Carrier module PCB welding device and welding method

Abstract

The invention relates to the technical field of carrier module production, in particular to a carrier module PCB welding device and method. The device comprises a fixing piece and a machining piece arranged on the fixing piece. According to the welding device, when the pre-welding structure slides upwards, the welding flux flows out to wrap the pin of the electronic component, meanwhile, the supply structure is driven to reset, and when the pre-welding structure moves downwards to reset, the supply structure is driven to clamp the welding wire and drive the welding wire to enter the pre-welding structure to be heated and melted to form new welding flux; as the lengths of the welding wires are consistent when the supply structure drives the welding wires to enter the pre-welding structure every time, the amount of the welding flux formed by melting the welding wires through the pre-welding structure every time is consistent, that is, the amount of the welding flux used for welding every time in the welding machining process of the carrier module PCB is consistent, the situation that the welding flux is too little can be avoided, and the welding quality of the carrier module PCB is improved. And the condition of excessive welding flux can be avoided, so that the welding processing quality of the carrier module PCB is ensured.

Description

Technical Field

[0001] The present invention relates to the technical field of carrier module production, and specifically, to a welding device and a welding method for a carrier module PCB board. Background Technique

[0002] A carrier module is a communication device that uses existing power lines or other media as transmission media to achieve data transmission through modulation and demodulation technologies. A carrier module PCB board is a specially designed circuit board that usually contains multiple electronic components and circuits, such as oscillators, filters, amplifiers, etc. These components are connected by copper wire traces on the PCB board to form a complete circuit system.

[0003] When welding a PCB board, generally, electronic components are installed on the front side of the PCB board, and the pins of the electronic components pass through the PCB board. Then, on the back side of the PCB board, welding wire and an electric soldering iron are used to perform welding treatment on the pins. Specifically, the operator aligns the end of the welding wire with the pin, and then uses the electric soldering iron to heat the end of the welding wire, so that the end of the welding wire melts into liquid solder to coat the pin. Then, the solder cools and solidifies to complete the fixation of the pin and the PCB board. The difficulty lies in that during manual welding, factors such as the operator's skill level, experience, and fatigue degree will all affect the welding quality, and it is impossible to precisely control the amount of solder melted to form solder during each welding process. Too little solder will weaken the mechanical strength and electrical connectivity of the solder joint, and it is easy to fall off or generate high impedance, while too much solder will cause the solder to overflow, form a "solder mountain" and contact adjacent solder joints, resulting in a short circuit between pins or pads.

[0004] In order to precisely control the amount of solder and avoid too much or too little solder, a welding device and a welding method for a carrier module PCB board are proposed. Summary of the Invention

[0005] The purpose of the present invention is to provide a welding device and a welding method for a carrier module PCB board to solve the problems raised in the above background technique.

[0006] To achieve the above purpose, one of the purposes of the present invention is to provide a welding device for a carrier module PCB board, including a fixing member and a processing member disposed on the fixing member, and the fixing member is used to fix the PCB board and electronic components;

[0007] The workpiece to be processed includes a sleeve and a welding body. The sleeve is connected to one end of the top of the fixing member. The welding body includes a housing and a supply structure and a pre-welding structure that are slidably connected to the inner wall of the housing. The housing is slidably connected to one end of the sleeve. The pre-welding structure is slidably connected to the supply structure. The supply structure is used to place and drive the wire to move. The pre-welding structure is used to heat and melt the wire to obtain solder. When sliding on the pre-welding structure, the solder flows out through the bottom end of the pre-welding structure, and at the same time drives the supply structure to reset and clamp the wire. When the pre-welding structure moves down and resets, it drives the supply structure to move, and then drives the wire into the pre-welding structure to be heated and melted to form new solder.

[0008] As a further improvement of this technical solution, the fixing member includes a processing plate, a vertical plate, and a flipping body. The vertical plate is arranged at one end of the top of the processing plate. A first screw shaft is rotatably connected to the vertical plate. The flipping body includes a first connection block and a right-angled plate rotatably connected to the first connection block. The first connection block is slidably connected up and down to the inner wall of the vertical plate. The first screw shaft is threadedly connected to the first connection block. The right-angled plate is provided with a fixing plate body for fixing the PCB board and a fixing member body for fixing electronic components.

