Method for preventing electroplating liquid from being diluted, electroplating device and storage medium

Abstract

The invention belongs to the technical field of semiconductors, and discloses a method for preventing electroplating liquid from being diluted, an electroplating device and a storage medium. The method for preventing the electroplating liquid from being diluted comprises the steps that after a clamp assembly carries a wafer to complete the electroplating process in the electroplating liquid in an electroplating cavity, the clamp assembly is controlled to carry the wafer to rise to a preset cleaning position, and the preset cleaning position is higher than the position where an opening is located; closing the opening of the electroplating cavity; and the clamp assembly and the wafer carried by the clamp assembly are cleaned, so that the electroplating liquid attached to the clamp assembly and the wafer carried by the clamp assembly is removed. According to the electroplating device, the clamp assembly and the wafer after electroplating can be cleaned, the concentration of electroplating liquid in the electroplating cavity cannot be affected when the clamp assembly and the wafer are cleaned, the stability, uniformity and quality of wafer electroplating can be improved, part of the electroplating liquid attached to the clamp assembly and the wafer can be recycled into the electroplating cavity, and the working efficiency is high.

Description

Technical Field

[0001] The present invention relates to the field of semiconductor technology, and in particular, to a method for preventing dilution of electroplating solution, an electroplating device, and a storage medium. Background Art

[0002] A wafer refers to a silicon wafer used for fabricating silicon semiconductor integrated circuits. Since its shape is circular, it is called a wafer. A conductive metal layer is electroplated on the wafer, and the conductive metal layer is processed to form a conductive circuit. Electroplating is one of the key processes for fabricating these conductive metal layers. Wafer electroplating involves placing the wafer in an electroplating solution, applying the negative voltage terminal to a thin metal seed layer prefabricated on the wafer, applying the positive voltage terminal to a soluble or insoluble anode, and causing metal ions in the electroplating solution to deposit on the wafer surface through the action of an electric field. After electroplating, the wafer and the fixture need to be taken out of the electroplating solution together, and then the residual electroplating solution on the surfaces of the wafer and the fixture is recovered, and the wafer is washed and dried, etc.

[0003] Currently, in order to save the time for electroplating and cleaning the wafer and to save the process space for electroplating and cleaning the wafer, a waste liquid collection tank is provided on the outer periphery of the electroplating cavity. When cleaning the wafer and the fixture, the wafer and the fixture are moved above the opening of the electroplating cavity, and water is sprayed on the wafer and the fixture to clean them. The waste liquid collection tank can collect the waste water from cleaning the wafer and the fixture, but there is still some cleaning liquid falling into the electroplating cavity, resulting in a change in the concentration of the electroplating solution in the electroplating cavity, thereby causing a change in the coating performance of the electroplated wafer, a decrease in the yield of the wafer, and a decrease in production efficiency. Summary of the Invention

[0004] The purpose of the present invention is to provide a method for preventing dilution of electroplating solution, an electroplating device, and a storage medium, so as to solve the problem that the concentration of the electroplating solution changes when cleaning the wafer and the fixture in the existing electroplating device.

[0005] To achieve this purpose, the present invention adopts the following technical solutions:

[0006] A method for preventing dilution of electroplating solution, the method for preventing dilution of electroplating solution is applied to an electroplating device, the electroplating device includes an electroplating cavity and a fixture assembly, the electroplating cavity can hold an electroplating solution, and the fixture assembly can carry a wafer to immerse in the electroplating solution in the electroplating cavity from an opening above the electroplating cavity for an electroplating process; the method for preventing dilution of electroplating solution includes:

[0007] After the fixture assembly carries the wafer to complete the electroplating process in the electroplating solution in the electroplating cavity, control the fixture assembly to carry the wafer to rise to a preset cleaning position, and the preset cleaning position is higher than the position where the opening is located;

[0008] Close the opening of the electroplating cavity to prevent the liquid formed during the cleaning of the fixture assembly and the wafer carried by the fixture assembly from falling into the electroplating solution in the electroplating cavity;

[0009] Clean the fixture assembly and the wafer carried by the fixture assembly to remove the electroplating solution adhering to the fixture assembly and the wafer carried by the fixture assembly.

[0010] As a preferred embodiment of the above method for preventing dilution of the electroplating solution, after controlling the wafer carried by the fixture assembly to perform an electroplating process in the electroplating solution in the electroplating cavity and before controlling the wafer carried by the fixture assembly to rise to a preset cleaning position, the method for preventing dilution of the electroplating solution further includes:

[0011] Control the wafer carried by the fixture assembly to rise to a preset electroplating solution recovery position; the preset electroplating solution recovery position is located between the opening and the surface of the electroplating solution in the electroplating cavity;

[0012] Clean the electroplating solution adhering to the fixture assembly and the wafer carried by the fixture assembly, so that the cleaned electroplating solution falls into the electroplating solution in the electroplating cavity.

[0013] As a preferred embodiment of the above method for preventing dilution of the electroplating solution, the specific steps for cleaning the electroplating solution adhering to the fixture assembly and the wafer carried by the fixture assembly include:

[0014] Control the fixture assembly to rotate around its own central axis to drive the carried wafer to rotate synchronously, and perform liquid throwing cleaning on the electroplating solution adhering to the fixture assembly and the wafer carried by the fixture assembly; and / or, blow air to the fixture assembly and the wafer carried by the fixture assembly to perform air blowing cleaning on the electroplating solution adhering to the fixture assembly and the wafer carried by the fixture assembly.

[0015] As a preferred embodiment of the above method for preventing dilution of the electroplating solution, after cleaning the fixture assembly and the wafer carried by the fixture assembly to remove the electroplating solution adhering to the fixture assembly and the wafer carried by the fixture assembly, the following steps are further included:

[0016] Dry the fixture assembly and the wafer carried by the fixture assembly;

[0017] The drying methods include: controlling the fixture assembly to rotate around its own central axis to drive the carried wafer to rotate synchronously, and perform spin-drying on the cleaning solution adhering to the fixture assembly and the wafer carried by the fixture assembly; and / or, blow air to the fixture assembly and the wafer carried by the fixture assembly to perform air drying on the cleaning solution adhering to the fixture assembly and the wafer carried by the fixture assembly.

[0018] As a preferred embodiment of the above method for preventing dilution of the electroplating solution, after cleaning the fixture assembly and the wafer carried by the fixture assembly to remove the electroplating solution adhering to the fixture assembly and the wafer carried by the fixture assembly, the following steps are further included:

[0019] Control the fixture assembly to carry the wafer up to a preset wafer removal position, which is higher than the preset cleaning position;

[0020] Control the fixture assembly to open and remove the wafer from the fixture assembly;

[0021] Control the fixture assembly to close;

[0022] Control the fixture assembly to descend to the preset cleaning position;

[0023] When the opening is closed, clean the closed fixture assembly;

[0024] When the opening is closed, dry the closed fixture assembly.

[0025] As a preferred embodiment of the above method for preventing dilution of the electroplating solution, after drying the closed fixture assembly, the following steps are further included:

[0026] Control the fixture assembly to open;

[0027] When the opening is closed, clean the interior of the opened fixture assembly;

[0028] When the opening is closed, dry the opened fixture assembly.

[0029] As a preferred embodiment of the above method for preventing dilution of the electroplating solution, the electroplating apparatus further includes an opening and closing mechanism disposed at the opening of the electroplating cavity; the opening and closing mechanism has an open state and a closed state; when the opening and closing mechanism is in the open state, the fixture assembly can move up and down through the opening; when the opening and closing mechanism is in the closed state, the opening and closing mechanism closes the opening;

[0030] The specific steps for closing the opening of the electroplating cavity include:

[0031] Control the opening and closing mechanism to be in the closed state, and close the opening of the electroplating cavity through the opening and closing mechanism.

