Thermocompression bonding device for PCB (printed circuit board) production

Abstract

The invention provides a PCB production thermocompression bonding device, and relates to the field of PCB processing, and the PCB production thermocompression bonding device comprises a pedestal, a pressing bench arranged on the pedestal, a pressing assembly arranged on the pedestal, a pressing seat arranged on the pressing assembly, and a collection assembly arranged on the pedestal. In order to solve the problems that in the prior art, when PCBs of different sizes are replaced, all clamping assemblies need to be adjusted one by one, the operation time is greatly prolonged, and the working efficiency of the PCBs during hot pressing is low, the multi-layer PCBs of different sizes are automatically clamped and fixed through the arranged clamping mechanism and heating mechanism; through the arrangement of the clamping mechanism and the heating mechanism, the problem that in the prior art, a PCB is heated unevenly during heating is solved; through the arrangement of the clamping mechanism and the heating mechanism, the problem that dust or impurities on the surface of the pressing table in the prior art can affect the quality of the PCB after hot pressing is solved.

Description

Technical Field

[0001] The present invention relates to the field of PCB board processing, and more specifically, to a hot pressing device for PCB circuit board production. Background Art

[0002] In integrated circuit manufacturing, the hot pressing device in PCB circuit board production is mainly used to bond and cure materials such as the inner core board, prepreg (PP), and outer copper foil of multi-layer circuit boards through high temperature and high pressure to form an integral multi-layer board structure.

[0003] For example: In the "PCB board lamination pressing device with overload protection function" disclosed in the Chinese invention patent (application number: 202311785936.5), its specification discloses that: four groups of clamping components matching the pressing cavity are arranged on the top of the pressing table, and the four groups of clamping components are respectively located at the edges of the top of the pressing table. A collecting component matching the overload protection component is arranged on the top of the base. A heating component is arranged in the pressing table, and a control panel is fixedly connected to one side of the top of the base.

[0004] However, there are still some deficiencies in the above-mentioned PCB board lamination pressing device with overload protection function during actual use: In the above-mentioned prior art, when positioning and clamping PCB boards of different sizes, it is necessary to manually adjust the spacing of the clamping components, and the clamping components are adjusted to position and clamp PCB boards of different sizes. Among them, there are four groups of clamping components, and manual adjustment of the clamping components requires operators to adjust each clamping position one by one. Each time a PCB board of a different size is replaced, it is necessary to readjust, which greatly increases the operation time and makes the working efficiency of the PCB board during hot pressing relatively low. Therefore, we make improvements on this and propose a hot pressing device for PCB circuit board production. Summary of the Invention

[0005] The purpose of the present invention is to address the problem that when replacing PCB boards of different sizes, it is necessary to adjust each clamping component one by one, which greatly increases the operation time and makes the working efficiency of the PCB board during hot pressing relatively low.

[0006] To achieve the above-mentioned invention purpose, the present invention provides a hot pressing device for PCB circuit board production to improve the above problems.

[0007] Specifically, this application is as follows: It includes a base, a pressing table arranged on the base, a pressing component arranged on the base, a pressing seat arranged on the pressing component, and a collecting component arranged on the base. It further includes a clamping mechanism arranged on the pressing table and a heating mechanism arranged on the pressing table; The clamping mechanism includes an extrusion plate slidably arranged on the pressing table, a fixed seat arranged on the pressing table, a rack slidably arranged on the fixed seat, a fan rotatably arranged on the pressing seat, a rotating shaft arranged on the fixed seat, a rotating column arranged on the rotating shaft, a driving groove arranged on the outer side of the rotating column, a first triangular block arranged on the rotating column, a first spring arranged on the fixed seat, a gear arranged on the first spring, a second triangular block arranged on the gear, a driving component arranged on the base, a transfer component arranged on the base, and a cleaning component arranged on the base; The heating mechanism includes a cavity arranged in the pressing table and a heating grid arranged in the cavity.

[0008] As a preferred technical solution of the present application, four groups of the clamping mechanisms are provided. The rack is arranged on the extrusion plate. The fan is adapted to the driving groove. The first triangular block is adapted to the second triangular block. The gear is adapted to the rack.

