A crystal bonding device and a crystal bonding method

Abstract

The present invention relates to the technical field of semiconductor die bonding equipment, and in particular to a die bonding equipment and a die bonding method. The die bonding equipment provided by the present invention comprises a track module including a first track and a second track, the second track being arranged along the connecting direction of the loading module and the unloading module, the first track being arranged between the loading module and the second track, and extending downward along the width direction of the first track; a dispensing module including a first dispensing mechanism and a second dispensing mechanism, the first dispensing mechanism being arranged at one end of the first track away from the second track; a crystal supply module and a transfer table module being located on the side of the second track close to the first dispensing mechanism, and corresponding to the dispensing module; a mounting head module being arranged above the second track, and a second visual detector and a second dispensing mechanism being arranged on the mounting head module. The die bonding equipment can realize two working modes: dispensing first and then identifying, and identifying first and then dispensing, and is adaptable to the mounting of different types of chips, with higher applicability.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor die bonding equipment, and in particular to a die bonding equipment and a die bonding method. Background Art

[0002] Die bonding equipment is the middle equipment in the semiconductor packaging production line and is also the most important part of semiconductor packaging.

[0003] Traditional die bonding equipment first dispenses glue at a specific location on the substrate, then identifies the location where the chip is to be mounted, and finally grabs the chip from the wafer ring and mounts it on the substrate, connecting the chip and substrate through glue.

[0004] With the rapid development of the semiconductor industry, a variety of chip types have emerged. After some chips undergo the glue dispensing process, the glue will affect the subsequent mounting and identification. The existing die bonding equipment is not suitable for chip mounting processes that require glue dispensing before mounting and identification. Summary of the Invention

[0005] In order to solve the problem of poor compatibility of existing die bonding equipment, the present invention provides a die bonding equipment and a die bonding method.

[0006] In order to solve the above technical problems, the present invention provides the following technical solutions: a crystal bonding device, comprising a workbench and a loading module, a track module, a dispensing module, a crystal supply module, a transfer table module, a mounting head module and a unloading module arranged on the workbench; the loading module and the unloading module are respectively arranged at opposite ends of the workbench, the track module comprises a first track and a second track, the second track is arranged along the connecting direction of the loading module and the unloading module, the first track is arranged between the loading module and the second track, and extends downward along the width direction of the second track; the dispensing module comprises a first dispensing mechanism and a second dispensing mechanism, the first dispensing mechanism is arranged at one end of the first track away from the second track; the crystal supply module and the transfer table module are located on the side of the second track close to the first dispensing mechanism; the mounting head module is arranged above the second track, the mounting head module is provided with a second visual detector and a second dispensing mechanism, the first dispensing mechanism is arranged at the end of the first track away from the second track; the crystal supply module and the transfer table module are located on the side of the second track close to the first dispensing mechanism; the mounting head module is arranged above the second track, the mounting head module is provided with a second visual detector and a second dispensing mechanism, the first The two dispensing mechanisms and the mounting head module move synchronously; the crystal bonding equipment also includes a control module, which is signal-connected to the track module, the dispensing module, the crystal supply module, the mounting head module, the loading module, the unloading module and the transfer table module. The loading module and / or the crystal supply module are provided with a detection unit, and the detection unit is used to detect the type of substrate and chip; the control module controls the first dispensing mechanism to execute a working mode of first dispensing and then identifying, or controls the second dispensing mechanism to execute a working mode of first identifying and then dispensing according to the type of substrate and chip detected by the detection unit; the working mode of first dispensing and then identifying includes the following steps: dispensing identification, dispensing processing, mounting identification, and mounting processing; the working mode of first identifying and then dispensing includes the following steps: mounting identification, dispensing processing, and mounting processing; the second dispensing mechanism and the mounting head module perform dispensing processing and mounting processing based on the one-time detection result of the second visual detector.

[0007] Preferably, the first dispensing mechanism is provided with a first visual detector, and the detection accuracy of the second visual detector is higher than the detection accuracy of the first visual detector.

[0008] Preferably, the first dispensing mechanism corresponds to the first track, the mounting head module corresponds to the second track, and the first dispensing mechanism and the mounting head module can work simultaneously or in a time-sharing manner.

[0009] Preferably, a carrier plate is provided on the first track, the carrier plate is slidably connected to the first track, and a secondary track parallel to the second track is provided on the carrier plate. When the carrier plate is located at the end of the second track, the secondary track is connected to the second track.

[0010] Preferably, the transfer table module includes a transfer track and a transfer table. The transfer track is located on the side of the crystal supply module and extends toward the second track. The transfer track is provided with a first upward-looking detector near one end of the crystal supply module and a second upward-looking detector near one end of the second track. The transfer table is slidably connected to the transfer track. The crystal supply module includes a crystal suction head binding mechanism, which can move between the crystal supply module and the transfer table.

[0011] Preferably, the workbench is also provided with a material table and a mounting bracket, and the material table is arranged on the transfer track close to one end of the first track; the mounting bracket is arranged parallel to the first track, and the mounting head module is slidingly connected to the mounting bracket. The mounting head module is movable along the length direction of the second track through the mounting bracket, and the mounting bracket as a whole is movable along the width direction of the second track.

[0012] Preferably, the crystal suction and binding mechanism performs a first calibration on the chip according to the detection result of the first upward-looking detector; and the crystal suction and binding mechanism performs a second calibration on the chip according to the detection result of the second upward-looking detector.

[0013] In order to solve the above technical problems, the present invention provides another technical solution as follows: a die bonding method, using a die bonding device as described in any of the above items to fix a chip to a substrate, comprising: step S1: the loading module loads the substrate onto the first track; step S2: the crystal supply module supplies the chip to the second track through the transfer table module; step S3: the dispensing module performs dispensing on the substrate, and the second visual detector performs mounting identification on the substrate, wherein the order of dispensing and mounting identification on the substrate is replaceable; wherein step S3 also includes: step S31a: based on the first track, the substrate is moved to the corresponding position of the first dispensing mechanism, and the substrate is dispensing identified by the first visual detector , and then the substrate is glued by the first glue dispensing mechanism; step S32a: the substrate is moved to the second track, and the substrate that has completed the glue dispensing process is identified by the second visual detector; and / or step S31b: based on the second track, the substrate is moved to the corresponding position of the mounting head module, and the substrate is identified by the second visual detector; step S32b: based on the recognition result of the second visual detector, the substrate is glued by the second glue dispensing mechanism; step S4: the mounting head module absorbs the chip from the transfer table module, and mounts the substrate based on the result of the mounting identification; step S5: the mounted substrate containing the chip is unloaded through the unloading module.

[0014] Preferably, when the substrate is first subjected to glue dispensing treatment and then subjected to mounting identification in step S3, steps S2, S3, S4 and S5 can be performed simultaneously; when the substrate is first subjected to mounting identification and then subjected to glue dispensing treatment in step S3, steps S1, S2, S3 and S5 can be processed in parallel, or steps S1, S2, S4 and S5 can be processed in parallel.

