Chip packaging material strip clamping steel belt

Abstract

The invention belongs to the technical field of electroplating processes, and discloses a packaging chip material strip clamping steel belt, a plurality of conductive supports are arranged at the lower end of a steel belt body, each conductive support corresponds to an elastic clamp, the upper ends of the elastic clamps are connected to the steel belt body above the conductive supports, and the lower ends of the elastic clamps are connected to the conductive supports. The lower end of the elastic clamp is a clamping end matched with the conductive support to clamp and package a chip material strip, the clamping end of the elastic clamp is provided with a first insulator formed by injection molding, a second insulator is formed outside the conductive support by injection molding, and one surface of the bottom of the conductive support is provided with a conductive contact point. The conductive contact point is matched with the lower end of the first insulator to clamp and package the chip material strip, and when the conductive contact point abuts against the lower end of the first insulator, the lower end of the first insulator covers the conductive contact point. According to the clamping steel belt, the conductive bracket and the elastic clamp are prevented from being tinned as far as possible, so that the loss of electric energy is reduced when the clamping steel belt is electroplated, and the deplating operation after blanking is also avoided as far as possible.

Description

Technical Field

[0001] The present invention belongs to the technical field of electroplating processes, and particularly relates to a clamping steel strip for an encapsulated chip strip. Background Art

[0002] The production process of encapsulated chips consists of wafer manufacturing, wafer testing, chip encapsulation, and post-encapsulation testing. After plastic encapsulation, a series of operations are also required, such as post-mold cure, plating, trim & form, and printing processes. A typical encapsulation process flow is: dicing, die bonding, wire bonding, plastic encapsulation, deburring, plating, printing, trim & form, appearance inspection, finished product testing, packaging, and shipping.

[0003] During the electroplating process of an encapsulated chip strip, the encapsulated chip strip needs to be immersed in a chemical solution for electroplating tin. In order to ensure that the encapsulated chip strip can be stably electroplated with tin, the encapsulated chip strip needs to be clamped and fixed on the steel strip of the electroplating equipment. In the prior art, generally, a spring clip is installed at the lower end of the steel strip. One end of the spring clip is assembled on the steel strip, and the other end presses the encapsulated chip strip against the conductive bracket at the lower end of the steel strip to fix the encapsulated chip strip. Then, electroplating processing is performed on the encapsulated chip strip through the conduction of the steel strip or the spring clip.

[0004] Currently, the steel strip structures used in electroplating equipment are generally divided into the following three types:

[0005] 1. Both the spring clip and the conductive bracket at the lower edge of the steel strip are made of all metal. The electroplating equipment conducts electricity to the encapsulated chip strip through the steel strip. In this case, when the encapsulated chip strip is electroplated, both the lower end of the steel strip and the clamping end of the spring clip will conduct electricity. Therefore, both will be tinned. The tinned metal surface area is large, resulting in a large electroplating current, high energy consumption. Moreover, after unloading, there is a large amount of tin on the lower end of the steel strip and the clamping end of the spring clip. Therefore, stripping plating treatment is required. This stripping plating current and voltage are both very large, resulting in large power consumption and also causing a large consumption of stripping plating chemical solution;

[0006] 2. The steel strip is made of all metal, and the other end of the spring clip clamps the encapsulated chip strip through an insulating material. The electroplating equipment conducts electricity to the encapsulated chip strip through the steel strip. In this case, when the encapsulated chip strip is electroplated, the entire steel strip conducts electricity for electroplating. Therefore, the lower end of the steel strip will be tinned, resulting in a large electroplating current, high energy consumption. Moreover, after unloading, there is tin on the lower end of the steel strip. Therefore, stripping plating treatment is required. This stripping plating current and voltage are both very large, resulting in large power consumption and also causing a large consumption of stripping plating chemical solution;