[0009] As a preferred technical solution of the present application, the driving component includes a convex block arranged in the fan. An extrusion rod is arranged in the pressing seat. A spiral groove is arranged on the extrusion rod. The convex block is adapted to the spiral groove. The extrusion rod is slidably arranged on the fan.

[0010] As a preferred technical solution of the present application, a discharge hole is arranged on the pressing table, and an air inlet hole is arranged on the pressing table. The discharge hole is adapted to the fan.

[0011] As a preferred technical solution of the present application, an extension plate is slidably arranged on the extrusion plate, and a second spring is arranged on the corresponding surfaces of the extension plate and the extrusion plate.

[0012] As a preferred technical solution of the present application, a telescopic rod is arranged on the fixed seat. The first spring is arranged in the telescopic rod. The rack is rotatably arranged on the telescopic rod.

[0013] As a preferred technical solution of the present application, the transfer component includes a hole arranged on the extrusion plate. A first connecting pipe is fixedly penetrated between the extrusion plate and the telescopic rod. A second connecting pipe is fixedly penetrated on the telescopic rod.

[0014] As a preferred technical solution of the present application, a first one-way valve is arranged in the first connecting pipe, and a second one-way valve is arranged in the second connecting pipe.

[0015] As a preferred technical solution of the present application, the cleaning component includes a semi-circular block arranged on the fixed seat. A transmission shaft is arranged on the rack. The transmission shaft is rotatably arranged on the extrusion plate.

[0016] As a preferred technical solution of the present application, an offset groove is provided on the extrusion plate, the offset groove is adapted to the rack, a torsion spring is provided outside the transmission shaft, and both ends of the torsion spring are respectively provided on the corresponding surfaces of the rack and the extrusion plate.

[0017] Compared with the prior art, the beneficial effects of the present invention are as follows: In the solution of the present application: 1. In order to solve the problem that in the prior art, when replacing PCB boards of different sizes, each clamping component needs to be adjusted one by one, which greatly increases the operation time and results in low working efficiency of the PCB board during hot pressing. In the present application, through the provided clamping mechanism and heating mechanism, the extrusion plate is displaced by the fan, so that the extrusion plate clamps and fixes PCB boards of different sizes, and then cooperates with the extension plate to fix multi-layer PCB boards, realizing automatic clamping and fixing of multi-layer PCB boards of different sizes; 2. Through the provided clamping mechanism and heating mechanism, by the opposite design of the fan blades and driving the rotation of the fan, the hot air circulation above the pressing table is realized, solving the problem of uneven heating of the PCB board in the prior art during heating; 3. Through the provided clamping mechanism and heating mechanism, by driving the extrusion plate to rotate and discharging the hot air from the holes on the extrusion plate, the dust and impurities on the surface of the pressing table are cleaned by the discharged hot air, solving the problem that the quality of the PCB board after hot pressing is affected by dust or impurities on the surface of the pressing table in the prior art. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 It is a schematic structural diagram of the PCB circuit board production hot pressing device provided by the present application; Figure 2 It is a schematic structural diagram of the driving component of the PCB circuit board production hot pressing device provided by the present application; Figure 3 It is a schematic structural diagram of the heating mechanism of the PCB circuit board production hot pressing device provided by the present application; Figure 4 It is a schematic structural diagram of the back of the clamping mechanism of the PCB circuit board production hot pressing device provided by the present application; Figure 5 It is a schematic structural diagram of the front of the clamping mechanism of the PCB circuit board production hot pressing device provided by the present application; Figure 6 It is a schematic partial sectional view of the extrusion plate of the PCB circuit board production hot pressing device provided by the present application; Figure 7 It is a schematic structural diagram of the inside of the fixed seat of the PCB circuit board production hot pressing device provided by the present application; Figure 8Schematic diagram of the internal structure of the telescopic rod of the PCB circuit board production hot pressing device provided by this application.

