Heat dissipation module and electronic equipment comprising same

Abstract

The embodiment of the invention provides a heat dissipation module and electronic equipment comprising the heat dissipation module, the heat dissipation module comprises a plurality of heat dissipation plates which are connected in series through a cooling pipeline, the cooling pipeline is used for conveying cooling liquid to the plurality of heat dissipation plates, the cooling pipeline is connected with at least one heat dissipation plate through a first floating structure, the pressure of the cooling liquid in the first floating structure in the circulating process will float the cooling pipeline, then a certain freedom degree is allowed for connection between the cooling pipeline and the heat dissipation plates, for example, displacement in the up-down direction or the left-right direction is allowed, the displacement can counteract the tolerance of the cooling pipeline and the multiple heat dissipation plates in the manufacturing and assembling process, and the heat dissipation efficiency is improved. Therefore, the printed circuit board is prevented from being deformed, and elements in the electronic equipment are prevented from being damaged.

Description

Technical Field

[0001] The present application relates to the field of electronic engineering and thermal management technology, and in particular to a heat dissipation module and an electronic device including the heat dissipation module. Background Art

[0002] In order to ensure the stable operation of electronic devices and extend their service life, a heat dissipation module is required to dissipate heat from the components in the electronic devices (such as CPU, GPU, etc.). The heat sink in the heat sink module is in direct contact with the components and connected to the cooling pipe in the cooling system. The coolant in the cooling channel inside the heat sink is used to take away the heat from the components, thereby effectively reducing the operating temperature of the electronic devices. Therefore, the cooling pipe needs to be connected to the heat sink.

[0003] In the related art, the cooling pipe and the plurality of heat sinks are rigidly connected, wherein the rigid connection refers to a connection method in which the relative positions between the cooling pipe and the plurality of heat sinks are fixed, such as welding or threaded connection.

[0004] However, tolerances between the cooling pipe and the multiple heat sinks during the manufacturing and assembly process may cause deformation of the cooling pipe. Since the cooling pipe and the multiple heat sinks are rigidly connected, the deformation of the cooling pipe cannot offset these tolerances, which may cause stress concentration and make it impossible for the multiple heat sinks to be on the same plane, which may cause the printed circuit board (PCB) that fixes the components in the electronic device to deform and damage the components in the electronic device (for example, the soldering points in the components break, causing the components to fail, etc.). Summary of the invention

[0005] An embodiment of the present application provides a heat dissipation module and an electronic device including the heat dissipation module, which are used to achieve a floating connection between a cooling pipe in the heat dissipation module and at least one heat dissipation plate, thereby offsetting the tolerances of the cooling pipe and multiple heat dissipation plates during the manufacturing and assembly processes, thereby avoiding deformation of the printed circuit board and avoiding damage to components in the electronic device.

[0006] In a first aspect, an embodiment of the present application provides a heat dissipation module, comprising:

[0007] A plurality of heat sinks are connected in series via a cooling pipe, wherein the cooling pipe is used to transport cooling liquid to the plurality of heat sinks; wherein the cooling pipe is connected to at least one heat sink via a first floating structure, and the cooling liquid in the first floating structure causes the connected cooling pipe to float.

[0008] In a possible implementation, the cooling pipeline includes a part where different sub-pipelines are connected together; wherein, any two of the different sub-pipelines are connected by a second floating structure, and the coolant in the second floating structure causes floating of the sub-pipeline it accesses.

[0009] In a possible implementation, the first floating structure includes a first pipeline, a first spring coil, and a first connecting component;

[0010] The first pipeline is fixed to the heat dissipation plate. The first pipeline includes a coolant transmission channel for inputting the coolant received from the cooling pipeline into the heat dissipation plate, or transmitting the coolant output from the heat dissipation plate to the cooling pipeline.

[0011] The first spring coil is fixedly arranged at the first end of the cooling pipeline, and the first end of the cooling pipeline and the first spring coil are arranged in the first pipeline.

[0012] The first connecting component is arranged in the first pipeline. One end of the first connecting component is fixed at the first end of the cooling pipeline and contacts the first spring coil; the other end of the first connecting component is suspended in the first pipeline.

[0013] In a possible implementation, the second floating structure includes: a second pipeline, a second spring coil, and a second connecting component;

[0014] For two sub-pipelines connected by the second floating structure, wherein, a second spring coil is fixedly arranged at the second end of one or more of the two sub-pipelines, and the second end of one or more of the two sub-pipelines and the second spring coil are arranged in the second pipeline;

[0015] The second connecting component is arranged in the second pipeline. One end of the second connecting component is fixed at the second end of one or more of the two sub-pipelines and contacts the second spring coil, and the other end of the second connecting component is suspended in the second pipeline.

