiments, and are not intended to limit the present application. The singular forms of "a", "the" and "said" used in the embodiments of the present application and the appended claims are also intended to include the plural forms, unless the context clearly indicates otherwise. It should also be understood that the term "and / or" used in the embodiments of the present application refers to and includes any or all possible combinations of one or more of the associated listed items.

[0031] It should be understood that in the description of the embodiments of the present application, the orientation or positional relationship indicated by the terms "length", "width", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc. is based on the orientation or positional relationship shown in the drawings, and is only for the convenience of describing the solutions of the embodiments of the present application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus should not be construed as a limitation to the embodiments of the present application.

[0032] In addition, when an element or layer is referred to as being "on", "connected to" or "coupled to" another element or layer, the element or layer can be directly on the other element or layer, directly connected to or directly coupled to the other element or layer or there can be intermediate elements or layers. However, when an element or layer is referred to as being "directly on", "directly connected to" or "directly coupled to" another element or layer, there are no intermediate elements or layers.

[0033] The terms first, second, etc. are used to describe various elements, components, regions, layers and / or parts, but these elements, components, regions, layers and / or parts should not be limited by these terms. These terms are used to distinguish one element, component, region, layer and / or part from another element, component, region, layer and / or part.

[0034] Unless otherwise clearly defined and limited, the terms "install", "connect", "couple", "fix", etc. shall be understood in a broad sense. For example, it may be a fixed connection, a detachable connection, or integrated; it may be a mechanical connection or an electrical connection; it may be directly connected or indirectly connected through an intermediate medium, and it may be the communication inside two components or the interaction relationship between two components. For those skilled in the art, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0035] The following further describes the specific implementation of the embodiments of the present application with reference to the accompanying drawings of the embodiments of the present application.

[0036] Figure 1 It is an exemplary structural schematic diagram of a display device provided for an embodiment of the present application.

[0037] See Figure 1 , an embodiment of the present application provides a display device 1000. The display device 1000 is an electronic device with an image (including: static image or dynamic image, where the dynamic image may be a video) display function. For example, the display device 1000 may be a display, a television, a billboard, a digital photo frame, a laser printer with a display function, a telephone, a mobile phone, a personal digital assistant (Personal Digital Assistant, PDA), a digital camera, a portable video camera, a viewfinder, a navigator, a large-area wall, a household appliance, an information query device (such as a business query device in departments such as e-government, banks, hospitals, and power), a monitor, an electronic painting screen, a virtual reality (Virtual Reality, VR) display device, an augmented reality (Augmented Reality, AR) display device, and an in-vehicle display, etc., but is not limited thereto.

[0038] Continue to refer to Figure 1 , the display device 1000 may include a display panel 100. The display panel 100 may be any one of an organic light emitting diode (Organic Light emitting Diode, OLED) display panel, a quantum dot light emitting diode (Quantum Dot Light Emitting Diodes, QLED) display panel, a micro light emitting diode (Mini LED or Micro LED) display panel, and a liquid crystal display (Liquid Crystal Display, LCD) panel. The embodiments of the present application do not limit the type of the display panel 100.

[0039] Figure 2 It is an exemplary structural schematic diagram of a display panel provided for an embodiment of the present application. Figure 3 ForFigure 2 Enlarged view of portion A in [the figure].

[0040] For ease of description hereinafter, an XYZ coordinate system is established. Refer to Figure 2 , where the third direction Z represents the thickness direction of the display panel 100 (or the thickness direction of the display device), the first direction X and the second direction Y are perpendicular to each other, and both are perpendicular to the third direction Z.

[0041] Refer to Figure 2 , the display panel 100 has a display area AA and a non-display area SA. The display area AA is the area on the display panel 100 for displaying images, and the non-display area SA is the area on the display panel 100 other than the display area AA. The non-display area SA can be located on at least one side (e.g., one side, or multiple sides) of the display area AA. For example, the non-display area SA can be arranged to surround the display area AA.

[0042] The display area AA includes a plurality of pixel units P. Refer to Figure 3 , each pixel unit P includes a plurality of sub-pixels 101, and the sub-pixels 101 are the smallest units for image display within the display panel 100. The emission colors of the plurality of sub-pixels 101 are different. Exemplarily, each pixel unit P includes a first sub-pixel, a second sub-pixel, and a third sub-pixel. The first sub-pixel, the second sub-pixel, and the third sub-pixel respectively emit three primary color lights. For example, the first sub-pixel can emit red light, the second sub-pixel can emit green light, and the third sub-pixel can emit blue light. The arrangement pattern of the plurality of sub-pixels 101 in the display area AA can be any arrangement pattern such as a standard RGB arrangement pattern, a Delta pixel arrangement pattern, a Pentile arrangement pattern, a diamond-like arrangement pattern, etc.

[0043] Figure 4 Is Figure 3 A cross-sectional view taken along the section line B1 - B2 in [the figure].

[0044] Refer to Figure 4 , the display panel 100 includes a substrate 10, a display functional layer, a pixel definition layer 20, and an isolation structure (VSS) 40.

[0045] The substrate 10 includes a substrate base 11. The substrate base 11 supports other structures in the display panel 100. The substrate base 11 can be set according to actual needs. Exemplarily, the substrate base 11 can be a rigid substrate, and alternatively, the substrate base 11 can be a flexible substrate. The substrate 10 may further include a driving circuit layer 12, which is located on one side of the substrate base 11 and is coupled to a plurality of light-emitting devices (the light-emitting devices will be described in detail below), and is configured to provide an electrical signal to each light-emitting device, so that the light-emitting device emits light with a corresponding brightness. The driving circuit layer 12 includes a plurality of pixel driving circuits, and each pixel driving circuit is electrically connected to a sub-pixel 101 for driving the sub-pixel to emit light. The pixel driving circuit may include a plurality of electronic components such as transistors and capacitors. For example, each pixel driving circuit may include three transistors and one capacitor, forming 3T1C (i.e., one driving transistor, two switching transistors, and one capacitor), and may also include more than three transistors and at least one capacitor, such as 4T1C, 5T1C, or 7T1C, etc. Among them, the transistor can be a thin film transistor (TFT), a metal oxide semiconductor (MOS), or other switching devices with the same characteristics.

