Rigid-flexible combined board, satellite, satellite system and satellite manufacturing method

Abstract

The invention provides a rigid-flexible combined board, a satellite, a satellite system and a satellite manufacturing method, the rigid-flexible combined board is suitable for connecting each subsystem in the satellite to realize information interaction among the subsystems, and the rigid-flexible combined board comprises a rigid board comprising a signal transmission line; and a plurality of flexible plates, one end of each flexible plate is electrically connected with the rigid plate, and the other end of each flexible plate is electrically connected with the corresponding subsystem. The rigid-flexible combined board is electrically connected with each subsystem of the satellite through each flexible board electrically connected with one rigid board, so that data interaction among the subsystems in the satellite is realized, complicated and disordered data cables in the prior art can be integrated, and more concise and effective spatial layout in the satellite is realized.

Description

Technical Field

[0001] This application mainly relates to the field of satellites, and particularly to a rigid-flexible printed circuit board, a satellite, a satellite system, and a satellite manufacturing method. Background Art

[0002] Currently, the mainstream satellite assembly technology for the main network of a whole satellite adopts a conventional cable network design, resulting in a large number of cables in the satellite. These cables not only occupy a large amount of space inside the satellite but also make it difficult to achieve automated assembly, reducing the satellite manufacturing efficiency and increasing the requirements and difficulties of quality inspection.

[0003] In addition, some satellite structures use multiple rigid plates and multiple flexible plates to achieve internal data interaction in a complex connection manner. However, this solution requires installing each rigid plate and flexible plate sequentially during the assembly process, resulting in problems such as high automation difficulty, slow assembly speed, and increased risk of assembly bumps in the complex assembly process, which indirectly reduces the quality of the finished product.

[0004] Therefore, the existing technical solutions for satellite cable networks and rigid and flexible plates cannot meet the requirements of mass-producing satellites. Summary of the Invention

[0005] The technical problem to be solved by this application is to provide a rigid-flexible printed circuit board, a satellite, a satellite system, and a satellite manufacturing method, which improve the manufacturing efficiency and quality of satellites by integrating the internal circuits of the satellites.

[0006] To solve the above technical problem, this application provides a rigid-flexible printed circuit board, which is suitable for connecting each subsystem in a satellite to realize information interaction between each subsystem. The rigid-flexible printed circuit board includes: a rigid plate containing signal transmission lines; and multiple flexible plates, one end of each flexible plate is electrically connected to the rigid plate respectively, and the other end of each flexible plate is electrically connected to the corresponding subsystem.

[0007] Optionally, the flexible plate includes at least one plug provided at the other end, and each plug is used to interact with the information data corresponding to one function of the subsystem.

[0008] Optionally, the flexible plate further includes a flexible area, and the top layer and the bottom layer of the flexible area are respectively covered with an anti-abrasion layer.

[0009] Optionally, the satellite further includes an extended function module for realizing the corresponding extended function, and the rigid-flexible printed circuit board further includes at least one connector provided on the rigid plate, and the connector is used to be electrically connected to the extended function module.

[0010] Optionally, the rigid plate is provided with metallized mounting holes for fixedly connecting the rigid-flexible printed circuit board to the satellite housing.

[0011] Optionally, the signal routing of the flexible board includes differential signal routing.

[0012] Optionally, the differential signal routing is carried out with equal length, equal width, and equal spacing. Among them, the positive and negative signals of the same signal are distributed on the same layer of the flexible board; and / or the adjacent layers of the same flexible board use ground signal copper plating as the characteristic impedance reference plane.

[0013] Optionally, the material of the flexible board includes polyimide material.

[0014] Optionally, each layer of the rigid board has a gridless printed line with a width greater than 10 mil, and / or each layer of the flexible board has a gridless printed line with a width greater than 10 mil.

[0015] Optionally, the length of the rigid board is set according to the positions of each subsystem.

[0016] Optionally, the length ranges from 1 meter to 1.5 meters.

[0017] Optionally, when the satellite is a flat-panel satellite, the width of the rigid board is set according to the thickness of the satellite.

[0018] Optionally, the width ranges from 20 cm to 40 cm.

[0019] Optionally, the thickness of the rigid board is not greater than 5 cm.

[0020] Optionally, the extended length of the flexible board is not greater than 30 cm.

[0021] Optionally, the subsystem includes an energy subsystem, a satellite operation and management subsystem, a payload subsystem, and an attitude and orbit control subsystem.

