Device assembly, preparation method thereof, circuit module and electronic equipment

Abstract

The invention relates to a device assembly, a preparation method thereof, a circuit module and electronic equipment. The device assembly comprises a substrate which is provided with a first surface and a second surface which are arranged oppositely, and the substrate is provided with an air hole penetrating through the first surface and the second surface; the component is arranged on the first surface and is provided with a third surface opposite to the first surface and a fourth surface facing the first surface; the electromagnetic shielding layer covers the third surface and the side peripheral surface of the component, and the electromagnetic shielding layer is filled between the fourth surface and the first surface along the periphery of the component so as to seal the gap between the fourth surface and the first surface; the air holes are located in the space closed by the electromagnetic shielding layer on the first surface. The device assembly can be arranged in a narrow area on a circuit board and realizes a good electromagnetic shielding effect.

Description

Technical Field

[0001] The present application relates to the technical field of electromagnetic shielding, and particularly relates to a device component, a preparation method thereof, a circuit module, and an electronic device. Background Art

[0002] With the rapid development of electronic devices such as smart phones, tablet computers, and e-readers, the functions integrated in electronic devices are increasing, and the number of electronic components accommodated inside is also increasing. To adapt to the spatial layout of different electronic components, the circuit boards in electronic devices are often cut and separated into fragments, and in order to improve the area utilization rate of the circuit board, components are usually also arranged in the narrow areas where the circuit board is cut. To prevent the electromagnetic radiation generated by the components from spreading outwards, or to prevent the components from being interfered by electromagnetic radiation, it is usually necessary to perform electromagnetic shielding on the components. However, the traditional electromagnetic shielding method is not applicable to the components arranged in narrow areas, resulting in difficulties in setting up electromagnetic shielding. Summary of the Invention

[0003] Embodiments of the present application provide a device component, a preparation method thereof, a circuit module, and an electronic device to solve the problem that the traditional electromagnetic shielding method is not applicable to the components arranged in narrow areas.

[0004] A device component includes:

[0005] A substrate having a first surface and a second surface arranged opposite to each other, and ventilation holes penetrating the first surface and the second surface are provided on the substrate;

[0006] A component is arranged on the first surface and has a third surface facing away from the first surface and a fourth surface facing the first surface; and,

[0007] An electromagnetic shielding layer covers the third surface and the side circumferential surface of the component, and the electromagnetic shielding layer is filled between the fourth surface and the first surface along the periphery of the component to seal the gap between the fourth surface and the first surface, and the ventilation holes are located in the space enclosed by the electromagnetic shielding layer on the first surface.

[0008] A circuit module includes a circuit board and the device component as described above, the device component is arranged on the circuit board, and the second surface of the substrate faces the circuit board.

[0009] An electronic device includes a housing and the circuit module as described above, and the circuit module is arranged inside the housing.

[0010] A preparation method of a device component includes:

[0011] A substrate and components are provided. The substrate has a first surface and a second surface disposed opposite to each other. The substrate is provided with air vents penetrating through the first surface and the second surface. Device pads and ground pads are provided on the substrate. The ground pads are arranged around the device pads and the air vents and are connected end to end. The components have a third surface and a fourth surface disposed opposite to each other;

[0012] The components are disposed on the first surface such that the device pads are electrically connected to the components on the fourth surface, and such that the projection of the ground pads on the fourth surface partially falls on the fourth surface and is arranged around the periphery of the fourth surface;

[0013] An electromagnetic shielding material is disposed on the third surface and the side circumferential surface of the components to form an electromagnetic shielding layer. Among them, part of the electromagnetic shielding material enters and fills between the fourth surface and the ground pads through capillary action to seal the gap between the fourth surface and the first surface.

[0014] For the above device assembly, by disposing components on the substrate and providing an electromagnetic shielding layer on the components, compared with the method of enclosing the components by providing an electromagnetic shielding cover on the circuit board, the overall width dimension of the device assembly can be effectively reduced, enabling the device assembly to be disposed in a narrow area on the circuit board and achieving a good electromagnetic shielding effect, thereby better realizing the electromagnetic shielding setting of the components in the narrow area on the circuit board. At the same time, air vents are provided on the substrate. When the electromagnetic shielding layer is provided, due to the existence of the air vents, part of the electromagnetic shielding layer can enter and fill between the fourth surface and the first surface through capillary action to seal the gap between the fourth surface and the first surface, providing effective electromagnetic shielding protection for the gap between the components and the substrate, which is beneficial to improving the electromagnetic shielding effect of the device assembly. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the prior art, the following will briefly introduce the drawings required for the description of the embodiments or the prior art. Obviously, the drawings in the following description are only some embodiments of the present application. For those of ordinary skill in the art, without creative efforts, other drawings can also be obtained based on these drawings.

[0016] Figure 1 It is a schematic structural diagram of an electronic device in some embodiments.

[0017] Figure 2 It is a schematic structural diagram of a circuit module in some embodiments.

[0018] Figure 3 It is a schematic cross-sectional view of a circuit module in some embodiments.

[0019] Figure 4 It is a schematic structural diagram of device components in some embodiments.

[0020] Figure 5 It is a schematic cross-sectional diagram of device components in some embodiments.

[0021] Figure 6 It is a schematic structural diagram of components on a substrate in some embodiments.

[0022] Figure 7 It is a schematic cross-sectional diagram of components on a substrate in some embodiments.

[0023] Figure 8 It is a schematic structural diagram of a device component with signal vias in some embodiments.

[0024] Figure 9 It is a schematic structural diagram of a substrate in some embodiments.

