Transfer device for semiconductor wafer thickness detection

Abstract

The invention belongs to the technical field of special equipment for semiconductor wafers, and particularly relates to a transfer device for semiconductor wafer thickness detection, which comprises a detection table, a thickness measurement unit comprises a support frame and a thickness gauge which are fixedly arranged on the detection table, and the thickness gauge is arranged on a horizontal frame of the support frame; a detection cylinder is arranged on the detection table, and the detection cylinder is located under the thickness gauge; the detection table is provided with a mobile pick-up unit, and the mobile pick-up unit is used for transferring a semiconductor wafer to be detected from the station into the detection cylinder; a notch groove is formed in the pick-up ring, a plurality of lifting blocks are installed on the inner ring surface of the pick-up ring, each lifting block is provided with a contact suction cup, and the pick-up ring is installed on the detection table through a sliding supporting assembly; according to the semiconductor wafer thickness detection device, the accuracy of semiconductor wafer thickness detection can be improved, and since the plurality of contact suckers are in small-area adsorption contact with the to-be-detected wafer, unnecessary damage or pollution to the semiconductor wafer cannot be caused.

Description

Technical Field

[0001] The present invention belongs to the technical field of semiconductor wafer special equipment, and particularly relates to a transfer device for detecting the thickness of a semiconductor wafer. Background Art

[0002] A semiconductor wafer refers to a silicon wafer used to fabricate silicon semiconductor circuits, and its raw material is silicon. High-purity polysilicon is dissolved and doped with a silicon crystal seed, and then slowly pulled out to form a cylindrical single-crystal silicon. After the silicon ingot is ground, polished, and sliced, a silicon wafer is formed, that is, a wafer. Various circuit element structures can be processed and fabricated on the silicon wafer to become products with specific electrical functions. During the processing of semiconductor wafers, in order to improve the accuracy of the wafers, it is necessary to detect the thickness of the semiconductor wafers.

[0003] Most of the existing devices for detecting the thickness of semiconductor wafers are independently set. Therefore, it is necessary to manually or semi-automatically place the semiconductor wafers being processed on the production line onto the detection table for thickness detection processing, and it is impossible to use a clamping and transferring device to transfer them to the detection table. Obviously, this method will not only affect the processing efficiency of semiconductor wafers, but also cause unnecessary contamination or damage to the semiconductor wafers when contacting them over a large area, thereby affecting the subsequent processing and use of the semiconductor wafers. Summary of the Invention

[0004] To solve the above technical problems, the present invention is realized through the following technical solutions:

[0005] The present invention is a transfer device for detecting the thickness of a semiconductor wafer, including a detection table. A thickness measurement unit is arranged above the detection table, and a detection cylinder is arranged on the detection table and is located directly below the thickness measurement unit; a moving picking unit is arranged on the detection table, and the moving picking unit is used to transfer the semiconductor wafer to be detected from the working position into the detection cylinder; the moving picking unit includes a picking ring, a lifting block, and a contact suction cup. A notch groove is formed on the picking ring, and a plurality of lifting blocks are installed on the inner circumferential surface of the picking ring. Each lifting block is equipped with a contact suction cup. The picking ring is installed on the detection table through a sliding support assembly, and the outer diameter of the picking ring is smaller than the inner diameter of the detection cylinder.

[0006] Further, the sliding support assembly includes an L-shaped support rod, an electric lifting rod, a support block, a driving rack, a meshing gear, and an electric push rod. Symmetrically fixed on the outer peripheral surface of the picking ring are L-shaped support rods. The distance between the left and right horizontal rods of the symmetrically arranged L-shaped support rods is greater than the front-to-back width of the support frame. The end portions of the front and back horizontal rods of the L-shaped support rod extend to the front and back side surfaces of the detection table, and the end portions of the front and back horizontal rods are connected to the output rod of the vertical electric lifting rod. A support notch is downwardly formed in the upper barrel opening of the detection cylinder, and symmetrically arranged L-shaped support rods are slidably supported in the support notch. Symmetrically formed in the detection table are moving long slots. The rod body of the electric lifting rod extends downward into the moving long slot and is connected to the support block. A driving rack is slidably arranged in the moving long slot, and the end portion of the driving rack is connected to the support block. Symmetrically formed in the detection table are lifting holes. A servo motor is fixed at the bottom of the lifting hole, and the output shaft of the servo motor is connected to an electric push rod. An engaging gear is arranged on the output shaft of the electric push rod, and the engaging gear meshes with the driving rack.