[0007] 3. The lower edge of the steel strip is made of insulating material, and the spring clip is made of metal material. The electroplating equipment conducts electricity to the encapsulated chip strip through the spring clip. In this case, when the encapsulated chip strip is electroplated, the spring clip will conduct electricity, and the clamping end of the spring clip will be tinned. The electroplating current is relatively small, and the energy consumption is relatively small. When the spring clip needs to be de-tinned after blanking, the de-tinning current and voltage are also small, the power loss is small, and the consumption of de-tinning potion is also relatively small. However, the method of conducting electricity through the spring clip may have the problem of poor electrical conductivity at the contact point between the steel strip and the spring clip, that is to say, there is a risk of unqualified electroplating quality in this way.

[0008] In summary, the existing three steel strip structures all have different defects. Summary of the Invention

[0009] The purpose of the present invention is to provide a clamping steel strip for an encapsulated chip strip to solve the above problems existing in the prior art.

[0010] To achieve the above purpose, the present invention adopts the following technical solutions:

[0011] A clamping steel strip for an encapsulated chip strip includes a steel strip body and elastic clips. A plurality of conductive brackets are arranged at the lower end of the steel strip body and are evenly distributed along its length direction. Each conductive bracket is correspondingly arranged with an elastic clip. The upper end of the elastic clip is connected to the steel strip body above the conductive bracket. The lower end of the elastic clip is a clamping end that cooperates with the conductive bracket to clamp the encapsulated chip strip. An injection-molded first insulator is arranged at the clamping end of the elastic clip, a second insulator is injection-molded outside the conductive bracket, and a conductive contact point for conducting electricity to the encapsulated chip strip is arranged on one side of the bottom of the conductive bracket. The conductive contact point cooperates with the lower end of the first insulator to clamp the encapsulated chip strip. When the conductive contact point abuts against the lower end of the first insulator, the lower end of the first insulator covers the conductive contact point.

[0012] As a preferred technical solution in the present invention, the conductive contact point is a conductive protrusion protruding from the outside of the second insulator, and the end of the conductive protrusion is a conductive contact surface that is in surface contact with the encapsulated chip strip. When the conductive contact point abuts against the lower end of the first insulator, the lower end of the first insulator covers the conductive contact surface.

[0013] As a preferred technical solution in the present invention, a first insulator adjustment hole is arranged in the middle of the conductive bracket. The upper end of the elastic clip is connected to the back of the steel strip body. The lower end of the first insulator passes through the first insulator adjustment hole and is inclined towards the conductive contact port. When the lower end of the first insulator cooperates with the conductive contact point to clamp the encapsulated chip strip, the lower end of the first insulator is in surface contact with the encapsulated chip strip.

[0014] As a preferred technical solution in the present invention, the elastic clip includes a torsion spring and a first insulator as a clamping end, one end of the torsion spring is connected to the back of the steel strip body, and the upper end of the first insulator is connected to the other end of the steel strip body.

[0015] As a preferred technical solution in the present invention, the elastic clip also includes a connecting piece, which is vertically connected to the back side of the steel belt body, and one end of the torsion spring is connected to an end of the connecting piece away from the steel belt body.

[0016] As a preferred technical solution in the present invention, a rotating shaft is provided at the other end of the connecting member, and the torsion spring is rotatably connected to the rotating shaft.

[0017] As a preferred technical solution in the present invention, a limiting ring is provided at the upper end of the first insulator, and the limiting ring is sleeved outside the rotating shaft.

[0018] As a preferred technical solution in the present invention, the first insulator and the second insulator are both made of corrosion-resistant and non-conductive materials.