[0016] In a possible implementation, the size of the first connecting component is larger than the size of the port of the first pipeline away from the heat dissipation plate.

[0017] In a possible implementation, for the sub-pipeline fixed with the connection of the second connecting part, the size of the port of the second pipeline accessing this sub-pipeline is smaller than the size of the second connecting component.

[0018] In a possible implementation, the first floating structure further includes a first sealing ring; wherein, the first sealing ring is fixed inside the first pipe, and the first sealing ring is located on a side of the first spring coil away from the first connecting component.

[0019] In a possible implementation, the first floating structure further includes a second sealing ring, and the second sealing ring is fixed on a side of the first connecting component away from the first spring coil.

[0020] In a possible implementation, at least two interface holes are provided on each of the heat dissipation plates; the two interface holes are respectively used for coolant to flow into and out of the heat dissipation plate;

[0021] The cooling pipe is connected to at least one heat dissipation plate through a first floating structure, including: the cooling pipe is respectively connected to each interface hole of at least one heat dissipation plate through a first floating structure.

[0022] In a possible implementation, a floating positioning structure located outside the first floating structure is further included. The floating positioning structure includes a shielding plate and a sliding rod. The sliding rod passes through an opening of the shielding plate. A first end of the sliding rod is fixed on the heat dissipation plate, and a second end of the sliding rod is away from the heat dissipation plate and has a size larger than the size of the opening.

[0023] The size of the shielding plate is larger than the size of an opening at one end where the first pipe accesses the cooling pipe. The shielding plate is fixed on the cooling pipe and moves along the sliding rod as the cooling pipe floats.

[0024] In a possible implementation, the hardness of the cooling pipe is greater than a preset hardness threshold.

[0025] In a possible implementation, the plurality of heat dissipation plates are arranged on one side of a component for cooling the component; wherein, the component is fixed on a printed circuit board.

[0026] In a second aspect, an embodiment of the present application provides an electronic device, including the heat dissipation module as described in the first aspect above and / or various possible ones of the first aspect.

[0027] An embodiment of the present application provides a heat dissipation module and an electronic device including the heat dissipation module. The heat dissipation module includes a plurality of heat dissipation plates connected in series through a cooling pipe. The cooling pipe is used to convey a coolant to the plurality of heat dissipation plates. The cooling pipe is connected to at least one heat dissipation plate through a first floating structure. Among them, the pressure of the coolant in the first floating structure during the circulation process will cause the cooling pipe to float, so that the connection between the cooling pipe and the heat dissipation plate allows a certain degree of freedom, such as displacement in the up and down or left and right directions. These displacements can offset the tolerances in the manufacturing and assembly processes of the cooling pipe and the plurality of heat dissipation plates, thereby avoiding deformation of the printed circuit board and damage to the components in the electronic device. Description of the Drawings

[0028] The drawings herein are incorporated into the specification and constitute a part of this specification, showing embodiments consistent with the present application, and are used together with the specification to explain the principles of the present application.

[0029] Figure 1 A cross-sectional view of a cooling pipe and a heat dissipation plate connected by a floating structure provided by the present application;

[0030] Figure 2 An exploded view of a cooling pipe and a heat dissipation plate connected by a floating structure provided by the present application;

[0031] Figure 3 An axonometric view of a cooling pipe and a heat dissipation plate connected by a floating structure provided by the present application;

[0032] Figure 4 A side view of a cooling pipe and a heat dissipation plate connected by a floating structure provided by the present application;

[0033] Figure 5 A top view of a cooling pipe and a heat dissipation plate connected by a floating structure provided by the present application;

[0034] Figure 6 A schematic structural view of a protective case of a heat dissipation plate provided by the present application.

[0035] Description of the Reference Numerals:

[0036] 101, the first pipe, or the second pipe; 102, the first spring coil, or the second spring coil; 103, the first connecting member, or the second connecting member; 104, the cooling pipe, or the sub-pipe; 105, the first sealing ring, or the third sealing ring; 106, the second sealing ring, or the fourth sealing ring; 107, the sliding rod; 108, the sliding rod; 109, the baffle; 1071, the nut; 1081, the nut; 1091, the opening; 1092, the opening; 20, the heat dissipation plate; 201, the interface hole; 202, the interface hole;

[0037] 30, the protective case.

