Pressing device for processing Mini LED printed circuit board

Abstract

The invention provides a pressing device for processing a Mini LED printed circuit board, and belongs to the technical field of circuit board processing. Comprising an equipment box body, a control module is installed on one side of the surface of the equipment box body, a discharging opening is formed in the surface of one side of the equipment box body in a penetrating mode, feeding openings are formed in the other surfaces of the equipment box body in a penetrating mode, hot pressing equipment is installed at the top end of the inner wall of the equipment box body, and an oil cylinder is installed on one side of the bottom end of the inner wall of the equipment box body; an installation frame is installed at the top end of the oil cylinder, a conveying belt set is installed on one side of the inner wall of the top end of the installation frame, every two conveying belts in the conveying belt set are arranged up and down, and the conveying belts in the conveying belt set are made of rubber and Teflon composite materials. By arranging the feeding assembly, sequential feeding and stacking of multiple layers of circuit board inner-layer core boards are achieved, and elastic limiting is conducted on the circuit board inner-layer core boards through the sponge roller.

Description

Technical Field

[0001] The present invention relates to the technical field of circuit board processing, and particularly relates to a pressing device for processing MiniLED printed circuit boards. Background Art

[0002] A printed circuit board is one of the important components of the electronics industry. It is a plate-like structure composed of an insulating substrate and conductive copper foil circuits, and is used to achieve electrical connections between electronic components. Traditionally, it is manufactured by etching copper foil to form a specific circuit pattern. The pressing process is a process of heating and pressing several separate PCB boards into the same board. The pressing methods are generally divided into two types: dry pressing and wet pressing. For wet pressing, glue needs to be evenly applied to the surface of the PCB board first, and then the heating and pressing process is carried out. The printed circuit board is the backbone of modern electronic systems, and its quality directly affects the performance and stability of electronic products.

[0003] Before the existing printed circuit boards are processed and pressed, the inner core boards of multiple layers of circuit boards need to be stacked in sequence. During this process, due to the certain elasticity and curvature of the inner core boards of the circuit boards, there are small cavities after the inner core boards of multiple layers of circuit boards are stacked. Therefore, when the inner core boards of multiple layers of circuit boards are processed and pressed after stacking, the pressing and processing effect of the inner core boards of multiple layers of circuit boards is affected. Therefore, the present application provides a pressing device for processing MiniLED printed circuit boards to meet the requirements. Summary of the Invention

[0004] The technical problem to be solved by the present invention is to provide a pressing device for processing MiniLED printed circuit boards to solve the problem that before the existing printed circuit boards are processed and pressed, the inner core boards of multiple layers of circuit boards need to be stacked in sequence. During this process, due to the certain elasticity and curvature of the inner core boards of the circuit boards, there are small cavities after the inner core boards of multiple layers of circuit boards are stacked. Therefore, when the inner core boards of multiple layers of circuit boards are processed and pressed after stacking, the pressing and processing effect of the inner core boards of multiple layers of circuit boards is affected.

[0005] To solve the above technical problem, the present invention provides the following technical solutions: A lamination device for processing MiniLED printed circuit boards, comprising an equipment box body. A control module is installed on one side of the surface of the equipment box body. A discharge port is provided through the surface of one side of the equipment box body, and feeding ports are provided through the remaining surfaces of the equipment box body. A hot pressing device is installed at the top end of the inner wall of the equipment box body. An oil cylinder is installed at one side of the bottom end of the inner wall of the equipment box body. An installation frame is installed at the top end of the oil cylinder. A conveyor belt group is installed on one side of the inner wall at the top end of the installation frame. The conveyor belts in the conveyor belt group are arranged in pairs, one above the other. The conveyor belts in the conveyor belt group are made of a rubber and Teflon composite material. A motor is installed at the center of the bottom end of the inner wall of the equipment box body; An upper feeding component is installed at the top end of the oil cylinder, and the upper feeding component is used for sequentially feeding and stacking the inner core boards of the circuit boards; A coating component is installed on one side of the installation frame, and the coating component is used for coating glue on the copper plates in the inner core boards of the circuit boards; A leveling component is installed on one side of the coating component, and the leveling component is used for leveling the glue accumulated near the bottom of one of the sponge rollers in the coating component; The coating component is located outside the upper feeding component, and the leveling component is located on one side of the coating component.

[0006] Optionally, the upper feeding component includes a lamination bottom plate, the lamination bottom plate is installed on the top end of the motor, a positioning frame is installed on the side of the lamination bottom plate, a screw rod is installed on one side of the lamination bottom plate, and a first flat gear is installed at the bottom end of the screw rod.

[0007] Optionally, the upper feeding component further includes a toothed ring, the toothed ring is installed at the bottom end of the inner wall of the equipment box body, an auxiliary pressing plate is sleeved on the outer surface of the screw rod in a threaded manner, the inner wall of the auxiliary pressing plate is in contact with the surface of the positioning frame, and a plurality of elastic telescopic rods are installed at the bottom edge of the auxiliary pressing plate. The bottom ends of the plurality of elastic telescopic rods are all installed at the edge of the positioning frame.

[0008] Optionally, a spring is installed at one side of the bottom end of the auxiliary pressing plate, a sponge roller is elastically connected to the bottom end of the spring, the sponge material in the sponge roller is set as polyurethane material, the number of the sponge rollers is set as two groups, and the two groups of sponge rollers are both installed at the bottom end of the auxiliary pressing plate.

