Production process of direct-fitting type metal substrate circuit board
Through the production process of direct bonding metal substrate circuit boards, the problems of environmental pollution and low production efficiency in traditional processes are solved, and environmentally friendly and efficient continuous production is achieved.
Patent Information
- Application Number
- CN202510420154.4
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2025-04-03
- Publication Date
- 2025-07-04
AI Technical Summary
The production process of traditional metal substrate circuit boards leads to environmental pollution and low production efficiency, making it difficult to achieve continuous and efficient production.
The direct-fit metal substrate circuit board production process is adopted. The metal substrate is cleaned and shaped, and the circuit is formed by mechanical or optical processing, and the metal substrate is pasted to the surface of the metal substrate at a set temperature, and then cut and pressed to achieve an etch-free pre-adhesive process.
It avoids chemical waste pollution, reduces excess processes, improves production efficiency, and achieves efficient continuous production.
Smart Images
Figure CN120264598A_ABST
Abstract
Description
Technical Field
[0001] The present invention relates to a production process of a circuit board, and specifically, to a production process of a directly bonded metal substrate circuit board. Background Art
[0002] FR4 material is the core substrate material of a circuit board, and its board manufacturing process is very mature. FR4 is mainly a composite material of epoxy resin and glass fiber. This material has low flexibility. In the circuit board manufacturing process, it must be cut into small sizes suitable for production equipment one by one, and then the printed circuit can be started. It requires multiple processes and cannot be continuously produced. "FR" in FR4 is the English abbreviation of "flame retardant", indicating that this material has flame retardant properties, representing a specification in which the resin material can self-extinguish under a burning state. Therefore, the FR4 substrate is a material substrate that meets this flame retardant grade.
[0003] However, with the development of electronic products towards being light, small, high-density, and multi-functional, it is difficult for FR4 substrates to meet their heat dissipation requirements. As a result, the application of various metal substrates in circuit boards is increasing day by day, while the traditional etching process is still used in the board manufacturing process of metal substrates in the industry. The waste liquid generated by etching is listed in Class HW22 of the National "List of Hazardous Wastes". The waste liquid needs to be secondary-treated to meet the discharge requirements before it can be discharged, resulting in a waste of resources.
[0004] That is to say, in traditional circuit board manufacturing, FR4 substrates are gradually replaced by metal substrates due to insufficient heat dissipation performance, but the metal substrates still use the etching process, generating copper-containing waste liquid (hazardous waste of Class HW22), with high treatment costs and environmental pollution.
[0005] In view of this, it is necessary to propose a more adaptable production process for metal substrate circuit boards. Summary of the Invention
[0006] The basic technical problem to be solved by the present invention is to provide a production process of a directly bonded metal substrate circuit board, which can achieve environmental protection production, solve the problem of environmental pollution, and form convenient conditions for efficient continuous production.
[0007] Furthermore, the problem to be solved by the present invention is to achieve continuous and efficient production of metal substrate circuit boards on the basis of the above technical problems.
[0008] To solve the above basic technical problems, the present invention provides a production process for a direct bonding type metal substrate circuit board, which includes the following steps: a) performing surface cleaning and shaping treatment on the metal substrate; b) mechanically processing or optically processing the circuit raw materials into a set circuit, and pasting the circuit onto the surface of the metal substrate under set temperature conditions so that the circuit is bonded to the metal substrate; or, pasting the circuit raw materials onto the surface of the metal substrate under set temperature conditions so that the circuit raw materials are bonded to the metal substrate, and mechanically processing or optically processing the circuit raw materials into a set circuit after pasting; c) cutting the metal substrate with the circuit pasted thereon to form a single circuit board with set process dimensions; and d) laminating the single circuit board.
[0009] Preferably, the circuit includes a film, a resin layer, and a conductive circuit pattern between the film and the resin layer. One side of the resin layer is bonded and fixed to the conductive circuit pattern, and the other side is bonded to the metal substrate.
[0010] Preferably, the set temperature conditions in step b) are a temperature range that makes the resin layer semi-cured and generates viscosity.
[0011] Typically, the temperature range is 80°C to 120°C, and the thickness range of the resin layer is 50 to 120 μm.
