Test interface structure and chip test equipment

Abstract

The invention relates to the technical field of chip testing, in particular to a testing interface structure and chip testing equipment. The test interface structure comprises a substrate which is used for being arranged above a chip bearing platform and is used for being installed at the bottom of a light source provider; the substrate is provided with a plurality of open holes which are distributed at intervals and extend in a penetrating mode, the open holes are provided with light-transmitting separation structures, and the separation structures are configured to be capable of forming first separation spaces with a dry environment between the separation structures and the light source providers. The separation structure is further configured to form a second separation space between the separation structure and the chip bearing platform, wherein the second separation space allows dry gas to be filled or vacuumized; and the multiple objective lenses are installed in the multiple open holes in a one-to-one correspondence mode, and the objective lenses are located above the bottom face of the separation structure. By adopting the test interface structure, the view field of the objective lens can be clear, and the test is convenient.

Description

Technical Field

[0001] The present invention relates to the technical field of chip testing, and particularly relates to a test interface structure and a chip testing device. Background Art

[0002] Based on test requirements, a chip testing device needs to perform signal tests on chips in high-temperature, normal-temperature, and low-temperature environments.

[0003] The light source provider generates a large amount of heat during long-term operation, and this heat causes the temperatures of the light source provider and the objective lens of the test probe card to be relatively high. Therefore, when performing low-temperature tests, the temperature of the objective lens of the test probe card is higher than the temperature of the environment where the chip under test is located. However, once the humidity of the environment where the chip under test is located is slightly high, condensation or frosting may occur on the objective lens of the test probe card, making the objective lens of the test probe card become blurred and difficult to perform tests.

[0004] In addition, after the chip is tested in a higher-temperature environment and then needs to be tested in a lower-temperature environment, for example, from high temperature to normal temperature, from high temperature to low temperature, or from normal temperature to low temperature, the same situation as above will occur, where the temperature of the objective lens is higher than the temperature of the environment where the chip under test is located, resulting in condensation or frosting on the objective lens, making the objective lens of the test probe card become blurred and difficult to perform tests. Therefore, after the test is completed in a higher ambient temperature, the same chip testing device cannot perform the next test in a lower temperature environment. At this time, a test probe card specifically for low-temperature tests must be replaced to perform the test. Summary of the Invention

[0005] The purpose of the present invention is to solve the following technical problems: during low-temperature tests, condensation or frosting may occur on the objective lens, making the objective lens become blurred and difficult to perform tests; and when performing the next test in a lower-temperature environment after the test is completed in a higher-temperature environment, condensation or frosting may occur on the objective lens, making the objective lens become blurred and difficult to perform tests.

[0006] To achieve the above purpose, on the one hand, the present invention provides a test interface structure, which includes: a substrate configured to be disposed above a chip carrier platform and mounted at the bottom of a light source provider; the substrate is provided with a plurality of apertures spaced apart and extending therethrough, and the apertures are provided with a light-transmitting partition structure, the partition structure is configured to be able to form a first partition space with a dry environment between it and the light source provider, and the partition structure is further configured to be able to form a second partition space with the chip carrier platform that allows the charging of dry gas or evacuation; and a plurality of objective lenses, the plurality of objective lenses are respectively mounted in the plurality of apertures, and the objective lenses are located above the bottom surface of the partition structure.

[0007] In some embodiments, the first separation space is configured to maintain its dry environment by continuously charging dry gas.

[0008] In some embodiments, the separation structure includes a first light-transmitting plate, and the outer peripheral portion of the first light-transmitting plate is sealingly connected to the pore wall of the opening.

[0009] In some embodiments, the first light-transmitting plate is a glass plate or a filter plate.

[0010] In some embodiments, the first light-transmitting plate is located at the middle or bottom of the opening.

