Server or computer based hardware heat sink

Abstract

The present invention relates to the technical field of heat conduction and heat dissipation of electronic products, specifically to a hardware heat sink based on a server or computer, a substrate and a shell welded on the surface thereof, a hollow cavity is formed between the shell and the substrate, the interior of the hollow cavity is designed with a capillary microstructure layer, and the interior of the hollow cavity is filled with a phase change medium; a plurality of expanded graphite sheets are limitedly placed inside the hollow cavity, the exterior of the expanded graphite sheets is sealed with a sealing film, and the expanded graphite sheets expand upon contact with the phase change medium to fill the hollow cavity; a reaction structure for destroying the sealing film is installed inside the hollow cavity, an assembly cavity is integrally stamped into the interior of the hollow cavity toward the outer wall of the shell, a plunger is installed on the inner wall of the assembly cavity for sliding up and down, and an air guide channel connected to the interior of the hollow cavity is opened at the bottom of the assembly cavity. The present invention can trigger the water absorption and expansion of the expanded graphite sheets when the hollow cavity is under pressure and leaks, thereby repairing the seal and improving the thermal conductivity.

Description

Technical Field

[0001] The present invention relates to the technical field of heat conduction and heat dissipation of electronic products, in particular to a hardware heat sink based on a server or a computer. Background Art

[0002] Current hardware heat sinks are mainly used to conduct and dissipate heat from the heat-generating hardware of electronic products, especially chip-type hardware. If the heat generated during operation cannot be transferred in time, the working efficiency of the hardware will be easily reduced. Hardware heat sinks mainly include heat pipes and vacuum heat sinks. The vacuum heat sink is a two-dimensional heat conductor with excellent heat distribution and thermal conductivity. Combined with a cold source, it can quickly form a heat conduction and heat dissipation chain and is more suitable for compact spaces, such as mobile phones, notebooks and graphics cards. It can also be used in servers, base stations or aerospace fields.

[0003] In the existing technology, since the shell thickness of the vacuum heat spreader is relatively thin and the internal cavity formed after welding needs to be evacuated, once the shell of the vacuum heat spreader is compressed, it is very easy to cause related problems such as shell collapse and sealing failure, and lose thermal conductivity. At this time, the vacuum heat spreader's thermal conductivity is even much weaker than that of a solid metal plate because the vacuum cavity is transformed into a normal pressure cavity. Summary of the Invention

[0004] The present invention provides a hardware heat sink based on a server or a computer, which can trigger the expansion of an expanded graphite sheet by absorbing water when a hollow cavity is pressurized and leaks, thereby repairing the seal and improving the thermal conductivity.

[0005] In order to achieve the above object, the present invention provides the following technical solutions:

[0006] Server or computer based hardware heat sinks, including:

[0007] A substrate and a shell welded to its surface, a hollow cavity is formed between the shell and the substrate, the interior of the hollow cavity is designed with a capillary microstructure layer, and the interior of the hollow cavity is filled with a phase change medium; a plurality of expanded graphite sheets are placed in limited positions inside the hollow cavity, and the exterior of the expanded graphite sheets is sealed with a sealing film. Upon contact with the phase change medium, the expanded graphite sheets will expand to fill the hollow cavity; and a reaction structure that destroys the sealing film is installed inside the hollow cavity.

[0008] Optionally, an assembly cavity is integrally stamped into the interior of the hollow cavity toward the outer wall of the shell, a plunger is slidably installed on the inner wall of the assembly cavity, an air guide channel connected to the interior of the hollow cavity is opened at the bottom of the assembly cavity, a cover is designed at the opening of the assembly cavity, a pressure sensor is installed on the cover, an elastic rope is fixedly connected between the top of the plunger and the pressure surface of the pressure sensor, and when the hollow cavity is evacuated, the plunger moves downward to the lowest point, and the elastic rope remains taut.