[0012] Specifically, in step c), the cutting is performed by an automated cutting device, and the set process dimensions of the single circuit board formed by cutting are adapted to the lamination process of the circuit board.
[0013] Preferably, after laminating the cut single circuit board, the following processes are sequentially included: printing, window opening, surface treatment, blanking, and inspection.
[0014] Specifically, in step d), the cutting is optical processing or mechanical processing.
[0015] As a further preferred embodiment of the present invention, the metal substrate is a flexible metal coil. In step b), the mechanical processing or optical processing is die cutting, and the circuit or circuit raw materials and the metal substrate are synchronously transported in a roll-to-roll continuous feeding manner.
[0016] Optionally, the metal substrate is an aluminum substrate, a copper substrate, an aluminum alloy substrate, or a copper alloy substrate.
[0017] Specifically, limit detection is performed during the roll-to-roll continuous feeding process so that the pasting position meets the set position accuracy requirements.
[0018] The direct bonding type metal substrate circuit board production process of the above basic method of the present invention proposes a brand-new circuit board production concept, that is, first forming a set circuit by means of mechanical die-cutting of circuit raw materials, and then directly pasting the circuit onto the metal substrate, or pasting the circuit raw materials onto the metal substrate and then die-cutting into a set circuit, and making the paste connection between the two cool and fix. This circuit board processing concept can be widely applied to the metal substrate circuit board industry, avoiding the environmental pollution problems caused by chemical wastes such as waste water and waste liquid generated by the traditional etching process of metal substrate circuit boards due to the use of a large amount of chemicals. At the same time, it reduces many processes such as film pasting, exposure, development, etching, and film removal of traditional metal substrate circuit boards, greatly improving production efficiency and creating convenient conditions for continuous production.
[0019] In a further preferred embodiment of the present invention, the metal substrate of the present invention is semi-cured at a set temperature condition when transported to a specified position, and the circuit or circuit raw materials can be pasted onto the metal substrate through an extrusion mechanism (such as an extrusion roller group). Combining the properties of the metal substrate and the circuit material, it proposes a pre-pasting process without etching, which not only realizes environmental protection production but also realizes efficient continuous production.
[0020] The advantages and effects of other preferred embodiments or specific embodiments of the present invention will be further described in detail in the specific embodiments. BRIEF DESCRIPTION OF THE DRAWINGS
[0021] Figure 1 It is a block diagram of the steps of the direct bonding type metal substrate circuit board production process of the basic embodiment of the present invention;
[0022] Figure 2 It is a process flow chart of the direct bonding type metal substrate circuit board production process of the present invention in a specific implementation, which shows the complete process from the pretreatment of the metal substrate to the cutting of the finished product. DETAILED DESCRIPTION OF THE EMBODIMENTS
[0023] The following will describe in detail the specific embodiments of the present invention with reference to the accompanying drawings. It should be understood that the specific embodiments described herein are only for explaining and illustrating the present invention and are not used to limit the present invention.
[0024] See Figure 1 As shown, the direct bonding type metal substrate circuit board production process of the basic embodiment of the present invention includes the following steps:
[0025] a) Perform surface cleaning and shaping treatment on the metal substrate; and die-cut the circuit raw materials into a set circuit;
[0026] b) Mechanically or optically process the circuit raw material into a set circuit, and paste the circuit onto the surface of the metal substrate under set temperature conditions so that the circuit adheres to the metal substrate; or, paste the circuit raw material onto the surface of the metal substrate under set temperature conditions so that the circuit raw material adheres to the metal substrate, and mechanically or optically process the circuit raw material into a set circuit after pasting;
[0027] c) Cut the metal substrate with the circuit pasted thereon to form a single circuit board with set process dimensions; and
[0028] d) Press the single circuit board.
[0029] It should be additionally noted here that in the above basic embodiment, the cleaning and shaping treatment of the metal substrate can be carried out manually or by using existing metal substrate cleaning equipment. In addition, regarding the die-cutting of the circuit raw material, FDC (flexible die-cut circuit board) has been widely used, which mainly adopts mechanical processing or optical processing. For example, typically, the circuit material is formed into a circuit with a required conductive circuit pattern by mechanical die-cutting.