[0019] Labels in the figure: 1. Base; 101. Pressing table; 102. Pressing assembly; 103. Pressing seat; 104. Collection assembly; 2. Clamping mechanism; 201. Extrusion plate; 202. Fixed seat; 203. Rack; 204. Fan; 205. Rotating shaft; 206. Rotating column; 207. Driving groove; 208. Triangular block 1; 209. Spring 1; 210. Gear; 211. Triangular block 2; 212. Driving assembly; 2121. Protrusion; 2122. Extrusion rod; 2123. Spiral groove; 213. Extension plate; 214. Spring 2; 215. Telescopic rod; 216. Transfer assembly; 2161. Hole; 2162. Connecting pipe 1; 2163. Connecting pipe 2; 2164. Check valve 1; 2165. Check valve 2; 217. Cleaning assembly; 2171. Semi-circular block; 2172. Transmission shaft; 2173. Offset groove; 2174. Torsion spring; 3. Heating mechanism; 301. Cavity; 302. Heating mesh; 303. Discharge hole; 304. Air inlet hole. Detailed implementation manners

[0020] In order to enable those skilled in the art to better understand the solution of the present invention, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention.

[0021] As described in the background art, when replacing PCB boards of different sizes, it is necessary to adjust each clamping component one by one, which greatly increases the operation time and results in a low working efficiency during the hot pressing of PCB boards.

[0022] To solve this technical problem, the present invention provides a PCB circuit board production hot pressing device, which is applied to the processing of PCB boards.

[0023] Specifically, please refer to Figures 1-8, the hot pressing device for PCB circuit board production specifically includes: a base 1, a pressing table 101 arranged on the base 1, a pressing assembly 102 arranged on the base 1, a pressing seat 103 arranged on the pressing assembly 102, and a collecting assembly 104 arranged on the base 1. It also includes a clamping mechanism 2 arranged on the pressing table 101 and a heating mechanism 3 arranged on the pressing table 101. In the prior art, the pressing table 101 is used to place the PCB board, the pressing assembly 102 is used to drive the pressing seat 103 to cooperate with the pressing table 101 and perform the pressing work on the PCB board. After the PCB board is hot pressed, the hot pressed PCB board is transferred into the collecting assembly 104 by the pressing assembly 102, and the hot pressed PCB board is discharged through the collecting assembly 104; The clamping mechanism 2 includes a pressing plate 201 slidably arranged on the pressing table 101, a fixed seat 202 arranged on the pressing table 101, a rack 203 slidably arranged on the fixed seat 202, a fan 204 rotatably arranged on the pressing seat 103, a rotating shaft 205 arranged on the fixed seat 202, a rotating column 206 arranged on the rotating shaft 205, a driving groove 207 arranged on the outer side of the rotating column 206, a first triangular block 208 arranged on the rotating column 206, a first spring 209 arranged on the fixed seat 202, a gear 210 arranged on the first spring 209, a second triangular block 211 arranged on the gear 210, a driving assembly 212 arranged on the base 1, a transfer assembly 216 arranged on the base 1, and a cleaning assembly 217 arranged on the base 1; The heating mechanism 3 includes a cavity 301 arranged inside the pressing table 101 and a heating mesh 302 arranged inside the cavity 301.

[0024] The hot pressing device for PCB circuit board production provided by the present invention solves the problem that in the prior art, when replacing PCB boards of different sizes, each clamping component needs to be adjusted one by one, which greatly increases the operation time and results in low working efficiency during the hot pressing of PCB boards. Through the arranged clamping mechanism 2 and heating mechanism 3, the pressing plate 201 is displaced by driving the fan 204, so that the pressing plate 201 clamps and fixes PCB boards of different sizes, and then cooperates with the extension plate 213 to fix multi-layer PCB boards, realizing the automatic clamping and fixing of multi-layer PCB boards of different sizes; Through the arranged clamping mechanism 2 and heating mechanism 3, by the opposite design of the fan blades of the fan 204 and driving the rotation of the fan 204, the hot air circulation above the pressing table 101 is realized, solving the problem of uneven heating of PCB boards in the prior art during heating; Through the provided clamping mechanism 2 and heating mechanism 3, by driving the pressing plate 201 to rotate and discharging hot air from the holes 2161 on the pressing plate 201, the dust and impurities on the surface of the pressing table 101 are cleaned by the discharged hot air, solving the problem in the prior art that the dust or impurities on the surface of the pressing table 101 will affect the quality of the PCB board after hot pressing.