[0007] Further, the moving picking unit further includes a driving gear ring. An annular cavity is inwardly formed in the inner peripheral wall of the picking ring. Rotatably installed in the annular cavity is a driving gear ring with a notch. Tooth teeth are formed on the outer peripheral surface of the driving gear ring. Meshing notches are symmetrically formed on both the outer peripheral surface of the picking ring and the detection cylinder. The symmetrically arranged engaging gears correspond to the symmetrically arranged meshing notches. A plurality of lifting blocks are installed on the inner peripheral surface of the driving gear ring. A moving guide groove is formed inside the detection table and is located on the outer side wall of the moving long slot, and the left end portion of the moving guide groove penetrates leftward and is opened.

[0008] Further, a plurality of positioning blocks are fixed on the inner barrel wall of the detection cylinder, and the upper surfaces of the plurality of positioning blocks are in contact with the inserted picking ring.

[0009] Further, a pushing column is arranged on the upper surface of the positioning block. A plurality of positioning holes are penetratingly formed in the bottom of the annular cavity, and each positioning hole corresponds to each pushing column. A plurality of recessed holes are formed in the lower surface of the driving gear ring, and a limiting column is slidably inserted into each recessed hole through a spring. The bottom end portion of the limiting column is downwardly inserted into the positioning hole, and the bottom end portion thereof is designed with a rounded corner.

[0010] Further, a through long slot is horizontally formed in the lifting block. Horizontally arranged in the through long slot is a bladder-shaped column. A spring is arranged in the bladder-shaped column, and the tail end portion of the bladder-shaped column is communicated with an air pipe. The other end portion of the bladder-shaped column is connected to a contact suction cup through a connecting air guide column, and the air guide column is slidably inserted into the through long slot.

[0011] Further, an arc-shaped block is slidably arranged on the upper surface of the lifting block. An arc-shaped chamfer is formed on the inner side of the top end of the arc-shaped block. The bottom end surface of the arc-shaped block is connected to the outer ring of the contact suction cup through a horizontal connecting block. The height of the arc-shaped block is greater than the horizontal plane height of the contact suction cup.

[0012] Further, the thickness measuring unit includes a support frame and a thickness gauge fixedly arranged on the detection table. The thickness gauge is installed on the horizontal frame of the support frame; a sealing film is slidably arranged at the notch of the upwardly penetrating moving long groove. The length of the moving guide groove is greater than the length of the moving long groove.

[0013] The present invention has the following beneficial effects:

[0014] 1. The present invention is provided with a moving pick-up unit on the detection table. The wafer to be detected falls onto at least three lifting blocks arranged in a circumferential array. At this time, the small-sized contact suction cups will contact the lower surface of the wafer, realizing multi-point positioning adsorption and fixation of the wafer. The sliding support assembly can drive the adsorbed and fixed wafer to be stably transferred into the detection cylinder for thickness detection. Furthermore, the detection system of the present invention can be accurately matched to the production line of semiconductor wafer processing, realizing real-time on-line thickness detection of the semiconductor wafer being processed, and it is not necessary to manually remove the wafer to be detected from the production line, thereby improving the accuracy of semiconductor wafer thickness detection. And since multiple contact suction cups are in small-area adsorption contact with the wafer to be detected, it will not cause unnecessary damage or contamination to the semiconductor wafer.

[0015] 2. With the cooperation of the sliding support assembly, the pick-up ring of the present invention, through the cooperation of symmetric L-shaped support rods, electric lifting rods and sliding drive racks, not only enables the pick-up ring to accurately and quickly stably adsorb and fix the wafer to be detected and transfer it into the detection cylinder for thickness detection, but also will not cause the pick-up ring to be unable to automatically and accurately transfer the wafer to be detected from the detection area of the production line to the detection table due to the installation position of the thickness gauge or the detection cylinder, thereby affecting the efficiency and accuracy of real-time on-line thickness detection of the semiconductor wafers being produced and processed on the production line.

