Display panel evaporation alignment device and evaporation equipment

Abstract

The invention is suitable for the technical field of display panel evaporation alignment devices, and provides a display panel evaporation alignment device and evaporation device.The display panel evaporation alignment device comprises a substrate bearing mechanism, a mask bearing mechanism and a temperature control magnetic attraction platform, and the substrate bearing mechanism is arranged in a metal evaporation cavity; the mask bearing mechanism is movably arranged in the metal evaporation cavity; the temperature control magnetic attraction platform is movably arranged in the metal evaporation cavity, the temperature control magnetic attraction platform comprises a temperature control magnetic attraction assembly, a plurality of carrying table positioning pin assemblies and at least one anti-warping supporting pin assembly, the carrying table positioning pin assemblies are used for applying first pressing force to the substrate so as to press the aligned substrate and the mask plate, and the anti-warping supporting pin assemblies are used for supporting the substrate and the mask plate; the anti-warping supporting pin assembly is used for applying second pressing force to the edge area of the substrate. According to the display panel evaporation alignment device provided by the invention, substrate warping caused by pressing of the carrier positioning pin assembly can be counteracted, so that the evaporation shadow effect is remarkably improved, and the uniformity of an evaporation film layer is improved.

Description

Technical Field

[0001] This application belongs to the technical field of evaporation alignment devices for display panels. More specifically, it relates to an evaporation alignment device for a display panel and an evaporation equipment. Background Art

[0002] In the process of fabricating traditional display panels, light-emitting pixel patterning is usually achieved through a fine metal mask (FMM). Due to its mature process system, high-precision alignment ability, and rich mass production experience, the FMM technology has become the current mainstream evaporation process solution.

[0003] In the existing evaporation process of display panels, there is a problem of warping in the edge area of the substrate, which affects the performance of the display panel and the product yield. Summary of the Invention

[0004] The purpose of the embodiments of this application is to provide an evaporation alignment device for a display panel and an evaporation equipment, aiming to solve the technical problem that in the existing evaporation process of display panels, there is warping in the edge area of the substrate, which affects the performance of the display panel and the product yield.

[0005] To achieve the above purpose, according to one aspect of this application, an evaporation alignment device for a display panel is provided. The evaporation alignment device for a display panel is arranged in the metal evaporation chamber of the evaporation equipment and is used to align the substrate with the mask. The evaporation alignment device for a display panel includes: a temperature-controlled magnetic adsorption platform, which includes a temperature-controlled magnetic adsorption component, a plurality of stage positioning pin components, and at least one anti-warping support pin component. The temperature-controlled magnetic adsorption component is movably arranged in the metal evaporation chamber, and the stage positioning pin components and the anti-warping support pin components are both arranged on the temperature-controlled magnetic adsorption component. Among them, when the substrate is aligned with the mask, the position of the stage positioning pin component corresponds to the edge area of the substrate. The stage positioning pin component is used to apply a first pressing force to the edge area of the substrate to press the substrate and the mask together and keep a preset distance between the substrate and the temperature-controlled magnetic adsorption component. After the edge area of the substrate is subjected to the first pressing force, an edge prone to warping area is correspondingly formed. The position of the anti-warping support pin component corresponds to the edge prone to warping area and is used to apply a second pressing force to the edge prone to warping area to offset the warping of the substrate caused by the first pressing force.

[0006] Optionally, the first pressing force points to the mask, and the magnitude of the first pressing force is a, where 10N ≤ a ≤ 13N; and / or, the second pressing force points to the mask, and the magnitude of the second pressing force is b, where 0.8N ≤ b ≤ 5N; and / or, the magnitude of the preset distance is c, where 1mm ≤ c ≤ 1.5mm.

[0007] Optionally, the display panel evaporation alignment device further includes: a substrate carrying mechanism disposed in the metal evaporation chamber for carrying a substrate; a mask carrying mechanism movably disposed in the metal evaporation chamber and located below the substrate carrying mechanism for carrying a mask and aligning the mask with the substrate; a temperature-controlled magnetic attraction component located on a side of the substrate carrying mechanism facing away from the mask carrying mechanism. When the substrate and the mask are aligned, a plurality of stage positioning pin assemblies are arranged at intervals along the edge contour direction of the substrate.

[0008] Optionally, the substrate is a rectangular substrate, which has a first long side, a first short side, a second long side, and a second short side arranged in sequence. A plurality of stage positioning pin assemblies are arranged at intervals along the edge contour directions of the first long side, the first short side, the second long side, and the second short side.

[0009] Optionally, the number of stage positioning pin assemblies is d, where 10 ≤ d ≤ 30; and / or, e stage positioning pin assemblies are equally spaced along the edge contour directions of the first long side and the second long side respectively, where 3 ≤ e ≤ 10; and / or, f stage positioning pin assemblies are equally spaced along the edge contour directions of the first short side and the second short side respectively, where 2 ≤ f ≤ 5.

[0010] Optionally, the number of anti-warping support pin assemblies is multiple. When the substrate and the mask are aligned, the multiple anti-warping support pin assemblies are arranged at intervals along the edge contour direction of the aligned substrate.

[0011] Optionally, the multiple anti-warping support pin assemblies are arranged at intervals along the edge contour directions of the first short side and the second short side.

[0012] Optionally, the number of anti-warping support pin assemblies is g, where g ≥ 4; and / or, h stage positioning pin assemblies are equally spaced along the edge contour directions of the first short side and the second short side respectively, where h ≥ 2.

[0013] Optionally, the temperature-controlled magnetic attraction component includes a magnetic attraction plate component. When the substrate and the mask are aligned, the magnetic attraction plate component is used to apply a magnetic attraction force pointing to the substrate to the mask, so that the mask fits with the substrate.

[0014] Optionally, when the substrate and the mask are aligned, the temperature-controlled magnetic attraction platform has a pressing state and an avoidance state; when the temperature-controlled magnetic attraction platform is in the pressing state, the stage positioning pin assemblies and the anti-warping support pin assemblies are both in contact with the side of the substrate facing away from the mask, and the stage positioning pin assemblies apply a first pressing force to the edge area of the substrate, and the anti-warping support pin assemblies apply a second pressing force to the easily warping edge area of the substrate; when the temperature-controlled magnetic attraction platform is in the avoidance state, the stage positioning pin assemblies and the anti-warping support pin assemblies are both separated from the substrate and avoid the substrate.