[0046] The pixel definition layer 20 is located on one side of the substrate 10. The pixel definition layer 20 includes pixel defining portions 21 and a plurality of pixel openings 22 formed by enclosing the pixel defining portions 21. That is to say, there are a plurality of openings on the surface of the pixel definition layer 20 away from the substrate 10.

[0047] The display function layer is located on the substrate 10, and includes a plurality of light-emitting devices 30 at least partially (for example, partially, or all) located in the pixel opening 22. The light-emitting device 30 is an electronic device that can emit light, and one light-emitting device 30 corresponds to one sub-pixel, and one light-emitting device 30 corresponds to one pixel opening 22. The light-emitting device 30 can be any one of an OLED device, a QLED device, an LED device, and a micro light-emitting diode (Mini LED or Micro LED) device. The light-emitting device 30 includes a first electrode 31, a light-emitting function layer 32, and a second electrode 33 stacked in sequence in a direction away from the substrate 10. Among them, the first electrode 31 is located on one side of the substrate 10, one first electrode 31 corresponds to one pixel opening 22, the pixel opening 22 exposes a part of the corresponding first electrode 31, and the pixel defining portion 21 covers the gap between adjacent first electrodes 31. The light-emitting function layer 32 covers the exposed first electrode 31, and the side of the light-emitting function layer 32 close to the substrate 10 is connected to the first electrode 31, and the side away from the substrate 10 is connected to the second electrode 33. Either the first electrode 31 or the second electrode 33 is an anode, and the other is a cathode. Exemplarily, the first electrode 31 is an anode and the second electrode 33 is a cathode. Exemplarily again, the first electrode 31 is a cathode and the second electrode 33 is an anode. The light-emitting functional layer 32 may include a light-emitting layer (EML) and a functional material layer. For example, the functional material layer may include one or more of a hole injection layer (HIL), a hole transport layer (HTL), an electron transport layer (ETL) and an electron injection layer (EIL), which may be specifically configured according to actual needs, and this embodiment does not limit this.

[0048] The isolation structure 40 is located on one side of the substrate 10, specifically, on the side of the pixel definition layer 20 away from the substrate 10, and is used to isolate the light-emitting functional layer 32 of the adjacent light-emitting device 30. Specifically, the isolation structure 40 is located on the side of the pixel definition portion 21 away from the substrate 10. The isolation structure 40 can be a multilayer structure. Exemplarily, the isolation structure 40 includes a first isolation layer 41, a second isolation layer 42 and a third isolation layer 43 stacked in sequence in a direction away from the substrate 10, and the second electrode 33 overlaps the first isolation layer 41. The isolation structure 40 encloses a plurality of isolation openings. The isolation opening is connected to the pixel opening 21, and part of the light-emitting device 30 is located in the corresponding isolation opening. The isolation structure 40 is electrically connected to the light-emitting device 30, and specifically, the isolation structure 40 overlaps the second electrode 33.

[0049] The display panel 100 may further include a first encapsulation layer 50, which is located on the side of the display functional layer away from the substrate 10. Exemplarily, the first encapsulation layer 50 is composed of a plurality of encapsulation units respectively covering the isolation openings. The first encapsulation layer 50 at least covers the light-emitting devices 30, and forms a dense thin film (for example, a thin film with only a closed contour line) above these light-emitting devices 30 to block external water and oxygen from entering the light-emitting devices and protect the film layers of the light-emitting devices 30. To better achieve the sealing effect, the material of the first encapsulation layer 50 may include an inorganic insulating material, such as one or more of silicon oxide, silicon nitride, titanium oxide, etc. The first encapsulation layer 50 may be formed by a thin film deposition process such as Chemical Vapor Deposition (CVD), Physical Vapor Deposition (PVD), or Atomic Layer Deposition (ALD).

[0050] The display panel 100 may further include a second encapsulation layer 60 and a third encapsulation layer 70 to further enhance the encapsulation effect. The second encapsulation layer 60 is located on the side of the first encapsulation layer 50 away from the substrate 10, and the third encapsulation layer 70 is located on the side of the second encapsulation layer 60 away from the substrate 10, covering the isolation openings and the isolation structure 40. The second encapsulation layer 60 and the third encapsulation layer 70 may extend from the display area AA to the non-display area SA, and at this time their contour lines are located in the non-display area SA. The second encapsulation layer 60 is an organic layer, and the third encapsulation layer 70 is an inorganic layer.

[0051] Figure 5 Exemplary structural schematic diagram of the mother board provided by the embodiment of the present application.

[0052] The display panel 100 is formed by cutting the mother board 100m. Specifically, referring to Figure 5 , the mother board 100m includes a plurality of panel parts 101 and blank parts 102, and at least two adjacent panel parts 101 are separated by the blank parts 102. When forming the display panel 100, the blank parts of the mother board 100m are cut so that the panel parts 101 form the display panel 100.

[0053] In some embodiments, the blank part 102 is provided with a plurality of test terminals 1021 for lighting (Light On Inspection, LOI) & CT testing. The test terminals 1021 are electrically connected to the corresponding panel parts 101.

[0054] In some embodiments, the blank portion 102 is further provided with a plurality of test devices 1022, which serve as a test element group (TEG) for cathode lap impedance testing. The test devices 1022 are disposed beside the corresponding panel portion 101 and include a virtual pixel circuit, a virtual isolation structure, and a virtual first electrode. The virtual isolation structure encloses an isolation opening, and a portion of the virtual first electrode is exposed from the isolation opening and electrically connected to the virtual pixel circuit.