[0038] The above drawings have shown clear embodiments of the present application, which will be described in more detail later. These drawings and text descriptions are not intended to limit the scope of the present application in any way, but to illustrate the concept of the present application to those skilled in the art by referring to specific embodiments. DETAILED DESCRIPTION

[0039] Exemplary embodiments will be described in detail herein, examples of which are shown in the accompanying drawings. When the following description refers to the drawings, the same numbers in different drawings represent the same or similar elements unless otherwise indicated. The implementations described in the following exemplary embodiments do not represent all implementations consistent with the present application. Instead, they are merely examples of devices and methods consistent with some aspects of the present application as detailed in the appended claims.

[0040] The components in electronic devices generate a lot of heat during operation. If the heat is not dissipated in a timely and effective manner, it may cause damage to the components. Therefore, a heat dissipation module is needed to dissipate the heat of the electronic devices. The heat sink in the heat dissipation module is in direct contact with the components and connected to the cooling pipe in the cooling system. The coolant in the cooling channel inside the heat sink takes away the heat of the components, thereby effectively reducing the operating temperature of the electronic equipment.

[0041] Therefore, a connection is required between the cooling pipe and the heat sink.

[0042] In one example, the cooling pipe and the plurality of heat sinks are rigidly connected, wherein the meaning of the rigid connection has been introduced in the background technology section, and the details can be referred to the above description, which will not be repeated here.

[0043] However, the tolerances between the cooling pipe and the multiple heat sinks during the manufacturing and assembly process may cause deformation of the cooling pipe. Since the cooling pipe is made of metal and the cooling pipe and the multiple heat sinks are rigidly connected, the deformation of the cooling pipe and the multiple heat sinks cannot offset these tolerances, which may cause stress concentration and make it impossible for the multiple heat sinks to be on the same plane, which may cause the printed circuit board (PCB) that fixes the components in the electronic device to deform and damage the components in the electronic device.

[0044] The present application provides a heat dissipation module and an electronic device including the heat dissipation module to solve the above technical problems.

[0045] The following will specifically describe the technical solutions of the present application and how the technical solutions of the present application solve the above technical problems. The following several specific embodiments can be combined with each other, and the same or similar concepts or processes may not be repeated in some embodiments. The embodiments of the present application will be described below with reference to the accompanying drawings.

[0046] Figure 1 It is a cross-sectional view of a cooling pipe and a heat dissipation plate connected by a floating structure provided by the present application; Figure 2 It is an exploded view of a cooling pipe and a heat dissipation plate connected by a floating structure provided by the present application; Figure 3 It is an axonometric view of a cooling pipe and a heat dissipation plate connected by a floating structure provided by the present application; Figure 4 It is a side view of a cooling pipe and a heat dissipation plate connected by a floating structure provided by the present application; Figure 5 It is a top view of a cooling pipe and a heat dissipation plate connected by a floating structure provided by the present application.

[0047] As Figure 1 、 Figure 2 、 Figure 3 、 Figure 4 、 Figure 5 shown, the heat dissipation module provided by the embodiments of the present application includes a plurality of heat dissipation plates 20 connected in series through a cooling pipe, and the cooling pipe is used to convey a coolant to the plurality of heat dissipation plates 20; wherein, the cooling pipe is connected to at least one heat dissipation plate 20 through a first floating structure, and the coolant in the first floating structure generates a floating force on the connected cooling pipe.

[0048] In one example, a plurality of heat dissipation plates 20 are arranged on one side of the component for cooling the component; wherein, the component is fixed to the printed circuit board.

[0049] Exemplarily, the electronic devices in the embodiments of the present application include, but are not limited to, servers, laptop computers, desktop computers, or other terminal devices that adopt liquid cooling heat dissipation technology based on heat dissipation plates. The server can be an independent server or a server cluster, such as any form including, but not limited to, cloud servers, distributed servers, blockchain servers, etc.

[0050] Exemplarily, in the electronic device, the heat dissipation plate 20 and the component can be sequentially stacked and fixed on the printed circuit board by screws. The printed circuit board can be understood, for example, as being used to support the components in the electronic device. The use of the heat dissipation plate 20 has been introduced in the foregoing content and will not be repeated here. One heat dissipation plate 20 can be used to dissipate heat from one component or multiple components, and this embodiment does not limit this.

[0051] The cooling pipe is connected to at least one heat dissipation plate 20 through a first floating structure. It can be understood that the connection between the cooling pipe and at least one heat dissipation plate 20 allows a certain degree of freedom, such as displacement in the up and down or left and right directions.

