Cold plate device
By introducing an ultrasonic generator into the cold plate device, the high-frequency vibration of the ceramic sheet disturbs the flow of coolant, the problem of limited heat dissipation efficiency of the cold plate device is solved, and more efficient heat exchange is achieved, which is suitable for high-power chip testing.
Patent Information
- Application Number
- CN202510501054.4
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2025-04-21
- Publication Date
- 2025-07-04
AI Technical Summary
In semiconductor packaging testing, the heat dissipation efficiency of existing cold plate devices is limited by the fluid laminar flow effect, contact area and material thermal conductivity, making it difficult to meet the needs of efficient heat dissipation.
An ultrasonic generator is introduced into the cold plate device, which generates high-frequency vibration disturbance through the ceramic sheet, breaks the laminar flow boundary layer, increases the contact area and mixing degree between the fluid and the heat sink plate, and promotes heat exchange.
It significantly improves the heat transfer efficiency of the cold plate device and is suitable for scenarios where rapid heat dissipation is required, such as high-power chip testing.
Smart Images
Figure CN120264702A_ABST
Abstract
Description
Technical Field
[0001] The present invention relates to the field of temperature control in semiconductor packaging and testing, and particularly to a cold plate device for accelerating heat transfer. Background Art
[0002] In semiconductor packaging and testing (such as ATE, SLT, Burn-in testing) and high-power electronic devices (such as CPUs, lasers, servers, etc.), temperature control and heat dissipation are crucial. Traditional heat dissipation solutions mainly rely on cold plates and heat sinks. Among them, the cold plate is a closed structure with a coolant channel inside, and heat is carried away through liquid circulation. The materials are mostly copper, aluminum, or stainless steel (anti-corrosion coating is required). Its performance is limited by factors such as fluid laminar flow effect, contact area, and material thermal conductivity. The heat sink transfers the heat generated by the device to the surrounding environment through conduction and convection. In the field of semiconductor packaging, the combination of cold plates and heat sinks is usually involved.
[0003] In the application of semiconductors, especially in the back-end packaging and testing of chips, the quality and performance of the cold plate will directly affect the accuracy of the test results, which also puts higher requirements on the heat dissipation rate of the cold plate. The purpose of the present invention is to achieve more efficient heat transfer by actively disturbing the fluid laminar flow. Summary of the Invention
[0004] Based on this, the present invention aims to overcome the defects of the prior art and provides a cold plate device.
[0005] A cold plate device, which includes:
[0006] A sealing cover and a heat sink. The sealing cover is arranged on the heat sink to form a sealed box body with a cavity inside. The heat sink has a gap structure.
[0007] An ultrasonic generator is arranged between the sealing cover and the heat sink and has a channel (such as a grid-like or net-like structure) that enables the coolant to flow freely between the heat sink and the sealing cover. Its main body is a ceramic thin plate, and both the upper surface and the lower surface of the ceramic thin plate are coated with a conductive coating. Another two wires are respectively connected to the conductive coatings on the upper and lower surfaces and led out for external connection.
[0008] The overall device is a layered and stacked sealed structure. The layers are, in sequence, the sealing cover, the ultrasonic generator, and the heat sink. The connection method of each layer is to fix with screws from the edge; or the ultrasonic generator is buried in the cavity of the box body formed by the sealing cover and the heat sink.
[0009] Further, the upper surface of the ultrasonic generator is provided with grooves.
[0010] Further, two coolant interfaces are arranged on the sealing cover.
[0011] Further, it further includes a spacer. The spacer is in a ring structure and is arranged between the ultrasonic generator and the heat sink plate in a layered superposition manner.
[0012] Further, sealing rings are arranged between adjacent layers of the sealing cover, the ultrasonic generator, the spacer, and the heat sink plate to seal the gaps between the layers; or the gap between the spacer and the heat sink plate is sealed by welding; or the spacer and the heat sink plate are integrated into one component.
[0013] Further, it further includes a temperature controller, such as a ceramic heater, a TEC (Thermo Electric Cooler) heater, etc.