[0019] Beneficial effect: The clamping end of the elastic clip of the present invention is provided with an injection-molded first insulator outside, so that the elastic clip uses the first insulator to clamp the packaged chip material strip, thereby preventing the elastic clip from being tinned during electroplating, and the conductive bracket is injection-molded with a second insulator outside, and the second insulator wraps the conductive bracket to prevent it from being electroplated. Only a conductive contact point is provided on one side of the bottom of the conductive bracket, which does not affect the electroplating equipment to conduct electricity for the packaged chip material strip through the steel strip body. While ensuring the conductivity of the packaged chip material strip, the exposure of metal on the conductive bracket is reduced, and the conductive contact point cooperates with the lower end of the first insulator to clamp the packaged chip material strip, ensuring the stability of the packaged chip material strip, while using the packaged chip material strip to cover The conductive contact points it contacts can be plated at very small amounts, or even not plated at all. When some conductive contact points are not used to clamp the packaged chip strips, the conductive contact points abut against the lower end of the first insulator, and the lower end of the first insulator covers the conductive contact points, which can also make only a very small amount of conductive contact points be plated, or even not plated. In this way, when electroplating is carried out in the electroplating equipment, tinning of the conductive bracket can be avoided as much as possible while ensuring stable power supply, so that the clamping steel strip can reduce or avoid the loss of electric energy as much as possible during electroplating, and can also reduce or avoid the operation of stripping after unloading. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Figure 1 It is a front perspective view of the clamping steel belt in the first embodiment of the present invention;

[0021] Figure 2 It is a back perspective view of the clamping steel belt in the first embodiment of the present invention;

[0022] Figure 3 This is the front perspective view of the clamping steel strip in the second embodiment of the present invention;

[0023] Figure 4 This is the back perspective view of the clamping steel strip in the second embodiment of the present invention;

[0024] Figure 5 This is the front perspective view of another assembly form in the first embodiment of the present invention;

[0025] Figure 6 This is the back perspective view of another assembly form in the first embodiment of the present invention.

[0026] In the figure: 1 - steel strip body; 101 - conductive bracket; 1011 - conductive protrusion; 102 - second insulator; 2 - elastic clip; 201 - first insulator; 202 - torsion spring; 203 - connecting piece; 204 - rotating shaft. Detailed implementation manners

[0027] In order to more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the following will briefly introduce the present invention in combination with the drawings and the description of the embodiments or the prior art. Obviously, the following description of the drawing structure is only some embodiments of the present invention. For those of ordinary skill in the art, other drawings can be obtained based on these drawings without creative efforts. It should be noted here that the description of these embodiment modes is used to help understand the present invention, but does not constitute a limitation to the present invention.

[0028] Embodiment 1:

[0029] As Figure 1 and Figure 2As shown, the present embodiment provides a chip material strip clamping steel strip, comprising a steel strip body 1 and an elastic clip 2. The lower end of the steel strip body 1 is provided with a plurality of conductive brackets 101 evenly distributed along its length direction. Each conductive bracket 101 is provided corresponding to an elastic clip 2. The upper end of the elastic clip 2 is connected to the steel strip body 1 above the conductive bracket 101. The lower end of the elastic clip 2 is a clamping end that cooperates with the conductive bracket 101 to clamp the chip material strip. The chip material strip is clamped on the plurality of conductive brackets 101 by a plurality of elastic clips 2, thereby achieving the clamping of the chip material strip at the lower end of the steel strip body 1. The clamping end of the elastic clip 2 is provided with an injection-molded first insulator 201, so that the elastic clip 2 clamps the chip material strip by the first insulator 201, thereby preventing the elastic clip 2 from being tinned during electroplating. The conductive bracket 101 is injection-molded with a second insulator 102, which wraps the conductive bracket 101 to prevent it from being electroplated. A conductive contact point 1011 for conducting electricity for the packaged chip strip is provided on one side of the bottom of the electrical support 101, which does not affect the electroplating equipment to conduct electricity for the packaged chip strip through the steel strip body 1. While ensuring the conductivity of the packaged chip strip, the exposure of metal on the conductive support 101 is reduced. The conductive contact point 1011 cooperates with the lower end of the first insulator 201 to clamp the packaged chip strip. While ensuring the stability of the packaged chip strip, the packaged chip strip is used to cover the conductive contact point 1011 that it contacts, so that only a very small number of the conductive contact points 1011 are electroplated, or even the conductive contact points 1011 will not be electroplated. When some conductive contact points 1011 are not used to clamp the packaged chip strip, when the conductive contact points 1011 are in contact with the lower end of the first insulator 201, the lower end of the first insulator 201 covers the conductive contact points 1011, which can also ensure that only a very small number of the conductive contact points 1011 are electroplated, or even the conductive contact points 1011 will not be electroplated.