[0022] To solve the above technical problems, the present application provides a satellite, which includes: a plurality of subsystems for implementing multiple functions; and the above-mentioned rigid-flexible combination board for connecting each subsystem.

[0023] Optionally, in the above satellite, the satellite is a flat-panel satellite, and the width direction of the rigid-flexible combination board is parallel to the thickness direction of the satellite.

[0024] To solve the above technical problems, the present application provides a satellite system, which includes: multiple satellites as described above, and the satellites are suitable for communication connection.

[0025] To solve the above technical problems, the present application provides a satellite manufacturing method, which includes: designing and manufacturing a rigid-flexible printed circuit board and a housing according to the functional requirements of the satellite. The rigid-flexible printed circuit board includes a rigid board and multiple flexible boards. The rigid board contains signal transmission lines, and one end of each flexible board is electrically connected to the rigid board respectively; fixedly connecting the rigid board to the housing; fixing each subsystem of the satellite at the corresponding preset positions on the housing respectively; and electrically connecting each flexible board to the corresponding subsystem respectively.

[0026] Compared with the prior art, the present application has the following advantages: By electrically connecting each flexible board electrically connected to a rigid board to each subsystem of the satellite, data interaction between each subsystem inside the satellite is realized, and the complicated data cables in the prior art can be integrated, achieving a more concise and effective space layout inside the satellite; The function expansion of the satellite is realized through the connectors provided on the rigid board, ensuring that the connection cables of all devices that need to interact inside the satellite are aggregated on a single rigid-flexible printed circuit board; The settings of the metallized mounting holes, anti-wear layer, and gridless printed lines can effectively prevent the rigid-flexible printed circuit board from being damaged during the automated assembly process, thereby improving the finished product quality of the rigid-flexible printed circuit board; By limiting the length, width, and thickness of the rigid board, as well as the extension length of the flexible board, the internal space layout of the satellite can be further optimized, thereby optimizing the overall size of the satellite; By setting the width direction of the rigid-flexible printed circuit board installed in the flat satellite to be parallel to the thickness direction of the flat satellite, the space inside the flat satellite can be fully utilized, avoiding the occupation of space by messy data cables, and effectively reducing the overall size of the flat satellite. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] The accompanying drawings are provided to further understand the present application. They are incorporated and constitute a part of the present application. The accompanying drawings illustrate embodiments of the present application and, together with this specification, serve to explain the principles of the present application. In the accompanying drawings:

[0028] Figure 1 is a schematic diagram of a rigid-flexible printed circuit board according to an embodiment of the present application;

[0029] Figure 2 is a side view of the rigid-flexible printed circuit board in the installed state according to an embodiment of the present application;

[0030] Figure 3 is a schematic diagram of the subsystems and the rigid-flexible printed circuit board in a satellite according to an embodiment of the present application; and

[0031] Figure 4 is a flowchart of the satellite manufacturing method according to an embodiment of the present application. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0032] To more clearly illustrate the technical solutions of the embodiments of the present application, the following will briefly introduce the drawings required for the description of the embodiments. Obviously, the drawings in the following description are only some examples or embodiments of the present application. For those of ordinary skill in the art, without creative efforts, the present application can also be applied to other similar scenarios based on these drawings. Unless obvious from the language context or otherwise stated, the same reference numerals in the drawings represent the same structure or operation.

[0033] As shown in the present application and the claims, unless the context clearly indicates an exception, words such as "a", "an", "one", and / or "the" are not specifically singular and may also include the plural. Generally speaking, the terms "comprising" and "including" only indicate the inclusion of the clearly identified steps and elements, and these steps and elements do not constitute an exclusive list. The method or device may also include other steps or elements.

[0034] Unless otherwise specifically stated, the relative arrangements, numerical expressions, and numerical values of the components and steps described in these embodiments do not limit the scope of the present application. At the same time, it should be understood that for the sake of convenience of description, the sizes of the various parts shown in the drawings are not drawn in actual proportional relationships. Technologies, methods, and devices known to those of ordinary skill in the relevant fields may not be discussed in detail, but in appropriate cases, the said technologies, methods, and devices should be regarded as part of the authorization specification. In all the examples shown and discussed here, any specific value should be interpreted as merely exemplary and not as a limitation. Therefore, other examples of the exemplary embodiments may have different values. It should be noted that similar reference numerals and letters represent similar items in the following drawings. Therefore, once an item is defined in one drawing, it does not need to be further discussed in subsequent drawings.