[0055] The process steps for fabricating the mother board 100m at least include: G1. Forming an isolation structure on the substrate, and the isolation structure encloses a plurality of isolation openings. G2. Forming a plurality of light-emitting devices, with a portion of the light-emitting devices located within the corresponding isolation openings. The formed light-emitting devices include a first electrode, a light-emitting functional layer, and a second electrode sequentially arranged in a direction away from the substrate, and the second electrode overlaps with the isolation structure. When forming the pixel driving circuit in the substrate, the virtual pixel circuit can be formed simultaneously. When forming the isolation structure on the substrate, the virtual isolation structure can be formed simultaneously. When forming the first electrode, the virtual first electrode can be formed simultaneously.

[0056] The formation of the plurality of light-emitting devices is performed using an evaporation process in an evaporation device.

[0057] Figure 6 It is a schematic structural diagram of an evaporation device in some examples.

[0058] In some examples, referring to Figure 6 , the evaporation device 200A includes an evaporation source 201A and a stage 202A. The stage 202A has a bearing surface 2021A facing the evaporation source 201A, and the mother board 100m is placed on the bearing surface 2021A. During the process of fabricating the mother board 100m, the evaporation source 201A sprays evaporation materials onto the mother board 100m to complete the evaporation process. During the evaporation process, the mother board 100m is placed on the stage 202A. There is a deviation in the alignment between the evaporation source 201A and the mother board 100m, resulting in the evaporation materials not being accurately evaporated at the corresponding positions on the mother board 100m, causing a deviation in the positions of the light-emitting devices on the mother board 100m, affecting the light-emitting effect, and thus resulting in a poor display effect of the formed display panel 100.

[0059] To solve the above technical problems, an embodiment of the present application provides an evaporation device, adding an alignment system to improve the alignment accuracy between the evaporation source and the mother board.

[0060] Figure 7 It is an exemplary structural diagram of an evaporation device provided by an embodiment of the present application. Figure 8 It is an exemplary structural diagram of a shielding mask provided by an embodiment of the present application.

[0061] Referring to Figure 7, the evaporation device includes a plurality of evaporation sources 201, a stage 202, and a shielding mask 203.

[0062] The evaporation source 201 can accommodate evaporation materials and can be applied to the evaporation process in the display panel manufacturing process. That is, in a vacuum chamber, through heating, the evaporation materials are sublimated into molecular-level vapor and uniformly adhered to the mother board 100m according to a preset device structure. The evaporation materials can be classified into encapsulation layer materials (including light extraction materials and crystal encapsulation materials), cathode evaporation materials, electron transport layer materials, hole blocking layer materials, light-emitting layer materials, electron blocking layer materials, hole transport layer materials, hole injection layer materials, etc. The evaporation source 210 can be a dot evaporation source, a line evaporation source, or a surface evaporation source. Exemplarily, the evaporation source 10 can be a crucible. The embodiments of the present application do not specifically limit the shape and size of the evaporation source, as long as it can accommodate the evaporation materials and heat them.

[0063] The stage 202 has a bearing surface 2021 facing the plurality of evaporation sources 201, and the bearing surface 2021 is used to bear the mother board 100m. Among them, continue to refer to Figure 5 , at least one (for example, one, or multiple) first alignment mark G1 is provided on the blank part 102 of the mother board 100m.

[0064] Refer to Figure 7 and Figure 8 , the shielding mask 203 is located between the bearing surface 2021 and the plurality of evaporation sources 201, and has a main body portion 2031 and a plurality of evaporation openings 2032 formed by enclosing the main body portion 2031. At least one second alignment mark G2 corresponding to at least one first alignment mark G1 is provided on the main body portion 2031. Among them, after at least one second alignment mark G2 and at least one first alignment mark G1 are cooperatively aligned, exemplarily, one second alignment mark G2 is cooperatively aligned with one first alignment mark G1. Another exemplarily, each second alignment mark G2 is respectively cooperatively aligned with one first alignment mark G1. The panel portion 101 is exposed from the corresponding evaporation opening 2032 and is at least partially opposite to the plurality of evaporation sources 201.

[0065] Figure 9 It is an exemplary structural schematic diagram after the alignment of the mother board and the shielding mask provided by the embodiments of the present application.

[0066] During the working process of the evaporation device 200, there is no occlusion between the first alignment mark G1 and the second alignment mark G2. Refer to Figure 9, the second alignment mark G2 on the shielding mask 203 is aligned with the first alignment mark G1 on the mother board 100m. The panel portion 101 of the mother board 100m corresponds to the evaporation opening 2032 of the shielding mask 203, and the panel portion 101 is exposed from the evaporation opening 2032. The evaporation material in the evaporation source 201 is evaporated onto the panel portion 101 through the evaporation opening 2032 to form a corresponding film layer on the mother board 100m, completing the evaporation process. By using the cooperation and alignment of the first alignment mark G1 and the second alignment mark G2, the position alignment deviation between the evaporation source 201 and the mother board 100m can be reduced, so that the evaporation material is heated to form steam in the evaporation source 201 and then ejected from one side of the bearing surface 2021 of the third square Z-direction stage 202, and accurately evaporated at the corresponding position of the mother board 100m, so as to improve the alignment accuracy of the film layer pattern of the mother board 100m, thereby improving the alignment accuracy of the light-emitting device and further improving the display effect of the display panel 100.

[0067] In some embodiments, continue to refer to Figure 5 , at least one first alignment mark G1 includes a plurality (such as two, or more than two) of first alignment marks G1, and the blank portion 102 includes a plurality (such as two, or more than two) of first corner regions Q1. Exemplarily, the first corner region Q1 may be located in the region where the right angle of the mother board 100m is located. The plurality of first alignment marks G1 are respectively arranged in the plurality of first corner regions Q1. In this way, the range of the mother board 100m covered after the connection between the plurality of first alignment marks G1 is relatively large. That is to say, the plurality of first alignment marks G1 can increase the alignment mark range and perform high-precision positioning in a wider area of the mother board 100m, so as to reduce the alignment error caused by shielding or environmental interference and improve the stability and reliability of alignment.

