Wafer Automatic Loading Device and Its Control Method

Abstract

The present disclosure provides a wafer automatic loading device and a control method thereof, belonging to the technical field of wafer loading equipment, and is used to solve the problem of how to reduce the risk of wafer breakage caused by misoperation of staff. The wafer automatic loading device includes: a machine platform frame, a carrier module, a baffle module, and an open cover detection module. The carrier module is arranged on the machine platform frame, and is used to fix the wafer cassette, and drive the wafer cassette to move between an open cover station and a detection station linearly arranged along the opening direction of the cover of the wafer cassette through a linear drive mechanism; the baffle module includes a left baffle component, a right baffle component, and a lifting baffle component arranged around the carrier module, the lifting baffle component is arranged between the left baffle component and the right baffle component in a liftable manner, and is driven to lift by a baffle drive mechanism; the open cover detection module includes a lifting mechanism, an open cover component, and a detection component for detecting the wafers inside the wafer cassette.

Description

Technical Field

[0001] The present disclosure relates to a wafer automatic loading device and a control method thereof, belonging to the technical field of wafer loading equipment. Background Art

[0002] In the field of semiconductor manufacturing, wafers, as the basic materials for chip manufacturing, the accuracy and stability of their processing processes are crucial. Wafer automatic loading equipment is a key device in semiconductor production lines to achieve efficient and precise transfer and loading of wafers. It can automatically complete the loading process of wafers from wafer cassettes to processing equipment, greatly improving production efficiency and reducing errors caused by manual operations.

[0003] During the actual operation of wafer automatic loading equipment, when a wafer cassette is loaded into the equipment, usually two key operations need to be performed. On the one hand, it is necessary to unlock the wafer cassette. The wafer cassette is often designed with a locking mechanism to ensure the safety and stability of wafers during transportation and storage. Unlocking the wafer cassette in the loading equipment is to enable the equipment to smoothly obtain the wafers inside the wafer cassette and take them out for subsequent processing. On the other hand, it is also an essential link to detect the wafers inside the wafer cassette. Through detection, the equipment can accurately obtain important information such as the number, position, and whether there are defects of the wafers in the wafer cassette, so as to provide precise guidance for subsequent loading operations and ensure that the wafers can be taken out correctly and placed at the designated position.

[0004] However, the existing wafer automatic loading equipment has the problem that the protection measures for wafer cassettes are not perfect enough. In the actual production environment, it is inevitable that the operations of staff will be negligent or incorrect. Due to the lack of an effective protection mechanism for wafer cassettes in the existing equipment, when staff make misoperations, such as forcibly operating when the wafer cassette is not yet fully stable, it is very likely to cause damage to the wafers inside the wafer cassette, that is, the phenomenon of broken wafers. Broken wafers will not only cause waste of the wafers themselves, increase production costs, but also affect the normal operation of the production line, resulting in reduced production efficiency, and may even lead to more serious equipment failures or safety accidents.

[0005] At the same time, the existing wafer automatic loading equipment needs to be configured with a horizontal movement mechanism on the cover opening component, resulting in a relatively high manufacturing cost. When the cover of the wafer cassette is fixed by the cover opening component, the existing wafer automatic loading equipment drives the cover opening component to move horizontally to open the cover through the horizontal movement mechanism, otherwise it will interfere with the lifting movement of the cover opening component, which leads to a relatively complex structure of the wafer automatic loading equipment and a high manufacturing cost.

[0006] It should be noted that the information disclosed in the above background art section is only used to strengthen the understanding of the background of the present disclosure, and thus may include information that does not constitute the prior art known to those of ordinary skill in the art. Summary of the Invention

[0007] To solve one of the above technical problems, the present disclosure provides a wafer automatic loading device and a control method thereof.

[0008] According to one aspect of the present disclosure, there is provided a wafer automatic loading device, which includes: a machine platform frame; a carrier module disposed on the machine platform frame for fixing a wafer cassette and provided with a linear drive mechanism for driving the wafer cassette to move between an open lid station and an inspection station, where the inspection station and the open lid station are linearly arranged along the opening direction of the lid of the wafer cassette; a baffle module including a left baffle component, a right baffle component and a lifting baffle component disposed around the carrier module, the left baffle component and the right baffle component are disposed on the machine platform frame, the lifting baffle component is slidably disposed between the left baffle component and the right baffle component and is provided with a baffle drive mechanism, the baffle drive mechanism is disposed on the left baffle component or the right baffle component and is used to drive the lifting baffle component to move up and down; an open lid inspection module including a lifting mechanism, an open lid component and an inspection component, the lifting mechanism is disposed on the machine platform frame and is connected to the open lid component, the open lid component is used to fix and unlock the lid of the wafer cassette located at the open lid station, the inspection component is disposed on the open lid component and is used to inspect the wafers inside the wafer cassette located at the inspection station. Among them, the left baffle component and the right baffle component are fixedly disposed on two opposite sides of the machine platform frame and each is provided with a chute; the lifting baffle component includes at least three baffles slidably disposed in the chute, the baffles are arranged in sequence from top to bottom and are stacked in sequence along a horizontal direction, vertical extending slideways are respectively disposed between adjacent baffles and sliders slidably engaged with the slideways; wherein, the baffle drive mechanism is connected to the uppermost baffle; among two adjacent baffles, when the upper baffle moves upward, the lower baffle is driven to move upward through the slider.

[0009] According to the wafer automatic loading device of at least one embodiment of the present disclosure, a mounting plate is fixedly arranged on the inner side of the left baffle assembly or the right baffle assembly; the baffle driving mechanism includes a baffle driving cylinder, a connecting block, a first synchronous belt, a first pulley, a rotating shaft, a second synchronous belt, and a second pulley; the driving cylinder is arranged on the mounting plate and is provided with a piston rod, the piston rod, the connecting block, and the first synchronous belt are fixedly connected in sequence, the first synchronous belt is connected to the two first pulleys, the first pulleys are rotatably arranged on the mounting plate through wheel shafts, and the wheel shaft of one of the first pulleys is in transmission connection with the rotating shaft, and the connection line of the two first pulleys is parallel to the piston rod; the rotating shaft is rotatably arranged between the left baffle assembly and the right baffle assembly, and is provided with the second pulley, the left baffle assembly and / or the right baffle assembly is provided with the second pulley above the rotating shaft, the second synchronous belt is connected between the rotating shaft and the second pulley on the left baffle assembly or between the rotating shaft and the second pulley on the right baffle assembly, and the second synchronous belt is connected to the uppermost baffle.