[0032] As a preferred embodiment of the above method for preventing dilution of the electroplating solution, the opening and closing mechanism includes an opening and closing part, which can selectively open the opening to make the opening and closing mechanism in the open state, or selectively close the opening to make the opening and closing mechanism in the closed state;

[0033] The specific steps for controlling the opening and closing mechanism to be in the closed state include:

[0034] Control the opening and closing part to close the opening to make the opening and closing mechanism in the closed state.

[0035] As a preferred embodiment of the above method for preventing dilution of the electroplating solution, the opening and closing mechanism further includes a fixing ring and a driving ring. The fixing ring is fixed relative to the electroplating cavity, the driving ring is rotatably sleeved on the outer periphery of the fixing ring, and the driving ring and the fixing ring are coaxially arranged; the driving ring can rotate relative to the fixing ring to drive the opening and closing part to open or close the opening;

[0036] The specific steps for controlling the opening and closing part to close the opening include:

[0037] Control the driving ring to rotate relative to the fixing ring to drive the opening and closing part to close the opening.

[0038] As a preferred embodiment of the above method for preventing dilution of the electroplating solution, the opening and closing mechanism further includes a connecting rod. Along the axial direction of the driving ring, the connecting rod is located between the opening and closing part and the driving ring; a first installation position is provided on the upper end surface of the driving ring along the axial direction, the first rod end of the connecting rod is rotatably connected to the first installation position, a second installation position is provided on the upper end surface of the fixing ring along the axial direction, the first opening and closing end of the opening and closing part is rotatably connected to the second installation position, and the second rod end of the connecting rod is rotatably connected to the second opening and closing end of the opening and closing part; along the circumferential direction of the fixing ring, the first installation position is located between the second installation position and the second rod end of the connecting rod, or the second rod end of the connecting rod is located between the first installation position and the second installation position; the driving ring can rotate relative to the fixing ring and synchronously drive the connecting rod to rotate around the first installation position, and synchronously drive the opening and closing part to rotate around the second installation position to open or close the opening;

[0039] The specific steps for controlling the driving ring to rotate relative to the fixing ring to drive the opening and closing part to close the opening include:

[0040] Control the driving ring to rotate relative to the fixing ring and synchronously drive the connecting rod to rotate around the first installation position, and synchronously drive the opening and closing part to rotate around the second installation position so that the opening and closing part closes the opening.

[0041] As a preferred embodiment of the above method for preventing dilution of the electroplating solution, an electric heating structure is provided on the surface of the opening and closing part, and / or an electric heating structure is formed inside the opening and closing part; the electric heating structure is used to heat and evaporate the liquid on the opening and closing part;

[0042] The method for preventing dilution of the electroplating solution further includes:

[0043] Before switching the opening and closing mechanism from the closed state to the open state, control the electric heating structure to heat and evaporate the liquid on the upper surface of the opening and closing part.

[0044] An electroplating apparatus includes an electroplating cavity and a fixture assembly. The electroplating cavity can hold an electroplating solution, and the fixture assembly can carry a wafer and immerse it into the electroplating solution in the electroplating cavity from an opening above the electroplating cavity to perform an electroplating process. The electroplating apparatus can execute the above method for preventing dilution of the electroplating solution based on the electroplating cavity and the fixture assembly.

[0045] A storage medium stores a computer program, and the computer program can be executed by the electroplating apparatus to implement the above method for preventing dilution of the electroplating solution.

[0046] Advantages of the present invention:

[0047] The present invention provides a method for preventing dilution of an electroplating solution, an electroplating apparatus, and a storage medium. Among them, the method for preventing dilution of the electroplating solution includes: after the fixture assembly carries the wafer to complete the electroplating process in the electroplating solution in the electroplating cavity, control the fixture assembly to carry the wafer to rise to a preset cleaning position, and the preset cleaning position is higher than the position where the opening is located; close the opening of the electroplating cavity to prevent the liquid formed during the cleaning of the fixture assembly and the wafer carried by the fixture assembly from falling into the electroplating solution in the electroplating cavity; clean the fixture assembly and the wafer carried by the fixture assembly to remove the electroplating solution attached to the fixture assembly and the wafer carried by the fixture assembly.

[0048] By adopting the method for preventing dilution of the electroplating solution, when cleaning the fixture assembly and the wafer, the opening of the electroplating cavity will be closed, so that the liquid formed before and after cleaning will not fall into the electroplating solution in the electroplating cavity, avoiding the dilution of the concentration of the electroplating solution in the electroplating cavity caused by the cleaning liquid falling into the electroplating solution in the electroplating cavity, effectively improving the working efficiency of the electroplating apparatus, and effectively improving the stability, uniformity and quality of electroplating the wafer. Description of the Drawings

[0049] Figure 1 is a flowchart of the method for preventing dilution of the electroplating solution provided by a specific embodiment of the present invention;

[0050] Figure 2It is a schematic structural diagram of the electroplating device provided by a specific embodiment of the present invention;

[0051] Figure 3 It is a cross-sectional view of the electroplating device provided by a specific embodiment of the present invention;

[0052] Figure 4 It is a partial structural schematic diagram of the electroplating device provided by a specific embodiment of the present invention along the first perspective;

[0053] Figure 5 It is a partial structural schematic diagram of the electroplating device provided by a specific embodiment of the present invention along the second perspective;

[0054] Figure 6 It is a structural schematic diagram along the first perspective when the opening and closing mechanism is in a closed state when, along the circumferential direction of the fixed ring, each first installation position is located between the corresponding second installation position and the second rod end of the corresponding connecting rod;

[0055] Figure 7 It is a structural schematic diagram when the opening and closing mechanism is not fully opened when, along the circumferential direction of the fixed ring, each first installation position is located between the corresponding second installation position and the second rod end of the corresponding connecting rod;

[0056] Figure 8 It is a structural schematic diagram when the opening and closing mechanism is fully opened when, along the circumferential direction of the fixed ring, each first installation position is located between the corresponding second installation position and the second rod end of the corresponding connecting rod;

[0057] Figure 9 It is a partial structural schematic diagram along the second perspective when the opening and closing mechanism is in a closed state when, along the circumferential direction of the fixed ring, each first installation position is located between the corresponding second installation position and the second rod end of the corresponding connecting rod;

[0058] Figure 10 It is a partial structural schematic diagram when the opening and closing mechanism is not fully opened when, along the circumferential direction of the fixed ring, each first installation position is located between the corresponding second installation position and the second rod end of the corresponding connecting rod;

[0059] Figure 11 It is a partial structural schematic diagram when the opening and closing mechanism is in a closed state when, along the circumferential direction of the fixed ring, the second rod end of each connecting rod is located between the corresponding first installation position and the corresponding second installation position;

[0060] Figure 12It is a partial structural schematic diagram when the opening and closing mechanism is not fully opened when, along the circumferential direction of the fixed ring, the second rod ends of each connecting rod are located between the corresponding first installation positions and the corresponding second installation positions provided by the specific embodiments of the present invention;

[0061] Figure 13 It is a structural schematic diagram of the opening and closing part provided by the specific embodiments of the present invention.

[0062] In the figure:

[0063] 1. Electroplating cavity; 11. Opening;

[0064] 2. Fixture assembly;

[0065] 3. Opening and closing mechanism; 31. Opening and closing part; 311. First opening and closing end; 312. Second opening and closing end; 313. Third opening and closing end; 32. Fixed ring; 321. Second installation position; 33. Driving ring; 331. Tooth-shaped part; 34. Connecting rod; 341. First rod end; 342. Second rod end; 35. Driving motor; 36. Gear;

[0066] 4. Waste liquid collection tank body; 41. Upper cavity; 42. Lower cavity;

[0067] 5. Deflector; 51. Communication hole. Specific embodiments

[0068] The present invention will be further described in detail below with reference to the accompanying drawings and embodiments. It can be understood that the specific embodiments described herein are only used to explain the present invention, rather than limiting the present invention. In addition, it should be noted that, for the sake of convenience of description, only the parts related to the present invention rather than all the structures are shown in the drawings.

