Module power supply and electronic equipment

Abstract

The invention provides a module power supply and electronic equipment, and the module power supply comprises a PCB which comprises a bottom end wiring layer, a second isolation layer, a PCB winding, a first isolation layer and a top end wiring layer which are sequentially stacked in the thickness direction of the PCB; the electronic devices are arranged in a first area on the top surface of the PCB, the electronic devices are arranged in a second area on the bottom surface of the PCB, and the first area, the second area and the PCB winding coincide up and down; the magnetic core comprises an upper magnetic core structure, a lower magnetic core structure and a middle column structure. Due to the first isolation layer and the second isolation layer, the PCB winding is electrically isolated from the top end wiring layer and the bottom end wiring layer respectively. Therefore, the plurality of electronic devices can be arranged in the first area of the top surface of the PCB and the second area of the bottom surface of the PCB, which are overlapped with the PCB winding up and down, so that the space utilization rate and the plane utilization rate of the module power supply are improved, and the system power density and the plane current density of the module power supply are further improved.

Description

Technical Field

[0001] The present invention relates to the field of power supplies, and in particular, to a modular power supply and an electronic device. Background Art

[0002] The rapid development of artificial intelligence cloud computing centers and new energy vehicles has brought higher requirements for the power density and efficiency of 48V DC-DC modular power supplies. At the same time, the demand for new vertical power supplies has put forward higher requirements for the current density of the power plane. The LLC (Inductor-Inductor-Capacitor) full-bridge resonant circuit can achieve soft switching of the entire chip over the full load range and can achieve high efficiency at high frequencies. Therefore, it is widely used in DC-DC modular power supplies with low voltage and large current output.

[0003] However, the existing single-column modular power supply has problems of insufficient space utilization and large planar area, which affect the system power density and planar current density of the modular power supply. Summary of the Invention

[0004] Embodiments of the present invention provide a modular power supply and an electronic device to improve the system power density and planar current density of the modular power supply.

[0005] To solve the above technical problems, the technical solution of the present invention provides a modular power supply, including:

[0006] A PCB board, including a bottom connection layer, a second isolation layer, a PCB winding, a first isolation layer, and a top connection layer stacked in sequence along the thickness direction of the PCB board;

[0007] A plurality of electronic devices, arranged in a first area on the top surface of the PCB board and a second area on the bottom surface of the PCB board, where the first area, the second area, and the PCB winding overlap vertically;

[0008] A magnetic core, including an upper magnetic core structure, a lower magnetic core structure, and a middle column structure, where the upper magnetic core structure covers some of the electronic devices on the top surface of the PCB board, the lower magnetic core structure covers some of the electronic devices on the bottom surface of the PCB board, and the middle column structure penetrates the PCB board and connects the upper magnetic core structure and the lower magnetic core structure respectively.

[0009] Optionally, the electronic devices at least include a plurality of power switch chips, a plurality of driver chips, a plurality of rectifier chips, and a plurality of capacitors;

[0010] The power switch chip is disposed on the top surface and / or the bottom surface of the PCB board, the drive chip is disposed on the top surface and / or the bottom surface of the PCB board and / or the surface of the power switch chip, the rectifier chip is disposed on the top surface and / or the bottom surface of the PCB board, the capacitor is disposed on the top surface and / or the bottom surface of the PCB board, and at least two of the plurality of capacitors are stacked on each other.

[0011] Optionally, the power switch chip is disposed on the surfaces of the top connection layer and the bottom connection layer;

[0012] Each drive chip corresponds to one power switch chip and is stacked on the surface of the corresponding power switch chip;

[0013] The rectifier chip is disposed on the surfaces of the top connection layer and the bottom connection layer;

[0014] Some of the capacitors are disposed on the surfaces of the top connection layer and the bottom connection layer, and the remaining capacitors are stacked on the surfaces of the corresponding different capacitors respectively;

[0015] The drive chip, the power switch chip, the capacitor and the rectifier chip are respectively electrically connected to the bottom connection layer and electrically connected to the top connection layer.

[0016] Optionally, the module power supply further includes a plurality of first heat sinks and a plurality of second heat sinks. Each first heat sink corresponds to one rectifier chip, and the first heat sink is disposed on the surface of the corresponding rectifier chip. The second heat sink includes a first structure and a second structure. The first structure is disposed between the drive chip and the power switch chip, and the second structure covers the surface of the upper magnetic core structure and / or the lower magnetic core structure. The first structure and the second structure are connected.