[0010] According to the wafer automatic loading device of at least one embodiment of the present disclosure, the baffle driving mechanism further includes a third synchronous belt, a tensioning pulley, and two third pulleys, one of the third pulleys is fixedly connected to the wheel shaft of the first pulley, the other third pulley is fixedly arranged on the rotating shaft, the third synchronous belt is connected between the two third pulleys, and the tensioning pulley is rotatably arranged on the mounting plate and is used for tensioning the third synchronous belt.

[0011] According to the wafer automatic loading device of at least one embodiment of the present disclosure, the baffle driving mechanism further includes a first guide rail, the first guide rail is fixedly arranged on the mounting plate and is parallel to the piston rod of the baffle driving cylinder, the connecting block is fixedly provided with a sliding seat, and the sliding seat is slidably connected to the first guide rail.

[0012] According to the wafer automatic loading device of at least one embodiment of the present disclosure, the left baffle assembly, the right baffle assembly, the lifting baffle assembly, and the machine table frame form a square space around the stage module.

[0013] The wafer automatic loading device according to at least one embodiment of the present disclosure, the stage module includes: a module bottom plate, a guide rail assembly, a stage assembly, and a fixing mechanism; the module bottom plate is fixedly arranged on the machine table frame, the guide rail assembly is fixedly arranged on the module bottom plate, the stage assembly is slidably arranged on the guide rail assembly for placing the wafer cassette, the linear drive mechanism includes a ball screw assembly, the ball screw assembly is fixedly arranged on the module bottom plate and connected to the stage assembly for driving the stage assembly to move between the open - cover station and the detection station along the guide rail assembly, and the fixing mechanism is arranged on the stage assembly for fixing the wafer cassette on the stage assembly.

[0014] The wafer automatic loading device according to at least one embodiment of the present disclosure, the open - cover assembly includes a fixing component for fixing the lid, an unlocking component for unlocking the lid, and a fitting plate for mounting the fixing component and the unlocking component; the unlocking component includes at least two key pins rotatably arranged on the fitting plate, a link component connected to the two key pins, and an unlocking cylinder connected to the link component; the link component includes a first rotating rod, a second rotating rod, and an intermediate rod, two ends of the first rotating rod are respectively hinged to the piston rod of the unlocking cylinder and one end of the intermediate rod, and the middle of the first rotating rod is connected to one of the unlocking pins, one end of the second rotating rod is connected to the unlocking pin, and the other end is fixedly connected to one end of the intermediate rod; wherein, the first rotating rod and the second rotating rod are parallel to each other, the intermediate rod and the piston rod of the unlocking cylinder are parallel to each other and are arranged in a parallelogram, and the two key pins are arranged at the middle positions of the opposite sides of the parallelogram.

[0015] The wafer automatic loading device according to at least one embodiment of the present disclosure, the detection component includes a detection frame, a telescopic cylinder, and a detection sensor; the detection frame is rotatably arranged on the open - cover assembly and is provided with an arc - shaped track groove, the telescopic cylinder is fixedly arranged on the open - cover assembly, and its piston rod is provided with a roller, the roller is arranged inside the track groove; the detection sensor is arranged on the detection frame; wherein, when the piston rod of the telescopic cylinder moves, the roller pushes the groove wall of the track groove to rotate the detection frame, so that the detection sensor moves from outside the wafer cassette to inside or from inside the wafer cassette to outside.

[0016] According to another aspect of the present disclosure, a control method for a wafer automatic loading device is provided, the control method is used to control the wafer automatic loading device of any one of the above, and includes the following steps:

[0017] After the wafer cassette is placed on the stage module, the baffle driving mechanism drives the lifting baffle assembly to rise; the stage module fixes the wafer cassette at the detection station; the linear driving mechanism drives the wafer cassette to move forward from the detection station to the lid-opening station; the lid-opening assembly fixes and unlocks the lid of the wafer cassette located at the lid-opening station; the linear driving mechanism drives the wafer cassette to move backward from the lid-opening station to the detection station, separating the wafer cassette from the lid and enabling the lifting movement of the lid-opening assembly and the detection assembly to be free from interference by the wafer cassette; the lifting mechanism controls the lifting movement of the detection assembly, and the detection assembly detects the wafers inside the wafer cassette.

[0018] Compared with the prior art, the beneficial effects brought by the technical solutions provided in the embodiments of the present application at least include: The wafer automatic loading device of the present application improves the protection performance of wafers through the baffle module. After the wafer cassette is placed on the stage module, the baffle driving mechanism drives the lifting baffle assembly to rise, so that the left baffle assembly, the right baffle assembly, and the lifting baffle assembly are arranged around the stage module to form a protection structure to protect the wafer cassette and prevent fragmentation caused by misoperation. The wafer automatic loading device of the present application reduces the manufacturing cost through the coordinated action of the stage module and the lid-opening and detection module. After the lid-opening assembly fixes and unlocks the lid of the wafer cassette located at the lid-opening station, the linear driving mechanism drives the wafer cassette to move backward from the lid-opening station to the detection station, separating the wafer cassette from the lid and enabling the lifting movement of the lid-opening assembly and the detection assembly to be free from interference by the wafer cassette. Compared with the existing wafer automatic loading equipment, the wafer automatic loading device of the present application does not need to configure a horizontal movement mechanism on the lid-opening assembly to open the lid. Instead, it uses the horizontal driving mechanism of the stage module to drive the wafer cassette to move, and then opens the lid. That is, the horizontal driving mechanism has the functions of driving the wafer cassette to move between the detection station and the lid-opening station and opening the lid of the wafer cassette at the same time. When the wafer cassette returns to the detection station, the lid-opening action can be completed synchronously. In this way, the wafer automatic loading device of the present application can save the use of the horizontal driving mechanism, thereby reducing the manufacturing cost. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] The drawings illustrate exemplary embodiments of the present disclosure and, together with the description thereof, are used to explain the principles of the present disclosure. These drawings are included to provide a further understanding of the present disclosure, and the drawings are included in this specification and form a part of this specification.

[0020] Figure 1 is a perspective view of a wafer automatic loading device according to an embodiment of the present disclosure.

[0021] Figure 2 is an exploded view of a wafer automatic loading device according to an embodiment of the present disclosure.