[0069] In the description of the present invention, unless otherwise clearly defined and limited, the terms "connected", "connected", "fixed" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or integrated; it can be a mechanical connection, an electrical connection; it can be directly connected, or indirectly connected through an intermediate medium, and it can be the communication inside two components or the interaction relationship between two components. For those of ordinary skill in the art, the specific meanings of the above terms in the present invention can be understood according to specific situations.

[0070] In the present invention, unless otherwise clearly specified and defined, the first feature being "on" or "under" the second feature may include the direct contact between the first and second features, or may include the situation where the first and second features are not in direct contact but in contact through additional features therebetween. Moreover, the first feature being "above", "over" and "on top of" the second feature includes that the first feature is directly above and obliquely above the second feature, or merely indicates that the horizontal height of the first feature is higher than that of the second feature. The first feature being "under", "beneath" and "underneath" the second feature includes that the first feature is directly below and obliquely below the second feature, or merely indicates that the horizontal height of the first feature is less than that of the second feature.

[0071] In the description of this embodiment, the orientation or positional relationships such as "up", "down", "right", etc. are based on the orientation or positional relationship shown in the drawings, and are only for the convenience of description and simplifying the operation, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus should not be construed as a limitation to the present invention. In addition, the terms "first" and "second" are only used for distinction in description and have no special meaning.

[0072] Embodiment 1

[0073] As Figure 1 shown, this embodiment provides a method for preventing the dilution of electroplating solution. By adopting this method for preventing the dilution of electroplating solution, when cleaning the fixture assembly 2 and the wafer, the opening 11 of the electroplating cavity 1 will be closed, so that the liquid formed before and after cleaning will not fall into the electroplating solution in the electroplating cavity 1, avoiding the dilution of the concentration of the electroplating solution in the electroplating cavity 1 caused by the cleaning solution falling into the electroplating solution in the electroplating cavity 1, which can effectively improve the working efficiency of the electroplating device, and can effectively improve the stability, uniformity and quality of electroplating the wafer.

[0074] Specifically, as Figure 2 and Figure 3 shown, the electroplating device includes an electroplating cavity 1 and a fixture assembly 2. The electroplating cavity 1 can hold electroplating solution, and the fixture assembly 2 can carry the wafer and immerse it into the electroplating solution in the electroplating cavity 1 from the opening 11 above the electroplating cavity 1 for electroplating process.

[0075] Specifically, this method for preventing the dilution of electroplating solution is usually executed after the fixture assembly 2 carries the wafer and finishes the electroplating process in the electroplating solution in the electroplating cavity 1, and is usually carried out before putting the wafer into the fixture assembly 2 when the fixture assembly does not carry the wafer.

[0076] As Figure 1 shown, this method for preventing the dilution of electroplating solution includes:

[0077] S100. Control the fixture assembly 2 to lift the wafer to a preset plating solution recovery position.

[0078] The preset plating solution recovery position is located between the opening 11 and the surface of the plating solution in the electroplating cavity 1. It can be understood that along the height direction of the electroplating cavity 1, the preset plating solution recovery position can be any height position between the opening 11 and the surface of the plating solution in the electroplating cavity 1. Such a setting enables the plating solution to be cleaned later to fall into the plating solution in the electroplating cavity 1 when cleaning the plating solution attached to the fixture assembly 2 and the wafer carried by the fixture assembly 2, so that a part of the plating solution can be recovered, thereby effectively reducing the electroplating cost.

[0079] S200. Clean the plating solution attached to the fixture assembly 2 and the wafer carried by the fixture assembly 2, so that the cleaned plating solution falls into the plating solution in the electroplating cavity 1.

[0080] Specifically, step S200 includes:

[0081] Controlling the fixture assembly 2 to rotate around its own central axis to drive the carried wafer to rotate synchronously, and performing liquid throwing cleaning on the plating solution attached to the fixture assembly 2 and the wafer carried by the fixture assembly 2; and / or blowing air onto the fixture assembly 2 and the wafer carried by the fixture assembly 2 to perform blowing cleaning on the plating solution attached to the fixture assembly 2 and the wafer carried by the fixture assembly 2.

[0082] In this embodiment, exemplarily, the electroplating device further includes a rotating mechanism, which drives the fixture assembly 2 to rotate around its own central axis, drives the wafer carried by the fixture assembly 2 to rotate synchronously, and performs liquid throwing on the plating solution attached to the fixture assembly 2 and the wafer carried by the fixture assembly 2, so as to achieve the purpose of cleaning the plating solution attached to the fixture assembly 2 and the wafer carried by the fixture assembly 2.

[0083] As an alternative solution, the electroplating device further includes a blowing structure, which blows air onto the fixture assembly 2 and the wafer carried by the fixture assembly 2 to blow the plating solution attached to the fixture assembly 2 and the wafer carried by the fixture assembly 2 into the plating solution in the electroplating cavity 1, and can also achieve the purpose of cleaning the plating solution attached to the fixture assembly 2 and the wafer carried by the fixture assembly 2.

[0084] As an alternative solution, the electroplating device includes a rotating mechanism and a blowing structure. While driving the fixture assembly 2 to rotate around its own central axis and driving the wafer carried by the fixture assembly 2 to rotate synchronously, blowing air onto the fixture assembly 2 and the wafer carried by the fixture assembly 2 through the blowing mechanism can improve the efficiency of cleaning the plating solution attached to the fixture assembly 2 and the wafer carried by the fixture assembly 2.

[0085] Such a setting enables the cleaning of the jig assembly 2 and the electroplating solution adhering to the wafer carried by the jig assembly 2, and also enables the recovery of a part of the electroplating solution adhering to the jig assembly 2 and the wafer carried by the jig assembly 2 into the electroplating cavity 1 to save the electroplating cost.

[0086] It can be understood that other structures can also be used to clean the electroplating solution adhering to the jig assembly 2 and the wafer carried by the jig assembly 2, as long as the purpose of cleaning the electroplating solution adhering to the jig assembly 2 and the wafer carried by the jig assembly 2 can be achieved, and a part of the electroplating solution adhering to the jig assembly 2 and the wafer carried by the jig assembly 2 can be recovered into the electroplating cavity 1.

[0087] S300. Control the jig assembly 2 to carry the wafer up to a preset cleaning position, and the preset cleaning position is higher than the position where the opening 11 is located.

[0088] It can be understood that the preset cleaning position is a certain fixed height position above the opening 11. Specifically, the electroplating device further includes a waste liquid collection tank body 4. In this embodiment, the electroplating cavity 1 is arranged in the waste liquid collection tank body 4, and the preset cleaning position is located above the opening 11 along the height direction of the electroplating cavity 1 and within the waste liquid collection tank body 4. In other embodiments, the top of the waste liquid collection tank body 4 along the height direction can also be set lower than the position where the opening 11 is located.

[0089] S400. Close the opening 11 of the electroplating cavity 1 to prevent the liquid formed during the cleaning of the jig assembly 2 and the wafer carried by the jig assembly 2 from falling into the electroplating solution in the electroplating cavity 1.

[0090] Specifically, as Figures 2 to 12 shown, the electroplating device further includes an opening and closing mechanism 3, and the opening and closing mechanism 3 is arranged at the opening 11 of the electroplating cavity 1; the opening and closing mechanism 3 has an open state and a closed state; when the opening and closing mechanism 3 is in the open state, the jig assembly 2 can move up and down through the opening 11; when the opening and closing mechanism 3 is in the closed state, the opening and closing mechanism 3 closes the opening 11.

[0091] The specific steps for closing the opening 11 of the electroplating cavity 1 include:

[0092] Control the opening and closing mechanism 3 to be in the closed state, and close the opening 11 of the electroplating cavity 1 through the opening and closing mechanism 3.

[0093] Further, as Figures 3 to 13 shown, the opening and closing mechanism 3 includes an opening and closing part 31, and the opening and closing part 31 can selectively open the opening 11 to make the opening and closing mechanism 3 in the open state, or selectively close the opening 11 to make the opening and closing mechanism 3 in the closed state.

