An assembly device for aluminum alloy extrusion

Abstract

This application relates to an assembly device for aluminum alloy extrusion, belonging to the field of industrial production equipment. It includes an assembly base, a reference detection cavity, a first adjustment module, a second adjustment module, a laser signal emission module and an annular diversion piece, a position adjustment module arranged in the reference detection cavity, and a signal receiving disk arranged on the position adjustment module. The first adjustment module is used to adjust the planar position of the first dividing die and drive the first dividing die to rotate on the horizontal plane. The second adjustment module is used to adjust the planar position of the second dividing die and drive the second dividing die to move in the vertical direction. The laser signal emission module is used to emit detection light rays to the detection surface of the second dividing die. The assembly device for aluminum alloy extrusion disclosed in this application uses a non-contact laser detection method to adjust the position alignment during the die installation process. This method can detect in the circumferential direction and at different height positions, providing reference data for position adjustment.

Description

Technical Field

[0001] This application relates to the field of industrial production equipment, and particularly to an assembly device for aluminum alloy extrusion. Background Art

[0002] Aluminum alloy extrusion is a processing technology that plastically forms aluminum alloy materials through a mold, and is widely used in the field of industrial manufacturing. Its basic principle is to place a heated and softened aluminum alloy blank (aluminum rod or ingot) in an extrusion cylinder, and force the metal to flow through a mold with a specific shape under high pressure to form profiles or pipes with the required cross-sectional profiles.

[0003] A core component in the extrusion process is the mold. The maintenance of the mold includes temperature control, cleaning, surface treatment, and trimming, etc. Among them, cleaning, surface treatment, and trimming involve disassembly, installation, and reinstallation.

[0004] Insufficient accuracy in the reinstallation process will lead to problems such as rapid wear of the mold, local wear of the mold, unstable production process, and decline in product quality. Currently, the reinstallation of the module mainly relies on manual operation. The process adopts methods such as scribing for positioning and using a feeler gauge for detection, and at the same time relies on the positioning structure on the mold to carry out.

[0005] However, with the increasing complexity of the mold and the refinement of its size, the implementation of the above methods becomes more and more difficult. The main reasons include that the deformation of the mold caused during use will reduce the accuracy of the positioning structure, and the decrease in the width of the mold gap and the change in the structure make it difficult for the feeler gauge to enter. Summary of the Invention

[0006] This application provides an assembly device for aluminum alloy extrusion, which uses a non-contact laser detection method to adjust the position alignment during the mold installation process. This method can detect in the circumferential direction and at different height positions, providing reference data for position adjustment.

[0007] The above object of this application is achieved through the following technical solutions:

[0008] This application provides an assembly device for aluminum alloy extrusion, including:

[0009] An assembly base, on which a reference detection cavity is provided;

[0010] A first adjustment module, arranged on the assembly base, and the first adjustment module is used to adjust the planar position of the first dividing die and drive the first dividing die to rotate on the horizontal plane;

[0011] A second adjustment module, arranged on the assembly base, and the second adjustment module is used to adjust the planar position of the second dividing die and drive the second dividing die to move in the vertical direction;

[0012] The laser signal emission module is arranged on the assembly base, and the laser signal emission module is used to emit detection light rays to the detection surface of the second flow splitter mold;

[0013] The annular flow guide member is arranged on the assembly base, and the annular flow guide member is used to guide the detection light rays reflected on the detection surface of the second flow splitter mold to the detection surface of the first flow splitter mold;

[0014] The position adjustment module is arranged in the reference detection cavity;

[0015] The signal receiving disk is arranged on the position adjustment module, and there are at least a set of symmetrically arranged signal receiving sensors on the signal receiving disk;

[0016] Wherein, the reference detection cavity is located below the first adjustment module;

[0017] The position adjustment module adjusts the planar position of the signal receiving disk and drives the signal receiving disk to rotate on the horizontal plane.

[0018] In a possible implementation manner of the present application, the first adjustment module includes:

[0019] The first linear module is arranged on the assembly base, and the first linear module is used to adjust the planar position of the first flow splitter mold;

[0020] The rotating table is arranged on the first linear module; the rotating table is used to drive the first flow splitter mold to rotate on the horizontal plane.

[0021] In a possible implementation manner of the present application, the second adjustment module includes:

[0022] The second linear module is arranged on the assembly base, and the second linear module is used to adjust the planar position of the second flow splitter mold;

[0023] The lifter is arranged on the second linear module, and the lifter is used to drive the second flow splitter mold to move in the vertical direction.