[0022] Figure 3It is a top view of a wafer automatic loading device according to an embodiment of the present disclosure.

[0023] Figure 4 is Figure 3 a perspective sectional view of cross-section A in

[0024] Figure 5 It is a perspective view of a baffle module with some components removed according to an embodiment of the present disclosure.

[0025] Figure 6 It is a partial perspective view of a baffle module according to an embodiment of the present disclosure.

[0026] Figure 7 It is a perspective view of baffles connected in sequence through a slideway and a slider according to an embodiment of the present disclosure.

[0027] Figure 8 It is an exploded view of a stage module and a wafer cassette according to an embodiment of the present disclosure.

[0028] Figure 9 It is a perspective view of the internal structure of a stage module according to an embodiment of the present disclosure.

[0029] Figure 10 It is an exploded view of an open cover detection module according to an embodiment of the present disclosure.

[0030] Figure 11 It is a perspective view of the internal structure of an open cover assembly according to an embodiment of the present disclosure.

[0031] Figure 12 It is a perspective view of a detection component according to an embodiment of the present disclosure.

[0032] Figure 13 It is a perspective view of a track groove according to an embodiment of the present disclosure.

[0033] Specifically, the reference numerals in the figure are:

[0034] 100 Wafer automatic loading device

[0035] 110 Machine table frame

[0036] 120 Stage module

[0037] 121 Linear drive mechanism

[0038] 122 Module bottom plate

[0039] 123 Guide rail assembly

[0040] 124 Stage assembly

[0041] 125 Fixing mechanism

[0042] 130 Baffle module

[0043] 131 Left baffle assembly

[0044] 132 Right baffle assembly

[0045] 133 Lifting baffle assembly

[0046] 134 Baffle drive mechanism

[0047] 131A Slide groove

[0048] 131B Mounting plate

[0049] 133A Baffle

[0050] 133B Slideway

[0051] 133C Slide block

[0052] 134A Baffle drive cylinder

[0053] 134B Connecting block

[0054] 134C First synchronous belt

[0055] 134D First pulley

[0056] 134E Rotating shaft

[0057] 134F Second synchronous belt

[0058] 134G Second pulley

[0059] 134H Third synchronous belt

[0060] 134I Tensioning pulley

[0061] 134J Third pulley

[0062] 134K First guide rail

[0063] 140 Open cover detection module

[0064] 141 Lifting mechanism

[0065] 142 Open cover assembly

[0066] 143 Detection assembly

[0067] 144 Module backplane

[0068] 142A Fixing assembly

[0069] 142B Fitting plate

[0070] 142C Key pin

[0071] 142D unlocking cylinder

[0072] 142E first rotating rod

[0073] 142F second rotating rod

[0074] 142G intermediate rod

[0075] 143A detection frame

[0076] 143B telescopic cylinder

[0077] 143C detection sensor

[0078] 143D track groove

[0079] 143E roller

[0080] 150 wafer cassette

[0081] 151 lid. Detailed implementation manners

[0082] The present disclosure will be further described in detail below in conjunction with the accompanying drawings and implementation manners. It can be understood that the specific implementation manners described herein are only used to explain the relevant content and do not limit the present disclosure. Additionally, it should be noted that for the convenience of description, only the parts related to the present disclosure are shown in the accompanying drawings.

[0083] It should be noted that, without conflict, the implementation manners in the present disclosure and the features in the implementation manners can be combined with each other. The technical solutions of the present disclosure will be described in detail below with reference to the accompanying drawings and in conjunction with the implementation manners.

[0084] Unless otherwise specified, the exemplary implementation manners / embodiments shown will be understood to provide exemplary features of various details of some ways that can implement the technical concept of the present disclosure in practice. Therefore, unless otherwise specified, without departing from the technical concept of the present disclosure, the features of various implementation manners / embodiments can be additionally combined, separated, interchanged, and / or rearranged.

[0085] In the drawings, the use of hatching and / or shading is generally used to make the boundaries between adjacent components clear. Thus, unless stated otherwise, the presence or absence of hatching or shading does not convey or imply any preference or requirement for the specific material, material properties, dimensions, proportions, commonality between the components shown, and / or any other characteristics, attributes, properties, etc. of the components. In addition, in the drawings, for clarity and / or descriptive purposes, the dimensions and relative dimensions of components may be exaggerated. When an exemplary embodiment can be implemented differently, the specific process order may be performed in a different order than that described. For example, two consecutively described processes may be performed substantially simultaneously or in an order opposite to that described. In addition, the same reference numerals denote the same components.

[0086] When a component is referred to as being "on" or "above" another component, "connected to" or "coupled to" another component, the component can be directly on the other component, directly connected to or directly coupled to the other component, or there may be intervening components. However, when a component is referred to as being "directly on" another component, "directly connected to" or "directly coupled to" another component, there are no intervening components. For this reason, the term "connected" can refer to a physical connection, an electrical connection, etc., and can have or not have intervening components.

[0087] For descriptive purposes, the present disclosure may use spatial relative terms such as "under", "below", "beneath", "down", "above", "on", "over", "upper", and "side (e.g., as in "sidewall")" to describe the relationship of one component to another (other) component as shown in the drawings. In addition to the orientation depicted in the drawings, the spatial relative terms are also intended to encompass different orientations of the device during use, operation, and / or manufacture. For example, if the device in the drawings is flipped, a component described as being "under" or "beneath" another component or feature will then be positioned "above" the other component or feature. Thus, the exemplary term "under" can encompass both the "above" and "below" orientations. In addition, the device may be otherwise positioned (e.g., rotated 90 degrees or at other orientations), and accordingly, the spatial relative descriptors used herein are to be interpreted.

[0088] The terms used herein are for the purpose of describing particular embodiments and are not intended to be limiting. As used herein, unless the context clearly indicates otherwise, the singular forms "a", "an" and "the" are also intended to include the plural forms. In addition, when the terms "comprise" and / or "include" and their variants are used in this specification, it is stated that there are the stated features, integers, steps, operations, components, assemblies and / or groups thereof, but do not preclude the presence or addition of one or more other features, integers, steps, operations, components, assemblies and / or groups thereof. It should also be noted that, as used herein, the terms "substantially", "about" and other similar terms are used as approximate terms and not as terms of degree, so they are used to explain the inherent deviations of measured values, calculated values and / or provided values that would be recognized by a person of ordinary skill in the art.