[0094] The specific steps for controlling the opening and closing mechanism 3 to be in the closed state include:

[0095] The opening and closing part 31 is controlled to close the opening 11, so that the opening and closing mechanism 3 is in a closed state.

[0096] Furthermore, as Figures 2 to 12 shown, the opening and closing mechanism 3 further includes a fixed ring 32 and a driving ring 33. The fixed ring 32 is fixed relative to the electroplating cavity 1. The driving ring 33 is rotatably sleeved on the outer periphery of the fixed ring 32, and the driving ring 33 and the fixed ring 32 are coaxially arranged. The driving ring 33 can rotate relative to the fixed ring 32 to drive the opening and closing part 31 to open or close the opening 11.

[0097] The specific steps of controlling the opening and closing part 31 to close the opening 11 include:

[0098] Controlling the driving ring 33 to rotate relative to the fixed ring 32 to drive the opening and closing part 31 to close the opening 11.

[0099] Furthermore, as Figures 9 to 12 shown, the opening and closing mechanism 3 further includes a connecting rod 34. Along the axial direction of the driving ring 33, the connecting rod 34 is located between the opening and closing part 31 and the driving ring 33. A first installation position is provided on the upper end surface of the driving ring 33 along the axial direction. The first rod end 341 of the connecting rod 34 is rotatably connected to the first installation position. A second installation position 321 is provided on the upper end surface of the fixed ring 32 along the axial direction. The first opening and closing end 311 of the opening and closing part 31 is rotatably connected to the second installation position 321. The second rod end 342 of the connecting rod 34 is rotatably connected to the second opening and closing end 312 of the opening and closing part 31. Along the circumferential direction of the fixed ring 32, the first installation position is located between the second installation position 321 and the second rod end 342 of the connecting rod 34, or the second rod end 342 of the connecting rod 34 is located between the first installation position and the second installation position 321. The driving ring 33 can rotate relative to the fixed ring 32 and synchronously drive the connecting rod 34 to rotate around the first installation position as the rotation center, and synchronously drive the opening and closing part 31 to rotate around the second installation position 321 as the rotation center to open or close the opening 11.

[0100] The specific steps of controlling the driving ring 33 to rotate relative to the fixed ring 32 to drive the opening and closing part 31 to close the opening 11 include:

[0101] Controlling the driving ring 33 to rotate relative to the fixed ring 32 and synchronously drive each connecting rod 34 to rotate around the corresponding first installation position as the rotation center, and synchronously drive each opening and closing part 31 to rotate around the corresponding second installation position 321 as the rotation center, so that each opening and closing part 31 moves closer to the center of the opening 11 and is spliced to form a whole to close the opening 11.

[0102] It can be understood that the number of the opening and closing parts 31 can be adaptively set to one or more according to the actual working conditions. When the number of the opening and closing parts 31 is multiple, multiple connecting rods 34 are correspondingly provided for the multiple opening and closing parts 31.

[0103] As an alternative, the number of opening and closing parts is one, and the opening and closing mechanism 3 further includes a first linear movement driving part such as a linear motor or an electric push rod. The opening and closing part (not shown in the figure) is connected to the output end of the first linear movement driving part, and the first linear movement driving part drives the opening and closing part to move along a first fixed straight line so as to be able to drive the opening and closing part to open or close the opening 11 of the electroplating cavity 1.

[0104] The specific steps for controlling the opening and closing mechanism 3 to be in a closed state include:

[0105] Control the first linear movement driving part to drive the opening and closing part to move along the first fixed straight line to close the opening 11 of the electroplating cavity 1.

[0106] As an alternative, the number of opening and closing parts is one, and the opening and closing mechanism 3 further includes a first rotation driving part such as a rotary motor. The opening and closing part is connected to the output end of the first rotation driving part, and the first rotation driving part can drive the opening and closing part to rotate around a first fixed axis to open or close the opening 11 of the electroplating cavity 1.

[0107] The specific steps for controlling the opening and closing mechanism 3 to be in a closed state include:

[0108] Control the first rotation driving part to drive the opening and closing part to rotate around the first fixed axis to close the opening 11 of the electroplating cavity 1.

[0109] As an alternative, the number of opening and closing parts is two, and the opening and closing mechanism 3 further includes two second linear movement driving parts. The two opening and closing parts (not shown in the figure) and the two second linear movement driving parts are arranged in one-to-one correspondence. The opening and closing part is connected to the output end of the second linear movement driving part, and the two second linear movement driving parts can drive the corresponding opening and closing parts to approach or move away from each other along a second fixed straight line so that the two opening and closing parts can selectively open or close the opening 11. Among them, the second linear movement driving part is a linear motor or two electric push rods, etc.

[0110] The specific steps for controlling the opening and closing mechanism 3 to be in a closed state include:

[0111] Control the two second linear movement driving parts to drive the corresponding opening and closing parts to approach each other along the second fixed straight line to close the opening 11 of the electroplating cavity 1.

[0112] As an alternative, the number of opening and closing parts is two, and the opening and closing mechanism 3 further includes two second rotation driving parts. The two opening and closing parts (not shown in the figure) are correspondingly connected to the output ends of the two second rotation driving parts, and each second rotation driving part can drive the corresponding opening and closing part to rotate around the corresponding second fixed axis to open or close the opening 11 of the electroplating cavity 1. Among them, the second rotation driving part is a rotary motor, etc.

[0113] The specific steps for controlling the opening and closing mechanism 3 to be in a closed state include:

[0114] Control two second rotation driving members to drive the corresponding opening and closing parts to rotate around their respective second fixed axes, and close the opening 11 of the electroplating cavity 1.

[0115] It can be understood that the opening and closing mechanism 3 can be connected to the opening 11 of the electroplating cavity 1 or to a certain fixed position above the opening 11 of the electroplating cavity 1. Along the height direction of the electroplating cavity 1, when the opening and closing mechanism 3 is in a closed state, the orthographic projection of the opening and closing mechanism 3 can completely cover the opening 11. Other structures can also be used to close the opening 11 of the electroplating cavity 1, as long as it can prevent the liquid generated by cleaning the fixture assembly 2 and the wafer from falling into the electroplating cavity 1 and affecting the concentration of the electroplating solution in the electroplating cavity 1.

[0116] S500. Clean the fixture assembly 2 and the wafer carried by the fixture assembly 2 to remove the electroplating solution adhering to the fixture assembly 2 and the wafer carried by the fixture assembly 2.

[0117] Specifically, the fixture assembly 2 and the wafer are sprayed with cleaning liquid through a cleaning structure to clean the fixture assembly 2 and the wafer carried by the fixture assembly 2. The liquid obtained from the cleaning falls into the waste liquid collection tank body 4. The specific structure of the cleaning structure is not limited, as long as it can achieve the purpose of cleaning the fixture assembly 2 and the wafer.

[0118] With such a setting, the liquid generated by cleaning the fixture assembly 2 and the wafer will not fall into the electroplating cavity 1 and affect the concentration of the electroplating solution in the electroplating cavity 1, which can effectively improve the working efficiency of the electroplating device, and can effectively improve the stability, uniformity and quality of electroplating the wafer.

[0119] S600. Dry the fixture assembly 2 and the wafer carried by the fixture assembly 2.

[0120] Specifically, in this embodiment, the drying method is: control the fixture assembly 2 to rotate around its own central axis to drive the carried wafer to rotate synchronously, and spin-dry the cleaning liquid adhering to the fixture assembly 2 and the wafer carried by the fixture assembly 2. The liquid shed during the spin-drying process falls into the waste liquid collection tank body 4. Specifically, the fixture assembly 2 is driven to rotate around its own central axis by a rotating mechanism.

[0121] As an alternative solution, blow air to the fixture assembly 2 and the wafer carried by the fixture assembly 2 to blow dry the electroplating solution adhering to the fixture assembly 2 and the wafer carried by the fixture assembly 2. The cleaning liquid blown off during the drying process falls into the waste liquid collection tank body 4. Specifically, blow air to the fixture assembly 2 and the wafer carried by the fixture assembly 2 through a blowing structure.