[0035] In the description of the present application, it should be understood that the orientation or positional relationships indicated by orientation words such as "front, back, up, down, left, right", "horizontal, vertical, perpendicular, horizontal", and "top, bottom" are usually based on the orientation or positional relationships shown in the drawings. It is only for the convenience of describing the present application and simplifying the description. Without contrary instructions, these orientation words do not indicate and imply that the device or element referred to must have a specific orientation or be constructed and operated in a specific orientation. Therefore, it cannot be understood as a limitation on the protection scope of the present application; the orientation words "inside, outside" refer to the inside and outside relative to the contour of each component itself.

[0036] For ease of description, spatial relative terms, such as "above", "over", "on the upper surface", "upper", etc., may be used herein to describe the spatial positional relationship of one device or feature to other devices or features as shown in the figures. It should be understood that the spatial relative terms are intended to encompass different orientations in use or operation in addition to the orientation depicted in the figures. For example, if the device in the figures is inverted, a device described as "above" or "over" another device or structure will then be positioned "below" or "under" the other device or structure. Thus, the exemplary term "above" can include both orientations of "above" and "below". The device may also be positioned in other different ways (rotated 90 degrees or in other orientations), and the corresponding explanations will be made for the spatial relative descriptions used herein.

[0037] In addition, it should be noted that the use of terms such as "first", "second", etc. to limit components is only for the convenience of distinguishing the corresponding components. Without additional statements, the above terms have no special meanings, and thus should not be construed as limiting the scope of protection of this application. In addition, although the terms used in this application are selected from well-known and commonly used terms, some of the terms mentioned in the specification of this application may be selected by the applicant according to his or her judgment, and their detailed meanings are described in the relevant parts of this description. In addition, it is required to understand this application not only through the actual terms used, but also through the meanings implied by each term.

[0038] It should be understood that when a component is referred to as "on another component", "connected to another component", "coupled to another component", or "in contact with another component", it can be directly on, connected to, or coupled to, or in contact with the other component, or there may be an intervening component. In contrast, when a component is referred to as "directly on another component", "directly connected to", "directly coupled to", or "directly in contact with" another component, there is no intervening component. Similarly, when the first component is referred to as "electrically in contact with" or "electrically coupled to" the second component, there is an electrical path allowing current to flow between the first component and the second component. The electrical path may include capacitors, coupled inductors, and / or other components allowing current to flow, even if there is no direct contact between the conductive components.

[0039] Flowcharts are used in this application to illustrate the operations performed by the systems according to the embodiments of this application. It should be understood that the operations before or below do not necessarily have to be executed precisely in sequence. Instead, various steps can be executed in reverse order or simultaneously. Also, other operations may be added to these processes, or one or more steps may be removed from these processes.

[0040] This application refers to Figures 1 to 2 and presents a schematic structural diagram of a rigid-flex printed circuit board 10, which is suitable for connecting each subsystem in a satellite to achieve information interaction between each subsystem. Preferably, the subsystems include an energy subsystem, an on-board management and control subsystem, a payload subsystem, and an attitude and orbit control subsystem. It should be noted that both the manufacturing of the rigid-flex printed circuit board 10 and the installation of the rigid-flex printed circuit board 10 adopt an automated production line and / or industrial robots, so as to be able to mass-produce the rigid-flex printed circuit board 10 and the satellite equipped with the rigid-flex printed circuit board 10 quickly and on a large scale. For example, in the "Thousands of Sails Constellation" plan, more than 500 satellites for networking need to be launched within one year, and such satellites can adopt the rigid-flex printed circuit board 10 to achieve efficient mass production.

[0041] First, refer to Figure 1 , the rigid-flex printed circuit board 10 includes a rigid board 11 containing signal transmission lines, multiple flexible boards 12, and multiple connectors 13. Preferably, the rigid board 11 is provided with metallized mounting holes (not shown in the figure) for fixedly connecting the rigid-flex printed circuit board 10 to the satellite housing. The metallized mounting holes can avoid scratching and wearing the rigid board 11 by screws during the automated assembly process, thereby improving the finished product quality of the automated assembly.