[0052] The cooling system dissipates heat from the components in the electronic device by circulating the coolant through multiple heat dissipation plates 20 connected in series in the cooling pipe. Therefore, the pressure of the coolant in the first floating structure during the circulation process will cause the connected cooling pipe to float (displace).

[0053] In one example, assume that an electronic device includes 2 components. The heat dissipation module can dissipate heat from the 2 components in the electronic device through 2 heat dissipation plates 20 respectively. The cooling pipe can be connected to one heat dissipation plate 20 through a first floating structure and rigidly connected to the other heat dissipation plate 20; or, the cooling pipe can be connected to both 2 heat dissipation plates 20 through a first floating structure.

[0054] The embodiment of the present application provides a heat dissipation module and an electronic device including the heat dissipation module. The heat dissipation module includes multiple heat dissipation plates 20 connected in series through a cooling pipe. The cooling pipe is used to transport the coolant to the multiple heat dissipation plates 20. The cooling pipe is connected to at least one heat dissipation plate 20 through a first floating structure. Among them, the pressure of the coolant in the first floating structure during the circulation process will cause the cooling pipe to float, so that the connection between the cooling pipe and the heat dissipation plate 20 allows a certain degree of freedom, such as displacement in the up and down or left and right directions. These displacements can offset the tolerances in the manufacturing and assembly processes of the cooling pipe and the multiple heat dissipation plates, thereby avoiding deformation of the printed circuit board and avoiding damage to the components in the electronic device.

[0055] In some implementation manners of this embodiment, the cooling pipe includes a part where different sub-pipes are connected together; among them, any two of the different sub-pipes are connected through a second floating structure, and the coolant in the second floating structure causes the connected sub-pipes to float.

[0056] Exemplarily, in the heat dissipation module, the cooling pipe connecting multiple heat dissipation plates 20 can be composed of multiple different sub-pipes connected together, and any two of the different sub-pipes can be connected through a second floating structure.

[0057] The pressure of the coolant in the second floating structure during the circulation process will cause the connected sub-pipes to float, so that the connection between any two of the different sub-pipes allows a certain degree of freedom, such as displacement in the up and down or left and right directions. These displacements can further offset the tolerances in the manufacturing and assembly processes of the cooling pipe, thereby further avoiding deformation of the printed circuit board and further avoiding damage to the components in the electronic device.

[0058] In some embodiments of this embodiment, the first floating structure includes a first pipe 101, a first spring coil 102, and a first connecting member 103.

[0059] The first pipe 101 is fixed to the heat dissipation plate 20. The first pipe 101 includes a coolant transmission channel for inputting the coolant received from the cooling pipe 104 into the heat dissipation plate 20, or for transmitting the coolant output from the heat dissipation plate 20 to the cooling pipe 104.

[0060] The first spring coil 102 is fixedly arranged at the first end of the cooling pipe 104. The first end of the cooling pipe 104 and the first spring coil 102 are arranged in the first pipe 101.

[0061] The first connecting member 103 is arranged in the first pipe. One end of the first connecting member 103 is fixed at the first end of the cooling pipe 104 and is in contact with the first spring coil 102; the other end of the first connecting member 103 is suspended in the first pipe 101.

[0062] In one example, at least two interface holes 201 and 202 are provided on each heat dissipation plate 20; the two interface holes 201 and 202 are respectively used for the coolant to flow into and out of the heat dissipation plate 20.

[0063] The cooling pipe is connected to at least one heat dissipation plate 20 through the first floating structure, including: the cooling pipe is connected to the respective interface holes 201 and 202 of at least one heat dissipation plate 20 through the first floating structure.

[0064] Exemplarily, the free height, compression height, wire diameter, outer diameter, inner diameter, pitch, etc. of the first spring coil 102 can be determined according to actual needs. This embodiment does not limit this, as long as the floating generated by the coolant in the first floating structure on the cooling pipe 104 can offset the tolerances in the manufacturing and assembly processes of the cooling pipe 104 and the heat dissipation plate 20.

[0065] In one example, as Figure 2 shown, the first pipe 101 can be threadedly connected to the interface hole 201 of the heat dissipation plate 20 for inputting the coolant received from the cooling pipe 104 into the heat dissipation plate 20. Alternatively, the first pipe 101 can be threadedly connected to the interface hole 202 of the heat dissipation plate 20 for transmitting the coolant output from the heat dissipation plate 20 to the cooling pipe 104.

[0066] As Figure 1 shown, the first spring coil 102 is sleeved on the first end of the cooling pipe 104, and the first end and the first spring coil 102 are located in the first pipe 101.