[0025] In order to enable those skilled in the art to better understand the solution of the present invention, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings.

[0026] It should be noted that, without conflict, the embodiments in the present invention and the features and technical solutions in the embodiments can be combined with each other.

[0027] It should be noted that similar reference numerals and letters denote similar items in the following drawings. Therefore, once an item is defined in one drawing, it does not need to be further defined and explained in subsequent drawings.

[0028] Example 1, please refer to Figure 1 、 Figure 2 、 Figure 3 、 Figure 4 、 Figure 5 、 Figure 6 and Figure 7 As shown in Further, the driving component 212 includes a bump 2121 disposed within the fan 204. An extrusion rod 2122 is disposed within the pressing seat 103. A spiral groove 2123 is provided on the extrusion rod 2122. The bump 2121 is adapted to the spiral groove 2123. The extrusion rod 2122 is slidably disposed on the fan 204. When the pressing component 102 drives the pressing seat 103 to displace downward, such that the pressing seat 103 cooperates with the pressing table 101 and performs a pressing operation on the PCB board, the extrusion rod 2122 on the pressing seat 103 synchronously displaces downward. The spiral groove 2123 on the extrusion rod 2122 extrudes the bump 2121, causing the bump 2121 to rotate around its own axis along the spiral groove 2123. At the same time, the fan 204 rotates synchronously. By means of the fan 204, the clamping mechanism 2 is driven to clamp and fix PCB boards of different sizes. Compared with the prior art, where the clamping device is adjusted manually one by one to clamp and fix PCB boards of different sizes, this technology can automatically clamp and fix the PCB boards, improving the efficiency of hot pressing; Further, a discharge hole 303 is provided on the pressing table 101, and an air inlet hole 304 is provided on the pressing table 101. The discharge hole 303 is adapted to the fan 204. When the spiral groove 2123 on the extrusion rod 2122 extrudes the bump 2121 and drives the fan 204 to rotate, the fan 204 sucks out the hot air generated by the heating grid 302 within the cavity 301, and discharges the sucked hot air from the discharge hole 303. At the same time, the pressing table 101 cooperates with the pressing seat 103 to form a sealed space, where the PCB board is located within the sealed space. The hot air sucked out by the fan 204 heats the PCB board. Among them, as Figure 2 shown, four fans 204 are provided, and the angles of the fan blades of the symmetrically arranged fans 204 are opposite. Thus, when all the fans 204 rotate, one side of the fans 204 sucks air, and the other side of the fans 204 discharges air, realizing the circulation of hot air. The PCB board is uniformly heated by the circulating hot air; Further, an extension plate 213 is slidably disposed on the extrusion plate 201. A second spring 214 is provided on the corresponding surfaces of the extension plate 213 and the extrusion plate 201. The second spring 214 is used to drive the extension plate 213 to reset. The extension plate 213 is used to clamp multi-layer PCB boards. When the PCB board is replaced with different layers for hot pressing, the extension plate 213 slides along the extrusion plate 201 and fixes the multi-layer PCB boards, enabling the device to automatically clamp and fix the multi-layer PCB boards during hot pressing; The clamping mechanism 2 automatically clamps and fixes PCB boards of different sizes, and can simultaneously clamp and fix multi-layer PCBs. Through the cooperation of the clamping mechanism 2 and the heating mechanism 3, the hot air generated by the heating mechanism 3 is used to heat the PCB board, and at the same time, the hot air is driven to circulate to achieve uniform heating of the PCB board.