[0015] Optionally, the temperature-controlled magnetic adsorption component further includes a cooling plate component, which is disposed on the magnetic adsorption plate component. When the substrate is aligned with the mask plate, the cooling plate component is located on the side of the magnetic adsorption plate component close to the substrate and is spaced apart from the substrate, and is used for temperature adjustment of the substrate and the mask plate; when the temperature-controlled magnetic adsorption platform is in a pressing state, the cooling plate component is spaced apart from the substrate by a preset distance.

[0016] Optionally, the anti-warpage support pin component includes a connection base, a pressing head component and an elastic reset mechanism. The connection base is fixedly installed on the temperature-controlled magnetic adsorption platform. The pressing head component is slidably disposed on the connection base. The elastic reset mechanism is disposed on the connection base. Two ends of the elastic reset mechanism are respectively abutted against the connection base and the pressing head component. The elastic reset mechanism applies a second pressing force to the substrate through the pressing head component.

[0017] Optionally, a plurality of screw holes distributed along a first direction are formed on the temperature-controlled magnetic adsorption platform, and a plurality of fixing holes are formed on the connection base. The plurality of fixing holes can correspond to the plurality of screw holes to achieve rough positioning of the connection base in the first direction, where the first direction is parallel to the lower surface of the temperature-controlled magnetic adsorption platform.

[0018] Optionally, the temperature-controlled magnetic adsorption platform has a groove extending along a second direction, and a positioning protrusion is provided on the connection base. The positioning protrusion can cooperate with the groove to achieve positioning of the connection base in the second direction, where the second direction is parallel to the lower surface of the temperature-controlled magnetic adsorption platform and is perpendicular to the first direction.

[0019] Optionally, the screw holes extend along a third direction, and the anti-warpage support pin component further includes fixing screws. The fixing screws pass through the fixing holes and are screwed with the screw holes to achieve fixation of the connection base in the third direction, where the third direction is perpendicular to the lower surface of the temperature-controlled magnetic adsorption platform.

[0020] Optionally, the pressing head component includes a pressing head adjustment component and a pressing head body. The pressing head body is slidably disposed on the connection base through the pressing head adjustment component. The pressing head adjustment component is used to adjust the relative position between the pressing head body and the elastic reset mechanism when no external force acts; and / or, the anti-warpage support pin component further includes an elastic force adjustment component. The elastic force adjustment component is disposed on the connection base. The elastic reset mechanism includes a compression spring. A first end of the compression spring abuts against the pressing head component, and a second end of the compression spring abuts against the connection base through the elastic force adjustment component. The elastic force adjustment component is used to adjust the compression amount of the compression spring to change the magnitude of the second pressing force applied by the elastic reset mechanism to the substrate through the pressing head component.

[0021] According to another aspect of the present application, a vapor deposition device is provided. The vapor deposition device includes a device main body and a display panel vapor deposition alignment device. A metal vapor deposition chamber is provided in the device main body, and the display panel vapor deposition alignment device is disposed in the metal vapor deposition chamber. The display panel vapor deposition alignment device is the above-mentioned display panel vapor deposition alignment device.

[0022] The beneficial effects of the evaporation alignment device for display panels provided in this application are as follows: Compared with the prior art, the evaporation alignment device for display panels provided in this application enables the temperature-controlled magnetic adsorption platform to press-fit and align the substrate and the mask plate through multiple stage positioning pin assemblies, and maintain a heat dissipation interval with a preset distance between the temperature-controlled magnetic adsorption assembly and the substrate. At the same time, by setting up the anti-warpage support pin assembly, the temperature-controlled magnetic adsorption platform can offset the warping of the substrate caused by the press-fitting of the stage positioning pin assembly through the anti-warpage support pin assembly, thereby significantly improving the evaporation shadow effect and enhancing the uniformity of the evaporated film layer. Moreover, through the non-contact design between the substrate and the temperature-controlled magnetic adsorption assembly, the risks of chip adhesion and electrostatic damage caused by traditional mechanical press-fitting can be avoided, enabling the substrate to maximize the utilization of the effective area while obtaining stable support, taking into account both production yield and economic benefits. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] In order to more clearly illustrate the technical solutions in the embodiments of this application, the following will briefly introduce the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings in the following description are only some embodiments of this application. For those of ordinary skill in the art, other drawings can be obtained based on these drawings without creative efforts.

[0024] Figure 1 It is a schematic structural diagram of a substrate and a mask plate pressed and aligned by a peripheral pressing mechanism of an existing evaporation device; Figure 2 is Figure 1 a partial enlarged view of area A in Figure 3 It is a schematic structural diagram of the temperature-controlled magnetic adsorption platform for the substrate and the mask plate after press-fitting and alignment provided in the embodiment of this application; Figure 4 It is a schematic distribution diagram of the stage positioning pin assembly and the anti-warpage support pin assembly on the substrate provided in the embodiment of this application; Figure 5 It is a schematic structural diagram of the anti-warpage support pin assembly provided in the embodiment of this application; Figure 6 It is a schematic structural diagram of the anti-warpage support pin assembly from another perspective provided in the embodiment of this application; Figure 7 It is a schematic structural diagram of the pressing head body provided in the embodiment of this application; The label details involved in the above-mentioned drawings are as follows: 11”, peripheral pressing mechanism; 132”, cooling plate; 20”, substrate; 30”, mask plate; 10. Temperature-controlled magnetic platform; 11. Stage positioning pin assembly; 12. Anti-warpage support pin assembly; 121. Connection base; 1211. Fixing hole; 1212. Positioning protrusion; 1213. Spring positioning pin; 122. Press head assembly; 1221. Press head adjustment assembly; 1222. Press head body; 123. Elastic reset mechanism; 124. Elastic force adjustment assembly; 13. Temperature-controlled magnetic component; 131. Magnetic plate assembly; 132. Cooling plate assembly; 20. Substrate; 21. Edge warping-prone area; 30. Mask; 40. Substrate carrying mechanism; 50. Mask carrying mechanism. Specific implementation manner

[0025] In order to make the technical problems, technical solutions and beneficial effects to be solved by the present application clearer and more understandable, the present application will be further described in detail below with reference to the drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present application and are not used to limit the present application.

[0026] It should be noted that when an element is referred to as being "fixed to" or "disposed on" another element, it can be directly on the other element or indirectly on the other element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or indirectly connected to the other element. Without conflict, the embodiments in the present application and the features in the embodiments can be combined with each other. The present application will be described in detail below with reference to the drawings and in combination with the embodiments.

[0027] It should be understood that the orientation or positional relationship indicated by the terms "length", "width", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc. is the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, and is only for the convenience of describing the present application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation to the present application.