[0009] Optionally, the reaction structure includes a plurality of micro-support sheets installed between the shell and the substrate, the micro-support sheets are sheet-type structures, a plurality of the micro-support sheets are distributed in a rectangular array, and the expanded graphite sheets are located on both sides of the micro-support sheets. Barbs are installed on both sides of the micro-support sheets, and when the micro-support sheets are compressed and bent, the barbs will pierce the sealing film.

[0010] Optionally, the sealing film is designed to be in a stretched and taut state when wrapping the expanded graphite sheet, and the sealing film is configured as a silicon oxide coating film.

[0011] Optionally, the reaction structure includes a membrane cavity formed between a sealing membrane and an expanded graphite sheet, the internal pressure of the membrane cavity is close to vacuum, the sealing membrane adopts a flexible film with low membrane strength, and the edge of the expanded graphite sheet is designed with a sharp portion, and the outer wall of the expanded graphite sheet is designed with a hollow portion. When the internal pressure of the hollow cavity is converted from vacuum to normal pressure, the sharp portion can assist in the rupture of the sealing membrane.

[0012] Optionally, micro cracks are scratched on the sealing film by laser, and the tensile strength of the bonding seam of the sealing film is lower than the tensile strength of the sealing film body.

[0013] Optionally, a limiting sleeve is installed on the inner top of the shell, and a reactive metal needle is designed inside the limiting sleeve. One end of the reactive metal needle is fixed in the limiting sleeve, and the tip of the reactive metal needle is facing the expanded graphite sheet. After being heated, the reactive metal needle will expand unidirectionally in the direction of the expanded graphite sheet, and the reactive metal needle has a hollow structure. The expansion deformation temperature threshold of the reactive metal needle is one hundred and fifty degrees Celsius.

[0014] Optionally, the inner wall of the assembly cavity located at the top of the plunger is designed with a wax seal layer, the wax seal layer is made of microcrystalline wax or modified paraffin wax, and the melting point temperature of the wax seal layer is configured to be 150 degrees Celsius.

[0015] Optionally, fins are installed at the bottom of the substrate, and the substrate, shell, fins and capillary microstructure layer are all made of copper material with a copper content greater than or equal to 99.97% and an oxygen content less than or equal to 0.002%, and a hardness range of 45 to 60 HV.

[0016] The present invention provides a hardware heat sink based on a server or computer, which has the following beneficial effects compared to the existing technology: when a problem occurs with the vacuum heat sink, the reaction structure can destroy the sealing film, thereby exposing the expanded graphite sheet inside the hollow cavity. The expansion change of the expanded graphite sheet can prevent excessive leakage of pure water and absorb it. At the same time, the expansion of the expanded graphite sheet will fill the hollow cavity, so that the vacuum heat sink can still maintain a certain thermal conductivity. The expansion of the expanded graphite sheet is compressible and can adapt to irregular cavities. Its thermal conductivity is better than that of a solid heat-conducting metal plate. Therefore, the present invention can make repair compensation in time to avoid thermal conduction failure and affect the entire heat dissipation process. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 Schematic diagram of the external three-dimensional structure of the present invention;

[0018] Figure 2 For the present invention Figure 1 Schematic diagram of the right view structure;

[0019] Figure 3 For the present invention Figure 2 Schematic diagram of the structure viewed from the AA position;

[0020] Figure 4 Schematic diagram of the internal three-dimensional structure of the present invention;

[0021] Figure 5 For the present invention Figure 1 A top view of

[0022] Figure 6 For the present invention Figure 5 Schematic diagram of the structure cut away at the middle BB;

[0023] Figure 7 For the present invention Figure 6 Enlarged view of the structure at point C in the middle

[0024] Figure 8 Schematic diagram of the external three-dimensional structure of the vacuum vapor chamber in the present invention;

[0025] Figure 9 Schematic diagram of the three-dimensional structure inside the vacuum heat sink of the present invention;

[0026] Figure 10 Schematic diagram of the structure of the limiting sleeve and the reaction metal needle in the present invention;

[0027] Figure 11 For the present invention Figure 10 Enlarged view of the structure at point D in the middle.

