Wireless charging device

Abstract

The invention provides a wireless charging device which is used for charging electronic equipment, the wireless charging device comprises a support frame, a circuit board, a charging coil and a heat dissipation plate, the support frame is provided with a first accommodating cavity and a second accommodating cavity which are communicated with each other; the circuit board is contained in the first containing cavity, the charging coil is contained in the second containing cavity, the charging coil is electrically connected to the circuit board, the heat dissipation plate comprises a first heat dissipation sheet and a second heat dissipation sheet connected to the first heat dissipation sheet, the first heat dissipation sheet is contained in the first containing cavity, and the second heat dissipation sheet is contained in the second containing cavity. The circuit board is in contact with the first cooling fin, the second cooling fin is contained in the second containing cavity, and the charging coil is in contact with the second cooling fin.

Description

Technical Field

[0001] The present invention relates to the field of wireless charging, and particularly to a wireless charging device. Background Art

[0002] With the popularization of intelligent portable electronic devices such as mobile phones and tablet computers, high-end portable electronic devices generally integrate wireless charging functions. Therefore, corresponding wireless chargers are required to wirelessly charge the portable electronic devices. The wireless charging technology works based on the principle of electromagnetic induction, converting electrical energy into magnetic energy and then back into electrical energy. There will be certain energy losses during the charging process, and most of these losses are released in the form of heat; when the charging efficiency is not high, the heat generated by the wireless charger during operation will be higher; however, during the charging process of the existing wireless chargers, the heat generated by the wireless charging coil cannot be timely discharged outside the wireless charger, resulting in too high a temperature of the wireless charger. The wireless charger will reduce the charging power to prevent the temperature from being too high, thereby affecting the charging speed of the wireless charger for intelligent portable electronic devices. Summary of the Invention

[0003] This application provides a wireless charging device with strong heat dissipation performance.

[0004] A wireless charging device provided by this application is used to charge an electronic device. The wireless charging device clamp includes a support frame, a circuit board, a charging coil, and a heat dissipation plate. The support frame has a first receiving cavity and a second receiving cavity that communicate with each other; the circuit board is accommodated in the first receiving cavity, the charging coil is accommodated in the second receiving cavity, the charging coil is electrically connected to the circuit board, the heat dissipation plate includes a first heat dissipation fin and a second heat dissipation fin connected to the first heat dissipation fin. The first heat dissipation fin is accommodated in the first receiving cavity, the circuit board contacts the first heat dissipation fin, the second heat dissipation fin is accommodated in the second receiving cavity, and the charging coil contacts the second heat dissipation fin.

[0005] One end of the heat dissipation plate of the wireless charging device of this application contacts the charging coil, and the relatively other end of the heat dissipation plate contacts the circuit board. When the wireless charging device wirelessly charges an electronic device, the heat generated by the charging coil is conducted to the second heat dissipation fin, and the heat generated by the circuit board is conducted to the first heat dissipation fin; due to the large heat dissipation area of the heat dissipation plate, the heat dissipation performance of the wireless charging device is improved, avoiding too high a temperature of the wireless charging device, and the charging power of the wireless charging device can be increased. Description of the Drawings

[0006] To more clearly illustrate the technical solutions of the embodiments of the present invention, the accompanying drawings required for the implementation will be briefly introduced below. Obviously, the accompanying drawings in the following description are some embodiments of the present invention. For those of ordinary skill in the art, without creative efforts, other accompanying drawings can also be obtained based on these drawings.

[0007] Figure 1 It is a schematic perspective view of the wireless charging device according to the first embodiment of the present application.

[0008] Figure 2 is Figure 1 a schematic perspective view of the wireless charging device in another different perspective.

[0009] Figure 3 is Figure 1 a schematic perspective view of the wireless charging device in yet another different perspective.

[0010] Figure 4 is Figure 1 a schematic cross-sectional view of the wireless charging device in one of them.

[0011] Figure 5 is Figure 4 a schematic cross-sectional view of the support frame of the wireless charging device in one of them.

[0012] Figure 6 is Figure 4 a schematic cross-sectional view of the heat dissipation plate, circuit board and charging coil of the wireless charging device in one of them.

[0013] Figure 7 is Figure 6 a schematic perspective view of the heat dissipation plate after being flattened.

[0014] Figure 8 is Figure 7 a schematic exploded perspective view of the heat dissipation plate in one of them.

[0015] Figure 9 is Figure 7 a schematic cross-sectional view of the heat dissipation plate in one of them.