[0029] Example 2 further optimizes the hot pressing device for PCB board production provided in Example 1. Specifically, as shown in Figure 3 , Figure 4 , Figure 5 , Figure 6 , Figure 7 and Figure 8 , a telescopic rod 215 is arranged on the fixed seat 202. The first spring 209 is arranged inside the telescopic rod 215. The rack 203 is rotatably arranged on the telescopic rod 215. The telescopic rod 215 guides the gear 210 during displacement to prevent the second triangular block 211 on the gear 210 from disengaging from the first triangular block 208. When the gear 210 reciprocates up and down, the gear 210 and the rack 203 are always in a meshed state; Furthermore, the transfer component 216 includes a hole 2161 arranged on the extrusion plate 201. A first connecting pipe 2162 is fixedly penetrated between the extrusion plate 201 and the telescopic rod 215. A second connecting pipe 2163 is fixedly penetrated on the telescopic rod 215. The second connecting pipe 2163 is directly above the exhaust hole. When the gear 210 moves up and down, the hot air generated by the electric heating grid is inhaled into the telescopic rod 215 through the first connecting pipe 2162 and the second connecting pipe 2163, and is discharged into the hole 2161 from the first connecting pipe 2162. When the extrusion plate 201 clamps the PCB board, the hot air discharged through the hole 2161 heats the interlayer of the multi-layer PCB board, improving the heating efficiency; Furthermore, a first one-way valve 2164 is arranged in the first connecting pipe 2162, and a second one-way valve 2165 is arranged in the second connecting pipe 2163. The first connecting pipe 2162 and the second connecting pipe 2163 are unidirectionally conducted through the first one-way valve 2164 and the second one-way valve 2165, so that the second connecting pipe 2163 can only inhale hot air, and the first connecting pipe 2162 can only discharge hot air, realizing targeted heating of the interlayer of the multi-layer PCB board; Further, the cleaning component 217 includes a semi-circular block 2171 disposed on the fixed base 202. A transmission shaft 2172 is disposed on the rack 203. The transmission shaft 2172 is rotatably disposed on the pressing plate 201. When the pressing component 102 transfers the hot-pressed PCB board to the collecting component 104, the pressing seat 103 moves upward, so that the spiral groove 2123 on the pressing rod 2122 presses the bump 2121, and drives the fan 204 to reverse. The fan 204 drives the pressing plate 201 to reset. When the pressing plate 201 contacts and presses the semi-circular block 2171, the pressing plate 201 rotates along the transmission shaft 2172, so that the pressing plate 201 rotates. When the spiral groove 2123 on the pressing rod 2122 has not disengaged from the bump 2121, the telescopic rod 215 is always in a state of reciprocating up and down displacement. Through the up and down displacement of the telescopic rod 215, the hot air is discharged from the hole 2161. The dust and impurities on the surface of the pressing table 101 are cleaned by the discharged hot air, reducing the pollutants on the surface of the pressing table 101. Among them, the pressing plate 201 is rotated and hot air is blown to clean the dust and impurities on the surface of the pressing table 101. This method is to prevent the direct blowing of hot air from causing the relative hot air to cancel each other out, resulting in low cleaning efficiency. By rotating the pressing plate 201 and blowing hot air, the mutual cancellation of hot air is reduced, and the cleaning efficiency is improved; Further, an offset groove 2173 is disposed on the pressing plate 201. The offset groove 2173 is adapted to the rack 203. A torsion spring 2174 is disposed outside the transmission shaft 2172. The two ends of the torsion spring 2174 are respectively disposed on the corresponding surfaces of the rack 203 and the pressing plate 201. The offset groove 2173 prevents the pressing plate 201 from interfering with the rack 203 when rotating, and the torsion spring 2174 drives the pressing plate 201 to reset. When the pressing plate 201 is perpendicular to the rack 203, it is in a reset state; The sandwich layer of the multi-layer PCB board is heated by the transfer component 216, realizing targeted heating of the sandwich layer of the multi-layer PCB board. The cleaning component 217 drives the pressing plate 201 to rotate and blow out hot air, and the dust and impurities on the surface of the pressing table 101 are cleaned by the blown hot air, reducing the pollutants on the surface of the pressing table 101.