[0009] As a further improvement of this technical solution, a vertical shaft is arranged at the diagonal end of the processing plate opposite to the vertical plate. The sleeve is sleeved on the vertical shaft for adjusting the height of the welding body up and down. A second connection plate is arranged at one end of the sleeve. A back plate is arranged on the back side of the housing. The housing is slidably connected to the second connection plate for adjusting the horizontal position of the housing. The pre-welding structure includes a movable rod and a heating plate located in the housing. The top end of the movable rod is slidably connected up and down to the inner wall of the housing, and the movable rod is elastically connected to the inner wall of the housing. A rod core groove for the solder to pass through is opened in the movable rod. The top end of the rod core groove penetrates the side wall of the movable rod, and the bottom of the rod core groove penetrates the bottom of the movable rod. A pre-melting groove for heating and melting the wire to obtain solder is opened in the heating plate.

[0010] As a further improvement of this technical solution, a placement groove for placing the wire is opened on the surface of the housing. Two displacement grooves symmetric about the axis of the placement groove are opened on the inner wall of the housing. The supply structure includes two engaging blocks that are slidably connected to the displacement grooves for contacting the wire. The engaging blocks are also slidably connected to the movable rod.

[0011] As a further improvement of this technical solution, a connecting frame is arranged on one side of the middle of the movable rod. The engaging block is a plate body with a groove matching the wire on its surface, and cube-shaped protrusions for slidably connecting to the connecting frame are arranged at both ends of the plate body. A round shaft protrusion slidably connected to the displacement groove is also arranged at one end of the cube-shaped protrusion away from the plate body.

[0012] As a further improvement of the technical solution, the placement groove is a cylindrical groove with an inner diameter matching the outer diameter of the welding wire.

[0013] As a further improvement of the technical solution, both the fixed plate body and the fixed part body include a plurality of adsorption structures arranged on the right-angle plate. The adsorption structure includes a second connecting block and a first connecting plate inserted and matched with the second connecting block. The second connecting block is slidably connected to the right-angle plate. On both upper and lower sides of one end of the first connecting plate, a second screw shaft and a suction cup are respectively arranged. The second screw shaft is rotatably connected to one end of the first connecting plate. The suction cup is threadedly connected to the second screw shaft through a set screw.

[0014] As a further improvement of the technical solution, the narrowed part at the bottom end of the movable rod is made of a heat-dissipating material, and a shaping groove for solder shaping is provided at the narrowed part at the bottom end of the movable rod. The top end of the shaping groove is communicated with the bottom end of the rod core groove.

[0015] As a further improvement of the technical solution, the axis of the movable rod is perpendicular to the horizontal plane.

[0016] The second object of the present invention is to further provide a method of welding using the carrier module PCB board welding device as described above, including the following steps:

[0017] S1. Place the PCB board or electronic component on the suction cup, and rotate the second screw shaft so that the suction cup adsorbs and fixes the PCB board or electronic component.

[0018] S2. Slide the second connecting block along the right-angle plate to pass the pins of the electronic component through the PCB board, then rotate the right-angle plate to expose the back of the PCB board and the pins of the electronic component. Hold the sleeve and move it up and down along the vertical shaft, and horizontally slide the housing along the second connecting plate so that the bottom end of the movable rod contacts the pins of the electronic component on the back of the PCB board.

[0019] S3. Move the housing downward to drive the movable rod to move into the housing. The movable rod drives the engaging blocks to move from the lower dead point to the upper dead point of the displacement groove until the two engaging blocks reach the upper dead point and clamp the welding wire together. And the top end of the rod core groove is communicated with the pre-melting groove, and the solder in the pre-melting groove flows out through the rod core groove to coat the pins.

[0020] S4. Move the housing upward away from the back of the PCB board and move it to other solder joints. The movable rod moves downward to the bottom end of the housing, driving the engaging blocks to move along the displacement groove to the lower dead point. The bottom end of the welding wire enters the pre-melting groove and is heated and melted to form new solder, which is temporarily stored in the pre-melting groove, and so on in a cycle.