[0011] In some embodiments, the test interface structure further includes a second light-transmitting plate sealingly installed in the opening, and a first separation space with a dry environment is formed between the second light-transmitting plate and the first light-transmitting plate, wherein the dry environment is formed by charging dry gas or evacuating.

[0012] In some embodiments, the test interface structure further includes a second light-transmitting plate sealingly installed in the opening, and a sealed space is formed between the second light-transmitting plate and the first light-transmitting plate, and the sealed space is filled with dry gas or in a vacuum state.

[0013] In some embodiments, the second light-transmitting plate is located at the middle or top of the opening, and the distance between the second light-transmitting plate and the top of the opening is less than the distance between the first light-transmitting plate and the top of the opening.

[0014] In some embodiments, the objective lens is located between the second light-transmitting plate and the first light-transmitting plate.

[0015] In some embodiments, the objective lens is located between the second light-transmitting plate and the top of the opening.

[0016] In some embodiments, the second light-transmitting plate is a glass plate or a filter plate.

[0017] In some embodiments, the diameter of the opening gradually decreases from top to bottom.

[0018] The present invention also provides a chip testing device, which includes a light source provider, a chip carrying platform and the above-mentioned test interface structure. The substrate is installed at the bottom of the light source provider, and the objective lens can focus the light provided by the light source provider. The light source provider and the test interface structure are located above the chip carrying platform, and the chip carrying platform can carry and fix the chip to be tested.

[0019] The above technical solution of the present invention has the following beneficial effects:

[0020] When performing low-temperature tests, or when, after completing high-temperature environmental tests, the next test is carried out in a lower-temperature environment, the second partition space can be filled with dry gas or evacuated to keep the second partition space in a dry environment, thereby preventing moisture in the air from adhering to the bottom surface of the partition structure and causing condensation or frosting, ensuring a clear field of view of the objective lens and facilitating testing. At the same time, the first partition space has a dry environment, which can also enhance the isolation and protection effect for the objective lens, further preventing condensation or frosting on the objective lens and the partition structure due to temperature reduction, making the field of view of the objective lens clear and facilitating testing, and there is no need to replace a dedicated test probe card for low-temperature tests to conduct the test. Therefore, by adopting the test interface structure of the present invention, the field of view of the objective lens can be made clear and testing can be facilitated. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] Figure 1 is a schematic diagram of a test interface structure in an embodiment of the present invention;

[0022] Figure 2 is a schematic diagram of a chip testing device in an embodiment of the present invention;

[0023] Figure 3 is a schematic diagram of a test interface structure in another embodiment of the present invention;

[0024] Figure 4 is a schematic diagram of a test interface structure in another embodiment of the present invention;

[0025] Figure 5 is a schematic diagram of a test interface structure in another embodiment of the present invention;

[0026] Figure 6 is a schematic diagram of a test interface structure in another embodiment of the present invention;

[0027] Figure 7 is a schematic diagram of a test interface structure in another embodiment of the present invention.

[0028] DESCRIPTION OF THE REFERENCE NUMERALS

[0029] 1. Substrate; 11. Opening; 12. First partition space; 13. Second partition space; 14. Sealed space; 15. Second light-transmitting plate; 16. Probe;

[0030] 2. Partition structure; 21. First light-transmitting plate;

[0031] 3. Objective lens;

[0032] 4. Light source provider;

[0033] 5. Chip carrier platform;

[0034] 6. Chip under test. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0035] The features and exemplary embodiments of various aspects of the present invention will be described in detail below. In order to make the objectives, technical solutions, and advantages of the present invention clearer and more understandable, the present invention will be further described in detail below in conjunction with the accompanying drawings and specific embodiments. It should be understood that the specific embodiments described herein are only intended to explain the present invention and not to limit the present invention. For those skilled in the art, the present invention can be implemented without some of these specific details. The following description of the embodiments is only to provide a better understanding of the present invention by showing examples of the present invention.