[0067] One end of the first connecting component 103 can be threadedly connected to the first end portion and is in contact with the first spring coil 102; the other end of the first connecting component 103 is suspended in the first pipe 101.

[0068] By fixing the first pipe 101 to the heat dissipation plate 20, the first end portion of the cooling pipe 104 is fixedly provided with the first spring coil 102. The first end portion of the cooling pipe 104 and the first spring coil 102 are arranged in the first pipe 101. One end of the first connecting component 103 is fixed to the first end portion and is in contact with the first spring coil 102. The other end of the first connecting component 103 is suspended in the first pipe 101. Inside the first pipe 101 in the first floating structure, the pressure generated by the flow of the coolant first pushes the first connecting component 103, and then the first connecting component 103 pushes the first spring coil 102 to generate different intensities of compression, causing the cooling pipe 104 to float. Thus, the connection between the cooling pipe 104 and the heat dissipation plate 20 is achieved through the first floating structure.

[0069] In some embodiments of this embodiment, the second floating structure includes: a second pipe 101, a second spring coil 102, and a second connecting component 103;

[0070] For two sub-pipes connected by the second floating structure, one or more second end portions of the two sub-pipes are fixedly provided with the second spring coil 102, and one or more second end portions of the two sub-pipes and the second spring coil are arranged in the second pipe 101.

[0071] The second connecting component 103 is arranged in the second pipe 101. One end of the second connecting component 103 is fixed to one or more second end portions of the two sub-pipes and is in contact with the second spring coil 102. The other end of the second connecting component 103 is suspended in the second pipe 101.

[0072] Exemplarily, the second floating structure is similar to the first floating structure. For details, reference can be made to the above description of the first floating structure, which will not be elaborated here. Among them, the first pipe 101 is similar to the second pipe 101, the first spring coil 102 is similar to the second spring coil 102, and the first connecting component 103 is similar to the second connecting component 103.

[0073] The difference between the second floating structure and the first floating structure is that since the first floating structure is connected to the cooling pipe 104 and the heat dissipation plate 20 and is rigidly connected to the heat dissipation plate 20, it can only float the connected cooling pipe 104. Since the second floating structure is connected to different sub-pipes in the cooling pipe, it can float only the sub-pipe connected to one end, or can float the sub-pipes connected to both ends simultaneously.

[0074] For two sub-pipes connected by a second floating structure, a second spring coil 102 is fixedly arranged at the second end of one or more of the two sub-pipes, wherein the second end and the second spring coil are arranged in the second pipe 101; one end of the second connecting member 103 is fixed at the second end and is in contact with the second spring coil 102, and the other end of the second connecting member 103 is suspended in the second pipe 101. Inside the second pipe 101 in the second floating structure, the pressure generated by the coolant flow first pushes the second connecting member 103, and then the second connecting member 103 pushes the second spring coil 102 to generate compressions of different intensities, so that the sub-pipe provided with the second spring coil 102 floats, thereby realizing the connection between different sub-pipes through the second floating structure.

[0075] In some embodiments of this embodiment, the size of the first connecting member 103 is larger than the size of the port of the first pipe 101 away from the heat dissipation plate 20.

[0076] Exemplarily, as Figure 1 shown, in the first floating structure, assuming that both the first connecting member 103 and the first pipe 101 are hollow cylinders, the maximum outer diameter of the first connecting member 103 can be set to be larger than the inner diameter of the port of the first pipe 101 away from the heat dissipation plate 20.

[0077] In the first floating structure, by setting the size of the first connecting member 103 to be larger than the size of the port of the first pipe 101 away from the heat dissipation plate 20, it is avoided that when the cooling pipe 104 floats away from the first pipe 101, it falls off from the first pipe 101, causing coolant leakage.

[0078] In some embodiments of this embodiment, for the sub-pipe 104 fixedly connected by the second connecting portion 103, the size of the port of the second pipe 101 accessing the sub-pipe 104 is smaller than the size of the second connecting member 103.

[0079] Exemplarily, in the second floating structure, assuming that both the second connecting member 103 and the sub-pipe 104 connected by the second connecting portion 103 are hollow cylinders, the maximum outer diameter of the second connecting member 103 can be set to be larger than the inner diameter of the port of the second pipe 101 accessing the sub-pipe 104.

