High-precision high-speed eutectic machine

Abstract

The invention relates to a high-precision and high-speed eutectic machine which integrates a substrate feeding module, a wafer feeding module, an eutectic module, a correction module and a discharging module through a rack and is matched with the cross-module conveying capacity of a material transplanting module, so that multi-process seamless connection is realized, the material turnover time is shortened, the production efficiency is improved by more than 30%, and meanwhile, the occupied area of equipment is saved; the eutectic module and the chip correction module are respectively provided with a first multi-dimensional correction device and a second multi-dimensional correction device, support X / Y / theta axis and other multi-degree-of-freedom fine adjustment, and can automatically compensate the assembly error of the substrate and the chip, realize high-precision alignment and obviously improve the bonding yield to 99.5% or above; the substrate feeding module and the wafer feeding module are driven by the Y-axis linear module to be accurately positioned, automatic suction of the material transplanting module and automatic suction of the finished product discharging module are combined, unmanned operation of the whole process from raw materials to finished products is achieved, the pollution risk caused by manual intervention is reduced, and the labor cost is saved by 50%.

Description

Technical Field

[0001] The present invention relates to the technical field of eutectic machines, and particularly to a high-precision and high-speed eutectic machine. Background Art

[0002] Eutectic technology is a key process in semiconductor packaging and microelectronic device manufacturing, which realizes high-precision bonding between chips and substrates through molten solder. The following problems generally exist in traditional eutectic equipment: 1. Dispersed processes: Feeding of substrates, positioning of chips, eutectic operation, and unloading of finished products require the cooperation of multiple devices. The process connection efficiency is low, and the floor area is large; 2. Insufficient precision: The alignment between chips and substrates relies on manual intervention or single-dimensional mechanical adjustment, making it difficult to meet the multi-dimensional micron-level precision requirements of high-density and miniaturized devices; 3. Low degree of automation: The transfer of materials relies on manual labor or independent robotic arms, resulting in a slow production tempo and high labor costs.

[0003] Therefore, there is an urgent need for a highly integrated, multi-dimensionally precisely controllable, and fully automated eutectic equipment to improve production efficiency and process consistency. Summary of the Invention

[0004] The present invention aims to solve at least one of the problems existing in the related art to a certain extent. For this purpose, the present invention provides a high-precision and high-speed eutectic machine.

[0005] To achieve the above object, the present invention provides the following technical solutions:

[0006] A high-precision and high-speed eutectic machine includes a frame. A material transfer module is arranged on the frame, and a substrate loading module, an eutectic module, a chip calibration module, and a wafer loading module are arranged on the front side of the material transfer module;

[0007] The substrate loading module includes a substrate placement seat for placing the substrate to be eutectic and a first Y-axis linear module for driving the substrate placement seat to move along the Y-axis;

[0008] The eutectic module includes an eutectic stage and a first multi-dimensional deviation correction device for driving multi-dimensional adjustment of the eutectic stage;

[0009] The wafer loading module includes a wafer fixture plate and a second Y-axis linear module for driving the wafer fixture plate to move along the Y-axis;

[0010] The chip calibration module includes a calibration stage for carrying the chip and a second multi-dimensional deviation correction device for driving multi-dimensional adjustment of the calibration stage;

[0011] Wherein, the material transfer module performs transfer and transportation between the substrate loading module, the eutectic module, the chip calibration module, and the wafer loading module;

[0012] It further includes a finished product blanking module, which is used to pick up and blank the products that have completed eutectic bonding on the eutectic table.

[0013] In some embodiments, the material transfer module includes a first arched frame disposed on the frame. A transverse slide rail arranged along the X-axis direction is provided on the first arched frame. Three sets of sliders slide automatically on the transverse slide rail. A first adsorption component and a first vision positioning camera are provided on each slider.

[0014] In some embodiments, the first multi-dimensional deviation correction device has the same structure as the second multi-dimensional deviation correction device. Specifically, both include a Y-axis slider, an X-axis slider disposed on the Y-axis slider, and a θ-axis adjustment frame disposed on the X-axis slider. The eutectic table or the calibration table is disposed on the θ-axis adjustment frame.