[0016] Figure 10 is Figure 4 a schematic diagram of the heat dissipation process of the wireless charging device in one of them.

[0017] Figure 11 It is a schematic cross-sectional view of the wireless charging device according to the second embodiment of the present application in one of them.

[0018] Figure 12 It is a schematic cross-sectional view of the wireless charging device according to the third embodiment of the present application in one of them.

[0019] Figure 13 It is a schematic cross-sectional structure diagram of a wireless charging device according to the fourth embodiment of the present application.

[0020] Figure 14 It is a schematic cross-sectional structure diagram of a wireless charging device according to the fifth embodiment of the present application.

[0021] Main reference numerals description:

[0022] 100, wireless charging device; 20, support frame; 202, first receiving cavity; 204, second receiving cavity; 205, heat dissipation holes; 22, base; 222, bottom housing; 2221, first substrate; 2223, second substrate; 2225, first peripheral plate; 224, support housing; 2242, first support plate; 2244, second support plate; 2246, side wall; 25, bracket housing; 252, support plate; 254, connecting plate; 255, side plate; 256, through groove; 40, circuit board; 60, charging coil; 70, heat dissipation plate; 72, first heat sink; 73, diversion plate; 730, flow channel; 74, second heat sink; 742, first heat dissipation section; 744, second heat dissipation section; 746, third heat dissipation section; 75, first heat dissipation film; 752, liquid inlet hole; 754, liquid outlet hole; 76, third heat sink; 77, second heat dissipation film; 78, piezoelectric pump; 782, liquid inlet; 784, liquid outlet; 200, electronic device; 210, wireless charging coil; 220, power supply. Detailed implementation manners

[0023] Next, the technical solutions in the embodiments of the present invention will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention.

[0024] In addition, the descriptions of the following embodiments are made with reference to the attached drawings, which are used to illustrate specific embodiments in which the present application can be implemented. The directional terms mentioned in the present application, for example, "upper", "lower", "front", "rear", "left", "right", "inner", "outer", "side", etc., are only with reference to the directions of the attached drawings. Therefore, the directional terms used are for better and clearer description and understanding of the present application, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus cannot be construed as a limitation to the present application.

[0025] In the description of the present application, it should be noted that unless otherwise clearly defined and limited, the terms "installation", "connection", "linkage", and "set on..." should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection; it can be a direct connection, or an indirect connection through an intermediate medium, and it can be the communication inside two components. For those of ordinary skill in the art, the specific meanings of the above terms in the present application can be understood according to specific circumstances.

[0026] Please refer to Figures 1-4 , the wireless charging device 100 in the first embodiment of the present invention is used for wirelessly charging an electronic device. The wireless charging device 100 includes a support frame 20, a circuit board 40, a charging coil 60, and a heat dissipation plate 70. The support frame 20 has a first receiving cavity 202 and a second receiving cavity 204 that communicate with each other; the circuit board 40 is received in the first receiving cavity 202, the charging coil 60 is received in the second receiving cavity 204, the charging coil 60 is electrically connected to the circuit board 40, the heat dissipation plate 70 is disposed on the support frame 20, the heat dissipation plate 70 includes a first heat sink 72 and a second heat sink 74 connected to the first heat sink 72. The first heat sink 72 is received in the first receiving cavity 202, and the circuit board 40 contacts the first heat sink 72; the second heat sink 74 is received in the second receiving cavity 204, and the charging coil 60 contacts the second heat sink 74. When the wireless charging device 100 wirelessly charges the electronic device, the heat generated by the operation of the charging coil 60 is conducted to the second heat sink 74, so that the heat on the second heat sink 74 is conducted to the first heat sink 72, and the heat generated by the operation of the circuit board 40 is conducted to the first heat sink 72. The first heat sink 72 and the second heat sink 74 increase the heat dissipation area, improve the heat dissipation performance of the wireless charging device 100, can avoid the temperature of the wireless charging device 100 from being too high, improve the charging efficiency of the wireless charging device 100, and increase the charging speed of the wireless charging device 100 for the electronic device.

[0027] It can be understood that the electronic device can be, but is not limited to, a mobile phone, a tablet computer, a laptop computer, a smart watch, a VR head-mounted display, a smart wearable device, etc. with wireless charging function, and the electronic device has wireless charging. The "connection" in the description of the embodiments of the present invention includes two cases of direct connection and indirect connection. For example, the connection between A and B includes the direct connection between A and B or the connection through a third element C or more other elements. The connection also includes two cases of integral connection and non-integral connection. The integral connection means that A and B are integrally formed and connected, and the non-integral connection means that A and B are non-integrally formed and connected.

