Manufacturing method of composite material heat dissipation structure
By permeating the rigid porous carrier in a vacuum environment, the problems of poor process stability and low yield in the prior art are solved, and efficient manufacturing of the composite heat dissipation structure is achieved, and excellent thermal and mechanical properties are achieved.
Patent Information
- Application Number
- CN202510398317.3
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2025-04-01
- Publication Date
- 2025-06-17
AI Technical Summary
In the prior art, when manufacturing silicon carbide-based radiators, the process stability and the finished product yield are poor, making it difficult to effectively control the microstructure of the ceramic and the penetration of metal melt.
The vapor-phase metal permeation treatment in a vacuum environment is used to vaporize the melt of the highly thermally conductive metal material to form a vaporization mixture to penetrate into the pores of the rigid porous carrier, and a metal skin layer is formed on the outer surface.
The process stability is improved, the cycle is short, the handling is convenient and the cost is low, and the heat dissipation structure of the composite material has excellent thermal and mechanical properties.
Smart Images
Figure CN120158713A_ABST
Abstract
Description
Technical Field
[0001] The present invention relates to the technical field of manufacturing methods for heat dissipation structures, and particularly to a manufacturing method for a composite material heat dissipation structure. Background Art
[0002] As electronic products are constantly updated, in addition to the basic functional aspects, in order to meet the requirements of high integration, high transmission, high speed, and high efficiency, etc., electronic products also have higher requirements for heat dissipation efficiency. However, the currently commonly used heat dissipation solutions, such as installing heat dissipation fans or general metal heat sinks, are no longer sufficient to cope with the heat dissipation problems of servers and high-power products.
[0003] Silicon carbide has excellent properties such as high thermal conductivity, resistance to thermal shock, acid and alkali resistance, lightness and thinness, etc. Heat sinks based on silicon carbide have become one of the key components in the development of thermal management packaging technology. However, the performance of such heat sinks also depends on the microstructure after the formation of silicon carbide, such as pore size, porosity, pore distribution, pore connectivity, etc. However, the existing methods for manufacturing such heat sinks generally have some areas to be improved in terms of process stability and product yield. For example, in the ceramic forming step, it is not easy to control the microstructure of the ceramic, resulting in poor process stability. Another example is that in the infiltration step, the melt containing metal is not easy to penetrate into the pores of the ceramic, resulting in a low product yield. Summary of the Invention
[0004] The purpose of the present invention is to provide a manufacturing method for a composite material heat dissipation structure to solve the problems raised in the above background art.
[0005] To achieve the above purpose, the present invention provides the following technical solution: A manufacturing method for a composite material heat dissipation structure, wherein the rigid porous carrier is formed by a hard material containing silicon carbide; and a vapor phase metal infiltration treatment is performed on the rigid porous carrier in a vacuum environment, wherein the vapor phase metal infiltration treatment includes vaporizing a melt of a high thermal conductivity metal material and generating a gas compound of the high thermal conductivity metal material to penetrate into the pores of the rigid porous carrier.
[0006] Further, in the vapor phase metal infiltration treatment, the vaporized mixture of the high thermal conductivity metal material further forms a metal skin layer covering the outside of the rigid porous carrier.
[0007] Further, the vaporized mixture includes metal atomic gas, metal molecular gas, and plasma gas derived from the high thermal conductivity metal material.
[0008] Further, the high thermal conductivity metal material is aluminum metal, copper metal, aluminum-based alloy, or copper-based alloy.
[0009] Further, the high thermal conductivity metal material is an aluminum-copper alloy, and the copper content of the aluminum-copper alloy is in the range of 1% to 50%.
[0010] Further, the high thermal conductivity metal material is an aluminum-copper-silver alloy, the copper content of the aluminum-copper-silver alloy is in the range of 1% to 50%, and the silver content of the aluminum-copper-silver alloy is in the range of 1% to 10%.
[0011] Further, the pressure of the vacuum environment is in the range of 0.01 to 3 torr, and the temperature of the vacuum environment is in the range of 600 to 900 °C.
[0012] Further, the hard material includes at least one of single crystal silicon, diamond, diamond-like, boron nitride, and graphene.
