Computer semiconductor brazing processing device and method

Abstract

The invention discloses a computer semiconductor brazing machining device and method, and relates to the technical field of semiconductor manufacturing, the computer semiconductor brazing machining device comprises a welding table, the top of the welding table is fixedly connected with a supporting frame, the top of the welding table is fixedly connected with two sets of welding frames, and welding guns are arranged on the outer sides of the two sets of welding frames; a displacement device used for moving is arranged between the welding frame and the welding gun, the two connecting pieces drive the two traction rods to move along the two ends of a limiting groove correspondingly, coating tanks at the bottoms of the traction rods are made to coat welding points of a substrate with a stop-off agent around pins, the welding points are accurately coated, and the welding efficiency is improved. Fused welding flux is limited to diffuse to a non-target area through the physical isolation effect, short circuit or bridging between adjacent pins is avoided, welding spot gaps are filled with the welding flux along a preset path by limiting the flowing range of the welding flux, a uniform wetting interface is formed, meanwhile, the situation that the welding flux splashes to pollute the surface of a substrate can be avoided, and secondary machining procedures such as cleaning and polishing are reduced.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor manufacturing, and particularly relates to a computer semiconductor soldering processing device and method. Background Art

[0002] With the development of technology, electronic products are becoming more and more advanced and smaller in size. The fundamental development of electronic products lies in the extensive use of electronic chips. Currently, electronic chips need to be connected to a substrate through soldering. Soldering is a welding method that uses a filler metal with a melting point lower than that of the base metal. By heating, the filler metal is melted and fills the gaps between solid workpieces to achieve metal connection.

[0003] Referring to a semiconductor soldering processing device and its processing method disclosed in a patent application with a publication number of CN118616830A, belonging to the field of welding technology, including a machine table and a picking device, and further including: a transfer mechanism, a bearing mechanism, a turntable, a driving component, and a welding mechanism; the bearing mechanism includes a bearing box, and further includes: a temperature control component installed on the turntable; a sealing component installed on the turntable; the welding mechanism includes a frame, and further includes: a heating component installed at the lower part of the frame; a pressing component installed at the upper part of the frame; the present invention can preheat a semiconductor weldment before soldering, reduce defects and cracks after welding, control the welding temperature and welding pressure during welding to improve the welding quality, and can adjust the temperature rise rate of the welding environment and the temperature drop rate after welding, so as to prevent the welded part of the semiconductor weldment from having welding defects and cracks due to a sharp rise or fall in temperature.

[0004] In the above solution, the semiconductor is preheated to improve the welding effect. During the soldering process, the filler metal is heated and melted by a soldering gun and then solidified to connect it. However, when the filler metal is melted, during the soldering process, it is difficult for existing equipment to achieve a circumferential closed coating around the solder joints, easily resulting in the overflow of molten solder to form bridging defects, and additional laser correction or repair processes are required. At the same time, the high-temperature radiation of the soldering gun during the welding process easily causes the filler metal near adjacent solder joints to fail, and the heat dispersion easily leads to uneven flow of the filler metal, resulting in incomplete wetting or solder joint voids.

[0005] Therefore, it is necessary to provide a computer semiconductor soldering processing device and method to solve the above technical problems. Summary of the Invention

[0006] The purpose of the present invention is to provide a computer semiconductor soldering processing device and method to solve the problems of the defects of the prior art proposed in the above background art.

[0007] Based on the above ideas, the present invention provides the following technical solution: a computer semiconductor brazing processing device, a limiting frame fixedly connected to the outside of the welding end of the welding torch, a limiting groove is opened on the outside of the limiting frame, and touch switches are arranged at both ends of the limiting groove;

[0008] Two traction rods, both of the two traction rods are arranged on the outside of the limiting frame and are symmetrically arranged. Fixedly connected to the bottom ends of the two traction rods are guiding frames, and a coating tank is connected to the inside of the guiding frame through a sliding member. The coating tank is used for coating a flow blocker on the welding points of the pins and the substrate;

[0009] A connecting member is arranged between the traction rod and the limiting frame. A micro electric push rod is fixedly connected to the outside of the welding torch, and the telescopic end of the micro electric push rod is fixedly connected to a pushing ring. When the pushing ring descends, the two connecting members slide symmetrically around the pushing ring along the limiting groove.