[0030] The direct bonding type metal substrate circuit board production process in the above basic mode of the present invention essentially proposes a brand-new circuit board production concept, that is, first form a set circuit (i.e., a circuit with a conductive circuit pattern) by mechanical processing or optical processing of the circuit raw material, and then directly paste the circuit onto the metal substrate and make the paste connection between the two cool and fix. It can also paste the circuit raw material onto the metal substrate first and then mechanically or optically process it into a set circuit. This circuit board processing concept can be widely applied to the processing of metal substrate circuit boards, avoiding the environmental pollution problems caused by chemical wastes such as waste water and waste liquid generated by the traditional etching process of metal substrate circuit boards due to the use of a large amount of chemicals. At the same time, it reduces many processes such as film pasting, exposure, development, etching, and film removal of traditional metal substrate circuit boards, greatly improving the production efficiency.
[0031] On the basis of the above basic implementation, as a preferred specific implementation, the above circuit may include a film, a resin layer and a conductive circuit pattern between the film and the resin layer, one side of the resin layer is fixedly attached to the conductive circuit pattern, and the other side is bonded to the metal substrate. In this preferred embodiment, the circuit raw material may initially include a film, a conductive circuit pattern and a resin layer, so that no matter it is mechanically processed or optically processed in advance, or mechanically processed or optically processed afterwards, the circuit has a conductive circuit pattern and a resin layer after mechanical processing or optical processing, and no additional adhesive is required in the subsequent pasting step. The resin layer is semi-cured (i.e. softened) by the set temperature conditions and can be directly pasted. In addition, the advantage of using a resin layer is that when the bonding is completed and cooled and solidified, the resin layer will form a natural insulating barrier between the conductive circuit pattern and the metal substrate, avoiding the need to set an additional insulating layer. Of course, the protection scope of the present invention is not limited to this, and the above circuit may not include a resin layer, and a resin film or other types of adhesives may be additionally applied in the subsequent bonding step, which all belong to the protection scope of the present invention.
[0032] Furthermore, the set temperature condition in the above step b) can be a temperature range that makes the resin layer soften and produce viscosity. For example, the specific temperature range can be 80°C to 120°C, and the thickness of the resin layer can be in the range of 50 to 120 μm, typically 60 μm. It should be noted that the temperature range is not limited to the temperature range listed here. In the case where the circuit does not include a resin layer but an adhesive is additionally applied, as long as the temperature range can keep the adhesive in a fluid viscosity state, it belongs to the range of the set temperature condition of the present invention.
[0033] Preferably, in the above step c), since the circuit board requires high dimensional accuracy, it can generally be cut by a cutting device, preferably, it can be cut by an automated cutting device, and the set process size of the single circuit board formed by cutting is adapted to the subsequent circuit board pressing process. For example, preferably, optical processing or mechanical processing can be used for cutting, specifically, a laser cutting machine or a CNC punching machine can be used.
[0034] Typically, it is well known to those skilled in the art that in order to ensure the quality of circuit boards, improve the appearance of circuit boards, and facilitate external sales, after the individual circuit boards are formed and pressed, the present invention may also include printing (ink printing, silk screen printing), surface treatment, window opening, blanking and testing of the cut individual circuit boards.
[0035] Based on the above various embodiments, particularly preferably, the metal substrate may be a flexible metal coil. In the above step b), the machining or optical processing is die-cutting, and the die-cut circuit or circuit raw material and the metal substrate can be synchronously transported in a roll-to-roll continuous feeding manner.