[0028] In the figure: 1. substrate; 2. capsule; 3. fin; 4. hollow cavity; 5. micro-support sheet; 6. expanded graphite sheet; 7. sealing film; 8. capillary microstructure layer; 9. assembly cavity; 11. wax seal layer; 12. plunger; 13. air guide channel; 14. pressure sensor; 15. limit sleeve; 16. reaction metal needle. DETAILED DESCRIPTION

[0029] The following will clearly and completely describe the technical solutions in the embodiments of the present invention in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0030] See also Figures 1 to 11 The present invention provides a technical solution: a hardware heat sink based on a server or a computer, comprising:

[0031] A substrate 1 and a capsule 2 welded to its surface form a hollow cavity 4 between the capsule 2 and the substrate 1. The interior of the hollow cavity 4 is designed with a capillary microstructure layer 8, and the interior of the hollow cavity 4 is filled with a phase change medium. A plurality of expanded graphite sheets 6 are placed in limited positions inside the hollow cavity 4, and the exterior of the expanded graphite sheets 6 is sealed with a sealing film 7. When the expanded graphite sheets 6 come into contact with the phase change medium, they will expand to fill the hollow cavity 4. A reaction structure that destroys the sealing film 7 is installed inside the hollow cavity 4.

[0032] In the prior art, the extrusion of the heat spreader is difficult to recover, and the failure of the seal of the vacuum chamber will cause the phase change medium to be unable to work or even leak. Moreover, after the vacuum chamber fails, the heat spreader becomes a heat conducting plate with a cavity, and its thermal conductivity is extremely low. Once the heating hardware overheats, the hardware will also be damaged. Therefore, it is necessary to repair and compensate for the sealing failure caused by extrusion to reduce losses. In the present invention, a vacuum heat spreader is formed between the substrate 1, the shell 2, the hollow cavity 4, the capillary microstructure layer 8 and the phase change medium. By designing the expanded graphite sheet 6, the expanded graphite sheet 6 has expansion characteristics, and the sealing film 7 serves as an isolation layer to ensure that the expanded graphite sheet 6 can always remain dry inside the hollow cavity 4. When the vacuum heat spreader is working, the expanded graphite sheet 6 is independent of the phase change medium, and the expanded graphite sheet 6 and the sealing film 7 will not interfere too much with the working efficiency of the vacuum heat spreader. When the vacuum heat spreader has problems, the reaction structure can destroy the sealing film 7, thereby The expanded graphite sheet 6 can be exposed inside the hollow cavity 4. The expanded graphite sheet 6 is a porous material made of natural graphite through chemical or high-temperature treatment. Its core characteristic is that it expands rapidly when it comes into contact with water or other polar solvents. The volume can increase several times to dozens of times, and its high thermal conductivity will not drop significantly, especially for a phase change medium such as pure water. When the expanded graphite sheet 6 comes into contact with pure water, due to the deionization characteristics of pure water, its permeability is optimal, which will accelerate the expansion of the expanded graphite sheet 6. In this process, the expansion change of the expanded graphite sheet 6 can prevent excessive leakage of pure water and absorb it. At the same time, the expansion of the expanded graphite sheet 6 will fill the hollow cavity 4, so that the vacuum heat sink can still maintain a certain thermal conductivity. The expansion of the expanded graphite sheet 6 is compressible and can adapt to irregular cavities. Its thermal conductivity will be better than that of a solid heat-conducting metal plate. Therefore, when there is a problem with the hollow cavity 4, the present invention can make timely repair compensation to avoid thermal failure and affect the entire heat dissipation process.

[0033] Among the more preferred embodiments, an assembly cavity 9 is integrally stamped into the interior of the hollow cavity 4 toward the outer wall of the capsule 2, a plunger 12 is slidably installed on the inner wall of the assembly cavity 9, an air guide channel 13 communicating with the interior of the hollow cavity 4 is opened at the bottom of the assembly cavity 9, a cover is designed at the opening of the assembly cavity 9, a pressure sensor 14 is installed on the cover, an elastic rope is fixedly connected between the top of the plunger 12 and the pressure surface of the pressure sensor 14, and when the hollow cavity 4 is evacuated, the plunger 12 moves downward to the lowest point, and the elastic rope remains taut.