[0024] In a possible implementation manner of the present application, the laser signal emission module includes:

[0025] The angle adjustment turntable is arranged on the assembly base;

[0026] The laser signal emitter is arranged on the angle adjustment turntable;

[0027] Wherein, the angle adjustment turntable is used to adjust the incident angle of the laser signal emitter.

[0028] In a possible implementation manner of the present application, the annular flow guide member includes:

[0029] The lifting brackets symmetrically arranged on the assembly base;

[0030] The linear expander is arranged on the lifting bracket;

[0031] The diversion half-ring is detachably fixed on the linear expander.

[0032] In a possible implementation manner of the present application, the position adjustment module includes:

[0033] The third linear module is arranged on the assembly base;

[0034] The electric turntable is arranged on the third linear module, and the third linear module is used to adjust the planar position of the electric turntable.

[0035] In a possible implementation manner of the present application, there are multiple groups of symmetrically arranged signal receiving sensors on the signal receiving disk, and the distances between each group of symmetrically arranged signal receiving sensors are all different.

[0036] In a possible implementation manner of the present application, the shape of the detection surface of the signal receiving sensor is circular.

[0037] In a possible implementation manner of the present application, it further includes a display module electrically connected to the signal receiving sensors, and the display module is used to simultaneously display the receiving point positions on the detection surfaces of a group of symmetrically arranged signal receiving sensors. Description of the Drawings

[0038] Figure 1 It is a structural schematic diagram of an extrusion die provided by the present application.

[0039] Figure 2 It is a structural schematic diagram of an assembly device for aluminum alloy extrusion provided by the present application.

[0040] Figure 3 It is a path schematic diagram of detecting light provided by the present application.

[0041] Figure 4 It is a schematic diagram of temporarily fixing the die provided by the present application.

[0042] Figure 5 It is a distribution schematic diagram of the signal receiving sensors on the signal receiving disk provided by the present application.

[0043] Figure 6 It is a working principle schematic diagram of the signal receiving sensor provided by the present application.

[0044] Figure 7 It is a schematic diagram of generating a curve based on the data generated by the signal receiving sensor provided by the present application.

[0045] Figure 8 It is a structural schematic diagram of a first adjustment module provided by the present application.

[0046] Figure 9 This is a structural schematic diagram of a second adjustment module provided by the present application.

[0047] Figure 10 This is a structural schematic diagram of a laser signal emission module provided by the present application.

[0048] Figure 11 This is a structural schematic diagram of an annular flow guide provided by the present application.

[0049] Figure 12 This is a structural schematic diagram of a position adjustment module provided by the present application.

[0050] Figure 13 This is a structural schematic block diagram of a display module provided by the present application.

[0051] In the figure, 1. Assembly base, 2. First adjustment module, 3. Second adjustment module, 4. Laser signal emission module, 5. Annular flow guide, 6. Position adjustment module, 7. Signal receiving disc, 8. Display module, 11. Reference detection cavity, 21. First linear module, 22. Rotating table, 31. Second linear module, 32. Lifter, 33. Optical bar, 41. Angle adjustment turntable, 42. Laser signal emitter, 51. Lifting bracket, 52. Linear expander, 53. Flow guide semi-ring, 61. Third linear module, 62. Electric turntable, 71. Signal receiving sensor. Specific embodiments

[0052] The following further elaborates on the technical solutions in the present application with reference to the accompanying drawings.

[0053] The assembly device for aluminum alloy extrusion disclosed in the present application is mainly used for mold position adjustment and mold assembly during the aluminum alloy extrusion production process. Please refer to Figure 1 , where mold position adjustment refers to adjusting the relative position of the first and second dividing dies, and mold assembly refers to assembling the first dividing die ( Figure 1 The die core located in the upper middle position in is connected to the surrounding structure through a flow dividing bridge (not shown)) and the second dividing die ( Figure 1 Located below in).

[0054] Through Figure 1 It can be seen that when the relative position of the first and second dividing dies in the horizontal direction is inaccurate, it will cause uneven thickness at the die exit. On the one hand, it will lead to uneven product thickness and potential internal and surface defects. On the other hand, it will also cause additional wear and reduced service life of the die core due to uneven stress.