[0015] Preferably, the first dispensing mechanism and the second visual detector can work simultaneously to perform dispensing processing and placement identification in parallel.

[0016] Compared with the prior art, the die bonding device and die bonding method provided by the present invention have the following beneficial effects:

[0017] 1. In a die bonding device provided by an embodiment of the present invention, a gluing module and a mounting head module are respectively arranged corresponding to a first track and a second track. The substrate to be mounted can be quickly moved to the gluing or mounting station through the corresponding track to perform corresponding process operations. In addition, for the mounting of conventional chips, that is, the mounting of chips that are identified by the mounting will not be affected by the glue, the gluing and mounting processes can be processed in parallel, thereby improving the overall efficiency of the die bonding. Since the first track and the second track are independently arranged, the substrate will not affect other processes when performing the gluing or mounting process, thereby ensuring the accuracy of the gluing or mounting.

[0018] It can be understood that the mounting and binding head module is also provided with a second dispensing mechanism and a high-precision second visual detector. For some chips, if glue is coated on the substrate, it will affect the subsequent mounting position identification, resulting in mounting failure. For the mounting of such chips, the second visual detector can be used to first perform mounting identification, and then the second dispensing mechanism can be used to dispense glue based on the identification result.

[0019] The die bonding equipment provided in an embodiment of the present invention is provided with two independent dispensing mechanisms, so that the die bonding equipment can realize different mounting processes through different dispensing mechanisms, that is, the first dispensing mechanism is used to realize the working mode of dispensing first and then identifying. At this time, the dispensing and identification are completed on two independent modules respectively, so that the synchronous operation of dispensing and identification can be realized, thereby improving the overall mounting efficiency; the second dispensing mechanism is used to realize the working mode of identifying first and then dispensing, so as to meet the mounting requirements of chips where glue will affect the mounting identification.

[0020] The above design enables the device to adapt to the placement of different types of chips, with higher applicability and efficiency.

[0021] 2. In the die bonding equipment provided by an embodiment of the present invention, the first dispensing mechanism corresponds to the first track, and the mounting head module corresponds to the second track. Therefore, in the working mode of dispensing first and then identifying, the first dispensing mechanism and the mounting head module can work simultaneously; secondly, since the accuracy requirement for identifying the dispensing position is usually lower than the accuracy requirement for identifying the mounting position during the chip mounting process, this embodiment is equipped with a low-precision first visual detector on the first dispensing mechanism for dispensing identification, which improves the detection speed and also plays a role in reducing costs.

[0022] 3. In the die bonding equipment provided in an embodiment of the present invention, a sub-track connecting the loading module and the second track is provided on the carrier plate. The loading module sends the substrate to the sub-track. The carrier plate moves down along the first track to send the substrate to the first dispensing mechanism for dispensing, and then moves up to the sub-track to dock with the first track, and transfers the substrate from the sub-track to the first track for mounting. The substrate can be quickly and stably transferred to various operating stations on different tracks through the carrier plate, thereby improving production efficiency and mounting quality.

[0023] 4. In the crystal bonding equipment provided by the embodiment of the present invention, a transfer track is provided between the crystal supply module and the second track. After the crystal suction and binding head mechanism grabs the chip, it performs initial calibration on the chip through the first upward-looking detector, and then quickly and stably transfers the initially calibrated chip to the second track through the transfer table, performs mounting calibration through the second upward-looking detector, and finally performs mounting processing. The mounting accuracy is guaranteed through multiple calibrations, and the chip is quickly transferred to the mounting station through the transfer table, which reduces the waiting time for mounting and thereby improves the overall mounting efficiency.

[0024] 6. In the die bonding equipment provided by the embodiment of the present invention, a material table for placing chips is also provided near the mounting station. By placing different chips on the turntable on the material table, the mounting head module can obtain different chips from the material table and the turntable for mounting, thereby realizing multi-chip mounting; secondly, when the turntable is waiting for the crystal supply module to pick up materials, the mounting head module can first perform the mounting operation through the chip on the material table, that is, the mounting head module mounting and the turntable picking up materials can be carried out simultaneously, thereby improving the overall chip mounting efficiency.

[0025] 7. The die bonding equipment provided in the embodiment of the present invention is provided with a detection unit for detecting the chip type and a control module for controlling the operation of each module. Through the cooperation of the detection unit and the control module, the die bonding equipment can automatically match the corresponding mounting process according to different chip types, thereby improving the automation of the equipment.

[0026] 8. An embodiment of the present invention also provides a die bonding method for fixing a chip to a substrate by using a die bonding device as described in any of the above items, comprising a loading module loading the substrate onto a first track; a die supply module supplying the chip to a second track via a turntable module; a gluing module performing gluing on the substrate, and a second visual detector performing mounting identification on the substrate, wherein the order of performing gluing and mounting identification on the substrate is replaceable; a mounting head module sucking the chip from the turntable module for mounting on the substrate; and unloading the mounted substrate containing the chip via an unloading module.

[0027] It can be understood that the order of dispensing and mounting identification in the die bonding method provided in this embodiment is replaceable. By swapping the order of the two, two working modes can be realized: dispensing first and then identifying, and identifying first and then dispensing, to meet the mounting requirements of different types of chips.

[0028] Specifically, the die bonding method provided in this embodiment has the same beneficial effects as the die bonding equipment described in any of the above items, which will not be described in detail here.

[0029] 9. In a die bonding method provided in an embodiment of the present invention, a working mode of first dispensing glue and then identifying is provided. Specifically, the substrate is first moved to the corresponding position of the first dispensing mechanism through the first track for dispensing glue identification and dispensing glue, and then the substrate is moved to the second track for mounting identification.

[0030] It can be understood that the first track and the second track are set independently of each other, and the first dispensing mechanism and the second visual detector are also independent of each other. Therefore, when the first dispensing mechanism is working, it will not affect the work of the second visual detector, thereby ensuring the accuracy of dispensing or identification. Therefore, the first dispensing mechanism and the second visual detector can work at the same time, that is, the dispensing and identification processes are processed in parallel, thereby improving the overall mounting efficiency.

[0031] 10. The die bonding method provided in an embodiment of the present invention also provides a working mode of first identifying and then dispensing glue. Specifically, the substrate is moved to the corresponding position of the mounting binding head module, first identified and processed by a second visual detector, and then glued using a second dispensing mechanism based on the identification result.

[0032] It can be understood that the second visual detector is used to identify the mounting position of the substrate before dispensing glue to avoid the situation where the glue coated on the substrate affects the identification due to dispensing glue first, so as to ensure the accuracy of the mounting; at the same time, the detection results of the second visual detector can also be applied to both the dispensing and mounting processes at the same time, reducing the number of identification times and improving work efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0033] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0034] Figure 1 This is a schematic diagram of the overall framework of the die bonding equipment provided by the first embodiment of the present invention. Figure 1 .