[0034] See also Figure 6 and Figure 7In this embodiment, a detection component is formed between the pressure sensor 14, the assembly cavity 9 and the elastic rope, which is used to detect the vacuum environment of the hollow cavity 4. If a seal failure occurs, the interior of the hollow cavity 4 changes from a vacuum state to a normal pressure state. At this time, the elastic rope will release its force, causing the plunger 12 to move upward, and the tension exerted by the elastic rope on the pressure sensor 14 will be reduced, thereby obtaining a detection result. Under normal conditions, the vacuum environment inside the hollow cavity 4 will always keep the plunger 12 at the lowest point, and the tension exerted on the pressure sensor 14 remains unchanged. When the tension digital display of the pressure sensor 14 changes significantly, it can be determined that the seal has failed.

[0035] The pressure sensor 14 can be associated with an external early warning mechanism to monitor in real time and provide a timely alarm.

[0036] Based on the embodiment of the detection component, two implementation schemes of the reaction structure are provided.

[0037] Example 1:

[0038] The reaction structure includes a plurality of micro-support sheets 5 installed between the capsule 2 and the substrate 1. The micro-support sheets 5 are sheet-like structures and are arranged in a rectangular array. The expanded graphite sheets 6 are located on both sides of the micro-support sheets 5. Both sides of the micro-support sheets 5 are equipped with barbs. When the micro-support sheets 5 are compressed and bent, the barbs will pierce the sealing film 7. Figure 3 and Figure 4 The top area of the capsule 2 is always large, and the thickness of the heat sink is much smaller than the top surface size. Therefore, the top surface of the capsule 2 is the main surface under pressure. Therefore, when the top of the capsule 2 is subjected to pressure, the micro-support sheet 5 will also bend under pressure, so that the barbs on it will approach the sealing film 7 and complete the puncture. The expanded graphite sheet 6 is designed in a strip shape, so a single point puncture can also cause the entire sealing film 7 to separate from the expanded graphite sheet 6.

[0039] Based on the first embodiment, the sealing film 7 is designed to be in a stretched and taut state when wrapping the expanded graphite sheet 6. The sealing film 7 is configured as a silicon oxide coating film, which has high tensile strength but poor puncture resistance. When the sealing film 7 is scratched or punctured while in a stretched and taut state, the sealing film 7 will shrink and deform, quickly releasing the wrapping of the expanded graphite sheet 6, so that the expanded graphite sheet 6 is quickly exposed inside the hollow cavity 4.

[0040] Example 2:

[0041] The reaction structure includes a membrane cavity formed between a sealing membrane 7 and an expanded graphite sheet 6. The internal pressure of the membrane cavity is close to vacuum. The sealing membrane 7 is a flexible film with low membrane strength. The expanded graphite sheet 6 is designed with sharp edges. The outer wall of the expanded graphite sheet 6 is designed with a hollow portion. When the internal pressure of the hollow cavity 4 changes from vacuum to normal pressure, the sharp edges can assist in rupturing the sealing membrane 7. Under normal conditions, the pressure difference between the membrane cavity and the hollow cavity 4 is very small, and the sealing membrane 7 can function normally to protect and isolate the expanded graphite sheet 6. However, if the seal of the hollow cavity 4 fails, the interior of the hollow cavity 4 will tend to normal pressure, resulting in a large pressure difference between the hollow cavity 4 and the membrane cavity. This pressure difference will cause the sealing membrane 7 to have an inward pressure difference. Since the sealing membrane 7 in this embodiment is a flexible film and is not in the stretched state as in the first embodiment, the flexible film will spontaneously rupture after being compressed and stretched. The sharp edges on the expanded graphite sheet 6 can assist in the self-rupture of the sealing membrane 7.