[0068] Continue to refer to Figure 8 , at least one second alignment mark G2 includes a plurality (such as two, or more than two) of second alignment marks G2. The main body portion 2031 includes a plurality of second corner regions Q2 corresponding to the plurality of first corner regions Q1, and the plurality of second alignment marks G2 are respectively arranged in the plurality of second corner regions Q2 corresponding to the plurality of first alignment marks G1. In this way, the first corner region Q1 corresponds to the second corner region Q2, and the plurality of first alignment marks G1 correspond to the plurality of second alignment marks G2. The alignment marks at two or more corresponding positions correspond to each other, which can improve the alignment accuracy between the mother board 100m and the shielding mask 203 and reduce the alignment error.

[0069] In some embodiments, after the plurality of second alignment marks G2 are aligned with the plurality of first alignment marks G1, the first shape formed by the orthographic projection of the outer edge of the first alignment mark G1 on the bearing surface 2021 has a first area, the second shape formed by the orthographic projection of the outer edge of the second alignment mark G2 on the bearing surface 2021 has a second area, and the orthographic projection of the panel portion 101 on the bearing surface 2021 has a third area.

[0070] The first area is smaller than the third area. That is to say, the orthographic projection of the outer edge of the first alignment mark G1 on the bearing surface 2021 is smaller than the orthographic projection of the panel portion 101 on the bearing surface 2021. The first alignment mark G1 is smaller than the panel portion 101, and the movement range of the first alignment mark G1 is smaller. Compared with directly aligning using the panel portion 101, during the alignment process of the first alignment mark G1, the absolute error between the actual position and the target position is smaller, and the alignment accuracy is higher than that of the panel portion 101. Therefore, using the first alignment mark G1 for alignment can improve the alignment accuracy of the mother board 100m.

[0071] The second area is smaller than the third area. That is to say, the orthographic projection of the outer edge of the second alignment mark G2 on the bearing surface 2021 is smaller than the orthographic projection of the panel portion 101 on the bearing surface 2021. The second alignment mark G2 is smaller than the panel portion 101, and the movement range of the second alignment mark G2 is smaller. Compared with directly aligning using the panel portion 101, during the alignment process of the second alignment mark G2, the absolute error between the actual position and the target position is smaller, and the alignment accuracy is higher than that of the panel portion 101. Therefore, using the second alignment mark G2 for alignment can improve the alignment accuracy of the mother board 100m.

[0072] The first area is smaller than the second area. That is to say, the orthographic projection of the outer edge of the first alignment mark G1 on the bearing surface 2021 is smaller than the orthographic projection of the second alignment mark G2 on the bearing surface 2021. When aligning, the first positioning mark G1 can be first moved into the corresponding second positioning mark G2 and then fine-tuned to improve the alignment efficiency. Moreover, during the alignment process, it is possible to monitor the alignment accuracy of the mother board 100m and the shielding mask 203 by detecting whether the first alignment mark G1 is covered by the second positioning mark G2, so as to reduce the alignment error.

[0073] In some embodiments, continue to refer to Figure 9, the number of multiple first alignment marks G1 and the number of multiple second alignment marks G2 are equal. For example, the number of the first alignment marks G1 is four, which are respectively located at the four corners of the mother board 100m, and the number of the second alignment marks G2 is also four, which are respectively located at the four corners of the shielding mask template 203. The first alignment marks G1 have a first pattern, and the second alignment marks G2 have first openings that match the first pattern of the corresponding first alignment marks G1. After at least one second alignment mark is aligned with at least one first alignment mark, the first pattern is exposed from the corresponding first opening. The number of the first alignment marks G1 and the second alignment marks G2 is equal, and each first pattern is respectively exposed from the corresponding first opening. The first alignment marks G1 and the second alignment marks G2 at multiple positions are aligned one by one, which can improve the alignment accuracy of the positions where each alignment mark is located, and further improve the alignment accuracy of the entire mother board 100m and the entire shielding mask template 203, reduce the alignment error, and thus improve the display effect.

[0074] In some embodiments, continue to refer to Figure 8 , the orthographic projection area of the first opening K1 on the bearing surface 2021 is smaller than the orthographic projection area of the evaporation opening 2032 on the bearing surface 2021. The first opening K1 is smaller than the evaporation opening 2032, and the moving range of the second alignment mark G2 is smaller. Compared with directly using the evaporation opening 2032 for alignment, during the alignment process of the second alignment mark G2, the absolute error between the actual position and the target position is smaller, and the alignment accuracy is greater than that of the evaporation opening 2032. Therefore, using the first opening K1 of the second alignment mark G2 for alignment can improve the alignment accuracy of the mother board 100m.

[0075] In some embodiments, multiple first alignment marks G1 at least include a first sub-alignment mark and a second sub-alignment mark, and multiple second alignment marks at least include a third sub-alignment mark corresponding to the first sub-alignment mark and a fourth sub-alignment mark corresponding to the second sub-alignment mark.

[0076] The shape of the first pattern corresponding to the first sub-alignment mark is different from the shape of the first pattern corresponding to the second sub-alignment mark; the shape of the orthographic projection of the first opening corresponding to the third sub-alignment mark on the bearing surface is different from the shape of the orthographic projection of the first opening corresponding to the fourth sub-alignment mark on the bearing surface. The shape of the first sub-alignment mark in the first alignment mark G1 can be the same as the shape of the third sub-alignment mark or the fourth sub-alignment mark, and the shape of the second sub-alignment mark can be the same as the shape of the third sub-alignment mark or the fourth sub-alignment mark. That is to say, there are at least two shapes of the first alignment mark G1, and there are at least two shapes of the second alignment mark G2. During the alignment process, the sub-alignment marks of various shapes on the mother board 100m are respectively aligned with the sub-alignment marks of various shapes on the shielding mask template 203, and the alignment positions are different, which can improve the alignment accuracy and reduce the alignment error.