[0021] Compared with the prior art, the beneficial effects of the present invention:

[0022] 1. In the welding device and method for the PCB board of the carrier module, when the pre-welding structure slides upward, the solder flows out and wraps the pins of the electronic components. At the same time, it drives the supply structure to reset and clamp the welding wire. When the pre-welding structure moves downward and resets, it drives the supply structure to move, thereby driving the welding wire into the pre-welding structure and being heated and melted to form new solder. Since the length of the welding wire is the same each time the supply structure drives the welding wire into the pre-welding structure, the amount of solder formed by melting the welding wire through the pre-welding structure is the same each time. That is, the amount of solder used for welding is the same each time during the welding process of the PCB board of the carrier module, which can avoid the situation that the mechanical strength and electrical connectivity of the solder joints are weakened due to too little solder, and can also avoid the situation that the solder overflows due to too much solder, forming a "solder mountain" and contacting adjacent solder joints, resulting in short circuits between pins or pads, thus ensuring the welding quality of the PCB board of the carrier module.

[0023] 2. In the welding device and method for the PCB board of the carrier module, the narrowed part at the bottom of the movable rod is made of heat-dissipating material, and a shaping groove for solder shaping is provided at the narrowed part at the bottom of the movable rod. During welding, the pins of the electronic components are placed in the shaping groove, and then the solder flows into the shaping groove. After the heat is quickly dissipated through the narrowed part at the bottom of the movable rod, the solder cools and solidifies to complete the wrapping of the pins. The role of the shaping groove is to restrict the flowing solder, so that the solidified solder is in a regular cylindrical shape, ensuring the mechanical strength and electrical connectivity of the solder joints. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] Figure 1 It is a schematic diagram of the overall structure of the present invention;

[0025] Figure 2 It is a sectional view of the fixing part in the overall components of the present invention;

[0026] Figure 3 It is a schematic diagram of the cooperation between the vertical plate and the flipping body structure of the present invention;

[0027] Figure 4 It is a partial sectional view of the adsorption structure of the present invention;

[0028] Figure 5 It is a schematic diagram of the connection between the vertical shaft and the welding part structure of the present invention;

[0029] Figure 6 It is a schematic diagram of the cooperation between the second connecting plate and the welding body structure of the present invention;

[0030] Figure 7 It is a sectional view of the welding body structure of the present invention;

[0031] Figure 8 is Figure 7 a schematic enlarged view of the structure at A in

[0032] Figure 9 isFigure 7 Schematic enlarged view of the structure at B in

[0033] Figure 10 Schematic diagram of the structure movement during welding of the present invention.

[0034] The meanings of each label in the figure are as follows:

[0035] 1. Fixing part; 11. Processing plate; 12. Vertical plate; 121. First screw shaft; 13. Flipping body; 131. First connecting block; 132. Right-angle plate; 133. Adsorption structure; 1331. Second connecting block; 1332. First connecting plate; 1333. Second screw shaft; 1334. Suction cup; 14. Vertical shaft;

[0036] 2. Workpiece to be processed; 21. Sleeve; 22. Second connecting plate; 23. Welding body; 231. Back plate; 232. Housing; 2321. Placing groove; 2322. Displacement groove; 2323. Biting block; 233. Movable rod; 2331. Rod core groove; 2332. Connecting frame; 2333. Shaping groove; 234. Heating plate; 2341. Pre-melting groove. Detailed implementation manners

[0037] Next, the technical solutions in the embodiments of the present invention will be clearly and completely described in conjunction with the accompanying drawings in the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments in the present invention, all other embodiments obtained by those of ordinary skill in the art without making creative efforts shall fall within the protection scope of the present invention.

[0038] In the description of the present invention, it should be understood that the orientation or positional relationships indicated by the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", etc. are based on the orientation or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of the present invention.

[0039] In addition, the terms "first" and "second" are only used for descriptive purposes and cannot be understood as indicating or implying relative importance or implicitly specifying the quantity of the indicated technical features. Thus, the features defined with "first" and "second" may explicitly or implicitly include one or more of such features. In the description of the present invention, "a plurality" means two or more, unless otherwise specifically defined.