[0013] The present invention provides a manufacturing method of a composite material heat dissipation structure, which has the following beneficial effects: The present invention can perform a gas-phase metal infiltration treatment on the rigid porous carrier, and the gas-phase metal infiltration treatment includes vaporizing the melt of a high thermal conductivity metal material and generating a vaporized mixture of the high thermal conductivity metal material to penetrate into the pores of the rigid porous carrier. The technical features have the advantages of stable process, short cycle, convenient operation, low cost, high product quality, etc., and the heat dissipation structure of the composite material manufactured has good thermal performance and mechanical performance. Description of the Drawings
[0014] Figure 1 is a flowchart of the working process of the manufacturing method of a composite material heat dissipation structure according to the present invention; Figure 2 is a schematic diagram of the structure of the rigid porous carrier of the present invention; Figure 3 is a structure diagram of small-sized particles, medium-sized particles, and large-sized particles of the present invention; Figure 4 is an integrated structure diagram of small-sized particles, medium-sized particles, and large-sized particles connected by an adhesive of the present invention; Figure 5 is a schematic diagram of the heat dissipation structure of the manufacturing method of a composite material heat dissipation structure according to the present invention. Detailed Embodiments
[0015] The following further describes in detail the embodiments of the present invention with reference to the drawings and examples. The following examples are used to illustrate the present invention, but cannot be used to limit the scope of the present invention. Examples
[0016] Please refer to Figure 1 , which shows the manufacturing method of the composite material heat dissipation structure according to the first embodiment of the present invention, as Figure 1As shown, the manufacturing method of the composite material heat dissipation structure of the present invention includes: Step S100, providing a rigid porous carrier; Step S300, performing a vapor phase metal infiltration treatment on the rigid porous carrier in a vacuum environment.
[0017] In the present invention, a high thermal conductivity metal material is introduced into the rigid porous carrier through a vapor phase infiltration reaction. The degree of the vapor phase infiltration reaction can be controlled by controlling conditions such as the vacuum degree, reaction temperature, and pressure, achieving unexpected effects. Specifically, the high thermal conductivity metal material can fully fill the pores of the rigid porous carrier and can be continuously and uniformly distributed on an outer surface of the rigid porous carrier, making the manufactured composite material of better quality and superior performance. High thermal conductivity metal materials applicable to the present invention include, but are not limited to: metallic aluminum, metallic copper, aluminum-based alloys, and copper-based alloys. Hereinafter, the steps of the manufacturing method of the composite material heat dissipation structure of the present invention will be described in detail in conjunction with Figure 1 and Figure 5 to describe each step of the manufacturing method of the composite material heat dissipation structure of the present invention in detail.
[0018] In Step S100, the rigid porous carrier 1 is formed of a hard material containing silicon carbide, thereby having characteristics such as high porosity, high rigidity, high thermal stability, and low thermal expansion coefficient, and being suitable for carrying a high thermal conductivity metal material to meet the heat dissipation requirements of practical applications.
[0019] In Step S300, the rigid porous carrier 1 can be placed in a evacuated reaction chamber, and the high thermal conductivity metal material is heated and melted and then fed into the reaction chamber, so that the melt of the high thermal conductivity metal material is vaporized under controlled conditions, and a vaporized mixture (vapor phase metal) fills the reaction chamber. Therefore, the vaporized mixture can penetrate into the rigid porous carrier 1 from different directions and fill the pores. In addition, the vaporized mixture can be deposited and adhered on the outer surface of the rigid porous carrier 1 to further form a metal skin layer 2 covering the outside of the rigid porous carrier 1.
[0020] It is worth mentioning that the vapor phase metal infiltration treatment can control the concentration of the vaporized mixture by controlling process parameters such as the vacuum degree, temperature, and pressure, thereby conveniently controlling the speed and range of the vaporized mixture penetrating into the rigid porous carrier 1 and overcoming the difficulties existing in the liquid phase metal infiltration method.
[0021] In this embodiment, the high thermal conductivity metal material penetrates into the rigid porous carrier 1 in the form of metal vapor, and the concentration of the metal vapor can meet the requirements of the vapor phase infiltration reaction by controlling the temperature and pressure of the vacuum environment. Further, the high thermal conductivity metal material undergoes triple point vaporization, and the converted vaporized mixture can include metal atomic gas, metal molecular gas, and / or plasma gas derived from the high thermal conductivity metal material.
[0022] In actual application, the pressure of the vacuum environment ranges from 0.01 to 3 torr, and the temperature of the vacuum environment ranges from 600 to 900 °C. The high thermal conductivity metal material can be an aluminum-copper alloy, and the copper content of this aluminum-copper alloy ranges from 1% to 50%. Alternatively, the high thermal conductivity metal material can be an aluminum-copper-silver alloy, and the copper content of this aluminum-copper-silver alloy ranges from 1% to 50%, and the silver content ranges from 1% to 10%. Therefore, the temperature required for the gas-phase metal infiltration treatment can be reduced, and the thermal conductivity of the composite material can be increased. However, the above are only representative examples and are not intended to limit the present invention.
[0023] Optionally, between step S100 and step S300, the manufacturing method of the composite material heat dissipation structure of the present invention may further include step S200 of machining the rigid porous carrier 1 so that the rigid porous carrier 1 has a shape or structure that meets the actual application requirements. The machining applicable to the present invention includes but is not limited to: cutting, grinding, drilling, and grooving.