[0030] The use process of the PCB circuit board production hot pressing device provided by the present invention is as follows: During use, the pressing component 102 drives the pressing seat 103 to move downward, so that the pressing seat 103 cooperates with the pressing table 101 to press the PCB board. The extrusion rod 2122 on the pressing seat 103 moves downward synchronously. The spiral groove 2123 on the extrusion rod 2122 extrudes the bump 2121, causing the bump 2121 to rotate along the spiral groove 2123. At the same time, the fan 204 rotates synchronously. The fan 204 extrudes the driving groove 207 and drives the driving groove 207 and the rotating column 206 to rotate synchronously. The triangular block one 208 on the rotating column 206 drives the triangular block two 211 to rotate. The triangular block two 211 and the rack 203 rotate synchronously. The rack 203 drives the extrusion plate 201 to move towards the central part of the pressing seat 103. When the extrusion plate 201 contacts the PCB board, the extrusion plate 201 stops moving. At this time, the triangular block two 211 stops rotating. At the same time, the triangular block one 208 drives the triangular block two 211 to reciprocate up and down. At the same time, the fan 204 sucks out the hot air generated by the heating net 302 in the cavity 301 and discharges the sucked hot air from the discharge hole 303. At the same time, the pressing table 101 and the pressing seat 103 cooperate to form a sealed space, where the PCB board is in the sealed space, and the hot air sucked out by the fan 204 heats the PCB board. Among them, as Figure 2As shown, there are four fans 204. The angles of the blades of the symmetric fans 204 are opposite. Thus, when all the fans 204 rotate, the fans 204 on one side suck air and the fans 204 on the other side exhaust air, realizing the circulation of hot air. The PCB board is evenly heated by the circulating hot air. The connecting pipe two 2163 is directly above the exhaust hole. When the gear 210 moves up and down, the one-way valve one 2164 and the one-way valve two 2165 conduct the connecting pipe one 2162 and the connecting pipe two 2163 unidirectionally, so that the connecting pipe two 2163 can only suck hot air and the connecting pipe one 2162 can only exhaust hot air. The hot air generated by the electric heating grid is sucked into the telescopic rod 215 through the connecting pipe two 2163 and discharged into the hole 2161 from the connecting pipe one 2162. When the pressing plate 201 clamps the PCB board, the hot air discharged through the hole 2161 heats the interlayer of the multi-layer PCB board. When the pressing component 102 transfers the hot-pressed PCB board to the collecting component 104, the pressing seat 103 moves up, so that the spiral groove 2123 on the pressing rod 2122 presses the convex block 2121 and drives the fan 204 to reverse. The fan 204 drives the pressing plate 201 to reset. When the pressing plate 201 contacts and presses the semi-circular block 2171, the pressing plate 201 rotates along the transmission shaft 2172, so that the pressing plate 201 rotates. When the spiral groove 2123 on the pressing rod 2122 has not separated from the convex block 2121, the telescopic rod 215 has been in a state of reciprocating up and down displacement. Through the up and down displacement of the telescopic rod 215, the hot air is discharged from the hole 2161, and the dust and impurities on the surface of the pressing table 101 are cleaned by the discharged hot air, reducing the pollutants on the surface of the pressing table 101.

[0031] In the present invention, unless otherwise clearly defined and limited, terms such as "installation", "connection", "connection", "fixation" and the like should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection or an integral one; it can be a mechanical connection, an electrical connection or communication with each other; it can be directly connected or indirectly connected through an intermediate medium, and it can be the communication inside two components or the interaction relationship between two components, unless otherwise clearly defined. For those of ordinary skill in the art, the specific meanings of the above terms in the present invention can be understood according to specific situations.

[0032] Obviously, the embodiments described above are only a part of the embodiments of the present invention, rather than all of them. The preferred embodiments of the present invention are shown in the accompanying drawings, but they do not limit the patent scope of the present invention. The present invention can be implemented in many different forms. On the contrary, the purpose of providing these embodiments is to make the understanding of the disclosed content of the present invention more thorough and comprehensive. Although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing specific embodiments, or perform equivalent replacements on some of the technical features. Any equivalent structure directly or indirectly using the content of the specification and drawings of the present invention in other related technical fields shall be within the scope of the patent protection of the present invention by the same token.