[0040] Please refer to Figure 1 、Figure 5 , Figure 6 As shown in Figure 6 , one of the purposes of this embodiment is to provide a welding device for a carrier module PCB board, which includes a fixing member 1 and a processing member 2 disposed on the fixing member 1. The fixing member 1 is used to fix the PCB board and electronic components;

[0041] The processing member 2 includes a sleeve 21 and a welding body 23. The sleeve 21 is connected to one end of the top of the fixing member 1. The welding body 23 includes a housing 232 and a supply structure and a pre-welding structure that are slidably connected to the inner wall of the housing 232. The housing 232 is slidably connected to one end of the sleeve 21. The pre-welding structure is slidably connected to the supply structure. The supply structure is used to place and drive the movement of the welding wire. The pre-welding structure is used to heat and melt the welding wire to obtain solder. When the pre-welding structure slides upward, the solder flows out through the bottom end of the pre-welding structure, and at the same time drives the supply structure to reset and clamp the welding wire. When the pre-welding structure moves downward and resets, it drives the supply structure to move, and then drives the welding wire into the pre-welding structure to be heated and melted to form new solder.

[0042] First, use the fixing member 1 to fix the PCB board and electronic components. After the pins of the electronic components pass through the PCB board, turn it over so that the back of the PCB board faces upward. Then, control the welding body 23 to approach a solder joint on the back of the PCB board, that is, the position of the pins of the electronic components, through the sleeve 21. Then, use the up and down movement of the pre-welding structure to drive the supply structure to replenish the welding wire into the pre-welding structure. Specifically, when the housing 232 descends close to the back of the PCB board, the pre-welding structure slides upward along the inner wall of the back plate 231 under the extrusion of the back of the PCB board, so that the solder in the pre-welding structure flows out through the bottom end of the pre-welding structure to cover the pins of the electronic components, and at the same time drives the supply structure to reset and clamp the welding wire. Subsequently, control the housing 232 to move upward away from the back of the PCB board and move to other solder joints. The pre-welding structure moves downward and resets to drive the supply structure to move, and then drives the welding wire into the pre-welding structure to be heated and melted to form new solder, and so on.

[0043] Since the length of the welding wire is the same each time the supply structure drives the welding wire into the pre-welding structure, the amount of solder formed by melting the welding wire through the pre-welding structure is the same each time, that is, the amount of solder used for welding is the same each time during the welding process of the carrier module PCB board, neither too much nor too little. It can avoid the situation that the mechanical strength and electrical connectivity of the solder joints are weakened due to too little solder, and can also avoid the situation that the solder overflows due to too much solder, forming a "solder mountain" and contacting adjacent solder joints, resulting in a short circuit between the pins or pads, thus ensuring the welding quality of the carrier module PCB board.

[0044] The above structure is disclosed as follows:

[0045] First, it is necessary to fix the PCB board and electronic components, such as Figure 1 , Figure 2 , Figure 3 ,Figure 4 As shown, the fixing member 1 includes a processing plate 11, a vertical plate 12 and a flipping body 13. The vertical plate 12 is arranged at one end of the top of the processing plate 11. A first screw shaft 121 is rotatably connected to the vertical plate 12. The flipping body 13 includes a first connecting block 131 and a right-angle plate 132 rotatably connected to the first connecting block 131. The first connecting block 131 is slidably connected to the inner wall of the vertical plate 12 up and down. The first screw shaft 121 is threadedly connected to the first connecting block 131. The right-angle plate 132 is provided with a fixing plate body for fixing the PCB board and a fixing member body for fixing electronic components.

[0046] Furthermore, both the fixing plate body and the fixing member body include a plurality of adsorption structures 133 arranged on the right-angle plate 132. The adsorption structure 133 includes a second connecting block 1331 and a first connecting plate 1332 inserted and matched with the second connecting block 1331. The second connecting block 1331 is slidably connected to the right-angle plate 132. On both sides of one end of the first connecting plate 1332, a second screw shaft 1333 and a suction cup 1334 are respectively arranged. The second screw shaft 1333 is rotatably connected to one end of the first connecting plate 1332. A screw rod is arranged in the middle of one end of the suction cup 1334 close to the second screw shaft 1333. Part of the screw rod is located in the second screw shaft 1333. The suction cup 1334 is threadedly connected to the second screw shaft 1333 through the arranged screw rod.