[0017] Optionally, the second heat sink is at least composed of any one or more of copper, aluminum, silver, graphene, direct copper clad ceramic.

[0018] Optionally, the capacitor includes a multilayer ceramic capacitor.

[0019] Optionally, both the first isolation layer and the second isolation layer are non-closed structures.

[0020] Optionally, the materials of both the first isolation layer and the second isolation layer are at least any one of silver, copper, and conductive polymer, and the isolation layer is electrically connected to the ground terminal.

[0021] Optionally, a first notch area and a second notch area exist on the first side of the PCB board member. The first notch area and the second notch area are separated by the bump structure of the PCB board member. The lower magnetic core structure includes a first side post and a second side post. The first side post is embedded in the first notch area and connected to the upper magnetic core structure. The second side post is embedded in the second notch area and connected to the upper magnetic core structure.

[0022] Optionally, the PCB winding includes a plurality of stacked winding layers. The modular power supply further includes a winding layer connection structure. The winding layer connection structure covers the surface of the area of the PCB board member penetrated by the middle post structure. The winding layer connection structure is used to connect the plurality of winding layers.

[0023] Optionally, the winding layer connection structure is a copper plating structure, and the thickness of the copper plating structure is greater than or equal to 40 μm.

[0024] The technical solution of the present invention further provides an electronic device including the modular power supply.

[0025] Compared with the prior art, the technical solution provided by the present invention has the following beneficial effects:

[0026] For the modular power supply provided by the technical solution of the present invention, the first isolation layer is arranged between the PCB winding and the bottom connection layer, and the second isolation layer is arranged between the top connection layer and the PCB winding, so that the PCB winding is electrically isolated from the top connection layer and the bottom connection layer respectively. Therefore, the plurality of electronic devices can be arranged in the first area on the top surface of the PCB board member that overlaps with the PCB winding up and down and the second area on the bottom surface of the PCB board member, thereby making full use of the space perpendicular to the PCB winding, improving the space utilization rate and the plane utilization rate of the modular power supply, and further improving the system power density and the plane current density of the modular power supply.

[0027] Furthermore, since the driving chip is stacked on the power switch chip and at least two of the capacitors are stacked on each other, the space utilization rate of the modular power supply is further improved, and the plane area of the modular power supply is reduced.

[0028] Furthermore, the technical solution of the present invention also provides a plurality of first radiators and second radiators. The first radiators are arranged on the surfaces of the corresponding rectifying chips. The second radiator includes a first structure and a second structure. The first structure is arranged between the driving chip and the power switch chip, and the second structure covers the surface of the upper magnetic core structure and / or the lower magnetic core structure, so as to quickly export the heat between the driving chip and the power switch chip to the outside of the power supply, and quickly dissipate the heat of the rectifying chip, thereby greatly improving the heat dissipation capacity of the modular power supply.

[0029] Furthermore, the isolation layer is set to be a non-closed structure to avoid short-circuiting the PCB winding.

[0030] Furthermore, a first notch area and a second notch area are arranged on the first side of the PCB board, and the first side post and the second side post of the lower magnetic core structure are respectively embedded in the first notch area and the second notch area, so as to further reduce the planar area of the modular power supply.

[0031] Furthermore, a winding layer connection structure is arranged on the surface of the area where the PCB board is penetrated by the middle post structure to connect a plurality of the winding layers by the winding layer connection structure, thereby simplifying the circuit layout between the winding layers. BRIEF DESCRIPTION OF THE DRAWINGS

[0032] Figure 1 is a top view of an embodiment of a single-middle-post modular power supply;

[0033] Figure 2 is a simple cross-sectional schematic diagram of an embodiment of a single-middle-post modular power supply;

[0034] Figure 3 is a cross-sectional structure schematic diagram of the modular power supply provided by the embodiment of the present invention Figure 1 ;

[0035] Figure 4 is a cross-sectional structure schematic diagram of the modular power supply provided by the embodiment of the present invention Figure 2 ;

[0036] Figure 5 is a perspective view of the isolation layer provided by the embodiment of the present invention;

[0037] Figure 6 is a top view of the modular power supply provided by the embodiment of the present invention Figure 1 ;