[0080] In the second floating structure, for the sub-pipe 104 fixedly connected by the second connecting portion 103, the size of the port of the second pipe 101 accessing the sub-pipe 104 is set to be smaller than the size of the second connecting member 103, which avoids that when the sub-pipe 104 floats away from the second pipe 101, it falls off from the second pipe 101, causing coolant leakage.

[0081] In some embodiments of the present embodiment, the first floating structure further includes a first sealing ring 105; wherein, the first sealing ring 105 is fixed inside the first pipe 101, and the first sealing ring 105 is located on the side of the first spring coil 102 away from the first connecting member 103.

[0082] Exemplarily, as Figure 1 shown, in the first floating structure, a first clamping groove can be provided inside one end of the first pipe 101 where the cooling pipe 104 is connected. The first sealing ring 105 is fixed in the first clamping groove and is located on the side of the first spring coil 102 away from the first connecting member 103. The cooling pipe 104 passes through the first sealing ring 105, and the outer wall of the cooling pipe 104 contacts the first sealing ring 105. Wherein, the first sealing ring 105 can be a single-layer sealing ring or a multi-layer sealing ring.

[0083] In the first floating structure, by providing the first sealing ring 105, leakage of the coolant inside the first pipe 101 can be avoided, and thus components in the electronic device can be prevented from being corroded by the leaked coolant.

[0084] In some embodiments of the present embodiment, the first floating structure further includes a second sealing ring 106, and the second sealing ring 106 is fixed on the side of the first connecting member 103 away from the first spring coil 102.

[0085] Exemplarily, as Figure 1 shown, in the first floating structure, a second clamping groove can be provided on the side of the first connecting member 103 away from the first spring coil 102. The second sealing ring 106 is fixed in the second clamping groove. Wherein, the second sealing ring 106 can be a single-layer sealing ring or a multi-layer sealing ring.

[0086] In the first floating structure, by providing the second sealing ring 106, leakage of the coolant inside the first pipe 101 can be further avoided, and thus components in the electronic device can be further prevented from being corroded by the leaked coolant; it can also prevent the first spring coil 102 from being corroded by the coolant inside the first pipe 101.

[0087] In some embodiments of the present embodiment, the second floating structure further includes a third sealing ring 105; wherein, the third sealing ring 105 is fixed inside the second pipe 101, and the third sealing ring 105 is located on the side of the second spring coil 102 away from the second connecting member 103.

[0088] Exemplarily, as Figure 1As shown, a third card slot can be provided inside one end of the second pipe 101 where the sub-pipe 104 is connected. The third sealing ring 105 is fixed in the third card slot and is located on the side of the second spring ring 102 away from the second connecting component 103. The sub-pipe 104 passes through the third sealing ring 105 and contacts the third sealing ring 105. Among them, the third sealing ring 105 can be a single-layer sealing ring or a multi-layer sealing ring.

[0089] In the second floating structure, by providing the third sealing ring 105, the leakage of the coolant inside the second pipe 101 can be avoided, and further, the components in the electronic device can be prevented from being corroded by the leaked coolant.

[0090] In some embodiments of the present embodiment, the second floating structure further includes a fourth sealing ring 106, and the fourth sealing ring 106 is fixed on the side of the second connecting component 103 away from the second spring ring 102.

[0091] Exemplarily, as Figure 1 shown, in the second floating structure, a fourth card slot can be provided on the side of the second connecting component 103 away from the second spring ring 102, and the fourth sealing ring 106 is fixed in the fourth card slot. Among them, the fourth sealing ring 106 can be a single-layer sealing ring or a multi-layer sealing ring.

[0092] In the second floating structure, by providing the fourth sealing ring 106, the leakage of the coolant inside the second pipe 101 can be further avoided, and further, the components in the electronic device can be prevented from being corroded by the leaked coolant; and the second spring ring 102 can also be prevented from being corroded by the coolant inside the second pipe 101.

[0093] In some embodiments of the present embodiment, it further includes a floating positioning structure located outside the first floating structure. The floating positioning structure includes a shielding plate 109 and sliding rods 107, 108; the sliding rods 107, 108 pass through the openings 1091, 1092 of the shielding plate 109, the first ends of the sliding rods 107, 108 are fixed on the heat dissipation plate 20, and the second ends of the sliding rods 107, 108 are away from the heat dissipation plate 20 and the size is larger than the size of the openings 1091, 1092;

[0094] The size of the shielding plate 109 is larger than the size of the opening at one end of the first pipe 101 where it is connected to the cooling pipe 104. The shielding plate 109 is fixed on the cooling pipe 104 and moves along the sliding rods 107, 108 as the cooling pipe 104 floats.