[0016] Of course, it is not necessary for any product implementing the present invention to simultaneously achieve all the above-mentioned advantages. Description of the Drawings

[0017] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the following will briefly introduce the drawings required for the description of the embodiments. Obviously, the drawings in the following description are only some embodiments of the present invention. For those of ordinary skill in the art, without creative efforts, other drawings can be obtained based on these drawings.

[0018] Figure 1 Schematic diagram of the overall structure of the disclosed embodiment of the present invention;

[0019] Figure 2 State diagram of the pick-up ring extending out of the detection cylinder in the disclosed embodiment of the present invention;

[0020] Figure 3 Schematic diagram of the structure of the mobile pick-up unit and the sliding support assembly on the detection table in the disclosed embodiment of the present invention;

[0021] Figure 4 Schematic diagram of the cooperation between the mobile pick-up unit and the sliding support assembly in the disclosed embodiment of the present invention;

[0022] Figure 5 Schematic diagram of the cooperation between the pick-up ring and the detection cylinder in the disclosed embodiment of the present invention;

[0023] Figure 6 Partial cross-sectional view of the pick-up ring in the disclosed embodiment of the present invention;

[0024] Figure 7 In the disclosed embodiment of the present invention Figure 6 Local enlarged view at position A;

[0025] Figure 8 Schematic diagram of the structure of the detection table in the disclosed embodiment of the present invention.

[0026] In the figure: 1, detection table; 11, moving long groove; 12, lifting hole; 13, moving guide groove;

[0027] 2, support frame;

[0028] 3, thickness gauge;

[0029] 4, detection cylinder; 41, support notch; 42, meshing notch;

[0030] 5, mobile pick-up unit; 51, pick-up ring; 511, annular cavity; 512, positioning hole; 52, lifting block; 521, through long groove; 53, contact suction cup; 54, driving gear ring; 541, recessed hole; 55, limit post; 56, positioning block; 57, pushing post; 58, bladder-shaped post;

[0031] 6, sliding support assembly; 61, L-shaped support rod; 62, electric lifting rod; 63, support block; 64, driving rack; 65, meshing gear; 66, electric push rod;

[0032] 7, arc-shaped block; 71, horizontal connecting block;

[0033] 8, sealing film. Detailed implementation manners

[0034] The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present invention without creative efforts shall fall within the protection scope of the present invention.

[0035] In the description of the present invention, it should be understood that the terms "opening", "upper", "lower", "thickness", "top", "middle", "length", "inner", "periphery", etc. indicating orientation or positional relationships are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the components or elements referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus should not be construed as a limitation to the present invention.

[0036] Please refer to Figures 1-8 As shown, the present invention is a transfer device for detecting the thickness of a semiconductor wafer, including a detection table 1. Above the detection table 1, there is a thickness measurement unit. The thickness measurement unit includes a support frame 2 fixed on the detection table 1 and a thickness gauge 3. The thickness gauge 3 is installed on the horizontal frame of the support frame 2. A detection cylinder 4 is arranged on the detection table 1, and the detection cylinder 4 is located directly below the thickness gauge 3. A mobile picking unit 5 is arranged on the detection table 1, and the mobile picking unit 5 is used to transfer the semiconductor wafer to be detected from the working station into the detection cylinder 4. The mobile picking unit 5 includes a picking ring 51, a lifting block 52, and a contact suction cup 53. A notch groove is formed on the picking ring 51, and a plurality of lifting blocks 52 are installed on the inner circumferential surface of the picking ring 51. Each lifting block 52 is installed with a contact suction cup 53. The picking ring 51 is installed on the detection table 1 through a sliding support assembly 6, and the outer diameter of the picking ring 51 is smaller than the inner diameter of the detection cylinder 4.