[0042] On the basis of Example 2, microcracks are laser-etched on the sealing film 7, and the tensile strength at the bonding seam of the sealing film 7 is lower than the tensile strength of the sealing film 7 body. The microcracks can reduce the local strength of the sealing film 7, thereby accelerating the fracture when stretched. At the same time, the tensile strength at the seam is poor, so that the pressure difference between the hollow cavity 4 and the sealing film 7 drives the sealing film 7 to spontaneously break and fracture.

[0043] On the basis of Example 1 and Example 2, a limiting sleeve 15 is installed on the inner top of the capsule 2, and a reactive metal needle 16 is designed inside the limiting sleeve 15. One end of the reactive metal needle 16 is fixed in the limiting sleeve 15, and the tip of the reactive metal needle 16 is facing the expanded graphite sheet 6. After being heated, the reactive metal needle 16 will expand unidirectionally in the direction of the expanded graphite sheet 6, and the reactive metal needle 16 is a hollow structure. The expansion deformation temperature threshold of the reactive metal needle 16 is one hundred and fifty degrees Celsius. This embodiment is a backup solution. When the reaction structure is delayed or the reaction fails, the failure of the thermal conductivity will cause the overall temperature of the heat sink to rise, thereby causing the reactive metal needle 16 to undergo a thermal deformation reaction. Since one end of the reactive metal needle 16 is limited, the tip of the reactive metal needle 16 will be output toward the sealing film 7, thereby puncturing the sealing film 7, so that the sealing film 7 releases the wrapping of the expanded graphite sheet 6, allowing the expanded graphite sheet 6 to perform self-repair work. Among them, the deformation threshold of the reactive metal needle 16 can be adjusted by adding alloys, so that the backup solution can be applied to different scenarios.

[0044] Based on the embodiment of the detection component, a wax seal layer 11 is designed on the inner wall of the assembly cavity 9 at the top of the plunger 12. The wax seal layer 11 is made of microcrystalline wax or modified paraffin wax. The melting point temperature of the wax seal layer 11 is configured to be one hundred and fifty degrees Celsius. By designing the wax seal layer 11, the sealing performance of the detection component can be improved, that is, the seal between the assembly cavity 9 and the plunger 12. At the same time, the plunger 12 is limited to a certain extent. When the vacuum in the hollow cavity 4 fails, the heat spreader will experience high temperature. At this time, the wax seal layer 11 will soften, and will not hinder the upward movement of the plunger 12.

[0045] Fins 3 are installed at the bottom of the substrate 1, which provide more heat dissipation and convection area. Furthermore, in order to improve the thermal conductivity and overall compressive resistance, the substrate 1, the shell 2, the fins 3 and the capillary microstructure layer 8 are all made of copper with a copper content greater than or equal to 99.97%, and an oxygen content less than or equal to 0.002%, with a hardness range of 45 to 60HV.

[0046] By utilizing the above structures, when the hollow cavity 4 is pressurized and leaks, the expanded graphite sheet 6 can be triggered to absorb water and expand, thereby repairing the seal and improving the thermal conductivity.

[0047] The standard parts used in this embodiment can be purchased directly from the market, and the non-standard structural components recorded in the specification and drawings can also be directly processed according to existing technical common sense without any doubt. At the same time, the connection method of each component adopts the mature conventional means in the existing technology, and the machinery, parts and equipment all adopt conventional models in the existing technology, so no specific description is given here.

[0048] While embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions, and variations may be made to these embodiments without departing from the principles and spirit of the invention, and that the scope of the invention is defined by the appended claims and their equivalents.

Claims

1. Hardware heat sink based on server or computer, characterized by: include: A substrate (1) and a shell (2) welded to the surface thereof, wherein a hollow cavity (4) is formed between the shell (2) and the substrate (1), a capillary microstructure layer (8) is designed inside the hollow cavity (4), and the interior of the hollow cavity (4) is filled with a phase change medium; A plurality of expanded graphite sheets (6) are placed within the hollow cavity (4) in a limited manner, and the expanded graphite sheets (6) are sealed with a sealing film (7) on the outside. Upon contact with the phase change medium, the expanded graphite sheets (6) expand to fill the hollow cavity (4); A reaction structure for destroying the sealing film (7) is installed inside the hollow cavity (4).