[0009] Optionally, the coating component includes a motor, the motor is installed on one side surface of the installation frame, one end of the motor is connected to a sponge roller, the number of the sponge rollers is set as two groups, the two groups of sponge rollers are installed on one side inner wall at the top end of the installation frame, one end of one of the two groups of sponge rollers extends out of the inner wall at the top end of the installation frame and is connected to the motor, and the sponge material in the sponge roller is set as melamine material.

[0010] Optionally, a first pulley group is connected between the other ends of the two groups of sponge rollers extending out of the inner wall part at the top of the installation frame. The surfaces of the other ends of the two groups of sponge rollers extending out of the inner wall part at the top of the installation frame are both sleeved with second pulley groups. One of the pulley inner walls in the two groups of second pulley groups is sleeved with a reciprocating lead screw, and the reciprocating lead screw is installed on the inner wall of one side at the top of the installation frame.

[0011] Optionally, sliding bases are threadedly sleeved on the outer surfaces of the two groups of reciprocating lead screws. The bottom end of one of the two groups of sliding bases is in contact with the top surface of one of the sponge rollers, and the top end of the other group of sliding bases in the two groups of sliding bases is in contact with the bottom surface of the other sponge roller. Drippers are sleeved in the inner cavities of the two sliding bases, and one end part of the dripper is sleeved on the inner wall of one side at the top of the installation frame.

[0012] Optionally, the smoothing assembly includes a rotating rod installed on one side of one of the two groups of sliding bases. A second spur gear is installed at the top end of the rotating rod, and a rack is meshed on one side of the second spur gear. The rack is installed on the inner wall of the other side at the top of the installation frame.

[0013] Optionally, a mounting disc is rotatably installed at the bottom end of the rotating rod, and a group of rubber columns is installed on the side surface of the mounting disc. The number of the group of rubber columns is set to be multiple groups, and the multiple groups of rubber columns are arranged in an equiangular circular array on the side surface of the mounting disc.

[0014] Optionally, the rubber columns in the group of rubber columns are arranged in a "pin" shape, and the material of the rubber columns in the group of rubber columns is set to be nitrile rubber.

[0015] Compared with the prior art, the present invention has at least the following beneficial effects: In the above solution, by setting up the feeding component, through the rotational cooperation of the pressing bottom plate and the motor, the adjustment of the rotational angle of the pressing bottom plate is realized. By changing the rotational angle of the pressing bottom plate and cooperating with the conveyor belt group for the fitting and conveying of the inner core board of the circuit board, the sequential feeding and stacking of the inner core boards of the multi-layer circuit board are realized, improving the accuracy during the stacking of the inner core boards of the multi-layer circuit board. At the same time, through the rotational cooperation among the screw rod, the first flat gear, and the toothed ring, the real-time adjustment of the height of the auxiliary pressing plate is realized, enabling the height of the auxiliary pressing plate to synchronously adapt to the stacking height of the inner core boards of the multi-layer circuit board. At the same time, by elastically installing a spring and a sponge roller at the bottom end of the auxiliary pressing plate, a buffer stroke is formed at the bottom end of the auxiliary pressing plate. When sequentially inserting the inner core boards of the circuit board, through the elastic cooperation of the spring and the sponge roller, before inserting the next layer of the inner core board of the circuit board, the sponge roller elastically limits the stacked inner core boards of the circuit board, avoiding the existence of small cavities between the stacked inner core boards of the circuit board. At the same time, taking advantage of the high flexibility of the polyurethane material, when continuously inserting and stacking the inner core board of the circuit board on the top of the already stacked inner core boards of the circuit board, damage to the top surface of the inner core board of the circuit board is avoided, ensuring the yield rate during the processing and pressing after the stacking of the inner core boards of the multi-layer circuit board.

[0016] By setting up the coating component, by setting two sponge rotating rollers and cooperating with the two conveyor belts arranged up and down in the conveyor belt group, when stacking and feeding the copper plates in the inner core boards of the multi-layer circuit board, the two sponge rotating rollers rotate to contact the top and bottom ends of the copper plates. At the same time, by utilizing the rotational cooperation between the reciprocating lead screw and the sliding base, the reciprocating sliding of the sliding base on the top and bottom surfaces of the two sponge rotating rollers is realized. At the same time, by specially designing a cavity in the sliding base, when the dropper applies glue to the surface of the sponge rotating roller, it fits when the sliding base contacts the top and bottom surfaces of the sponge rotating roller at two different positions, ensuring that the dropper can fully apply glue to the surfaces of the two sponge rotating rollers. At the same time, through the rotational effect between the two sponge rotating rollers, the coating effect on both the top and bottom surfaces of the copper plate is realized. At the same time, through the rotational cooperation with the conveyor belt group, two-way limiting is achieved in the advancing direction of the copper plate, ensuring the stability of the copper plate during feeding and stacking while ensuring the glue coating effect on the copper plate. At the same time, taking advantage of the excellent non-stick property of the rubber + Teflon composite material, the secondary adhesion of the conveyor belt group during the conveying of the steel plate is avoided, preventing secondary damage to the glue coating on the surface of the copper plate.