[0047] Place the PCB board or electronic components on the suction cup 1334. Rotate the second screw shaft 1333 to deform the suction cup 1334, so that the volume of the closed space formed between the suction cup 1334 and the surface of the PCB board or electronic components increases, forming negative pressure. Then, utilize the atmospheric pressure to realize the adsorption and fixation of the suction cup 1334 to the PCB board or electronic components. Hold the first handle arranged at the other end of the first connecting plate 1332, drive the second connecting block 1331 to slide along the right-angle plate 132, adjust the position of the electronic components relative to the PCB board, move the electronic components to the installation position on the PCB board, and make the pins of the electronic components pass through the PCB board. Then rotate the right-angle plate 132 to flip the PCB board and the electronic components, exposing the back of the PCB board and the pins of the electronic components. During the flipping process, the height of the first connecting block 131 can be adjusted by rotating the first screw shaft 121 to avoid the right-angle plate 132 being blocked by the processing plate 11 when flipping.

[0048] After completing the fixation of the PCB board and the electronic components and making the back of the PCB board face up, such as Figure 2 , Figure 5 , Figure 6 , Figure 7 , Figure 8As shown, a vertical shaft 14 is provided at the diagonal end of the processing plate 11 opposite to the vertical plate 12. A sleeve 21 is sleeved on the vertical shaft 14 for adjusting the height of the welding body 23 up and down. One end of the sleeve 21 is provided with a second connecting plate 22. A back plate 231 is provided on the back side of the housing 232. The housing 232 is slidably connected to the second connecting plate 22 through the provided back plate 231 for adjusting the horizontal position of the housing 232. The pre-welding structure includes a movable rod 233 and a heating plate 234 located inside the housing 232. The top end of the movable rod 233 is slidably connected to the inner wall of the housing 232 up and down, and the movable rod 233 is elastically connected to the inner wall of the housing 232 through a spring provided on the surface. A rod core groove 2331 for the solder to pass through is opened in the movable rod 233. The top end of the rod core groove 2331 penetrates the side wall of the movable rod 233, and the bottom end of the rod core groove 2331 penetrates the bottom of the movable rod 233. A pre-melting groove 2341 for heating and melting the welding wire to obtain solder and temporarily storing the solder is opened in the heating plate 234.

[0049] Hold the second handle provided on the surface of the sleeve 21, so that the sleeve 21 moves up and down along the vertical shaft 14, and slide the housing 232 horizontally along the second connecting plate 22, so that the bottom end of the movable rod 233 contacts the pins of the electronic components on the back of the PCB board. When contacting, the movable rod 233 is squeezed to move into the housing 232 against the spring force until the top end of the rod core groove 2331 communicates with the pre-melting groove 2341. The solder in the pre-melting groove 2341 flows out through the rod core groove 2331 to the pins to coat the pins, and the welding of the pins can be completed after the solder cools.

[0050] In addition, a placement groove 2321 for placing the welding wire is opened on the surface of the housing 232. Two displacement grooves 2322 symmetric about the axis of the placement groove 2321 are opened on the inner wall of the housing 232. The supply structure includes engaging blocks 2323 respectively located in the two displacement grooves 2322 and slidably connected to the displacement grooves 2322 for contacting the welding wire. The engaging blocks 2323 are also slidably connected to the movable rod 233. Specifically, a connecting frame 2332 is provided on one side of the middle part of the movable rod 233. The engaging block 2323 is a plate body with grooves matching the welding wire opened on the surface, and square body protrusions for slidably connecting with the connecting frame 2332 are provided at both ends of the plate body. A round shaft protrusion for slidably connecting with the displacement groove 2322 is also provided at one end of the square body protrusion away from the plate body.