[0089] The existing wafer automatic loading device lacks an effective protection mechanism for the wafer cassette. When the staff makes a misoperation, it is possible to cause damage to the wafers in the wafer cassette, that is, the phenomenon of broken wafers occurs. At the same time, the existing wafer automatic loading equipment needs to configure a horizontal movement mechanism on the opening cover assembly to drive the opening of the cover, resulting in a higher manufacturing cost.

[0090] To solve the above technical problems, refer to Figure 1 as shown in Figure 1 is a perspective view of a wafer automatic loading device according to an embodiment of the present disclosure. In this embodiment, a wafer automatic loading device 100 is provided.

[0091] Figure 2 is an exploded view of a wafer automatic loading device according to an embodiment of the present disclosure.

[0092] As Figure 2 shown, the wafer automatic loading device 100 includes: a machine frame 110, a stage module 120, a baffle module 130, and an opening cover detection module 140.

[0093] The machine frame 110 serves as an installation carrier for the stage module 120, the baffle module 130, and the opening cover detection module 140.

[0094] Figure 3 is a top view of a wafer automatic loading device according to an embodiment of the present disclosure, Figure 4 is Figure 3 a sectional perspective view of section A in

[0095] As Figure 3 and Figure 4As shown, the stage module 120 is disposed on the machine frame 110 and is used to fix the wafer cassette 150. The stage module 120 is provided with a linear drive mechanism 121, and the linear drive mechanism 121 is used to drive the wafer cassette 150 to move between the lid-opening station and the detection station, as Figure 3 shown. In the figure, the area of the wafer cassette 150 with a solid-line edge is the lid-opening station, and the area of the wafer cassette 150 with a dashed-line edge is the detection station. The detection station and the lid-opening station are linearly arranged along the opening direction of the lid 151 of the wafer cassette 150, that is, the lid-opening station is closer to the lid-opening detection module 140, so that when the lid 151 of the wafer cassette 150 is fixed and the wafer cassette 150 moves from the lid-opening station to the detection station, the wafer cassette 150 can be automatically separated from the lid 151.

[0096] Figure 5 is a perspective view of a baffle module with some components removed according to an embodiment of the present disclosure.

[0097] Referring to Figure 3 and Figure 5 shown, the baffle module 130 includes a left baffle component 131, a right baffle component 132, and a lifting baffle component 133 disposed around the stage module 120, which plays a protective role for the wafer cassette 150 to avoid accidental touch and misoperation. The left baffle component 131 and the right baffle component 132 are disposed on the machine frame 110. The lifting baffle component 133 is movably disposed between the left baffle component 131 and the right baffle component 132 and is provided with a baffle drive mechanism 134. The baffle drive mechanism 134 is disposed on the left baffle component 131 or the right baffle component 132 and is used to drive the lifting baffle component 133 to move up and down, thereby opening or closing the baffle module 130 to allow or prevent operators from operating.

[0098] Figure 10 is an exploded view of a lid-opening detection module according to an embodiment of the present disclosure;

[0099] Referring to Figure 4 and Figure 10 shown, the lid-opening detection module 140 includes a lifting mechanism 141, a lid-opening component 142, and a detection component 143. The lifting mechanism 141 is disposed on the machine frame 110 and is connected to the lid-opening component 142. The lid-opening component 142 is used to fix and unlock the lid 151 of the wafer cassette 150 located at the lid-opening station. The detection component 143 is disposed on the lid-opening component 142 and is used to detect the wafers inside the wafer cassette 150 located at the detection station.

[0100] Figure 6 is a partial perspective view of a baffle module according to an embodiment of the present disclosure, Figure 7A perspective view of baffles connected in sequence through a slideway and a slider according to an embodiment of the present disclosure.

[0101] As Figure 6 and Figure 7 shown, the above-mentioned left baffle assembly 131 and right baffle assembly 132 are arranged on the machine table frame 110, and the lifting baffle assembly 133 is arranged between the left baffle assembly 131 and the right baffle assembly 132 in a liftable and movable manner, which can be achieved in the following way: The left baffle assembly 131 and the right baffle assembly 132 are fixedly arranged on two opposite side surfaces of the machine table frame 110, such as fixed on the machine table frame 110 by screws. Each of the left baffle assembly 131 and the right baffle assembly 132 is provided with a chute 131A, and the positions of the chutes 131A are opposite to each other. The lifting baffle assembly 133 includes at least three baffles 133A slidably arranged in the chute 131A. The baffles 133A are arranged in sequence from top to bottom and are stacked in sequence along a horizontal direction. Vertical slideways 133B extending vertically and sliders 133C slidably matched with the slideways 133B are respectively arranged between adjacent baffles 133A; wherein, the baffle driving mechanism 134 is connected to the uppermost baffle 133A; among two adjacent baffles 133A, when the upper baffle 133A moves upward, the lower baffle 133A is driven to move upward through the slider 133C. When the baffle driving mechanism 134 drives the uppermost baffle 133A to descend, the lower baffle 133A can descend by its own weight. The baffle 133A is guided by sliding through the chute 131A, and at the same time, it is matched with the adjacent baffle 133A through the slideway 133B and the slider 133C. The double limit and guidance realize the stable lifting of the baffle 133A, and the movement of the lower baffle 133A is driven by the upper baffle 133A, which simplifies the driving structure and makes the lifting operation of the baffle 133A more efficient; equally importantly, the baffles 133A can be directly stacked, which can effectively reduce the storage space required after descending and reduce the space occupation; the baffle 133A can be quickly lifted before the equipment works through lifting movement, preventing personnel from entering the working area and affecting the operation of the machine table and the safety of personnel, and effectively reducing the risk of fragmentation caused by misoperation of the staff.