[0036] Generally, in the art, the high-temperature, normal-temperature, and low-temperature environments of the chip under test are provided by the chip carrier platform 5. A temperature adjustment device is provided inside the chip carrier platform 5, enabling the chip carrier platform 5 itself to heat, cool, or maintain normal temperature, so that the chip under test can be in a high-temperature, normal-temperature, or low-temperature environment. When the chip under test is in a low-temperature environment, the environment around the chip under test will also be in a low-temperature state. The light source provider 4 generates a large amount of heat during long-term operation, and this heat will conduct to the objective lens and increase the temperature of the objective lens, resulting in the temperature of the objective lens being higher than the temperature of the environment around the chip under test. Therefore, once the humidity of the environment where the chip under test is located is slightly high, condensation or frosting may occur on the objective lens, making the objective lens become blurred and difficult to test. In addition, after the chip under test is tested in a higher-temperature environment and needs to be tested in a lower-temperature environment, for example, from high temperature to normal temperature, from high temperature to low temperature, or from normal temperature to low temperature, the same as above, the temperature of the objective lens will be higher than the temperature of the environment where the chip under test is located, resulting in the situation that condensation or frosting may occur on the objective lens, making the objective lens of the test probe card become blurred and difficult to test. Therefore, after the test is completed in a higher-temperature environment, the same chip testing device cannot perform the next test in a lower-temperature environment. At this time, it is necessary to replace the test probe card specifically for low-temperature testing to perform the test.

[0037] As Figure 1 and Figure 2 shown, the present invention provides a test interface structure, which includes a substrate 1 and a plurality of objective lenses 3. The substrate 1 is used to be arranged above the chip carrier platform 5 and installed at the bottom of the light source provider 4; the substrate 1 is provided with a plurality of apertures 11 that are spaced apart and extend through, and the apertures 11 are provided with a light-transmitting partition structure 2. The partition structure 2 is configured to be able to form a first partition space 12 with a dry environment between it and the light source provider 4, and the partition structure 2 is also configured to be able to form a second partition space 13 with the chip carrier platform 5 that allows the charging of dry gas or evacuation. The plurality of objective lenses 3 are respectively installed in the plurality of apertures 11, and the objective lenses 3 are located above the bottom surface of the partition structure 2.

[0038] Specifically, the substrate 1 is provided with a plurality of apertures 11 that are spaced apart and extend therethrough, and the apertures 11 are provided with a partition structure 2 that allows light to pass through. After the substrate 1 is installed at the bottom of the light source provider 4, the substrate 1 and the partition structure 2 can separate the space between the light source provider 4 and the chip carrier platform 5. Among them, a first separation space 12 can be formed between the partition structure 2 and the light source provider 4, that is, the first separation space 12 is close to the light source provider 4; a second separation space 13 can be formed between the partition structure 2 and the chip carrier platform 5, that is, the second separation space 13 is close to the chip carrier platform 5 and the chip under test 6; and the partition structure 2 separates the first separation space 12 and the second separation space 13 to prevent gas convection from occurring in the first separation space 12 and the second separation space 13. The objective lens 3 is installed in the aperture 11 and the objective lens 3 is located above the bottom surface of the partition structure 2, so the partition structure 2 also separates the objective lens 3 and the second separation space 13, and the second separation space 13 can be filled with a dry gas or evacuated to form a dry environment with a low thermal conductivity, reducing water vapor condensation and preventing heat conduction, thereby preventing the partition structure 2 from generating condensed water or frost due to temperature reduction and keeping the field of view of the objective lens 3 clear. Moreover, the objective lens 3 can be located in the first separation space 12 or above the first separation space 12, etc. The first separation space 12 has a dry environment with a low thermal conductivity, which can also reduce water vapor condensation and prevent heat conduction. Therefore, the first separation space 12 can also enhance the isolation and protection effect for the objective lens 3, further preventing the objective lens 3 and the partition structure 2 from generating condensed water or frost due to temperature reduction in the first separation space 12 and the second separation space 13 and keeping the field of view of the objective lens 3 clear.