[0035] Figure 2 This is a schematic diagram of the overall framework of the die bonding equipment provided by the first embodiment of the present invention. Figure 2 .

[0036] Figure 3 It is a schematic diagram of the framework of the track module provided in the first embodiment of the present invention.

[0037] Figure 4 It is a schematic diagram of the framework of the dispensing module provided in the first embodiment of the present invention.

[0038] Figure 5 It is a structural schematic diagram of a carrier board provided by the first embodiment of the present invention.

[0039] Figure 6 It is a partial framework diagram of the die bonding equipment provided in the first embodiment of the present invention.

[0040] Figure 7 It is a schematic diagram of the framework of the workbench provided by the first embodiment of the present invention.

[0041] Figure 8 It is a structural block diagram of the die bonding equipment provided by the first embodiment of the present invention.

[0042] Figure 9 1 is a flowchart of the steps of the die bonding method provided in the second embodiment of the present invention.

[0043] Figure 10 This is the detailed process of step 3 of the die bonding method provided by the second embodiment of the present invention. Figure 1 .

[0044] Figure 11 This is the detailed process of step 3 of the die bonding method provided by the second embodiment of the present invention. Figure 2 .

[0045] Description of the accompanying drawings:

[0046] 100. Die bonding equipment;

[0047] 10. Workbench; 20. Track module; 30. Glue dispensing module; 40. Wafer supply module; 50. Mounting and binding head module; 60. Loading module; 70. Unloading module; 80. Transfer table module; 90. Control module;

[0048] 101. Feed port; 102. Discharge port; 103. Mounting structure; 104. Material table; 105. Mounting bracket;

[0049] 201, first track; 2011, carrier plate; 2012, auxiliary track; 202, second track;

[0050] 301, first dispensing mechanism; 3011, first visual detector; 302, second dispensing mechanism;

[0051] 401, crystal suction head binding mechanism;

[0052] 501, second visual detector; 502, mounting mechanism;

[0053] 601, detection unit;

[0054] 701, transfer track; 702, transfer platform; 703, first upward-looking detector; 704, second upward-looking detector. DETAILED DESCRIPTION

[0055] In order to make the purpose, technical solutions and advantages of the present invention more clearly understood, the present invention will be further described in detail below with reference to the accompanying drawings and implementation examples. It should be understood that the specific embodiments described herein are only used to explain the present invention and are not intended to limit the present invention.

[0056] In the embodiments provided herein, it should be understood that "B corresponding to A" means that B is associated with A and B can be determined based on A. However, it should also be understood that determining B based on A does not mean determining B based solely on A; B can also be determined based on A and / or other information.

[0057] It should be understood that references to "one embodiment" or "an embodiment" throughout this specification mean that specific features, structures, or characteristics associated with the embodiment are included in at least one embodiment of the present invention. Therefore, the appearance of "in one embodiment" or "in an embodiment" throughout this specification does not necessarily refer to the same embodiment. Furthermore, these specific features, structures, or characteristics may be combined in any suitable manner in one or more embodiments. Those skilled in the art should also be aware that the embodiments described in this specification are all optional embodiments, and the actions and modules involved are not necessarily required for the present invention.

[0058] In various embodiments of the present invention, it should be understood that the size of the serial numbers of the above-mentioned processes does not necessarily mean the order of execution. The execution order of each process should be determined by its function and internal logic, and should not constitute any limitation on the implementation process of the embodiments of the present invention.

[0059] The flow charts and block diagrams in the accompanying drawings of the present invention illustrate the possible implementation architecture, functions and operations of the system, method and computer program product according to various embodiments of the present application. In this regard, each box in the flow chart or block diagram can represent a module, program segment or a part of code, and the module, program segment or a part of code contains one or more executable instructions for realizing the specified logical function. It should also be noted that in some alternative implementation schemes, the functions marked in the box can also occur in a different order than those marked in the accompanying drawings. For example, two boxes represented in succession can actually be executed substantially in parallel, and they can sometimes be executed in the opposite order, which is determined based on the functions involved. It should be noted that each box in the block diagram and / or flow chart, and the combination of the boxes in the block diagram and / or flow chart can be implemented by a dedicated hardware-based system that performs the specified function or operation, or can be implemented by a combination of dedicated hardware and computer instructions.

[0060] See also Figure 1 - Figure 4 The first embodiment of the present invention provides a die bonding device 100, which includes a workbench 10 and a track module 20, a dispensing module 30, a die supply module 40, a mounting and binding head module 50, a loading module 60, a unloading module 70, and a transfer table module 80 arranged on the workbench 10; the loading module 60 and the unloading module 70 are respectively arranged at opposite ends of the workbench 10, the track module 20 includes a first track 201 and a second track 202, the second track 202 is arranged along the connecting direction of the loading module 60 and the unloading module 70, and the first track 201 is arranged at the loading module 60 and the second track 202, and extends downward along the width direction of the first track 201; the dispensing module 30 includes a first dispensing mechanism 301 and a second dispensing mechanism 302, and the first dispensing mechanism 301 is arranged at an end of the first track 201 away from the second track 202; the crystal supply module 40 and the transfer table module 80 are located on the side of the second track 202 close to the first dispensing mechanism 301, and correspond to the dispensing module 30; the mounting head module 50 is arranged above the second track 202, and the mounting head module 50 is provided with a second visual detector 501 and a second dispensing mechanism 302.

[0061] The die bonding device 100 provided in the embodiment of the present invention can be used in the semiconductor industry to bond chips to substrates after glue dispensing, thereby realizing glue process application; the die bonding device 100 can place components at high speed and high precision to complete a series of key steps such as positioning, alignment and mounting. It is an indispensable device in the integrated circuit packaging process and is also the most important link in semiconductor packaging.

[0062] As a feasible implementation method, the first track 201 and the second track 202 are arranged vertically along their length directions, and the dispensing module 30 and the mounting head module 50 are arranged corresponding to the first track 201 and the second track 202 respectively, specifically at the non-adjacent ends of the first track 201 and the second track 202, to avoid the dispensing module 30 and the mounting head module 50 from obstructing each other when working and moving, thereby affecting the mounting process; the substrate to be mounted can be quickly moved to the dispensing or mounting station through the corresponding track for corresponding process operations. By setting the first track 201 and the second track 202, the moving speed of the substrate in each process is improved, and the waiting time of the dispensing module 30 or the mounting head module 50 is reduced, thereby improving the overall mounting efficiency.

[0063] It can be understood that the mounting head module 50 and the first glue dispensing mechanism 301 are respectively arranged at the opposite ends of the length direction of the first track 201, and are used for gluing and mounting the substrate; the crystal supply module 40 and the first glue dispensing mechanism 301 are arranged in parallel on the side of the second track 202 away from the mounting head module 50, and the crystal supply module 40 is used to provide chips to the transfer table module 80; the mounting head module 50, the first glue dispensing mechanism 301 and the crystal supply module 40 are respectively used to realize the mounting, gluing, chip loading and other processes in the chip mounting process. In actual work, the movement ranges of the mounting head module 50, the first glue dispensing mechanism 301 and the crystal supply module 40 do not interfere with each other, so that each module can work synchronously, thereby providing overall mounting efficiency.