[0051] The cooperative movement principle of the pre-welding structure and the supply structure is as Figure 10As shown, when the bottom end of the movable rod 233 contacts the pins of the electronic components on the back of the PCB board, the movable rod 233 is squeezed to move into the housing 232 against the spring force along the arrow a. During the movement, the movable rod 233 drives the engaging block 2323 that is slidably connected to the connecting frame 2332 to move, so that the engaging block 2323 moves from the lower dead point to the upper dead point of the displacement groove 2322 until the two engaging blocks 2323 reach the upper dead point and clamp the welding wire together. At this time, as shown by the arrow b, the top end of the rod core groove 2331 is communicated with the pre-melting groove 2341, so that the solder in the pre-melting groove 2341 flows out through the rod core groove 2331 to the pin to coat the pin. Then, when the housing 232 moves up and away from the back of the PCB board and moves to other solder joints, under the action of the spring force, the movable rod 233 moves along the arrow c to the bottom end of the housing 232. When moving, it will drive the engaging block 2323 to move along the displacement groove 2322 to the lower dead point, and the engaging block 2323 will further pull the welding wire towards the heating plate 234, so that the bottom end of the welding wire enters the pre-melting groove 2341 and is heated and melted to form new solder. And because the rod core groove 2331 is not communicated with the pre-melting groove 2341 at this time, the solder is temporarily stored in the pre-melting groove 2341 and waits to flow out when the rod core groove 2331 is communicated with the pre-melting groove 2341 again, and so on in cycles.

[0052] It should be noted that, considering the weldability of the pins of the electrical components and the PCB board, tin-based welding wires are generally selected. However, the material of the tin-based welding wires is soft and easy to deform. If the welding wire placed in the placement groove 2321 is not in a quasi-straight shape, during the merging process of the two engaging blocks 2323, the welding wire not only cannot be clamped into the groove of the plate body, but also affects the complete merging of the two engaging blocks 2323. Therefore, the placement groove 2321 is a cylindrical groove with an inner diameter matching the outer diameter of the welding wire. After the end of the welding wire is placed in the placement groove 2321, the shape of the welding wire can be adjusted to a quasi-straight shape through the placement groove 2321, so as to facilitate the clamping of the welding wire into the groove of the plate body and the traction of the welding wire during the merging of the two engaging blocks 2323.

[0053] In addition, please refer to Figure 9As shown in the figure, the narrowed part at the bottom end of the movable rod 233 is made of heat-dissipating material, and a shaping groove 2333 for solder shaping is provided in the narrowed part at the bottom end of the movable rod 233. The top end of the shaping groove 2333 communicates with the bottom end of the rod core groove 2331. During welding, the pins of the electronic components are placed in the shaping groove 2333, and then the solder flows out into the shaping groove 2333. After the heat is quickly dissipated through the narrowed part at the bottom end of the movable rod 233, the solder cools and solidifies to complete the coating of the pins. The function of the shaping groove 2333 is to restrict the flowing solder, so that the solidified solder is in a regular cylindrical shape, which can ensure the mechanical strength and electrical connectivity of the solder joints. Then, when the solder is shaped, it is necessary to avoid the angle between the bottom end of the movable rod 233 and the surface of the PCB board being too large, which may cause the flowing solder to flow out of the shaping groove 2333. The axis of the movable rod 233 is perpendicular to the horizontal plane. When fixing the PCB board, the right-angle plate 132 is flipped so that the back surface of the PCB board coincides with the horizontal plane, and then the housing 232 is brought closer to the PCB board, which can ensure that the bottom end of the movable rod 233 fits the surface of the PCB board or maintains a small angle, and can prevent the flowing solder from flowing out of the shaping groove 2333, ensuring the shaping effect of the solidified solder.

[0054] The second object of this embodiment is to further provide a method for welding using the above-mentioned carrier module PCB board welding device. The specific steps are as follows:

[0055] S1. Place the PCB board or electronic components on the suction cup 1334, and rotate the second screw shaft 1333 to increase the volume of the closed space formed between the suction cup 1334 and the surface of the PCB board or electronic components to form a negative pressure, thereby adsorbing and fixing the PCB board or electronic components.