[0039] Therefore, in this embodiment, when performing a low-temperature test, or alternatively, after a high-temperature environmental test is completed and then a next test is performed in a lower-temperature environment, the second separation space 13 can be filled with a dry gas or evacuated to keep the second separation space 13 in a dry environment, thereby preventing moisture in the air from adhering to the bottom surface of the partition structure 2 and generating condensed water or frost, ensuring that the field of view of the objective lens 3 is clear and facilitating the test; at the same time, the first separation space 12 has a dry environment, which can also enhance the isolation and protection effect for the objective lens 3, further preventing the objective lens 3 and the partition structure 2 from generating condensed water or frost due to temperature reduction, keeping the field of view of the objective lens 3 clear and facilitating the test, and moreover, there is no need to replace a dedicated test probe card for low-temperature testing to perform the test. Therefore, by adopting the test interface structure of the present invention, the field of view of the objective lens 3 can be kept clear and the test can be facilitated.

[0040] In some embodiments, when forming a dry environment by filling with a dry gas, the dry gas can be an inert gas or nitrogen, etc., or a combination of the above two gases in any suitable ratio.

[0041] In some embodiments of the present invention, the first separation space 12 is configured to maintain its dry environment by continuously filling it with dry gas.

[0042] Specifically, during low-temperature testing, or when conducting the next test in a lower-temperature environment after completing a higher-temperature environmental test, dry gas can be continuously filled into the first separation space 12 to create a positive pressure environment in the first separation space 12, causing the air with water vapor in the first separation space 12 to be continuously discharged, thereby maintaining the dry environment of the first separation space 12. At the same time, if there is fog on one side of the objective lens 3 in the first separation space 12, the fog on the objective lens 3 will also be dried due to the continuous inflow of dry air.

[0043] As Figures 1 to 7 shown, in some embodiments of the present invention, the separation structure 2 includes a first light-transmitting plate 21, and the outer peripheral portion of the first light-transmitting plate 21 is sealingly connected to the hole wall of the opening 11.

[0044] Specifically, the first separation space 12 is located between the first light-transmitting plate 21 and the light source provider 4, the second separation space 13 is located between the first light-transmitting plate 21 and the chip carrier platform 5, and the objective lens 3 is disposed above the bottom surface of the first light-transmitting plate 21.

[0045] In some embodiments, the first light-transmitting plate 21 can be one or more than one. In some embodiments, when there are more than one first light-transmitting plates 21, two adjacent first light-transmitting plates 21 can be attached to each other or arranged at intervals.

[0046] In some embodiments of the present invention, the first light-transmitting plate 21 is a glass plate or a filter plate.

[0047] Specifically, the glass plate has a good light-transmitting effect, which neither affects the light intensity nor the light path, thus ensuring signal accuracy. The filter plate can filter out stray light, improve the light signal intensity, adjust the light color and spectrum, thereby ensuring signal accuracy. Of course, the first light-transmitting plate 21 can also adopt other light-transmitting plate members that can achieve the above technical effects, and the present invention does not make any limitations.

[0048] In some embodiments, to further improve the light-transmitting effect, the first light-transmitting plate 21 can be a light-transmitting plate member with a uniform thickness.

[0049] In some other embodiments, the first light-transmitting plate 21 can also be a light-transmitting plate member with at least one of the top surface and the bottom surface being concave; or, the first light-transmitting plate 21 can also be a light-transmitting plate member with at least one of the top surface and the bottom surface being convex; or, the first light-transmitting plate 21 can also be such that one of the top surface and the bottom surface is concave while the other protrudes outward.

[0050] In some embodiments of the present invention, at least a part of the partition structure 2 is located at the middle of the opening 11. For example, in some embodiments, a part of the partition structure 2 is located at the middle of the opening 11, while another part thereof is located at the bottom end of the opening 11. For another example, in some embodiments, the partition structure 2 is entirely located at the middle of the opening 11.