[0095] Exemplarily, as Figure 2 、 Figure 3As shown, when the cooling pipe is connected to at least one heat dissipation plate 20 through a first floating structure, a floating positioning structure located outside the first floating structure may also be included. Among them, the floating positioning structure may include at least two sliding rods. For example, two screws may be used as the sliding rods 107 and 108 respectively. The first ends of the sliding rods 107 and 108 may be threadedly connected to the heat dissipation plate 20, and the second ends of the sliding rods 107 and 108 may be threadedly connected or welded to nuts 1071 and 1072 respectively. The maximum diameter of the nuts 1071 and 1072 is greater than the diameter of the openings 1091 and 1092.

[0096] The maximum diameter of the baffle 109 is greater than the diameter of the opening at one end of the first pipe 101 accessing the cooling pipe 104, and the baffle 109 may be welded to the cooling pipe 104.

[0097] In one example, when the baffle 109 contacts the two nuts 1071 and 1081, the floating distance of the cooling pipe 104 in the direction away from the first pipe 101 is the largest; when the baffle 109 contacts the first pipe 101, the floating distance of the cooling pipe 104 in the direction close to the first pipe 101 is the largest.

[0098] When the cooling pipe is connected to at least one heat dissipation plate 20 through a first floating structure, by setting the floating positioning structure, the baffle 109, the sliding rods 107 and 108 can be used to cooperate to control the floating distance of the coolant in the first floating structure on the cooling pipe 104. Furthermore, the floating distance of the cooling pipe 104 can be adjusted by adjusting the installation position of the baffle 109 and / or the lengths of the sliding rods 107 and 108, which can more precisely offset the tolerances generated during the manufacturing and assembly of the cooling pipe 104 and the heat dissipation plate 20. Moreover, it can further prevent the cooling pipe 104 from falling off the first pipe 101, causing coolant leakage.

[0099] In some embodiments of this embodiment, the hardness of the cooling pipe is greater than a preset hardness threshold.

[0100] Exemplarily, the cooling pipe, the first pipe 101, and the second pipe 101 can all adopt hard pipes with a hardness greater than the preset hardness threshold, such as metal pipes with a hardness greater than the preset hardness threshold. Among them, the metal material is, for example, one or more of copper, stainless steel, aluminum, etc. The preset hardness threshold can be determined according to actual needs, and this embodiment does not limit this.

[0101] Since the space in electronic devices is generally relatively small, therefore, the hard pipe cooling pipe can save space, and the hard pipe cooling pipe has good sealing performance, which can avoid coolant leakage, and further avoid the coolant from corroding the components in the electronic device.

[0102] In some embodiments of the present embodiment, a protective case 30 is further provided on the first surface of the heat dissipation plate 20; wherein, the first surface of the heat dissipation plate 20 is the surface where the heat dissipation plate 20 is connected to the cooling pipe.

[0103] In one example, the protective case 30 can be made of transparent plastic material.

[0104] Exemplarily, Figure 6 is a schematic structural diagram of the protective case of the heat dissipation plate provided by the present application. As Figure 6 shown, the protective case 30 is connected to the first surface of the heat dissipation plate 20. Among them, the protective case can cover all directions of the first surface of the heat dissipation plate 20, or only cover part of the directions of the first surface of the heat dissipation plate 20. This embodiment does not limit this, as long as the cooling pipe is exposed by the protective case 30.

[0105] By providing the protective case 30 on the first surface of the heat dissipation plate 20, it is possible to further prevent the coolant from leaking from the cooling pipe and damaging the components in the electronic device. Among them, the protective case made of transparent plastic material is conducive to intuitively observing whether there is coolant leakage on the heat dissipation plate 20.

[0106] The electronic device provided in this embodiment includes the heat dissipation module provided in the above embodiment, and its structure and technical effects are similar, so details are not described here again.

[0107] After considering the specification and practicing the invention disclosed herein, those skilled in the art will readily think of other embodiments of the present application. The present application is intended to cover any variations, uses, or adaptations of the present application, which follow the general principles of the present application and include common general knowledge or conventional technical means in the technical field not disclosed in the present application. The specification and embodiments are only regarded as exemplary, and the true scope and spirit of the present application are pointed out by the following claims.

[0108] It should be understood that the present application is not limited to the exact structure already described and shown in the drawings, and various modifications and changes can be made without departing from its scope. The scope of the present application is only limited by the appended claims.