[0028] One end of the heat dissipation plate 70 of the wireless charging device 100 of the present application is in contact with the charging coil 60, and the opposite end of the heat dissipation plate 70 is in contact with the circuit board 40. When the wireless charging device 100 wirelessly charges an electronic device, the heat generated by the charging coil 60 is conducted to the second heat sink 74, and the heat generated by the circuit board 40 is conducted to the first heat sink 72; since the heat dissipation area of the heat dissipation plate 70 is large, the heat dissipation performance of the wireless charging device 100 is improved, avoiding the temperature of the wireless charging device 100 from being too high, and the charging power of the wireless charging device 100 can be increased.

[0029] As Figures 1-5 shown, the support frame 20 includes a base 22 and a support housing 25. A first receiving cavity 202 is provided in the base 22, and a second receiving cavity 204 is provided in the support housing 25. The base 22 is provided with heat dissipation holes 205 communicating with the first receiving cavity 202, and the heat generated by the operation of the wireless charging device 100 can be discharged from the heat dissipation holes 205. Specifically, the base 22 includes a bottom housing 222 and a support housing 224. The support housing 224 is connected between the bottom housing 222 and the support housing 25. The first receiving cavity 202 is located in the bottom housing 222 and the support housing 224, and one end of the first receiving cavity 202 away from the bottom housing 222 communicates with the second receiving cavity 204; the heat dissipation plate 70 further includes a third heat sink 76 connected between the first heat sink 72 and the second heat sink 74. The first heat sink 72 is located in the bottom housing 222, the second heat sink 74 is located in the support housing 25, the charging coil 60 is in contact with the second heat sink 74, and the third heat sink 76 is located in the support housing 224. When the charging coil 60 operates, the heat generated is conducted to the second heat sink 74, and the heat of the second heat sink 74 is conducted to the first heat sink 72 through the third heat sink 76, that is, the heat generated by the charging coil 60 can be quickly and evenly conducted to the entire heat dissipation plate 70, and the heat on the first heat sink 72 passes through the heat dissipation holes 205 and is discharged from the base 22, improving the heat dissipation efficiency of the wireless charging device 100.

[0030] Specifically, the bottom housing 222 includes a first substrate 2221, a second substrate 2223, and a first peripheral plate 2225. The first substrate 2221 and the second substrate 2223 are spaced apart and face each other. The first peripheral plate 2225 is connected between the periphery of the first substrate 2221 and the periphery of the second substrate 2223. One end of the support housing 224 is connected to the bottom housing 222, and the bracket housing 25 is connected to the end of the support housing 224 away from the bottom housing 222. The first substrate 2221, the second substrate 2223, and the first peripheral plate 2225 enclose one end of the first receiving cavity 202. The first substrate 2221 and the second substrate 2223 are respectively provided with a plurality of heat dissipation holes 205, and each heat dissipation hole 205 communicates with the first receiving cavity 202. Optionally, the first substrate 2221 and the second substrate 2223 are both covered with heat dissipation holes 205. In this embodiment, the first substrate 2221 and the second substrate 2223 are both rectangular plates, and the first peripheral plate 2225 is a rectangular frame plate. One side edge of the rectangular plate is connected to the first substrate 2221, and the opposite side edge of the rectangular plate is connected to the second substrate 2223.

[0031] In other embodiments, the first substrate 2221 and the second substrate 2223 may be respectively, but not limited to, circular plates, polygonal plates, elliptical plates, etc., and the first peripheral plate 2225 may be, but not limited to, circular frame plates, polygonal frames, elliptical frame plates, etc.