[0051] As Figures 1 to 7 shown, in some embodiments of the present invention, the first light-transmitting plate 21 is located at the middle or the bottom end of the opening 11.

[0052] Specifically, as long as at least a part of the first light-transmitting plate 21 is located at the middle of the opening 11, it is considered that the first light-transmitting plate 21 is located at the middle of the opening 11. In some embodiments, the distance between the middle and the bottom end of the opening 11 is greater than the thickness of the first light-transmitting plate 21.

[0053] As Figures 4 to 5 shown, in some embodiments of the present invention, the test interface structure further includes a second light-transmitting plate 15 hermetically installed in the opening 11, and a first partition space 12 with a dry environment is formed between the second light-transmitting plate 15 and the first light-transmitting plate 21, wherein the dry environment is formed by filling with dry gas or evacuating.

[0054] Specifically, the second light-transmitting plate 15 and the first light-transmitting plate 21 cooperate to form the first partition space 12, and the first partition space 12 is a relatively enclosed space, which can further improve the isolation and protection effect on the objective lens 3. In some embodiments, for the space between the second light-transmitting plate 15 and the light source provider 4, the dry environment can still be formed by filling with dry gas or evacuating, further reducing water vapor condensation and preventing heat conduction.

[0055] As Figures 6 to 7 shown, in some embodiments of the present invention, the test interface structure further includes a second light-transmitting plate 15 hermetically installed in the opening 11. A sealed space 14 is formed between the second light-transmitting plate 15 and the first light-transmitting plate 21. The sealed space 14 is filled with dry gas or in a vacuum state, so that the first partition space 12, the sealed space 14, and the second partition space 13 are all in a dry state.

[0056] Specifically, a first separation space 12 is formed between the first light-transmitting plate 21 and the light source provider 4, and a sealed space 14 is formed between the second light-transmitting plate 15 and the first light-transmitting plate 21. Therefore, the sealed space 14 is part of the first separation space 12. Moreover, the sealed space 14 can further enhance the isolation and protection effect on the objective lens 3. Among them, the part of the first separation space 12 other than the sealed space 14 is defined as the external space, and the external space and the sealed space 14 can be dried in the same or different ways. For example, both the external space and the sealed space 14 are dried by filling with dry gas. Another example is that the external space is dried by filling with dry gas, while the sealed space 14 is dried by vacuum pumping.

[0057] As Figures 4 to 7 shown, in some embodiments of the present invention, the second light-transmitting plate 15 is located at the middle or top of the opening 11, and the distance between the second light-transmitting plate 15 and the top of the opening 11 is less than the distance between the first light-transmitting plate 21 and the top of the opening 11.

[0058] Specifically, the second light-transmitting plate 15 is located above the first light-transmitting plate 21, and the two are spaced apart to form the first separation space 12 or the sealed space 14 therebetween.

[0059] As Figure 4 and Figure 6 shown, in some embodiments of the present invention, the objective lens 3 is located between the second light-transmitting plate 15 and the first light-transmitting plate 21.

[0060] Specifically, the second light-transmitting plate 15 can be located at the top of the opening 11, and the first light-transmitting plate 21 can be located at the middle of the opening 11, so that a first separation space 12 or a sealed space 14 extending from the middle of the opening 11 to the top of the opening 11 is formed between the second light-transmitting plate 15 and the first light-transmitting plate 21. And the objective lens 3 can be closer to the first light-transmitting plate 21. The first separation space 12 or the sealed space 14 can form a dry environment by filling with dry gas or vacuum pumping, so that the objective lens 3 is located in a dry environment, ensuring the clear vision of the objective lens 3. The space between the second light-transmitting plate 15 and the light source provider 4 can also form a dry environment by filling with dry gas or vacuum pumping, reducing water vapor condensation and preventing heat conduction.