[0025] Figure 10 It is a schematic structural diagram of a circuit board in some embodiments.

[0026] Figure 11 It is a schematic structural diagram of multiple substrates connected by connecting ribs in some embodiments.

[0027] Figure 12 It is a schematic structural diagram of other components of an electronic device in some embodiments.

[0028] Reference numerals:

[0029] 10, electronic device; 11, housing; 111, back panel; 112, middle frame; 20, circuit module; 21, circuit board; 22, signal pad; 23, electromagnetic shielding pad; 30, device component; 31, substrate; 311, first surface; 312, second surface; 313, ventilation hole; 314, signal via; 315, ground via; 32, component; 321, third surface; 322, fourth surface; 33, electromagnetic shielding layer; 34, device pad; 35, conductive structure; 36, ground pad; 37, electromagnetic shielding structure; 41, connecting rib. Detailed implementation manners

[0030] To facilitate the understanding of the present application, the present application will be described more comprehensively below with reference to the relevant drawings. Preferred embodiments of the present application are shown in the drawings. However, the present application can be implemented in many different forms and is not limited to the embodiments described herein. On the contrary, these embodiments are provided to make the understanding of the disclosure of the present application more thorough and comprehensive.

[0031] "Electronic device" as used herein refers to a device capable of receiving and / or transmitting communication signals, including but not limited to those connected via any one or more of the following connection methods:

[0032] (1) Via wired connection methods, such as via the Public Switched Telephone Networks (PSTN), Digital Subscriber Line (DSL), digital cable, direct cable connection;

[0033] (2) Via wireless interface methods, such as cellular networks, Wireless Local Area Network (WLAN), digital television networks such as DVB-H networks, satellite networks, AM-FM broadcast transmitters.

[0034] An electronic device configured to communicate via a wireless interface may be referred to as a "mobile terminal". Examples of mobile terminals include but are not limited to the following electronic devices:

[0035] (1) Satellite phones or cellular phones;

[0036] (2) Personal Communications System (PCS) terminals that can combine cellular radiotelephone with data processing, fax, and data communication capabilities;

[0037] (3) Radiotelephones, pagers, Internet / intranet access, web browsers, notebooks, calendars, personal digital assistants (PDAs) equipped with a Global Positioning System (GPS) receiver;

[0038] (4) Conventional laptop and / or palm-top receivers;

[0039] (5) Conventional laptop and / or palm-top radiotelephone transceivers, etc.

[0040] Please refer to Figure 1 , Figure 2 and Figure 3 as shown, Figure 1 which is a schematic structural diagram of the electronic device 10 in some embodiments, Figure 2 and which is a schematic structural diagram of the circuit module 20 in some embodiments, Figure 3It is a schematic cross-sectional view of the circuit module 20 in some embodiments. The electronic device 10 provided in this application includes, but is not limited to, smartphones, tablets, e-readers, etc. The electronic device 10 includes a housing 11 and a circuit module 20, and the circuit module 20 is disposed within the housing 11. For example, the housing 11 includes a back plate 111 and a middle frame 112. The electronic device 10 further includes a display screen (not shown in the figure). The back plate 111 covers one side of the middle frame 112, the display screen covers the other side of the middle frame 112, and the circuit module 20 is disposed within the accommodation space jointly enclosed by the back plate 111, the middle frame 112, and the display screen. The circuit module 20 includes a circuit board 21 and a device component 30 disposed on the circuit board 21. The circuit board 21 includes, but is not limited to, a printed circuit board (PCB). The circuit board 21 can be the main board of the electronic device 10 or a printed circuit board specifically used for arranging the device component 30 in the electronic device 10.

[0041] The device component 30 includes a substrate 31, components 32 disposed on the substrate 31, and an electromagnetic shielding layer 33 covering at least a part of the components 32. The substrate 31 is disposed on the circuit board 21. The substrate 31 includes, but is not limited to, a printed circuit board, and is used for arranging the components 32 and realizing the electrical connection between the components 32 and the circuit board 21. The electromagnetic shielding layer 33 is used to provide an electromagnetic shielding effect for the components 32, preventing the radiation generated by the components 32 from spreading outwards and damaging other components in the circuit module 20 or the electronic device 10, or preventing the radiation outside the device component 30 from spreading to the components 32 and causing damage to the components 32. The components 32 include, but are not limited to, any applicable components that need to be provided with electromagnetic shielding in the circuit module 20, such as a processor, a baseband chip, a radio frequency chip, a storage chip, a power management chip, a crystal oscillator, an inductive element, etc.

[0042] In some embodiments, the substrate 31 has a first surface 311 and a second surface 312 which are opposite to each other, and the second surface 312 of the substrate 31 faces the circuit board 21. The device assembly 30 includes device pads 34 provided on the first surface 311. The components 32 are arranged on the device pads 34 by SMT (Surface - Mount Technology) patching and are electrically connected to the device pads 34. The components 32 and the device pads 34 can be interconnected and electrically connected through solder paste. The substrate 31 also has signal vias 314 penetrating the first surface 311 and the second surface 312. The signal vias 314 are opposite to the device pads 34. The device assembly 30 further includes a conductive structure 35 provided in the signal vias 314. The conductive structure 35 is electrically connected to the device pads 34 on the first surface 311 and extends to the second surface 312 for electrically conducting the components 32 to the side of the second surface 312. The conductive structure 35 can be any suitable conductive material such as metal filled in the signal vias 314, or a conductive material such as a copper layer plated on the side walls of the signal vias 314. The conductive structure 35 can partially protrude from the second surface 312 and be connected to the device pads 34 on the first surface 311. The conductive structure 35 and the device pads 34 can be an integral structure. The circuit module 20 further includes signal pads 22 provided on the circuit board 21. The materials of the signal pads 22 and the device pads 34 can be any suitable conductive material such as copper. When the device assembly 30 is arranged on the circuit board 21, the part of the conductive structure 35 protruding from the second surface 312 can be connected to the signal pads 22 through solder paste to establish an electrical connection. It can be understood that the components 32 are electrically connected to the circuit board 21 through the device pads 34, the conductive structure 35, and the signal pads 22 in sequence, so as to be electrically connected to other components on the circuit board 21 or other components on the electronic device 10, realizing power supply and control of the components 32.