[0038] Figure 7 is a structural diagram of the magnetic core provided by the embodiment of the present invention;

[0039] Figure 8Top view of the module power supply provided by the embodiment of the present invention Figure 2 ;

[0040] Figure 9 Top view of the module power supply provided by the embodiment of the present invention Figure 3 。 Detailed implementation manners

[0041] As described in the background art, the existing module power supplies have problems of insufficient space utilization rate and large planar area, thus affecting the system power density and planar current density of the module power supplies. The problems existing in the existing single-middle-column module power supplies will be described below with reference to the drawings:

[0042] Figure 1 Fig. is a top view of an embodiment of a single-middle-column module power supply. Figure 2 Fig. is a simple sectional schematic view of an embodiment of a single-middle-column module power supply.

[0043] Please refer to Figure 1 and Figure 2 , Figure 1 and Figure 2 The embodiment of the single-middle-column module power supply shown in and includes a PCB board 120, a plurality of electronic devices 100 and a magnetic core 110. The magnetic core 110 is arranged around the PCB board 120. The plurality of electronic devices 100 are arranged on the top surface and the ground surface of the PCB board 120. The PCB board 120 includes a PCB winding 121, a top connection layer and a bottom connection layer. The PCB winding 121 is located between the top connection layer and the bottom connection layer. The problems existing in this embodiment are as follows:

[0044] Since the PCB winding 121 will cause electromagnetic interference to the electronic devices 100 arranged on the top surface and the ground surface, in order to avoid electromagnetic interference, the plurality of electronic devices 100 cannot be directly arranged in the areas on the top and bottom of the PCB board 120 perpendicular to the PCB winding 121, but can only be scattered in the edge areas on the top and bottom of the PCB board 120 that are not perpendicular to the PCB winding 121, thus greatly increasing the planar area of the PCB board 120 and affecting the planar current density of the module power supply. At the same time, since the plurality of electronic devices 100 are scattered on the top and bottom of the PCB board 120, and the heights of the plurality of electronic devices 100 and the magnetic core 110 are not equal to each other. For example, in Figure 2 ,

[0045] In view of this, embodiments of the present invention provide a new modular power supply to improve the system power density and planar current density of the modular power supply by increasing the space utilization rate of the modular power supply and reducing the planar area of the modular power supply.

[0046] Figure 3 Schematic cross-sectional structure of the modular power supply provided by the embodiment of the present invention Figure 1 。

[0047] Please refer to Figure 3 , the modular power supply provided by the embodiment of the present invention includes the following structures:

[0048] The PCB board 200 includes a bottom connection layer 205, a second isolation layer 204, a PCB winding 203, a first isolation layer 202, and a top connection layer 201 stacked in sequence along the thickness direction AA` of the PCB board 200;

[0049] A plurality of electronic devices 210 are arranged in a first area on the top surface of the PCB board 200 and a second area on the bottom surface of the PCB board 200, and the first area, the second area, and the PCB winding 203 overlap vertically;

[0050] The magnetic core includes an upper magnetic core structure 230, a lower magnetic core structure 250, and a middle column structure 240. The upper magnetic core structure 230 covers some of the electronic devices 210 on the top surface of the PCB board 200, the lower magnetic core structure 250 covers some of the electronic devices 210 on the bottom surface of the PCB board 200, and the middle column structure 240 penetrates the PCB board 200 and is respectively connected to the upper magnetic core structure 230 and the lower magnetic core structure 250.

[0051] When the modular power supply is operating normally, crosstalk will occur in the loop traces or adjacent wires in the PCB winding 203 due to magnetic field coupling or electric field coupling. When a high-frequency signal passes through the winding, the changing current will generate an alternating magnetic field in the surrounding space, and the alternating magnetic field will induce an interference voltage on the adjacent wire through Faraday's law of electromagnetic induction. At the same time, the parasitic capacitance between the wires will cause electric field coupling, enabling the signal energy to cross the insulating medium and transfer to the sensitive circuit, forming common-mode or differential-mode interference.