[0010] As a further scheme of the present invention: the connecting member includes a connecting plate arranged on the outside of the limiting frame. Fixedly connected to one side of the connecting plate is a sliding shaft, and the sliding shaft extends into the limiting groove and slides with the limiting frame. When the sliding shaft slides to the bottom end of the limiting groove, it contacts the touch switch, and a first sliding groove is opened at the bottom of the pushing ring. The top of the connecting plate extends into the first sliding groove and is slidably connected to the pushing ring. A first spring and a telescopic rod are fixedly connected between the connecting plate and the traction rod, and the first spring is sleeved outside the telescopic rod.

[0011] As a further scheme of the present invention: the sliding member includes a sliding block, the sliding block is slidably connected to the inside of the guiding frame, and a second spring is fixedly connected between the sliding block and the traction rod. Fixedly connected to the side of the sliding block away from the second spring is an electromagnet, and the electromagnet is electrically connected to the touch switch. When the touch switch is triggered, the two electromagnets are electrified and attracted to each other. When the connecting member drives the traction rod to move to the position where the touch switch is triggered, one ends of the two guiding frames coincide with each other to form a continuous sliding channel.

[0012] As a further scheme of the present invention: a coating head for coating is arranged at the bottom end of the coating tank, and two baffles are arranged at the bottom of the coating head. Two side plates are arranged on both sides of each baffle, and the side plates are fixedly connected to the coating tank. An inclined groove is opened on the outside of the side plate, a sliding rod is fixedly connected to the outside of the baffle, and the sliding rod extends into the inclined groove and is slidably connected to the side plate. A third spring is fixedly connected between the inclined groove and the side plate.

[0013] As a further scheme of the present invention: two storage frames are fixedly connected to the bottom of the limiting frame. A winding rod is rotatably connected to the inside of the two storage frames. Both ends of the winding rod are connected to the storage frames through clockwork springs to achieve reset, and a heat-insulating cloth is wound around the outside of the winding rod. One end of the heat-insulating cloth is fixedly connected to a traction plate, and a sliding plate is fixedly connected to the top of the traction plate.

[0014] As a further solution of the present invention: second sliding grooves are formed at the bottom of the limiting frame, the sliding plate extends into the second sliding grooves and is slidably connected to the limiting frame, and a sliding frame is fixedly connected to the outer side of the traction rod. The sliding frame is slidably connected to the outer side of the traction plate. When the traction rod moves, the traction plate is driven to move together through the sliding frame, so that the heat insulation cloth is wound and unfolded around the welding torch.

[0015] As a further solution of the present invention: a cleaning ring is arranged on the inner wall of the welding torch. The cleaning ring is fixedly connected to the inner wall of the welding torch through a support plate, and two cleaning frames are slidably connected to the outer side of the cleaning ring. A push rod is fixedly connected to the bottom of the cleaning frame, and the push rod is fixedly connected to the sliding plate.

[0016] As a further solution of the present invention: a groove is arranged inside the cleaning ring, a rotating rod is rotatably connected to the inside of the groove, the rotating rod is fixedly connected to the cleaning frame through a return spring, a scraping plate is fixedly connected to the outer side of the rotating rod, and a shape memory metal part is fixedly connected between the scraping plate and the cleaning frame. The shape memory metal part generates a preset deformation after being heated, so that one side of the scraping plate is in contact with the inner side of the welding torch.

[0017] A computer semiconductor soldering processing method is also provided, including the following steps:

[0018] Step 1: After positioning the semiconductor and the substrate, place them on the top of the welding table. At this time, drive the welding torch to move through the displacement device on the welding frame, so that the welding end of the welding torch is aligned with the pins of the semiconductor and the substrate;

[0019] Step 2: Drive the welding torch to move down through the displacement device, so that the two coating cans on the outer side of the welding torch are in contact with the pin welding area;

[0020] Step 3: Start the micro electric push rod. The micro electric push rod drives the push ring to descend, so that the two connecting pieces drive the two traction rods to move along the two ends of the limiting groove respectively, so that the coating cans at the bottom of the traction rods coat the solder blocking agent on the welding points of the substrate around the pins.