[0043] In some embodiments, a plurality of device assemblies 30 can be provided on the circuit board 21. The types of the components 32 in each device assembly 30 can be the same or different. Other components can also be provided on the circuit board 21, which can be specifically set according to the functional requirements of the circuit module 20 and are not limited in this application. In some embodiments, there can also be a plurality of device pads 34. The number and arrangement rules of the device pads 34 are not limited. For example, they can be arranged to adapt to the pins of the components 32 as long as the electrical connection requirements of the components 32 can be met. Correspondingly, there can also be a plurality of signal vias 314, conductive structures 35, and signal pads 22. The signal vias 314, conductive structures 35, signal pads 22 and the device pads 34 are in one - to - one correspondence.

[0044] Further, in some embodiments, the substrate 31 is further provided with air vents 313 penetrating through the first surface 311 and the second surface 312. The component 32 has a third surface 321 facing away from the first surface 311, a fourth surface 322 facing the first surface 311, and a side peripheral surface located between the third surface 321 and the fourth surface 322. The electromagnetic shielding layer 33 covers the third surface 321 and the side peripheral surface of the component 32, and the electromagnetic shielding layer 33 is filled between the fourth surface 322 and the first surface 311 along the periphery of the component 32 to enclose the gap between the fourth surface 322 and the first surface 311. The air vents 313 are located within the space enclosed by the electromagnetic shielding layer 33 on the first surface 311.

[0045] For the above device assembly 30, by disposing the component 32 on the substrate 31 and providing the electromagnetic shielding layer 33 on the component 32, compared with the method of enclosing the component 32 by providing an electromagnetic shielding cover on the circuit board 21, the overall width dimension of the device assembly 30 can be effectively reduced, so that the device assembly 30 can be disposed in a narrow area on the circuit board 21 and achieve a good electromagnetic shielding effect, thereby better realizing the electromagnetic shielding setting of the component 32 in the narrow area on the circuit board 21. For example, referring to Figure 2 As shown, when the circuit board 21 needs to be divided into multiple connected narrow parts to adapt to the layout of the camera or other components in the electronic device 10, by adopting the above device assembly 30, while realizing electromagnetic shielding for the component 32, the overall width dimension of the device assembly 30 can be effectively reduced, so that the device assembly 30 can be disposed on the narrow part of the circuit board 21, avoiding the situation that the traditional electromagnetic shielding cover needs to reserve too much space on the peripheral side of the component 32 and thus cannot be installed in the narrow area of the circuit board 21.

[0046] Meanwhile, by providing the air vents 313 on the substrate 31, when the electromagnetic shielding layer 33 is provided, due to the existence of the air vents 313, the cavity formed by the air vents 313, the fourth surface 322 and the first surface 311 can generate a capillary action, and part of the electromagnetic shielding layer 33 can enter and fill between the fourth surface 322 and the first surface 311 by means of the capillary action to enclose the gap between the fourth surface 322 and the first surface 311, providing effective electromagnetic shielding protection for the gap between the component 32 and the substrate 31, thereby being beneficial to improving the electromagnetic shielding effect of the device assembly 30. For example, the above electromagnetic shielding layer 33 can achieve a good shielding effect on signals within 30G, and the shielding efficiency exceeds 80db. In addition, the setting of driving part of the electromagnetic shielding layer 33 to enclose the gap between the fourth surface 322 and the first surface 311 by means of the capillary action generated by the ventilation holes is also beneficial to simplifying the manufacturing process of the device assembly 30 and reducing the manufacturing cost.

[0047] Combined with Figure 4 、Figure 5 , Figure 6 and Figure 7 As shown in Figure 5 , Figure 6 , and Figure 7 , in some embodiments, the device component 30 further includes a ground pad 36 disposed on the first surface 311. The material and setting process of the ground pad 36 can be the same as those of the device pad 34 to simplify the preparation process of the device component 30. The ground pad 36 is arranged around the device pad 34 and the ventilation hole 313 and is connected end to end. For example, the ground pad 36 is generally in any applicable shape such as a ring or a square arranged around the device pad 34. The orthographic projection of the ground pad 36 on the fourth surface 322 at least partially falls on the fourth surface 322 and is arranged around the periphery of the fourth surface 322. The electromagnetic shielding layer 33 located between the fourth surface 322 and the first surface 311 is partially filled between the fourth surface 322 and the ground pad 36. The ventilation hole 313 is located within the area surrounded by the ground pad 36 on the first surface 311, and the ventilation hole 313 communicates with the gap between the fourth surface 322 and the ground pad 36.