[0030] The clamping end of the elastic clip 2 of the present invention is provided with an injection-molded first insulator 201 outside, so that the elastic clip 2 uses the first insulator 201 to clamp the packaged chip material strip, thereby preventing the elastic clip 2 from being tinned during electroplating, and the conductive bracket 101 is injection-molded with a second insulator 102 outside, and the second insulator 102 wraps the conductive bracket 101 to prevent it from being electroplated. Only a conductive contact point 1011 is provided on one side of the bottom of the conductive bracket 101, which does not affect the electroplating equipment to conduct electricity for the packaged chip material strip through the steel strip body 1. While ensuring the conductivity of the packaged chip material strip, the exposure of the metal on the conductive bracket 101 is reduced. The conductive contact point 1011 cooperates with the lower end of the first insulator 201 to clamp the packaged chip material strip, and while ensuring the stability of the packaged chip material strip, the packaged chip material strip is used to cover its contact. The conductive contact points 1011 that are in contact with the first insulator 201 are covered by the lower end of the first insulator 201, so that only a very small number of the conductive contact points 1011 are plated, or even the conductive contact points 1011 are not plated. When some of the conductive contact points 1011 are not used to clamp the packaged chip material strips, the conductive contact points 1011 are in contact with the lower end of the first insulator 201, and the lower end of the first insulator 201 covers the conductive contact points 1011, which can also make only a very small number of the conductive contact points 1011 be plated, or even the conductive contact points 1011 are not plated. In this way, when electroplating is carried out in the electroplating equipment, tinning on the conductive bracket 101 can be avoided as much as possible while ensuring stable power supply, so that the clamping steel belt can reduce or avoid the loss of electric energy as much as possible during electroplating, and also reduce or avoid the operation of de-plating after unloading.

[0031] As a preferred implementation scheme in this embodiment, it needs to be further explained that the conductive contact point 1011 is a conductive protrusion protruding from the second insulator 102, and the end of the conductive protrusion is a conductive contact surface in contact with the surface of the packaged chip material strip. In this way, the conductive contact point 1011 protrudes a little from the second insulator 102 to stably conduct electricity for the packaged chip material strip, and the packaged chip material strip can be used to maximize the shielding of the conductive contact point 1011. When the conductive contact point 1011 is in contact with the lower end of the first insulator 201, the lower end of the first insulator 201 covers the conductive contact surface, so that only a very small amount of the conductive contact point 1011 can be electroplated, or even the conductive contact point 1011 will not be electroplated.

[0032] As a preferred implementation in this embodiment, it should be further noted that a first insulator adjustment hole is provided in the middle of the conductive bracket 101, which is the same as the prior art. The upper end of the elastic clip 2 is connected to the back of the steel strip body 1 to ensure the stability of the elastic clip 2. The lower end of the first insulator 201 passes through the first insulator adjustment hole and extends to the front of the steel strip body 1. After passing through the front of the steel strip body 1, it is inclined towards the conductive contact port. When the lower end of the first insulator 201 cooperates with the conductive contact point 1011 to clamp and package the chip strip, the lower end of the first insulator 201 is in surface contact with the packaged chip strip surface, thereby ensuring the best clamping effect.