[0037] Specifically, a mobile picking unit 5 is provided on the inspection table 1 of the present invention. When it is necessary to detect the thickness of a semiconductor wafer being processed on the production line, the control system controls the sliding support assembly 6 to work at this time, driving the picking ring 51 to rise outside the inspection cylinder 4, and then driving the picking ring 51 to move horizontally along the inspection table 1 to the thickness inspection station of the production line. At this time, the picking ring 51 enters the lifting platform in the inspection area through the opened notch groove, and the picking ring 51 is located below the wafer to be transferred. Then, the sliding support assembly 6 drives the picking ring 51 to rise, so that the wafer to be detected falls onto at least three lifting blocks 52 installed in a circumferential array. At this time, the small-sized contact suction cups 53 will contact the lower surface of the wafer, realizing multi-point positioning adsorption and fixation of the wafer. Then, the picking ring 51 continues to rise, so that the wafer to be detected is separated from the lifting platform in the inspection area. Then, the sliding support assembly 6 drives the picking ring 51 holding the wafer to be retracted to the side of the inspection table 1, and slowly drives the picking ring 51 to descend to the vacancy formed between the thickness gauge 3 and the inspection cylinder 4. Then, the sliding support assembly 6 drives the descending picking ring 51 to move directly above the inspection cylinder 4 and align. Then, the picking ring 51 lowers the adsorbed and fixed wafer into the inspection cylinder 4. Then, through the cooperation of the laser thickness gauge 3 on the support frame 2 and various instruments in the inspection cylinder 4, the thickness of the wafer placed in the inspection cylinder 4 is detected. When the thickness of the wafer is detected to be qualified, at this time, the picking ring 51 will first rise from the inspection cylinder 4 under the drive of the sliding support assembly 6, then move horizontally to the thickness inspection station, and then the picking ring 51 drives the inspected wafer to descend to the lifting platform of the inspection process. The multiple contact suction cups 53 will disengage from the adsorption of the wafer, facilitating the further processing of the inspected wafer in the next process. The unqualified wafers will be sent to the unqualified area for storage through the cooperation of the picking ring 51 and the sliding support assembly 6. Thus, the inspection system of the present invention can be accurately coordinated with the semiconductor wafer processing production line, realizing real-time on-line thickness detection of the semiconductor wafers being processed, and there is no need to manually remove the wafers to be detected from the production line, thereby improving the accuracy of semiconductor wafer thickness detection. And because the multiple contact suction cups 53 are in small-area adsorption contact with the wafers to be detected, unnecessary damage or contamination to the semiconductor wafers will not be caused.

[0038] In the solution designed by the present invention, the sliding support assembly 6 includes an L-shaped support rod 61, an electric lifting rod 62, a support block 63, a driving rack 64, a meshing gear 65 and an electric push rod 66. Symmetrically fixed on the outer circumferential surface of the picking ring 51 are the L-shaped support rods 61. The distance between the left and right horizontal rods of the symmetrically arranged L-shaped support rods 61 is greater than the front-back width of the support frame 2. The ends of the front and back horizontal rods of the L-shaped support rod 61 extend to the front and back sides of the inspection table 1, and the ends of the front and back horizontal rods are connected to the output rods of the vertical electric lifting rods 62. A support notch 41 is downwardly opened at the upper barrel opening of the inspection cylinder 4, and the symmetrically arranged L-shaped support rods 61 are slidably supported in the support notch 41. Symmetrically opened on the inspection table 1 are moving long grooves 11. The rod body of the electric lifting rod 62 extends downward into the moving long grooves 11 and is connected to the support block 63. A driving rack 64 is slidably arranged in the moving long grooves 11, and the end of the driving rack 64 is connected to the support block 63. Symmetrically opened on the inspection table 1 are lifting holes 12. A servo motor is fixedly arranged at the bottom of the lifting holes 12, and the output shaft of the servo motor is connected to an electric push rod 66. A meshing gear 65 is arranged on the output shaft of the electric push rod 66, and the meshing gear 65 meshes with the driving rack 64;