[0048] Setting the ground pad 36 can reduce the gap between the periphery of the fourth surface 322 and the first surface 311. For example, the gap between the periphery of the fourth surface 322 and the ground pad 36 is approximately equal to the height of the solder paste between the component 32 and the device pad 34, which is beneficial to enhancing the capillary action between the periphery of the fourth surface 322 and the ground pad 36, enabling the electromagnetic shielding layer 33 to fully enter and fill between the fourth surface 322 and the ground pad 36, and improving the electromagnetic shielding function for the component 32. At the same time, referring to the principle of the Faraday cage, the ground pad 36 can also play an electromagnetic shielding role around the device pad 34, further improving the electromagnetic shielding effect between the fourth surface 322 and the first surface 311.

[0049] In some embodiments, the radial dimension of the ventilation hole 313 is greater than or equal to 0.5 mm to improve the communication effect between the ventilation hole 313 and the outside of the device component 30 through the gap between the fourth surface 322 and the ground pad 36, facilitating the smooth formation of capillary action to drive the electromagnetic shielding layer 33 to fill between the fourth surface 322 and the ground pad 36. In some embodiments, the thickness of the substrate 31 is less than or equal to 0.5 mm, for example, it can be 0.3 mm, to reduce the occupied space of the device component 30 while effectively carrying the component 32.

[0050] In some embodiments, the orthographic projection of a part of the ground pad 36 on the fourth surface 322 is located outside the fourth surface 322 and is arranged around the component 32 along the circumferential side. The electromagnetic shielding layer 33 covers the side of the ground pad 36 facing away from the first surface 311. Setting the ground pad 36 to extend outward to the component 32 can provide a larger coverage area for the electromagnetic shielding layer 33, increase the thickness of the part of the electromagnetic shielding layer 33 close to the ground pad 36, and cooperate with the larger width of the ground pad 36, which is beneficial to enhancing the electromagnetic shielding effect for the component 32.

[0051] In some embodiments, the width of at least a part of the electromagnetic shielding layer 33 located on the peripheral side of the component 32 gradually decreases in the direction from the substrate 31 to the component 32. With such a setting, it is beneficial to adapt to the setting process of the electromagnetic shielding layer 33, save the material used for the electromagnetic shielding layer 33, and at the same time make the part of the electromagnetic shielding layer 33 close to the substrate 31 have a sufficient width to enhance the electromagnetic shielding effect between the fourth surface 322 and the first surface 311.

[0052] In some embodiments, the width of the ground pad 36 is greater than or equal to 0.4 mm. By increasing the width of the ground pad 36 and the coverage area of the electromagnetic shielding layer 33 on the ground pad 36, it is beneficial to enhance the gap closing effect of the electromagnetic shielding layer 33 and the ground pad 36 between the fourth surface 322 and the first surface 311, and improve the electromagnetic shielding effect on the component 32. In some embodiments, the width of the part of the ground pad 36 located outside the fourth surface 322 in the orthographic projection on the fourth surface 322 is less than or equal to 0.2 mm, for example, 0.2 mm or 0.1 mm. While ensuring the electromagnetic shielding effect, the width of the ground pad 36 extending out of the component 32 is reduced, which is beneficial to reducing the overall width dimension of the device assembly 30, so that the device assembly 30 can adapt to the installation in the narrow area of the circuit board 21.

[0053] In some embodiments, the ground pad 36 is arranged around the periphery of the first surface 311, and the outer peripheral side surface of the ground pad 36 is flush with the side surface of the substrate 31. That is to say, the difference between the width dimensions of the substrate 31 and the component 32 is equal to the width of the part of the ground pad 36 located outside the component 32. While enabling the substrate 31 to effectively install the component 32, the ground pad 36 and the electromagnetic shielding layer 33, it is also beneficial to reduce the overall width of the device assembly 30. For example, the difference between the overall width of the device assembly 30 and the width of the component 32 is less than or equal to 0.2 mm. Compared with the conventional setting of an electromagnetic shielding cover for electromagnetic shielding of the component 32, when the electromagnetic shielding cover usually has a reserved dimension of more than 1.4 mm wider than the width of the component 32 at the outer peripheral edge, the device assembly 30 can adapt to the installation in the narrow area of the circuit board 21.

[0054] Reference Figure 8 and Figure 9As shown, in some embodiments, the substrate 31 is further provided with a plurality of ground vias 315 penetrating through the first surface 311 and the second surface 312. The plurality of ground vias 315 are arranged around the signal via 314 and are spaced apart from each other in sequence. The substrate 31 further includes an electromagnetic shielding structure 37 disposed within the ground vias 315. By arranging a plurality of ground vias 315 and an electromagnetic shielding structure 37 around the signal via 314, referring to the principle of Faraday cage, the ground vias 315 and the electromagnetic shielding structure 37 can play an electromagnetic shielding role around the signal via 314, which can prevent the radiation generated by the conductive structure 35 from spreading outwards, and is beneficial to improving the electromagnetic shielding effect of the device assembly 30. The material of the electromagnetic shielding structure 37 includes, but is not limited to, any suitable conductive material such as copper, as long as it can play an electromagnetic shielding role according to the principle of Faraday cage. The signal via 314 and the ground vias 315 can be fabricated by the same process. The material of the electromagnetic shielding structure 37 can be the same as that of the conductive structure 35 and can be fabricated by the same process, which is beneficial to simplifying the manufacturing process of the device assembly 30 and reducing the manufacturing cost.