[0021] Compared with the prior art, the beneficial effects of the present invention are:

[0022] 1. The two connecting pieces drive the two traction rods to move along the two ends of the limiting groove respectively, so that the coating cans at the bottom of the traction rods coat the solder blocking agent on the welding points of the substrate around the pins, accurately coating the welding points. Through the physical isolation effect, the molten solder is restricted from spreading to non-target areas, avoiding short circuits or bridging between adjacent pins. By limiting the solder flow range, it ensures that the solder fills the solder joint gap along the preset path, forming a uniform wetting interface. At the same time, it can also prevent the solder from splashing and polluting the substrate surface, reducing secondary processing procedures such as cleaning and grinding. Only the resistance agent on the outer side of the substrate needs to be cleaned later, such as soaking and wiping with acetone or a special cleaning agent.

[0023] 2. When the sliding shaft contacts the tactile switch, the two electromagnets are energized. At this time, the two electromagnets generate magnetic adsorption. At this time, the two sliders move through the magnetic adsorption of the electromagnets and approach each other through the guide frame, so that the coating tank can move to the lower part of the chip pin bending position, thereby performing a complete annular coating on the welding area.

[0024] 3. The sliding frame on the traction rod drives the traction plate to move together, so that the traction plate pulls the heat insulation cloth to unfold around the welding torch. The two heat insulation cloths annularly block the nozzle of the welding torch. First, it can reduce the influence of high temperature on the solder on the surrounding pins. Second, it can also ensure that the generated temperature is more concentrated, ensure that the solder is heated more evenly, and avoid the out-of-control flow of the solder.

[0025] 4. When the welding is completed and the traction plate resets, the push rod is pulled by the sliding plate. At this time, the scraper on the cleaning frame contacts the inner wall of the welding torch to clean the carbon deposits on the inner wall of the welding torch. As the welding time increases, the shape memory metal part deforms more. At this time, the scraper contacts the welding torch more tightly, thereby improving the cleaning of the carbon deposits. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] The present invention will be further described below in conjunction with the drawings and embodiments.

[0027] Figure 1 is the overall structural schematic diagram of the present invention;

[0028] Figure 2 is the structural schematic diagram of the welding frame of the present invention;

[0029] Figure 3 is the structural schematic diagram of the welding torch of the present invention;

[0030] Figure 4 is the structural schematic diagram of the connecting member of the present invention;

[0031] Figure 5 is the structural schematic diagram of the limit frame of the present invention;

[0032] Figure 6 is the present invention Figure 5 A-part enlarged structural schematic diagram;

[0033] Figure 7 is the structural schematic diagram of the traction rod of the present invention;

[0034] Figure 8 is the sectional structural schematic diagram of the cleaning frame of the present invention;

[0035] Figure 9 is the structural schematic diagram of the storage frame of the present invention;

[0036] Figure 10 is the structural schematic diagram of the sliding member of the present invention;

[0037] Figure 11 It is a schematic structural diagram of the coated can of the present invention;

[0038] Figure 12 It is a schematic structural diagram of the semiconductor chip of the present invention.

[0039] In the figure: 1, welding table; 101, support frame; 2, welding frame; 201, displacement device; 3, welding torch; 4, pushing ring; 400, micro electric push rod; 401, limiting frame; 4011, limiting groove; 4012, touch switch; 402, connecting plate; 4021, sliding shaft; 403, telescopic rod; 404, first spring; 5, traction rod; 501, guiding frame; 502, sliding block; 503, second spring; 504, electromagnet; 505, sliding frame; 6, coated can; 600, coating head; 601, baffle; 602, side plate; 603, sliding rod; 604, inclined groove; 605, third spring; 7, cleaning ring; 701, pushing rod; 702, cleaning frame; 7021, rotating rod; 7022, return spring; 7023, shape memory metal piece; 7024, scraping plate; 8, storage frame; 800, winding rod; 801, heat insulation cloth; 802, traction plate; 803, sliding plate. Detailed implementation manners

[0040] Next, the technical solutions in the embodiments of the present invention will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present invention.