[0064] Specifically, the first track 201 and the second track 202 are arranged independently of each other, so that the dispensing module 30 or the mounting head module 50 will not affect other processes when performing dispensing or mounting, thereby ensuring the accuracy of dispensing or mounting; secondly, by using different operating components to perform process processing at different workstations, such as using the first dispensing mechanism 301 to perform dispensing processing on the first track 201, and using the mounting head module 50 to perform mounting processing on the second track 202, conditions for parallel processing are provided for the dispensing process or the mounting process, that is, the crystal bonding equipment 100 provided in this embodiment can perform dispensing and mounting process processing at the same time, thereby improving the overall efficiency of crystal bonding.

[0065] It should be noted that with the continuous advancement of technology and changes in market demand, the types of semiconductor chips have gradually become more refined and diversified. During the mounting process of some chips, if the substrate is first glued, the glue coated on the substrate will affect the subsequent mounting identification, resulting in mounting failure.

[0066] Specifically, for microchips and flip chips that require high-precision mounting, if glue is dispensed first, the diffusion of glue or slight deviation may block the positioning marks of the substrate, interfering with visual recognition; secondly, due to the dense wiring of high-density substrates and the extremely small size of the positioning marks, glue may also cover the marks after dispensing, interfering with recognition; in addition, mounting processes with special process requirements such as flexible substrate mounting or multi-chip module mounting require identification and positioning before dispensing glue.

[0067] Understandably, when there's a risk of glue interfering with visual recognition (such as obscuring markings or altering the substrate's optical properties) or causing reduced placement accuracy, the die-bonding process needs to be adjusted to: recognition first, then glue dispensing. This relies on equipment capabilities like coordinate memory and dynamic compensation, which utilize pre-stored substrate feature data to achieve precise operation.

[0068] As a preferred embodiment of the present invention, a second dispensing mechanism 302 and a high-precision second visual detector 501 are also provided on the mounting head module 50. The substrate can be mounted and identified by the second visual detector 501 before dispensing, and then glued by the second dispensing mechanism 302, and finally the chip mounting process is performed through the mounting head module 50.

[0069] Through this design, the die bonding equipment 100 can meet the mounting requirements of various types of chips, and has higher adaptability and market competitiveness; at the same time, the second dispensing mechanism 302 is set on the mounting binding head module 50, so that the dispensing and mounting processes can share the detection results of the second visual detector 501, reducing the overall number of inspections and improving the detection and mounting efficiency.

[0070] It can be understood that the die bonding equipment 100 provided in the embodiment of the present invention is provided with two dispensing mechanisms, so that the die bonding equipment 100 can realize different mounting processes through different dispensing mechanisms, that is, the working mode of dispensing first and then identifying by the first dispensing mechanism 301, and the working mode of identifying first and then dispensing by the second dispensing mechanism 302, so that the device can adapt to the mounting of different types of chips, and has higher applicability and stronger market competitiveness.

[0071] It should be noted that the first dispensing mechanism 301 corresponds to the first track 201, the mounting head module 50, and the second dispensing mechanism 302 arranged thereon correspond to the second track 202. The first dispensing mechanism 301 and the mounting head module 50 can work simultaneously or in time-sharing manner.

[0072] Specifically, the first dispensing mechanism 301 is located at one end of the first track 201 away from the second track 202. In the working mode of dispensing first and then mounting identification: the substrate is dispensed at this end and then transferred to the second track 202 at the other end for mounting identification and chip mounting. That is, in this working mode, the dispensing and mounting processes are actually operated at different positions using different structural modules. Therefore, in the working mode of dispensing first and then mounting identification, the dispensing process and the mounting process can be processed in parallel, that is, the first dispensing mechanism 301 is used to dispense glue on one substrate on the first track 201, and the mounting binding head module 50 is used on the second track 202 to mount the chip on another substrate, thereby improving the overall mounting efficiency.

[0073] In some embodiments, the mounting head module 50 includes a second visual detector 501 and a mounting mechanism 502. A second dispensing mechanism 302 is also provided on the mounting head module 50. The movement of the second dispensing mechanism 302 and the mounting head module 50 is controlled by the same driving component and moves synchronously. In the working mode of first mounting and then dispensing: the substrate is sent to the corresponding position of the mounting head module 50, and is first mounted and identified by the second visual detector 501. Based on the identification result, the second dispensing mechanism 302 is used for dispensing, and finally the chip is mounted by the mounting mechanism 502. That is, the dispensing process and the chip mounting are both performed based on the detection result of the second visual detector 501.

[0074] Specifically, a single detection by the second visual detector 501 simultaneously guides the second dispensing mechanism 302 and the mounting mechanism 502 to perform precise dispensing and mounting processing on the substrate, thereby improving the utilization rate of the detection data; the substrate is firstly identified for mounting before dispensing, thereby effectively preventing the glue coated on the substrate from affecting the identification of the second visual detector 501, thereby ensuring the quality of mounting.

[0075] Furthermore, a first visual detector 3011 is provided on the first dispensing mechanism 301 , and the detection accuracy of the second visual detector 501 is higher than the detection accuracy of the first visual detector 3011 .

[0076] It should be noted that, usually before the substrate is subjected to gluing or mounting processing, the gluing position and mounting position of the substrate need to be detected and identified, and the accuracy requirement for identifying the gluing position is lower than the accuracy requirement for identifying the mounting position; therefore, for conventional chip mounting, that is, chip mounting that does not affect mounting identification after gluing, detection equipment with lower detection accuracy can be used for identification and detection, avoiding the use of high-precision detection equipment to detect low-precision processes, resulting in waste of resources.

[0077] It can be understood that in the working mode of first dispensing and then identifying, the substrate needs to be identified before chip mounting after the dispensing is completed. Therefore, the first dispensing mechanism 301 of this embodiment adopts a low-precision first visual detector 3011 to perform identification detection before the dispensing process to improve detection efficiency and reduce costs; at the same time, the first dispensing mechanism 301 and the mounting head module 50 are independent of each other and are located in two different workstations. Therefore, the operation of the first dispensing mechanism 301 does not affect the operation of the mounting head module 50. Therefore, when the first dispensing mechanism 301 is used for dispensing, the mounting head module 50 can perform mounting processing simultaneously, thereby improving the overall efficiency of the solid crystal.

[0078] Further, please also refer to Figure 5 A carrier plate 2011 is provided on the first track 201, and the carrier plate 2011 is slidably connected to the first track 201. A secondary track 2012 parallel to the second track 202 is provided on the carrier plate 2011. When the carrier plate 2011 is located at the end of the second track 202, the secondary track 2012 is connected to the second track 202.