[0042] Preferably, the length of the rigid board 11 along the a-a' extension direction is set according to the positions of each subsystem. Preferably, the length range of the rigid board 11 is set to be 1 meter - 1.5 meters. Preferably, when the satellite is a flat-panel satellite, the width of the rigid board 11 along the b-b' extension direction is set according to the thickness of the satellite. Preferably, the width range of the rigid board 11 is 20 cm - 40 cm. Preferably, the thickness of the rigid board 11 along the c-c' extension direction is not greater than 5 cm. Exemplarily, for the networking satellite in the "Thousands of Sails Constellation" plan, which is a flat-panel satellite, the length of the rigid-flex printed circuit board 10 is 1.1 meters, the width is 28 cm, and the thickness is 3.4 cm, so as to further optimize the overall size of the networking satellite, and then be able to achieve multiple satellites in one launch by stacking the networking satellites, such as 18 satellites in one launch.

[0043] Continue to refer to Figure 1, one end of each flexible board 12 is electrically connected to the rigid board 11 respectively, and the other end of each flexible board 12 is electrically connected to the corresponding subsystem. The flexible board 12 includes at least one plug 121 and a flexible area 122 arranged at the other end (i.e., the end electrically connected to the subsystem). Each plug 121 is used to interact with the information data corresponding to one function of the subsystem. Preferably, the signal wiring of the flexible board 12 includes differential signal wiring. Specifically, the differential signal wiring is routed with equal length, equal width, and equal spacing. Among them, the positive and negative signals of the same signal are distributed on the same layer of the flexible board 12, or the adjacent layers of the same flexible board 12 use ground signal copper plating as the characteristic impedance reference plane, or the positive and negative signals of the same signal are distributed on the same layer of the flexible board 12 and the adjacent layers of the same flexible board 12 use ground signal copper plating as the characteristic impedance reference plane. It should be noted that in this embodiment, the characteristic impedance of the flexible board 12 for CANA and CANB signals is designed according to 120Ω±10%, and the characteristic impedance of the remaining signals is designed according to 100Ω±10%. Preferably, the material of the flexible board 12 includes polyimide material (Polyimide, PI), so that the flexible board 12 can be bent arbitrarily. For example, referring to Figure 2 , Figure 2 exemplarily shows the position state when the flexible board 12 is connected to the subsystem. As Figure 2 shown, multiple flexible boards 12 are respectively unfolded along the c-c' extension direction, that is, the thickness direction of the rigid board 11, so as to realize the electrical connection to the subsystems scattered around the rigid board 11.

[0044] Preferably, the top layer and the bottom layer of the flexible area 122 of the flexible board 12 are respectively covered with an anti-wear layer. This anti-wear layer can prevent the flexible board 12 from being worn during the automatic assembly process or being scratched by parts or installation instruments during the installation process, effectively improving the yield rate of the rigid-flex board 10 and its satellite. It should be noted that in this embodiment, the flexible area 122 of the flexible board 12 is the area where the flexible board can be bent arbitrarily. For example, in one embodiment, the flexible area 122 can be all areas of the flexible board 12 except the plug 121.

[0045] Preferably, the extension length of the flexible board 12 is not greater than 30 cm. Exemplarily, Figure 1 if the extension direction of the flexible board 12 in

[0046] Preferably, in this embodiment, each layer of the rigid board 11 has a gridless printed line with a width greater than 10 mils (mil), or each layer of the flexible board 12 has a gridless printed line with a width greater than 10 mils (mil), or both the rigid board 11 and the flexible board 12 have the above-mentioned gridless printed line design. In this way, the tear resistance of the flexible area 122 in the flexible board 12 can be improved.

[0047] Continuing to refer to Figure 1 , the connector 13 is arranged on the rigid board 11. The connector 13 is used for electrically connecting with the expansion function module of the satellite, and the expansion function module is used to implement the corresponding expansion function. It should be noted that in this embodiment, the rigid-flex board 10 corresponding to the satellite includes the connector 13. In other embodiments, when the satellite only has subsystems and does not have an expansion function module, the corresponding rigid-flex board 10 may not include the connector 13. Through the above-mentioned rigid-flex board 10, all devices that need to perform data interaction in the satellite can be connected, so as to realize the unified integration of the data cables between each device, thereby reducing the occupation of the internal space of the satellite by the data cables and further optimizing the overall structure of the satellite.