[0055] This application discloses an assembly device for aluminum alloy extrusion. In some examples, the assembly device for aluminum alloy extrusion disclosed in this application includes an assembly base 1, a first adjustment module 2, a second adjustment module 3, a laser signal emission module 4, an annular flow guide 5, a position adjustment module 6, and a signal receiving disk 7.

[0056] Please refer to Figure 2 , there is a reference detection cavity 11 on the assembly base 1. Here, taking the posture of the assembly base 1 placed on the horizontal plane as a reference, the reference detection cavity 11 is located on the upper surface of the assembly base 1.

[0057] The first adjustment module 2, the second adjustment module 3, the laser signal emission module 4, and the annular flow guide 5 are all installed on the assembly base 1. The first adjustment module 2 is used to adjust the planar position of the first split die and drive the first split die to rotate on the horizontal plane. The second adjustment module 3 is used to adjust the planar position of the second split die and drive the second split die to move in the vertical direction. The laser signal emission module 4 is used to emit detection light rays to the detection surface of the second split die. The annular flow guide 5 is used to guide the detection light rays reflected on the detection surface of the second split die to the detection surface of the first split die, as Figure 3 shown.

[0058] A specific process will be described in combination:

[0059] First, place the first split die on the first adjustment module 2. The specific fixing method is as Figure 4 shown. The annular fixing ring is sleeved on the first split die and temporarily fixed with bolts around. Place the second split die on the second adjustment module 3, and the fixing method is the same.

[0060] Then start the preliminary position adjustment. Specifically, adjust the position of the first split die on the horizontal plane. After the adjustment is completed, adjust the height of the second split die according to the preliminarily measured optical path.

[0061] Then the laser signal emission module 4 emits detection light rays to the detection surface of the second split die. The detection light rays are reflected on the detection surface of the second split die and then reflected again on the annular flow guide 5, and then shoot towards the detection surface of the first split die.

[0062] The above process also requires the staff to make adjustments. Here, mainly adjust the height of the second split die and the reflection position provided by the annular flow guide 5 so that the detection light rays shoot towards the detection surface of the first split die.

[0063] Please refer to Figure 3 , Figure 5 and Figure 6, detect the light reflected at the detection surface of the first shunt die and then shoot towards the signal receiving disk 7. The function of the signal receiving disk 7 is to convert the received optical signal into an electrical signal, and the electrical signal can be displayed using position coordinates. Based on this, it can be judged whether the relative positions of the first shunt die and the second shunt die are appropriate.

[0064] The position adjustment module 6 is fixedly installed in the reference detection cavity 11, and the reference detection cavity 11 is located below the first adjustment module 2.

[0065] The signal receiving disk 7 is installed on the position adjustment module 6. The function of the position adjustment module 6 is to adjust the planar position of the signal receiving disk 7 and drive the signal receiving disk 7 to rotate on the horizontal plane.

[0066] The function of adjusting the planar position of the signal receiving disk 7 is to make the axis of the signal receiving disk 7 and the axis of the first shunt die or the second shunt die be on the same straight line. The function of driving the signal receiving disk 7 to rotate on the horizontal plane is to cooperate with the position adjustment of the laser signal emission module 4.

[0067] The purpose of the position adjustment of the laser signal emission module 4 is to emit detection light at different positions, aiming to make the finally obtained position adjustment amount more accurate through the multi-position detection method.

[0068] During the detection process described above, the first adjustment module 2 will drive the first shunt die to rotate. At this time, it is equivalent to the relative movement between a detection point on the second shunt die and a detection line (circular) on the first shunt die.

[0069] Please refer to Figure 6 and Figure 7 , if the relative positions of the first shunt die and the second shunt die on the horizontal plane are accurate, at this time, for the signal receiving disk 7, the detected line it outputs is a straight line or a curve that jumps within the allowable range; if the relative positions of the first shunt die and the second shunt die on the horizontal plane are inaccurate, at this time, for the signal receiving disk 7, the detected line it outputs is a curve that jumps outside the allowable range.

[0070] Furthermore, through the comparison of the two curves, the specific adjustment direction and adjustment amount can be determined. At the same time, after further adjustment and retesting, problems such as local deformation and inclination can also be found.

[0071] There is at least one set of symmetrically arranged signal receiving sensors 71 on the signal receiving disk 7. This means that the number of laser signal emission modules 4 is two, and the two laser signal emission modules 4 and a set of symmetrically arranged signal receiving sensors 71 need to work simultaneously in the initial stage.