[0028] In addition, the terms "first" and "second" are only used for descriptive purposes and cannot be understood as indicating or implying relative importance or implicitly indicating the quantity of the indicated technical features. Thus, the features defined with "first" and "second" may explicitly or implicitly include one or more of such features. In the description of the present application, "a plurality" means two or more unless otherwise specifically defined.

[0029] As described in the background technology, in the traditional display panel manufacturing process, the light-emitting pixel patterning is usually achieved through a fine metal mask (FMM). FMM technology has become the current mainstream evaporation process solution due to its mature process system, high-precision alignment capability and rich mass production experience.

[0030] In the display panel evaporation process, the metal chamber of the evaporation equipment usually uses a peripheral pressing mechanism 11" to press the aligned substrate 20" and the mask 30", and balances heat conduction and mechanical stress by controlling the distance between the cooling plate 132" and the substrate 20". Figure 1 and Figure 2 As shown, the existing evaporation equipment presses the edge area of ​​the substrate 20" through the peripheral pressing mechanism 11", so that after the substrate 20" and the mask 30" are pressed, there is a certain distance between the substrate 20" and the cooling plate 132". At this time, the edge warping area of ​​the substrate 20" will warp. When large-size panels are produced or high-utilization substrates are cut, the edge warping will aggravate the shadow effect during the evaporation process, causing the edge of the metal film layer to extend, thereby causing the display panel packaging to fail, affecting the display panel performance and product yield.

[0031] In the existing display panel evaporation process, in order to solve the problem of warping in the edge area of ​​​​the substrate 20", two technical solutions are mainly used: one is to reduce the gap between the substrate 20" and the cooling plate 132", but this solution has significant defects: after long-term evaporation operations, the cooling plate 132" is prone to sticking to the substrate 20", resulting in a decrease in yield; at the same time, the large-area contact between the cooling plate 132" and the substrate 20" will cause electrostatic damage defects, and the parallelism matching requirements between the mechanism and the mask 30" are strict, which greatly increases the risk of pressing and breaking during production. The second is to limit the arrangement position of the effective area of ​​the product to avoid the warped area at the edge of the substrate 20", but this method will significantly reduce the economic cutting utilization rate of the substrate 20", and cannot meet the current large-size display panel production needs for maximizing the utilization rate of the substrate 20".

[0032] See also Figures 3 to 7As shown in the figure, to solve the above problems, according to one aspect of the present application, an embodiment of the present application provides a display panel evaporation alignment device. The display panel evaporation alignment device is disposed in the metal evaporation chamber of the evaporation equipment and is used for aligning the substrate 20 and the mask 30. The display panel evaporation alignment device includes: a temperature-controlled magnetic adsorption platform 10, the temperature-controlled magnetic adsorption platform 10 includes a temperature-controlled magnetic adsorption component 13, a plurality of stage positioning pin components 11 and at least one anti-warpage support pin component 12. The temperature-controlled magnetic adsorption component 13 is movably disposed in the metal evaporation chamber, and the stage positioning pin components 11 and the anti-warpage support pin component 12 are both disposed on the temperature-controlled magnetic adsorption component 13; wherein, when the substrate 20 and the mask 30 are aligned, the position of the stage positioning pin component 11 corresponds to the edge area of the substrate 20, and the stage positioning pin component 11 is used to apply a first pressing force to the edge area of the substrate 20 to press the substrate 20 and the mask 30 together and keep the substrate 20 at a preset distance from the temperature-controlled magnetic adsorption component 13; after the edge area of the substrate 20 is subjected to the first pressing force, an edge warping-prone area 21 is correspondingly formed, and the position of the anti-warpage support pin component 12 corresponds to the edge warping-prone area 21, and is used to apply a second pressing force to the edge warping-prone area 21 to offset the warping of the substrate 20 caused by the first pressing force. The display panel evaporation alignment device provided in this embodiment can press the aligned substrate 20 and the mask 30 together through a plurality of stage positioning pin components 11, and maintain a heat dissipation interval with a preset distance between the temperature-controlled magnetic adsorption component and the substrate 20. At the same time, by setting the anti-warpage support pin component 12, the temperature-controlled magnetic adsorption platform 10 can offset the warping of the substrate 20 caused by the pressing of the stage positioning pin component 11 through the anti-warpage support pin component 12, thereby significantly improving the evaporation shadow effect and enhancing the uniformity of the evaporated film layer. Moreover, through the non-contact design between the substrate 20 and the temperature-controlled magnetic adsorption component, the risks of adhesive sheet and electrostatic damage caused by traditional mechanical pressing can be avoided, so that while the substrate 20 obtains stable support, the maximum utilization of the effective area of the substrate 20 is realized, taking into account both the production yield and economic benefits.

[0033] It should be noted that the edge warping-prone area 21 in this embodiment refers to a specific deformation area generated at the edge of the substrate 20 due to uneven distribution of the pressing force when the substrate 20 and the mask 30 are pressed together only by applying the first pressing force through the stage positioning pin component 11.

[0034] It can be understood that in this solution, the edge area of the substrate 20 specifically refers to the inner transition area between the outside of the effective display area of the substrate 20 and the physical edge of the substrate, that is, the edge area of the substrate 20 has the outermost circuit trace of the effective display area of the substrate 20 as the inner boundary and the physical cutting edge of the substrate 20 as the outer boundary.

[0035] In a specific embodiment, the first pressing force in this embodiment is directed towards the mask 30, and the magnitude of the first pressing force is a, where 10N ≤ a ≤ 13N. It should be noted that the first pressing force in this embodiment refers to the mechanical pressure applied by the stage positioning pin assembly 11 to the substrate 20, perpendicular to the plane of the substrate 20 and directed towards the mask 30.

[0036] In some embodiments, controlling the magnitude of the first pressing force within the range of 10N to 13N can not only ensure a stable pressing contact between the substrate 20 and the mask 30, avoiding the generation of gaps during the evaporation process that may cause evaporation shadows, but also prevent excessive deformation or breakage of the substrate 20 due to excessive pressure.

[0037] In a specific embodiment, the second pressing force in this embodiment is directed towards the mask 30, and the magnitude of the second pressing force is b, where 0.8N ≤ b ≤ 5N. It should be noted that the second pressing force in this embodiment refers to the compensatory mechanical pressure applied by the anti-warpage support pin assembly 12 to the edge region of the substrate 20, perpendicular to the plane of the substrate 20 and directed towards the mask 30.