[0039] Specifically, when the pick-up ring 51 needs to extend out of the detection cylinder 4, at this time, the output rods of the symmetrically arranged electric lifting rods 62 extend out, and will push the pick-up ring 51 to slide upward in the detection cylinder 4 through the L-shaped support rods 61. Since the symmetrically arranged L-shaped support rods 61 are driven by the servo motors fixedly installed in the symmetrically arranged lifting holes 12, their output shafts will drive the meshing gears 65 to rotate through the electric push rods 66, causing the driving rack 64 to horizontally slide left and right in the moving long groove 11. Furthermore, the support block 63 will drive the electric lifting rod 62 to horizontally slide left and right, and then the L-shaped support rod 61 will drive the pick-up ring 51 to horizontally slide to the detection area of the production line. Since the distance between the left and right horizontal rods of the symmetrically arranged L-shaped support rods 61 is greater than the front and back width of the support member, when the pick-up ring 51 disengages from between the thickness gauges 3 in the detection cylinder 4, at this time, the output rods of the symmetrically arranged electric lifting rods 62 continue to extend, which can drive the pick-up ring 51 to continue rising to an appropriate height to be flush with the lifting platform in the detection area. The continuous sliding of the driving rack 64 will cause the pick-up ring 51 to move to the lifting platform to adsorb and pick up the wafer to be detected. Then, through the cooperation of the retraction of the driving rack 64 that slides and the output rods of the electric lifting rods 62, at this time, the left and right horizontal rods of the symmetrically arranged L-shaped support rods 61 will descend and support into the support notch 41, so that the wafer adsorbed by the pick-up ring 51 can accurately and safely descend into the detection cylinder 4, and then the thickness gauge 3 is used to detect the thickness of the wafer. Furthermore, through the cooperation of the symmetrically arranged L-shaped support rods 61, electric lifting rods 62 and the sliding driving rack 64, not only can the pick-up ring 51 accurately and quickly stably adsorb and fix the wafer to be detected and transfer it into the detection cylinder 4 for thickness detection, but also it will not be affected by the installation positions of the thickness gauge 3 or the detection cylinder 4, resulting in the pick-up ring 51 being unable to automatically and accurately transfer the wafer to be detected from the detection area of the production line to the detection table 1, thereby affecting the efficiency and accuracy of the on-line thickness detection of the semiconductor wafers being produced and processed on the production line.

[0040] In the solution designed by the present invention, the mobile pick-up unit 5 further includes a driving gear ring 54. An annular cavity 511 is formed by inward extension of the inner peripheral wall of the pick-up ring 51. A driving gear ring 54 with a notch is rotatably installed in the annular cavity 511. Tooth teeth are formed on the outer peripheral surface of the driving gear ring 54. Meshing notches 42 are symmetrically formed on both the outer peripheral surface of the pick-up ring 51 and the detection cylinder 4. The symmetrically arranged meshing gears 65 correspond to the symmetrically arranged meshing notches 42. A plurality of lifting blocks 52 are installed on the inner peripheral surface of the driving gear ring 54. A moving guide groove 13 is formed inside the detection table 1, and the moving guide groove 13 is located on the outer side wall of the moving long groove 11, and the left end of the moving guide groove 13 penetrates leftward and is opened;

[0041] Specifically, after the pick-up ring 51 transfers the wafer fixed by adsorption through multiple contact suction cups 53 into the detection cylinder 4, the engagement notches 42 formed on the pick-up ring 51 will align with the engagement notches 42 on the detection cylinder 4. The engagement notches 42 on the detection cylinder 4 correspond to the lifting holes 12. At this time, the output rod of the electric push rod 66 is extended to drive the engagement gear 65 to move upward until it meshes with the external teeth of the drive gear ring 54. Then, when the output shaft of the servo motor in the lifting hole 12 rotates, it will drive the engagement gear 65 to rotate, causing the drive gear ring 54 to rotate within the annular cavity 511. Since multiple lifting blocks 52 are circumferentially arrayed and installed on the inner circumferential surface of the drive gear ring 54, the adsorbed and fixed wafer can rotate slowly within the detection cylinder 4 for thickness detection at different positions, thereby improving the accuracy of semiconductor wafer thickness detection. When the engagement gear 65 rises and disengages from the drive rack 64, since the pick-up ring 51 is located within the detection cylinder 4 and is supported and limited by the symmetrical L-shaped support rods 61, the adsorbed and fixed wafer will not cause the pick-up ring 51 to shake or tilt within the detection cylinder 4 during rotation, and thus will not affect the accuracy of wafer thickness detection within the detection cylinder 4. When it is necessary to transfer and remove the detected wafer from the detection cylinder 4, the notch on the drive gear ring 54 is aligned with the notch groove on the pick-up ring 51. Then, the output rod of the electric push rod 66 is retracted to move the engagement gear 65 downward until it meshes with the drive rack 64. The output rod of the electric lifting rod 62 is extended to drive the pick-up ring 51 to disengage upward from the detection cylinder 4 through the symmetrical L-shaped support rods 61, thereby facilitating the transfer of the detected wafer to the detection area of the production line for subsequent processing. The leftward through-opening of the moving guide groove 13 enables the drive rack 64 to stably and safely slide within the moving guide groove 13 without interfering with the normal lifting movement of the engagement gear 65.