[0015] In some embodiments, through holes are formed through the wafer fixture plate. The wafer loading module further includes a lifting component disposed on the frame and below the wafer fixture plate. The lifting component is used to lift the wafer chips on the wafer fixture plate upward from below at the through holes. A first auxiliary detection camera is also provided on one side of the lifting component.

[0016] In some embodiments, a bottom camera positioning module is provided on the frame and between the eutectic module and the chip calibration module. The bottom camera positioning module is used for secondary vision positioning of the wafer chips.

[0017] In some embodiments, a second auxiliary detection camera is also provided on one side of the eutectic table.

[0018] In some embodiments, the finished product blanking module includes a second arched frame disposed on the frame. A first X-axis linear module that moves along the X-axis is provided on the second arched frame. A second adsorption component and a second vision positioning camera are respectively provided on the sliding seat of the first X-axis linear module. A third Y-axis linear module that moves along the Y-axis is also provided on the frame. A support seat is provided on the slide seat of the third Y-axis linear module. A finished product carrier plate is detachably installed on the support seat. A fourth Y-axis linear module that moves along the Y-axis is also provided on the frame. The first multi-dimensional deviation correction device is disposed on the sliding seat of the fourth Y-axis linear module.

[0019] In some embodiments, a mounting seat is provided at the rear side of the lower end of the finished product carrier plate, and a limiting component for restricting the movement of the mounting seat is provided on the upper end surface of the support seat. The limiting component includes a first baffle plate provided at the rear side of the upper end of the support seat and extending in the left-right direction. A limiting plate extending forward is provided at the upper end of the first baffle plate. A limiting groove is formed between the limiting plate and the support seat. A second baffle plate for restricting the mounting seat from moving to the left is provided at the left side of the upper end of the support seat. A first elastic limiting part that is vertically telescopic and used for restricting the mounting seat from moving to the right is provided at the right side of the upper end of the support seat. A second elastic limiting part that is vertically telescopic and used for restricting the mounting seat from moving forward is provided at the front side of the upper end of the support seat. A clamping strip is provided at the rear side of the mounting seat. After the mounting seat is connected and installed with the support seat, the clamping strip is snapped into the limiting groove.

[0020] In some embodiments, an extension seat is provided on the frame and in front of the third Y-axis linear module. A conveyor belt for conveying along the Y-axis is provided on the extension seat. A first air cylinder is provided along the extension seat. The piston rod of the first air cylinder moves in the front-rear direction and is provided with a seat body. An elastic hook body is provided at the upper end of the seat body. A connecting seat is provided at the lower end of the finished product carrier plate and in front of the mounting seat. The elastic hook body can be hooked on the connecting seat, and the first air cylinder is used to pull the finished product carrier plate onto the conveyor belt. A first support plate for supporting the finished product carrier plate during movement is further provided on the extension seat.

[0021] In some embodiments, a stacking machine for placing the finished product carrier plates is provided on the frame and at the right side of the third Y-axis linear module. A second support plate for supporting the finished product carrier plate during movement is provided under the stacking machine. A second air cylinder is provided on the first support plate. The piston rod of the second air cylinder moves left and right and is provided with an L-shaped pulling plate. The L-shaped pulling plate can abut against the connecting seat, and when the second air cylinder works, the finished product carrier plates on the stacking machine are pulled from right to left, and the clamping strip at the lower end of the finished product carrier plate is snapped into the limiting groove on the support seat.

[0022] Compared with the prior art, the beneficial effects of the present invention are:

[0023] 1. By integrating the substrate loading module, wafer loading module, eutectic module, calibration module and unloading module on the frame, and cooperating with the cross-module conveying ability of the material transfer module, seamless connection of multiple processes is realized, the material turnover time is reduced, the production efficiency is increased by more than 30%, and at the same time, the floor area of the equipment is saved;

[0024] 2. The eutectic module and the chip calibration module are respectively equipped with the first and second multi-dimensional deviation correction devices, which support multi-degree-of-freedom fine-tuning such as X / Y / θ axes, can automatically compensate for the assembly error between the substrate and the chip, achieve high-precision alignment, and significantly improve the bonding yield to more than 99.5%;

[0025] 3. The substrate loading module and the wafer loading module are accurately positioned by the Y-axis linear module. Combining the automatic suction of the material transfer module and the automatic suction of the finished product unloading module, it realizes the full-process unmanned operation from raw materials to finished products, reduces the pollution risk caused by manual intervention, and saves 50% of the labor cost;