[0038] In some embodiments, controlling the magnitude of the second pressing force within the range of 0.8N to 5N can precisely offset the warping deformation of the edge of the substrate 20 caused by the first pressing force, ensuring good contact between the edge region of the substrate 20 and the mask 30, and at the same time avoiding reverse deformation of the substrate 20 due to excessive compensation pressure.

[0039] See Figure 3 As shown, in a specific embodiment, the magnitude of the preset distance in this embodiment is c, where 1mm ≤ c ≤ 1.5mm. The preset distance in this embodiment refers to the constant spacing between the upper surface of the substrate 20 and the lower surface of the temperature-controlled magnetic adsorption platform 10.

[0040] In some embodiments, controlling the magnitude of the preset distance within the range of 1mm to 1.5mm can ensure that the substrate 20 obtains sufficient heat conduction and cooling effect, maintain a non-contact state between the substrate 20 and the temperature-controlled magnetic adsorption platform 10 to avoid damage to the surface of the substrate 20, and at the same time provide an operating space for the compensatory movement of the anti-warpage support pin assembly 12.

[0041] See Figure 4As shown, in a specific embodiment, the display panel evaporation alignment device further includes: a substrate carrying mechanism 40, which is arranged in the metal evaporation chamber and used to carry the substrate 20; a mask carrying mechanism 50, which is movably arranged in the metal evaporation chamber and located below the substrate carrying mechanism 40, and used to carry the mask 30 and align the mask 30 with the substrate 20; the temperature-controlled magnetic suction component 13 is located on the side of the substrate carrying mechanism 40 away from the mask carrying mechanism 50. When the substrate 20 and the mask 30 are aligned, the multiple stage positioning pin components 11 in this embodiment are arranged at intervals along the edge contour direction of the substrate 20. The multiple stage positioning pin components 11 are arranged at intervals along the edge contour direction of the substrate 20, so that the first pressing force forms a force ring at the edge of the substrate 20, ensuring the overall pressing stability between the substrate 20 and the mask 30, while avoiding local stress concentration.

[0042] It should be noted that the substrate carrying mechanism 40 in this embodiment refers to a special support structure arranged in the metal evaporation chamber, which is used to carry the substrate 20 during the evaporation process. It specifically includes but is not limited to a vacuum adsorption platform, a mechanical clamping device or an electrostatic chuck, etc., which, through non-contact support or partial contact design, physically avoids the evaporation area of ​​the substrate 20 while ensuring the position stability of the substrate 20 to avoid blocking the deposition path of the evaporation material; the mask carrying mechanism refers to a precision positioning device movably arranged in the metal evaporation chamber, which is used to carry the mask 30 and realize its graphic alignment with the substrate 20. It specifically includes a high-precision linear drive module, a fine-tuning alignment mechanism and a mask fixing assembly, which adjusts the position of the mask 30 through closed-loop control to ensure that its graphic opening area is accurately matched with the substrate 20. Among them, the mask carrying mechanism 50 avoids the evaporation beam path during the evaporation process to avoid mechanism interference.

[0043] See also Figure 4 As shown, in some embodiments, the substrate 20 in this embodiment is a rectangular substrate, and the rectangular substrate has a first long side, a first short side, a second long side and a second short side arranged in sequence, and a plurality of stage positioning pin assemblies 11 are arranged at intervals along the edge contour direction of the first long side, the first short side, the second long side and the second short side; the plurality of stage positioning pin assemblies 11 are arranged at intervals along the edge contour direction of the aligned rectangular substrate, so that the first pressing force forms a force ring at the edge of the substrate 20, thereby suppressing the bending deformation caused by the large span of the long side area and avoiding the local warping caused by insufficient support of the short side area. Of course, in other embodiments, the substrate 20 in this embodiment can also be other shapes.

[0044] In some embodiments, the substrate 20 in this embodiment is made of glass. Of course, in other embodiments, the substrate 20 in this embodiment may also be made of other materials.

[0045] In some embodiments, the number of the stage positioning pin assemblies 11 in this embodiment is d, where 10 ≤ d ≤ 30. Setting the number of the stage positioning pin assemblies 11 to be from 10 to 30 can ensure the stable positioning of the substrate 20, reduce the influence of edge warping on the evaporation coating accuracy, and improve the alignment yield.

[0046] In some embodiments, e stage positioning pin assemblies 11 are arranged at equal intervals in the edge contour directions of the first long side and the second long side in this embodiment, where 3 ≤ e ≤ 10. Setting the number of the stage positioning pin assemblies 11 arranged at equal intervals in the edge contour directions of the first long side and the second long side to be from 3 to 10 can evenly distribute the positioning binding force, effectively inhibit the warping deformation of the substrate edge, and at the same time avoid the stress concentration problem caused by over-constraint, improving the evaporation coating alignment accuracy and yield.

[0047] In some embodiments, f stage positioning pin assemblies 11 are arranged at equal intervals in the edge contour directions of the first short side and the second short side in this embodiment, where 2 ≤ f ≤ 5. Setting the number of the stage positioning pin assemblies 11 arranged at equal intervals in the edge contour directions of the first short side and the second short side to be from 2 to 5 can ensure the substrate positioning stability. While inhibiting the edge warping, it can avoid the structural complexity and cost increase caused by too many positioning points.

[0048] See Figure 4 As shown, in some specific embodiments, the number of the stage positioning pin assemblies 11 in this embodiment is 20. 8 stage positioning pin assemblies 11 are arranged at equal intervals in the edge contour directions of the first long side and the second long side respectively, and 2 stage positioning pin assemblies 11 are arranged at equal intervals in the edge contour directions of the first short side and the second short side respectively. By arranging 8 equally spaced stage positioning pin assemblies 11 on each of the two long sides, the long sides of the substrate 20 can be fully supported. By arranging 2 positioning pin assemblies on each of the two short sides, while meeting the positioning requirements of the short sides, it can avoid over-constraining the short sides of the rectangular substrate.

[0049] See Figure 4 As shown, in a specific embodiment, the number of the anti-warping support pin assemblies 12 in this embodiment is multiple. When the substrate is aligned with the mask template, the multiple anti-warping support pin assemblies 12 are arranged at intervals along the edge contour direction of the substrate 20. By arranging the multiple anti-warping support pin assemblies 12 at intervals along the edge contour direction of the aligned substrate 20, each anti-warping support pin assembly 12 can specifically offset the local deformation in the edge area of the substrate 20. While effectively eliminating the edge warping phenomenon caused by traditional peripheral pressing, it maintains the overall flatness of the substrate 20, thereby significantly improving the deposition uniformity of the evaporation coating material in the edge area of the substrate 20 and solving the evaporation coating shadow problem caused by edge warping in the prior art.