[0041] In the description of the present invention, it should be understood that the terms "opening", "upper", "lower", "thickness", "top", "middle", "length", "inner", "periphery", etc. indicating the orientation or positional relationship are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the components or elements referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of the present invention.

[0042] As Figures 1 to 12 shown, a computer semiconductor soldering processing device and method include the following embodiments:

[0043] Embodiment 1: As Figures 1 to 5 shown, it includes a welding table 1, a support frame 101 is fixedly connected to the top of the welding table 1, two groups of welding frames 2 are fixedly connected to the top of the welding table 1, welding torches 3 are arranged on the outer sides of the two groups of welding frames 2, and a displacement device 201 for moving is arranged between the welding frame 2 and the welding torch 3. The displacement device 201 can be combined by multiple moving modules, such as electric push rods and lead screw modules. By combining the telescoping of the electric push rod with the lead screw module, and a horizontal electric push rod is arranged at the moving end of the lead screw module, and the telescoping end of the horizontal electric push rod is fixedly connected to the welding torch 3, so that the welding torch 3 can weld the semiconductor chips and substrates at multiple positions. It also includes:

[0044] A limiting frame 401 fixedly connected to the outer side of the welding end of the welding torch 3, a limiting groove 4011 is formed on the outer side of the limiting frame 401, and touch switches 4012 are arranged at both ends of the limiting groove 4011;

[0045] Two traction rods 5, both of the two traction rods 5 are arranged on the outer side of the limiting frame 401 and are symmetrically arranged. Guide frames 501 are fixedly connected to the bottom ends of the two traction rods 5. A coating tank 6 is connected to the inside of the guide frame 501 through a sliding member. The coating tank 6 is used for coating a flow blocker on the welding points of the pins and the substrate;

[0046] A connecting member is arranged between the traction rod 5 and the limiting frame 401. A micro electric push rod 400 is fixedly connected to the outer side of the welding torch 3. The telescopic end of the micro electric push rod 400 is fixedly connected to the pushing ring 4. When the pushing ring 4 descends, the two connecting members slide symmetrically around the pushing ring 4 along the limiting groove 4011.

[0047] During specific implementation, during the brazing process, the pins in the semiconductor are welded to the substrate by melting the brazing filler metal. However, due to the fluidity of the melted brazing filler metal, when it flows to other positions, it is easy to cause brazing filler metal overflow or bridging, resulting in surface contamination or short - circuit risk brazing in non - welding areas. Therefore, in this solution: After positioning the semiconductor and the substrate, they are placed on the top of the welding table 1. At this time, the displacement device 201 on the welding frame 2 drives the welding torch 3 to move, so that the welding end of the welding torch 3 is aligned with the pins of the semiconductor and the substrate. The displacement device 201 drives the welding torch 3 to move downward, so that the two coating tanks 6 on the outer side of the welding torch 3 contact the welding area of the pins. The micro electric push rod 400 is started, and the micro electric push rod 400 drives the pushing ring 4 to descend, so that the two connecting members drive the two traction rods 5 to move along both ends of the limiting groove 4011 respectively, so that the coating tank 6 at the bottom of the traction rod 5 coats the flow blocker on the substrate welding point around the pin, precisely coats the welding point, restricts the diffusion of the molten brazing filler metal to non - target areas through physical isolation, avoids short - circuit or bridging between adjacent pins, ensures that it fills the solder joint gap along the preset path by limiting the flow range of the solder, forms a uniformly wetted interface, and at the same time can also avoid solder splashing and contaminating the substrate surface, reducing secondary processing procedures such as cleaning and grinding. Only the resistance agent on the outer side of the substrate needs to be cleaned later, such as soaking and wiping with acetone or a special cleaning agent.

[0048] Embodiment Two: As Figures 5 to 7As shown in the figure, the connecting member includes a connecting plate 402 disposed outside the limiting frame 401. A sliding shaft 4021 is fixedly connected to one side of the connecting plate 402. The sliding shaft 4021 extends into the limiting groove 4011 and slides with the limiting frame 401. When the sliding shaft 4021 slides to the bottom end of the limiting groove 4011, it contacts the touch switch 4012. A first chute is formed at the bottom of the pushing ring 4. The top of the connecting plate 402 extends into the first chute and is slidably connected to the pushing ring 4. A first spring 404 and a telescopic rod 403 are fixedly connected between the connecting plate 402 and the traction rod 5, and the first spring 404 is sleeved outside the telescopic rod 403.