[0052] Therefore, in the embodiment of the present invention, the first isolation layer 202 is disposed between the PCB winding 203 and the bottom connection layer 205, and the second isolation layer 204 is disposed between the top connection layer 201 and the PCB winding 203, thereby blocking the electromagnetic interference of the PCB winding 203 to a plurality of electronic devices 210. Therefore, the plurality of electronic devices 210 can be disposed in the first area on the top surface of the PCB board 200 that overlaps with the PCB winding 203 up and down and the second area on the bottom surface of the PCB board 200, thereby making full use of the space perpendicular to the PCB winding 203, improving the space utilization rate and the planar utilization rate of the module power supply, and further improving the system power density and the planar current density of the module power supply.

[0053] In addition, since the upper magnetic core structure 230 covers some of the electronic devices 210 located on the top surface of the PCB board 200, and the lower magnetic core structure 250 covers some of the electronic devices 210 located on the bottom surface of the PCB board 200, the height difference caused by the horizontal distribution of the magnetic core and other electronic devices 210 is avoided, thereby improving the space utilization rate of the module power supply, and further improving the system power density of the module power supply.

[0054] It should be noted that since the bottom connection layer 205, the second isolation layer 204, the PCB winding 203, the first isolation layer 202, and the top connection layer 201 are sequentially stacked in the thickness direction AA` of the PCB board 200. Therefore, in accordance with the set thickness direction AA` of the PCB board 200, the top connection layer 201 is actually located at the topmost layer of the PCB board 200, and the bottom connection layer 205 is actually located at the bottommost layer of the PCB board 200. Therefore, the top surface of the PCB board 200 can also be understood as the plane where the top connection layer 201 is exposed to the outside, and the bottom surface of the PCB board 200 can also be understood as the plane where the bottom connection layer 205 is exposed to the outside.

[0055] It should be noted that although improving the space utilization rate can improve the system power density of the module power supply, and reducing the planar area can improve the planar current density of the module power supply, there are many influencing factors affecting the system power density and the planar current density of the module power supply, such as heat dissipation, power conversion efficiency, input and output voltage range, size of the EMI filter, copper foil thickness, etc. Therefore, the optimization of the system power density and the planar current density is not limited to the improvement of the space utilization rate and the planar area, that is, improving the space utilization rate and reducing the planar area are not the only options for optimizing the system power density and the planar current density.

[0056] The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present invention without creative efforts shall fall within the protection scope of the present invention. The terms "first", "second", "third", "fourth", etc. (if any) in the specification and claims of the present invention and the above accompanying drawings are used to distinguish similar objects and do not necessarily need to describe a specific order or sequence. It should be understood that such data can be interchanged under appropriate circumstances so that the embodiments of the present invention described herein can be implemented in an order other than those illustrated or described herein. In addition, the terms "comprising" and "having" and any variations thereof are intended to cover non-exclusive inclusion. For example, a process, method, system, product or device comprising a series of steps or units does not necessarily have to be limited to those steps or units clearly listed, but may include other steps or units not clearly listed or inherent to these processes, methods, products or devices.

[0057] Figure 4 Schematic cross-sectional structure of the module power supply provided by the embodiment of the present invention Figure 2 。

[0058] Please refer to Figure 4 , as an implementation manner, the electronic device 210 at least includes several power switch chips 212, several driver chips 211, several rectifier chips 214, and several capacitors 213;

[0059] The power switch chips 212 are arranged on the top surface and / or the bottom surface of the PCB board 200, the driver chips 211 are arranged on the top surface and / or the bottom surface of the PCB board 200 and / or the surface of the power switch chips 212, the rectifier chips 214 are arranged on the top surface and / or the bottom surface of the PCB board 200, the capacitors 213 are arranged on the top surface and / or the bottom surface of the PCB board 200, and at least two of the several capacitors 213 are stacked on each other.

[0060] Specifically, all of the driving chips 211 can be disposed on the top surface or the bottom surface of the PCB board 200. Of course, in order to reduce the planar area of the module power supply, some of the driving chips 211 can be disposed on the top surface or the bottom surface of the PCB board 200, and the other part of the driving chips 211 can be stacked on the surface of the corresponding power switch chips 212. In order to minimize the planar area of the module power supply, the driving chips 211 and the power switch chips 212 can be arranged in one-to-one correspondence, and each driving chip 211 is stacked on the surface of the corresponding power switch chip 212. The stacking between the driving chip 211 and the power switch chip 212 is specifically fixed by soldering with solder, and electrically connected by wire bonding. The solder specifically includes: tin-lead alloy, tin-copper alloy, tin-silver-copper alloy, etc., which are not limited herein. In addition to solder, the welding material can also be selected from gold, silver, Zn-Sn alloy, aluminum-silicon, Ag-Cu-Zn alloy, etc., which are not limited herein.