[0077] In some embodiments, the plurality of first alignment marks at least include a first sub-alignment mark and a second sub-alignment mark, and the plurality of second alignment marks at least include a third sub-alignment mark corresponding to the first sub-alignment mark and a fourth sub-alignment mark corresponding to the second sub-alignment mark.

[0078] The width of the first pattern corresponding to the first sub-alignment mark is smaller than the width of the first pattern corresponding to the second sub-alignment mark. That is to say, the size of the first sub-alignment mark is different from the size of the second sub-alignment mark. In this way, during the cooperative alignment process, the alignment positions of the first sub-alignment mark and the second sub-alignment mark are different, which can improve the alignment accuracy and reduce the alignment error.

[0079] The width of the positive projection of the first opening corresponding to the third sub-alignment mark on the bearing surface is smaller than the width of the positive projection of the first opening corresponding to the fourth sub-alignment mark on the bearing surface. That is to say, the size of the third sub-alignment mark is different from the size of the fourth sub-alignment mark. In this way, during the cooperative alignment process, the alignment positions of the third sub-alignment mark and the fourth sub-alignment mark are different, which can improve the alignment accuracy and reduce the alignment error.

[0080] In some embodiments, referring further to Figure 9 , the number of the plurality of first alignment marks G1, the plurality of second alignment marks G2, the plurality of first corner regions Q1, and the plurality of second corner regions Q2 is 4. The first alignment marks G1 are disposed in the corresponding first corner regions Q1, and the second alignment marks G2 are disposed in the corresponding second corner regions Q2. During the cooperative alignment process, the first corner regions Q1 and the second corner regions Q2 are aligned with each other one by one, and the first alignment marks G1 and the second alignment marks G2 are aligned with each other one by one. In this way, the first alignment marks G1 are located in the four first corner regions Q1, and the connection lines between the first alignment marks G1 cover the entire mother board 100m. The second alignment marks G2 are located in the four second corner regions Q2, and the connection lines between the second alignment marks G2 cover the entire shielding mask 203. The first alignment marks G1 and the second alignment marks G2 can increase the alignment range, perform high-precision positioning in a wider area of the mother board 100m and the shielding mask 203, so as to reduce the alignment error caused by shielding or environmental interference and improve the stability and reliability of the alignment.

[0081] In some embodiments, the first pattern is at least one of a cross shape, a grid shape, and a rectangular shape, and the shape of the orthographic projection of the first opening corresponding to the first pattern on the bearing surface is at least one of a cross shape, a grid shape, and a rectangular shape. The shape of the first pattern and the orthographic projection of the first opening on the bearing surface may be the same or different. Exemplarily, the first pattern is a cross shape, and the shape of the orthographic projection of the first opening on the bearing surface may also be a cross shape. When specific positions on the cross shape of the first pattern are aligned with specific positions on the cross shape of the first opening, it indicates that the first alignment mark G1 and the second alignment mark G2 are cooperatively aligned. Another example is that the first pattern is a cross shape, and the shape of the orthographic projection of the first opening on the bearing surface may be a rectangular shape. When specific positions on the cross shape of the first pattern are aligned with specific positions on the rectangular shape of the first opening, it indicates that the first alignment mark G1 and the second alignment mark G2 are cooperatively aligned.

[0082] In some embodiments, the number of the plurality of first alignment marks G1 is less than the number of the plurality of second alignment marks G2. That is to say, the number of alignment marks on the mother board 100m is less than the number of alignment marks on the shielding mask 203. The plurality of first alignment marks G1 includes at least one fifth sub - alignment mark, and the plurality of second alignment marks G2 includes at least a plurality of sixth sub - alignment marks corresponding to the fifth sub - alignment mark.

[0083] The fifth sub - alignment mark has a second pattern, and the sixth sub - alignment mark has a second opening that cooperates with the second pattern. After the fifth sub - alignment mark and the sixth sub - alignment mark are cooperatively aligned, a part of the second pattern is exposed from the plurality of second openings. One fifth sub - alignment mark corresponds to a plurality of sixth sub - alignment marks, and one fifth sub - alignment mark is cooperatively aligned with at least two sixth sub - alignment marks. That is to say, one first alignment mark G1 is cooperatively aligned with at least two second alignment marks G2. One alignment mark on the mother board 100m is positioned by using a plurality of alignment marks on the shielding mask 203, which further improves the alignment accuracy between the mother board 100m and the shielding mask 203. In the evaporation process, the spraying range of the evaporation material is more accurate, and the position of the film pattern on the mother board 100m is more accurate, further improving the display effect of the display panel.

[0084] In some embodiments, after the fifth sub - alignment mark and the sixth sub - alignment mark are cooperatively aligned, the orthographic projection area of the second pattern on the bearing surface is larger than the total area of the shape formed by enclosing the outer edges of the plurality of second openings on the bearing surface. The fifth sub - alignment mark can cover one second opening, and using at least two second openings to position the fifth sub - alignment mark can improve the alignment accuracy.

[0085] In some examples, when forming sub-pixels of each color on the mother board 100m, it is necessary to evaporate and encapsulate a corresponding color light-emitting layer at the corresponding pixel opening and remove the sub-pixels of this color formed at the pixel openings of other colors (VEE yellow light), dry etching (DE), wet etching (WE), removing photoresist and other processes. Then, the test terminal 1021 of the blank part 102 is electrically connected to the panel part 101 to perform a cathode lap impedance test to confirm whether the second electrode of the light-emitting device is lapped with the isolation structure. In order to protect the test terminal 1021 from being damaged by DE and WE, a photoresist (PR) layer covers the test terminal 1021 of the mother board 100m. Before the lap impedance test, the photoresist layer is removed to expose the test terminal 1021 for testing.