[0102] As Figure 6As shown, in some embodiments, the baffle driving mechanism 134 is disposed on the left baffle assembly 131 or the right baffle assembly 132 and is used to drive the lifting baffle assembly 133. The baffle driving mechanism 134 drives the lifting baffle assembly 133 to move up and down in the following manner: An installation plate 131B is fixedly disposed inside the left baffle assembly 131 or the right baffle assembly 132, and the installation plate 131B serves as the installation carrier of the baffle driving mechanism 134. The baffle driving mechanism 134 includes a baffle driving cylinder 134A, a connecting block 134B, a first synchronous belt 134C, a first pulley 134D, a rotating shaft 134E, a second synchronous belt 134F, and a second pulley 134G; The driving cylinder 134A is disposed on the installation plate 131B and is provided with a piston rod. The piston rod, the connecting block 134B, and the first synchronous belt 134C are fixedly connected in sequence, such as by bolt fixation. The first synchronous belt 134C is connected to the two first pulleys 134D. The first pulley 134D is rotatably disposed on the installation plate 131B through a wheel shaft, and the wheel shaft of one of the first pulleys 134D is in transmission connection with the rotating shaft 134E. The connection line of the two first pulleys 134D is parallel to the piston rod. The rotating shaft 134E is rotatably disposed between the left baffle assembly 131 and the right baffle assembly 132, such as its two ends are respectively rotatably installed on bearings preset in the left baffle assembly 131 and the right baffle assembly 132. Two synchronous belt mechanisms are respectively disposed at both ends of the rotating shaft 134E, that is, two second pulleys 134G are respectively disposed at both ends of the rotating shaft 134E. One second pulley 134G is disposed above the rotating shaft 134E on each of the left baffle assembly 131 and the right baffle assembly 132. There are two second synchronous belts 134F, which are respectively connected between the rotating shaft 134E and the second pulley 134G on the left baffle assembly 131 and between the rotating shaft 134E and the second pulley 134G on the right baffle assembly 132, and the second synchronous belt 134F is connected to the uppermost baffle 133A. Of course, the rotating shaft 134E can also be provided with only one synchronous belt mechanism to drive the baffle 133A to move up and down. The beneficial effect of this driving mechanism is that through the transmission method of the synchronous belt and the pulley, the stable driving of the baffle driving cylinder 134A on the baffle 133A is realized. The transmission process is stable, and the lifting position of the baffle 133A can be accurately controlled; at the same time, by being installed on the installation plate 131B of the left baffle assembly 131 or the right baffle assembly 132, the internal space of the baffle module 130 is fully utilized, the overall structural layout of the baffle module 130 is optimized, and the space occupied by the baffle module 130 is reduced.

[0103] Further, as Figure 6As shown, in an embodiment where the above-mentioned axle is in driving connection with the rotating shaft 134E, the baffle driving mechanism 134 further includes a third synchronous belt 134H, a tension pulley 134I, and two third belt pulleys 134J. One of the third belt pulleys 134J is fixedly connected to the axle of the first belt pulley 134D, and the other third belt pulley 134J is fixedly arranged on the rotating shaft 134E. The third synchronous belt 134H is connected between the two third belt pulleys 134J. The tension pulley 134I is rotatably arranged on the mounting plate 131B and is used to tension the third synchronous belt 134H. The third synchronous belt 134H and the third belt pulleys 134J optimize the transmission unit of the baffle driving mechanism 134, making the power transmission smoother, avoiding slipping during the transmission process, and improving the accuracy and stability of the transmission.

[0104] It can be understood that the driving connection between the axle and the rotating shaft 134E can also be achieved through an existing gear transmission mechanism or a chain transmission mechanism.

[0105] Refer to Figure 6 As shown, in order to improve the stability of the movement of the first synchronous belt 134C, the baffle driving mechanism 134 further includes a first guide rail 134K. The first guide rail 134K is fixedly arranged on the mounting plate 131B by bolts and is parallel to the piston rod of the baffle driving cylinder 134A. The connecting block 134B is fixedly provided with a sliding seat, and the sliding seat is slidably connected to the first guide rail 134K. The cooperation between the first guide rail 134K and the sliding seat provides accurate guidance for the movement of the connecting block 134B, enabling the connecting block 134B to move stably along a straight line under the drive of the piston rod, thereby ensuring the accuracy of the movement of the baffle driving mechanism 134.

[0106] As Figure 3 As shown, in some embodiments, the left baffle assembly 131, the right baffle assembly 132, the lifting baffle assembly 133, and the machine table frame 110 form a square space around the stage module 120. The square space provides good protection and positioning for the stage module 120, and can effectively prevent external factors from interfering with the stage module 120.

[0107] Figure 8 is an exploded view of a stage module and a wafer cassette according to an embodiment of the present disclosure, Figure 9 is a perspective view of the internal structure of a stage module according to an embodiment of the present disclosure.

[0108] Refer to Figure 8 and Figure 9As shown, in some embodiments of the above-mentioned stage module 120, the stage module 120 includes: a module base plate 122, a guide rail assembly 123, a stage assembly 124, and a fixing mechanism 125; the module base plate 122 is fixedly arranged on the machine frame 110, the guide rail assembly 123 is fixedly arranged on the module base plate 122, the stage assembly 124 is slidably arranged on the guide rail assembly 123 for placing the wafer cassette 150, the linear drive mechanism 121 includes a ball screw assembly, the ball screw assembly is fixedly arranged on the module base plate 122 and is connected to the stage assembly 124 for driving the stage assembly 124 to move between the open lid station and the detection station along the guide rail assembly 123, and the fixing mechanism 125 is arranged on the stage assembly 124 and can be a buckle assembly for fixing the wafer cassette 150 on the stage assembly 124. Among them, the buckle assembly can use existing electric or pneumatic buckle mechanisms, which will not be elaborated here. The module base plate 122 provides a stable support foundation for the entire stage module 120, and the cooperation of the guide rail assembly 123 and the ball screw assembly enables the stage assembly 124 to move accurately and smoothly between the open lid station and the detection station, improving the positioning accuracy and moving efficiency of the wafer cassette 150. The setting of the buckle assembly ensures the fixation of the wafer cassette 150 on the stage assembly 124, avoiding the shaking or falling off of the wafer cassette 150 during the movement and ensuring the smooth progress of the transfer and detection processes.

[0109] It can be understood that the fixing mechanism 125 can also be a fixture or a vacuum chuck.

[0110] As Figure 10 shown, in some embodiments of the above-mentioned lifting mechanism 141, the lifting mechanism 141 is a ball screw module and is installed on the module back plate 144, its moving end is connected to the open lid component 142, and the module back plate 144 is fixed on the machine frame 110.

[0111] Figure 11 It is a perspective view of the internal structure of the open lid component according to an embodiment of the present disclosure.