[0050] See Figure 4 As shown, in some embodiments, a plurality of anti-warpage support pin assemblies 12 in this embodiment are arranged at intervals along the edge profiles of the first short side and the second short side; by arranging a plurality of anti-warpage support pin assemblies 12 at intervals along the edge profiles of the first short side and the second short side, local warpage deformation caused by the pressing of the stage positioning pin assembly 11 on the short side of the substrate 20 can be effectively offset, and the warpage amount in the short side region of the rectangular substrate can be significantly reduced.

[0051] In some embodiments, the number of the anti-warpage support pin assemblies 12 in this embodiment is g, where g≥4; setting the number of the anti-warpage support pin assemblies 12 to be greater than or equal to 4 can enable the substrate to be evenly supported at multiple points during the evaporation process, ensure precise alignment between the mask plate and the substrate, and improve the evaporation yield and product performance of the display panel.

[0052] In some embodiments, h stage positioning pin assemblies are arranged at equal intervals along the edge profiles of the first short side and the second short side in this embodiment, where h≥2. Setting the number of the stage positioning pin assemblies arranged at equal intervals along the edge profiles of the first short side and the second short side to be greater than or equal to 2 can form symmetric constraints on the short sides of the substrate, cooperate with the long side positioning to jointly suppress the overall warpage deformation, and ensure the stable alignment accuracy between the substrate and the mask plate during the evaporation process.

[0053] See Figure 4 As shown, in some specific embodiments, the number of the anti-warpage support pin assemblies 12 in this embodiment is 4, and 2 anti-warpage support pin assemblies 12 are arranged at equal intervals along the edge profiles of the first short side and the second short side of the rectangular substrate respectively; by arranging 2 equally spaced anti-warpage support pin assemblies 12 on two opposite short sides of the rectangular substrate respectively, symmetric compensation force application points can be formed on the rectangular substrate, so as to effectively cover the main deformation positions in the short side region of the rectangular substrate. Each anti-warpage support pin assembly 12 applies an accurate compensation force according to the local deformation characteristics of its corresponding region, enabling the short side region of the rectangular substrate to obtain sufficient deformation compensation, significantly reducing the edge warpage amount of the rectangular substrate, and at the same time avoiding stress superposition caused by too dense support points.

[0054] In a specific embodiment, the anti-warpage support pin assembly 12 in this embodiment is located between two adjacent stage positioning pin assemblies 11. It should be noted that the anti-warpage support pin assembly 12 being located between two adjacent stage positioning pin assemblies 11 means that the anti-warpage support pin assembly 12 and the stage positioning pin assembly 11 are arranged alternately in the edge region of the substrate 20, and the setting position of the anti-warpage support pin assembly 12 is in the perpendicular direction of the line connecting the two stage positioning pin assemblies 11.

[0055] In some embodiments, the anti-warpage support pin assembly 12 is arranged between two adjacent stage positioning pin assemblies 11, which enables the support pin assembly to precisely act on the maximum warpage area generated after the stage positioning pin assembly 11 applies force, and at the same time forms a triangular stable support structure to ensure the balanced distribution of the deformation compensation force in each area of the edge of the substrate 20.

[0056] See Figure 3 As shown, in a specific embodiment, the temperature-controlled magnetic attraction assembly in this embodiment includes a magnetic attraction plate assembly 131. When the substrate 20 is aligned with the mask plate 30, the magnetic attraction plate assembly 131 is used to apply a magnetic attraction force pointing to the substrate 20 to the mask plate 30, so that the mask plate 30 fits with the substrate 20. It should be noted that the magnetic attraction plate assembly 131 in this embodiment refers to an electromagnetic adsorption device integrated in the temperature-controlled magnetic attraction assembly. After the substrate 20 and the mask plate 30 are aligned, the magnetic attraction plate assembly 131 generates a gradient magnetic field perpendicular to the plane of the mask plate 30 and pointing in the direction of the substrate 20, so that the mask plate 30 is subjected to a uniformly distributed magnetic attraction force and actively fits with the substrate 20. Among them, the mask plate 30 in this embodiment is a metal mask plate with magnetic response.

[0057] In a specific embodiment, when the substrate 20 is aligned with the mask plate 30, the temperature-controlled magnetic attraction platform 10 has a pressing state and an avoidance state; when the temperature-controlled magnetic attraction platform 10 is in the pressing state, both the stage positioning pin assembly 11 and the anti-warpage support pin assembly 12 are in contact with the side of the substrate 20 facing away from the mask plate 30, and the stage positioning pin assembly 11 applies a first pressing force to the edge area of the substrate 20, and the anti-warpage support pin assembly 12 applies a second pressing force to the easily warped area of the edge of the substrate 20; when the temperature-controlled magnetic attraction platform 10 is in the avoidance state, both the stage positioning pin assembly 11 and the anti-warpage support pin assembly 12 are separated from the substrate 20 and avoid the substrate. It should be noted that the pressing state and the avoidance state of the temperature-controlled magnetic attraction platform 10 in this embodiment refer to two working modes of the temperature-controlled magnetic attraction platform 10. In the pressing state, the stage positioning pin assembly 11 and the anti-warpage support pin assembly 12 on the temperature-controlled magnetic attraction platform 10 are respectively in contact with the upper surface of the substrate 20. Among them, the stage positioning pin assembly 11 applies a first pressing force perpendicular to the plane of the substrate 20 and pointing to the mask plate 30 to the edge area of the substrate 20, and the anti-warpage support pin assembly 12 applies a second pressing force in the same direction to the easily warped area 21 of the edge of the substrate 20; in the avoidance state, the stage positioning pin assembly 11 and the anti-warpage support pin assembly 12 maintain a separation distance from the substrate 20 to achieve process avoidance.

[0058] In some embodiments, the switching between the pressing state and the avoiding state of the temperature-controlled magnetic suction platform 10 in this embodiment is achieved by lifting and lowering the temperature-controlled magnetic suction platform 10, wherein the first pressing force is used to maintain the precise alignment of the substrate 20 and the mask plate 30, and the second pressing force is dedicated to compensating for the edge deformation of the substrate 20. Through the synergistic effect of the first pressing force and the second pressing force, it can be ensured that the substrate 20 has a higher flatness during the evaporation process.