[0061] Further, a full-bridge switching circuit is integrated in the power switch chip 212, and the switching tubes in the full-bridge switching circuit can be any one of silicon-based MOS tubes, gallium nitride tubes, and silicon carbide tubes. Of course, in addition to integrating the full-bridge switching circuit, the power switch chip 212 can also integrate other circuits with switching and rectifying functions, which are not limited herein. A bridge rectifying circuit is integrated in the rectifying chip 214, and the switching tubes in the bridge rectifying circuit can be any one of silicon-based MOS tubes, gallium nitride tubes, and silicon carbide tubes. Of course, in addition to integrating the bridge rectifying circuit, the rectifying chip 214 can also select other circuits with switching and rectifying functions, which are not limited herein.

[0062] Specifically, all of the capacitors 213 can be disposed on the top surface or the bottom surface of the PCB board 200. Of course, in order to reduce the planar area of the module power supply, some of the capacitors 213 can be disposed on the top surface or the bottom surface of the PCB board 200, and the other part of the capacitors 213 are stacked pairwise with each other. In order to minimize the planar area of the module power supply, all of the capacitors 213 are stacked pairwise, and the specific stacking method is: the capacitors 213 are directly placed on the corresponding capacitors 213 and fixed by soldering with solder. The solder specifically includes: tin-lead alloy, tin-copper alloy, tin-silver-copper alloy, etc., which are not limited herein. In addition to solder, the welding material can also be selected from gold, silver, Zn-Sn alloy, aluminum-silicon, Ag-Cu-Zn alloy, etc., which are not limited herein. In order to facilitate the direct stacking of the capacitors 213 on the top surface of the PCB board 200 and the stacking between the capacitors 213, the capacitors 213 can be selected as multilayer ceramic capacitors 213. Of course, in addition to the multilayer ceramic capacitors 213, the types of the capacitors 213 can also be selected according to actual needs, which are not limited herein.

[0063] As can be seen from the above technical means, the driving chip 211 is stacked on the surface of the power switch chip 212 and the capacitors 213 are stacked on each other. Therefore, the stacking of the above-mentioned electronic devices 210 can further reduce the planar area of the module power supply, thereby further increasing the planar current density of the module power supply. At the same time, the stacking of the above-mentioned electronic devices 210 improves the flatness of the devices, further improves the space utilization rate, and thus further increases the power density of the module power supply.

[0064] It should be noted that the quantities of the power switch chip 212, the driving chip 211, the rectifying chip 214, and the capacitors 213 can be set according to actual requirements and are not limited herein. In addition, the power switch chip 212, the driving chip 211, the rectifying chip 214, and the capacitors 213 do not need to be provided on both the top surface and the bottom surface of the PCB board 200. That is, the power switch chip 212, the driving chip 211, the rectifying chip 214, and the capacitors 213 can be provided only on the top surface or the bottom surface of the PCB board 200. Of course, in order to improve the electrical performance of the module power supply, improve thermal management, enhance electromagnetic compatibility, and improve reliability, the power switch chip 212, the driving chip 211, the rectifying chip 214, and the capacitors 213 can be symmetrically provided on the top surface and the bottom surface of the PCB board 200, that is, the same number of the power switch chip 212, the driving chip 211, the rectifying chip 214, and the capacitors 213 are provided on both the top surface and the bottom surface of the PCB board 200.

[0065] Please refer to Figure 4 , as a specific embodiment, the module power supply further includes a plurality of first heat sinks 270 and a plurality of second heat sinks 260. Each first heat sink 270 corresponds to one rectifying chip 214, and the first heat sink 270 is disposed on the surface of the corresponding rectifying chip 214. The second heat sink 260 includes a first structure 261 and a second structure 262. The first structure 261 is disposed between the driving chip 211 and the power switch chip 212, and the second structure 262 covers the surface of the upper magnetic core structure 230 and / or the lower magnetic core structure 250, and the first structure 261 and the second structure 262 are connected.