[0112] Refer to Figure 11As shown, in some embodiments of the above-mentioned lid opening assembly 142, the lid opening assembly 142 includes a fixing assembly 142A for fixing the lid 151, an unlocking assembly for unlocking the lid 151, and a fitting plate 142B for mounting the fixing assembly 142A and the unlocking assembly. Among them, the fixing assembly 142A can be a vacuum chuck or a fixture. The unlocking assembly includes at least two key pins 142C rotatably arranged on the fitting plate 142B, a connecting rod assembly connected to the two key pins 142C, and an unlocking cylinder 142D connected to the connecting rod assembly; the connecting rod assembly includes a first rotating rod 142E, a second rotating rod 142F, and an intermediate rod 142G. Two ends of the first rotating rod 142E are respectively hinged to the piston rod of the unlocking cylinder 142D and one end of the intermediate rod 142G, and the middle of the first rotating rod 142E is connected to one of the unlocking pins. One end of the second rotating rod 142F is connected to the unlocking pin, and the other end is fixedly connected to one end of the intermediate rod 142G; wherein, the first rotating rod 142E and the second rotating rod 142F are parallel to each other, the intermediate rod 142G and the piston rod of the unlocking cylinder 142D are parallel to each other and are arranged in a parallelogram, and the two key pins 142C are arranged at the middle positions of the opposite sides of the parallelogram. During operation, the wafer cassette 150 moves to the lid opening station, the fixing assembly 142A stably fixes the lid 151, the key pins 142C are inserted into the keyholes of the lid 151, and the connecting rod assembly is driven by the unlocking cylinder 142D to drive the key pins 142C to rotate, realizing the unlocking operation of the lid 151. Compared with the traditional unlocking mechanism with worm and worm gear transmission, the lid opening assembly 142 of the present application simplifies the overall structure through the parallelogram structure of the connecting rod assembly, and makes the rotation of the key pins 142C more stable and accurate, improving the success rate and reliability of lid opening.

[0113] Figure 12 is a perspective view of a detection component according to an embodiment of the present disclosure, Figure 13 is a perspective view of a track groove according to an embodiment of the present disclosure.

[0114] As Figure 12 and Figure 13As shown, in some embodiments of the above-mentioned detection component 143, the detection component 143 includes a detection frame 143A, a telescopic air cylinder 143B, and a detection sensor 143C; the detection frame 143A is rotatably arranged on the opening cover component 142, such as being connected to the fitting plate 142B of the opening cover component 142 through a rotating shaft. An arc-shaped track groove 143D is arranged at the bottom of the detection frame 143A. The telescopic air cylinder 143B is fixedly arranged on the opening cover component 142, and a roller 143E is arranged on its piston rod. The roller 143E is arranged inside the track groove 143D; the detection sensor 143C is arranged at the top of the detection frame 143A; wherein, when the piston rod of the telescopic air cylinder 143B moves, the roller 143E pushes the groove wall of the track groove 143D to make the detection frame 143A rotate, so that the detection sensor 143C moves from outside the wafer cassette 150 to inside or from inside the wafer cassette 150 to outside. By driving the roller 143E to move in the track groove 143D by the telescopic air cylinder 143B, the rotation of the detection frame 143A is realized, and then the detection sensor 143C is driven to extend into the wafer cassette 150. At the same time, by driving the detection sensor 143C to lift and lower through the lifting mechanism 141, it is convenient to detect the inside and outside of the wafer cassette 150. After detection, the telescopic air cylinder 143B drives the roller 143E to move in the reverse direction, making the detection frame 143A rotate in the reverse direction and resetting the detection sensor 143C.

[0115] In this embodiment, a control method for a wafer automatic loading device is provided. The control method is used to control the wafer automatic loading device of any one of the above, and includes the following steps:

[0116] After the wafer cassette 150 is placed on the stage module 120, the baffle driving mechanism 134 drives the lifting baffle assembly 133 to rise; the stage module 120 fixes the wafer cassette 150 at the detection station; the linear driving mechanism 121 drives the wafer cassette 150 to advance from the detection station to the opening cover station; the opening cover component 142 fixes and unlocks the lid 151 of the wafer cassette 150 located at the opening cover station; the linear driving mechanism 121 drives the wafer cassette 150 to retreat from the opening cover station to the detection station, separating the wafer cassette 150 from the lid 151, and enabling the lifting and moving of the opening cover component 142 and the detection component 143 to be not interfered by the wafer cassette 150; the lifting mechanism 141 controls the lifting and moving of the detection component 143, and the detection component 143 detects the wafers located inside the wafer cassette 150.

[0117] Exemplarily, the wafer automatic loading device of the present application is used for a wafer loader. The wafer loader adopts the control of Positive Motion's Base + ladder diagram language. The control of Positive Motion's Base + ladder diagram language is a programming method for industrial automation, combining the efficiency of the Base language and the intuitiveness of the ladder diagram language. The advantages of the combination of Base + ladder diagram are as follows: The combination of flexibility and intuitiveness: The Base language processes complex logic, and the ladder diagram language processes simple logic, improving development efficiency and system performance; Modular design: Supports modular programming, facilitating function reuse and maintenance; Good real-time performance: Suitable for real-time control, capable of quickly responding to input signals and performing operations. Its action process is as follows: Start, initialization, wait for personnel or an overhead crane to place the wafer cassette 150, recipe selection, loading process, manipulator to pick and place wafers, unloading process, wait for personnel or an overhead crane to take away the wafer cassette 150, end. Specifically, initialization: The system starts, performs self-check and initialization settings. Wait for personnel or an overhead crane to place the wafer cassette 150: The system waits for the wafer cassette 150 to be placed at the designated position. Recipe selection: Select the corresponding processing recipe according to the model or category of the wafer cassette 150.

[0118] Exemplarily, the loading process is as follows: The baffle rises: The baffle rises to prevent personnel from entering the working area and affecting the operation of the machine and personnel safety; The wafer cassette is fixed: The fixing mechanism 125 uses a buckle assembly, fixture or vacuum chuck to fix the wafer cassette to prevent the cassette 150 from moving during subsequent operations, and confirm that the wafer cassette 150 is firmly fixed; The wafer cassette 150 advances: The wafer cassette 150 advances from the initial position to the lid opening station to ensure that the wafer cassette 150 accurately reaches the working area of the lid opening assembly 142; The lid opening assembly 142 sucks vacuum: The vacuum chuck of the lid opening assembly 142 is activated to suck the lid 151 of the wafer cassette 150, confirm that the chuck firmly fixes the lid 151, and the key pin 142C is inserted into the keyhole of the lid 151; Unlock the lid 151: The key pin 142C rotates to unlock the buckle of the lid 151, confirm complete unlocking, and the lid 151 can be opened; The wafer cassette 150 retracts: The wafer cassette 150 retracts from the lid opening position, and the door of the wafer cassette 150 is pulled open under the action of the vacuum chuck to complete the lid opening operation.