[0048] On the other hand of the present application, referring to Figure 3 A satellite 100 is also proposed. The satellite 100 includes a rigid-flex board 10 and multiple subsystems 20. The rigid-flex board 10 is used to connect each subsystem 20. Preferably, the satellite 100 is a flat satellite, and the width direction of the rigid-flex board 10, that is, the b-b' extension direction, is parallel to the thickness direction of the satellite 100. Exemplarily, if the flat surface of the flat satellite is Figure 3 the paper surface, then the rigid-flex board 10 is vertically arranged on the flat surface along the b-b' extension direction, so as to reduce the occupied space of the rigid-flex board 10 inside the satellite and further compact the overall size of the satellite. It should be noted that the other settings of the subsystem 20 and the rigid-flex board 10 can refer to the specific content of the above embodiment and will not be repeated here. In addition, Figure 3 only four subsystems 20 and their respective layouts on both sides of the rigid-flex board 10 are shown exemplarily, so as to improve the utilization rate of the rigid-flex board 10 and the utilization rate of the internal space of the satellite, but it does not limit other layout methods of the subsystem 20. For example, the subsystem 20 is only arranged on one side of the rigid-flex board 10, etc.

[0049] On the other hand of the present application, referring to Figure 4A satellite manufacturing method 200 is also proposed. The satellite manufacturing method 200 includes the following steps. Step S1 is to design and manufacture a rigid-flexible printed circuit board 10 and a housing according to the functional requirements of the satellite 100. Step S2 is to fixedly connect the rigid board 11 to the housing. Step S3 is to respectively fix each subsystem 20 of the satellite 100 at corresponding preset positions on the housing. Step S4 is to electrically connect each flexible board 12 to the corresponding subsystem 20. It should be noted that the satellite manufacturing method 200 adopts automated assembly and manufacturing means. Combining the various settings described above, it can significantly improve the quality of the rigid-flexible printed circuit board 10. Therefore, there is no need to frequently conduct quality inspections (or even no need for quality inspections) on the rigid-flexible printed circuit board 10 during the manufacturing process, thereby greatly improving the manufacturing efficiency of the rigid-flexible printed circuit board 10. In addition, when performing performance tests on the assembled satellite 100, if there are performance problems related to the rigid-flexible printed circuit board 10, the original rigid-flexible printed circuit board 10 is directly removed from the satellite 100 and replaced with a new one for performance testing, without the need to conduct fault analysis on the original rigid-flexible printed circuit board 10, thereby accelerating the mass production of the satellite 100.

[0050] On the other hand, the present application also proposes a satellite system. The satellite system includes multiple satellites 100, and the satellites 100 are adapted to be communicatively connected. Since the satellite system uses the rigid-flexible printed circuit board proposed in the present application for satellite design, it has the advantages of the above-described embodiments and will not be elaborated herein.

[0051] The basic concepts have been described above. Obviously, for those skilled in the art, the above application disclosure is only an example and does not constitute a limitation to the present application. Although not explicitly stated herein, those skilled in the art may make various modifications, improvements, and corrections to the present application. Such modifications, improvements, and corrections are proposed in the present application, so such modifications, improvements, and corrections still fall within the spirit and scope of the exemplary embodiments of the present application.

[0052] At the same time, the present application uses specific terms to describe the embodiments of the present application. Such as "one embodiment", "an embodiment", and / or "some embodiments" mean a certain feature, structure, or characteristic related to at least one embodiment of the present application. Therefore, it should be emphasized and noted that the "one embodiment" or "an embodiment" or "an alternative embodiment" mentioned twice or more at different positions in this specification does not necessarily refer to the same embodiment. In addition, certain features, structures, or characteristics in one or more embodiments of the present application can be appropriately combined.

[0053] Similarly, it should be noted that, in order to simplify the description disclosed in this application and thus help the understanding of one or more embodiments of the application, in the foregoing description of the embodiments of this application, multiple features are sometimes grouped into one embodiment, drawing or description thereof. However, this disclosure method does not mean that the features required by the object of this application are more than those mentioned in the claims. In fact, the features of the embodiments are fewer than all the features of the individual embodiments disclosed above.

[0054] In some embodiments, numbers are used to describe components and the quantity of attributes. It should be understood that such numbers used for the description of embodiments are modified by the modifiers "about", "approximate" or "substantially" in some examples. Unless otherwise specified, "about", "approximate" or "substantially" indicate that the said numbers allow a variation of ±20%. Accordingly, in some embodiments, the numerical parameters used in the specification and claims are approximate values, and such approximate values may change according to the characteristics required by individual embodiments. In some embodiments, the numerical parameters should consider the specified significant digits and adopt the method of retaining the general number of digits. Although the numerical ranges and parameters used in some embodiments of this application to confirm the breadth of their scope are approximate values, in specific embodiments, the setting of such numerical values is as precise as possible within the feasible range.