[0079] It should be noted that when the carrier 2011 is located between the loading module 60 and the second track 202, the sub-track 2012 thereon connects the loading module 60 and the second track 202, that is, the loading module 60 can transfer the substrate to the sub-track 2012, and then transfer it to the second track 202 through the sub-track 2012.

[0080] As a feasible implementation method, after the carrier 2011 receives the substrate from the loading module 60, the carrier 2011 moves along the length direction of the first track 201 toward the first dispensing mechanism 301, and performs dispensing processing on the substrate at the first dispensing mechanism 301, and then the carrier 2011 is reset to the other end of the first track 201, so that the secondary track 2012 is docked with the second track 202, thereby transferring the substrate to the second track 202 for mounting processing.

[0081] As another feasible embodiment, after the carrier 2011 receives the substrate from the loading module 60, the substrate is transferred to the second track 202 through the auxiliary track 2012, and the substrate is identified and detected by the second visual detector 501 on the mounting head module 50, and then glued by the second dispensing mechanism 302 which is also arranged on the mounting head module 50.

[0082] Optionally, the mounting and binding head module 50 may also be moved above the carrier 2011 to perform gluing and / or mounting operations on the substrate.

[0083] It can be understood that by carrying the substrate on the carrier 2011 and then sliding the carrier 2011 along the track, the substrate can be quickly and stably transferred to various operating stations located on different tracks, thereby accelerating the flow speed of the substrate and improving production efficiency.

[0084] Further, please refer to Figure 1 and Figure 2 The workbench 10 is also provided with a mounting bracket 105, which is arranged parallel to the first track 201. The mounting head module 50 is slidably connected to the mounting bracket 105, and the mounting head module 50 can be moved along the length direction of the second track 202 through the mounting bracket 105.

[0085] Optionally, the mounting bracket 105 is a gantry bracket.

[0086] Specifically, the mounting bracket 105 spans the first rail 201 and the second rail 202, so that the mounting head module 50 set thereon can move above the first rail 201 and the second rail 202, thereby quickly moving to the corresponding operation point, thereby improving the coverage range of the operation of the mounting head module 50.

[0087] Optionally, a UV lamp may be provided on the mounting head module 50 or the mounting bracket 105 for UV curing the chip.

[0088] In some embodiments, the mounting head module 50 moves on the mounting station of the second track 202, thereby performing operations such as mounting identification, glue dispensing, mounting processing and / or UV curing on the substrate at the station.

[0089] In other embodiments, the mounting head module 50 can be moved above the first rail 201 and the second rail 202 through the mounting bracket 105; specifically, the mounting head module 50 can be moved to the end of the first rail 201 close to the second rail 202, perform mounting identification, glue dispensing and / or mounting processing on the substrate at this position, and then move the substrate to the second rail for UV curing.

[0090] As a feasible implementation method, the mounting bracket 105 as a whole can be moved along the width direction of the second track 202, that is, through the movement of the mounting bracket 105 itself and the movement of the mounting head module 50 on the mounting bracket 105, the mounting head module 50 can be accurately moved to any point on the mounting plane for mounting or gluing.

[0091] It can be understood that the mounting head module 50 is slidably connected to the mounting bracket 105, so that the mounting head module 50 can move quickly and stably on the mounting bracket 105, ensuring that the mounting head module 50 can quickly and accurately reach the corresponding processing point to perform gluing and / or mounting processing on the substrate, ensuring the quality and accuracy of the mounting and improving the overall die bonding efficiency.

[0092] Further, see Figure 6 The workbench 10 is also provided with a transfer track 701 and a transfer table 702. The transfer track 701 is located on the side of the crystal supply module 40 and extends toward the second track 202. The transfer track 701 is provided with a first upward-looking detector 703 at one end close to the crystal supply module 40, and a second upward-looking detector 704 is provided at one end close to the second track. The transfer table 702 is slidably connected to the transfer track 701. The crystal supply module 40 includes a crystal suction head binding mechanism 401, which can move between the crystal supply module 40 and the transfer table 702.

[0093] In some embodiments, the transfer track 701 is arranged between the first track 201 and the crystal supply module 40, and is arranged parallel to the first track 201. The first upward-looking detector 703 and the second upward-looking detector 704 are respectively provided at both ends of the length direction of the transfer track 701. Specifically, the first upward-looking detector 703 is arranged at one end of the transfer track 701 close to the crystal supply module 40, and is used to perform initial calibration of the chip. The second upward-looking detector 704 is arranged at one end of the transfer track 701 close to the second track 202, and is used to perform chip mounting calibration.

[0094] Optionally, the upward-looking detector is an upward-looking CCD (Charge Coupled Device). CCD is a semiconductor device that can convert optical images into digital signals to achieve operations such as image acquisition, storage, and transmission processing.

[0095] It can be understood that after grabbing the chip on the crystal supply module 40, the crystal suction and binding head mechanism 401 first moves to the first upward-looking detector 703 for identification and detection, and performs a first calibration on the chip based on the detection result, and then places the initially calibrated chip on the transfer table 702, and transfers the chip to the second track 202 through the transfer table 702 to wait for mounting; the mounting and binding head module 50 is also provided with a mounting mechanism 502 for grabbing the chip. After grabbing the chip on the transfer table 702, the mounting mechanism 502 also moves to the second upward-looking detector 704 for identification and detection and a second calibration before mounting.

[0096] It should be noted that the first upward-looking detector 703 and the second upward-looking detector 704 are specifically used to identify the bottom of the chip. It should be understood that usually the crystal binding head mechanism 401 and the mounting mechanism 502 are equipped with visual detectors for identifying the chip from above the chip, but the key features of some chips are at the bottom, and relying solely on the visual detectors equipped on the crystal binding head mechanism 401 and the mounting mechanism 502 cannot well identify the relevant features of the chip.

[0097] This embodiment can perform comprehensive chip recognition by providing the first upward-looking detector 703 and the second upward-looking detector 704, thereby improving recognition accuracy; the chip mounting accuracy is further improved through two calibrations.

[0098] As a feasible implementation method, the detection accuracy of the first upward-looking detector 703 is lower than that of the second upward-looking detector 704; it can be understood that the upward-looking detector can be adaptively configured according to the detection accuracy required in the actual operation of different processes, avoiding the use of high-precision upward-looking detectors to identify and detect crystal supply processes with lower precision requirements, thereby reducing costs and improving detection efficiency.

[0099] It can be understood that after grabbing the chip, the crystal suction and binding head mechanism 401 performs initial calibration on the chip through the first upward-looking detector 703, and then quickly and stably transfers the initially calibrated chip to the second track 202 through the transfer table 702, performs mounting calibration through the second upward-looking detector 704, and finally performs mounting processing. The mounting accuracy is ensured through multiple calibrations, and the chip is quickly transferred to the mounting station through the transfer table 702.

[0100] Furthermore, the workbench 10 is further provided with a material table 104 , and the material table 104 is arranged at one end of the transfer track 701 close to the first track 201 .