[0036] The roll-to-roll conveying method is relatively widely used in the coil industry. Generally, it is adopted when one coil needs to be combined with another coil for further processing. Its main implementation structure is generally that one coil is conveyed through its corresponding conveying roller mechanism, and another coil is conveyed through its corresponding another conveying roller mechanism. In the tension part of the coils during conveying, generally, the two coils can be combined through a combining roller or an extrusion roller, and then the combined two coils are pulled out by a traction roller for storage or further processing. In the above further preferred embodiment of the present invention, the present invention innovatively applies the roll-to-roll synchronous conveying and processing method to the processing technology of circuit boards. Since the metal substrate uses a flexible metal coil (such as an aluminum substrate, a copper substrate, an aluminum alloy substrate, or a copper alloy substrate), the metal substrate coil and the circuit raw material or the circuit after die-cutting can be conveyed through their own conveying roller mechanisms respectively, and the die-cut circuit and the metal substrate are synchronously transported in a roll-to-roll continuous feeding manner. When transported to a specified position, the resin layer on the circuit is semi-cured under set temperature conditions, and the circuit or circuit raw material can be pasted onto the metal substrate in the form of a coil through an extrusion mechanism (such as an extrusion roller group). This roll-to-roll continuous conveying and continuous bonding method realizes the continuous production of metal substrate circuit boards. Combining the coil properties of the metal substrate and the conductive circuit material, it proposes a pre-pasting process without etching, which not only realizes environmental protection production but also realizes efficient continuous production. This roll-to-roll continuous production method combining coil characteristics effectively solves the chemical pollution problem and improves production efficiency.
[0037] In the above preferred roll-to-roll embodiment, in order to ensure the bonding position accuracy between the circuit and the metal substrate, more preferably, limit detection can be performed during the roll-to-roll continuous feeding process, so that the bonding position accuracy between the circuit or circuit raw material and the metal substrate meets the set position accuracy requirements.
[0038] From the description of the basic embodiment and the preferred embodiment of the present invention above, it can be seen that the main innovations of the direct bonding type metal substrate circuit board production process provided by the present invention include:
[0039] First, the pre-pasting technology: The present invention semi-cures and bonds the resin layer to the circuit (or circuit raw material) and the metal substrate under set temperature conditions, and performs machining or optical processing before or after bonding, eliminating the etching process;
[0040] Third, high-precision cutting: It is adapted to the subsequent lamination process and supports automated cyclic production.
[0041] See Figure 1 and Figure 2 , in actual production and processing, taking the prior processing of circuit raw materials into circuits as an example, the specific process flow includes metal substrate pretreatment, circuit machining or optical machining, high-temperature pre-pasting, cutting, and subsequent processes. Among them, (1) Metal substrate pretreatment: Clean and shape, for example, an aluminum-based coil, and eliminate the surface oxide layer, such as removing surface oil stains by ultrasonic waves; (2) Circuit machining or optical machining: The copper foil circuit raw materials can be processed into a designed conductive pattern by, for example, a laser engraving machine or a CNC die-cutting machine; (4) Circuit pre-pasting: Soften the resin layer at, for example, 100 °C, and complete the bonding through a rolling device such as a pair of pressing rollers. The bonding between the circuit and the metal substrate is ensured to be firm after cooling and curing to avoid adverse situations such as displacement in the subsequent cutting process; (5) High-precision cutting: Use a laser cutting machine to cut the metal substrate with pre-pasted circuits into, for example, 300 mm × 300 mm single circuit boards; (6) Subsequent processes: The cut units are formed into finished products after lamination, surface treatment, screen printing, blanking and forming, and inspection. In the above steps, after the circuit board is cut, the metal substrate and the conductive circuit raw materials continue to be fed, pasted, and cut, and so on in a cycle to achieve the purpose of automated continuous production.
[0042] In an embodiment of precise production, during the bonding process, a temperature sensor and a vision inspection system can be configured to ensure that the bonding position accuracy meets the requirements, the waste liquid generation amount is zero, and the production cycle is shortened by 40%.
[0043] It can be seen from the above description of the present invention that the direct bonding type metal substrate circuit board production process of the present invention directly bonds circuits or circuit raw materials to the metal substrate. This circuit board processing concept can be widely applied to the metal substrate circuit board industry, avoiding the environmental pollution problems caused by chemical wastes, such as waste water and waste liquid, generated by the traditional etching process of metal substrate circuit boards, and at the same time reducing many time-consuming processes such as film pasting, exposure, development, etching, and film removal of traditional metal substrate circuit boards, greatly improving the production efficiency, and creating convenient conditions for continuous production.