[0056] S2. Slide the second connecting block 1331 along the right-angle plate 132 to move the electronic components to the installation position on the PCB board, and make the pins of the electronic components pass through the PCB board. Then rotate the right-angle plate 132 to flip the PCB board and the electronic components, exposing the back surface of the PCB board and the pins of the electronic components. Hold the sleeve 21 and move it up and down along the vertical shaft 14, and horizontally slide the housing 232 along the second connecting plate 22, so that the bottom end of the movable rod 233 contacts the pins of the electronic components on the back surface of the PCB board.

[0057] S3. Move the housing 232 downward to drive the movable rod 233 to move into the housing 232. The movable rod 233 drives the engaging blocks 2323 to move from the lower dead point to the upper dead point of the displacement groove 2322 until the two engaging blocks 2323 reach the upper dead point and clamp the welding wire together. And the top end of the rod core groove 2331 communicates with the pre-melting groove 2341, so that the solder in the pre-melting groove 2341 flows out through the rod core groove 2331 to the pins to coat the pins.

[0058] S4. Then, the housing 232 moves upward away from the back of the PCB board and moves to other solder joints. The movable rod 233 moves toward the bottom end of the housing 232, driving the engaging block 2323 to move downward to the bottom dead center along the displacement slot 2322. The bottom end of the welding wire enters the pre-melting groove 2341 and is heated and melted to form new solder, which is temporarily stored in the pre-melting groove 2341, and this process repeats.

[0059] The foregoing has shown and described the basic principles, main features, and advantages of the present invention. Those skilled in the art should understand that the present invention is not limited by the above embodiments. The above embodiments and the descriptions in the specification are only preferred examples of the present invention and are not used to limit the present invention. Without departing from the spirit and scope of the present invention, the present invention will have various changes and improvements, and all these changes and improvements fall within the scope of the present invention claimed. The scope of the present invention claimed is defined by the appended claims and their equivalents.

Claims

1. A welding device for a carrier module PCB board, characterized in that: It includes a fixing member (1) and a processing member (2) provided on the fixing member (1), and the fixing member (1) is used to fix the PCB board and electronic components; The processing member (2) includes a sleeve (21) and a welding body (23). The sleeve (21) is connected to one end of the top of the fixing member (1). The welding body (23) includes a housing (232) and a supply structure and a pre-welding structure that are slidably connected to the inner wall of the housing (232). The housing (232) is slidably connected to one end of the sleeve (21). The pre-welding structure is slidably connected to the supply structure. The supply structure is used to place and drive the welding wire to move. The pre-welding structure is used to heat and melt the welding wire to obtain solder. When sliding on the pre-welding structure, the solder flows out through the bottom end of the pre-welding structure, and at the same time drives the supply structure to reset and clamp the welding wire. When the pre-welding structure moves down and resets, it drives the supply structure to move, and then drives the welding wire into the pre-welding structure to be heated and melted to form new solder.

2. The carrier module PCB board soldering device according to claim 1, characterized in that: The fixing member (1) includes a processing plate (11), a vertical plate (12) and a flipping body (13). The vertical plate (12) is provided at one end of the top of the processing plate (11). A first screw shaft (121) is rotatably connected to the vertical plate (12). The flipping body (13) includes a first connecting block (131) and a right-angle plate (132) rotatably connected to the first connecting block (131). The first connecting block (131) is slidably connected up and down with the inner wall of the vertical plate (12). The first screw shaft (121) is threadedly connected to the first connecting block (131). The right-angle plate (132) is provided with a fixing plate body for fixing the PCB board and a fixing member body for fixing electronic components.

3. The carrier module PCB board soldering device according to claim 2, characterized in that: A vertical shaft (14) is provided at the diagonal end of the processing plate (11) opposite to the vertical plate (12). The sleeve (21) is sleeved on the vertical shaft (14) for adjusting the height of the welding body (23) up and down. A second connecting plate (22) is provided at one end of the sleeve (21). A back plate (231) is provided on the back side of the housing (232). The housing (232) is slidably connected to the second connecting plate (22) for adjusting the horizontal position of the housing (232). The pre-welding structure includes a movable rod (233) and a heating plate (234) located in the housing (232). The top end of the movable rod (233) is slidably connected up and down with the inner wall of the housing (232), and the movable rod (233) is elastically connected to the inner wall of the housing (232). A rod core groove (2331) for the solder to pass through is formed in the movable rod (233). The top end of the rod core groove (2331) penetrates the side wall of the movable rod (233), and the bottom of the rod core groove (2331) penetrates the bottom of the movable rod (233). A pre-melting groove (2341) for heating and melting the welding wire to obtain solder is formed in the heating plate (234).

