Chip mounting equipment for computer mainboard production

Abstract

The invention discloses chip mounting equipment for computer mainboard production, and relates to the technical field of chip mounting equipment.The chip mounting equipment comprises a rack, a conveying mechanism, a moving mechanism, a displacement frame and a chip mounting mechanism, the conveying mechanism is arranged on the rack and used for conveying a mainboard, the moving mechanism is arranged on the rack and used for driving the displacement frame on the moving mechanism to move, and the chip mounting mechanism is arranged on the rack and used for driving the displacement frame to move; and the chip mounting mechanism is arranged on the displacement frame and is used for carrying out chip mounting on the cooling fins on the main board. The position of the chip mounting mechanism is adjusted through the moving mechanism, a mainboard is positioned and finely adjusted through a conveying plate of the conveying mechanism, and meanwhile, the chip mounting mechanism rotates and resets a vacuum chuck and a cooling fin on the vacuum chuck under the action of a torsional spring on a rotating rod, so that glue at the bottom of the cooling fin and the mainboard are twisted, and the chip mounting efficiency is improved. According to the equipment, the to-be-pasted position of the mainboard can be cleaned, and meanwhile, the smearing uniformity of the glue at the bottom of the cooling fin is improved.

Description

Technical Field

[0001] The present invention relates to the technical field of chip mounters, and particularly to a chip mounter for the production of computer motherboards. Background Art

[0002] As a key component in a computer, during the processing of a computer motherboard, a heat sink needs to be accurately attached to the motherboard with the aid of a chip mounting device to complete the assembly process of the computer motherboard, making it closely combined with various components and finally forming a complete whole. During the processing of the motherboard, debris residues are likely to remain and contaminate the area to be mounted on the motherboard. At the same time, the bottom of the heat sink is generally coated using a dispensing process. When installing it on the motherboard, the colloid is unevenly distributed during subsequent adhesion, affecting the stability of the heat sink on the motherboard. Summary of the Invention

[0003] The purpose of the present invention is to provide a chip mounter for the production of computer motherboards to overcome the above-mentioned defects in the prior art.

[0004] A chip mounter for the production of computer motherboards includes a frame, a conveying mechanism, a moving mechanism, a displacement frame, and a chip mounting mechanism;

[0005] The conveying mechanism is arranged on the frame and is used for transporting the motherboard;

[0006] The moving mechanism is arranged on the frame and is used for driving the displacement frame thereon to move;

[0007] The chip mounting mechanism is arranged on the displacement frame and is used for mounting the heat sink on the motherboard.

[0008] Preferably, the conveying mechanism includes a driving lead screw one, a first motor, and a conveying plate. The two ends of the driving lead screw one are rotatably connected to the frame. The first motor is installed at the bottom of the frame, and a pulley one is installed on its output shaft. The pulley one is connected to a pulley two at one end of the driving lead screw one through a driving belt. The bottom of the conveying plate is helically connected to the driving lead screw one through a lead screw nut. The conveying plate is slidably connected to a slide rail one on the frame and is provided with a positioning groove for placing the motherboard.

[0009] Preferably, the moving mechanism includes a second driving lead screw, a second motor, a moving frame, a third driving lead screw and a third motor. On both sides of the frame, a first fixing seat and a second fixing seat spanning the conveying plate are respectively provided. The two ends of the second driving lead screw are rotatably connected to the first fixing seat. The second motor is installed on the first fixing seat and its output shaft is connected to one end of the second driving lead screw. The bottom of the moving frame is helically connected to the second driving lead screw through a lead screw nut. Both ends of the moving frame are slidably connected to the second slide rails on the first fixing seat and the second fixing seat respectively. The two ends of the third driving lead screw are rotatably connected to the moving frame. The third motor is installed on the moving frame and its output shaft is connected to one end of the third driving lead screw. The displacement frame is helically connected to the third driving lead screw through a lead screw nut and is slidably connected to the third slide rail on the moving frame.