[0086] If the lap impedance test passes, it indicates that the second electrode of the light-emitting device is lapped with the isolation structure. If the lap impedance test fails, it is necessary to re-form the photoresist layer to cover the test terminal 1021, and change the evaporation parameters (such as evaporation angle) in the evaporation device, etc., perform the evaporation process, then remove the photoresist layer covering the test terminal 1021, and re-perform the lap impedance test. Repeat the above steps until the test passes. In this way, forming and removing the photoresist layer makes the lap impedance test take a long time, the evaporation cycle is extended, the preparation cycle of the display panel is extended, and the production efficiency is reduced.

[0087] To solve the above problems, in some embodiments, continue to refer to Figure 7 and Figure 9 , after at least one second alignment mark G2 is aligned with at least one first alignment mark G1, the main body part 2031 separates a plurality of test terminals 2021 from a plurality of evaporation sources 201. The main body part 2031 is located between the test terminal 2021 and the evaporation source 201. The main body part 2031 can block the evaporation material in the evaporation source 201 from spraying onto the test terminal 2021. When performing processes such as VEE yellow light, dry etching (DE), wet etching (WE), and removing photoresist, the test terminal 1021 does not need to be covered with a photoresist layer and is directly protected by the shielding mask 203 to avoid damage by DE and WE. Before performing the cathode lap impedance test, there is no need to perform the step of removing the photoresist layer. After the evaporation process, the cathode lap impedance test can be directly performed. In this way, the evaporation effect confirmation time is short, the efficiency of changing evaporation process parameters is high, and the optimization conditions can be imported quickly, which can shorten the evaporation cycle and improve the production efficiency.

[0088] In some examples, after the lap impedance test, it is also necessary to ship the product to the OLED factory for the LOI test to confirm the light-emitting effect of sub-pixels of the same color. To protect the test device 1022 from being damaged by the DE and WE, a photoresist (PR) layer covers the test device 1022 on the mother board 100m. Before the LOI test, the photoresist layer needs to be removed to expose the test device 1022 for testing. If the LOI test passes, it indicates that the sub-pixels of the same color emit light well. If the LOI test fails, it is necessary to reform the photoresist layer to cover the test device 1022, change the evaporation parameters in the evaporation process, etc., and re-conduct the LOI test. Repeat the above steps until the test passes. The evaluation cycle for evaporating one color is short for 3 - 4 days and long for 6 - 8 days. If the test result fails, re-evaporation will delay more time and also affect the preparation cycle of the display panel.

[0089] To solve the above problems, in some embodiments, continue to refer to Figure 7 and Figure 9 , after at least one second alignment mark G2 is aligned with at least one first alignment mark G1, the main body 2031 separates the multiple test devices 2022 from the multiple evaporation sources 201. The main body 2031 is located between the test device 2022 and the evaporation source 201. The main body 2031 can block the evaporation material in the evaporation source 201 from spraying onto the test device 2022. When performing the LOI test, the test device 2022 does not need to be covered with a photoresist layer and is directly protected by the shielding mask 203. Before performing the LOI test, there is no need to perform the step of removing the photoresist layer on the test device 2022. After the evaporation process, the LOI test can be directly carried out. In this way, the time for confirming the evaporation effect is short, the efficiency of changing the evaporation process parameters is high, and the optimization conditions can be introduced quickly, which can shorten the evaporation cycle and improve production efficiency.

[0090] In some embodiments, continue to refer to Figure 9 , after at least one second alignment mark G2 is aligned with at least one first alignment mark G1, the orthographic projection of the main body 2031 on the bearing surface 2021 covers the orthographic projection of the multiple test terminals 1021 on the bearing surface 2021, and the orthographic projection of the main body 2031 on the bearing surface 2021 covers the orthographic projection of the multiple test devices 2022 on the bearing surface 2021. The main body 2031 completely covers the test terminals 1021 and the test devices 2022, and shields between the evaporation source 201 and the mother board 100m to prevent the evaporation source 201 from directly facing the mother board 100m, causing damage to the test terminals 1021 and the test devices 2022 during the evaporation process, thereby reducing the test efficiency.

[0091] In some embodiments, continue to refer to Figure 8The width of the main body portion 2031 located between the multiple evaporation openings 2032 is smaller than the width of the main body portion 2031 located beside the multiple evaporation openings 2032. The first alignment mark G1 is located on the main body portion 2031 beside the multiple evaporation openings 2032. The relatively wide width of the main body portion 2031 facilitates the formation of the first alignment mark G1 and prevents the first alignment mark G1 from entering the evaporation opening 2032 when its size is relatively large, which may affect the evaporation process.

[0092] An embodiment of the present application further provides a method for manufacturing a display panel, which adds a shielding mask in the evaporation device for manufacturing the display panel.

[0093] Figure 10 It is a flowchart of a method for manufacturing a display panel provided by an embodiment of the present application. The method provided by the embodiment of the present application will be schematically described below with reference to the accompanying drawings.

[0094] See Figure 10 The above method for manufacturing a display panel includes: S1 - S3.

[0095] S1. Move the mother board 100m of the display panel to the bearing surface 2021 of the stage 202 of the evaporation device 100 as described in any of the above embodiments. The structure of the mother board 100m can be referred to the above description and will not be elaborated here.

[0096] S2. Continue to refer to Figure 7 and Figure 9 Move the shielding mask 203 to align at least one second alignment mark G2 with at least one first alignment mark G1, so that the panel portion 101 is exposed from the corresponding evaporation opening 2032 and at least partially faces the multiple evaporation sources 201. The structure of the shielding mask 203 can be referred to the above description and will not be elaborated here.

[0097] S3. Use the evaporation materials ejected from the multiple evaporation sources 201 to evaporate the multiple panel portions 101 of the mother board 100m.

[0098] The embodiment of the present application uses the first alignment mark G1 of the mother board 100m and the second alignment mark G2 of the shielding mask 203 to align the mother board 100m with the shielding mask 203, so that the evaporation materials can be accurately ejected at the corresponding positions of the panel portion 101 to form the corresponding film layer patterns of the display panel, thereby improving the evaporation accuracy and further improving the display effect of the display panel.