[0122] As another alternative, while controlling the fixture assembly 2 to rotate around its own central axis to drive the carried wafer to rotate synchronously, blowing air onto the fixture assembly 2 and the wafer carried by the fixture assembly 2 can improve the efficiency of drying the fixture assembly 2 and the wafer carried by the fixture assembly 2.

[0123] In this way, it is possible to dry the fixture assembly 2 and the wafer carried by the fixture assembly 2, and it is possible to avoid affecting the concentration of the electroplating solution in the electroplating cavity 1 during the process of drying the fixture assembly 2 and the wafer carried by the fixture assembly 2.

[0124] S700. Control the fixture assembly 2 to carry the wafer up to a preset wafer removal position, and the preset wafer removal position is higher than the preset cleaning position.

[0125] Preferably, along the height direction of the electroplating cavity 1, the preset wafer removal position is located above the waste liquid collection tank body 4.

[0126] S800. Control the fixture assembly 2 to open and take out the wafer from the fixture assembly 2.

[0127] S900. Control the fixture assembly 2 to close.

[0128] S1000. Control the fixture assembly 2 to descend to the preset cleaning position.

[0129] S1100. When the opening 11 is closed, clean the closed fixture assembly 2.

[0130] Specifically, the cleaning method has been described in step S500, so it will not be elaborated here.

[0131] S1200. When the opening 11 is closed, dry the closed fixture assembly 2.

[0132] Specifically, the drying method has been described in step S600, so it will not be elaborated here.

[0133] It can be understood that after step S400, preferably, the opening and closing mechanism 3 always remains in a closed state until before electroplating the next wafer, and then control the opening and closing mechanism 3 to switch to an open state to open the opening 11.

[0134] S1300. Control the fixture assembly 2 to open.

[0135] S1400. When the opening 11 is closed, clean the interior of the opened fixture assembly 2.

[0136] Specifically, the cleaning method has been described in step S500, so it will not be elaborated here.

[0137] S1500. When the opening 11 is closed, dry the opened fixture assembly 2.

[0138] Specifically, the cleaning method has been described in step S600, so it will not be elaborated here.

[0139] With such a setting, it is possible to clean and dry the closed fixture assembly 2 and the opened fixture assembly 2; secondly, it can avoid affecting the concentration of the plating solution in the plating cavity 1 when cleaning and drying the closed fixture assembly 2 and the opened fixture assembly 2, which can further improve the working efficiency of the plating device, further improve the stability, reliability and quality of plating the wafer, and can avoid contaminating the next wafer when the fixture assembly 2 picks up the next wafer.

[0140] Preferably, an electric heating structure is provided on the surface of the opening and closing part 31, and / or an electric heating structure is formed inside the opening and closing part 31; the electric heating structure is used to heat and evaporate the liquid on the opening and closing part 31.

[0141] The method for preventing the dilution of the plating solution further includes:

[0142] Before switching the opening and closing mechanism 3 from the closed state to the open state, control the electric heating structure to heat and evaporate the liquid on the upper surface of the opening and closing part 31.

[0143] With such a setting, it is possible to avoid the liquid remaining on the opening and closing part 31 falling into the plating cavity 1 during the process of switching the opening and closing mechanism 3 from the closed state to the open state and affecting the concentration of the plating solution in the plating cavity 1, thereby being able to further improve the stability, reliability and quality of plating the wafer.

[0144] Embodiment 2

[0145] This embodiment also provides a plating device for implementing the method for preventing the dilution of the plating solution described in Embodiment 1. It should be noted that the specific structure of the plating device in this embodiment is one of the specific solutions capable of implementing the method for preventing the dilution of the plating solution described in Embodiment 1, which is only an example for clearly explaining the above method, rather than limiting the specific implementation manner of the present invention. Any solution that can prevent the dilution of the plating solution during the process of cleaning the fixture assembly and the wafer is within the protection scope of the above method.

[0146] Such as Figures 2 to 12As shown in the figure, the electroplating device includes an electroplating cavity 1, a fixture assembly 2, and an opening / closing mechanism 3. Among them, the fixture assembly 2 is located above the electroplating cavity 1. The electroplating cavity 1 can hold electroplating solution, and the fixture assembly 2 can carry the wafer and immerse it into the electroplating solution in the electroplating cavity 1 through the opening 11 above the electroplating cavity 1 for the electroplating process. The opening / closing mechanism 3 is arranged at the opening 11 of the electroplating cavity 1. The opening / closing mechanism 3 has an open state and a closed state. When the opening / closing mechanism 3 is in the open state, the fixture assembly 2 can move up and down through the opening 11. When the opening / closing mechanism 3 is in the closed state, the opening / closing mechanism 3 closes the opening 11. When the wafer carried by the fixture assembly 2 completes the electroplating process and rises to the preset cleaning position, the opening / closing mechanism 3 switches to the closed state to close the opening 11. At this time, the opening / closing mechanism 3 in the closed state can prevent the liquid formed by cleaning the fixture assembly 2 and / or the wafer carried by the fixture assembly 2 from falling into the electroplating solution in the electroplating cavity 1. The preset cleaning position is located above the opening / closing mechanism 3.

[0147] When electroplating the wafer, control the opening / closing mechanism 3 to be in the open state to connect the electroplating cavity 1 with the outside world. The fixture assembly 2 carries the wafer and immerses it into the electroplating solution in the electroplating cavity 1 through the opening 11 above the electroplating cavity 1 for the electroplating process. After the wafer completes the electroplating process in the electroplating solution in the electroplating cavity 1, control the fixture assembly 2 to carry the wafer and move it above the electroplating solution in the electroplating cavity 1 to the preset plating solution recovery position. At the preset plating solution recovery position, the electroplating solution attached to the fixture assembly 2 and the wafer (the splashed-back electroplating solution includes the electroplating solution inside and outside the fixture assembly, inside and outside the wafer, and in the gap between the fixture assembly and the wafer) is splashed back into the electroplating solution in the electroplating cavity 1 by rotation to avoid waste of electroplating solution and save resources and costs. Then control the fixture assembly 2 to carry the wafer and move it above the opening / closing mechanism 3 to the preset cleaning position. At this time, both the wafer and the fixture assembly 2 are spaced above the opening / closing mechanism 3. Then control the opening / closing mechanism 3 to switch to the closed state, so that the opening 11 of the electroplating cavity 1 is closed. Then clean the residual electroplating solution attached to the fixture assembly 2 and the wafer to remove the residual electroplating solution on the fixture assembly 2 and the residual electroplating solution on the wafer. Since the opening / closing mechanism 3 is in the closed state at this time, the liquid generated by cleaning the fixture assembly 2 and the wafer will not fall into the electroplating cavity 1 and affect the concentration of the electroplating solution. It can be understood that the liquid generated by cleaning the fixture assembly 2 and the wafer at this time is a mixed liquid of electroplating solution and cleaning solution.

[0148] Secondly, after the wafer carried by the fixture assembly 2 is moved to the preset wafer removal position and the wafer is taken away, control the opening / closing mechanism 3 to remain in the closed state, and lower the fixture assembly 2 again to the preset cleaning position to clean and dry the outer circumference and the inside of the fixture assembly 2, which can not only avoid contaminating the next wafer when the fixture assembly 2 grips the next wafer, but also further avoid affecting the concentration of the electroplating solution in the electroplating cavity 1 when cleaning the fixture assembly 2.

[0149] Secondly, when the electroplating device is not performing electroplating work, the opening and closing mechanism 3 is controlled to remain in a closed state, which can prevent foreign debris and the like from entering the electroplating cavity 1 and affecting the quality of the electroplating solution.