[0033] As a preferred implementation in this embodiment, it should be further noted that the elastic clip 2 includes a torsion spring 202 and a first insulator 201 as the clamping end. One end of the torsion spring 202 is connected to the back of the steel strip body 1. Here, one end of the torsion spring 202 can be directly connected to the back of the steel strip body 1, or one end of the torsion spring 202 can be connected to the back of the steel strip body 1 with the help of other components, such as Figure 1 and Figure 2 shown. And the connection here can be a fixed connection or a detachable snap connection, without specific limitation, as long as the stability of one end of the torsion spring 202 can be ensured. The upper end of the first insulator 201 is connected to the other end of the steel strip body 1. The connection here can be achieved by directly fixing through the injection molding of the first insulator 201, or the first insulator 201 is an independent individual, and the upper end of the first insulator 201 is fixedly connected or abutted against the other end of the steel strip body 1 to ensure that the first insulator 201 can receive the spring force of the torsion spring 202, so as to be able to cooperate with the second insulator 102 to clamp and package the chip strip in the natural state.

[0034] It should be noted here that according to the change of the torsion spring 202 and the installation method, the installation form of the overall structure can be simply adjusted, such as Figure 5 and Figure 6 shown, which is another assembly form of this embodiment.

[0035] As a preferred implementation in this embodiment, it should be further noted that the elastic clip 2 further includes a connecting piece 203. The connecting piece 203 is vertically connected to the back of the steel strip body 1. Here, the connecting piece 203 and the back of the steel strip body 1 can be fixedly connected or snapped, without specific limitation. One end of the torsion spring 202 is connected to the end of the connecting piece 203 away from the steel strip body 1. When the connecting piece 203 is snapped with the steel strip body 1, a strip hole can be provided on the steel strip body 1, and a snap plate is vertically provided at the end of the connecting piece 203. The snap plate passes through the strip hole and is in surface contact with the front of the steel strip body 1, such as Figure 1 andFigure 2 As shown, with the assistance of the torsion spring 202 and the first insulator 201, the stability of the connecting member 203 can be ensured.

[0036] It should be noted that preferably, as Figure 3 shown, a plug hole can be provided at one end of the connecting member 203, and one end of the torsion spring 202 can be directly and fittingly inserted into the plug hole. With the cooperation between the other end of the torsion spring 202 and the first insulator 201 and the second insulator 102, the stability of the torsion spring 202 can be ensured.

[0037] As a preferred implementation in this embodiment, it should be further noted that both the first insulator 201 and the second insulator 102 are made of corrosion-resistant and non-conductive materials. In this embodiment, preferably, corrosion-resistant plastic is used to ensure that the first insulator 201 and the second insulator 102 are not easily corroded and damaged by electroplating solution after long-term use. At the same time, the corrosion-resistant and non-conductive materials also have a certain strength to ensure the clamping and encapsulation of the chip strip.

[0038] Embodiment Two:

[0039] As Figure 3 and Figure 4 shown, this embodiment is a further improvement based on Embodiment One. The specific differences between this embodiment and Embodiment One are as follows:

[0040] As a preferred implementation in the present invention, it should be further noted that a rotating shaft 204 is provided at the other end of the connecting member 203 as Figure 4 shown. The torsion spring 202 is rotatably connected to the rotating shaft 204. In this way, one end of the torsion spring 202 no longer needs to be directly connected to the connecting member 203, but only needs to be in contact with the connecting member 203, which can make the assembly of the structure easier.

[0041] As a preferred implementation in this embodiment, it should be further noted that the first insulator 201 is an independent individual formed by injection molding and is detachably connected to the torsion spring 202. A limiting ring is provided at the upper end of the first insulator 201, and the limiting ring is sleeved outside the rotating shaft 204. In this way, the stability of the first insulator 201 can be ensured. At the same time, with the other end of the torsion spring 202 in contact with the first insulator 201, the first insulator 201 can be made to cooperate with the second insulator 102 to clamp and encapsulate the chip strip under the action of the torsion spring 202.