[0017] By setting the leveling component, through the linkage cooperation of the rotating rod, the second spur gear and the rack, and using the acting force of the reciprocating sliding of the sliding base, the rotating effect of the mounting plate and the rubber column group is realized. By means of the rotating surface formed when multiple groups of rubber column groups rotate, when multiple groups of rubber column groups sequentially pass through the contact position between one group of sponge rollers and the top surface of the copper plate, the glue accumulated here is scattered and leveled by multiple groups of rubber column groups, so as to avoid the long-term accumulation of glue at the contact position between the sponge rollers and the top surface of the copper plate, and avoid the adhesion caused by the long-term accumulation of glue, resulting in the poor rotation of the sponge rollers, thus avoiding interference during the application of glue to the surface of the copper plate, further ensuring the application effect when the sponge rollers apply glue to the surface of the copper plate, and at the same time avoiding the secondary interference of the glue after long-term accumulation and adhesion to the feeding and conveying of the next group of copper plates, and preventing the deviation of the copper plates during conveying. Brief Description of the Drawings

[0018] The accompanying drawings incorporated herein and constituting a part of the specification illustrate embodiments of the present invention and, together with the specification, are further used to explain the principles of the present invention and enable those skilled in the relevant art to implement and use the present invention.

[0019] Figure 1 It is a schematic structural diagram of a lamination device for MiniLED printed circuit board processing; Figure 2 It is a schematic side sectional structural diagram of a lamination device for MiniLED printed circuit board processing; Figure 3 It is a schematic structural diagram of some components of the feeding component; Figure 4 It is Figure 3 The enlarged view of A in Figure 5 It is a schematic structural diagram of the feeding component; Figure 6 It is a schematic structural diagram of the auxiliary pressing plate, the spring and the sponge roller; Figure 7 It is a schematic overall structural diagram of the coating component; Figure 8 It is a schematic structural diagram of some components of the coating component; Figure 9 It is a schematic structural diagram of the coating component; Figure 10 It is a schematic partial sectional structural diagram of the coating component and the sliding base; Figure 11 It is a schematic structural diagram of the leveling component; Figure 12 It is Figure 11 The enlarged view of B in Figure 13 It is a schematic structural diagram of some components of the leveling component.

[0020] Reference numerals: 1. Equipment box body; 2. Control module; 3. Discharge port; 4. Feeding port; 5. Hot pressing equipment; 6. Oil cylinder; 7. Installation frame; 70. Conveyor belt group; 8. Motor; 9. Loading component; 91. Pressing bottom plate; 92. Positioning frame; 93. Screw rod; 94. First flat gear; 95. Tooth ring; 96. Auxiliary pressing plate; 97. Elastic telescopic rod; 98. Spring; 99. Sponge roller; 10. Coating component; 101. Motor; 102. Sponge rotating roller; 103. First pulley group; 104. Second pulley group; 105. Reciprocating lead screw; 106. Sliding base; 107. Drip pipe; 11. Smoothing component; 111. Rotating rod; 112. Second flat gear; 113. Rack; 114. Installation disc; 115. Rubber column group.

[0021] As shown in the figure, in order to clearly implement the structure of the embodiments of the present invention, specific structures and devices are marked in the figure. However, this is only for schematic purposes and is not intended to limit the present invention to this specific structure, device and environment. Those of ordinary skill in the art can adjust or modify these devices and environments according to specific needs. Detailed embodiments

[0022] The following will describe in detail a pressing device for MiniLED printed circuit board processing provided by the present invention in conjunction with the accompanying drawings and specific embodiments. At the same time, it should be noted here that in order to make the embodiments more detailed, the following embodiments are the best and preferred embodiments. For some well-known technologies, those skilled in the art can also adopt other alternative methods for implementation; moreover, the accompanying drawings are only for more specific description of the embodiments and are not intended to specifically limit the present invention.

[0023] It should be noted that in the specification, references to "an embodiment", "embodiments", "exemplary embodiments", "some embodiments", etc. indicate that the described embodiments may include specific features, structures or characteristics, but not necessarily every embodiment includes such specific features, structures or characteristics. Additionally, when combining embodiments to describe specific features, structures or characteristics, implementing such features, structures or characteristics in combination with other embodiments (whether explicitly described or not) should be within the knowledge of those skilled in the relevant art.

[0024] Generally, terms can be understood at least in part from their use in context. For example, at least in part depending on the context, the term "one or more" used herein can be used to describe any feature, structure or characteristic in a singular sense, or can be used to describe a combination of features, structures or characteristics in a plural sense. Additionally, the term "based on" can be understood as not necessarily intended to convey a set of exclusive factors, but rather, at least in part depending on the context, can allow for the existence of other factors that may not be explicitly described.

[0025] It is understood that the meanings of "on", "above", and "over" in the present invention should be interpreted in the broadest manner, such that "on" not only means "directly on" something, but also includes the meaning of being "on" something with intermediate features or layers therebetween, and "above" or "over" not only means "above" or "over" something, but may also include the meaning of being "above" or "over" something with no intermediate features or layers therebetween.

[0026] In addition, spatial relative terms such as "under", "below", "lower", "above", "upper", etc. may be used herein for convenience of description to describe the relationship of one element or feature to another or other elements or features, as shown in the drawings. The spatial relative terms are intended to cover different orientations in the use or operation of the device in addition to the orientation depicted in the drawings. The device may be oriented in other ways, and the spatial relative descriptors used herein may be interpreted accordingly.