[0066] Specifically, the first heat sink 270 and the rectifying chip 214 correspond to each other one by one and are mounted on the surface of the corresponding rectifying chip 214. The first heat sink 270 is specifically a heat sink, and the materials of the heat sink include aluminum alloy heat sinks, copper-based heat sinks, copper-aluminum composite structures, graphene composite materials, etc., which are not limited herein. To further improve the heat dissipation performance of the modular power supply, the embodiment of the present invention also provides a second heat sink 260. The first structure 261 of the second heat sink 260 is disposed between the driving chip 211 and the power switch chip 212 for isolation and connection between the driving chip 211 and the power switch chip 212. The second structure 262 of the second heat sink 260 covers the surface of the upper magnetic core structure 230 and / or the surface of the lower magnetic core structure 250 and is connected to the first structure 261 of the second heat sink 260. The second heat sink 260 can be selected from any one or more of materials with heat conduction performance such as copper, aluminum, silver, graphene, and direct copper clad ceramic to quickly conduct the heat between the driving chip 211 and the power switch chip 212 to the outside of the power supply, thereby improving the heat dissipation capacity of the modular power supply. If the second heat sink 260 selects a direct copper clad ceramic material, the second heat sink 260 can not only be used for heat conduction but also relieve the thermal expansion stress generated by the driving chip 211 and the power switch chip 212 due to different materials.

[0067] It should be noted that if the driving chip 211 and the power switch chip 212 are stacked on the top surface of the PCB board 200, the second structure 262 of the second heat sink 260 is connected to the corresponding first structure 261 and covers the surface of the upper magnetic core structure 230. If the driving chip 211 and the power switch chip 212 are stacked on the bottom surface of the PCB board 200, the second structure 262 of the second heat sink 260 is connected to the corresponding first structure 261 and covers the surface of the lower magnetic core structure 250. Since the larger the area of the heat sink, the better the heat dissipation effect on the heat source, the second structure 262 of the second heat sink is not limited to completely covering the surfaces of the lower magnetic core structure and the upper magnetic core structure, and the coverage range can also exceed or be less than the surfaces of the lower magnetic core structure and the upper magnetic core structure, which is not limited herein.

[0068] Figure 5 Perspective view of the isolation layer provided by the embodiment of the present invention.

[0069] Please refer to Figure 5, the material of the first isolation layer 202 is specifically copper. By filling copper foil into the connection gap area between the top connection layer 201 and the PCB winding 203, and connecting the copper foil to a stable ground terminal, it serves as an electrical isolation layer between the PCB winding 203 and the electronic device 210 located in the first area on the top surface of the PCB board 200. The thickness of the first isolation layer 202 needs to be designed according to PCB process requirements and power supply operating frequency requirements. For example, in an application with an operating frequency of 1 MHz, the thickness of the first isolation layer 202 is designed to be 2 ounces, which is not limited here.

[0070] Of course, in addition to copper, the material of the first isolation layer 202 can also be selected as silver, conductive polymer, etc., which is not limited here. To ensure that the first isolation layer 202 does not short-circuit the PCB winding 203, the first isolation layer 202 needs to be set as a non-closed structure. The second isolation layer 204 is arranged between the bottom connection layer 205 and the PCB winding 203. The material, structure, and function of the second isolation layer 204 are similar to those of the first isolation layer 202, and will not be elaborated here.

[0071] Figure 6 The top view of the modular power supply provided by the embodiment of the present invention Figure 1 。 Figure 7 The structural diagram of the magnetic core provided by the embodiment of the present invention. Figure 8 The top view of the modular power supply provided by the embodiment of the present invention Figure 2 。

[0072] Please refer to Figure 6 、 Figure 7 and Figure 8 , as an implementation manner, there are a first notch area 281 and a second notch area 282 on the first side of the PCB board 200. The first notch area 281 and the second notch area 282 are separated by a bump structure of the PCB board 200. The lower magnetic core structure 250 includes a first side post 251 and a second side post 252. The first side post 251 is embedded in the first notch area 281 and connected to the upper magnetic core structure 230, and the second side post 252 is embedded in the second notch area 282 and connected to the upper magnetic core structure 230. Since the first side post 251 and the second side post 252 can be respectively embedded in the first notch area 281 and the second notch area 282, the magnetic core does not protrude compared to the PCB board 200, but forms an integral whole with the PCB board 200, thereby further reducing the planar area of the modular power supply.

[0073] As a specific implementation manner, the shape of the central column structure 240 includes at least a cylindrical shape, a square shape, or an arc shape. The shape of the central column structure 240 can be selected corresponding to different application scenarios, which is not limited herein.