[0059] See also Figure 3 As shown, in some embodiments, the temperature-controlled magnetic suction component in this embodiment also includes a cooling plate component 132, and the cooling plate component 132 is arranged on the magnetic suction plate component 131. When the substrate 20 and the mask 30 are aligned, the cooling plate component 132 is located on the side of the magnetic suction plate component 131 close to the substrate 20, and is spaced apart from the substrate 20, for temperature regulation of the substrate 20 and the mask 30; when the temperature-controlled magnetic suction platform 10 is in a pressed state, the cooling plate component 132 is spaced apart from the substrate 20 by a preset distance. It should be noted that the cooling plate component 132 in this embodiment refers to an active temperature control system integrated in the temperature-controlled magnetic suction component. In the pressed state, the cooling plate component 132 and the substrate 20 maintain a preset spacing of 0.5~1.5mm to form a non-contact heat conduction area.

[0060] See also Figures 5 to 7 As shown in a specific embodiment, the anti-warping support pin assembly 12 in this embodiment includes a connecting base 121, a pressing head assembly 122 and an elastic reset mechanism 123. The connecting base 121 is fixedly installed on the temperature-controlled magnetic suction platform 10, the pressing head assembly 122 is slidably arranged on the connecting base 121, and the elastic reset mechanism 123 is arranged on the connecting base 121. The two ends of the elastic reset mechanism 123 are respectively abutted against the connecting base 121 and the pressing head assembly 122. The elastic reset mechanism 123 is pressed by The head assembly 122 applies a second pressing force to the substrate 20; by slidably arranging the pressure head assembly 122 on the connecting base 121, and making the two ends of the elastic reset mechanism 123 respectively abut against the connecting base 121 and the pressure head assembly 122, the elastic reset mechanism 123 can apply a second pressing force to the substrate 20 through the pressure head assembly 122, and the second pressing force can offset the warping deformation of the edge of the substrate 20, thereby significantly improving the overall flatness of the substrate 20 and the uniformity of the film layer in the edge area during the evaporation process.

[0061] It should be noted that the pressing head assembly 122 in this embodiment forms a sliding fit with the connecting base 121 through a linear guide rail.

[0062] See also Figures 5 to 7As shown, in some embodiments, a plurality of screw holes distributed along a first direction are formed on the temperature-controlled magnetic adsorption platform 10 in this embodiment. A plurality of fixing holes 1211 are formed on the connecting base 121. The plurality of fixing holes 1211 can correspond to the plurality of screw holes to achieve rough positioning of the connecting base 121 in the first direction, where the first direction is parallel to the lower surface of the temperature-controlled magnetic adsorption platform 10; through the alignment and cooperation of the plurality of screw holes and the plurality of fixing holes 1211, the connecting base 121 can be quickly and accurately preliminarily positioned in the first direction. It should be noted that the temperature-controlled magnetic adsorption platform 10 in this embodiment is the temperature-controlled magnetic adsorption platform 10 of an existing evaporation coating device, and the plurality of screw holes thereon are the original positioning hole positions of the device. The plurality of fixing holes 1211 provided on the connecting base 121 are adapted to the original positioning hole positions. By reusing the hole position resources of the existing device, the influence of additional machining of hole positions on the structural integrity of the device can be avoided, and at the same time, the refitting construction period is significantly shortened.

[0063] In some embodiments, a groove extending along a second direction is formed on the temperature-controlled magnetic adsorption platform 10 in this embodiment. A positioning protrusion 1212 is provided on the connecting base 121. The positioning protrusion 1212 can cooperate with the groove to achieve positioning of the connecting base 121 in the second direction, where the second direction is parallel to the lower surface of the temperature-controlled magnetic adsorption platform 10 and perpendicular to the first direction; through the cooperation of the groove and the positioning protrusion 1212, the connecting base 121 can be quickly and accurately positioned in the second direction. It should be noted that the temperature-controlled magnetic adsorption platform 10 in this embodiment is the temperature-controlled magnetic adsorption platform 10 of an existing evaporation coating device, and the groove thereon is the original positioning groove of the device. The positioning protrusion 1212 provided on the connecting base 121 is adapted to the original positioning groove. By reusing the groove resources of the existing device, the influence of additional machining of the groove on the structural integrity of the device can be avoided, and at the same time, the refitting construction period is significantly shortened.

[0064] In some embodiments, the positioning protrusion 1212 in this embodiment has a side positioning surface, and the positioning protrusion 1212 in this embodiment is limited by cooperating with the groove through the side positioning surface.

[0065] In some embodiments, the screw holes in this embodiment extend along a third direction. The anti-warpage support pin assembly 12 further includes fixing screws. The fixing screws pass through the fixing holes 1211 and are screwed with the screw holes to achieve fixation of the connecting base 121 in the third direction, where the third direction is perpendicular to the lower surface of the temperature-controlled magnetic adsorption platform 10; it should be noted that the fixing screws in this embodiment are standard fasteners. By passing the fixing screws through the fixing holes 1211 and screwing them with the screw holes, accurate positioning and fixation of the connecting base 121 in the original coordinate system of the device can be achieved.

[0066] In some embodiments, the first direction and the second direction in this embodiment are horizontal directions, and the third direction is a vertical direction.

[0067] In some embodiments, the indenter assembly 122 in this embodiment includes an indenter adjustment assembly 1221 and an indenter body 1222. The indenter body 1222 is slidably disposed on the connection base 121 through the indenter adjustment assembly 1221. The indenter adjustment assembly 1221 is used to adjust the relative position between the indenter body 1222 and the elastic reset mechanism 123 when no external force is applied. Through the indenter adjustment assembly 1221 in this embodiment, the initial position of the indenter body 1222 relative to the connection base 121 can be accurately controlled, so that the anti-warpage support pin assembly 12 can adapt to the deformation compensation requirements of substrates 20 with different thicknesses.

[0068] In some embodiments, the specific structure of the indenter adjustment assembly 1221 in this embodiment is a conventional structure in the prior art and will not be elaborated here.

[0069] In some embodiments, the material of the indenter body 1222 in this embodiment is polyether ether ketone. Of course, in other embodiments, the indenter body 1222 in this embodiment can also be made of other materials.

[0070] In some embodiments, the anti-warpage support pin assembly 12 in this embodiment further includes an elastic force adjustment assembly 124. The elastic force adjustment assembly 124 is disposed on the connection base 121. The elastic reset mechanism 123 includes a compression spring. The first end of the compression spring abuts against the indenter assembly 122, and the second end of the compression spring abuts against the connection base 121 through the elastic force adjustment assembly 124. The elastic force adjustment assembly 124 is used to adjust the compression amount of the compression spring to change the magnitude of the second pressing force applied by the elastic reset mechanism 123 to the substrate 20 through the indenter assembly 122. It should be noted that the compression amount of the compression spring in this embodiment refers to the initial compression amount of the compression spring. Adjusting the initial compression amount of the compression spring can change the magnitude of the second pressing force, so that the anti-warpage support pin assembly 12 can compensate for the edge warpage generated under different process conditions.