[0055] Combined with Figure 3 and Figure 10 As shown, in some embodiments, the circuit module 20 further includes a plurality of electromagnetic shielding pads 23 disposed on the circuit board 21. The plurality of electromagnetic shielding pads 23 are arranged around the signal pad 22 and are spaced apart from each other in sequence. The material of the electromagnetic shielding pads 23 includes, but is not limited to, any suitable conductive material such as copper. The electromagnetic shielding pads 23 can be made of the same material as the signal pads 22 and fabricated by the same process to simplify the manufacturing process. Referring to the principle of Faraday cage, by arranging a plurality of electromagnetic shielding pads 23 around the signal pad 22, an electromagnetic shielding effect can be provided for the signal pad 22 to prevent the radiation generated between the substrate 31 and the circuit board 21 from spreading outwards, which is beneficial to improving the electromagnetic shielding effect of the circuit module 20. In some embodiments, the electromagnetic shielding pads 23 and the electromagnetic shielding structure 37 are connected to each other or form an integral structure in a one-to-one correspondence, which can cooperate with each other to provide a stronger electromagnetic shielding effect. It should be noted that the number and arrangement rules of the ground vias 315 and the electromagnetic shielding pads 23 are not limited, as long as the electromagnetic shielding effect can be achieved according to the principle of Faraday cage. In Figure 10 the embodiment shown, there are four electromagnetic shielding pads 23, and each electromagnetic shielding pad 23 is strip-shaped. The four electromagnetic shielding pads 23 are disposed around the signal pad 22 in a one-to-one correspondence.

[0056] It should be noted that in the embodiments shown in the various drawings of the present application, each device component 30 is provided with only one component 32. In some other embodiments, the device component 30 may also include a plurality of components 32, and the plurality of components 32 are arranged on the first surface 311 at intervals. Correspondingly, the device component 30 may be provided with a plurality of electromagnetic shielding layers 33, and the electromagnetic shielding layers 33 respectively cover the third surface 321 and the side circumferential surface of the component 32, and are filled between the fourth surface 322 and the first surface 311 along the periphery of the corresponding component 32. It can be understood that when the device component 30 is provided with a plurality of components 32, the difference between the maximum width of the entire device component 30 and the width of the component 32 with the largest width is less than or equal to 0.2 mm. For example, the maximum width of the entire device component 30 is only 0.1 mm or 0.2 mm larger than the width of the component 32 with the largest width, which can also effectively reduce the width dimension of the device component 30, so as to adapt to the installation in a narrow area on the circuit board 21.

[0057] In some embodiments, the present application further provides a method for manufacturing a device component 30, which can be used to manufacture the device component 30 as described in any of the above embodiments. The method for manufacturing the device component 30 includes:

[0058] Referring to Figure 6 and Figure 7 As shown, a substrate 31 and a component 32 are provided. The substrate 31 is provided with a ventilation hole 313 penetrating the first surface 311 and the second surface 312. The substrate 31 is provided with a device pad 34 and a ground pad 36. The ground pad 36 is arranged around the device pad 34 and the ventilation hole 313 and is connected end to end;

[0059] The component 32 is arranged on the first surface 311, so that the device pad 34 is electrically connected to the component 32 on the fourth surface 322, and the projection of the ground pad 36 on the fourth surface 322 partially falls on the fourth surface 322 and is arranged around the periphery of the fourth surface 322;

[0060] An electromagnetic shielding material is sprayed or coated on the third surface 321 and the side circumferential surface of the component 32 to form an electromagnetic shielding layer 33. Among them, part of the electromagnetic shielding material enters and fills the gap between the fourth surface 322 and the ground pad 36 through capillary action to seal the gap between the fourth surface 322 and the first surface 311. The electromagnetic shielding material for forming the electromagnetic shielding layer 33 includes, but is not limited to, metal conductive coatings, nano-metal materials, conductive polymer materials, etc. The thickness of the sprayed or coated electromagnetic shielding material can be dozens to hundreds of micrometers. Among them, the thickness of the electromagnetic shielding material on the circumferential side of the component 32 can be greater than the thickness of the electromagnetic shielding material on the side of the third surface 321 of the component 32. The electromagnetic shielding material on the circumferential side of the component 32 presents a shape with a gradually changing thickness under the action of gravity. At the same time, since the thickness of the electromagnetic shielding material near the ground pad 36 is relatively large, it can be fully filled between the fourth surface 322 and the ground pad 36 by means of capillary action.

[0061] For the device assembly 30 prepared by the above preparation method, the electromagnetic shielding layer 33 directly covers the side circumferential surface of the component 32, so that the occupied space of the electromagnetic shielding layer 33 on the circumferential side of the component 32 is small, which is beneficial to reducing the overall width of the device assembly 30, thereby adapting to the installation in a narrow area on the circuit board 21. The setting of the electromagnetic shielding layer 33 filling part of the fourth surface 322 and the first surface 311, such as filling between the fourth surface 322 and the ground pad 36, is also beneficial to improving the electromagnetic shielding effect on the component 32. At the same time, by providing the vent holes 313 on the substrate 31, when spraying or coating the electromagnetic shielding material, the electromagnetic shielding material can enter and fill between the fourth surface 322 and the ground pad 36 by means of capillary action, which is beneficial to simplifying the preparation process of the device assembly 30 and reducing the preparation cost while improving the electromagnetic shielding effect.

[0062] Combined Figure 8 and Figure 11 As shown, in some embodiments, in the step of providing the substrate 31 and the component 32, a plurality of substrates 31 and a plurality of components 32 are provided. The plurality of substrates 31 are connected to each other in pairs by connecting ribs 41, and the connecting ribs 41 can be an integral structure with the substrate 31. In the step of disposing the component 32 on the first surface 311, the plurality of components 32 are disposed on the first surface 311 of the plurality of substrates 31 one by one. In the step of spraying or coating the electromagnetic shielding material on the third surface 321 and the side circumferential surface of the component 32 to form the electromagnetic shielding layer 33, the electromagnetic shielding material is sprayed or coated on the plurality of components 32 simultaneously to form a plurality of electromagnetic shielding layers 33. With such a setting, a plurality of device assemblies 30 can be prepared simultaneously, realizing the batch production process of the device assemblies 30, which is beneficial to improving the production efficiency of the device assemblies 30 and reducing the preparation cost.