[0074] Specifically, in this embodiment, according to the magnetic flux design requirements, the sum of the areas of the first side column 251 and the second side column 252 is equal to the area of the central column. And the designed dimensions of both the first side column 251 and the second side column 252 are 4.5 mm * 2 mm, and the radius of the central column is 2.25 mm. Of course, the dimensions of the central column, the first side column 251, and the second side column 252 can also be adaptively adjusted according to different application scenarios, which is not limited herein.

[0075] Figure 9 The top view of the modular power supply provided by the embodiment of the present invention Figure 3 。

[0076] Please refer to Figure 9 , as a specific implementation manner, the PCB winding 203 specifically includes a plurality of stacked winding layers. The modular power supply further includes a winding layer connection structure 290, and the winding layer connection structure 290 covers the surface of the area of the PCB board 200 penetrated by the central column structure 240 for connecting the plurality of winding layers.

[0077] Since the traditional method is to connect each winding layer by punching holes, but the punching generally requires a hole diameter of 0.2 - 0.3 mm, which will not only occupy the area of the PCB board 200, but also affect the layout of the primary and secondary windings in each winding layer. And connecting each winding layer through the winding layer connection structure 290 can effectively reduce the occupation of the planar area of the PCB board 200 by vias and simplify the circuit layout of the primary and secondary windings in each winding layer.

[0078] Specifically, the winding layer connection structure 290 is a copper plating structure, and the thickness of the copper plating structure is greater than or equal to 40 μm, and the length of the copper plating structure is not limited. Of course, in addition to copper plating, the winding layer connection structure 290 can also be other metal conductive structures, and the dimensions of the winding layer connection structure 290 can also be adaptively adjusted according to the application scenario, which are not limited herein.

[0079] As a specific implementation manner, in order to consider the withstand voltage requirements and heat dissipation uniformity of each electronic device 210. The layout spacing requirement of each electronic device 210 is above 1 mm. On this basis, the spacing of each electronic device 210 can be minimized as much as possible to reduce the planar area requirement.

[0080] In summary, for the modular power supply provided by the embodiments of the present invention, the first isolation layer is disposed between the PCB winding and the bottom connection layer, and the second isolation layer is disposed between the top connection layer and the PCB winding, so that the PCB winding is electrically isolated from the top connection layer and the bottom connection layer respectively. Therefore, the plurality of electronic devices can be disposed in the first region on the top surface of the PCB board member that overlaps the PCB winding vertically and the second region on the bottom surface of the PCB board member, thereby making full use of the space perpendicular to the PCB winding, improving the space utilization rate and the planar utilization rate of the modular power supply, and further improving the system power density and the planar current density of the modular power supply.

[0081] Furthermore, since the drive chip is stacked on the power switch chip, and at least two of the capacitors are stacked on each other, the space utilization rate of the modular power supply is further improved, and the planar area of the modular power supply is reduced.

[0082] Furthermore, the technical solution of the present invention further provides a plurality of first heat sinks and second heat sinks. The first heat sink is disposed on the surface of the corresponding rectifier chip. The second heat sink includes a first structure and a second structure. The first structure is disposed between the drive chip and the power switch chip, and the second structure covers the surface of the upper magnetic core structure and / or the lower magnetic core structure, so as to quickly conduct the heat between the drive chip and the power switch chip to the outside of the power supply, and quickly dissipate the heat of the rectifier chip, thereby greatly improving the heat dissipation capacity of the modular power supply.

[0083] Furthermore, the isolation layer is set to be a non-closed structure, so as to avoid short-circuiting the PCB winding.

[0084] Furthermore, a first notch area and a second notch area are provided on the first side of the PCB board member, and the first side post and the second side post of the lower magnetic core structure are respectively embedded in the first notch area and the second notch area, thereby further reducing the planar area of the modular power supply.

[0085] Furthermore, a winding layer connection structure is disposed on the surface of the area of the PCB board member penetrated by the middle post structure, so that the winding layer connection structure connects the plurality of winding layers, thereby simplifying the circuit layout between the winding layers.

[0086] The embodiments of the present invention further provide an electronic device, including the modular power supply provided in the previous embodiment.