2. The server or computer-based hardware heat sink according to claim 1, wherein: An assembly cavity (9) is integrally stamped and formed inside the hollow cavity (4) toward the outer wall of the shell (2); a plunger (12) is slidably mounted on the inner wall of the assembly cavity (9) up and down; an air guide channel (13) communicating with the interior of the hollow cavity (4) is provided at the bottom of the assembly cavity (9); a cover is provided at the opening of the assembly cavity (9); a pressure sensor (14) is mounted on the cover; an elastic rope is fixedly connected between the top of the plunger (12) and the pressure surface of the pressure sensor (14); when the hollow cavity (4) is evacuated, the plunger (12) moves downward to the lowest point, and the elastic rope remains in a taut state.

3. The server or computer-based hardware heat sink according to claim 2, wherein: The reaction structure comprises a plurality of micro-support sheets (5) installed between the capsule (2) and the substrate (1), wherein the micro-support sheets (5) are of sheet-type structure, the plurality of micro-support sheets (5) are distributed in a rectangular array, and the expanded graphite sheets (6) are located on both sides of the micro-support sheets (5), and both sides of the micro-support sheets (5) are provided with barbs, and when the micro-support sheets (5) are compressed and bent, the barbs will pierce the sealing film (7).

4. The server or computer-based hardware heat sink according to claim 3, wherein: The sealing film (7) is designed to be in a stretched and taut state when wrapping the expanded graphite sheet (6), and the sealing film (7) is configured as a silicon oxide coating film.

5. The server or computer-based hardware heat sink according to claim 2, wherein: The reaction structure includes a membrane cavity formed between a sealing membrane (7) and an expanded graphite sheet (6), the internal pressure of the membrane cavity is close to vacuum, the sealing membrane (7) adopts a flexible film with low membrane strength, and the edge of the expanded graphite sheet (6) is designed with a sharp portion, and the outer wall of the expanded graphite sheet (6) is designed with a hollow portion. When the internal pressure of the hollow cavity (4) is converted from vacuum to normal pressure, the sharp portion can assist the sealing membrane (7) to rupture.

6. The server or computer-based hardware heat sink according to claim 5, characterized in that: Microcracks are carved on the sealing film (7) by laser, and the tensile strength of the bonding seam of the sealing film (7) is lower than the tensile strength of the sealing film (7) body.

7. The server or computer-based hardware heat sink according to claim 4 or 6, characterized in that: A limiting sleeve (15) is installed on the inner top of the enclosure (2), and a reaction metal needle (16) is designed inside the limiting sleeve (15). One end of the reaction metal needle (16) is fixed in the limiting sleeve (15), and the tip of the reaction metal needle (16) faces the expanded graphite sheet (6). After being heated, the reaction metal needle (16) will unidirectionally expand in the direction of the expanded graphite sheet (6), and the reaction metal needle (16) is a hollow structure. The expansion deformation temperature threshold of the reaction metal needle (16) is one hundred and fifty degrees Celsius.

8. The server or computer-based hardware heat sink according to claim 2, wherein: The inner wall of the assembly cavity (9) located at the top of the plunger (12) is designed with a wax seal layer (11), and the wax seal layer (11) is made of microcrystalline wax or modified paraffin wax, and the melting point temperature of the wax seal layer (11) is configured to be 150 degrees Celsius.

9. The server or computer-based hardware heat sink according to any one of claims 1, 2, 3, 4, 5, 6 and 8, characterized in that: Fins (3) are installed at the bottom of the substrate (1); the substrate (1), the enclosure (2), the fins (3) and the capillary microstructure layer (8) are all made of copper material with a copper content greater than or equal to 99.97% and an oxygen content less than or equal to 0.002%, and a hardness range of 45 to 60 HV.

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