[0119] Exemplarily, the unloading process is as follows: the wafer cassette 150 retreats, the Map process, the wafer cassette 150 advances, the lid 151 is locked, the wafer cassette 150 retreats, the wafer cassette 150 is released, and the baffle descends. Specifically, the wafer cassette 150 retreats: the wafer cassette 150 retreats from the unloading position to the detection station to ensure that the lifting movement of the lid opening assembly 142 is not affected; Map process: perform the Map operation process; the wafer cassette 150 advances: the wafer cassette 150 advances to the lid opening position to ensure that the wafer cassette 150 accurately reaches the working area of the lid opening assembly 142, the lid 151 enters the wafer cassette 150, and the key pin 142C is inserted into the keyhole; lock the lid 151: the key pin 142C rotates to tightly lock the buckle of the wafer cassette 150, confirm that the lid 151 is tightly locked on the wafer cassette 150, and the vacuum suction cup releases the adsorption of the lid 151; the wafer cassette 150 retreats: the wafer cassette 150 retreats to the initial position and enters the operation area of personnel (or overhead crane); the wafer cassette 150 is released: the fixing mechanism 125 cancels the fixation of the wafer cassette 150; the baffle descends: the baffle driving mechanism 134 drives the baffle 133A to descend to ensure that the wafer cassette 150 can be safely picked up and placed in the transfer area.

[0120] The above Map process is as follows: the lid opening assembly 142 descends to the starting position: the lid opening assembly 142 descends from the current position to the starting position of the Mapping scan to ensure that the lid opening assembly 142 does not interfere with the operation of the detection assembly 143; the detection assembly 143 extends: the telescopic cylinder 143B drives the detection frame 143A to rotate, so that the detection sensor 143C extends into the wafer cassette 150 to confirm that the detection mechanism reaches the starting position of the scan; the lid opening assembly 142 descends to the ending position: the lid opening assembly 142 continues to descend from the starting position to the ending position of the Mapping scan. During the descent, the detection sensor 143C scans the inside of the wafer cassette 150; latch the calculation result of the data: after the scan is completed, the system latches the detection data, analyzes the latched data to analyze whether the products are stacked or skewed (whether there is inclination or incorrect position), and generates a status report of the inside of the wafer cassette 150 according to the calculation result; the detection assembly 143 retracts: the detection sensor 143C retracts from the inside of the wafer cassette 150 and returns to the initial position to confirm that the detection mechanism is fully retracted to avoid interfering with subsequent operations.

[0121] In summary, the wafer automatic loading device of the present application improves the protection of wafers through the baffle module 130. After the wafer cassette 150 is placed on the stage module 120, the baffle driving mechanism 134 drives the lifting baffle assembly 133 to rise, so that the left baffle assembly 131, the right baffle assembly 132, and the lifting baffle assembly 133 are arranged around the stage module 120 to form a protection structure to protect the wafer cassette 150 and prevent fragments caused by misoperation. The wafer automatic loading device of the present application reduces the manufacturing cost through the synergistic action of the stage module 120 and the cover opening detection module 140. After the cover opening assembly 142 fixes and unlocks the cover 151 of the wafer cassette 150 at the cover opening station, the linear driving mechanism 121 drives the wafer cassette 150 to retreat from the cover opening station to the detection station, separates the wafer cassette 150 from the cover 151, and enables the lifting movement of the cover opening assembly 142 and the detection assembly 143 to be not interfered by the wafer cassette 150. Compared with the existing wafer automatic loading equipment, the wafer automatic loading device of the present application does not need to configure a horizontal movement mechanism on the cover opening assembly 142 to open the cover 151. Instead, it uses the horizontal driving mechanism of the stage module 120 to drive the wafer cassette 150 to move, and then opens the cover 151. That is, the horizontal driving mechanism has the functions of driving the wafer cassette 150 to move between the detection station and the cover opening station and opening the cover 151 of the wafer cassette 150 at the same time. When the wafer cassette 150 retreats to the detection station, the cover opening action can be completed synchronously. In this way, the wafer automatic loading device of the present application can save the use of the horizontal driving mechanism, thereby reducing the manufacturing cost.

[0122] In the description of this specification, the descriptions referring to the terms "one embodiment / way", "some embodiments / ways", "example", "specific example", or "some examples", etc. mean that the specific features, structures, materials, or characteristics described in connection with the embodiment / way or example are included in at least one embodiment / way or example of the present application. In this specification, the schematic expressions of the above terms do not necessarily refer to the same embodiment / way or example. Moreover, the specific features, structures, materials, or characteristics described can be combined in a suitable manner in any one or more embodiments / ways or examples. In addition, without contradiction, those skilled in the art can combine and combine the different embodiments / ways or examples described in this specification and the features of different embodiments / ways or examples.

[0123] In addition, the terms "first" and "second" are only used for descriptive purposes and cannot be understood as indicating or implying relative importance or implicitly specifying the quantity of the indicated technical features. Thus, the features defined with "first" and "second" can explicitly or implicitly include at least one of the features. In the description of the present application, the meaning of "a plurality" is at least two, such as two, three, etc., unless otherwise specifically defined.

[0124] Those skilled in the art should understand that the above embodiments are only for clearly illustrating the present disclosure, rather than limiting the scope of the present disclosure. For those skilled in the art, other changes or variations can be made based on the above disclosure, and these changes or variations are still within the scope of the present disclosure.