[0027] As Figures 1 to 13 shown, an embodiment of the present invention provides a lamination device for processing MiniLED printed circuit boards, including a device box body 1. One side of the surface of the device box body 1 is provided with a control module 2. A discharge port 3 is provided through one side surface of the device box body 1, and a feeding port 4 is provided through the remaining surfaces of the device box body 1. A hot pressing device 5 is installed at the top end of the inner wall of the device box body 1. One side of the bottom end of the inner wall of the device box body 1 is provided with an oil cylinder 6. An installation frame 7 is installed at the top end of the oil cylinder 6. One side of the inner wall at the top end of the installation frame 7 is provided with a conveyor belt group 70. It is characterized in that the conveyor belts in the conveyor belt group 70 are arranged in pairs, one above the other, and the material of the conveyor belts in the conveyor belt group 70 is set as a rubber + Teflon composite material. A motor 8 is installed at the center of the bottom end of the inner wall of the device box body 1. A feeding component 9 is installed at the top end of the oil cylinder 6. The feeding component 9 is used for sequentially feeding and stacking the inner core boards of the circuit boards. A coating component 10 is installed on one side of the installation frame 7. The coating component 10 is used for coating glue on the copper plates in the inner core boards of the circuit boards. A smoothing component 11 is installed on one side of the coating component 10. The smoothing component 11 is used for smoothing the glue accumulated near the bottom of one of the sponge rollers 102 in the coating component 10. The coating component 10 is located outside the feeding component 9, and the smoothing component 11 is located on one side of the coating component 10.

[0028] By setting up the loading component 9, sequential loading and stacking of the inner core boards of multi-layer circuit boards are achieved, improving the accuracy during the stacking of the inner core boards of multi-layer circuit boards. By setting up the coating component 10, when the sliding base 106 contacts two different positions on the top and bottom surfaces of the sponge rotating roller 102, fitting is performed to ensure that the dropper 107 can fully coat glue on the surfaces of the two groups of sponge rotating rollers 102. By setting up the leveling component 11, a multi-group rubber column group 115 is used to disperse and sweep the glue accumulated here, preventing the glue from accumulating for a long time at the contact position between the sponge rotating roller 102 and the top surface of the copper plate.

[0029] As Figures 3 to 6 shown, the loading component 9 includes a pressing bottom plate 91, the pressing bottom plate 91 is installed at the top of the motor 8, a positioning frame 92 is installed on the side of the pressing bottom plate 91, a screw rod 93 is installed on one side of the pressing bottom plate 91, a first spur gear 94 is installed at the bottom end of the screw rod 93, the loading component 9 further includes a toothed ring 95, the toothed ring 95 is installed at the bottom end of the inner wall of the equipment box body 1, a threaded sleeve 96 is sleeved on the outer surface of the screw rod 93, the inner wall of the auxiliary pressing plate 96 is in contact with the surface of the positioning frame 92, multiple elastic telescopic rods 97 are installed at the bottom edge of the auxiliary pressing plate 96, the bottom ends of the multiple elastic telescopic rods 97 are all installed at the edge of the positioning frame 92, a spring 98 is installed at one side of the bottom end of the auxiliary pressing plate 96, the bottom end of the spring 98 is elastically connected to a sponge roller 99, the sponge material in the sponge roller 99 is set as polyurethane material, the number of the sponge rollers 99 is set as two groups, and the two groups of sponge rollers 99 are both installed at the bottom end of the auxiliary pressing plate 96.

[0030] The operator first drives the start of multiple conveyor belt groups 70 on the inner wall of the top end of the installation frame 7 through the control module 2. At this time, the top surface of the conveyor belt at the bottom position in the conveyor belt groups 70 is on the same axis direction as the pressing bottom plate 91. Subsequently, the operator feeds the inner core board of the circuit board into one of the conveyor belt groups 70. Under the rotation of the two conveyor belts in the conveyor belt groups 70, the two conveyor belts in the conveyor belt groups 70 rotate while fitting the top and bottom ends of the inner core board of the circuit board respectively. Under the continuous rotation of one of the conveyor belt groups 70, the inner core board of the circuit board slides, and while sliding, the inner core board of the circuit board approaches and contacts the top surface of the pressing bottom plate 91.

[0031] When the inner core board of the circuit board slides close to the lamination bottom plate 91, the top end of the inner core board of the circuit board sequentially contacts two sets of sponge rollers 99 at the bottom end of the auxiliary pressing plate 96. Under the continuous sliding action of the inner core board of the circuit board, the inner core board of the circuit board contacts and pushes the sponge rollers 99 to slide upward. While the sponge rollers 99 slide, they push the spring 98 to contract. One set of conveyor belt group 70 continues to push the inner core board of the circuit board to slide, so that both sides and one end of the inner core board of the circuit board contact and fit the inner wall of the positioning frame 92 and slide. When the inner core board of the circuit board slides in place, through the elastic action of the springs 98 on both sides of the two sets of sponge rollers 99, the bottom ends of the two sets of sponge rollers 99 tightly contact the top surface of the inner core board of the circuit board, realizing the continuous positioning of the inner core board of the circuit board.