[0063] It can be understood that when preparing multiple device components 30 simultaneously, after the step of spraying or coating an electromagnetic shielding material on the third surface 321 and the side circumferential surface of the component 32 to form the electromagnetic shielding layer 33, the preparation method may further include:

[0064] Removing the connecting ribs 41 by any applicable means such as cutting to make the multiple substrates 31 independent of each other, thereby obtaining multiple device components 30.

[0065] In some embodiments, after the step of removing the connecting ribs 41 to make the multiple substrates 31 independent of each other, the preparation method further includes:

[0066] Removing a part of the periphery of the substrate 31, a part of the ground pad 36, and a part of the electromagnetic shielding layer 33 located on the circumferential side of the component 32, so that the width of the part of the ground pad 36 and the substrate 31 that is projected onto the fourth surface 322 outside the fourth surface 322 is less than or equal to 0.2 mm, that is, the difference between the overall width of the device component 30 and the width of the component 32 is less than or equal to 0.2 mm. For example, in the step of providing the substrate 31 and the component 32, the difference between the width of the provided substrate 31 and the width of the component 32 is set at 0.4 mm. After the component 32 is disposed on the first surface 311, the width of the part where the substrate 31 and the ground pad 36 extend beyond the component 32 on each side of the component 32 is 0.2 mm, which is beneficial to the smooth formation of the electromagnetic shielding layer 33. After the step of removing the connecting ribs 41 to make the multiple substrates 31 independent of each other, 0.1 mm width of the periphery of the substrate 31 and the ground pad 36 is removed by cutting or the like, and the electromagnetic shielding layer 33 within the corresponding width range is synchronously removed, so that the ground pad 36 and the substrate 31 only extend 0.1 mm beyond the component 32. In Figure 8 Two cutting positions in some embodiments are schematically shown by two dashed lines. The overall width of the device component 30 obtained after cutting is only 0.2 mm larger than the width of the component 32 itself. While achieving the electromagnetic shielding effect on the component 32, the width dimension of the device component 30 can be effectively reduced, which is beneficial to adapting to the installation in a narrow area on the circuit board 21.

[0067] Refer to Figure 12 Figure 12 FIG. is a schematic structural diagram of the electronic device 10 provided by the embodiment of the present application. The electronic device 10 may include a radio frequency (RF) circuit 501, a memory 502 including one or more computer-readable storage media, an input unit 503, a display unit 504, a sensor 505, an audio circuit 506, a wireless fidelity (WiFi) module 507, a processor 508 including one or more processing cores, and a power supply 509 and other components. Those skilled in the art can understand that​Figure 12 The structure of the electronic device 10 shown does not limit the electronic device 10, and it may include more or fewer components than shown, or combine certain components, or have different component arrangements.

[0068] The radio frequency circuit 501 can be used to receive and send information, or receive and send signals during a call. In particular, after receiving the downlink information from the base station, it is handed over to one or more processors 508 for processing; in addition, data related to the uplink is sent to the base station. Generally, the radio frequency circuit 501 includes, but is not limited to, antennas, at least one amplifier, a tuner, one or more oscillators, a subscriber identity module (SIM) card, a transceiver, a coupler, a low noise amplifier (LNA), a duplexer, etc. In addition, the radio frequency circuit 501 can also communicate with the network and other devices through wireless communication. This wireless communication can use any communication standard or protocol, including but not limited to the Global System of Mobile communication (GSM), General Packet Radio Service (GPRS), Code Division Multiple Access (CDMA), Wideband Code Division Multiple Access (WCDMA), Long Term Evolution (LTE), email, Short Messaging Service (SMS), etc.

[0069] The memory 502 can be used to store application programs and data. The application programs stored in the memory 502 contain executable code. The application programs can form various functional modules. The processor 508 executes various functional applications and data processing by running the application programs stored in the memory 502. The memory 502 mainly includes a program storage area and a data storage area. Among them, the program storage area can store an operating system, application programs required for at least one function (such as a sound playback function, an image playback function, etc.); the data storage area can store data created according to the use of the electronic device 10 (such as audio data, a phone book, etc.). In addition, the memory 502 can include high-speed random access memory, and can also include non-volatile memory, such as at least one magnetic disk storage device, a flash memory device, or other non-volatile solid-state storage devices. Correspondingly, the memory 502 can also include a memory controller to provide access to the memory 502 by the processor 508 and the input unit 503.

[0070] The input unit 503 can be used to receive input numerical, character information or user characteristic information (such as fingerprints), and generate keyboard, mouse, joystick, optical or trackball signal inputs related to user settings and function controls. Specifically, in a specific embodiment, the input unit 503 may include a touch-sensitive surface and other input devices. The touch-sensitive surface, also known as a touch display screen or a touchpad, can collect touch operations of a user thereon or nearby (such as operations of the user using any suitable object or accessory such as a finger or a stylus on or near the touch-sensitive surface), and drive corresponding connection devices according to a preset program. Optionally, the touch-sensitive surface may include two parts: a touch detection device and a touch controller. Among them, the touch detection device detects the touch orientation of the user, detects the signal brought by the touch operation, and transmits the signal to the touch controller; the touch controller receives the touch information from the touch detection device, converts it into contact coordinates, and then sends it to the processor 508, and can receive and execute commands sent by the processor 508.