[0026] 4. Each module is independently designed and its parameters are adjustable, supporting the rapid switching of different sizes of substrates, wafers and process parameters, compatible with the eutectic requirements of various products such as LEDs, radio frequency devices, and optical communication modules, and shortening the changeover time. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] Figure 1 It is one of the three-dimensional structure diagrams of the first embodiment of the present invention;

[0028] Figure 2 It is the second three-dimensional structure diagram of the first embodiment of the present invention;

[0029] Figure 3 It is the top view structure diagram of the first embodiment of the present invention;

[0030] Figure 4 It is the structure diagram of the eutectic module of the present invention;

[0031] Figure 5 It is the structure diagram of the wafer loading module of the present invention;

[0032] Figure 6 It is the three-dimensional structure diagram of the second embodiment of the present invention;

[0033] Figure 7 It is one of the partial structure diagrams of the second embodiment of the present invention;

[0034] Figure 8 It is the second partial structure diagram of the second embodiment of the present invention;

[0035] Figure 9 It is the schematic diagram when the elastic hook body of the present invention is hooked on the connecting seat;

[0036] Figure 10 It is the structure diagram of the support seat and the finished product carrier plate of the present invention;

[0037] Figure 11 It is the structure diagram of the support seat of the present invention. DETAILED DESCRIPTION OF THE INVENTION

[0038] The following specific implementation details provide various different embodiments or examples for implementing the present invention. Of course, these are only embodiments or examples and are not intended to be restrictive. Additionally, repeated reference numerals may be used in different embodiments, such as repeated numbers and / or letters. These repetitions are for the purpose of simply and clearly describing the present invention and do not represent a specific relationship between the different embodiments and / or structures being discussed.

[0039] First Embodiment:

[0040] As Figures 1-5 shown, a high-precision and high-speed eutectic machine includes a machine frame 1. A material transfer module 2 is provided on the machine frame 1. A substrate loading module 3, an eutectic module 4, a chip alignment module 5, and a wafer loading module 6 are provided on the front side of the material transfer module 2;

[0041] The substrate loading module 3 includes a substrate placement seat 31 for placing the substrate to be eutectic, and a first Y-axis linear module 32 for driving the substrate placement seat 31 to move along the Y-axis;

[0042] The eutectic module 4 includes an eutectic stage 41 and a first multi-dimensional alignment device 42 for driving the multi-dimensional adjustment of the eutectic stage 41;

[0043] The wafer loading module 6 includes a wafer fixture plate 61, and a second Y-axis linear module 62 for driving the wafer fixture plate 61 to move along the Y-axis;

[0044] The chip alignment module 5 includes an alignment stage 51 for carrying the chip and a second multi-dimensional alignment device 52 for driving the multi-dimensional adjustment of the alignment stage 51;

[0045] Among them, the material transfer module 2 performs transfer and transportation between the substrate loading module 3, the eutectic module 4, the chip alignment module 5, and the wafer loading module 6;

[0046] It further includes a finished product unloading module 7, and the finished product unloading module 7 is used to suck and unload the products that have completed eutectic on the eutectic stage 41.

[0047] According to the above structure, by integrating the substrate loading, wafer loading, eutectic, alignment, and unloading modules on the machine frame 1, and cooperating with the cross-module transportation ability of the material transfer module, seamless connection of multiple processes is achieved, the material turnover time is reduced, the production efficiency is increased by more than 30%, and at the same time, the floor area of the equipment is saved.

[0048] The eutectic module 4 and the chip alignment module 5 are respectively configured with the first and second multi-dimensional alignment devices, supporting multi-degree-of-freedom fine adjustment such as X / Y / θ axes, which can automatically compensate for the assembly errors between the substrate and the chip, achieve high-precision alignment, and significantly improve the bonding yield to more than 99.5%.

[0049] The substrate loading and wafer loading modules are driven by a Y-axis linear module for precise positioning. Combined with the automatic suction of the material transfer module and the automatic suction of the finished product unloading module, it realizes the unmanned operation of the entire process from raw materials to finished products, reduces the pollution risk caused by manual intervention, and saves 50% of labor costs.