[0049] The sliding member includes a sliding block 502. The sliding block 502 is slidably connected inside the guiding frame 501. A second spring 503 is fixedly connected between the sliding block 502 and the traction rod 5. An electromagnet 504 is fixedly connected to the side of the sliding block 502 away from the second spring 503. The electromagnet 504 is electrically connected to the touch switch 4012. When the touch switch 4012 is triggered, the two electromagnets 504 are electromagnetically attracted. When the connecting member drives the traction rod 5 to move to the trigger position of the touch switch 4012, one ends of the two guiding frames 501 coincide with each other to form a continuous sliding channel.

[0050] During specific implementation, when welding the pins of a semiconductor chip to a substrate, the pins to be welded are often bent. As Figure 12 shown in the figure, during the coating process, the area near the chip at the pins cannot be coated, which will cause the coating to flow towards the chip. Therefore, in this solution, before welding, the welding torch 3 descends so that the two coating tanks 6 around the lower part of the welding torch 3 contact the substrate. At this time, the micro electric push rod 400 is started. The micro electric push rod 400 pushes the pushing ring 4 to descend, and the pushing ring 4 pushes the two connecting plates 402 at the bottom to descend. Since the sliding shafts 4021 fixedly connected to the outside of the connecting plates 402 extend into the limiting grooves 4011, and the bottom of the pushing ring 4 is slidably connected to the bottom of the connecting plates 402 through the first chute, when the pushing ring 4 descends, the pushing ring 4 pushes the connecting plates 402 to slide down along the limiting grooves 4011. During the movement of the connecting plates 402, the traction rod 5 is driven to slide together through the first spring 404 and the telescopic rod 403, so that the two coating tanks 6 at the bottom of the traction rod 5 move relatively around the outside of the welding torch 3 along with the two connecting plates 402 to form an annular coating area;

[0051] And when the sliding shaft 4021 moves to the bottom end of the limit groove 4011, one end of the guide frame 501 fixedly connected to the outside of the two traction rods 5 coincides at this time, so that the two guide frames 501 communicate with each other. At this time, when the sliding shaft 4021 contacts the touch switch 4012, the two electromagnets 504 are energized. At this time, the two electromagnets 504 generate magnetic adsorption. At this time, the two sliders 502 move through the magnetic attraction of the electromagnets 504 and approach each other through the guide frame 501, so that the coating tank 6 can move below the bending position of the chip pins, thereby performing a complete annular coating on the welding area.

[0052] In this embodiment, as Figure 11 shown, a coating head 600 for coating is provided at the bottom end of the coating tank 6, and two baffles 601 are provided at the bottom of the coating head 600. Two side plates 602 are provided on both sides of the baffle 601, and the side plates 602 are fixedly connected to the coating tank 6. An inclined groove 604 is provided on the outside of the side plate 602. A sliding rod 603 is fixedly connected to the outside of the baffle 601. The sliding rod 603 extends into the inclined groove 604 and is slidably connected to the side plate 602, and a third spring 605 is fixedly connected between the inclined groove 604 and the side plate 602.

[0053] During specific implementation, when the coating tank 6 descends, in order to avoid the situation of dripping before the coating head 600 moves, two baffles 601 are provided below the coating head 600 in this solution. When the baffle 601 contacts the substrate, the baffle 601 slides in the inclined groove 604 provided on the outside of the side plate 602 through the sliding rods 603 on both sides, so that the baffle 601 moves to both sides, exposing the coating head 600, so that the coating head 600 can contact the coating substrate position. When the coating tank 6 rises each time, the inclined groove 604 can quickly push the baffle 601 to reset through the action of the third spring 605 to block the coating head 600 and avoid the situation of dripping affecting the substrate. At the same time, a cleaning brush can be provided at the bottom of one of the baffles 601. When the coating tank 6 moves, the cleaning brush below the baffle 601 can clean the path to be coated on the substrate in advance to ensure that the flow blocker will not be affected by dust or impurities in its flow blocking effect.