[0032] After the placement of the first-layer inner core board of the circuit board is completed, the control module 2 controls the motor 8 to start. After the motor 8 starts, it drives the lamination bottom plate 91 to rotate 90 degrees, so that the opening of the positioning frame 92 is aligned with the next set of conveyor belt groups 70. While the lamination bottom plate 91 rotates, it drives the first spur gear 94 to pass through and mesh with the toothed ring 95. Under the action of the toothed ring 95, the first spur gear 94 rotates. While the first spur gear 94 rotates, it drives the screw 93 to rotate synchronously. Under the rotational action of the screw 93, the auxiliary pressing plate 96 slides along the direction of the screw 93, so that the sliding distance of the auxiliary pressing plate 96 is equal to the thickness of the inner core board of the circuit board. At the same time, during this process, through the elastic action of the spring 98, the bottom ends of the two sets of sponge rollers 99 remain in contact with the top end of the inner core of the circuit board.

[0033] At the same time, the control module 2 controls the oil cylinder 6 to start. After the oil cylinder 6 starts, it drives the mounting frame 7 to slide upward. While the mounting frame 7 slides, it drives multiple sets of conveyor belt groups 70 on the inner wall of the top end to slide upward synchronously. The sliding distance of the mounting frame 7 driving multiple sets of conveyor belt groups 70 on the inner wall of the top end is equal to the thickness of the inner core board of the circuit board, so that the top surface of the conveyor belt at the bottom position in the conveyor belt group 70 and the top surface of the inner core board of the circuit board placed on the top end of the lamination bottom plate 91 are in the same axial direction.

[0034] By setting the rotational cooperation of the lamination bottom plate 91 and the motor 8, the adjustment of the rotation angle of the lamination bottom plate 91 is realized. By changing the rotation angle of the lamination bottom plate 91 and cooperating with the fitting conveyance of the conveyor belt group 70 for the inner core board of the circuit board, the sequential feeding and stacking of multiple-layer inner core boards of the circuit board are realized, improving the accuracy during the stacking of multiple-layer inner core boards of the circuit board.

[0035] Such as Figures 7 to 10As shown, the smearing component 10 includes a motor 101. The motor 101 is installed on one side surface of the installation frame 7. One end of the motor 101 is connected to a sponge roller 102. The number of sponge rollers 102 is set to two groups. The two groups of sponge rollers 102 are installed on the inner wall of one side at the top of the installation frame 7. One end of one of the two groups of sponge rollers 102 extends out of the inner wall at the top of the installation frame 7 and is connected to the motor 101. The sponge material in the sponge roller 102 is set to melamine material. A first pulley group 103 is connected between the parts where the other ends of the two groups of sponge rollers 102 extend out of the inner wall at the top of the installation frame 7. Second pulley groups 104 are sleeved on the surfaces of the parts where the other ends of the two groups of sponge rollers 102 extend out of the inner wall at the top of the installation frame 7. One of the inner walls of the two groups of second pulley groups 104 is sleeved with a reciprocating lead screw 105. The reciprocating lead screw 105 is installed on the inner wall of one side at the top of the installation frame 7. Sliding bases 106 are threadedly sleeved on the outer surfaces of the two reciprocating lead screws 105. The bottom end of one of the two sliding bases 106 is in contact with the top surface of one of the sponge rollers 102. The top end of the other sliding base 106 among the two sliding bases 106 is in contact with the bottom surface of the other sponge roller 102. Pipettes 107 are sleeved in the inner cavities of the two sliding bases 106. One end part of the pipette 107 is sleeved on the inner wall of one side at the top of the installation frame 7.

[0036] Similarly, repeat the above steps in sequence to achieve the sequential loading and stacking of the inner core boards of multi-layer circuit boards. At the same time, when loading and stacking the copper plates in the inner core boards of multi-layer circuit boards, when the copper plate enters the loading and stacking through one of the conveyor belt groups 70, before the copper plate is placed into the cavity between the two conveyor belts in one of the conveyor belt groups 70, the control module 2 controls the motor 101 to start. After the motor 101 starts, it drives one of the sponge rollers 102 to rotate synchronously. While this sponge roller 102 rotates, it drives the other sponge roller 102 to rotate synchronously through the first pulley group 103, so that the two sponge rollers 102 respectively rotate in contact with the top and bottom surfaces of the copper plate.

[0037] While the sponge roller 102 rotates, it drives the reciprocating lead screw 105 to rotate synchronously through the second pulley group 104. Under the rotation of the reciprocating lead screw 105, the sliding base 106 threadedly sleeved on the outer surface of the reciprocating lead screw 105 reciprocates along the direction of the reciprocating lead screw 105. While the sliding base 106 slides, it drives the pipette 107 to rotate synchronously. At the same time, the operator continuously pumps glue into the pipette 107 through a pumping device, so that the glue continuously extrudes from the pipette 107.

[0038] After the glue in the dropper 107 inside the internal cavity of one set of sliding bases 106 is extruded, under the action of gravity and the continuous pumping of the pumping device, the glue drops onto the surface of one set of sponge rollers 102. At the same time, with the reciprocating sliding effect of the sliding bases 106, the surface of one set of sponge rollers 102 is filled with glue. After the glue in the dropper 107 inside the internal cavity of the other set of sliding bases 106 is extruded, under the continuous pumping of the pumping device, the extruded glue accumulates in the internal cavity of the sliding bases 106. Since the top of this set of sliding bases 106 is in contact with the bottom surface of the other set of sponge rollers 102, under the reciprocating sliding of the sliding bases 106, the surface of the other set of sponge rollers 102 is filled with glue.