[0050] Each module is independently designed and its parameters are adjustable, supporting rapid switching of different sizes of substrates, wafers, and process parameters, compatible with the eutectic requirements of various products such as LEDs, radio frequency devices, and optical communication modules, and shortening the changeover time.

[0051] During operation, the material transfer module 2 sucks the substrate to be eutectic on the substrate loading module 3 onto the eutectic stage 41, and the position of the eutectic stage 41 can be finely adjusted through the first multi-dimensional deviation correction device 42. At the same time, the material transfer module 2 also sucks the wafer chips on the wafer loading module 6 onto the calibration stage 51 and corrects them through the second multi-dimensional deviation correction device 52. Then, the corrected chips are sucked and placed on the eutectic stage for eutectic processing with the substrate.

[0052] Furthermore, the material transfer module 2 includes a first arched frame 21 provided on the frame 1. A transverse slide rail 22 arranged in the X-axis direction is provided on the first arched frame 21. Three slide tables 23 slide automatically on the transverse slide rail 22. A first adsorption component 24 and a first vision positioning camera 25 are provided on each slide table 23. Thus, before taking materials, the first adsorption component 24 can read the X / Y / θ positions and offsets of each product before taking materials through the first vision positioning camera 25, so as to perform deviation correction and processing in the next step.

[0053] See Figure 4 As shown, the first multi-dimensional deviation correction device 42 and the second multi-dimensional deviation correction device 52 have the same structure. Among them, both include a Y-axis slide table 43, an X-axis slide table 44 provided on the Y-axis slide table 43, and a θ-axis adjustment frame 45 provided on the X-axis slide table 44. The eutectic stage 41 or the calibration stage 51 is provided on the θ-axis adjustment frame 45.

[0054] See Figure 5 As shown, through holes 63 penetrate through the wafer fixture board 61. The wafer loading module 6 further includes a lifting component 64 provided on the frame 1 and located below the wafer fixture board 61. The lifting component 64 is used to lift the wafer chips on the wafer fixture board 61 upward at the through holes 63. A first auxiliary detection camera 65 is also provided on one side of the lifting component 64.

[0055] Furthermore, a bottom camera positioning module 8 is provided on the frame 1 and located between the eutectic module 4 and the chip calibration module 5. The bottom camera positioning module 8 is used for secondary vision positioning of the wafer chips.

[0056] In the present invention, second auxiliary detection cameras 46 are provided on one side of both the eutectic stage 41 and the substrate loading module 3.

[0057] It is worth mentioning that during the transplanting process, there are three parts that affect the accuracy. One is the accuracy of the nozzle sucking the product, the second is the influence of the transfer station on its accuracy during the transplanting process, and the third is the monitoring and identification processing of the product incoming accuracy.

[0058] The present invention solves and optimizes these three points as follows: 1. By setting the first vision positioning camera 25, before the first adsorption component 24 picks up the material, the X / Y / θ positions and offsets of each product before picking up the material can be read through the first vision positioning camera 25, so as to perform deviation correction and processing in the next step; 2. The picking nozzle of the first adsorption component 24 for the incoming material is also crucial for its accuracy, because too high and too low picking states will affect the states of the product and the nozzle after sucking, thus affecting the final mounting accuracy. By setting the second auxiliary detection camera 46, by monitoring and taking pictures from a certain angle on the side, the uniqueness and reasonable state of the picking state of each nozzle are ensured, so as to ensure the uniqueness of the transferred product; 3. After the nozzle of the first adsorption component 24 picks up the material in the present invention, a chip correction module 5 and a bottom camera positioning module 8 are provided. The reasons are: one is to adjust the posture of the incoming product to be consistent with the mounting base, and the other is that after the nozzle adsorbs the product, due to the length of the path and the vacuum stability state during the transplanting process, the adsorbed posture may be affected.