[0099] In some embodiments, in the step of performing evaporation coating on the multiple panel portions 101 of the mother board 100m, the main body portion 2031 separates the multiple test terminals 1021 from the multiple evaporation sources 201, and the main body portion 2031 separates the multiple test devices 1022 from the multiple evaporation sources 201. In this way, the shielding mask plate 203 protects the test terminals 1021 and the test devices 1022.

[0100] After the step of performing evaporation coating on the multiple panel portions 101 of the mother board 100m, the method for manufacturing a display panel further includes: S4 (optionally), performing a lighting test on the corresponding panel portion 101 with the test terminal 1021.

[0101] The test terminal 1021 is electrically connected to the corresponding panel portion 101, and a lighting test is directly performed after the evaporation coating process.

[0102] S5 (optionally), performing a cathode latching impedance test on the corresponding panel portion 101 with the test device 1022.

[0103] The test device 1022 is disposed beside the corresponding panel portion 101, and includes a virtual pixel circuit, a virtual isolation structure, and a virtual first electrode. The virtual isolation structure encloses to form an isolation opening, and a part of the virtual first electrode exposes from the isolation opening and is electrically connected to the virtual pixel circuit. After the evaporation coating process, a cathode latching impedance test is directly performed.

[0104] In some implementation manners, it is also possible to first perform a cathode latching impedance test on the corresponding panel portion 101 with the test device 1022, and then perform a lighting test on the corresponding panel portion 101 with the test terminal 1021.

[0105] In some embodiments, the method for manufacturing a display panel further includes: S6, performing cutting on the blank portion 102 to separate the multiple panel portions 101 after evaporation coating from each other, so as to obtain multiple display panels 100. The display panel 100 includes the corresponding panel portion 101 after evaporation coating. The structure of the display panel 100 can be referred to the description above, and will not be elaborated here.

[0106] Wherein, in the process of separating the multiple panel portions 101 after evaporation coating from each other, the test terminal 1021 is separated from the corresponding panel portion 101 after evaporation coating, and the test device 1022 is separated from the corresponding panel portion 101 after evaporation coating.

[0107] The display panel provided by the embodiments of the present application is manufactured by using the method described in any of the above embodiments. The structure of the display panel can be referred to the description of the display panel above, and will not be elaborated here.

[0108] The above embodiments are only used to illustrate the embodiments of the present application, rather than limiting the embodiments of the present application. Those of ordinary skill in the relevant technical field can also make various changes and modifications without departing from the spirit and scope of the embodiments of the present application. Therefore, all equivalent technical solutions also belong to the scope of the embodiments of the present application. The patent protection scope of the embodiments of the present application shall be defined by the claims.

Claims

1. A vapor deposition device, characterized in that: A motherboard for evaporating a display panel, the motherboard comprising a blank portion and a plurality of panel portions, at least two adjacent panel portions being separated by the blank portion, the blank portion being provided with at least one first alignment mark, the evaporation device comprising: Multiple evaporation sources; A carrier, having a carrying surface facing the plurality of evaporation sources, the carrying surface being used to carry the motherboard; a shielding mask, located between the carrying surface and the plurality of evaporation sources, comprising a main body and a plurality of evaporation openings formed by the main body, wherein the main body is provided with at least one second alignment mark corresponding to the at least one first alignment mark; After the at least one second alignment mark is aligned with the at least one first alignment mark, the panel portion is exposed from the corresponding evaporation opening and is at least partially opposite to the plurality of evaporation sources.

2. The evaporation device according to claim 1, characterized in that: The at least one first alignment mark includes a plurality of first alignment marks, the blank portion includes a plurality of first corner areas, and the plurality of first alignment marks are respectively arranged in the plurality of first corner areas; The at least one second alignment mark includes a plurality of second alignment marks, the main body includes a plurality of second corner areas corresponding to the plurality of first corner areas, and the plurality of second alignment marks are respectively arranged in the plurality of second corner areas corresponding to the plurality of first alignment marks.

3. The evaporation device according to claim 2, characterized in that: After the plurality of second alignment marks are aligned with the plurality of first alignment marks, a first shape formed by the orthographic projections of the outer edges of the first alignment marks on the carrying surface has a first area, a second shape formed by the orthographic projections of the outer edges of the second alignment marks on the carrying surface has a second area, and the orthographic projection of the panel portion on the carrying surface has a third area, wherein: The first area is smaller than the third area, the second area is smaller than the third area, and the first area is smaller than the second area.

4. The evaporation device according to claim 2, characterized in that: The number of the multiple first alignment marks and the multiple second alignment marks are equal, the first alignment marks have a first pattern, the second alignment marks have a first opening that matches the first pattern of the corresponding first alignment mark, and after the at least one second alignment mark is aligned with the at least one first alignment mark, the first pattern is exposed from the corresponding first opening.

5. The evaporation device according to claim 4, characterized in that: An orthographic projection area of ​​the first opening on the carrying surface is smaller than an orthographic projection area of ​​the evaporation opening on the carrying surface.

6. The evaporation device according to claim 4, characterized in that: The plurality of first alignment marks at least include a first sub-alignment mark and a second sub-alignment mark, and the plurality of second alignment marks at least include a third sub-alignment mark corresponding to the first sub-alignment mark and a fourth sub-alignment mark corresponding to the second sub-alignment mark, wherein: A shape of the first pattern corresponding to the first sub-alignment mark is different from a shape of the first pattern corresponding to the second sub-alignment mark; A shape of an orthographic projection of the first opening corresponding to the third sub-alignment mark on the carrying surface is different from a shape of an orthographic projection of the first opening corresponding to the fourth sub-alignment mark on the carrying surface.