[0010] Preferably, the chip mounting mechanism includes a first cylinder, a vacuum suction cup, a second cylinder and a cleaning component. The first cylinder is installed in the displacement frame and a lifting block is provided at the upper end of its piston rod. A fourth motor is installed in the lifting block and its output shaft is connected to a rotating block. A fixing plate is provided at the top of the rotating block. One side of the fixing plate is slidably connected to a sliding rod. The other side of the fixing plate is rotatably connected to a spiral sleeve. A threaded rod is helically connected in the spiral sleeve. The lower ends of the sliding rod and the threaded rod are provided with the same bottom plate. The vacuum suction cup is rotatably connected to the bottom plate through a rotating rod. A torsion spring is sleeved on the rotating rod. One end of the torsion spring is connected to the bottom plate and the other end is connected to the vacuum suction cup. A driving rod is provided at the rear side of the vacuum suction cup. The upper ends of the sliding rod and the threaded rod are connected to an extension plate through the same top plate. The cylinder body of the second cylinder is hinged to the bracket at the rear side of the fixing plate through a pin shaft. The end of the piston rod of the second cylinder is hinged to the lower end of a special-shaped plate through a pin shaft. The rear end of the special-shaped plate is hinged to the bracket through a pin shaft. A plug rod is provided at the front end of the special-shaped plate and is inserted into the chute on the extension plate. The cleaning component is provided on one side of the fixing plate and is used for cleaning the part to be chipped on the main board.

[0011] Preferably, the cleaning component includes a connecting plate, a rack, a gear and a cleaning brush. The connecting plate is slidably connected to the fourth slide rail on the side of the fixing plate and a rack meshing with the gear on the spiral sleeve is provided at its top. The cleaning brush is provided on the side of the connecting plate and an inclined driving plate is provided thereon. The driving plate is provided with an inclined surface.

[0012] Preferably, the connecting plate is of an inverted "L" shape structure.

[0013] Preferably, a guiding rod slidably connected to the displacement frame is provided at the lower end of the lifting block.

[0014] The beneficial effects achieved by the present invention are as follows:

[0015] In this application, the position of the chip mounting mechanism is adjusted by a moving mechanism, and the main board is positioned and finely adjusted by the conveying board of the conveying mechanism. At the same time, the second cylinder of the chip mounting mechanism drives the special-shaped plate to rotate, so that the threaded rod drives the heat sink on the vacuum chuck to move downward. The threaded rod drives the spiral sleeve to rotate, and the gear on the spiral sleeve drives the rack on the connecting plate to move, so that the cleaning brush moves on the main board to clean the main board. When the driving rod behind the vacuum chuck contacts the inclined surface of the driving plate on the cleaning brush, the vacuum chuck and the heat sink on it are driven to rotate by a certain angle. When the cleaning brush continues to move, the driving rod disengages from the driving plate. At this time, under the action of the torsion spring on the rotating rod, the vacuum chuck and the heat sink on it rotate and reset, so that the glue at the bottom of the heat sink twists with the main board, improving the uniformity of the glue adhesion on the heat sink. This device can clean the position to be chipped on the main board while improving the uniformity of the glue application at the bottom of the heat sink. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 is the front view of the whole of the present invention.

[0017] Figure 2 is the top view of the interior of the present invention.

[0018] Figure 3 is the front view of the chip mounting mechanism of the present invention.

[0019] Figure 4 is Figure 3 the partial enlarged view of A in

[0020] Figure 5 is the side view of the chip mounting mechanism of the present invention.

[0021] Figure 6 is the overall structural schematic diagram of the chip mounting mechanism of the present invention.

[0022] In the figure, 1 is the frame; 2 is the conveying mechanism; 21 is the first driving lead screw; 22 is the first motor; 23 is the first pulley; 24 is the driving belt; 25 is the second pulley; 26 is the conveying plate; 3 is the moving mechanism; 31 is the first fixed seat; 32 is the second fixed seat; 33 is the second driving lead screw; 34 is the second motor; 35 is the moving frame; 36 is the third driving lead screw; 37 is the third motor; 4 is the displacement frame; 5 is the chip mounting mechanism; 51 is the first cylinder; 511 is the lifting block; 512 is the guiding rod; 52 is the fourth motor; 521 is the rotating block; 53 is the fixing plate; 531 is the sliding rod; 532 is the spiral sleeve; 533 is the threaded rod; 534 is the bottom plate; 54 is the vacuum chuck; 541 is the rotating rod; 542 is the torsion spring; 543 is the driving rod; 55 is the top plate; 551 is the extending plate; 552 is the sliding groove; 56 is the second cylinder; 57 is the bracket; 58 is the special-shaped plate; 581 is the inserting rod; 59 is the cleaning assembly; 591 is the connecting plate; 592 is the rack; 593 is the gear; 594 is the cleaning brush; 595 is the driving plate; 596 is the inclined surface. Detailed implementation mode

[0023] The following is a more detailed description of the specific implementation mode of the present invention by describing the embodiments with reference to the accompanying drawings, so as to help those skilled in the art have a more complete, accurate and in-depth understanding of the concept and technical solution of the present invention.