[0059] In the present invention, the finished product unloading module 7 includes a second arched frame 71 provided on the frame 1. A first X-axis linear module 72 moving along the X axis is provided on the second arched frame 71. A second adsorption component 73 and a second vision positioning camera 74 are respectively provided on the sliding seat of the first X-axis linear module 72. A third Y-axis linear module 75 moving along the Y axis is further provided on the frame 1. A support seat 76 is provided on the slide table seat of the third Y-axis linear module 75. A finished product carrier plate 77 is detachably installed on the support seat 76. A fourth Y-axis linear module 78 moving along the Y axis is further provided on the frame 1. The first multi-dimensional deviation correction device 42 is provided on the sliding seat of the fourth Y-axis linear module 78; when the eutectic of the product on the eutectic stage 41 is completed, the first multi-dimensional deviation correction device 42 and the eutectic stage 41 are moved forward to the lower part of the second adsorption component 73 through the fourth Y-axis linear module 78, and the product is sucked onto the finished product carrier plate 77 by the second adsorption component 73.

[0060] Embodiment 2:

[0061] The difference between Embodiment 2 and Embodiment 1 is that the finished product carrier plate 77 can be automatically changed, further improving the degree of automation.

[0062] SeeFigures 6-11 As shown in the figure, a mounting seat 80 is provided at the rear side of the lower end of the finished product carrier plate 77. A limiting component for restricting the movement of the mounting seat 80 is provided on the upper surface of the support seat 76. The limiting component includes a first baffle 81 provided at the rear side of the upper end of the support seat 76 and extending in the left-right direction. A limiting plate 83 extending forward is provided at the upper end of the first baffle 81. A limiting groove 84 is formed between the limiting plate 83 and the support seat 76. A second baffle 85 for restricting the leftward movement of the mounting seat 80 is provided at the left side of the upper end of the support seat 76. A first elastic limiting part 87 which is vertically telescopic and used for restricting the rightward movement of the mounting seat 80 is provided at the right side of the upper end of the support seat 76. A second elastic limiting part 88 which is vertically telescopic and used for restricting the forward movement of the mounting seat 80 is provided at the front side of the upper end of the support seat 76. A clamping bar 86 is provided at the rear side of the mounting seat 80. After the mounting seat 80 is connected and installed with the support seat 76, the clamping bar 86 is snapped into the limiting groove 84.

[0063] It should be noted that the first elastic limiting part 87 and the second elastic limiting part 88 have the same structure, both including a spring and a stop block, and the upper end corners of the stop block are provided with rounded corners. When limiting and fixing the mounting seat 80, the stop block presses and limits the mounting seat 80 under the action of the spring. When the external force is greater than the spring force, the stop block can retract, so that the mounting seat 80 can be disassembled.

[0064] Furthermore, an extension seat 91 is provided on the frame 1 and in front of the third Y-axis linear module 75. A conveyor belt 92 for conveying along the Y-axis is provided on the extension seat 91. A first air cylinder 93 is arranged along the extension seat 91. The piston rod of the first air cylinder 93 moves in the front-rear direction and is provided with a seat body 94. An elastic hook body 95 is provided at the upper end of the seat body 94. A connecting seat 96 is provided at the lower end of the finished product carrier plate 77 and in front of the mounting seat 80. The elastic hook body 95 can be hooked on the connecting seat 96, and the first air cylinder 93 pulls the finished product carrier plate 77 onto the conveyor belt 92. A first support plate 97 for supporting the finished product carrier plate 77 during movement is also provided on the extension seat 91.

[0065] It should be noted that the elastic hook body 95 is similar in structure to the first elastic limiting part 87. The front side of the upper end of the hook body is a straight surface structure, and the rear side is an inclined surface structure. When the hook body moves towards the connecting seat 96, the inclined surface structure abuts against the connecting seat 96 and the hook body retracts. After passing the connecting seat 96, the hook body moves upward under the action of the spring. Then when the hook body moves forward, the straight surface structure of the hook body abuts against the connecting seat 96, thereby driving the connecting seat 96 and the finished product carrier plate 77 to move together.

[0066] Further, a stacking machine 10 for placing the finished product carrier plate 77 is arranged on the frame 1 and on the right side of the third Y-axis linear module 75. A second support plate 11 for supporting the finished product carrier plate 77 during movement is arranged under the stacking machine 10. A second cylinder 12 is arranged on the first support plate 97. The piston rod of the second cylinder 12 moves left and right and is provided with an L-shaped pulling plate. The L-shaped pulling plate can abut against the connecting seat 96, and the finished product carrier plate 77 on the stacking machine 10 is pulled from right to left by the operation of the second cylinder 12, and the clamping strip 86 at the lower end of the finished product carrier plate 77 is snapped into the limiting groove 84 on the support seat 76.