7. The evaporation device according to claim 4, characterized in that: The plurality of first alignment marks at least include a first sub-alignment mark and a second sub-alignment mark, and the plurality of second alignment marks at least include a third sub-alignment mark corresponding to the first sub-alignment mark and a fourth sub-alignment mark corresponding to the second sub-alignment mark, wherein: A width of the first pattern corresponding to the first sub-alignment mark is smaller than a width of the first pattern corresponding to the second sub-alignment mark; A width of an orthographic projection of the first opening corresponding to the third sub-alignment mark on the carrying surface is smaller than a width of an orthographic projection of the first opening corresponding to the fourth sub-alignment mark on the carrying surface.

8. The evaporation device according to claim 4, characterized in that: The number of the multiple first alignment marks, the multiple second alignment marks, the multiple first corner areas and the multiple second corner areas are all 4, the first alignment mark is set at the corresponding first corner area, and the second alignment mark is set at the corresponding second corner area.

9. The evaporation device according to claim 4, characterized in that: The first pattern is at least one of a cross, a tic-tac-toe shape, and a rectangle, and the shape of the orthographic projection of the first opening corresponding to the first pattern on the bearing surface is at least one of a cross, a tic-tac-toe shape, and a rectangle.

10. The evaporation device according to claim 2, characterized in that: The number of the plurality of first alignment marks is less than the number of the plurality of second alignment marks, the plurality of first alignment marks include at least one fifth sub-alignment mark, and the plurality of second alignment marks include at least a plurality of sixth sub-alignment marks corresponding to the fifth sub-alignment mark, wherein: The fifth sub-alignment mark has a second pattern, and the sixth sub-alignment mark has a second opening matched with the second pattern. After the fifth sub-alignment mark and the sixth sub-alignment mark are matched and aligned, parts of the second pattern are exposed from the plurality of second openings.

11. The evaporation device according to claim 10, characterized in that: After the fifth sub-alignment mark is aligned with the sixth sub-alignment mark, the orthographic projection area of ​​the second pattern on the carrying surface is larger than the total area of ​​the shape enclosed by the orthographic projections of the outer edges of the second openings on the carrying surface.

12. The evaporation device according to claim 1, characterized in that: The blank portion is provided with a plurality of test terminals, and the test terminals are electrically connected to the corresponding panel portion, wherein: After the at least one second alignment mark is aligned with the at least one first alignment mark, the main body separates the plurality of test terminals from the plurality of evaporation sources.

13. The evaporation device according to claim 12, characterized in that: The blank portion is provided with a plurality of test devices, the test devices are provided beside the corresponding panel portion, and include a virtual pixel circuit, a virtual isolation structure and a virtual first electrode, the virtual isolation structure encloses an isolation opening, a portion of the virtual first electrode is exposed from the isolation opening and is electrically connected to the virtual pixel circuit, wherein: After the at least one second alignment mark is aligned with the at least one first alignment mark, the main body separates the plurality of test devices from the plurality of evaporation sources.

14. The evaporation device according to claim 13, characterized in that: After the at least one second alignment mark is aligned with the at least one first alignment mark, the orthographic projection of the main body on the carrying surface covers the orthographic projection of the multiple test terminals on the carrying surface, and the orthographic projection of the main body on the carrying surface covers the orthographic projection of the multiple test devices on the carrying surface.

15. The evaporation device according to claim 1, characterized in that: The width of the main body portion located between the plurality of vapor deposition openings is smaller than the width of the main body portion located beside the plurality of vapor deposition openings.

16. A method for preparing a display panel, characterized in that: The method comprises: Moving a motherboard of a display panel onto the carrying surface of the stage of the evaporation device according to any one of claims 1 to 15, wherein the motherboard comprises a blank portion and a plurality of panel portions, at least two adjacent panel portions are separated by the blank portion, and the blank portion is provided with at least one first alignment mark; Moving the shielding mask to align the at least one second alignment mark with the at least one first alignment mark, so that the panel portion is exposed from the corresponding evaporation opening and is opposite to at least part of the plurality of evaporation sources; The plurality of panel portions of the motherboard are subjected to vapor deposition using the vapor deposition material ejected from the plurality of vapor deposition sources.

17. The method according to claim 16, characterized in that The blank portion is provided with a plurality of test terminals and a plurality of test devices, the test terminals are electrically connected to the corresponding panel portion, the test device is arranged beside the corresponding panel portion, and includes a virtual pixel circuit, a virtual isolation structure and a virtual first electrode, the virtual isolation structure is surrounded to form an isolation opening, a portion of the virtual first electrode is exposed from the isolation opening and is electrically connected to the virtual pixel circuit; In the step of performing evaporation deposition on the plurality of panel parts of the motherboard, the main body separates the plurality of test terminals from the plurality of evaporation sources, and the main body separates the plurality of test devices from the plurality of evaporation sources; After the step of performing evaporation deposition on the plurality of panel parts of the motherboard, the method further comprises: Performing a lighting test on the corresponding panel part with the test terminal; and, The cathode bonding impedance test is performed on the corresponding panel part using the test device.

18. The method according to claim 17, characterized in that The method further comprises: Cutting the blank portion to separate the plurality of panel portions after evaporation from each other to obtain a plurality of display panels, wherein the display panels include the corresponding panel portions after evaporation; In the process of separating the plurality of panel portions after vapor deposition from each other, the test terminals are separated from the corresponding panel portions after vapor deposition, and the test devices are separated from the corresponding panel portions after vapor deposition.

19. A display panel, characterized in that: Prepared by the method according to any one of claims 16 to 18.

20. The display panel according to claim 19, characterized in that: The display panel comprises: substrate; An isolation structure, located on one side of the substrate, the isolation structure encloses a plurality of isolation openings; A plurality of light-emitting devices, parts of which are located in the corresponding isolation openings, the light-emitting devices comprising a first electrode, a light-emitting functional layer and a second electrode which are sequentially arranged in a direction away from the substrate, and the second electrode overlaps the isolation structure.

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