[0032] The support housing 224 includes a first support plate 2242, a second support plate 2244, and two side walls 2246. The first support plate 2242 and the second support plate 2244 face each other at intervals. Opposite sides of one of the side walls 2246 are connected to the first support plate 2242 and the second support plate 2244 on the same side of the support housing 224, and opposite sides of the other side wall 2246 are connected to the first support plate 2242 and the second support plate 2244 on the other same side of the support housing 224. The first support plate 2242, the second support plate 2244, and the two side walls 2246 enclose the opposite second ends of the first receiving cavity 202. One end of the first support plate 2242 is connected to the first substrate 2221, and the same ends of the second support plate 2244 and the two side walls 2246 are connected to the second substrate 2223. In this embodiment, one end of the first support plate 2242 is a first arc-shaped piece, and the opposite end of the first support plate 2242 is a first straight-shaped piece. The end of the first arc-shaped piece away from the first straight-shaped piece is connected to the first substrate 2221, and the end of the first straight-shaped piece away from the first arc-shaped piece is connected to the bracket housing 25. The second support plate 2244 has the same shape as the first support plate 2242. One end of the second support plate 2244 is a second arc-shaped piece, and the opposite end of the second support plate 2244 is a second straight-shaped piece. The end of the second arc-shaped piece away from the second straight-shaped piece is connected to the second substrate 2223, and the end of the second straight-shaped piece away from the second arc-shaped piece is connected to the bracket housing 25. The first arc-shaped piece is spaced and parallel to the second arc-shaped piece, and the first straight-shaped piece is spaced and parallel to the second straight-shaped piece.

[0033] The bracket housing 25 includes a support plate 252, a connecting plate 254, and side plates 255. The support plate 252 and the connecting plate 254 face each other at intervals. Opposite sides of the side plates 255 are respectively connected to the support plate 252 and the connecting plate 254. The support plate 252, the connecting plate 254, and the side plates 255 enclose the second receiving cavity 204. The end of the support housing 224 away from the bottom housing 222 is connected to the connecting plate 254. The connecting plate 254 is provided with a through groove 256 facing the first receiving cavity 202 of the support housing 224. The heat dissipation plate 70 and the wire are disposed through the through groove 256. In this embodiment, the support plate 252 is a first rectangular plate, the connecting plate 254 is a second rectangular plate, and the shape of the first rectangular plate is the same as that of the second rectangular plate. The bracket housing 25 includes four side plates 255. One sides of the four side plates 255 are respectively connected to the four side edges of the first rectangular plate, and the opposite sides of the four side plates 255 are respectively connected to the four side edges of the second rectangular plate. The four side plates 255 are connected end to end in sequence to form a rectangular inner cavity. In other embodiments, the support plate 252 and the connecting plate 254 can be respectively but not limited to circular plates, polygonal plates, elliptical plates, etc., and the side plates 255 can be but not limited to circular ring plates, polygonal ring plates, elliptical ring plates, etc.

[0034] As Figures 4-6As shown, the first heat sink 72 is received at the first end of the first receiving cavity 202, and the third heat sink 76 is received at the second end of the first receiving cavity 202. One end of the third heat sink 76 away from the first heat sink 72 passes through the through slot 256 and is connected to the second heat sink 74. In this embodiment, the first heat sink 72 is a rectangular plate, and one end of the third heat sink 76 connected to the first heat sink 72 is an arc-shaped plate, and one end of the third heat sink 76 away from the first heat sink 72 is an inclined plate, and the inclined plate is connected to the second heat sink 74. The second heat sink 74 is attached to the inner surface of the second receiving cavity 204 of the bracket housing 25, and the charging coil 60 is attached to the second heat sink 74. Specifically, the second heat sink 74 includes a first heat dissipation section 742 attached to the support plate 252, a second heat dissipation section 744 attached to one of the side plates 255, and a third heat dissipation section 746 attached to the inner surface of the connection plate 254. One end of the third heat dissipation section 746 away from the second heat dissipation section 744 is connected to one end of the third heat sink 76 away from the first heat sink 72; the charging coil 60 is attached to the surface of the first heat dissipation section 742 facing away from the support plate 252.

[0035] Optionally, the circuit board 40 is attached to the inner surface of the first receiving cavity 202 of the bottom housing 222, and the heat-generating electronic device 42 on the circuit board 40 is attached to the first heat sink 72. In this embodiment, the circuit board 40 is attached to the inner surface of the first substrate 2221, the heat-generating electronic device 42 is located on the surface of the circuit board 40 facing away from the first substrate 2221, and the first heat sink 72 is attached to the heat-generating electronic device 42. In other embodiments, the circuit board 40 is attached to the inner surface of the second substrate 2223, the heat-generating electronic device 42 is located on the surface of the circuit board 40 facing away from the second substrate 2223, and the first heat sink 72 is attached to the heat-generating electronic device 42.