[0087] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit them; although the present invention has been described in detail with reference to the foregoing embodiments, those of ordinary skill in the art should understand that they can still modify the technical solutions described in the foregoing embodiments, or perform equivalent replacements for some or all of the technical features; and these modifications or replacements do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of the present invention.

Claims

1. A module power supply, characterized in that: include: A PCB board, comprising a bottom wiring layer, a second isolation layer, a PCB winding, a first isolation layer and a top wiring layer stacked in sequence along a thickness direction of the PCB board; A plurality of electronic components are arranged in a first area on the top surface of the PCB board and in a second area on the bottom surface of the PCB board, wherein the first area, the second area and the PCB winding overlap each other; The magnetic core includes an upper magnetic core structure, a lower magnetic core structure and a middle column structure, wherein the upper magnetic core structure covers part of the electronic components located on the top surface of the PCB board, the lower magnetic core structure covers part of the electronic components located on the bottom surface of the PCB board, and the middle column structure penetrates the PCB board and connects the upper magnetic core structure and the lower magnetic core structure respectively.

2. The modular power supply according to claim 1, characterized in that: The electronic device at least includes a plurality of power switch chips, a plurality of driver chips, a plurality of rectifier chips and a plurality of capacitors; The power switch chip is arranged on the top surface of the PCB board and / or the bottom surface of the PCB board, the driver chip is arranged on the top surface of the PCB board and / or the bottom surface of the PCB board and / or the surface of the power switch chip, the rectifier chip is arranged on the top surface of the PCB board and / or the bottom surface of the PCB board, the capacitor is arranged on the top surface of the PCB board and / or the bottom surface of the PCB board, and at least two of the multiple capacitors are stacked on each other.

3. The modular power supply according to claim 2, characterized in that: The power switch chip is arranged on the surface of the top wiring layer and the surface of the bottom wiring layer; Each of the driving chips corresponds to a power switch chip and is stacked on the surface of the corresponding power switch chip; The rectifier chip is arranged on the surface of the top wiring layer and the surface of the bottom wiring layer; Some of the capacitors are arranged on the surface of the top wiring layer and the surface of the bottom wiring layer, and the remaining capacitors are stacked on the corresponding different capacitor surfaces; The driving chip, the power switch chip, the capacitor and the rectifier chip are electrically connected to the bottom wiring layer and the top wiring layer respectively.

4. The modular power supply according to claim 2 or 3, characterized in that: The module power supply also includes a plurality of first heat sinks and a plurality of second heat sinks, each of the first heat sinks corresponds to a rectifier chip, the first heat sink is arranged on the surface of the corresponding rectifier chip, the second heat sink includes a first structure and a second structure, the first structure is arranged between the driving chip and the power switch chip, the second structure covers the surface of the upper magnetic core structure and / or the lower magnetic core structure, and the first structure and the second structure are connected.

5. The modular power supply according to claim 4, characterized in that: The second heat sink is made of at least one material or multiple materials selected from the group consisting of copper, aluminum, silver, graphene, and direct copper-clad ceramic.

6. The modular power supply according to claim 3, characterized in that: The capacitor includes a multilayer ceramic capacitor.

7. The modular power supply according to claim 1, characterized in that: The first isolation layer and the second isolation layer are both non-closed structures.

8. The modular power supply according to claim 7, characterized in that: The materials of the first isolation layer and the second isolation layer are at least any one of silver, copper, and a conductive polymer, and the isolation layer is electrically connected to the ground terminal.

9. The modular power supply according to claim 1, characterized in that: There are a first notch area and a second notch area on the first side of the PCB board, the first notch area and the second notch area are separated by a bump structure of the PCB board, the lower magnetic core structure includes a first side column and a second side column, the first side column is embedded in the first notch area and connected to the upper magnetic core structure, and the second side column is embedded in the second notch area and connected to the upper magnetic core structure.

10. The modular power supply according to claim 1, characterized in that: The PCB winding includes several stacked winding layers, and the module power supply also includes a winding layer connection structure, which covers the surface of the PCB board in the area penetrated by the central column structure, and the winding layer connection structure is used to connect several of the winding layers.

11. The modular power supply according to claim 10, characterized in that: The winding layer connection structure is a copper-plated structure, and the thickness of the copper-plated structure is greater than or equal to 40 μm.

12. An electronic device, characterized in that: A module power supply comprising any one of claims 1 to 11.

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