Claims

1. A heat dissipation module, characterized in that: include: A plurality of heat sinks (20) are connected in series via a cooling pipe, the cooling pipe being used to transport cooling liquid to the plurality of heat sinks (20); wherein the cooling pipe is connected to at least one heat sink (20) via a first floating structure, and the cooling liquid in the first floating structure causes the connected cooling pipe to float.

2. The heat dissipation module according to claim 1, characterized in that: The cooling pipe includes a portion where different sub-pipes are connected together; Wherein, any two sub-pipelines of the different sub-pipelines are connected via a second floating structure, and the coolant in the second floating structure causes the connected sub-pipelines to float.

3. The heat dissipation module according to claim 1, characterized in that: The first floating structure comprises a first pipe (101), a first spring ring (102), and a first connecting component (103); The first pipe (101) is fixed to the heat sink (20), and the first pipe (101) comprises a coolant transmission channel, which is used to input the coolant received from the cooling pipe (104) into the heat sink (20), or to transmit the coolant output from the heat sink (20) to the cooling pipe (104); The first spring ring (102) is fixedly arranged at the first end of the cooling pipe (104), and the first end of the cooling pipe (104) and the first spring ring (102) are arranged in the first pipe (101); The first connecting component (103) is arranged in the first pipe, one end of the first connecting component (103) is fixed to the first end of the cooling pipe (104) and is in contact with the first spring coil (102); the other end of the first connecting component (103) is suspended in the first pipe (101).

4. The heat dissipation module according to claim 2, characterized in that: The second floating structure comprises: a second pipe (101), a second spring ring (102), and a second connecting component (103); For two sub-pipes connected via the second floating structure, a second spring ring (102) is fixedly arranged at one or more second ends of the two sub-pipes, and one or more second ends of the two sub-pipes and the second spring ring are arranged in the second pipe (101); The second connecting component (103) is arranged in the second pipe (101), one end of the second connecting component (103) is fixed to the second end of one or more of the two sub-pipes and is in contact with the second spring coil (102), and the other end of the second connecting component (103) is suspended in the second pipe (101).

5. The heat dissipation module according to claim 3, characterized in that: The size of the first connecting component (103) is larger than the size of the port of the first pipe (101) away from the heat dissipation plate (20).

6. The heat dissipation module according to claim 4, characterized in that: For the sub-pipeline (104) fixedly connected with the second connecting part (103), the size of the port at which the second pipe (101) is connected to the sub-pipeline (104) is smaller than the size of the second connecting part (103).

7. The heat dissipation module according to claim 3, characterized in that: The first floating structure further comprises a first sealing ring (105); wherein the first sealing ring (105) is fixed in the first pipe (101), and the first sealing ring (105) is located on a side of the first spring ring (102) away from the first connecting component (103).

8. The heat dissipation module according to claim 3, characterized in that: The first floating structure also includes a second sealing ring (106), wherein the second sealing ring (106) is fixed to a side of the first connecting component (103) away from the first spring ring (102).

9. The heat dissipation module according to claim 1, characterized in that: At least two interface holes (201, 202) are provided on each of the heat dissipation plates (20); the two interface holes (201, 202) are used for coolant to flow into the heat dissipation plate (20) and to flow out of the heat dissipation plate (20), respectively; The cooling pipeline is connected to at least one heat sink (20) via a first floating structure, comprising: the cooling pipeline is respectively connected to each interface hole (201, 202) of at least one heat sink (20) via the first floating structure.

10. The heat dissipation module according to claim 3, characterized in that: It also includes a floating positioning structure located outside the first floating structure, the floating positioning structure including a shielding plate (109) and sliding rods (107, 108); the sliding rods (107, 108) pass through openings (1091, 1092) of the shielding plate (109), the first ends of the sliding rods (107, 108) are fixed on the heat dissipation plate (20), and the second ends of the sliding rods (107, 108) are away from the heat dissipation plate (20) and have a size larger than the size of the openings (1091, 1092); The size of the shielding plate (109) is larger than the size of the opening at one end of the first pipe (101) connected to the cooling pipe (104); the shielding plate (109) is fixed to the cooling pipe (104) and moves along the sliding rods (107, 108) as the cooling pipe (104) floats.

11. The heat dissipation module according to claim 1, characterized in that: The hardness of the cooling pipe is greater than a preset hardness threshold.

12. The heat dissipation module according to any one of claims 1 to 11, characterized in that: The plurality of heat dissipation plates (20) are arranged on one side of the component and are used to cool the component; wherein the component is fixed to a printed circuit board.

13. An electronic device, characterized in that: Comprising a heat dissipation module as described in any one of claims 1-12.

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