[0054] Embodiment Three: As Figures 7 to 10 shown, two storage frames 8 are fixedly connected to the bottom of the limit frame 401. A winding rod 800 is rotatably connected inside the two storage frames 8. Both ends of the winding rod 800 are connected to the storage frame 8 through a clockwork spring to achieve reset. An insulating cloth 801 is wound around the outside of the winding rod 800, and one end of the insulating cloth 801 is fixedly connected to a traction plate 802. A sliding plate 803 is fixedly connected to the top of the traction plate 802.

[0055] The bottom of the limit frame 401 is provided with second sliding grooves, the sliding plate 803 extends into the second sliding grooves and is slidably connected to the limit frame 401, and a sliding frame 505 is fixedly connected to the outside of the traction rod 5. The sliding frame 505 is slidably connected to the outside of the traction plate 802. When the traction rod 5 moves, the traction plate 802 is driven to move together through the sliding frame 505, so that the heat insulation cloth 801 is wound and unfolded around the welding torch 3.

[0056] During specific implementation, during the brazing process, the pins of the chip are often relatively close. When the welding torch 3 performs welding, its high temperature will affect the surrounding pins and the brazing filler metal, and heat will be lost during the welding process. Therefore, in this solution, after the two traction rods 5 move annularly around the welding torch 3, the traction plate 802 is driven to move together through the sliding frame 505 on the traction rod 5, so that the traction plate 802 pulls the heat insulation cloth 801 to unfold around the welding torch 3. The two heat insulation cloths 801 annularly block the nozzle of the welding torch 3. First, it can reduce the influence of high temperature on the brazing filler metal on the surrounding pins. Second, it can also ensure that the generated temperature is more concentrated, ensure that the brazing filler metal is heated more evenly, and avoid the out-of-control flow of the brazing filler metal. The heat insulation cloth 801 is coated with a high-temperature resistant material on its surface.

[0057] Embodiment 4: As Figures 7 to 8 shown, a cleaning ring 7 is arranged on the inner wall of the welding torch 3. The cleaning ring 7 is fixedly connected to the inner wall of the welding torch 3 through a support plate, and two cleaning frames 702 are slidably connected to the outside of the cleaning ring 7. A push rod 701 is fixedly connected to the bottom of the cleaning frame 702, and the push rod 701 is fixedly connected to the sliding plate 803.

[0058] A groove is arranged inside the cleaning ring 7. A rotating rod 7021 is rotatably connected to the inside of the groove. The rotating rod 7021 is fixedly connected to the cleaning frame 702 through a return spring 7022. A scraping plate 7024 is fixedly connected to the outside of the rotating rod 7021, and a shape memory metal part 7023 is fixedly connected between the scraping plate 7024 and the cleaning frame 702. The shape memory metal part 7023 generates a preset deformation when heated, so that one side of the scraping plate 7024 is in contact with the inner side of the welding torch 3.

[0059] During specific implementation, during the high-temperature welding process, a large amount of carbon deposition often appears on the inner wall of the welding torch 3. In this solution, a cleaning ring 7 is arranged inside the welding torch 3. When the traction plate 802 moves, it drives the fixedly connected sliding plate 803 to move. The sliding plate 803 drives the cleaning frame 702 sliding inside the cleaning ring 7 through the push rod 701. When the welding torch 3 is not in use, the temperature inside the welding torch 3 does not rise. After welding, the temperature inside the welding torch 3 increases. At this time, the memory metal part 7023 fixedly connected between the scraping plate 7024 inside the cleaning frame 702 and the cleaning frame 702 will deform. The memory metal part 7023 will extend. The memory metal part 7023 is made of a high-temperature deformation metal. At this time, the rotating rod 7021 fixedly connected to the outside of the scraping plate 7024 makes the scraping plate 7024 approach the inner wall of the welding torch 3 through the return spring 7022. When the welding is completed and the traction plate 802 returns to its original position, the push rod 701 is pulled through the sliding plate 803. At this time, the scraping plate 7024 on the cleaning frame 702 contacts the inner wall of the welding torch 3, cleaning the carbon deposition on the inner wall of the welding torch 3. And the longer the welding time, the greater the deformation of the memory metal part 7023. At this time, the scraping plate 7024 contacts the welding torch 3 more tightly, thereby improving the cleaning of the carbon deposition.