[0071] In some embodiments, the elastic force adjustment assembly 124 in this embodiment is an elastic force adjustment knob, and its specific structure is a conventional structure in the prior art and will not be elaborated here.

[0072] In some embodiments, a spring positioning pin 1213 is fixedly disposed on the connection base 121 in this embodiment. The compression spring in this embodiment is positioned on the connection base 121 through cooperation with the spring positioning pin 1213. It should be noted that the compression spring in this embodiment can be sleeved outside the spring positioning pin 1213 or can be inserted into the spring positioning pin 1213. The spring positioning pin 1213 is used to limit the radial movement of the compression spring and guide the expansion and contraction of the compression spring.

[0073] It should be noted that after the substrate 20 and the mask 30 are aligned in this embodiment, the temperature-controlled magnetic chuck platform 10, the substrate carrier mechanism 40, and the mask carrier mechanism 50 are arranged in sequence from top to bottom. Among them, both the substrate carrier mechanism 40 and the mask carrier mechanism 50 directly adopt the original configuration of the existing evaporation equipment. The temperature-controlled magnetic chuck platform 10 in this embodiment, based on the original structure of the existing temperature-controlled magnetic chuck platform 10 of the evaporation equipment, adds a warpage prevention support pin assembly 12, realizing precise compensation for the edge deformation of the substrate 20 while completely retaining the original magnetic force distribution and temperature control function of the original platform.

[0074] According to another aspect of the present application, an evaporation equipment is provided. The evaporation equipment includes an equipment main body and a display panel evaporation alignment device. A metal evaporation chamber is provided in the equipment main body, and the display panel evaporation alignment device is arranged in the metal evaporation chamber, and the display panel evaporation alignment device is the above-mentioned display panel evaporation alignment device.

[0075] In some embodiments, the evaporation equipment in this embodiment further includes a vacuum device. The vacuum device is arranged on the equipment main body and is communicated with the metal evaporation chamber for evacuating the metal evaporation chamber.

[0076] In some embodiments, the evaporation equipment in this embodiment further includes a metal evaporation device. The metal evaporation device is arranged in the metal evaporation chamber. After the substrate 20 and the mask 30 are aligned and the substrate 20 and the mask 30 are adhered, the metal evaporation device can evaporate a metal material layer on the surface of the substrate 20 through the mask 30.

[0077] In summary, implementing the display panel evaporation alignment device and the evaporation equipment provided in this embodiment has at least the following beneficial technical effects: The display panel evaporation alignment device provided in this embodiment enables the temperature-controlled magnetic chuck platform 10 to press and align the substrate 20 and the mask 30 after alignment through a plurality of stage positioning pin assemblies 11, and maintain a heat dissipation interval with a preset distance between the temperature-controlled magnetic chuck assembly and the substrate 20. At the same time, by setting the warpage prevention support pin assembly 12, the temperature-controlled magnetic chuck platform 10 can offset the warpage of the substrate 20 caused by the pressing of the stage positioning pin assembly 11 through the warpage prevention support pin assembly 12, thereby significantly improving the evaporation shadow effect and enhancing the uniformity of the evaporated film layer. Moreover, through the non-contact design between the substrate 20 and the temperature-controlled magnetic chuck assembly, the risks of adhesive sheet and electrostatic damage caused by traditional mechanical pressing can be avoided, enabling the substrate 20 to maximize the utilization of the effective area while obtaining stable support, taking into account both production yield and economic benefits.

[0078] The above are only the preferred embodiments of the present application and are not intended to limit the present application. Any modifications, equivalent replacements, and improvements made within the spirit and principle of the present application shall be included in the protection scope of the present application.

Claims

1. A display panel evaporation alignment device, arranged in a metal evaporation chamber of an evaporation device, used for aligning a substrate (20) and a mask (30), characterized in that: The display panel evaporation alignment device comprises: A temperature-controlled magnetic platform (10), the temperature-controlled magnetic platform comprising a temperature-controlled magnetic component (13), a plurality of carrier positioning pin components (11) and at least one anti-warping support pin component (12), the temperature-controlled magnetic component (13) being movably arranged in the metal vapor deposition chamber, the carrier positioning pin component (11) and the anti-warping support pin component (12) being both arranged in the temperature-controlled magnetic component (13); Wherein, when the substrate (20) and the mask (30) are aligned, the position of the stage positioning pin assembly (11) corresponds to the edge area of ​​the substrate (20), and the stage positioning pin assembly (11) is used to apply a first pressing force to the edge area of ​​the substrate (20) to press the substrate (20) and the mask (30), and to space the substrate (20) and the temperature-controlled magnetic attraction assembly (13) at a preset distance; After the first pressing force acts on the edge area of ​​the substrate (20), an edge warping area (21) is correspondingly formed; the position of the anti-warping support pin assembly (12) corresponds to the edge warping area (21) and is used to apply a second pressing force to the edge warping area (21) to offset the warping of the substrate (20) caused by the first pressing force.

2. The display panel evaporation alignment device according to claim 1, characterized in that: The first pressing force is directed toward the mask (30), and the magnitude of the first pressing force is a, 10N≤a≤13N; And / or, the second pressing force is directed toward the mask (30), and the magnitude of the second pressing force is b, 0.8N≤b≤5N; And / or, the preset distance is c, 1mm≤c≤1.5mm.

3. The display panel evaporation alignment device according to claim 1, characterized in that: The display panel evaporation alignment device further includes: A substrate carrying mechanism (40), the substrate carrying mechanism (40) being arranged in the metal vapor deposition chamber and used for carrying the substrate (20); A mask carrying mechanism (50), the mask carrying mechanism (50) being movably disposed in the metal evaporation chamber and located below the substrate carrying mechanism (40), and being used for carrying the mask plate (30) and aligning the mask plate (30) with the substrate (20); The temperature-controlled magnetic attraction component (13) is located on a side of the substrate carrying mechanism (40) that is away from the mask carrying mechanism (50), and when the substrate (20) and the mask plate (30) are aligned, a plurality of the carrier positioning pin components (11) are arranged at intervals along the edge contour direction of the substrate (20).