[0150] Therefore, when using this electroplating device to clean the fixture assembly 2 and the wafer, it will not affect the concentration of the electroplating solution in the electroplating cavity 1, which can effectively improve the working efficiency of the electroplating device, and can effectively improve the stability, uniformity and quality of electroplating the wafer; secondly, a part of the electroplating solution attached to the fixture assembly 2 and the wafer can be recycled into the electroplating cavity 1 to save electroplating costs; thirdly, compared with the passive method of natural evaporation in the prior art, this device and method for solving the change of electroplating solution concentration from the source can more effectively control the concentration of the electroplating solution in the electroplating cavity 1.

[0151] Among them, the fixture assembly 2 can fix the wafer and seal the back surface of the wafer. The fixture assembly 2 can carry the wafer and gradually move down in the electroplating cavity 1 to immerse the wafer into the electroplating solution to electroplate the front surface of the wafer, so as to deposit a corresponding metal layer on the front surface of the wafer. Specifically, the back surface of the wafer refers to: along the height direction of the electroplating cavity 1, the side surface of the wafer away from the electroplating solution in the electroplating cavity 1. The front surface of the wafer refers to: along the height direction of the electroplating cavity 1, the side surface of the wafer close to the electroplating solution in the electroplating cavity 1. The specific structure of the fixture assembly 2 belongs to the prior art, so it will not be elaborated here.

[0152] Among them, as Figures 2 to 13 shown, the opening and closing mechanism 3 includes at least two opening and closing parts 31, and at least two opening and closing parts 31 are sequentially distributed along the circumference of the opening 11; at least two opening and closing parts 31 can synchronously move from the outside of the opening 11 towards the center of the opening 11 to be spliced together to form an integral body and close the opening 11, so that the opening and closing mechanism 3 is in a closed state; and at least two opening and closing parts 31 can synchronously move from the center of the opening 11 to the outside of the opening 11 to separate from each other and completely open the opening 11, so that the opening and closing mechanism 3 is in an open state. Specifically, when at least two opening and closing parts 31 are in an open state, the fixture assembly 2 can carry the wafer and immerse it into the electroplating solution in the electroplating cavity 1 through the opening 11 above the electroplating cavity 1 for the electroplating process. After that, the electroplating device cleans the electroplating solution attached to the fixture assembly 2 and the wafer carried by the fixture assembly 2 in the electroplating cavity 1, that is, controls the fixture assembly 2 to carry the wafer and rotate synchronously to shake off the attached electroplating solution; when the opening and closing mechanism 3 is in a closed state, the residual electroplating solution attached to the fixture assembly 2 and the wafer can be cleaned to remove the residual electroplating solution on the fixture assembly 2 and the residual electroplating solution on the wafer, and the outer periphery and the inside of the fixture assembly 2 can be cleaned and dried after taking away the wafer on the fixture assembly 2. It can be understood that the opening and closing mechanism 3 being in an open state refers to the state where at least two opening and closing parts 31 separate from each other and completely open the opening 11.

[0153] Specifically, Figures 2 to 12 As shown, the opening and closing mechanism 3 also includes a fixed ring 32 and a driving ring 33. The fixed ring 32 is fixed relative to the electroplating chamber 1, and the driving ring 33 is rotatably sleeved on the outer periphery of the fixed ring 32. The driving ring 33 and the fixed ring 32 are coaxially arranged; the driving ring 33 can rotate relative to the fixed ring 32 to drive at least two opening and closing parts 31 to open or close the opening 11. So that at least two opening and closing parts 31 can synchronously move from the outside of the opening 11 to the center of the opening 11 to form a whole and close the opening 11, so that the opening and closing mechanism 3 is in a closed state; and at least two opening and closing parts 31 can synchronously separate from each other from the center of the opening 11 to the outside of the opening 11 to completely open the opening 11, so that the opening and closing mechanism 3 is in an open state.

[0154] It can be understood that the central axis of the driving ring 33 , the rotational center line of the driving ring 33 , and the central axis of the fixing ring 32 are all collinear.

[0155] Specifically, Figure 2 , Figure 3 , Figures 6 to 12 As shown, a toothed portion 331 is formed on the outer periphery of the driving ring 33, and the opening and closing mechanism 3 further includes a driving motor 35, and a gear 36 that is transmission-connected to the output shaft of the driving motor 35. The driving motor 35 is fixed relative to the electroplating chamber 1, and the gear 36 is meshed with the toothed portion 331. The driving motor 35 drives the gear 36 to rotate forward or reversely around its own central axis, and the gear 36 is meshed with the toothed portion 331 to drive the driving ring 33 to rotate around its own central axis in a first clockwise direction, or around its own central axis in a second clockwise direction. The first clockwise direction and the second clockwise direction are opposite clockwise directions.

[0156] Specifically, in some embodiments, Figures 6 to 10 and Figure 13As shown, the opening and closing mechanism 3 further includes at least two link rods 34, and the at least two link rods 34 and the at least two opening and closing parts 31 are arranged in one-to-one correspondence; along the axial direction of the driving ring 33, the link rods 34 are located between the opening and closing parts 31 and the driving ring 33; on the upper end surface of the driving ring 33 along the axial direction, there are at least two first mounting positions evenly distributed, and the first rod ends 341 of the at least two link rods 34 are rotatably connected to the at least two first mounting positions in one-to-one correspondence; on the upper end surface of the fixed ring 32 along the axial direction, there are at least two second mounting positions 321 evenly distributed, and the first opening and closing ends 311 of the at least two opening and closing parts 31 are rotatably connected to the at least two second mounting positions 321 in one-to-one correspondence; the second rod ends 342 of the link rods 34 are rotatably connected to the second opening and closing ends 312 of the opening and closing parts 31; along the circumferential direction of the fixed ring 32, each first mounting position is located between the corresponding second mounting position 321 and the second rod end 342 of the corresponding link rod 34; the driving ring 33 can rotate relative to the fixed ring 32 and synchronously drive each link rod 34 to rotate with the corresponding first mounting position as the rotation center, and synchronously drive each opening and closing part 31 to rotate with the corresponding second mounting position 321 as the rotation center to open or close the opening 11. It can be understood that the setting positions of the first mounting position and the first rod end 341 coincide. The at least two first mounting positions are evenly spaced along the circumferential direction of the driving ring 33. The at least two second mounting positions 321 are evenly spaced along the circumferential direction of the fixed ring 32.

[0157] As Figures 6 to 10As shown, for the circumferential direction along the fixed ring 32, where each first mounting position is located between the corresponding second mounting position 321 and the second rod end 342 of the corresponding connecting rod 34: When the opening and closing mechanism 3 is switched from the closed state to the open state, the control driving ring 33 rotates relative to the fixed ring 32 in the first clockwise direction, and the driving ring 33 drives the plurality of connecting rods 34 to move synchronously in the first clockwise direction. During the process of the plurality of connecting rods 34 moving synchronously in the first clockwise direction, since the corresponding second mounting position 321 of each connecting rod 34 is fixed, the plurality of connecting rods 34 synchronously rotate around their respective corresponding first mounting positions in a direction away from the center of the opening 11, driving the plurality of opening and closing parts 31 to synchronously rotate around the corresponding second mounting position 321 in a direction away from the center opening 11 until the opening 11 is completely opened, so as to realize the switching of the opening and closing mechanism 3 from the closed state to the open state; When the opening and closing mechanism 3 is switched from the open state to the closed state, the control driving ring 33 rotates relative to the fixed ring 32 in the second clockwise direction, and the driving ring 33 drives the plurality of connecting rods 34 to move synchronously in the second clockwise direction. During the process of the plurality of connecting rods 34 moving synchronously in the second clockwise direction, since the corresponding second mounting position 321 of each connecting rod 34 is fixed, the plurality of connecting rods 34 synchronously rotate around their respective corresponding first mounting positions towards the center of the opening 11, driving the plurality of opening and closing parts 31 to synchronously rotate around the corresponding second mounting position 321 towards the center of the opening 11 until the opening 11 is completely closed, so as to realize the switching of the opening and closing mechanism 3 from the open state to the closed state. Specifically, completely opening the opening 11 means that: along the height direction of the electroplating cavity 1, the orthographic projections of the plurality of opening and closing parts 31 are all distributed on the outer periphery of the opening 11. Completely closing the opening 11 means that: along the height direction of the electroplating cavity 1, the orthographic projections of the plurality of opening and closing parts 31 completely cover the opening 11.