[0036] As Figures 7-9As shown, the heat dissipation plate 70 is a liquid-cooled film composite heat conduction plate, which has soft characteristics. The liquid-cooled film composite heat conduction plate forms the first heat dissipation fin 72, the second heat dissipation fin 74 and the third heat dissipation fin 76 through a bending process, so that it can be directly embedded in the first receiving cavity 202 and the second receiving cavity 204 of the support frame 20, that is, the heat dissipation plate 70 can be directly attached to the inner surface of the support plate 252, the inner surface of the side plate 255, the inner surface of the connecting plate 254, and the first receiving cavity 202 of the base 22. The heat dissipation plate 70 includes a flow guiding plate 73, a first heat dissipation film 75, a second heat dissipation film 77 and a piezoelectric pump 78. The first heat dissipation film 75 covers one side of the flow guiding plate 73, and the second heat dissipation film 77 covers the opposite side of the flow guiding plate 73. The flow guiding plate 73 has a flow channel 730, and the flow channel 730 covers the entire flow guiding plate 73. The opposite sides of the flow channel 730 penetrate through the opposite side surfaces of the flow guiding plate 73 respectively. A heat conduction liquid is filled in the flow channel 730. When the piezoelectric pump 78 works, it can drive the heat conduction liquid to flow in the flow channel 730 to uniformly and quickly transfer heat to the entire heat dissipation plate 70.

[0037] In this embodiment, the flow guiding plate 73 is a rectangular plate, and both the first heat dissipation film 75 and the second heat dissipation film 77 are rectangular films. The first heat dissipation film 75 is hermetically attached to one side surface of the flow guiding plate 73, and the second heat dissipation film 77 is hermetically attached to the opposite side surface of the flow guiding plate 73, that is, the flow guiding plate 73 is hermetically clamped by the first heat dissipation film 75 and the second heat dissipation film 77, so that the heat dissipation plate 70 is a rectangular plate. Specifically, the lengths of the flow guiding plate 73, the first heat dissipation film 75 and the second heat dissipation film 77 are equal; the widths of the flow guiding plate 73, the first heat dissipation film 75 and the second heat dissipation film 77 are equal.

[0038] In this embodiment, the thermal conductivity of the heat dissipation plate 70 can reach more than 2000 W / mK, which is much greater than that of copper (~400 W / mK) and silica gel (~1.5 W / mK); at the same time, the overall material of the heat dissipation plate 70 has little influence on electromagnetic signals. Through the high-efficiency heat conduction of the heat dissipation plate 70, the heat conduction thermal resistance of the heat dissipation plate 70 can be effectively reduced, and the heat generated by the heat-generating electronic device 42 and the charging coil 60 during the operation of the wireless charging device 100 can be uniformly and efficiently conducted to the entire heat dissipation plate 70, greatly improving the heat dissipation efficiency of the wireless charging device 100.

[0039] In this embodiment, the flow channel 730 is a plurality of diversion grooves that are spaced apart from each other and communicate with each other. The plurality of diversion grooves cover the diversion plate 73. The piezoelectric pump 78 is disposed on the heat dissipation plate 70, and the piezoelectric pump 78 communicates with the flow channel 730. Specifically, the piezoelectric pump 78 includes a liquid inlet 782 and a liquid outlet 784. The first heat dissipation film 75 is provided with a liquid inlet hole 752 and a liquid outlet hole 754 that respectively communicate with the flow channel 730. The liquid inlet hole 752 communicates with the liquid outlet 784, and the liquid outlet hole 754 communicates with the liquid inlet 782. When the piezoelectric pump 78 operates, it can drive the heat-conducting liquid in the flow channel 730 to flow from the liquid outlet hole 754 and the liquid inlet 782 through the piezoelectric pump 78, and then flow back to the flow channel 730 from the liquid outlet 784 and the liquid inlet hole 752, so as to realize the flow of the heat-conducting liquid in the flow channel 730. The heat is quickly transferred to the entire heat dissipation plate 70 along with the heat-conducting liquid in the flow channel 730. Through the high heat conductivity of the liquid-cooling film composite cold-conducting plate, the heat generated by the charging coil 60 is effectively pulled down to the second heat dissipation fin 74 of the support housing 25 in time, and then transferred to the first heat dissipation fin 72 in the bottom housing 222 through the third heat dissipation fin 76, and the heat is discharged through the heat dissipation holes 205 on the bottom housing 222, accelerating the heat dissipation, so that the temperature in the area of the charging coil 60 is rapidly reduced, improving the heat dissipation effect of the wireless charging device 100, and helping to improve the efficiency and speed of the wireless charging device 100.