4. The display panel evaporation alignment device according to claim 3, characterized in that: The substrate (20) is a rectangular substrate having a first long side, a first short side, a second long side and a second short side arranged in sequence, and a plurality of the carrier positioning pin assemblies (11) are arranged at intervals along the edge contour direction of the first long side, the first short side, the second long side and the second short side.

5. The display panel evaporation alignment device according to claim 4, characterized in that: The number of the carrier positioning pin assemblies (11) is d, 10≤d≤30; And / or, e number of the platform positioning pin assemblies (11) are arranged at equal intervals in the edge contour direction of the first long side and the second long side, respectively, 3≤e≤10; And / or, f number of the carrier positioning pin assemblies (11) are arranged at equal intervals in the edge contour direction of the first short side and the second short side, respectively, and 2≤f≤5.

6. The display panel evaporation alignment device according to claim 4, characterized in that: The number of the anti-warping support pin assemblies (12) is plural, and when the substrate (20) and the mask plate (30) are aligned, the plurality of anti-warping support pin assemblies (12) are arranged at intervals along the edge contour direction of the substrate (20).

7. The display panel evaporation alignment device according to claim 6, characterized in that: The plurality of anti-warping support pin assemblies (12) are arranged at intervals along the edge contour direction of the first short side and the second short side.

8. The display panel evaporation alignment device according to claim 7, characterized in that: The number of the anti-warping support pin assemblies (12) is g, where g≥4; And / or, h number of the carrier positioning pin assemblies (11) are arranged at equal intervals in the edge contour direction of the first short side and the second short side, respectively, and h≥2.

9. The display panel evaporation alignment device according to claim 1, characterized in that: The temperature-controlled magnetic attraction component (13) comprises a magnetic attraction plate component (131), and when the substrate (20) and the mask (30) are aligned, the magnetic attraction plate component (131) is used to apply a magnetic attraction force directed toward the substrate (20) to the mask (30), so that the mask (30) and the substrate (20) are attached.

10. The display panel evaporation alignment device according to claim 9, characterized in that: When the substrate (20) and the mask (30) are aligned, the temperature-controlled magnetic attraction platform (10) has a pressing state and an avoiding state; When the temperature-controlled magnetic platform (10) is in the pressed state, the stage positioning pin assembly (11) and the anti-warping support pin assembly (12) are both in contact with a side of the substrate (20) that is away from the mask (30), and the stage positioning pin assembly (11) applies the first pressing force to an edge region of the substrate (20), and the anti-warping support pin assembly (12) applies the second pressing force to an edge region (21) of the substrate (20) that is prone to warping; When the temperature-controlled magnetic attraction platform (10) is in the avoidance state, the carrier positioning pin assembly (11) and the anti-warping support pin assembly (12) are separated from the substrate (20), and avoid the substrate (20).

11. The display panel evaporation alignment device according to claim 10, characterized in that: The temperature-controlled magnetic suction component further comprises a cooling plate component (132), wherein the cooling plate component (132) is arranged on the magnetic suction plate component (131); when the substrate (20) and the mask (30) are aligned, the cooling plate component (132) is located on a side of the magnetic suction plate component (131) close to the substrate (20) and is spaced apart from the substrate (20), so as to adjust the temperature of the substrate (20) and the mask (30); when the temperature-controlled magnetic suction platform (10) is in the pressed state, the cooling plate component (132) and the substrate (20) are spaced apart by the preset distance.

12. The display panel evaporation alignment device according to any one of claims 1 to 11, characterized in that: The anti-warping support pin assembly (12) comprises a connecting base (121), a pressing head assembly (122) and an elastic reset mechanism (123); the connecting base (121) is fixedly mounted on the temperature-controlled magnetic platform (10); the pressing head assembly (122) is slidably arranged on the connecting base (121); the elastic reset mechanism (123) is arranged on the connecting base (121); two ends of the elastic reset mechanism (123) are respectively in contact with the connecting base (121) and the pressing head assembly (122); and the elastic reset mechanism (123) applies the second pressing force to the substrate (20) through the pressing head assembly (122).

13. The display panel evaporation alignment device according to claim 12, characterized in that: The temperature-controlled magnetic platform (10) is provided with a plurality of screw holes distributed along a first direction, and the connection base (121) is provided with a plurality of fixing holes (1211), and the plurality of fixing holes (1211) can correspond to the plurality of screw holes to achieve rough positioning of the connection base (121) in the first direction, wherein the first direction is parallel to the lower surface of the temperature-controlled magnetic platform (10).

14. The display panel evaporation alignment device according to claim 13, characterized in that: The temperature-controlled magnetic platform (10) has a groove extending along a second direction, and the connection base (121) is provided with a positioning protrusion (1212), and the positioning protrusion (1212) can cooperate with the groove to achieve the positioning of the connection base (121) in the second direction, wherein the second direction is parallel to the lower surface of the temperature-controlled magnetic platform (10) and perpendicular to the first direction.

15. The display panel evaporation alignment device according to claim 13, characterized in that: The screw hole extends along a third direction, and the anti-warping support pin assembly (12) further comprises a fixing screw, which passes through the fixing hole (1211) and is screwed into the screw hole to achieve fixation of the connection base (121) in the third direction, wherein the third direction is perpendicular to the lower surface of the temperature-controlled magnetic platform (10).

16. The display panel evaporation alignment device according to claim 12, characterized in that: The pressure head assembly (122) comprises a pressure head adjustment assembly (1221) and a pressure head body (1222); the pressure head body (1222) is slidably arranged on the connection base (121) via the pressure head adjustment assembly (1221); the pressure head adjustment assembly (1221) is used to adjust the relative position between the pressure head body (1222) and the elastic reset mechanism (123) when no external force is applied; And / or, the anti-warping support pin assembly (12) further includes an elastic force adjustment assembly (124), the elastic force adjustment assembly (124) is arranged on the connecting base (121), the elastic reset mechanism (123) includes a compression spring, the first end of the compression spring abuts against the pressing head assembly (122), and the second end of the compression spring abuts against the connecting base (121) through the elastic force adjustment assembly (124), and the elastic force adjustment assembly (124) is used to adjust the compression amount of the compression spring to change the magnitude of the second pressing force applied by the elastic reset mechanism (123) to the substrate (20) through the pressing head assembly (122).

17. A vapor deposition device, characterized in that: The evaporation equipment includes an equipment body and a display panel evaporation alignment device. A metal evaporation cavity is arranged in the equipment body. The display panel evaporation alignment device is arranged in the metal evaporation cavity. The display panel evaporation alignment device is the display panel evaporation alignment device according to any one of claims 1 to 16.

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