[0067] When the finished product carrier plate 77 is replaced, the finished product carrier plate 77 moves forward through the third Y-axis linear module 75. At this time, the finished product carrier plate 77 on the third Y-axis linear module 75 is correspondingly arranged with the stacking machine 10 on the right side (as Figure 7 shown). Then, the first cylinder 93 drives the seat body 94 and the elastic hook body 95 to move along with the finished product carrier plate 77, and the elastic hook body 95 is hooked on the connecting seat 96. The first cylinder 93 hooks the connecting seat 96 through the elastic hook body 95 and moves forward. Since the force is greater than the elastic force of the second elastic limiting portion 88, the support seat 76 is separated from the second elastic limiting portion 88, and then the finished product carrier plate 77 is pulled onto the conveyor belt 92 for conveying. Then, through the L-shaped pulling plate on the second cylinder 12, the finished product carrier plate 77 at the lowermost end of the stacking machine 10 is pulled to the left side. The clamping strip 86 of the pulled-out finished product carrier plate 77 is snapped into the limiting groove 84 on the support seat 76. Then, the second baffle 85 limits the left side of the support seat 76. At the same time, the first elastic limiting portion 87 and the second elastic limiting portion 88 respectively limit the left side and the front side of the support seat 76, so as to realize the plate replacement work.

[0068] Combined with the drawings and the above display and description, the basic principles, main features and advantages of the present invention have been described. Those skilled in the art of this industry should understand that the present invention is not limited by the above embodiments. What is described in the above embodiments and the specification only illustrates the principles of the present invention. Without departing from the spirit and scope of the present invention, the present invention will have various changes and improvements, and these changes and improvements all fall within the scope of the present invention claimed. The scope of protection claimed by the present invention is defined by the appended claims and their equivalents.

Claims

1. A high-precision and high-speed eutectic machine, comprising a machine frame (1), characterized in that: A material transfer module (2) is provided on the frame (1). A substrate loading module (3), an eutectic module (4), a chip alignment module (5), and a wafer loading module (6) are provided on the front side of the material transfer module (2); The substrate loading module (3) includes a substrate placement seat (31) for placing the substrate to be eutectic, and a first Y-axis linear module (32) for driving the substrate placement seat (31) to move along the Y-axis; The eutectic module (4) includes an eutectic stage (41) and a first multi-dimensional alignment device (42) for driving the multi-dimensional adjustment of the eutectic stage (41); The wafer loading module (6) includes a wafer fixture plate (61), and a second Y-axis linear module (62) for driving the wafer fixture plate (61) to move along the Y-axis; The chip alignment module (5) includes an alignment stage (51) for carrying the chip and a second multi-dimensional alignment device (52) for driving the multi-dimensional adjustment of the alignment stage (51); Among them, the material transfer module (2) performs transfer and transportation between the substrate loading module (3), the eutectic module (4), the chip alignment module (5), and the wafer loading module (6); It further includes a finished product unloading module (7), and the finished product unloading module (7) is used for sucking and unloading the products completed in eutectic on the eutectic stage (41).

2. A high-precision and high-speed eutectic machine according to claim 1, characterized in that: The material transfer module (2) includes a first arch frame (21) provided on the frame (1). A transverse slide rail (22) is provided on the first arch frame (21) along the X-axis direction. Three sets of slide tables (23) slide automatically on the transverse slide rail (22). A first adsorption component (24) and a first vision positioning camera (25) are provided on each of the slide tables (23).

3. The high-precision and high-speed eutectic machine according to claim 1, characterized in that: The first multi-dimensional alignment device (42) and the second multi-dimensional alignment device (52) have the same structure. Among them, both include a Y-axis slide table (43), an X-axis slide table (44) provided on the Y-axis slide table (43), and a θ-axis adjustment frame (45) provided on the X-axis slide table (44). The eutectic stage (41) or the alignment stage (51) is provided on the θ-axis adjustment frame (45).