Claims

1. A PCB circuit board production hot pressing device, comprising a base (1), a pressing table (101) arranged on the base (1), a pressing assembly (102) arranged on the base (1), a pressing seat (103) arranged on the pressing assembly (102) and a collecting assembly (104) arranged on the base (1), characterized in that: It also includes a clamping mechanism (2) arranged on the pressing platform (101) and a heating mechanism (3) arranged on the pressing platform (101); The clamping mechanism (2) comprises an extrusion plate (201) slidably arranged on the pressing platform (101), a fixed seat (202) arranged on the pressing platform (101), a rack (203) slidably arranged on the fixed seat (202), a fan (204) rotatably arranged on the pressing platform (103), a rotating shaft (205) arranged on the fixed seat (202), a rotating column (206) arranged on the rotating shaft (205), a driving groove (207) arranged outside the rotating column (206), a triangular block (208) arranged on the rotating column (206), a spring (209) arranged on the fixed seat (202), a gear (210) arranged on the spring (209), a triangular block (211) arranged on the gear (210), a driving component (212) arranged on the base (1), a transfer component (216) arranged on the base (1), and a cleaning component (217) arranged on the base (1); The heating mechanism (3) comprises a cavity (301) arranged in the pressing platform (101) and a heating net (302) arranged in the cavity (301).

2. A PCB circuit board production hot pressing device according to claim 1, characterized in that: The clamping mechanism (2) is provided with four groups, the rack (203) is provided on the extrusion plate (201), the fan (204) and the driving slot (207) are adapted to each other, the triangular block 1 (208) and the triangular block 2 (211) are adapted to each other, and the gear (210) and the rack (203) are adapted to each other.

3. A PCB circuit board production hot pressing device according to claim 2, characterized in that: The driving assembly (212) comprises a protrusion (2121) arranged in the fan (204); an extrusion rod (2122) is arranged in the pressing seat (103); a spiral groove (2123) is arranged on the extrusion rod (2122); the protrusion (2121) and the spiral groove (2123) are adapted to each other; and the extrusion rod (2122) is slidably arranged on the fan (204).

4. A PCB circuit board production hot pressing device according to claim 3, characterized in that: The pressing platform (101) is provided with an exhaust hole (303), and the pressing platform (101) is provided with an air inlet hole (304), and the exhaust hole (303) and the fan (204) are adapted to each other.

5. A PCB circuit board production hot pressing device according to claim 4, characterized in that: An extension plate (213) is slidably arranged on the extrusion plate (201), and a second spring (214) is arranged on the corresponding surfaces of the extension plate (213) and the extrusion plate (201).

6. A PCB circuit board production hot pressing device according to claim 5, characterized in that: A telescopic rod (215) is arranged on the fixed seat (202), the spring 1 (209) is arranged inside the telescopic rod (215), and the rack (203) is rotatably arranged on the telescopic rod (215).

7. A PCB circuit board production hot pressing device according to claim 6, characterized in that: The transfer assembly (216) comprises a hole (2161) arranged on the extrusion plate (201), a connecting tube 1 (2162) is fixedly passed through between the extrusion plate (201) and the telescopic rod (215), and a connecting tube 2 (2163) is fixedly passed through the telescopic rod (215).

8. A PCB circuit board production hot pressing device according to claim 7, characterized in that: The connecting pipe 1 (2162) is provided with a one-way valve 1 (2164), and the connecting pipe 2 (2163) is provided with a one-way valve 2 (2165).

9. A PCB circuit board production hot pressing device according to claim 8, characterized in that: The cleaning assembly (217) comprises a semicircular block (2171) arranged on the fixing seat (202); a transmission shaft (2172) is arranged on the rack (203); and the transmission shaft (2172) is rotatably arranged on the extrusion plate (201).

10. A PCB circuit board production hot pressing device according to claim 9, characterized in that: The extrusion plate (201) is provided with an offset groove (2173), the offset groove (2173) being adapted to the rack (203), a torsion spring (2174) being provided on the outside of the transmission shaft (2172), and two ends of the torsion spring (2174) being respectively provided on corresponding surfaces of the rack (203) and the extrusion plate (201).

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