[0039] When the surfaces of both sets of sponge rollers 102 are filled with glue, the operator will send the copper plate into the conveyor belt group 70 on one side of the two sets of sponge rollers 102 through the feeding port 4, and through the rotation of the conveyor belt group 70, the copper plate is conveyed to the top position of the pressing bottom plate 91 for stacking.

[0040] By setting two sets of sponge rollers 102 and cooperating with the two conveyor belts arranged up and down in the conveyor belt group 70, when stacking and feeding the copper plates in the inner core plates of multi-layer circuit boards, the two sets of sponge rollers 102 rotate to contact the top and bottom ends of the copper plate, and when the sliding bases 106 contact the top and bottom surfaces of the sponge rollers 102 at two different positions, they are adhered, ensuring that the dropper 107 can fully apply glue to the surfaces of the two sets of sponge rollers 102.

[0041] As Figures 11 to 13 shown, the leveling component 11 includes a rotating rod 111. The rotating rod 111 is installed on one side of one set of the two sets of sliding bases 106. A second spur gear 112 is installed at the top of the rotating rod 111. A rack 113 is engaged on one side of the second spur gear 112. The rack 113 is installed on the other side of the inner wall at the top of the installation frame 7. The bottom end of the rotating rod 111 is rotatably installed with an installation disk 114. A rubber column group 115 is installed on the side of the installation disk 114. The number of the rubber column groups 115 is set to be multiple groups. The multiple groups of rubber column groups 115 are arranged in an equiangular circular array on the side of the installation disk 114. The rubber columns in the rubber column group 115 are arranged in a "pin" shape. The rubber columns in the rubber column group 115 are made of nitrile rubber.

[0042] Meanwhile, when the sliding base 106 reciprocates and applies glue to the surface of the sponge roller 102 through the dropper 107, one set of the sliding bases 106 drives the rotating rod 111 and the second spur gear 112 at the top of the rotating rod 111 to slide synchronously. While the second spur gear 112 slides, it meshes with the rack 113. Under the action of the rack 113, the second spur gear 112 rotates. While the second spur gear 112 rotates, it drives the mounting disc 114 at the bottom to rotate synchronously through the rotating rod 111. While the mounting disc 114 rotates, it drives multiple groups of rubber column groups 115 to rotate synchronously. While the rubber column groups 115 rotate, the rubber columns at the top position in the rubber column groups 115 contact the surface of one set of the sponge rollers 102. At the same time, while the rubber column groups 115 rotate, they disperse and level the glue accumulated at the contact position between the bottom of one set of the sponge rollers 102 and the copper plate, avoiding glue accumulation.

[0043] After all the inner core boards of the circuit boards are stacked, the control module 2 controls the hot pressing device 5 to start, and the hot pressing device 5 performs hot pressing forming on the sequentially stacked inner core boards of the circuit boards to complete the processing and pressing of the printed circuit board.

[0044] By setting the linkage cooperation of the rotating rod 111, the second spur gear 112 and the rack 113, and utilizing the acting force of the reciprocating sliding of the sliding base 106, the rotating effects of the mounting disc 114 and the rubber column groups 115 are realized. By using the rotating surface formed when the multiple groups of rubber column groups 115 rotate, as the multiple groups of rubber column groups 115 pass through the contact position between one set of the sponge rollers 102 and the top surface of the copper plate in sequence, the multiple groups of rubber column groups 115 disperse and sweep the glue accumulated here to avoid the glue from accumulating at the contact position between the sponge roller 102 and the top surface of the copper plate for a long time.

[0045] The working principle of the technical solution provided by the present invention is as follows: First, the operator drives multiple conveyor belt groups 70 on the inner wall of the top end of the mounting frame 7 to start through the control module 2. At this time, the top surface of the conveyor belt at the bottom position in the conveyor belt groups 70 is on the same axis direction as the pressing bottom plate 91. Subsequently, the operator feeds the inner core board of the circuit board into one set of the conveyor belt groups 70. Under the rotation action of the two conveyor belts in the conveyor belt groups 70, the two conveyor belts in the conveyor belt groups 70 rotate while fitting the top end and the bottom end of the inner core board of the circuit board respectively, and under the continuous rotation action of one set of the conveyor belt groups 70, the inner core board of the circuit board slides, and while the inner core board of the circuit board slides, it approaches and contacts the top surface of the pressing bottom plate 91.

[0046] When the inner core board of the circuit board slides close to the lamination bottom plate 91, the top end of the inner core board of the circuit board sequentially contacts two groups of sponge rollers 99 at the bottom end of the auxiliary pressing plate 96. Under the continuous sliding action of the inner core board of the circuit board, the inner core board of the circuit board contacts and pushes the sponge rollers 99 to slide upward. While the sponge rollers 99 slide, they push the springs 98 to contract. One group of conveyor belt sets 70 continues to push the inner core board of the circuit board to slide, so that both sides and one end of the inner core board of the circuit board contact and fit against the inner wall of the positioning frame 92 and slide. When the inner core board of the circuit board slides in place, through the elastic action of the springs 98 on both sides of the two groups of sponge rollers 99, the bottom ends of the two groups of sponge rollers 99 tightly contact the top surface of the inner core board of the circuit board, realizing continuous positioning of the inner core board of the circuit board.