[0024] As Figures 1-6 shown, the present invention provides a chip mounting device for computer motherboard production, including a frame 1, a conveying mechanism 2, a moving mechanism 3, a displacement frame 4 and a chip mounting mechanism 5;

[0025] It should be noted that the conveying mechanism 2 is arranged on the frame 1 and is used for transporting the motherboard. The conveying mechanism 2 includes a first driving lead screw 21, a first motor 22 and a conveying plate 26. The two ends of the first driving lead screw 21 are rotatably connected to the frame 1. The first motor 22 is installed at the bottom of the frame 1 and a first pulley 23 is installed on its output shaft. The first pulley 23 is connected to the second pulley 25 at one end of the first driving lead screw 21 through a driving belt 24. The bottom of the conveying plate 26 is helically connected to the first driving lead screw 21 through a screw nut. The conveying plate 26 is slidably connected to the first slide rail on the frame 1 and is provided with a positioning groove for placing the motherboard.

[0026] In addition, the moving mechanism 3 is arranged on the frame 1 and is used to drive the displacement frame 4 thereon to move. The moving mechanism 3 includes a driving lead screw two 33, a second motor 34, a moving frame 35, a driving lead screw three 36 and a third motor 37. On both sides of the frame 1, a first fixed seat 31 and a second fixed seat 32 spanning the conveying plate 26 are respectively provided. The two ends of the driving lead screw two 33 are rotatably connected to the first fixed seat 31. The second motor 34 is installed on the first fixed seat 31 and its output shaft is connected to one end of the driving lead screw two 33. The bottom of the moving frame 35 is helically connected to the driving lead screw two 33 through a lead screw nut. The two ends of the moving frame 35 are respectively slidably connected to the second slide rails on the first fixed seat 31 and the second fixed seat 32. The two ends of the driving lead screw three 36 are rotatably connected to the moving frame 35. The third motor 37 is installed on the moving frame 35 and its output shaft is connected to one end of the driving lead screw three 36. The displacement frame 4 is helically connected to the driving lead screw three 36 through a lead screw nut, and the displacement frame 4 is slidably connected to the third slide rail on the moving frame 35.

[0027] In addition, the patch mechanism 5 is arranged on the displacement frame 4 and is used to patch the heat sinks on the main board. The patch mechanism 5 includes a first cylinder 51, a vacuum suction cup 54, a second cylinder 56 and a cleaning component 59. The first cylinder 51 is installed in the displacement frame 4 and a lifting block 511 is provided at the upper end of its piston rod. A guide rod 512 slidably connected to the displacement frame 4 is provided at the lower end of the lifting block 511. A fourth motor 52 is installed in the lifting block 511, and the output shaft of the fourth motor 52 is connected to a rotating block 521. A fixing plate 53 is provided at the top of the rotating block 521. A slide rod 531 is slidably connected to one side of the fixing plate 53, and a spiral sleeve 532 is rotatably connected to the other side of the fixing plate 53. A threaded rod 533 is helically connected in the spiral sleeve 532. The lower ends of the slide rod 531 and the threaded rod 533 are provided with the same bottom plate 534. The vacuum suction cup 54 is rotatably connected to the bottom plate 534 through a rotating rod 541. A torsion spring 542 is sleeved on the rotating rod 541. One end of the torsion spring 542 is connected to the bottom plate 534, and the other end of the torsion spring 542 is connected to the vacuum suction cup 54. A driving rod 543 is provided at the rear side of the vacuum suction cup 54. The upper ends of the slide rod 531 and the threaded rod 533 are connected with an extension plate 551 through the same top plate 55. The cylinder body of the second cylinder 56 is hinged to the bracket 57 at the rear side of the fixing plate 53 through a pin shaft. The end of the piston rod of the second cylinder 56 is hinged to the lower end of a special-shaped plate 58 through a pin shaft. The rear end of the special-shaped plate 58 is hinged to the bracket 57 through a pin shaft. A plug rod 581 inserted into the chute 552 on the extension plate 551 is provided at the front end of the special-shaped plate 58;