[0042] In the solution designed by the present invention, a plurality of positioning blocks 56 are fixedly provided on the inner cylinder wall of the detection cylinder 4, and the upper surfaces of the plurality of positioning blocks 56 are in contact with the inserted pick-up ring 51. Specifically, when the pick-up ring 51 descends into the detection cylinder 4, the plurality of positioning blocks 56 circumferentially arrayed and installed on the inner wall of the detection cylinder 4 will provide gravity support for the pick-up ring 51, preventing the position of the pick-up ring 51 far from the L-shaped support rod 61 from tilting or skewing slightly within the detection cylinder 4 due to gravity, thereby affecting the accuracy of the thickness detection of the wafer by the thickness gauge 3.

[0043] In the solution designed by the present invention, a push column 57 is provided on the upper surface of the positioning block 56. A plurality of positioning holes 512 are penetrated and opened at the bottom of the annular cavity 511. Each positioning hole 512 corresponds to each push column 57. A plurality of recessed holes 541 are opened on the lower surface of the driving gear ring 54. A limiting column 55 is slidably inserted into each recessed hole 541 through a spring. The bottom end of the limiting column 55 is inserted downward into the positioning hole 512, and the bottom end thereof is designed with a rounded corner;

[0044] Specifically, when the pick-up ring 51 descends into the detection cylinder 4 and its lower surface contacts the positioning block 56, at this time, the push column 57 will be inserted into the aligned positioning hole 512. Then, the push column 57 will push the limiting column 55 inserted into the positioning hole 512 to move upward and retract into the recessed hole 541. At this time, the spring in the recessed hole 541 will be compressed. At this time, the driving gear ring 54 will be disengaged from the limit fixation with the pick-up ring 51, so as to facilitate the meshing gear 65 to drive the driving gear ring 54 to rotate in the annular cavity 511, facilitating the driving rotation of the adsorbed and fixed wafer; when the thickness detection of the wafer is completed, and after the notch of the driving gear ring 54 is aligned with the notch groove of the pick-up ring 51, and when the pick-up ring 51 rises and disengages from the detection cylinder 4, at this time, the spring in the recessed hole 541 will push the limiting column 55 to move downward and insert into the positioning hole 512, so that a plurality of limiting columns 55 can limit and fix the driving gear ring 54 in the annular cavity 511 of the pick-up ring 51, preventing the driving gear ring 54 from rotating automatically in the annular cavity 511 when the pick-up ring 51 drives the wafer to transfer, thereby causing the notch groove of the driving gear ring 54 to be misaligned with the notch groove on the pick-up ring 51, thereby affecting the accurate falling of the detected wafer onto the lifting platform in the detection area; and because the bottom end of the limiting column 55 is designed with a rounded corner, and the groove wall of the notch groove of the pick-up ring 51 is also designed with a rounded corner, therefore, when the limiting column 55 on the driving gear ring 54 rotates to the notch groove, when the limiting column 55 extends out under the push of the spring at this time, the continuous rotation of the driving gear ring 54 will cause the bottom end of the limiting column 55 to enter the annular cavity 511 through the transition of the arc angle, so that it will not interfere with the normal rotation of the driving gear ring 54 in the pick-up ring 51.