[0060] A computer semiconductor brazing processing method is also provided, including the following steps:

[0061] Step 1: After positioning the semiconductor and the substrate, place them on the top of the welding table 1. At this time, drive the welding torch 3 to move through the displacement device 201 on the welding frame 2, so that the welding end of the welding torch 3 is aligned with the pins of the semiconductor and the substrate;

[0062] Step 2: Drive the welding torch 3 to move downward through the displacement device 201, so that the two coating cans 6 outside the welding torch 3 contact the pin welding area;

[0063] Step 3: Start the micro electric push rod 400. The micro electric push rod 400 drives the push ring 4 to descend, so that the two connecting pieces drive the two traction rods 5 to move along both ends of the limiting groove 4011 respectively, so that the coating cans 6 at the bottom of the traction rods 5 coat the substrate welding points with a flow resistance agent around the pins.

[0064] At the same time, the content not described in detail in this specification belongs to the well-known prior art in the art.

[0065] In the description of this specification, the description referring to terms such as "one embodiment", "example", "specific example", etc. means that the specific features, structures, materials or characteristics described in connection with the embodiment or example are included in at least one embodiment or example of the present invention. In this specification, the schematic representations of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in a suitable manner in any one or more embodiments or examples.

[0066] The preferred embodiments of the present invention disclosed above are only used to help illustrate the present invention. The preferred embodiments do not describe all the details in detail, nor do they limit the invention to only the specific embodiments. Obviously, many modifications and variations can be made according to the content of this specification. These embodiments are selected and specifically described in this specification in order to better explain the principles and practical applications of the present invention, so that those skilled in the art can well understand and utilize the present invention. The present invention is only limited by the claims and their full scope and equivalents.

Claims

1. A computer semiconductor brazing processing device, comprising a welding table (1), a support frame (101) fixedly connected to the top of the welding table (1), two welding frames (2) fixedly connected to the top of the welding table (1), welding torches (3) are arranged on the outer sides of the two welding frames (2), and a displacement device (201) for moving is arranged between the welding frame (2) and the welding torch (3), characterized in that, It further includes: A limit frame (401) fixedly connected to the outside of the welding end of the welding torch (3). A limit groove (4011) is provided on the outside of the limit frame (401), and touch switches (4012) are provided at both ends of the limit groove (4011); Two traction rods (5). Both of the two traction rods (5) are arranged on the outside of the limit frame (401) and are symmetrically arranged. Guide frames (501) are fixedly connected to the bottom ends of the two traction rods (5). A coating tank (6) is connected to the inside of the guide frame (501) through a sliding member. The coating tank (6) is used for coating a flow blocker on the solder joints between the pins and the substrate; A connecting member is provided between the traction rod (5) and the limit frame (401). A micro electric push rod (400) is fixedly connected to the outside of the welding torch (3). The telescopic end of the micro electric push rod (400) is fixedly connected to the pushing ring (4). When the pushing ring (4) descends, the two connecting members slide symmetrically around the pushing ring (4) along the limit groove (4011).

2. The computer semiconductor brazing processing device according to claim 1, wherein: The connecting member includes a connecting plate (402) arranged on the outside of the limit frame (401). A sliding shaft (4021) is fixedly connected to one side of the connecting plate (402). The sliding shaft (4021) extends into the limit groove (4011) and slides with the limit frame (401). When the sliding shaft (4021) slides to the bottom end of the limit groove (4011), it contacts the touch switch (4012). A first chute is provided at the bottom of the pushing ring (4). The top of the connecting plate (402) extends into the first chute and is slidably connected to the pushing ring (4). A first spring (404) and a telescopic rod (403) are fixedly connected between the connecting plate (402) and the traction rod (5), and the first spring (404) is sleeved outside the telescopic rod (403).