4. A high-precision and high-speed eutectic machine according to claim 1, characterized in that: Through holes (63) penetrate through the wafer fixture plate (61). The wafer loading module (6) further includes a lifting component (64) provided on the frame (1) and located below the wafer fixture plate (61). The lifting component (64) is used to lift the wafer chips on the wafer fixture plate (61) upward from below at the through holes (63). A first auxiliary detection camera (65) is further provided on one side of the lifting component (64).

5. A high-precision and high-speed eutectic machine according to claim 1, characterized in that: A bottom camera positioning module (8) is provided on the frame (1) and between the eutectic module (4) and the chip alignment module (5). The bottom camera positioning module (8) is used for secondary vision positioning of the wafer chips.

6. The high-precision and high-speed eutectic machine according to claim 1, wherein: Second auxiliary detection cameras (46) are provided on one side of both the eutectic stage (41) and the substrate loading module (3).

7. A high-precision and high-speed eutectic machine according to claim 1, characterized in that: The finished product blanking module (7) includes a second arched frame (71) provided on the frame (1). A first X-axis linear module (72) that moves along the X-axis is provided on the second arched frame (71). A second adsorption component (73) and a second vision positioning camera (74) are respectively provided on the sliding seat of the first X-axis linear module (72). A third Y-axis linear module (75) that moves along the Y-axis is further provided on the frame (1). A support seat (76) is provided on the slide table seat of the third Y-axis linear module (75). A finished product carrier plate (77) is detachably installed on the support seat (76). A fourth Y-axis linear module (78) that moves along the Y-axis is further provided on the frame (1). The first multi-dimensional deviation correction device (42) is provided on the sliding seat of the fourth Y-axis linear module (78).

8. A high-precision and high-speed eutectic machine according to claim 7, characterized in that: An installation seat (80) is provided at the rear side of the lower end of the finished product carrier plate (77). A limiting component for restricting the movement of the installation seat (80) is provided on the upper end surface of the support seat (76). The limiting component includes a first baffle (81) provided at the rear side of the upper end of the support seat (76) and extending in the left-right direction. A limiting plate (83) extending forward is provided at the upper end of the first baffle (81). A limiting groove (84) is formed between the limiting plate (83) and the support seat (76). A second baffle (85) for restricting the installation seat (80) from moving to the left is provided at the left side of the upper end of the support seat (76). A first elastic limiting part (87) that expands and contracts vertically and is used for restricting the installation seat (80) from moving to the right is provided at the right side of the upper end of the support seat (76). A second elastic limiting part (88) that expands and contracts vertically and is used for restricting the installation seat (80) from moving forward is provided at the front side of the upper end of the support seat (76). A clamping bar (86) is provided at the rear side of the installation seat (80). After the installation seat (80) is connected and installed with the support seat (76), the clamping bar (86) is clamped into the limiting groove (84).

9. The high-precision and high-speed eutectic machine according to claim 8, wherein: An extension seat (91) is provided on the frame (1) and in front of the third Y-axis linear module (75). A conveyor belt (92) that conveys along the Y-axis is provided on the extension seat (91). A first air cylinder (93) is provided along the extension seat (91). The piston rod of the first air cylinder (93) moves in the front-rear direction and is provided with a seat body (94). An elastic hook body (95) is provided at the upper end of the seat body (94). A connecting seat (96) is provided at the front side of the lower end of the finished product carrier plate (77) and below the installation seat (80). The elastic hook body (95) can be hooked on the connecting seat (96), and the first air cylinder (93) is used to pull the finished product carrier plate (77) onto the conveyor belt (92). A first support plate (97) for supporting the finished product carrier plate (77) during movement is further provided on the extension seat (91).

10. A high-precision and high-speed eutectic machine according to claim 9, characterized in that: On the frame (1) and on the right side of the third Y-axis linear module (75), there is a stacking machine (10) for placing the finished product carrier plate (77). Below the stacking machine (10), there is a second support plate (11) for supporting the finished product carrier plate (77) when it moves. On the first support plate (97), there is a second cylinder (12). The piston rod of the second cylinder (12) moves left and right and is provided with an L-shaped pull plate. The L-shaped pull plate can abut against the connecting seat (96), and the finished product carrier plate (77) on the stacking machine (10) is pulled from right to left by the operation of the second cylinder (12), so that the card strip (86) at the lower end of the finished product carrier plate (77) is clamped into the limit groove (84) on the support seat (76).

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