[0042] Embodiment Three:

[0043] This embodiment is a further improvement based on Embodiment One or Embodiment Two. The specific differences between this embodiment and Embodiment One or Embodiment Two are as follows:

[0044] As a preferred embodiment of the present invention, it should be further noted that the lower end of the first insulator 201 holds and packages one side of the chip strip with a flexible surface that can completely cover the end of the conductive bump 1011. In this way, when the first insulator 201 and the second insulator 102 cooperate to clamp and package the chip strip, the flexible surface can be appropriately deformed, thereby better covering the entire conductive bump 1011 and minimizing the possibility of the conductive bump 1011 being tinned.

[0045] Finally, it should be noted that the above are only the preferred embodiments of the present invention and are not intended to limit the protection scope of the present invention. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principles of the present invention shall be included within the protection scope of the present invention.

Claims

1. An encapsulation chip strip clamping steel belt, comprising a steel belt body (1) and elastic clips (2). A plurality of conductive brackets (101) evenly distributed along the length direction are arranged at the lower end of the steel belt body (1). Each conductive bracket (101) is correspondingly arranged with an elastic clip (2). The upper end of the elastic clip (2) is connected to the steel belt body (1) above the conductive bracket (101). The lower end of the elastic clip (2) is a clamping end that cooperates with the conductive bracket (101) to clamp the encapsulation chip strip. It is characterized in that, The clamping end of the elastic clip (2) is provided with an injection-molded first insulator (201). A second insulator (102) is injection-molded outside the conductive bracket (101). A conductive contact point (1011) for conducting electricity to the encapsulated chip strip is provided on one side of the bottom of the conductive bracket (101). The conductive contact point (1011) cooperates with the lower end of the first insulator (201) to clamp the encapsulated chip strip. When the conductive contact point (1011) abuts against the lower end of the first insulator (201), the lower end of the first insulator (201) covers the conductive contact point (1011).

2. The clamping steel strip for the encapsulated chip strip according to claim 1, characterized in that The conductive contact point (1011) is a conductive protrusion protruding outside the second insulator (102). The end of the conductive protrusion is a conductive contact surface that is in surface contact with the encapsulated chip strip surface. When the conductive contact point (1011) abuts against the lower end of the first insulator (201), the lower end of the first insulator (201) covers the conductive contact surface.

3. A clamping steel strip for an encapsulated chip strip according to claim 1 or 2, characterized in that A first insulator adjustment hole is provided in the middle of the conductive bracket (101). The upper end of the elastic clip (2) is connected to the back surface of the steel strip body (1). The lower end of the first insulator (201) passes through the first insulator adjustment hole and is inclined towards the conductive contact port. When the lower end of the first insulator (201) cooperates with the conductive contact point (1011) to clamp the encapsulated chip strip, the lower end of the first insulator (201) is in surface contact with the encapsulated chip strip.

4. A clamping steel strip for an encapsulated chip strip according to claim 3, characterized in that, The elastic clip (2) includes a torsion spring (202) and a first insulator (201) as the clamping end. One end of the torsion spring (202) is connected to the back surface of the steel strip body (1), and the upper end of the first insulator (201) is connected to the other end of the steel strip body (1).

5. A clamping steel strip for an encapsulated chip strip according to claim 4, wherein, The elastic clip (2) further includes a connecting member (203). The connecting member (203) is vertically connected to the back surface of the steel strip body (1). One end of the torsion spring (202) is connected to the end of the connecting member (203) away from the steel strip body (1).

6. The clamping steel strip for the encapsulated chip strip according to claim 5, wherein A rotating shaft (204) is provided at the other end of the connecting member (203). The torsion spring (202) is rotatably connected to the rotating shaft (204).

7. A clamping steel strip for an encapsulated chip strip according to claim 6, characterized in that, A limiting ring is provided at the upper end of the first insulator (201). The limiting ring is sleeved outside the rotating shaft (204).

8. A clamping steel strip for an encapsulated chip strip according to claim 1, 2, 7 or 8, characterized in that Both the first insulator (201) and the second insulator (102) are made of corrosion-resistant non-conductive materials.

Images