[0044] In particular, in a preferred embodiment of the present invention, in the production process of the direct lamination type metal substrate circuit board of the present invention, the circuit raw materials or the circuits after die-cutting are synchronously transported with the metal substrate in a roll-to-roll continuous feeding manner. When transported to a designated position, the resin layer on the circuit is semi-cured by setting temperature conditions, and the circuit or circuit raw materials can be pasted onto the metal substrate in the form of a roll through an extrusion mechanism (such as an extrusion roller group). This roll-to-roll continuous transportation and continuous bonding method realizes the continuous production of the metal substrate circuit board. Combining the roll properties of the metal substrate and the conductive circuit material, it proposes a pre-pasting process without etching, which not only realizes environmental protection production but also efficient continuous production. This roll-to-roll continuous production method combining the characteristics of the roll effectively solves the chemical pollution problem and improves production efficiency. Specifically, in this preferred method, continuous production can be carried out from the transportation of the conductive circuit raw materials and the metal substrate roll to each process before lamination. The process is simplified, and there is no need for the cumbersome process of conductive pattern etching treatment. The production cycle can be effectively shortened, contributing to the lean production of the circuit board industry. Moreover, the etching process is omitted, no copper-containing waste liquid is generated, and the environmental pollution caused by circuit board production is reduced.
[0045] The preferred embodiments of the present invention have been described in detail above with reference to the accompanying drawings. However, the present invention is not limited to the specific details in the above embodiments. Within the scope of the technical concept of the present invention, various simple modifications can be made to the technical solutions of the present invention, and these simple modifications all fall within the protection scope of the present invention.
[0046] In addition, it should be noted that, in the case of no conflict, the various specific technical features described in the above specific embodiments can be combined in any suitable way. To avoid unnecessary repetition, the present invention will not separately describe various possible combination methods.
[0047] Furthermore, any combination can be made between different embodiments of the present invention as long as it does not violate the idea of the present invention, and it should also be regarded as the content disclosed by the present invention.
Claims
1. A production process for a directly bonded metal substrate circuit board, characterized in that, It includes the following steps: a) Perform surface cleaning and shaping treatment on the metal substrate; b) Mechanically process or optically process the circuit raw material into a set circuit, and paste the circuit onto the surface of the metal substrate under set temperature conditions so that the circuit adheres to the metal substrate; or, paste the circuit raw material onto the surface of the metal substrate under set temperature conditions so that the circuit raw material adheres to the metal substrate, and mechanically process or optically process the circuit raw material into a set circuit after pasting; c) Cut the metal substrate with the circuit pasted thereon to form a single circuit board with set process dimensions; and d) Press the single circuit board.
2. The direct lamination type metal substrate circuit board production process according to claim 1, wherein The circuit includes a film, a resin layer, and a conductive circuit pattern between the film and the resin layer. One side of the resin layer is fixedly attached to the conductive circuit pattern, and the other side is adhered to the metal substrate.
3. The direct bonding type metal substrate circuit board production process according to claim 2, characterized in that, The set temperature conditions in step b) are the temperature range that makes the resin layer semi-cured and generates viscosity.
4. The direct bonding type metal substrate circuit board production process according to claim 3, characterized in that, The temperature range is 80°C to 120°C, and the thickness range of the resin layer is 50 to 120 μm.
5. The direct bonding type metal substrate circuit board production process according to claim 1, characterized in that, In step c), the cutting is performed by an automated cutting device, and the set process dimensions of the single circuit board formed by cutting are adapted to the pressing process of the circuit board.
6. The direct lamination type metal substrate circuit board production process according to claim 5, wherein, After pressing the cut single circuit board, it sequentially further includes processes such as printing, windowing, surface treatment, blanking, and inspection.
7. The direct lamination type metal substrate circuit board production process according to claim 1, wherein, In step c), the cutting is optical processing or mechanical processing.
8. The direct bonding type metal substrate circuit board production process according to any one of claims 1 to 7, characterized in that, The metal substrate is a flexible metal coil. In step b), the mechanical processing or optical processing is die-cutting, and the circuit or circuit raw material and the metal substrate are synchronously transported in a roll-to-roll continuous feeding manner.
9. The direct bonding type metal substrate circuit board production process according to claim 8, characterized in that, The metal substrate is an aluminum substrate, a copper substrate, an aluminum alloy substrate, or a copper alloy substrate.
10. The direct bonding type metal substrate circuit board production process according to claim 8, characterized in that, Limit detection is performed during the roll-to-roll continuous feeding process so that the pasting position meets the requirements of set position accuracy.