[0045] In the solution designed by the present invention, a through long groove 521 is horizontally opened on the lifting block 52. A bladder column 58 is horizontally arranged in the through long groove 521. A spring is arranged in the bladder column 58, and the tail end of the bladder column 58 is communicated with an air pipe. The other end of the bladder column 58 is communicated with the contact suction cup 53 through a connecting air guide column. The air guide column is slidably inserted into the through long groove 521;

[0046] Specifically, to facilitate the picking and detecting of wafers of different sizes, gas is introduced into or extracted from the bladder-shaped column 58 through an air pipe at this time, so that the bladder-shaped column 58 can horizontally expand or contract in the through slot 521, enabling the plurality of contact suction cups 53 to slide along the plurality of lifting blocks 52. Furthermore, the circumferential diameter of the plurality of contact suction cups 53 in the circumferential array can be increased or decreased, thus facilitating the adsorption and fixation of wafers of different sizes.

[0047] In the solution designed by the present invention, an arc-shaped block 7 is slidably arranged on the upper surface of the lifting block 52. An arc chamfer is formed on the inner side of the top end of the arc-shaped block 7. The bottom end surface of the arc-shaped block 7 is connected to the outer ring of the contact suction cup 53 through a horizontal connecting block 71. The height of the arc-shaped block 7 is greater than the horizontal plane height of the contact suction cup 53.

[0048] Specifically, when the picking ring 51 moves upward on the lifting platform and the wafer enters the picking ring 51, the arc chamfers of the plurality of arc-shaped blocks 7 in the circumferential array will cause the wafer to accurately fall into the inner side surface. At this time, the circumferential array of arc-shaped blocks 7 will contact the outer ring surface of the wafer, enabling the wafer to accurately fall to the position of the circumferential array of contact suction cups 53, preventing the wafer from tilting on the plurality of contact suction cups 53, so that the contact suction cups 53 cannot accurately adsorb the lower surface of the wafer, and further affecting the accurate lifting and transfer of the wafer by the picking ring 51.

[0049] In the solution designed by the present invention, a sealing film 8 is slidably arranged at the notch of the upwardly penetrating moving slot 11. The length of the moving guide slot 13 is greater than the length of the moving slot 11. Specifically, the sealing film 8 made of an elastic material can seal the notch of the moving slot 11 and will not interfere with the normal sliding of the electric lifting rod 62. The opening of the moving guide slot 13 can provide gravity support for the sliding driving rack 64, preventing the driving gear ring 54 from being overloaded and affecting its normal movement.

[0050] In the description of this specification, the description with reference to terms such as "one embodiment", "example", "specific example", etc. means that the specific features, structures, materials or characteristics described in connection with the embodiment or example are included in at least one embodiment or example of the present invention. In this specification, the schematic representations of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in a suitable manner in any one or more embodiments or examples.

[0051] The preferred embodiments of the present invention disclosed above are only used to help illustrate the present invention. The preferred embodiments do not describe all the details in detail, nor do they limit the invention to the specific embodiments described. Obviously, many modifications and variations can be made according to the content of this specification. These embodiments are selected and specifically described in this specification to better explain the principles and practical applications of the present invention, so that those skilled in the art can well understand and utilize the present invention. The present invention is only limited by the claims and their full scope and equivalents.

Claims

1. A transfer device for detecting the thickness of a semiconductor wafer, characterized in that: It includes a testing platform, and a thickness measuring unit is arranged above the testing platform; A detection cylinder is provided on the detection table, and the detection cylinder is located directly below the thickness measuring unit; The testing table is provided with a mobile pickup unit, which is used to transfer the semiconductor wafer to be tested from the work station to the testing cylinder; The mobile pickup unit includes a pickup ring, a lifting block and a contact suction cup. A notch groove is formed on the pickup ring, and a plurality of lifting blocks are installed on the inner ring surface of the pickup ring. A contact suction cup is installed on each lifting block. The pickup ring is installed on the detection table through a sliding support assembly. The outer diameter of the pickup ring is smaller than the inner diameter of the detection cylinder.