[0028] The cleaning component 59 is arranged on one side of the fixed plate 53 and is used for cleaning the parts to be pasted on the main board. The cleaning component 59 includes a connecting plate 591, a rack 592, a gear 593 and a cleaning brush 594. The connecting plate 591 is in an inverted "L" shape. The connecting plate 591 is slidably connected to the fourth slide rail on the side of the fixed plate 53, and a rack 592 meshing with the gear 593 on the spiral sleeve 532 is arranged at the top thereof. The cleaning brush 594 is arranged on the side of the connecting plate 591, and an inclined driving plate 595 is arranged thereon. An inclined surface 596 is arranged on the driving plate 595. The cleaning component 59 is used to clean the position on the main board to be pasted.

[0029] Specific implementation manners and principles:

[0030] During operation, the main board to be pasted is placed in the positioning groove on the conveying plate 26. The vacuum chuck 54 of the pasting mechanism 5 adsorbs the heat sink with glue applied to the bottom. The output shaft of the fourth motor 52 drives the rotating block 521 to rotate to the other side of the displacement frame 4. Then, control the output shaft of the second motor 34 to rotate to drive the driving lead screw two 33 to rotate, so that the moving frame 35 moves to an appropriate position. Then, control the output shaft of the third motor 37 to rotate, so that the driving lead screw three 36 rotates, driving the pasting mechanism 5 on the displacement frame 4 to move to the corresponding position of the main board. At the same time, the output shaft of the first motor 22 can drive the driving lead screw one 21 to rotate through belt transmission, so as to finely adjust the position of the conveying plate 26. Then, control the piston rod of the first cylinder 51 to retract, driving the lifting block 511 to move downward so that the cleaning brush 594 contacts the main board;

[0031] Then, control the piston rod of the second cylinder 56 to retract, driving the special-shaped plate 58 to rotate. The insertion rod 581 on the special-shaped plate 58 moves in the chute 552 on the outer extension plate 551, so that the threaded rod 533 drives the heat sink on the vacuum chuck 54 to move downward. The threaded rod 533 drives the spiral sleeve 532 to rotate. The gear 593 on the spiral sleeve 532 drives the rack 592 on the connecting plate 591 to move, so that the cleaning brush 594 moves on the main board to clean the main board. When the driving rod 543 behind the vacuum chuck 54 contacts the inclined surface 596 of the driving plate 595 on the cleaning brush 594, the vacuum chuck 54 and the heat sink thereon are driven to rotate by a certain angle. When the cleaning brush 594 continues to move, the driving rod 543 disengages from the driving plate 595. At this time, under the action of the torsion spring 542 on the rotating rod 541, the vacuum chuck 54 and the heat sink thereon rotate and reset, so that the glue at the bottom of the heat sink is twisted with the main board, improving the uniformity of the glue adhesion on the heat sink.

[0032] The above-described embodiments of the present invention do not constitute a limitation to the protection scope of the present invention. Any modifications, equivalent replacements, and improvements made within the spirit and principle of the present invention shall be included within the protection scope of the claims of the present invention.

Claims

1. A chip placement device for producing computer motherboards, characterized in that: It comprises a frame (1), a conveying mechanism (2), a moving mechanism (3), a displacement frame (4) and a patch mechanism (5); The conveying mechanism (2) is arranged on the frame (1) and is used to transport the mainboard; The moving mechanism (3) is arranged on the frame (1) and is used to drive the displacement frame (4) thereon to move; The patch mechanism (5) is arranged on the displacement frame (4) and is used to patch the heat sink on the mainboard.

2. The chip mounting equipment for producing computer motherboards according to claim 1 is characterized in that: The conveying mechanism (2) comprises a driving screw rod (21), a first motor (22) and a conveying plate (26); the two ends of the driving screw rod (21) are rotatably connected to the frame (1); the first motor (22) is mounted on the bottom of the frame (1) and a pulley (23) is mounted on its output shaft; the pulley (23) is connected to a pulley (25) at one end of the driving screw rod (21) via a driving belt (24); the bottom of the conveying plate (26) is spirally connected to the driving screw rod (21) via a screw nut; the conveying plate (26) is slidably connected to a slide rail (1) on the frame (1) and is provided with a positioning groove for placing a main board.