3. A computer semiconductor brazing processing device according to claim 1, characterized in that: The sliding member includes a sliding block (502). The sliding block (502) is slidably connected to the inside of the guide frame (501). A second spring (503) is fixedly connected between the sliding block (502) and the traction rod (5). An electromagnet (504) is fixedly connected to the side of the sliding block (502) away from the second spring (503). The electromagnet (504) is electrically connected to the touch switch (4012). When the touch switch (4012) is triggered, the two electromagnets (504) are electrified and attract each other. When the connecting member drives the traction rod (5) to move to the trigger position of the touch switch (4012), one ends of the two guide frames (501) coincide with each other to form a continuous sliding channel.

4. A computer semiconductor soldering processing device according to claim 1, characterized in that: A coating head (600) for coating is provided at the bottom end of the coating tank (6). Two baffles (601) are provided at the bottom of the coating head (600). Two side plates (602) are provided on both sides of the baffle (601). The side plates (602) are fixedly connected to the coating tank (6). An inclined groove (604) is provided on the outside of the side plate (602). A sliding rod (603) is fixedly connected to the outside of the baffle (601). The sliding rod (603) extends into the inclined groove (604) and is slidably connected to the side plate (602). A third spring (605) is fixedly connected between the inclined groove (604) and the side plate (602).

5. A computer semiconductor brazing processing device according to claim 3, characterized in that: Two storage frames (8) are fixedly connected to the bottom of the limiting frame (401). A winding rod (800) is rotatably connected inside the two storage frames (8). Both ends of the winding rod (800) are connected to the storage frame (8) through a clockwork spring to achieve reset. An insulating cloth (801) is wound around the outer side of the winding rod (800). One end of the insulating cloth (801) is fixedly connected to a traction plate (802). The top of the traction plate (802) is fixedly connected to a sliding plate (803).

6. The computer semiconductor brazing processing device according to claim 5, wherein: Second chutes are formed at the bottom of the limiting frame (401). The sliding plate (803) extends into the second chute and is slidably connected to the limiting frame (401). A sliding frame (505) is fixedly connected to the outer side of the traction rod (5). The sliding frame (505) is slidably connected to the outer side of the traction plate (802). When the traction rod (5) moves, the traction plate (802) is driven to move together through the sliding frame (505), so that the insulating cloth (801) is wound and unfolded around the welding torch (3).

7. A computer semiconductor soldering processing device according to claim 6, characterized in that: A cleaning ring (7) is arranged on the inner wall of the welding torch (3). The cleaning ring (7) is fixedly connected to the inner wall of the welding torch (3) through a support plate. Two cleaning frames (702) are slidably connected to the outer side of the cleaning ring (7). A push rod (701) is fixedly connected to the bottom of the cleaning frame (702). The push rod (701) is fixedly connected to the sliding plate (803).

8. A computer semiconductor soldering processing device according to claim 7, characterized in that: A groove is arranged inside the cleaning ring (7). A rotating rod (7021) is rotatably connected inside the groove. The rotating rod (7021) is fixedly connected to the cleaning frame (702) through a return spring (7022). A scraping plate (7024) is fixedly connected to the outer side of the rotating rod (7021). A shape memory metal part (7023) is fixedly connected between the scraping plate (7024) and the cleaning frame (702). The shape memory metal part (7023) generates a preset deformation after being heated, so that one side of the scraping plate (7024) is in contact with the inner side of the welding torch (3).

9. A computer semiconductor soldering processing method, applicable to a computer semiconductor soldering processing device as described in any one of claims 1 to 8, characterized in that: It includes the following steps: Step 1: After positioning the semiconductor and the substrate, place them on the top of the welding table (1). At this time, drive the welding torch (3) to move through the displacement device (201) on the welding frame (2), so that the welding end of the welding torch (3) is aligned with the pins of the semiconductor and the substrate; Step 2: Drive the welding torch (3) to move downward through the displacement device (201), so that the two coating cans (6) outside the welding torch (3) are in contact with the pin welding area; Step 3: Start the micro electric push rod (400). The micro electric push rod (400) drives the push ring (4) to descend, so that the two connecting pieces drive the two traction rods (5) to move along the two ends of the limiting groove (4011) respectively, so that the coating cans (6) at the bottom of the traction rods (5) coat the welding points of the substrate with a flow blocking agent around the pins.

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