[0024] After the above steps are completed, a composite material heat dissipation structure Z can be obtained, which includes the rigid porous carrier 1 and the metal skin layer 2 as described above, and the metal skin layer 2 covers the outside of the rigid porous carrier 1.
[0025] It should be noted that both the thermal performance and mechanical performance of the composite material heat dissipation structure Z are excellent. The thermal conductivity of the composite material heat dissipation structure Z can be greater than 180 W / mK, preferably 250 W / mK to 350 W / mK; the coefficient of thermal expansion of the composite material heat dissipation structure Z ranges from 6 to 20. In addition, the rigid modulus of the composite material heat dissipation structure Z ranges from 300 to 600 Mpa.
[0026] Cooperate with Figure 5 As shown, in the composite material heat dissipation structure Z, the following relationship is satisfied between the rigid porous carrier 1 and the metal skin layer 2: 2A / T ≤ 50%; A represents the covering thickness of the metal skin layer 2 on the upper surface 101 or the lower surface 102 of the rigid porous carrier 1; T represents the total thickness of the composite material heat dissipation structure Z. In actual application, the covering thickness of the metal skin layer 2 on the upper surface 101 or the lower surface 102 of the rigid porous carrier 1 can be greater than 5 μm, preferably 25 μm to 1000 μm. Example
[0027] Refer back to Figure 1 As shown, in this embodiment, the process steps of the manufacturing method of the composite material heat dissipation structure are substantially the same as those in the first embodiment, except that the hard material is not sintered in step S200.
[0028] Cooperate with Figure 4As shown, during the pressurization process of the hard material, the small-size particles 13, the medium-size particles 12 and the large-size particles 11 are connected together by the binder 14 to form an integrated structure (such as a block or sheet structure). It is worth noting that the working temperature required for pressurization with the binder 14 is lower than the working temperature of the sintering treatment, and the time required is also shorter, so the rigid porous carrier 1 can be obtained in a more energy-saving and time-saving manner. After the heat treatment is completed, the rigid porous carrier 1 has pores left after the binder 14 is removed, and pseudo-adhesion is formed between the small-size particles 13, the medium-size particles 12 and the large-size particles 11.
[0029] The relevant technical details mentioned in the first embodiment are still valid in this embodiment, and will not be repeated here to reduce repetition. Accordingly, the relevant technical details mentioned in this embodiment can also be applied to the first embodiment.
[0030] The embodiments of the present invention are given for the purpose of illustration and description, and are not intended to be exhaustive or to limit the invention to the disclosed forms. Many modifications and variations will be apparent to those of ordinary skill in the art. The embodiments are selected and described in order to better illustrate the principles and practical applications of the present invention and to enable those of ordinary skill in the art to understand the present invention and thereby design various embodiments with various modifications suitable for specific uses.
Claims
1. A method for manufacturing a composite material heat dissipation structure, characterized in that: The rigid porous carrier is formed of a hard material including silicon carbide; and a vapor phase metal infiltration treatment is performed on the rigid porous carrier in a vacuum environment, wherein the vapor phase metal infiltration treatment includes vaporizing a melt of a high thermal conductivity metal material and generating a gas compound of the high thermal conductivity metal material to infiltrate into the pores of the rigid porous carrier.
2. The method for manufacturing a composite material heat dissipation structure according to claim 1, characterized in that: In the vapor phase metal infiltration process, the vaporized mixture of the high thermal conductivity metal material further forms a metal skin layer covering the rigid porous support.
3. The method for manufacturing a composite material heat dissipation structure according to claim 2, characterized in that: The gasification mixture includes metal atomic gas, metal molecular gas and plasma gas derived from the high thermal conductivity metal material.
4. The method for manufacturing a composite material heat dissipation structure according to claim 3, characterized in that: The high thermal conductivity metal material is metal aluminum, metal copper, aluminum-based alloy or copper-based alloy.
5. The method for manufacturing a composite material heat dissipation structure according to claim 4, characterized in that: The high thermal conductivity metal material is an aluminum-copper alloy, and the copper content of the aluminum-copper alloy is in the range of 1% to 50%.
6. The method for manufacturing a composite material heat dissipation structure according to claim 5, characterized in that: The high thermal conductivity metal material is an aluminum-copper-silver alloy, the copper content of the aluminum-copper-silver alloy is in the range of 1% to 50%, and the silver content of the aluminum-copper-silver alloy is in the range of 1% to 10%.
7. The method for manufacturing a composite material heat dissipation structure according to claim 6, characterized in that: The pressure of the vacuum environment is in the range of 0.01 to 3 torr, and the temperature of the vacuum environment is in the range of 600 to 900°C.
8. The method for manufacturing a composite material heat dissipation structure according to claim 7, characterized in that: The hard material includes at least one of single crystal silicon, diamond, diamond-like material, boron nitride and graphene.