[0040] In other embodiments, the flow channel 730 may be a spiral groove. The axis of the spiral groove is located at the center of the diversion plate 73. The spiral groove covers the diversion plate 73. The opposite ends of the spiral groove are spaced apart from each other and close to each other. The liquid inlet hole 752 and the liquid outlet hole 754 of the first heat dissipation film 75 respectively communicate with the opposite ends of the spiral groove. The liquid inlet 782 and the liquid outlet 784 of the piezoelectric pump 78 respectively communicate with the liquid outlet hole 754 and the liquid inlet hole 752. When the piezoelectric pump 78 operates, it can drive the heat-conducting liquid in the spiral groove to flow from the liquid outlet hole 754 and the liquid inlet 782 through the piezoelectric pump 78, and then flow back to the flow channel 730 from the liquid outlet 784 and the liquid inlet hole 752, so as to realize the flow of the heat-conducting liquid in the flow channel 730, thereby quickly and evenly transferring the heat to the entire heat dissipation plate 70. In other embodiments, the flow channel 730 may also be a groove of other shapes. The flow channel 730 covers the diversion plate 73. The liquid inlet hole 752 and the liquid outlet hole 754 of the first heat dissipation film 75 respectively communicate with the opposite ends of the flow channel 730. The liquid inlet 782 and the liquid outlet 784 of the piezoelectric pump 78 respectively communicate with the liquid outlet hole 754 and the liquid inlet hole 752.

[0041] Optionally, the thickness H of the heat dissipation plate 70 is ≥150 microns, the height h of the flow channel 730 is ≥80 microns. The first heat dissipation film 75 and the second heat dissipation film 77 are required to have a water vapor permeability of ≤1 g / m2 / 24 hr. The number of piezoelectric pumps 78 is ≥1. The size and performance of the heat dissipation plate 70, such as the maximum temperature difference, maximum current, maximum voltage, and maximum cooling capacity, are related to the heat dissipation capacity requirements and the overall machine size, and are not specifically limited.

[0042] As Figure 10 shown, when the wireless charging device 100 is used to wirelessly charge the electronic device 200, the electronic device 200 includes a wireless charging coil 210 and a power supply 220 disposed in its housing, and the wireless charging coil 210 is electrically connected to the power supply 220; the electronic device 200 is placed on the support plate 252 of the support housing 25 so that the wireless charging coil 210 faces the charging coil 60 directly. The charging coil 60 generates a changing magnetic field, and the wireless charging coil 210 senses the change of this magnetic field to generate an electric current, and this electric current charges the power supply 220. During the charging process, the heat generated by the charging coil 60 is conducted to the second heat sink 74, and the heat on the second heat sink 74 is conducted to the third heat sink 76 and the first heat sink 72 along with the heat-conducting liquid in the heat-conducting plate 70. It has high thermal conductivity and can quickly and timely pull down the heat generated by the charging coil 60 to the second heat sink 74 in the support housing 25, the third heat sink 76 and the second heat sink 74 of the base 22, and discharges the heat from the base 22 through the heat dissipation holes 205 on the support frame 20, so as to quickly dissipate the heat, rapidly reduce the temperature of the charging coil 60 area, improve the heat dissipation efficiency of the wireless charging device 100, and contribute to improving the charging efficiency and speed of the wireless charging device 100. Secondly, since the heat-conducting plate 70 of the wireless charging device 100 has high thermal conductivity and low density compared with metal materials, therefore, the size of the wireless charging device 100 can be designed to be thinner, and the weight of the wireless charging device 100 is also smaller accordingly.

[0043] The second heat sink 74 of the heat-conducting plate 70 of the wireless charging device 100 of the present application is in contact with the charging coil 60, and the first heat sink 72 of the heat-conducting plate 70 is in contact with the heat-generating electronic device 42. When the wireless charging device 100 wirelessly charges the electronic device 200, the heat generated by the charging coil 60 is conducted to the second heat sink 74, and then conducted to the first heat sink 72 through the third heat sink 76. The heat generated by the heat-generating electronic device 42 is conducted to the first heat sink 72, and the heat is discharged from the wireless charging device 100 through the heat dissipation holes 205; since the heat dissipation area of the heat-conducting plate 70 is large and the heat can be discharged from the heat dissipation holes 205 in time, therefore, the heat dissipation performance of the wireless charging device 100 is improved, avoiding the temperature of the wireless charging device 100 from being too high, and the charging power of the wireless charging device 100 can be improved.