[0071] The display unit 504 can be used to display information input by the user or information provided to the user, as well as various graphical user interfaces of the electronic device 10. These graphical user interfaces can be composed of graphics, text, icons, videos and any combination thereof. The display unit 504 may include a display panel. Optionally, the display panel can be configured in the form of a liquid crystal display (LCD), an organic light-emitting diode (OLED), etc. Further, the touch-sensitive surface can cover the display panel. When the touch-sensitive surface detects a touch operation thereon or nearby, it is transmitted to the processor 508 to determine the type of touch event. Subsequently, the processor 508 provides a corresponding visual output on the display panel according to the type of touch event. Although in Figure 12 the touch-sensitive surface and the display panel are implemented as two independent components to achieve input and input functions, in some embodiments, the touch-sensitive surface and the display panel can be integrated to achieve input and output functions.

[0072] The electronic device 10 may further include at least one sensor 505, such as a light sensor, a motion sensor, and other sensors. Specifically, the light sensor may include an ambient light sensor and a proximity sensor. Among them, the ambient light sensor can adjust the brightness of the display panel according to the brightness of the ambient light, and the proximity sensor can turn off the display panel and / or the backlight when the electronic device 10 is moved to the ear. As a kind of motion sensor, the gravity acceleration sensor can detect the magnitude of acceleration in all directions (generally three axes), and can detect the magnitude and direction of gravity when stationary, and can be used in applications for identifying the posture of the mobile phone (such as horizontal and vertical screen switching, related games, magnetometer posture calibration), vibration recognition related functions (such as pedometer, tapping), etc.; as for other sensors such as gyroscopes, barometers, hygrometers, thermometers, and infrared sensors that the electronic device 10 can also be configured with, they will not be elaborated here.

[0073] The audio circuit 506 can provide an audio interface between the user and the electronic device 10 through a speaker and a microphone. The audio circuit 506 can convert the received audio data into an electrical signal, transmit it to the speaker, and the speaker converts it into a sound signal for output; on the other hand, the microphone converts the collected sound signal into an electrical signal, which is received by the audio circuit 506 and then converted into audio data. After the audio data is output to the processor 508 for processing, it is sent to another electronic device 10, for example, through the radio frequency circuit 501, or the audio data is output to the memory 502 for further processing. The audio circuit 506 may also include a headphone jack to provide communication between the peripheral headphone and the electronic device 10.

[0074] Wireless Fidelity (WiFi) belongs to short-distance wireless transmission technology. The electronic device 10 can help users send and receive emails, browse the web, and access streaming media through the WiFi module 507, which provides users with wireless broadband Internet access. Although Figure 12 the WiFi module 507 is shown, it can be understood that it does not belong to the essential components of the electronic device 10 and can be completely omitted within the scope of not changing the essence of the invention according to needs.

[0075] The processor 508 is the control center of the electronic device 10, connecting various parts of the entire electronic device 10 through various interfaces and lines. By running or executing the application programs stored in the memory 502, and calling the data stored in the memory 502, it executes various functions of the electronic device 10 and processes data, thereby monitoring the electronic device 10 as a whole. Optionally, the processor 508 may include one or more processing cores; preferably, the processor 508 may integrate an application processor and a modulation and demodulation processor. Among them, the application processor mainly processes the operating system, user interface, and application programs, and the modulation and demodulation processor mainly processes wireless communication. It can be understood that the above modulation and demodulation processor may not be integrated into the processor 508 either.

[0076] The electronic device 10 further includes a power supply 509 that powers each component. Preferably, the power supply 509 can be logically connected to the processor 508 through a power management system, so as to implement functions such as management of charging, discharging, and power consumption management through the power management system. The power supply 509 may further include any components such as one or more DC or AC power supplies, a recharge system, a power failure detection circuit, a power converter or inverter, a power status indicator, etc.

[0077] Although Figure 12 not shown in the figure, the electronic device 10 may further include a Bluetooth module, etc., which will not be elaborated here. In specific implementation, the above-mentioned each module can be implemented as an independent entity, or can be combined arbitrarily and implemented as the same or several entities. For the specific implementation of the above-mentioned each module, reference can be made to the foregoing method embodiments, which will not be elaborated here.

[0078] The technical features of the above-described embodiments can be combined arbitrarily. For the sake of brevity of description, not all possible combinations of the technical features in the above-described embodiments are described. However, as long as there is no contradiction in the combination of these technical features, it should be considered as the scope described in this specification.

[0079] The above-described embodiments merely represent several implementation manners of the present application. The description thereof is relatively specific and detailed, but it should not be construed as a limitation on the scope of the patent application. It should be noted that for those of ordinary skill in the art, without departing from the concept of the present application, several modifications and improvements can still be made, and these all belong to the protection scope of the present application. Therefore, the protection scope of the patent of the present application shall be subject to the appended claims.

Claims

1. A device assembly, characterized in that: include: A substrate having a first surface and a second surface disposed opposite to each other, wherein the substrate is provided with a vent hole penetrating the first surface and the second surface; a component disposed on the first surface and having a third surface facing away from the first surface and a fourth surface facing the first surface; and, An electromagnetic shielding layer covers the third surface and the side surface of the component, and the electromagnetic shielding layer is filled between the fourth surface and the first surface along the periphery of the component to close the gap between the fourth surface and the first surface. The air hole is located on the first surface in the space closed by the electromagnetic shielding layer.