[0072] Specifically, at this time, the positions of the detected light rays fed back by a set of symmetrically arranged signal receiving sensors 71 should be the same, which is the initial reference standard.

[0073] In some examples, refer to Figure 8 , the first adjustment module 2 includes a first linear module 21 and a turntable 22. The first linear module 21 is installed on the assembly base 1, and the turntable 22 is installed on the first linear module 21. The first linear module 21 provides lateral (X-axis) and longitudinal (Y-axis) movements on the horizontal plane, and the turntable 22 provides rotation (Z-axis) on the horizontal plane.

[0074] When the size is inappropriate, the first adjustment module 2 can also be fixedly installed on the reference detection cavity 11 through a column.

[0075] In some examples, refer to Figure 9 , the second adjustment module 3 includes a second linear module 31 and a lifter 32. The second linear module 31 is installed on the assembly base 1, and the lifter 32 is installed on the second linear module 31. The second linear module 31 provides lateral (X-axis) and longitudinal (Y-axis) movements on the horizontal plane, and the lifter 32 provides movement in the vertical direction (Z-axis).

[0076] When the weight of the mold is large, a light bar 33 can be added to prevent the mold from tilting, as shown in Figure 9 .

[0077] In some examples, refer to Figure 10 , the laser signal emission module 4 includes an angle adjustment turntable 41 and a laser signal emitter 42. The angle adjustment turntable 41 is installed on the assembly base 1, and the laser signal emitter 42 is installed on the angle adjustment turntable 41. The angle adjustment turntable 41 is used to adjust the incident angle of the laser signal emitter 42.

[0078] In some possible implementation manners, a lifter is further added to the laser signal emission module 4. The lifter is fixedly installed on the assembly base 1, and the angle adjustment turntable 41 is transferred to the lifter. The function of the lifter is to adjust the height of the laser signal emission module 4, aiming to adapt to molds of different specifications.

[0079] In some possible implementation manners, two sets of laser signal emission modules 4 share one lifter.

[0080] In some examples, refer to Figure 11, the annular flow guide member 5 includes lifting brackets 51 symmetrically arranged on the assembly base 1, linear expanders 52 fixedly installed on the lifting brackets 51, and flow guide half-rings 53 detachably fixed on the linear expanders 52. The lifting brackets 51 are responsible for providing height adjustment, and the linear expanders 52 are responsible for providing lateral adjustment. The two work together to achieve the optical path adjustment function described above.

[0081] Please refer to Figure 12 , the position adjustment module 6 includes a third linear module 61 and an electric turntable 62. The third linear module 61 is fixedly installed on the assembly base 1, and the electric turntable 62 is arranged on the third linear module 61. The structure and function of the position adjustment module 6 are the same as those of the first adjustment module 2, and will not be elaborated here.

[0082] In some examples, there are multiple groups of symmetrically arranged signal receiving sensors 71 on the signal receiving disk 7, and the spacing between each group of symmetrically arranged signal receiving sensors 71 is different. This is because when the specifications and related dimensions of the mold change, the relative positions between a group of signal receiving sensors 71 also need to change.

[0083] The function of adding multiple groups of signal receiving sensors 71 is that when the above changes occur, one of the groups of signal receiving sensors 71 can be directly called for use.

[0084] In some examples, please refer to

[0085] The detection surface of the signal receiving sensor 71 is circular in shape, aiming to receive the detection light as much as possible. It should be understood that when the detection light is reflected, the incident light and the reflected light should be in the same plane. However, when the detection light is reflected multiple times, the last reflected light and the initial incident light cannot be guaranteed to be in the same plane.

[0086] In some examples, please refer to Figure 13 , a display module 8 electrically connected to the signal receiving sensors 71 is added. The display module 8 is used to simultaneously display the receiving point positions on the detection surfaces of a group of symmetrically arranged signal receiving sensors 71, so that the staff can conveniently determine the adjustment direction and adjustment amount by observing the display module 8.

[0087] It should be understood that the signal receiving sensors 71 in this application use CMOS sensors, and the sensor data needs to be received through an FPGA or a microcontroller (such as STM32), processed, and then output to the display through a VGA or HDMI interface.

[0088] A feasible hardware link is as follows: signal receiving sensor 71 (DVP interface) → FPGA → HDMI encoding chip → display. Based on this, the display module 8 in this application can be composed of three parts: FPGA (microcontroller), HDMI encoding chip, and display.