[0044] As Figure 11As shown in the figure, the structure of the wireless charging device 100a in the second embodiment of the present application is similar to that of the wireless charging device in the first embodiment. The difference lies in that: in the second embodiment, the support housing 224 is provided with heat dissipation holes 205 communicating with the first receiving cavity 202; that is, heat dissipation holes 205 are respectively formed on the first substrate 2221 and the second substrate 2223 of the bottom housing 222, and heat dissipation holes 205 are also respectively formed on the first support plate 2242 and the second support plate 2244 of the support housing 224; specifically, heat dissipation holes 205 are respectively provided at one end of the first support plate 2242 close to the first substrate 2221 and at one end of the second support plate 2244 close to the second substrate 2223. When the wireless charging device 100a charges an electronic device, the heat generated when the charging coil 60 works is conducted to the second heat sink 74, the heat of the second heat sink 74 is conducted to the first heat sink 72 through the third heat sink 76, the heat generated by the heat-generating electronic device 42 is conducted to the first heat sink 72 and the third heat sink 76, and the heat on the first heat sink 72 and the third heat sink 76 passes through the heat dissipation holes 205 and is discharged from the base 22, further improving the heat dissipation efficiency of the wireless charging device 100a.

[0045] In other embodiments, the heat dissipation holes 205 on the bottom housing 222 of the wireless charging device 100a can be omitted, and only the heat dissipation holes 205 of the support housing 224 are retained.

[0046] The beneficial effects of the wireless charging device 100a in the second embodiment are similar to those of the wireless charging device in the first embodiment, and will not be elaborated here.

[0047] As Figure 12 As shown in the figure, the structure of the wireless charging device 100b in the third embodiment of the present application is similar to that of the wireless charging device in the first embodiment. The difference lies in that: in the third embodiment, the support housing 224 is provided with heat dissipation holes 205 communicating with the first receiving cavity 202; specifically, heat dissipation holes 205 are respectively formed on the first substrate 2221 and the second substrate 2223 of the bottom housing 222, and heat dissipation holes 205 are respectively provided at one end of the first support plate 2242 close to the connecting plate 254 and at one end of the second support plate 2244 close to the connecting plate 254. When the wireless charging device 100b charges an electronic device, the heat generated when the charging coil 60 works is conducted to the second heat sink 74, the heat of the second heat sink 74 is conducted to the first heat sink 72 through the third heat sink 76, the heat generated by the heat-generating electronic device 42 is conducted to the first heat sink 72 and the third heat sink 76, and the heat on the first heat sink 72 and the third heat sink 76 passes through the heat dissipation holes 205 and is discharged from the base 22, further improving the heat dissipation efficiency of the wireless charging device 100b.

[0048] In other embodiments, the heat dissipation holes 205 on the bottom housing 222 of the wireless charging device 100b can be omitted, and only the heat dissipation holes 205 of the support housing 224 are retained.

[0049] The beneficial effects of the wireless charging device 100b in the third embodiment are similar to those of the wireless charging device in the first embodiment, and will not be elaborated here.

[0050] As Figure 13 shown, the structure of the wireless charging device 100c in the fourth embodiment of the present application is similar to that of the wireless charging device in the first embodiment. The difference is that: the heat dissipation holes 205 communicating with the second receiving cavity 204 are provided on the bracket housing 25 in the fourth embodiment; specifically, the heat dissipation holes 205 are respectively formed on the first substrate 2221 and the second substrate 2223 of the bottom housing 222, and the heat dissipation holes 205 are provided at the position where the connecting plate 254 faces the third heat dissipation section 746. When the wireless charging device 100c charges the electronic device, the heat generated when the charging coil 60 works is conducted to the second heat sink 74, the heat of the second heat sink 74 is conducted to the first heat sink 72 through the third heat sink 76, the heat generated by the heat-generating electronic device 42 is conducted to the first heat sink 72 and the third heat sink 76, and the heat on the second heat sink 74 and the third heat sink 76 is discharged from the support frame 20 through the heat dissipation holes 205, further improving the heat dissipation efficiency of the wireless charging device 100c.

[0051] In other embodiments, the heat dissipation holes 205 on the bottom housing 222 of the wireless charging device 100c can be omitted, and only the heat dissipation holes 205 on the bracket housing 25 are retained.

[0052] The beneficial effects of the wireless charging device 100c in the fourth embodiment are similar to those of the wireless charging device in the first embodiment, and will not be elaborated here.