[0061] As Figure 5 and Figure 7 shown, in some embodiments of the present invention, the objective lens 3 is located between the second light-transmitting plate 15 and the top of the opening 11.

[0062] Specifically, both the first light-transmitting plate 21 and the second light-transmitting plate 15 are located in the middle of the opening 11, and the second light-transmitting plate 15 is located above the first light-transmitting plate 21 and the two are spaced apart. The first separation space 12 or the sealing space 14 is formed between the first light-transmitting plate 21 and the second light-transmitting plate 15. The first separation space 12 or the sealing space 14 can form a dry environment by filling with dry gas or evacuating. The objective lens 3 is located above the second light-transmitting plate 15; and relative to the top end of the opening 11, the objective lens 3 can be closer to the second light-transmitting plate 15. Moreover, the space between the second light-transmitting plate 15 and the light source provider 4 can also form a dry environment by filling with dry gas or evacuating, reducing water vapor condensation and preventing heat conduction.

[0063] In some embodiments of the present invention, the second light-transmitting plate 15 is a glass plate or a filter plate.

[0064] Specifically, the glass plate has good light-transmitting effect, which will neither affect the light intensity nor the light path, thus ensuring signal accuracy. The filter plate can filter out stray light and improve light brightness, thus ensuring signal accuracy. Of course, the second light-transmitting plate 15 can also adopt other light-transmitting plate members that can achieve the above technical effects, and the present invention does not make limitations.

[0065] In some embodiments, to further improve the light-transmitting effect, the second light-transmitting plate 15 can be a light-transmitting plate member with a uniform thickness.

[0066] In some other embodiments, the second light-transmitting plate 15 can also be a light-transmitting plate member with at least one of the top surface and the bottom surface being concave; or, the second light-transmitting plate 15 can also be a light-transmitting plate member with at least one of the top surface and the bottom surface being convex; or, one of the top surface and the bottom surface of the second light-transmitting plate 15 is concave and the other protrudes outward.

[0067] In some embodiments of the present invention, the diameter of the opening 11 gradually decreases from top to bottom. On the one hand, it is convenient to install the objective lens 3 from the top end of the opening 11; on the other hand, it reduces the capacity of the opening 11, making it convenient for the opening 11 to be quickly filled with dry gas or evacuated.

[0068] In some other embodiments, the opening 11 can also be a cylindrical hole, a hole with a diameter gradually increasing from top to bottom, or a polygonal hole, etc., and the present invention does not make limitations.

[0069] In some embodiments of the present invention, a plurality of probes 16 are further provided at the bottom of the substrate 1.

[0070] The present invention also provides a chip testing device, which includes a light source provider 4, a chip carrying platform 5, and the testing interface structure of the above embodiment. The substrate 1 is installed at the bottom of the light source provider 4. The objective lens 3 can focus the light provided by the light source provider 4. The light source provider 4 and the testing interface structure are located above the chip carrying platform 5, and the chip carrying platform 5 can carry and fix the chip 6 to be tested.

[0071] Specifically, a first separation space 12 is formed between the separation structure 2 and the light source provider 4, and a second separation space 13 is formed between the separation structure 2 and the chip carrying platform 5. The separation structure 2 separates the first separation space 12 and the second separation space 13 to prevent gas convection from occurring in the first separation space 12 and the second separation space 13. The second separation space 13 can be filled with dry gas or evacuated to prevent the separation structure 2 from generating condensed water or frosting due to temperature reduction, so that the field of view of the objective lens 3 is clear. The objective lens 3 can be located in the first separation space 12 or above the first separation space 12, etc. The first separation space 12 with a dry environment can enhance the isolation and protection effect for the objective lens 3, and further prevent the objective lens 3 and the separation structure 2 from generating condensed water or frosting due to temperature reduction in the first separation space 12 and the second separation space 13, so that the field of view of the objective lens 3 is clear.