[0014] When the device is operating, the heat sink plate is in direct contact with the component that needs to dissipate heat and absorbs heat. Also, due to its gap structure, the heat is transferred to the coolant. The coolant is injected and led out through two interfaces on the sealing cover, and the heat dissipation effect is achieved through the flow of the coolant. The ultrasonic generator inputs a specific high-frequency voltage through two external wires, causing the piezoelectric ceramic sheet to generate high-frequency up and down vibrations, disturbing and disrupting the coolant flowing inside the gap structure of the heat sink plate, promoting the heat exchange between the coolant and the heat sink plate. At the same time, since the upper surface of the ultrasonic generator has grooves, it can play a guiding role in the coolant, making the coolant more uniform and effectively reducing the flow resistance.
[0015] The advantages of this application compared with the prior art are as follows:
[0016] Through the high-frequency vibration of ultrasonic waves, the flow of the coolant is disturbed, the traditional laminar boundary layer is destroyed, the contact area and mixing degree between the fluid and the heat sink plate are greatly increased, thereby improving the heat transfer efficiency, and it is applicable to scenarios that require rapid heat dissipation (such as high-power chip testing). Description of the Drawings
[0017] Figure 1 It is an exploded view of a cold plate device.
[0018] Figure 2 It is a three-dimensional view of the ultrasonic generator of a cold plate device.
[0019] Figure 3 It is a three-dimensional view of the ultrasonic generator of a cold plate device from another angle.
[0020] Reference Signs in the Drawings:
[0021] 1. Screw; 2. Coolant Interface; 3. Sealing Cover; 4. Sealing Ring; 5. Ultrasonic Generator; 6. Spacer; 7. Heat Sink Plate; 8. Heater; 501. Upper Surface of the Ultrasonic Generator; 502. Lower Surface of the Ultrasonic Generator; 503. Wire; 504. Groove. Detailed implementation manners
[0022] The following describes the implementation manners of the present invention through specific examples. Those skilled in the art can easily understand other advantages and effects of the present invention from the content disclosed in this specification. The present invention can also be implemented or applied through different specific implementation manners. Various details in this specification can also be modified or changed based on different viewpoints and applications without departing from the spirit of the present invention.
[0023] As an embodiment, the present application provides a cold plate device, as Figure 1 shown, its main structure includes:
[0024] A sealing cover 3 and a heat sink plate 7 are hermetically connected to form a sealed box body with a cavity inside. The box body is filled with a coolant, and the coolant can flow between the gap structures of the heat sink plate 7. An ultrasonic generator 5 is encapsulated between the sealing cover 3 and the heat sink plate 7, as Figure 2 , Figure 3 shown. The ultrasonic generator 5 has a channel that enables the coolant to flow freely between the heat sink plate 7 and the sealing cover 3. Its main body is a ceramic thin plate structure. Both the upper surface 501 and the lower surface 502 of the ceramic thin plate are coated with a conductive coating as electrodes. Two wires 503 are respectively connected to the conductive coatings on the upper and lower surfaces for inputting a high-frequency alternating voltage of a specific frequency. The frequency mainly depends on the gap structure of the heat sink plate 7, causing the ceramic thin plate to vibrate up and down at a high frequency. Ultrasonic waves of a specific frequency can effectively penetrate into the gap structure of the heat sink plate 7, disturbing and disrupting the coolant flowing inside the heat sink plate 7, thereby breaking the laminar flow of the fluid and promoting the heat exchange efficiency between the heat sink plate 7 and the coolant, and accelerating heat transfer.
[0025] As an embodiment, the device further includes a spacer 6. The overall device is a layered stacked sealing structure. Each layer is sequentially the sealing cover 3, the ultrasonic generator 5, the spacer 6, and the heat sink plate 7. The spacer 6 is a ring-shaped structure, and its function is to provide a stable installation base for the ultrasonic generator 5 to prevent it from being displaced due to vibration or fluid pressure. In addition, the spacer 6 is arranged between the ultrasonic generator 5 and the heat sink plate 7, and the internal space of its ring-shaped structure can provide sufficient flow space for the coolant.