[0158] Preferably, as Figures 6 to 10 shown, for the circumferential direction along the fixed ring 32, where each first mounting position is located between the corresponding second mounting position 321 and the second rod end 342 of the corresponding connecting rod 34, the connecting rod 34 is arc-shaped. When the opening and closing mechanism 3 is in the closed state, the radially inner side wall of the connecting rod 34 is in contact with the radially outer peripheral wall of the fixed ring 32. With such a setting, the limit position of the opening and closing part 31 rotating around the second mounting position 321 towards the center of the opening 11 can be defined, so as to avoid excessive rotation towards the center of the opening 11 and damage or even destroy the opening and closing part 31; Secondly, compared with setting the connecting rod 34 as a straight rod or other shaped rods, the size and occupied space of the connecting rod 34 can be reduced, the volume of the driving ring 33 can be reduced, and the exposure of the connecting rod 34 can be avoided, improving the aesthetics of the opening and closing mechanism 3.

[0159] It can be understood that the linear distance between the first rod end 341 and the second rod end 342 of the connecting rod 34 directly determines the caliber size of the communication port formed when the opening and closing mechanism 3 is in the open state.

[0160] It can be understood that, as Figure 9 and Figure 10 shown, when the opening and closing mechanism 3 is in the closed state, the radially inner wall of the connecting rod 34 faces the center of the fixed ring 32, and the center of the circle corresponding to the connecting rod 34 is concentric with the center of the fixed ring 32. The center of the fixed ring 32 is the center of the fixed ring 32.

[0161] Specifically, in some other embodiments, as Figures 11 to 13 shown, the opening and closing mechanism 3 further includes at least two connecting rods 34, and the at least two connecting rods 34 are arranged in one-to-one correspondence with at least two opening and closing parts 31; along the axial direction of the driving ring 33, the connecting rods 34 are located between the opening and closing parts 31 and the driving ring 33; at least two first mounting positions are evenly distributed on the upper end surface of the driving ring 33 along the axial direction, and the first rod ends 341 of the at least two connecting rods 34 are rotatably connected to the at least two first mounting positions in one-to-one correspondence; at least two second mounting positions 321 are evenly distributed on the upper end surface of the fixed ring 32 along the axial direction, and the first opening and closing ends 311 of the at least two opening and closing parts 31 are rotatably connected to the at least two second mounting positions 321 in one-to-one correspondence; the second rod end 342 of the connecting rod 34 is rotatably connected to the second opening and closing end 312 of the opening and closing part 31; along the circumferential direction of the fixed ring 32, the second rod end 342 of each connecting rod 34 is located between the corresponding first mounting position and the corresponding second mounting position 321; the driving ring 33 can rotate relative to the fixed ring 32 and synchronously drive each connecting rod 34 to rotate around the corresponding first mounting position as the rotation center, and synchronously drive each opening and closing part 31 to rotate around the corresponding second mounting position 321 as the rotation center to open or close the opening 11. It can be understood that the setting positions of the first mounting position and the first rod end 341 coincide. The at least two first mounting positions are evenly spaced along the circumferential direction of the driving ring 33. The at least two second mounting positions 321 are evenly spaced along the circumferential direction of the fixed ring 32.

[0162] As Figure 11 and Figure 12As shown in the figure, for the circumferential direction along the fixed ring 32, when the second rod end 342 of each connecting rod 34 is located between the corresponding first installation position and the corresponding second installation position 321: when the control opening and closing mechanism 3 is switched from the closed state to the open state, the control drive ring 33 rotates relative to the fixed ring 32 in the first clockwise direction, and the drive ring 33 drives the plurality of connecting rods 34 to move synchronously in the first clockwise direction, so that the linear distance between the corresponding first installation position and the second installation position 321 of each connecting rod 34 becomes shorter, thereby driving the plurality of connecting rods 34 to rotate synchronously with their respective corresponding first installation positions as the rotation centers, and the plurality of opening and closing parts 31 rotate synchronously with the corresponding second installation positions 321 as the rotation centers in a direction away from the center of the opening 11 until the opening 11 is completely opened, so as to realize the switching of the opening and closing mechanism 3 from the closed state to the open state; when at least two opening and closing parts 31 of the control opening and closing mechanism 3 are switched from the open state to the closed state, the control drive ring 33 rotates relative to the fixed ring 32 in the second clockwise direction, and the drive ring 33 drives the plurality of connecting rods 34 to move synchronously in the second clockwise direction, so that the linear distance between the corresponding first installation position and the second installation position 321 of each connecting rod 34 becomes longer, thereby driving the plurality of connecting rods 34 to rotate synchronously with their respective corresponding first installation positions as the rotation centers, and the plurality of opening and closing parts 31 rotate synchronously with the corresponding second installation positions 321 as the rotation centers towards the center of the opening 11 until the opening 11 is completely closed, so as to realize the switching of the opening and closing mechanism 3 from the closed state to the open state. Specifically, completely opening the opening 11 means that: along the height direction of the electroplating cavity 1, the orthographic projections of the plurality of opening and closing parts 31 are all distributed on the outer periphery of the opening 11. Completely closing the opening 11 means that: along the height direction of the electroplating cavity 1, the orthographic projections of the plurality of opening and closing parts 31 completely cover the opening 11.

[0163] Preferably, as Figure 11 and Figure 12 shown in the figure, for the circumferential direction along the fixed ring 32, when the second rod end 342 of each connecting rod 34 is located between the corresponding first installation position and the corresponding second installation position 321, the connecting rod 34 is arc-shaped, and the radially outer peripheral wall of the fixed ring 32 is recessed with avoidance limit holes. When the opening and closing mechanism 3 is in the closed state, each avoidance limit hole is located between the first rod end 341 and the second rod end 342 of the corresponding connecting rod 34 along the circumferential direction of the fixed ring 32, and at least a part of the radially outer side wall of the connecting rod 34 is attached to the inner wall of the avoidance limit hole. With such a setting, interference between the connecting rod 34 and the fixed ring 32 can be avoided; secondly, the limit position of the rotation of the opening and closing part 31 with the second installation position 321 as the rotation center towards the center of the opening 11 can be limited, so as to avoid excessive rotation towards the center of the opening 11 and damage or even damage the opening and closing part 31; thirdly, compared with setting the connecting rod 34 as a straight rod or a rod of other shapes, the exposed amount of the connecting rod 34 can be reduced, and the aesthetics of the opening and closing mechanism 3 can be improved. As an alternative, the connecting rod 34 is linear or the like.

[0164] It can be understood that the linear distance between the first rod end 341 and the second rod end 342 of the connecting rod 34 directly determines the caliber size of the communication port formed when the opening and closing mechanism 3 is in the open state.

[0165] Furthermore, as Figure 11 and Figure 12 shown, by way of example, the avoidance limit hole is a through hole penetrating the radial outer peripheral wall and the radial inner peripheral wall of the fixing ring 32. In other embodiments, the thickness of the fixing ring 32 in the radial direction can also be adjusted so that the avoidance limit hole is a blind hole that does not penetrate the radial inner peripheral wall of the fixing ring 32. It can be understood that in this case, the thickness of the fixing ring 32 in the radial direction is relatively thick.

[0166] In this embodiment, as Figures 6 to 13 shown, it is exemplary to set the opening and closing part 31 to include a first opening and closing end 311, a second opening and closing end 312, and a third opening and closing end 313. The first opening and closing end 311, the second opening and closing end 312, and the third opening and closing end 313 are sequentially and spaced apart along the circumferential direction of the opening and closing part 31. The opening and closing part 31 is generally fan-shaped. The outer peripheral surface connecting the first opening and closing end 311 and the third opening and closing end 313 is the first arc surface, and the outer peripheral surface connecting the second opening and closing end 312 and the third opening and closing end 313 is the second arc surface; when the opening and closing mechanism 3 is in the closed state, in any two adjacent opening and closing parts 31, the first arc surface of one fits with the second arc surface of the other.