Claims

1. An automatic wafer loading device, characterized in that, Comprising: Machine frame; Carrier module, the carrier module is arranged on the machine frame, used for fixing the wafer cassette, and is provided with a linear drive mechanism, the linear drive mechanism is used to drive the wafer cassette to move between the lid-opening station and the detection station, and the detection station and the lid-opening station are linearly arranged along the lid-opening direction of the wafer cassette; Baffle module, the baffle module includes a left baffle component, a right baffle component and a lifting baffle component arranged around the carrier module, the left baffle component and the right baffle component are arranged on the machine frame, the lifting baffle component is arranged between the left baffle component and the right baffle component in a liftable and movable manner, and is provided with a baffle drive mechanism, the baffle drive mechanism is arranged on the left baffle component or the right baffle component, and is used to drive the lifting baffle component to move up and down. Wherein, the left baffle component, the right baffle component, the lifting baffle component and the machine frame form a square space around the carrier module; Lid-opening detection module, including a lifting mechanism, a lid-opening component and a detection component, the lifting mechanism is arranged on the machine frame and is connected to the lid-opening component, the lid-opening component is used to fix and unlock the lid of the wafer cassette located at the lid-opening station, and the detection component is arranged on the lid-opening component, and is used to detect the wafers inside the wafer cassette located at the detection station; Wherein, the left baffle component and the right baffle component are fixedly arranged on two opposite sides of the machine frame position, and each is provided with a chute; the lifting baffle component includes at least three baffles slidably arranged in the chute, the baffles are arranged in sequence from top to bottom, and are arranged in layers in a horizontal direction in sequence, vertical extending slideways are respectively arranged between adjacent baffles and sliders slidably matched with the slideways; Wherein, the baffle drive mechanism is connected to the uppermost baffle; among two adjacent baffles, when the baffle located above moves upward, the baffle located below is driven to move upward through the slider; Wherein, the linear drive mechanism drives the wafer cassette to retreat from the lid-opening station to the detection station, separates the wafer cassette from the lid, and enables the lifting movement of the lid-opening component and the detection component not to be interfered by the wafer cassette.

2. The wafer automatic loading device according to claim 1, wherein An installation plate is fixedly arranged on the inner side of the left baffle component or the right baffle component; The baffle drive mechanism includes a baffle drive cylinder, a connecting block, a first synchronous belt, a first pulley, a rotating shaft, a second synchronous belt, and a second pulley; The baffle drive cylinder is arranged on the installation plate and is provided with a piston rod, the piston rod, the connecting block and the first synchronous belt are fixedly connected in sequence, the first synchronous belt is connected to two of the first pulleys, the first pulleys are rotatably arranged on the installation plate through a wheel shaft, and the wheel shaft of one of the first pulleys is in transmission connection with the rotating shaft, and the connection line of the two first pulleys is parallel to the piston rod; The rotating shaft is rotatably arranged between the left baffle assembly and the right baffle assembly, and is provided with the second pulley. The second pulley is arranged above the rotating shaft on the left baffle assembly and / or the right baffle assembly. The second synchronous belt is connected between the rotating shaft and the second pulley on the left baffle assembly or between the rotating shaft and the second pulley on the right baffle assembly, and the second synchronous belt is connected to the uppermost baffle.

3. The wafer automatic loading device according to claim 2, wherein, The baffle driving mechanism further includes a third synchronous belt, a tensioning pulley and two third pulleys. One of the third pulleys is fixedly connected to the axle of the first pulley, and the other third pulley is fixedly arranged on the rotating shaft. The third synchronous belt is connected between the two third pulleys, and the tensioning pulley is rotatably arranged on the mounting plate and is used for tensioning the third synchronous belt.

4. The wafer automatic loading device according to claim 2, characterized in that, The baffle driving mechanism further includes a first guide rail. The first guide rail is fixedly arranged on the mounting plate and is parallel to the piston rod of the baffle driving cylinder. The connecting block is fixedly provided with a sliding seat, and the sliding seat is slidably connected to the first guide rail.

5. The wafer automatic loading device according to claim 1, characterized in that, The stage module includes: a module bottom plate, a guide rail assembly, a stage assembly and a fixing mechanism; The module bottom plate is fixedly arranged on the machine frame. The guide rail assembly is fixedly arranged on the module bottom plate. The stage assembly is slidably arranged on the guide rail assembly and is used for placing the wafer cassette. The linear driving mechanism includes a ball screw assembly. The ball screw assembly is fixedly arranged on the module bottom plate and is connected to the stage assembly for driving the stage assembly to move between the open cover station and the detection station along the guide rail assembly. The fixing mechanism is arranged on the stage assembly for fixing the wafer cassette on the stage assembly.

6. The wafer automatic loading device according to claim 1, wherein The cover opening assembly includes a fixing component for fixing the cover, an unlocking component for unlocking the cover, and a fitting plate for mounting the fixing component and the unlocking component; The unlocking component includes at least two key pins rotatably arranged on the fitting plate, a link component connected to the two key pins, and an unlocking cylinder connected to the link component; The link component includes a first rotating rod, a second rotating rod and an intermediate rod. Two ends of the first rotating rod are respectively hinged to the piston rod of the unlocking cylinder and one end of the intermediate rod, and the middle part of the first rotating rod is connected to a key pin. One end of the second rotating rod is connected to the other key pin, and the other end of the second rotating rod is fixedly connected to the other end of the intermediate rod; Wherein, the first rotating rod and the second rotating rod are parallel to each other, the intermediate rod and the piston rod of the unlocking cylinder are parallel to each other and are arranged in a parallelogram, and the two key pins are arranged at the middle positions of the opposite sides of the parallelogram.

7. The wafer automatic loading device according to claim 1, wherein The detection component includes a detection frame, a telescopic cylinder and a detection sensor; the detection frame is rotatably arranged on the cover opening assembly and is provided with an arc-shaped track groove. The telescopic cylinder is fixedly arranged on the cover opening assembly, and its piston rod is provided with a roller. The roller is arranged inside the track groove; the detection sensor is arranged on the detection frame; Wherein, when the piston rod of the telescopic cylinder moves, the roller pushes the groove wall of the track groove to rotate the detection frame, so that the detection sensor moves from the outside of the wafer cassette to the inside of the wafer cassette or from the inside of the wafer cassette to the outside of the wafer cassette.

8. A control method for a wafer automatic loading device, characterized in that, The control method is used to control the wafer automatic loading device according to any one of claims 1 to 7, and includes the following steps: After the wafer cassette is placed on the stage module, the baffle driving mechanism drives the lifting baffle assembly to rise; The stage module fixes the wafer cassette at the detection station; The linear driving mechanism drives the wafer cassette to move forward from the detection station to the lid opening station; The lid opening assembly fixes and unlocks the lid of the wafer cassette located at the lid opening station; The linear driving mechanism drives the wafer cassette to move backward from the lid opening station to the detection station, separates the wafer cassette from the lid, and enables the lifting movement of the lid opening assembly and the detection assembly to be free from interference by the wafer cassette; The lifting mechanism controls the lifting movement of the detection assembly, and the detection assembly detects the wafers located inside the wafer cassette.

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