[0026] The ultrasonic generator 5 is a grid-like structure, enabling the coolant to flow freely between the heat sink plate 7 and the sealing cover 3. The upper surface 501 of the ultrasonic generator 5 is provided with grooves 504 for guiding the flow, which can make the coolant more uniform and effectively reduce the flow resistance.
[0027] Two coolant interfaces 2 are provided on the sealing cover 3 for injecting and discharging the coolant.
[0028] A sealing ring 4 is also provided between adjacent layers and layer edges to seal the gaps between the layers and prevent the leakage of the coolant. The layers are fixed by screws 1, and gaskets are provided at the fixing positions of the screws 1 on the sealing cover 3, which can ensure the sealing performance of the entire box body and prevent the leakage of the coolant from the fixing positions.
[0029] As another embodiment, the sealing between the spacer block 6 and the heat sink plate 7 is not achieved by the sealing ring 4, but by welding.
[0030] As another embodiment, the spacer block 6 and the heat sink plate 7 are integrated into one part, and then are hermetically connected to the ultrasonic generator 5 and the sealing cover 3.
[0031] As another embodiment, the ultrasonic generator 5 is not arranged in a layered stacking manner, but is completely buried in the sealed box body composed of the sealing cover 3 and the heat sink plate 7, and the external connection of its wire 503 is sealed with a sealant or a sealing ring 4 to prevent the leakage of the coolant.
[0032] As another embodiment, a heater 8, such as a ceramic heater, a TEC heater, etc., is also provided on the device. The setting of the heater 8 enables the cold plate to have the function of active temperature control, rather than being limited to being used as a radiator.
[0033] The above is only the preferred specific implementation manner of the present invention, but the protection scope of the present invention is not limited thereto. Any changes or substitutions that can be easily thought of by those skilled in the art within the technical scope disclosed by the present invention should be covered by the protection scope of the present invention. Therefore, the protection scope of the present invention should be subject to the protection scope of the claims.
Claims
1. A cold plate device, characterized in that, Comprising: A sealing cover and a heat sink plate. The sealing cover is disposed on the heat sink plate, and a sealed box body with a cavity inside is formed by sealing. The heat sink plate has a slit structure. An ultrasonic generator, disposed between the sealing cover and the heat sink plate, having a channel that enables the coolant to flow freely between the heat sink plate and the sealing cover. Its main body is a ceramic thin sheet, and both the upper surface and the lower surface of the ceramic thin sheet are coated with conductive coatings. Additionally, two wires are respectively connected to the conductive coatings on the upper and lower surfaces and led out for external connection.
2. The cold plate device according to claim 1, wherein: There are grooves on the upper surface of the ultrasonic generator.
3. A cold plate device according to claim 2, characterized in that: Two coolant interfaces are provided on the sealing cover.
4. A cold plate device according to claim 3, wherein: The whole device is a layered and stacked sealing structure. The layers are, in sequence, the sealing cover, the ultrasonic generator, and the heat sink plate. The connection method of each layer is to be fixed with screws from the edge.
5. The cold plate device according to claim 4, characterized in that: It further includes a spacer. The spacer is in a ring structure and is disposed between the ultrasonic generator and the heat sink plate in a layered stacking manner.
6. The cold plate device according to claim 5, characterized in that: Sealing rings are provided between adjacent layers of the sealing cover, the ultrasonic generator, the spacer, and the heat sink plate to seal the gaps between the layers.
7. The cold plate device according to claim 5, wherein: The spacer and the heat sink plate are sealed by welding.
8. The cold plate device according to claim 5, characterized in that: The spacer and the heat sink plate are integrated into one component.
9. A cold plate device according to claim 1, characterized in that: The ultrasonic generator is buried in the cavity of the box body formed by the sealing cover and the heat sink plate.
10. A cold plate device according to claim 1, characterized in that: It further includes a heater.