[0053] As Figure 14As shown, the structure of the wireless charging device 100d of the fifth embodiment of the present application is similar to that of the wireless charging device of the first embodiment, except that: heat dissipation holes 205 are respectively provided on the base 22 and the bracket housing 25 in the fifth embodiment; specifically, heat dissipation holes 205 are respectively formed on the first substrate 2221 and the second substrate 2223 of the bottom housing 222, and heat dissipation holes 205 are respectively provided at one end of the first support plate 2242 close to the first substrate 2221 and at one end of the first support plate 2242 close to the connecting plate 254, at one end of the second support plate 2244 close to the second substrate 2223 and at one end of the second support plate 2244 close to the connecting plate 254, and at the position of the connecting plate 254 facing the third heat dissipation section 746. When the wireless charging device 100d charges an electronic device, the heat generated when the charging coil 60 works is conducted to the second heat sink 74, the heat of the second heat sink 74 is conducted to the first heat sink 72 through the third heat sink 76, and the heat generated by the heat-generating electronic device 42 is conducted to the first heat sink 72 and the third heat sink 76. The heat on the first heat sink 72, the second heat sink 74 and the third heat sink 76 is discharged from the support frame 20 through the heat dissipation holes 205, further improving the heat dissipation efficiency of the wireless charging device 100d.

[0054] The beneficial effects of the wireless charging device 100d in the fifth embodiment are similar to those of the wireless charging device in the first embodiment, and will not be elaborated here.

[0055] The above are the implementation manners of the embodiments of the present invention. It should be noted that for those of ordinary skill in the art, without departing from the principle of the embodiments of the present invention, several improvements and refinements can be made, and these improvements and refinements are also regarded as the protection scope of the present invention.

Claims

1. A wireless charging device for wirelessly charging an electronic device, characterized in that: The wireless charging device comprises: A support frame, the support frame having a first receiving cavity and a second receiving cavity that are interconnected; A circuit board, the circuit board is accommodated in the first receiving cavity; a charging coil, the charging coil being accommodated in the second receiving cavity and being electrically connected to the circuit board; and The heat sink comprises a first heat sink and a second heat sink connected to the first heat sink, the first heat sink is accommodated in a first receiving cavity, the circuit board contacts the first heat sink, the second heat sink is accommodated in the second receiving cavity, and the charging coil contacts the second heat sink.

2. The wireless charging device according to claim 1, characterized in that: The heat sink also includes a third heat sink connected between the first heat sink and the second heat sink. The heat generated by the charging coil when working is conducted to the second heat sink, and the heat of the second heat sink is conducted to the first heat sink via the third heat sink.

3. The wireless charging device according to claim 2, characterized in that: The support frame includes a base and a support shell, the first receiving cavity is arranged in the base, the second receiving cavity is arranged in the support shell, and the base is provided with a heat dissipation hole communicating with the first receiving cavity.

4. The wireless charging device according to claim 3, characterized in that: The second heat sink is attached to the inner surface of the second receiving cavity of the bracket housing, and the charging coil is attached to the second heat sink.

5. The wireless charging device according to claim 3, characterized in that: The base comprises a bottom shell and a supporting shell, wherein the supporting shell is connected between the bottom shell and the bracket shell, the first receiving cavity is located between the bottom shell and the supporting shell, and an end of the first receiving cavity away from the bottom shell is connected to the second receiving cavity; The first heat sink is located in the bottom shell, and the third heat sink is located in the supporting shell.

6. The wireless charging device according to claim 5, characterized in that: The bottom shell and / or the supporting shell is provided with a heat dissipation hole communicating with the first receiving cavity.

7. The wireless charging device according to claim 5, characterized in that: The bottom shell and / or the bracket shell is provided with a heat dissipation hole communicating with the second receiving cavity.

8. The wireless charging device according to claim 5, characterized in that: The circuit board is attached to the inner surface of the first receiving cavity of the bottom shell, and the heat-generating electronic components on the circuit board are attached to the first heat sink.

9. The wireless charging device according to claim 1, characterized in that: The heat sink is a liquid-cooled membrane composite cooling plate.

10. The wireless charging device according to claim 3, characterized in that: The bracket shell includes a support plate, a connecting plate and a side plate, the support plate and the connecting plate are spaced apart and opposite to each other, the opposite sides of the side plate are respectively connected to the support plate and the connecting plate, the support plate, the connecting plate and the side plate form the second accommodating cavity, the second heat sink includes a first heat sink section attached to the inner surface of the support plate, a second heat sink section attached to the inner surface of one of the side plates, and a third heat sink section attached to the inner surface of the connecting plate, and the charging coil is attached to the surface of the first heat sink section facing away from the support plate.

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