[0055] Although this application has been described with reference to the current specific embodiments, those of ordinary skill in the art should recognize that the above embodiments are only used to illustrate this application, and various equivalent changes or substitutions can be made without departing from the spirit of this application. Therefore, as long as the changes and modifications of the above embodiments are within the scope of the spirit of this application, they will fall within the scope of the claims of this application.

Claims

1. A rigid-flexible board, characterized in that: Suitable for connecting various subsystems in the satellite to realize information interaction between the various subsystems, the rigid-flexible board includes: a rigid board containing signal transmission lines; and A plurality of flexible boards, one end of each of the flexible boards is electrically connected to the rigid boards respectively, and the other end of each of the flexible boards is electrically connected to the corresponding subsystem.

2. The rigid-flexible board according to claim 1, characterized in that: The flexible board includes at least one plug arranged at the other end, and each of the plugs is used to exchange information data corresponding to a function of the subsystem.

3. The rigid-flexible board according to claim 2, characterized in that: The flexible plate further comprises a flexible region, and a top layer and a bottom layer of the flexible region are respectively covered with an anti-wear layer.

4. The rigid-flexible board according to claim 1, characterized in that: The satellite also includes an extended function module, and the extended function module is used to implement the corresponding extended function. The rigid-flexible board also includes at least one connector disposed on the rigid board, and the connector is used to be electrically connected to the extended function module.

5. The rigid-flexible board according to claim 1, characterized in that: The rigid board is provided with metalized mounting holes for fixedly connecting the rigid-flexible board to the shell of the satellite.

6. The rigid-flexible board according to claim 1, characterized in that: The signal wiring of the flexible board includes differential signal wiring.

7. The rigid-flexible board according to claim 6, characterized in that: The differential signal wiring is performed in accordance with equal length, equal width and equal spacing, wherein: The positive and negative signals of the same signal are distributed on the same layer of the flexible board; and / or Adjacent layers of the same flexible board use ground signal copper cladding as a characteristic impedance reference plane.

8. The rigid-flexible board according to claim 1, characterized in that: The material of the flexible board includes polyimide material.

9. The rigid-flexible board according to claim 1, characterized in that: Each edge of the rigid board has a non-grid printed line larger than 10 mil, and / or each edge of the flexible board has a non-grid printed line larger than 10 mil.

10. The rigid-flexible board according to claim 1, characterized in that: The length of the rigid plate is set according to the position of each of the subsystems.

11. The rigid-flexible board according to claim 10, characterized in that: The length ranges from 1 meter to 1.5 meters.

12. The rigid-flexible board according to claim 1, characterized in that: When the satellite is a flat-panel satellite, the width of the rigid plate is set according to the thickness of the satellite.

13. The rigid-flexible board according to claim 12, characterized in that: The width ranges from 20 cm to 40 cm.

14. The rigid-flexible board according to claim 1, characterized in that: The thickness of the rigid plate is not greater than 5 cm.

15. The rigid-flexible board according to claim 1, characterized in that: The extension length of the flexible board is no more than 30 cm.

16. The rigid-flexible board according to claim 1, characterized in that: The subsystems include an energy subsystem, a satellite service subsystem, a payload subsystem and an attitude and orbit control subsystem.

17. A satellite, characterized in that: The satellites include: Multiple subsystems to achieve multiple functions; and The rigid-flexible board as described in any one of claims 1 to 16 is used to connect the various subsystems.

18. The satellite according to claim 17, characterized in that The satellite is a flat-panel satellite, and the width direction of the rigid-flexible board is parallel to the thickness direction of the satellite.

19. A satellite system, characterized in that: The satellite system comprises: A plurality of satellites as claimed in any one of claims 17 to 18, wherein the satellites are adapted to be communicatively connected with each other.

20. A satellite manufacturing method, characterized in that: The method comprises: Design and manufacture a rigid-flexible board and a shell according to the functional requirements of the satellite, wherein the rigid-flexible board includes a rigid board and a plurality of flexible boards, the rigid board includes a signal transmission line, and one end of each of the flexible boards is electrically connected to the rigid board; The rigid plate is fixedly connected to the housing; Fixing each subsystem of the satellite at a corresponding preset position of the shell; Each of the flexible boards is electrically connected to the corresponding subsystem.

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