[0101] It should be noted that the material table 104 is used to place chips for placement processing by the placement binding head module 50 .

[0102] As an embodiment, the chip type placed on the material table 104 is different from the chip type on the transfer table 702. The mounting head module 50 can grab the chips on the material table 104 and the transfer table 702 for mounting respectively, so as to realize the mounting of multiple types of chips.

[0103] As a preferred embodiment, when the turntable 702 is moving or waiting for the crystal supply module 40 to pick up materials, the mounting head module 50 can first grab the chip from the material table 104 for mounting processing, that is, the mounting head module 50 and the turntable 702 can work at the same time, thereby improving the overall chip mounting efficiency.

[0104] Further, see Figure 7The workbench 10 is also provided with a feed port 101 and a discharge port 102. The feed port 101 is arranged corresponding to the loading module 60, and the discharge port 102 is arranged corresponding to the unloading module 70. A mounting structure 103 is provided on the outside of the feed port 101 and the discharge port 102, and the loading module 60 and the unloading module 70 are connected to external equipment through the mounting structure 103.

[0105] It can be understood that the crystal bonding equipment 100 is a mid-stage equipment in the semiconductor packaging production line. By pre-setting the installation structure 103 on the feed end and the discharge end of the workbench 10, it is convenient to connect the crystal bonding equipment 100 with its upstream and downstream equipment to assemble it into a complete production line equipment, which is also convenient for subsequent repair and maintenance.

[0106] Further, see Figure 8 The crystal bonding equipment 100 also includes a control module 90. A detection unit 601 is provided on the loading module 60 and / or the crystal supply module 40. The control module 90 is signal-connected with the detection unit 601, the first dispensing mechanism 301 and the second dispensing mechanism 302. The control module 90 controls the operation of the first dispensing mechanism 301 or the second dispensing mechanism 302 according to the detection result of the detection unit 601.

[0107] It should be noted that the control module 90 is respectively connected to the track module 20, the dispensing module 30, the crystal supply module 40, the mounting and binding head module 50, the loading module 60, the unloading module 70 and the transfer table module 80 by signals to control the operation of each module; the detection unit 601 is used to detect the type of substrate and chip, that is, to detect whether it is a chip that can be mounted using the conventional process of first dispensing and then identifying.

[0108] It can be understood that if the detection result of the detection unit 601 is that the current chip is a conventional chip, the control module 90 controls the other modules to execute the working mode of first dispensing and then identifying, that is, sending the substrate to the corresponding position of the first dispensing mechanism 301 for dispensing; if the detection result of the detection unit 601 is that the current chip, after the dispensing process, the glue will affect the subsequent mounting identification, then the control module controls the other modules to execute the working mode of first identifying and then dispensing, that is, sending the substrate to the corresponding position of the mounting binding head module 50, first using the second visual detector 501 for mounting identification, and then using the second dispensing mechanism 302 for dispensing.

[0109] Through the cooperation of the detection unit and the control module, the die bonding equipment can automatically match the corresponding placement process according to different chip types, thereby improving the automation of the equipment.

[0110] See also Figure 9 A second embodiment of the present invention provides a die bonding method, which uses the die bonding device 100 as described above to bond a chip to a substrate, comprising:

[0111] Step S1: The loading module loads the substrate onto the first track;

[0112] Step S2: The wafer supply module supplies chips to the second track through the transfer table module;

[0113] Step S3: the dispensing module performs dispensing on the substrate, and the second visual detector performs placement identification on the substrate, wherein the order of performing dispensing on the substrate and placement identification can be changed;

[0114] Step S4: The mounting and binding head module picks up the chip from the transfer table module and mounts it on the substrate;

[0115] Step S5: unloading the mounted substrate containing the chip through the unloading module.

[0116] It should be noted that in step S2, the crystal supply module 40 supplies chips to the second track 202 through the turntable module 80. Specifically, the crystal suction and binding head mechanism 401 grabs the chips in the crystal supply module 40 for initial calibration, and then transports the initially calibrated chips to the mounting station of the second track 202 through the turntable 702 to wait for mounting.

[0117] It can be understood that the order of dispensing and mounting identification in step S3 is interchangeable. By swapping the order of the two, two working modes, namely dispensing first and then identifying, and identifying first and then dispensing, can be realized to meet the mounting requirements of different types of chips.

[0118] It should be further explained that the crystal bonding method provided in this embodiment needs to go through the steps of feeding, crystal supply, glue dispensing, identification and mounting, and discharge in sequence. It should be understood that the above-mentioned crystal supply steps are all performed in different areas of the workbench 10, and the working modules used in the corresponding operations are also different. Therefore, in actual operation, some steps can be performed simultaneously to improve production efficiency.

[0119] As a feasible implementation method, in step S3, the substrate is first subjected to glue dispensing treatment, and then the mounting identification is performed; at this time, after receiving the substrate, the carrier 2011 will carry the substrate to the glue dispensing station through the first track 201, that is, the glue dispensing treatment is performed at the corresponding position of the first glue dispensing mechanism 301, so steps S1 and S3 need to be performed successively; and since the first glue dispensing mechanism 301, the crystal supply module 40, and the mounting binding head module 50 are located in different areas of the workbench 10, and they do not interfere with each other when working, they can work in parallel, that is, steps S2, step S3, step S4 and step S5 can all be performed simultaneously to improve the mounting efficiency.

[0120] As another feasible implementation method, in step S3, the substrate is first mounted and identified, and then glue is applied. At this time, the overall die bonding process is as follows: the carrier 2011 is located between the feed port 101 and the second track 202, the sub-track 2012 is docked with the feed port 101 and the second track 202, the substrate is transported from the feed port 101 to the sub-track 2012 and moved to the corresponding position of the mounting head module 50, and is identified, glued, and mounted by the mounting head module 50 and the second glue application mechanism 302.

[0121] It should be understood that since the second dispensing mechanism 302 is arranged on the mounting head module 50 and is controlled by the same driving mechanism, the movement of the two is synchronized, that is, the mounting head module 50 and the second dispensing mechanism 302 cannot operate on two different substrates at the same time; so in step S3, the substrate is first mounted and identified, and then the dispensing process is performed, and step S3 and step S4 cannot be processed in parallel; in this working mode, step S1, step S2, step S3 and step S5, or step S1, step S2, step S4 and step S5 can be processed in parallel to improve the mounting efficiency.

[0122] Specifically, the die bonding method provided in this embodiment has the same beneficial effects as the die bonding apparatus 100 described above, which will not be described in detail here.

[0123] Further, see Figure 10 The dispensing module 30 performs dispensing on the substrate, and the second visual detector 501 performs mounting identification on the substrate, including:

[0124] Step S31a: moving the substrate to a position corresponding to the first dispensing mechanism based on the first track, performing dispensing identification on the substrate using the first visual detector, and then performing dispensing processing on the substrate using the first dispensing mechanism;

[0125] Step S32a: Move the substrate to the second track, and perform placement identification on the substrate that has completed the glue dispensing process through the second visual detector.