[0047] After the first-layer inner core board of the circuit board is placed, the control module 2 controls the motor 8 to start. After the motor 8 starts, it drives the lamination bottom plate 91 to rotate 90 degrees, so that the opening of the positioning frame 92 is aligned with the next group of conveyor belt sets 70. While the lamination bottom plate 91 rotates, it drives the first flat gear 94 to pass by and mesh with the toothed ring 95. Under the action of the toothed ring 95, the first flat gear 94 rotates. While the first flat gear 94 rotates, it drives the screw 93 to rotate synchronously. Under the rotation action of the screw 93, the auxiliary pressing plate 96 slides along the direction of the screw 93, and the sliding distance of the auxiliary pressing plate 96 is equal to the thickness of the inner core board of the circuit board. At the same time, during this process, through the elastic action of the spring 98, the bottom ends of the two groups of sponge rollers 99 remain in contact with the top end of the inner core of the circuit board.

[0048] At the same time, the control module 2 controls the oil cylinder 6 to start. After the oil cylinder 6 starts, it drives the mounting frame 7 to slide upward. While the mounting frame 7 slides, it drives multiple groups of conveyor belt sets 70 on the inner wall of the top end to slide upward synchronously. The sliding distance of the multiple groups of conveyor belt sets 70 on the inner wall of the top end driven by the mounting frame 7 is equal to the thickness of the inner core board of the circuit board, so that the top surface of the conveyor belt at the bottom position in the conveyor belt set 70 is in the same axial direction as the top surface of the inner core board of the circuit board placed on the top end of the lamination bottom plate 91.

[0049] Similarly, repeat the above steps in sequence to realize sequential feeding and stacking of multiple-layer inner core boards of the circuit board. At the same time, when feeding and stacking the copper plates in the multiple-layer inner core boards of the circuit board, when the copper plate enters the feeding and stacking through one group of conveyor belt sets 70, before the copper plate is placed into the cavity between the two conveyor belts in one group of conveyor belt sets 70, the control module 2 controls the motor 101 to start. After the motor 101 starts, it drives one group of sponge rollers 102 to rotate synchronously. While this group of sponge rollers 102 rotates, it drives the other group of sponge rollers 102 to rotate synchronously through the first pulley set 103, so that the two groups of sponge rollers 102 rotate in contact with the top and bottom surfaces of the copper plate respectively.

[0050] While the sponge roller 102 rotates, it drives the reciprocating lead screw 105 to rotate synchronously through the second pulley set 104. Under the rotation of the reciprocating lead screw 105, the sliding base 106 with a thread sleeve on the outer surface of the reciprocating lead screw 105 slides reciprocally along the direction of the reciprocating lead screw 105. While the sliding base 106 slides, it drives the dropper 107 to rotate synchronously. At the same time, the operator continuously pumps glue into the dropper 107 through a pumping device, so that the glue continuously extrudes from the dropper 107.

[0051] After the glue in the dropper 107 in the inner cavity of one group of sliding bases 106 is extruded, under the action of gravity and the continuous pumping of the pumping device, the glue drops onto the surface of one group of sponge rollers 102. At the same time, in cooperation with the reciprocating sliding effect of the sliding base 106, the surface of one group of sponge rollers 102 is filled with glue; After the glue in the dropper 107 in the inner cavity of the other group of sliding bases 106 is extruded, under the continuous pumping of the pumping device, the extruded glue accumulates in the inner cavity of the sliding base 106. Since the top of this group of sliding bases 106 is in contact with the bottom surface of the other group of sponge rollers 102, under the reciprocating sliding of the sliding base 106, the surface of the other group of sponge rollers 102 is filled with glue.

[0052] When the surfaces of both groups of sponge rollers 102 are filled with glue, the operator will send the copper plate into the conveyor belt group 70 on one side of the two groups of sponge rollers 102 through the feeding port 4, and through the rotation of the conveyor belt group 70, convey the copper plate to the top position of the pressing bottom plate 91 for stacking.

[0053] At the same time, when the sliding base 106 slides reciprocally and smears glue on the surface of the sponge roller 102 through the dropper 107, one group of sliding bases 106 drives the rotating rod 111 and the second spur gear 112 at the top of the rotating rod 111 to slide synchronously. While the second spur gear 112 slides, it meshes with the rack 113. Under the action of the rack 113, the second spur gear 112 rotates. While the second spur gear 112 rotates, it drives the mounting disc 114 at the bottom to rotate synchronously through the rotating rod 111. While the mounting disc 114 rotates, it drives multiple groups of rubber column groups 115 to rotate synchronously. While the rubber column groups 115 rotate, the rubber columns at the top position in the rubber column groups 115 contact the surface of one group of sponge rollers 102. At the same time, while the rubber column groups 115 rotate, they disperse and level the glue accumulated at the contact between the bottom of one group of sponge rollers 102 and the copper plate to avoid glue accumulation.

[0054] After all the inner core boards of the circuit boards are stacked, the control module 2 controls the hot pressing device 5 to start, and the hot pressing device 5 hot presses the sequentially stacked inner core boards of the circuit boards to complete the processing and pressing of the printed circuit board.

[0055] The present invention covers any alternatives, modifications, equivalent methods, and solutions made within the spirit and scope of the present invention. To enable the public to have a thorough understanding of the present invention, specific details are described in detail in the following preferred embodiments of the present invention. However, those skilled in the art can fully understand the present invention without the description of these details. Additionally, to avoid unnecessary confusion to the essence of the present invention, well-known methods, processes, procedures, components, and circuits are not described in detail.