2. The device assembly according to claim 1, characterized in that The device assembly also includes a device pad and a ground pad arranged on the first surface. The ground pad is arranged around the device pad and connected end to end. The components are arranged on the device pad and are electrically connected to the device pad.

3. The device assembly according to claim 2, characterized in that The orthographic projection of the ground pad on the fourth surface at least partially falls on the fourth surface and is arranged around the periphery of the fourth surface, and the portion of the electromagnetic shielding layer located between the fourth surface and the first surface fills the space between the fourth surface and the ground pad.

4. The device assembly according to claim 3, characterized in that The vent hole is located in the area surrounded by the ground pad on the first surface, and the vent hole communicates with the gap between the fourth surface and the ground pad.

5. The device assembly according to claim 3, characterized in that The orthographic projection of a portion of the ground pad on the fourth surface is located outside the fourth surface and is arranged around the component along the circumference, and the electromagnetic shielding layer covers a side of the ground pad that is away from the first surface.

6. The device assembly according to claim 5, characterized in that The width of at least a portion of the electromagnetic shielding layer located on the peripheral side of the component gradually decreases in a direction from the substrate to the component.

7. The device assembly according to claim 5, characterized in that The width of the ground pad is greater than or equal to 0.4 mm, the ground pad is arranged around the periphery of the first surface, and the width of a portion of the orthographic projection of the ground pad on the fourth surface located outside the fourth surface is less than or equal to 0.2 mm.

8. The device assembly according to claim 2, characterized in that The substrate is also provided with a signal via that passes through the first surface and the second surface, the signal via is opposite to the device pad, and the device assembly also includes a conductive structure arranged in the signal via, the conductive structure is electrically connected to the device pad on the first surface and is conductive to the second surface.

9. The device assembly according to claim 8, characterized in that The substrate is also provided with a plurality of ground vias penetrating the first surface and the second surface. The plurality of ground vias are arranged around the signal vias and are spaced apart in sequence. The substrate also includes an electromagnetic shielding structure arranged in the ground vias.

10. The device assembly according to claim 1, characterized in that The radial dimension of the air vent is greater than or equal to 0.5 mm.

11. The device assembly according to claim 1, characterized in that The device assembly includes a plurality of the components and a plurality of the electromagnetic shielding layers, wherein the plurality of components are arranged on the first surface at intervals, and the electromagnetic shielding layers cover the third surfaces and side surfaces of the components one by one, and fill between the fourth surface and the first surface along the corresponding periphery of the components.

12. A circuit module, characterized in that: It comprises a circuit board and a device assembly as claimed in any one of claims 1 to 11, wherein the device assembly is arranged on the circuit board, and the second surface of the substrate faces the circuit board.

13. The circuit module according to claim 12, characterized in that: The device assembly includes a device pad disposed on the first surface, the device pad being electrically connected to the component, the substrate being provided with a signal via penetrating the first surface and the second surface, the device assembly includes a conductive structure disposed in the signal via, the conductive structure being electrically connected to the device pad on the first surface and being conducted to the second surface, and the circuit module further includes a signal pad disposed on the circuit board, the signal pad being electrically connected to the conductive structure on the second surface.

14. The circuit module according to claim 13, characterized in that: The circuit module further includes a plurality of electromagnetic shielding pads disposed on the circuit board, and the plurality of electromagnetic shielding pads surround the signal pad and are sequentially spaced apart.

15. An electronic device, characterized in that: It comprises a shell and a circuit module as described in any one of claims 12 to 14, wherein the circuit module is arranged in the shell.

16. A method for preparing a device component, characterized in that: include: A substrate and a component are provided, wherein the substrate has a first surface and a second surface disposed opposite to each other, the substrate is provided with a vent hole penetrating the first surface and the second surface, the substrate is provided with a device pad and a ground pad, the ground pad is disposed around the device pad and the vent hole and connected end to end, and the component has a third surface and a fourth surface disposed opposite to each other; The components are arranged on the first surface, so that the device pads are electrically connected to the components on the fourth surface, and the projection of the ground pads on the fourth surface falls on the fourth surface and is arranged around the periphery of the fourth surface; An electromagnetic shielding material is disposed on the third surface and the side surface of the component to form an electromagnetic shielding layer, wherein part of the electromagnetic shielding material enters and fills between the fourth surface and the ground pad through capillary action to close the gap between the fourth surface and the first surface.

17. The preparation method according to claim 16, characterized in that: In the step of providing substrates and components, a plurality of substrates and a plurality of components are provided, and the plurality of substrates are connected in pairs by connecting ribs; In the step of arranging components on the first surface, a plurality of the components are arranged on the first surfaces of a plurality of the substrates in a one-to-one correspondence; In the step of providing electromagnetic shielding material on the third surface and the side circumferential surface of the component to form an electromagnetic shielding layer, the electromagnetic shielding material is provided on a plurality of the components; After the step of providing an electromagnetic shielding material on the third surface and the side circumferential surface of the component to form an electromagnetic shielding layer, the preparation method further comprises: The connecting ribs are removed to make the plurality of substrates independent of each other.

18. The preparation method according to claim 16, characterized in that: After the step of providing an electromagnetic shielding material on the third surface and the side circumferential surface of the component to form an electromagnetic shielding layer, the preparation method further comprises: Remove portions of the periphery of the substrate, portions of the ground pad, and portions of the electromagnetic shielding layer located on the periphery of the component, so that the width of the portion of the orthographic projection of the ground pad on the fourth surface located outside the fourth surface is less than or equal to 0.2 mm.

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