[0126] In some embodiments, the carrier 2011 quickly transfers the substrate to the first dispensing mechanism 301 via the first track 201 for dispensing, and then returns to the original path to transfer the substrate to the second track 202 for mounting.

[0127] It can be understood that the first track 201 and the second track 202 are set independently of each other, so when the first dispensing mechanism 301 is working, it will not affect the work of the second visual detector 501, thereby ensuring the accuracy of dispensing or identification. Therefore, the first dispensing mechanism 301 and the second visual detector 501 can work at the same time, that is, the dispensing and identification processes are processed in parallel, thereby improving the overall mounting efficiency.

[0128] Further, see Figure 11 The dispensing module 30 performs dispensing on the substrate, and the second visual detector 501 performs mounting identification on the substrate, including:

[0129] Step S31b: moving the substrate to the corresponding position of the mounting and binding head module based on the second track, and performing mounting identification on the substrate through the second visual detector;

[0130] Step S32b: Based on the recognition result of the second visual detector, the substrate is subjected to a glue dispensing process by the second glue dispensing mechanism.

[0131] It can be understood that before dispensing glue, the second visual detector 501 is used to identify the mounting position of the substrate, and then the substrate is subjected to glue dispensing to avoid the situation where the glue coated on the substrate affects the identification due to glue dispensing first, so as to ensure the accuracy of the mounting.

[0132] Compared with the prior art, the die bonding device and die bonding method provided by the present invention have the following beneficial effects:

[0133] 1. In a die bonding device provided by an embodiment of the present invention, a gluing module and a mounting head module are respectively arranged corresponding to a first track and a second track. The substrate to be mounted can be quickly moved to the gluing or mounting station through the corresponding track to perform corresponding process operations. In addition, for the mounting of conventional chips, that is, the mounting of chips that are identified by the mounting will not be affected by the glue, the gluing and mounting processes can be processed in parallel, thereby improving the overall efficiency of the die bonding. Since the first track and the second track are independently arranged, the substrate will not affect other processes when performing the gluing or mounting process, thereby ensuring the accuracy of the gluing or mounting.

[0134] It can be understood that the mounting and binding head module is also provided with a second dispensing mechanism and a high-precision second visual detector. For some chips, if glue is coated on the substrate, it will affect the subsequent mounting position identification, resulting in mounting failure. For the mounting of such chips, the second visual detector can be used to first perform mounting identification, and then the second dispensing mechanism can be used to dispense glue based on the identification result.

[0135] The die bonding equipment provided in an embodiment of the present invention is provided with two independent dispensing mechanisms, so that the die bonding equipment can realize different mounting processes through different dispensing mechanisms, that is, the first dispensing mechanism is used to realize the working mode of dispensing first and then identifying. At this time, the dispensing and identification are completed on two independent modules respectively, so that the synchronous operation of dispensing and identification can be realized, thereby improving the overall mounting efficiency; the second dispensing mechanism is used to realize the working mode of identifying first and then dispensing, so as to meet the mounting requirements of chips where glue will affect the mounting identification.

[0136] The above design enables the device to adapt to the placement of different types of chips and has higher applicability.

[0137] 2. In the die bonding equipment provided by an embodiment of the present invention, the first dispensing mechanism corresponds to the first track, and the mounting head module corresponds to the second track. Therefore, in the working mode of dispensing first and then identifying, the first dispensing mechanism and the mounting head module can work simultaneously; secondly, since the accuracy requirement for identifying the dispensing position is usually lower than the accuracy requirement for identifying the mounting position during the chip mounting process, this embodiment is equipped with a low-precision first visual detector on the first dispensing mechanism for dispensing identification, which improves the detection speed and also plays a role in reducing costs.

[0138] 3. In the die bonding equipment provided in an embodiment of the present invention, a sub-track connecting the loading module and the second track is provided on the carrier plate. The loading module sends the substrate to the sub-track. The carrier plate moves down along the first track to send the substrate to the first dispensing mechanism for dispensing, and then moves up to the sub-track to dock with the first track, and transfers the substrate from the sub-track to the first track for mounting. The substrate can be quickly and stably transferred to various operating stations on different tracks through the carrier plate, thereby improving production efficiency and mounting quality.

[0139] 4. In the crystal bonding equipment provided by the embodiment of the present invention, a transfer track is provided between the crystal supply module and the second track. After the crystal suction and binding head mechanism grabs the chip, it performs initial calibration on the chip through the first upward-looking detector, and then quickly and stably transfers the initially calibrated chip to the second track through the transfer table, performs mounting calibration through the second upward-looking detector, and finally performs mounting processing. The mounting accuracy is guaranteed through multiple calibrations, and the chip is quickly transferred to the mounting station through the transfer table, which reduces the waiting time for mounting and thereby improves the overall mounting efficiency.

[0140] 6. In the die bonding equipment provided by the embodiment of the present invention, a material table for placing chips is also provided near the mounting station. By placing different chips on the turntable on the material table, the mounting head module can obtain different chips from the material table and the turntable for mounting, thereby realizing multi-chip mounting; secondly, when the turntable is waiting for the crystal supply module to pick up materials, the mounting head module can first perform the mounting operation through the chip on the material table, that is, the mounting head module mounting and the turntable picking up materials can be carried out simultaneously, thereby improving the overall chip mounting efficiency.

[0141] 7. The die bonding equipment provided in the embodiment of the present invention is provided with a detection unit for detecting the chip type and a control module for controlling the operation of each module. Through the cooperation of the detection unit and the control module, the die bonding equipment can automatically match the corresponding mounting process according to different chip types, thereby improving the automation of the equipment.

[0142] 8. An embodiment of the present invention also provides a die bonding method for fixing a chip to a substrate by using a die bonding device as described in any of the above items, comprising a loading module loading the substrate onto a first track; a die supply module supplying the chip to a second track via a turntable module; a gluing module performing gluing on the substrate, and a second visual detector performing mounting identification on the substrate, wherein the order of performing gluing and mounting identification on the substrate is replaceable; a mounting head module sucking the chip from the turntable module for mounting on the substrate; and unloading the mounted substrate containing the chip via an unloading module.

[0143] It can be understood that the order of dispensing and mounting identification in the die bonding method provided in this embodiment is replaceable. By swapping the order of the two, two working modes can be realized: dispensing first and then identifying, and identifying first and then dispensing, to meet the mounting requirements of different types of chips.

[0144] Specifically, the die bonding method provided in this embodiment has the same beneficial effects as the die bonding equipment described in any of the above items, which will not be described in detail here.

[0145] 9. In a die bonding method provided in an embodiment of the present invention, a working mode of first dispensing glue and then identifying is provided. Specifically, the substrate is first moved to the corresponding position of the first dispensing mechanism through the first track for dispensing glue identification and dispensing glue, and then the substrate is moved to the second track for mounting identification.