2. A transfer device for detecting the thickness of a semiconductor wafer according to claim 1, characterized in that: The sliding support assembly includes an L-shaped support rod, an electric lifting rod, a support block, a driving rack, a meshing gear and an electric push rod. The outer ring surface of the pickup ring is symmetrically fixed with an L-shaped support rod, and the distance between the left and right horizontal rods of the symmetrical L-shaped support rod is greater than the front and rear width of the support frame. The front and rear horizontal rod ends of the L-shaped support rod extend to the front and rear sides of the detection platform, and the ends of the front and rear horizontal rods are connected to the output rod of the vertical electric lifting rod. A supporting groove is opened downwardly at the upper tube mouth of the detection cylinder, and symmetrical L-shaped support rods are slidably supported in the supporting groove. A movable long groove is symmetrically opened on the detection platform, and the rod body of the electric lifting rod extends downwardly to the movable long groove, and its rod body is connected to the support block. A driving rack is slidably arranged in the movable long groove, and the end of the driving rack is connected to the support block. Lifting holes are symmetrically opened on the detection platform, a servo motor is fixed at the bottom of the lifting hole, and an electric push rod is connected to the output shaft of the servo motor, and a meshing gear is provided on the output shaft of the electric push rod, and the meshing gear is meshed with the driving rack.

3. A transfer device for detecting the thickness of a semiconductor wafer according to claim 2, characterized in that: The mobile pickup unit also includes a driving gear ring, the inner ring wall of the pickup ring extends inward to form an annular cavity, a driving gear ring with a notch is rotatably installed in the annular cavity, teeth are formed on the outer ring surface of the driving gear ring, and meshing grooves are symmetrically provided on the outer ring surface of the pickup ring and the detection tube, and the symmetrical meshing gears correspond to the symmetrical meshing grooves. A plurality of lifting blocks are installed on the inner ring surface of the driving gear ring, and a moving guide groove is provided inside the detection table, and the moving guide groove is located on the outer side wall of the moving long groove, and the left end of the moving guide groove penetrates to the left.

4. A transfer device for detecting the thickness of a semiconductor wafer according to claim 3, characterized in that: A plurality of positioning blocks are fixedly arranged on the inner cylinder wall of the detection cylinder, and the upper surfaces of the plurality of positioning blocks are in contact with the inserted pickup ring.

5. A transfer device for detecting the thickness of a semiconductor wafer according to claim 4, characterized in that: A push column is provided on the upper surface of the positioning block, and a plurality of positioning holes are formed through the bottom of the annular cavity, each positioning hole corresponds to each push column, and a plurality of recessed holes are formed on the lower surface of the driving gear ring, and a limiting column is inserted into each recessed hole through a spring sliding connection, and the bottom end of the limiting column is inserted downward into the positioning hole, and its bottom end is designed with a rounded corner.

6. A transfer device for detecting the thickness of a semiconductor wafer according to claim 1, characterized in that: A long through slot is horizontally opened on the lifting block, a sac-shaped column is horizontally arranged in the long slot, a spring is arranged in the sac-shaped column, and the tail end of the sac-shaped column is connected to an air pipe, and the other end of the sac-shaped column is connected to the contact suction cup and connected to the air guide column, and the air guide column is slidably inserted into the long through slot.

7. A transfer device for detecting the thickness of a semiconductor wafer according to claim 6, characterized in that: An arc block is slidably provided on the upper surface of the lifting block, an arc chamfer is formed on the inner side of the top end of the arc block, the bottom end surface of the arc block is connected to the outer circle of the contact suction cup through a horizontal connecting block, and the height of the arc block is greater than the horizontal plane height of the contact suction cup.

8. A transfer device for detecting the thickness of a semiconductor wafer according to claim 3, characterized in that: The thickness measuring unit comprises a support frame fixed on the detection table and a thickness gauge, wherein the thickness gauge is installed on a horizontal frame of the support frame; a sealing film is slidably arranged at the slot of the movable long slot which penetrates upward, and the length of the movable guide slot is greater than the length of the movable long slot.

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