[0056] The above description is only a preferred embodiment of the present invention. It should be noted that for those of ordinary skill in the art, without departing from the principle of the present invention, several improvements and refinements can be made, and these improvements and refinements should also be regarded as the protection scope of the present invention.

Claims

1. A lamination device for processing MiniLED printed circuit boards, comprising an equipment box body, characterized in that, On one side of the surface of the equipment box body, a control module is installed. On one of the side surfaces of the equipment box body, a discharge port is penetrated. On the remaining surfaces of the equipment box body, feeding ports are penetrated. At the top of the inner wall of the equipment box body, a hot pressing device is installed. At one side of the bottom of the inner wall of the equipment box body, an oil cylinder is installed. At the top of the oil cylinder, an installation frame is installed. On one side of the inner wall at the top of the installation frame, a conveyor belt group is installed. The conveyor belts in the conveyor belt group are arranged in pairs, one above the other. At the center of the bottom of the inner wall of the equipment box body, a motor is installed; At the top of the oil cylinder, a feeding component is installed. The feeding component is used for sequentially stacking the inner core boards of the circuit board; On one side of the installation frame, a coating component is installed. The coating component is used for coating glue on the copper plates in the inner core boards of the circuit board; On one side of the coating component, a smoothing component is installed. The smoothing component is used for smoothing the glue accumulated near the bottom of one of the sponge rollers in the coating component; The coating component is located outside the feeding component, and the smoothing component is located on one side of the coating component.

2. The laminating device for processing MiniLED printed circuit boards according to claim 1, wherein The feeding component includes a pressing bottom plate. The pressing bottom plate is installed on the top of the motor. A positioning frame is installed on the side of the pressing bottom plate. A screw rod is installed on one side of the pressing bottom plate. At the bottom of the screw rod, a first flat gear is installed.

3. The lamination device for MiniLED printed circuit board processing according to claim 2, wherein, The feeding component further includes a toothed ring. The toothed ring is installed at the bottom of the inner wall of the equipment box body. An auxiliary pressing plate is sleeved on the outer surface of the screw rod in a threaded manner. The inner wall of the auxiliary pressing plate is in contact with the surface of the positioning frame. At the bottom edge of the auxiliary pressing plate, a plurality of elastic telescopic rods are installed. The bottoms of the plurality of elastic telescopic rods are all installed at the edge of the positioning frame.

4. The lamination device for MiniLED printed circuit board processing according to claim 3, characterized in that, On one side of the bottom of the auxiliary pressing plate, a spring is installed. At the bottom of the spring, a sponge roller is elastically connected. The sponge material in the sponge roller is set as polyurethane material. The number of the sponge rollers is set to two groups. The two groups of sponge rollers are both installed at the bottom of the auxiliary pressing plate.

5. The lamination device for MiniLED printed circuit board processing according to claim 4, characterized in that, The coating component includes a motor. The motor is installed on one side surface of the installation frame. One end of the motor is connected to a sponge roller. The number of the sponge rollers is set to two groups. The two groups of sponge rollers are installed on one side inner wall at the top of the installation frame. One end of one of the two groups of sponge rollers extends out of the inner wall at the top of the installation frame and is connected to the motor. The sponge material in the sponge roller is set as melamine material.

6. The lamination device for MiniLED printed circuit board processing according to claim 5, wherein, Between the other ends of the two groups of sponge rollers extending out of the inner wall at the top of the installation frame, a first pulley group is connected. On the surfaces of the other ends of the two groups of sponge rollers extending out of the inner wall at the top of the installation frame, a second pulley group is sleeved. On the inner walls of one of the two groups of pulleys in the second pulley group, a reciprocating lead screw is sleeved. The reciprocating lead screw is installed on one side inner wall at the top of the installation frame.

7. The lamination device for MiniLED printed circuit board processing according to claim 6, wherein, On the outer surfaces of the two groups of reciprocating lead screws, sliding bases are sleeved in a threaded manner. The bottom of one of the two groups of sliding bases is in contact with the top surface of one of the sponge rollers. The top of the other of the two groups of sliding bases is in contact with the bottom surface of the other sponge roller. Inside the inner cavities of the two sliding bases, droppers are sleeved. One end part of the dropper is sleeved on one side inner wall at the top of the installation frame.

8. The laminating device for MiniLED printed circuit board processing according to claim 7, wherein, The leveling component includes a rotating rod, the rotating rod is installed on one side of one of the two sliding bases, a second spur gear is installed at the top end of the rotating rod, a rack is meshed on one side of the second spur gear, and the rack is installed on the inner wall of the other side of the top end of the installation frame.

9. The lamination device for processing MiniLED printed circuit boards according to claim 8, wherein, An installation disk is rotatably installed at the bottom end of the rotating rod, a rubber column group is installed on the side surface of the installation disk, the number of the rubber column groups is set to be multiple groups, and the multiple rubber column groups are arranged in an equiangular circumferential array on the side surface of the installation disk.

10. The lamination device for MiniLED printed circuit board processing according to claim 9, characterized in that, The rubber columns in the rubber column group are arranged in a "pin" shape, and the material of the rubber columns in the rubber column group is set to nitrile rubber.

Images