[0072] In this article, specific examples are used to elaborate on the principle and implementation manner of the present invention. The description of the above examples is only used to help understand the method and its core idea of the present invention. The above is only the preferred implementation manner of the present invention. It should be noted that due to the limited nature of written expression and the objectively infinite specific structures, for those of ordinary skill in the art in this technical field, without departing from the principle of the present invention, several improvements, refinements or changes can be made, or the above technical features can be combined in an appropriate manner; these improvements, refinements, changes or combinations, or directly applying the concept and technical solution of the present invention to other occasions without improvement, should all be regarded as the protection scope of the present invention.

Claims

1. A test interface structure, characterized in that, Comprising: A substrate (1), which is used to be disposed above a chip carrier platform (5) and to be mounted at the bottom of a light source provider (4); the substrate (1) is provided with a plurality of apertures (11) that are spaced apart and extend therethrough, and a light-transmitting partition structure (2) is provided in the apertures (11), and the partition structure (2) is configured to be able to form a first partition space (12) with a dry environment between it and the light source provider (4), and the partition structure (2) is further configured to be able to form a second partition space (13) with the chip carrier platform (5) that allows the filling of dry gas or evacuation of air; And A plurality of objective lenses (3), and the plurality of objective lenses (3) are respectively mounted in the plurality of apertures (11) one by one, and the objective lenses (3) are located above the bottom surface of the partition structure (2).

2. The test interface structure according to claim 1, characterized in that The first partition space (12) is configured to allow its dry environment to be maintained by continuously filling dry gas.

3. The test interface structure according to claim 1, wherein The partition structure (2) includes a first light-transmitting plate (21), and the outer peripheral portion of the first light-transmitting plate (21) is sealingly connected to the pore wall of the aperture (11).

4. The test interface structure according to claim 3, wherein, The first light-transmitting plate (21) is a glass plate or a filter plate.

5. The test interface structure according to claim 3, characterized in that, The first light-transmitting plate (21) is located at the middle or bottom end of the aperture (11).

6. The test interface structure according to claim 5, wherein The test interface structure further includes a second light-transmitting plate (15) sealingly mounted in the aperture (11), and a first partition space (12) with a dry environment is formed between the second light-transmitting plate (15) and the first light-transmitting plate (21), wherein the dry environment is formed by filling dry gas or evacuating air.

7. The test interface structure according to claim 5, wherein The test interface structure further includes a second light-transmitting plate (15) sealingly mounted in the aperture (11), a sealed space (14) is formed between the second light-transmitting plate (15) and the first light-transmitting plate (21), and the sealed space (14) is filled with dry gas or is in a vacuum state.

8. The test interface structure according to claim 6 or 7, characterized in that, The second light-transmitting plate (15) is located at the middle or top end of the aperture (11), and the distance between the second light-transmitting plate (15) and the top end of the aperture (11) is less than the distance between the first light-transmitting plate (21) and the top end of the aperture (11).

9. The test interface structure according to claim 8, characterized in that The objective lens (3) is located between the second light-transmitting plate (15) and the first light-transmitting plate (21).

10. The test interface structure according to claim 6 or 7, characterized in that, The objective lens (3) is located between the second light-transmitting plate (15) and the top end of the aperture (11).

11. The test interface structure according to claim 6, wherein, The second light-transmitting plate (15) is a glass plate or a filter plate.

12. The test interface structure according to any one of claims 1-7, characterized in that, The diameter of the aperture (11) gradually decreases from top to bottom.

13. A chip testing device, characterized in that, Comprising a light source provider (4), a chip carrier platform (5) and the test interface structure according to any one of claims 1-12, the substrate (1) is mounted at the bottom of the light source provider (4), the objective lens (3) can focus the light provided by the light source provider (4), the light source provider (4) and the test interface structure are located above the chip carrier platform (5), and the chip carrier platform (5) can carry and fix a chip under test (6).

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