[0146] It can be understood that the first track and the second track are set independently of each other, and the first dispensing mechanism and the second visual detector are also independent of each other. Therefore, when the first dispensing mechanism is working, it will not affect the work of the second visual detector, thereby ensuring the accuracy of dispensing or identification. Therefore, the first dispensing mechanism and the second visual detector can work at the same time, that is, the dispensing and identification processes are processed in parallel, thereby improving the overall mounting efficiency.

[0147] 10. The die bonding method provided in an embodiment of the present invention also provides a working mode of first identifying and then dispensing glue. Specifically, the substrate is moved to the corresponding position of the mounting binding head module, first identified and processed by a second visual detector, and then glued using a second dispensing mechanism based on the identification result.

[0148] It can be understood that the second visual detector is used to identify the mounting position of the substrate before dispensing glue to avoid the situation where the glue coated on the substrate affects the identification due to dispensing glue first, so as to ensure the accuracy of the mounting; at the same time, the detection results of the second visual detector can also be applied to both the dispensing and mounting processes at the same time, reducing the number of identification times and improving work efficiency.

[0149] The above is a detailed introduction to a crystal bonding device and a crystal bonding method disclosed in an embodiment of the present invention. Specific examples are used herein to illustrate the principles and implementation methods of the present invention. The description of the above embodiments is only used to help understand the method of the present invention and its core idea. At the same time, for those skilled in the art, according to the idea of ​​the present invention, there will be changes in the specific implementation methods and application scope. In summary, the content of this specification should not be understood as a limitation on the present invention. Any modifications, equivalent replacements and improvements made within the principles of the present invention should be included in the scope of protection of the present invention.

Claims

1. A die bonding device, characterized in that: It includes a workbench and a loading module, a track module, a dispensing module, a crystal supply module, a transfer table module, a mounting head module and a blanking module arranged on the workbench; The loading module and the unloading module are respectively arranged at opposite ends of the workbench, and the track module includes a first track and a second track, the second track is arranged along the connecting direction of the loading module and the unloading module, and the first track is arranged between the loading module and the second track and extends downward along the width direction of the second track; The dispensing module includes a first dispensing mechanism and a second dispensing mechanism, wherein the first dispensing mechanism is arranged at an end of the first track away from the second track; The crystal supply module and the transfer table module are located on the side of the second track close to the first dispensing mechanism; The mounting and binding head module is arranged above the second track, and a second visual detector and a second dispensing mechanism are provided on the mounting and binding head module, and the second dispensing mechanism and the mounting and binding head module move synchronously; The die bonding equipment further includes a control module, which is signal-connected to the track module, the dispensing module, the die supply module, the placement and binding head module, the loading module, the unloading module, and the transfer table module. The loading module and / or the die supply module is provided with a detection unit, which is used to detect the type of the substrate and the chip; The control module controls the first dispensing mechanism to execute a working mode of dispensing first and then identifying, or controls the second dispensing mechanism to execute a working mode of identifying first and then dispensing, according to the types of substrates and chips detected by the detection unit; The working mode of dispensing first and then identifying includes the following steps: dispensing identification, dispensing processing, mounting identification, and mounting processing; the working mode of identifying first and then dispensing includes the following steps: mounting identification, dispensing processing, and mounting processing; The second dispensing mechanism and the mounting and binding head module perform dispensing and mounting processes based on a detection result of the second visual detector.

2. The die bonding device according to claim 1, wherein: The first dispensing mechanism is provided with a first visual detector, and the detection accuracy of the second visual detector is higher than the detection accuracy of the first visual detector.

3. The die bonding device according to claim 1, wherein: The first dispensing mechanism corresponds to the first track, and the mounting head module corresponds to the second track. The first dispensing mechanism and the mounting head module can work simultaneously or in a time-sharing manner.

4. The die bonding device according to claim 1, wherein: A carrier plate is provided on the first track, and the carrier plate is slidably connected to the first track. A secondary track parallel to the second track is provided on the carrier plate. When the carrier plate is located at the end of the second track, the secondary track is connected to the second track.

5. The die bonding device according to claim 1, wherein: The transfer table module includes a transfer track and a transfer table. The transfer track is located on the side of the crystal supply module and extends toward the second track. The transfer track is provided with a first upward-looking detector at one end close to the crystal supply module and a second upward-looking detector at one end close to the second track. The transfer table is slidably connected to the transfer track. The crystal supply module includes a crystal suction head binding mechanism, which can move between the crystal supply module and the transfer table.

6. The die bonding device according to claim 5, wherein: The workbench is also provided with a material table and a mounting bracket. The material table is arranged on the transfer track close to one end of the first track; the mounting bracket is arranged parallel to the first track, and the mounting head module is slidably connected to the mounting bracket. The mounting head module is movable along the length direction of the second track through the mounting bracket, and the mounting bracket as a whole is movable along the width direction of the second track.

7. The die bonding device according to claim 5, wherein: The crystal-absorbing and binding head mechanism performs a first calibration on the chip according to the detection result of the first upward-looking detector; and the crystal-absorbing and binding head mechanism performs a second calibration on the chip according to the detection result of the second upward-looking detector.

8. A die bonding method, comprising: fixing a chip to a substrate using the die bonding device according to any one of claims 1 to 7, wherein: include: Step S1: The loading module loads the substrate onto the first track; Step S2: The wafer supply module supplies chips to the second track through the transfer table module; Step S3: the dispensing module performs dispensing on the substrate, and the second visual detector performs placement identification on the substrate, wherein the order of performing dispensing on the substrate and placement identification can be changed; Wherein, step S3 further includes: Step S31a: moving the substrate to a position corresponding to the first dispensing mechanism based on the first track, performing dispensing identification on the substrate using the first visual detector, and then performing dispensing processing on the substrate using the first dispensing mechanism; Step S32a: moving the substrate onto the second track, and performing placement recognition on the substrate after the dispensing process using a second visual detector; and / or Step S31b: moving the substrate to the corresponding position of the mounting and binding head module based on the second track, and performing mounting identification on the substrate through the second visual detector; Step S32b: performing glue dispensing on the substrate by a second glue dispensing mechanism based on the recognition result of the second visual detector; Step S4: The mounting and binding head module picks up the chip from the transfer table module and performs mounting processing on the substrate based on the result of the mounting recognition; Step S5: unloading the mounted substrate containing the chip through the unloading module.

9. The die bonding method according to claim 8, wherein: When the substrate is first glued and then subjected to placement recognition in step S3, steps S2, S3, S4 and S5 can be performed simultaneously; When the substrate is first subjected to placement identification and then to glue dispensing in step S3, steps S1, S2, S3 and S5 can be processed in parallel, or steps S1, S2, S4 and S5 can be processed in parallel.

10. The die bonding method according to claim 8, wherein: The first dispensing mechanism and the second visual detector can work simultaneously to perform dispensing processing and placement recognition in parallel.

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