[0089] In addition, for the actuators mentioned in the previous content, their power is all supplied by servo motors or stepper motors. The servo motors or stepper motors are connected to the corresponding control chips, and these control chips are connected to a microcontroller (such as STM32) for control. The relevant action adjustments are realized by control buttons, and the control buttons are connected to the communication pins of the microcontroller through the corresponding communication circuits.

[0090] The embodiments of this specific implementation manner are all preferred embodiments of this application, and do not limit the protection scope of this application accordingly. Therefore, all equivalent changes made according to the structure, shape, and principle of this application should be covered within the protection scope of this application.

Claims

1. An assembly device for aluminum alloy extrusion, characterized in that, Comprising: An assembly base (1) provided with a reference detection cavity (11) thereon; A first adjustment module (2) provided on the assembly base (1), the first adjustment module (2) being used to adjust the planar position of the first diverter die and drive the first diverter die to rotate on a horizontal plane; A second adjustment module (3) provided on the assembly base (1), the second adjustment module (3) being used to adjust the planar position of the second diverter die and drive the second diverter die to move in the vertical direction; A laser signal emission module (4) provided on the assembly base (1), the laser signal emission module (4) being used to emit detection light rays towards the detection surface of the second diverter die; An annular flow guide member (5) provided on the assembly base (1), the annular flow guide member (5) being used to guide the detection light rays reflected on the detection surface of the second diverter die to the detection surface of the first diverter die; A position adjustment module (6) provided within the reference detection cavity (11); A signal receiving disk (7) provided on the position adjustment module (6), with at least one set of symmetrically arranged signal receiving sensors (71) on the signal receiving disk (7); Wherein, the reference detection cavity (11) is located below the first adjustment module (2); The position adjustment module (6) adjusts the planar position of the signal receiving disk (7) and drives the signal receiving disk (7) to rotate on a horizontal plane.

2. The assembly device for aluminum alloy extrusion according to claim 1, characterized in that, The first adjustment module (2) includes: A first linear module (21) provided on the assembly base (1), the first linear module (21) being used to adjust the planar position of the first diverter die; A rotating table (22) provided on the first linear module (21); the rotating table (22) being used to drive the first diverter die to rotate on a horizontal plane.

3. The assembly device for aluminum alloy extrusion according to claim 1 or 2, characterized in that, The second adjustment module (3) includes: A second linear module (31) provided on the assembly base (1), the second linear module (31) being used to adjust the planar position of the second diverter die; A lifter (32) provided on the second linear module (31), the lifter (32) being used to drive the second diverter die to move in the vertical direction.

4. The assembly device for aluminum alloy extrusion according to claim 1, wherein, The laser signal emission module (4) includes: An angle adjustment turntable (41) provided on the assembly base (1); A laser signal emitter (42) provided on the angle adjustment turntable (41); Wherein, the angle adjustment turntable (41) is used to adjust the incident angle of the laser signal emitter (42).

5. The assembly device for aluminum alloy extrusion according to claim 1 or 4, characterized in that, The annular flow guide member (5) includes: Lifting brackets (51) symmetrically arranged on the assembly base (1); A linear telescopic device (52) provided on the lifting brackets (51); A flow guide semi-ring (53) detachably fixed to the linear telescopic device (52).

6. The assembly device for aluminum alloy extrusion according to claim 1, characterized in that, The position adjustment module (6) includes: A third linear module (61) provided on the assembly base (1); An electric turntable (62) provided on the third linear module (61), the third linear module (61) being used to adjust the planar position of the electric turntable (62).

7. The assembly device for aluminum alloy extrusion according to claim 6, characterized in that, There are multiple sets of symmetrically arranged signal receiving sensors (71) on the signal receiving disk (7), and the spacing between each set of symmetrically arranged signal receiving sensors (71) is different.

8. The assembling device for aluminum alloy extrusion according to claim 6, characterized in that, The shape of the detection surface of the signal receiving sensor (71) is circular.

9. The assembly device for aluminum alloy extrusion according to claim 1 or 7 or 8, characterized in that, It further includes a display module (8) electrically connected to the signal receiving sensor (71). The display module (8) is configured to simultaneously display the receiving point positions on the detection surfaces of a set of symmetrically arranged signal receiving sensors (71).

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