4. The carrier module PCB board soldering device according to claim 3, characterized in that: A placement groove (2321) for placing a welding wire is formed on the surface of the housing (232). Two displacement grooves (2322) that are symmetric about the axis of the placement groove (2321) are formed on the inner wall of the housing (232). The supply structure includes two engaging blocks (2323) that are slidably connected to the displacement grooves (2322) and are used to contact the welding wire. The engaging blocks (2323) are also slidably connected to the movable rod (233).

5. The carrier module PCB board soldering device according to claim 4, wherein: A connecting frame (2332) is provided on one side of the middle part of the movable rod (233). The engaging block (2323) is a plate body with a groove matching the welding wire formed on its surface. Cuboid protrusions for slidably connecting the connecting frame (2332) are provided at both ends of the plate body. A round shaft protrusion that is slidably connected to the displacement groove (2322) is further provided at one end of the cuboid protrusion away from the plate body.

6. The carrier module PCB board soldering device according to claim 4, characterized in that: The placement groove (2321) is a cylindrical groove with an inner diameter matching the outer diameter of the welding wire.

7. The carrier module PCB board soldering device according to claim 2, characterized in that: Both the fixed plate body and the fixed part body include a plurality of adsorption structures (133) provided on the right-angle plate (132). The adsorption structure (133) includes a second connecting block (1331) and a first connecting plate (1332) that is inserted and matched with the second connecting block (1331). The second connecting block (1331) is slidably connected to the right-angle plate (132). Second screw shafts (1333) and suction cups (1334) are respectively provided on the upper and lower sides of one end of the first connecting plate (1332). The second screw shafts (1333) are rotatably connected to one end of the first connecting plate (1332). The suction cups (1334) are threadedly connected to the second screw shafts (1333) through the provided screw rods.

8. The carrier module PCB board soldering device according to claim 3, characterized in that: The narrowed part at the bottom end of the movable rod (233) is made of a heat-dissipating material. A shaping groove (2333) for shaping the solder is formed in the narrowed part at the bottom end of the movable rod (233). The top end of the shaping groove (2333) communicates with the bottom end of the rod core groove (2331).

9. The carrier module PCB board soldering device according to claim 3, characterized in that: The axis where the movable rod (233) is located is perpendicular to the horizontal plane.

10. A method of welding using the carrier module PCB board welding device according to any one of claims 1-9, characterized in that, It includes the following steps: S1. Place the PCB board or electronic component on the suction cup (1334), and rotate the second screw shaft (1333) so that the suction cup (1334) adsorbs and fixes the PCB board or electronic component. S2. Slide the second connecting block (1331) along the right-angle plate (132) to pass the pins of the electronic component through the PCB board, then rotate the right-angle plate (132) to expose the back of the PCB board and the pins of the electronic component. Hold the sleeve (21) and move it up and down along the vertical shaft (14), and horizontally slide the housing (232) along the second connecting plate (22) so that the bottom end of the movable rod (233) contacts the pins of the electronic component on the back of the PCB board. S3. Move the housing (232) downward to drive the movable rod (233) to move into the housing (232). The movable rod (233) drives the engaging block (2323) to move from the lower dead point to the upper dead point of the displacement groove (2322) until the two engaging blocks (2323) reach the upper dead point and merge to clamp the welding wire. And the top of the rod core groove (2331) communicates with the pre-melting groove (2341), and the solder in the pre-melting groove (2341) flows out through the rod core groove (2331) to coat the pin. S4. Move the housing (232) upward away from the back of the PCB board and move to other solder joints. The movable rod (233) moves toward the bottom end of the housing (232) to drive the engaging block (2323) to move along the displacement groove (2322) to the lower dead point. The bottom end of the welding wire enters the pre-melting groove (2341) and is heated and melted to form new solder and is temporarily stored in the pre-melting groove (2341), and so on in a cycle.

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