3. The chip mounting equipment for producing computer motherboards according to claim 1 is characterized in that: The moving mechanism (3) comprises a second driving screw rod (33), a second motor (34), a moving frame (35), a third driving screw rod (36) and a third motor (37). A first fixing seat (31) and a second fixing seat (32) are respectively provided on both sides of the frame (1) and cross the conveying plate (26). Both ends of the second driving screw rod (33) are rotatably connected to the first fixing seat (31). The second motor (34) is mounted on the first fixing seat (31) and its output shaft is connected to one end of the second driving screw rod (33). The bottom of the moving frame (35) is The two ends of the movable frame (35) are respectively connected in a sliding manner to the slide rails 2 on the fixed seat 1 (31) and the fixed seat 2 (32). The two ends of the drive screw rod 3 (36) are rotatably connected to the movable frame (35). The third motor (37) is installed on the movable frame (35) and its output shaft is connected to one end of the drive screw rod 3 (36). The displacement frame (4) is connected in a spiral manner to the drive screw rod 3 (36) through the screw nut. The displacement frame (4) is slidably connected to the slide rail 3 on the movable frame (35).

4. The chip mounting equipment for producing computer motherboards according to claim 1 is characterized in that: The patch mechanism (5) comprises a first cylinder (51), a vacuum suction cup (54), a second cylinder (56) and a cleaning assembly (59); the first cylinder (51) is installed in the displacement frame (4) and a lifting block (511) is provided at the upper end of the piston rod thereof; a fourth motor (52) is installed in the lifting block (511); an output shaft of the fourth motor (52) is connected to a rotating block (521); a fixed plate (53) is provided at the top of the rotating block (521); a sliding rod (531) is slidably connected to one side of the fixed plate (53); a spiral sleeve (532) is rotatably connected to the other side of the fixed plate (53); a threaded rod (533) is spirally connected to the spiral sleeve (532); a bottom plate (534) is provided at the lower ends of the sliding rod (531) and the threaded rod (533); the vacuum suction cup (54) is rotatably connected to the bottom plate (534) via a rotating rod (541); the rotating rod (541) is rotatably connected to the bottom plate (534); ) is sleeved with a torsion spring (542), one end of which is connected to the bottom plate (534), and the other end of which is connected to the vacuum suction cup (54). A driving rod (543) is provided on the rear side of the vacuum suction cup (54). The upper ends of the sliding rod (531) and the threaded rod (533) are connected to an extension plate (551) through the same top plate (55). The cylinder body of the second cylinder (56) is connected to the rear of the fixing plate (53) through a pin shaft. The bracket (57) on the side is hinged, the piston rod end of the second cylinder (56) is hinged to the lower end of the special-shaped plate (58) through a pin shaft, the rear end of the special-shaped plate (58) is hinged to the bracket (57) through a pin shaft, and the front end of the special-shaped plate (58) is provided with an insertion rod (581) inserted into a slide groove (552) on the extended plate (551), and the cleaning component (59) is arranged on one side of the fixed plate (53) and is used to clean the part to be patched on the main board.

5. The chip mounting equipment for producing computer motherboards according to claim 4 is characterized in that: The cleaning assembly (59) comprises a connecting plate (591), a rack (592), a gear (593) and a cleaning brush (594); the connecting plate (591) is slidably connected to a slide rail 4 on the side of the fixed plate (53) and a rack (592) is provided on the top of the connecting plate for meshing with the gear (593) on the spiral sleeve (532); the cleaning brush (594) is provided on the side of the connecting plate (591) and an inclined driving plate (595) is provided on the connecting plate; and an inclined surface (596) is provided on the driving plate (595).

6. The chip mounting equipment for producing computer motherboards according to claim 5 is characterized in that: The connecting plate (591) is an inverted "L"-shaped structure.

7. The chip mounting equipment for producing computer motherboards according to claim 4 is characterized in that: A guide rod (512) is provided at the lower end of the lifting block (511) and is slidably connected to the displacement frame (4).

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