[0167] In this embodiment, as Figures 6 to 13 shown, the number of the opening and closing parts 31 and the connecting rods 34 is five each, and the five opening and closing parts 31 and the five connecting rods 34 are arranged in one-to-one correspondence. When the opening and closing mechanism 3 is in the closed state, the third opening and closing ends 313 of the five opening and closing parts 31 are in contact with each other at the center of the fixing ring 32.

[0168] In this embodiment, as Figures 2 to 5 shown, it is preferred that the opening and closing mechanism 3 is arranged directly above the electroplating cavity 1. Such an arrangement enables the opening and closing mechanism 3 to be connected to the opening 11 of the electroplating cavity 1 or to be located at a certain fixed position above the opening 11 of the electroplating cavity 1, and minimizes the volume and the occupied space of the opening and closing mechanism 3. When cleaning the cleaning fixture assembly 2 and the wafers carried by the fixture assembly 2, it can effectively prevent the mixed liquid of the electroplating solution and the cleaning solution formed by cleaning from falling into the electroplating cavity 1 and affecting the electroplating solution in the electroplating cavity 1, and minimizes the volume of the electroplating device with good aesthetics.

[0169] As an alternative solution, the opening and closing mechanism 3 may also be provided with an opening and closing part (not shown in the figure). An opening and closing part can selectively open the opening 11 to make the opening and closing mechanism 3 in an open state, and can selectively close the opening 11 to make the opening and closing mechanism 3 in a closed state. Specifically, the opening and closing mechanism 3 further includes a first linear movement driving member such as a linear motor or an electric push rod. The opening and closing part is connected to the output end of the first linear movement driving member. The first linear movement driving member drives an opening and closing part to move along a first fixed straight line, so as to drive an opening and closing part to open or close the opening 11 of the electroplating cavity 1. Alternatively, the opening and closing mechanism 3 further includes a first rotation driving member such as a rotary motor. The opening and closing part is connected to the output end of the first rotation driving member. The first rotation driving member can drive an opening and closing part to rotate around a first fixed axis to open or close the opening 11 of the electroplating cavity 1. It can be understood that when the opening and closing mechanism 3 is in a closed state, the orthographic projection of an opening and closing part along the height direction of the electroplating cavity 1 completely covers the opening 11.

[0170] As another alternative solution, when the opening and closing mechanism 3 is provided with two opening and closing parts (not shown in the figure), the opening and closing mechanism 3 further includes two second linear movement driving members. The two opening and closing parts and the two second linear movement driving members are arranged in one-to-one correspondence. The opening and closing part is connected to the output end of the second linear movement driving member. The two second linear movement driving members can drive the corresponding opening and closing parts to approach or move away from each other along a second fixed straight line, so that the two opening and closing parts can selectively open or close the opening 11 of the electroplating cavity 1; the second linear movement driving member is a linear motor or two electric push rods, etc. Alternatively, the opening and closing mechanism 3 further includes two second rotation driving members. The two opening and closing parts are correspondingly connected to the output ends of the two second rotation driving members. Each second rotation driving member can drive the corresponding opening and closing part to rotate around the corresponding second fixed axis to open or close the opening 11 of the electroplating cavity 1; the second rotation driving member is a rotary motor, etc. It can be understood that when the opening and closing mechanism 3 is in a closed state, the orthographic projections of the two opening and closing parts along the height direction of the electroplating cavity 1 completely cover the opening 11.

[0171] Among them, as Figures 2 to 5 shown, the electroplating device further includes a waste liquid collecting tank body 4. The electroplating cavity 1 is arranged in the waste liquid collecting tank body 4, and the fixing ring 32 is fixedly arranged on the electroplating cavity 1 and / or the waste liquid collecting tank body 4. In this embodiment, by way of example, the fixing ring 32 is fixedly arranged on the inner wall of the waste liquid collecting tank body 4 and is located directly above the opening 11 of the electroplating cavity 1 along the height direction of the electroplating cavity 1. In other embodiments, the fixing ring 32 may also be fixed to the electroplating cavity 1. In other embodiments, the fixing ring 32 may also be fixed to both the electroplating cavity 1 and the waste liquid collecting tank body 4.

[0172] Among them, the electroplating device further includes a cleaning structure arranged in the waste liquid collecting tank body 4. The cleaning structure is located above the opening and closing mechanism 3, and the cleaning structure can clean the fixture assembly 2 and the wafer.

[0173] In this embodiment, the cleaning structure uses water as the cleaning liquid to clean the fixture assembly 2 and the wafer. The liquid collected in the waste liquid collection tank body 4 can be reused after concentration adjustment, so as to further reduce the electroplating cost. Other types of cleaning liquids can also be selected according to actual working conditions.

[0174] In this embodiment, the cleaning structure sprays to clean the fixture assembly 2 and the wafer. Among them, the specific structure of the cleaning structure belongs to the prior art, so it will not be elaborated here.

[0175] Among them, the electroplating device further includes a lifting drive mechanism and a rotating mechanism (not shown in the figure). The rotating mechanism is arranged at the output end of the lifting drive mechanism, and the output end of the rotating mechanism is fixedly connected to the connecting part of the fixture assembly 2; the lifting drive mechanism can drive the rotating mechanism and the fixture assembly 2 to lift synchronously along the height direction of the electroplating cavity 1, and the rotating mechanism can drive the fixture assembly 2 to rotate around its own central axis. As an alternative solution, the electroplating device further includes a robotic arm, and the output end of the robotic arm is fixedly connected to the connecting part of the fixture assembly 2. The robotic arm can at least drive the fixture assembly 2 to lift along the height direction of the electroplating cavity 1 and drive the fixture assembly 2 to rotate around its own central axis. Among them, the specific structures of the lifting drive mechanism, the rotating mechanism and the robotic arm all belong to the prior art, so they will not be elaborated here. The ways of fixed connection include but are not limited to screw connection, bolt connection or welding.

[0176] After the wafer completes the electroplating process in the electroplating solution in the electroplating cavity 1, control the lifting drive mechanism to drive the fixture assembly 2 and the wafer carried by the fixture assembly 2 to move above the electroplating solution in the electroplating cavity 1 to a preset plating solution recovery position, and control the rotating mechanism to drive the fixture assembly 2 to rotate around its own central axis, driving the wafer carried by the fixture assembly 2 to rotate synchronously. By rotating, the electroplating solution attached to the fixture assembly 2 and the wafer is thrown off into the electroplating solution in the electroplating cavity 1, so as to realize that a part of the electroplating solution attached to the fixture assembly 2 and the wafer can be recovered into the electroplating cavity 1 to save the electroplating cost.

[0177] After the fixture assembly 2 and the wafer carried by the fixture assembly 2 are moved above the opening and closing mechanism 3 by the lifting drive mechanism, control the cleaning structure to spray the cleaning liquid on the fixture assembly 2 and the wafer carried by the fixture assembly 2 to clean the residual electroplating solution on the fixture assembly 2 and the wafer carried by the fixture assembly 2. The mixed liquid of the electroplating solution and the cleaning liquid formed by the cleaning falls into the waste liquid collection tank body 4 and is collected.

[0178] After cleaning the fixture assembly 2 and the wafer carried by the fixture assembly 2, control the rotating mechanism to drive the fixture assembly 2 to rotate around its own central axis, driving the fixture assembly 2 and the wafer carried by the fixture assembly 2 to rotate synchronously, and throw off the residual liquid on the fixture assembly 2 and the wafer carried by the fixture assembly 2 to dry the fixture assembly 2 and the wafer.

[0179] After taking the dried wafer from the fixture assembly 2, control the opening and closing mechanism 3 to remain in a closed state, then control the lifting drive mechanism to move the fixture assembly 2 to a preset cleaning position, and then control the cleaning structure to spray cleaning liquid on the fixture assembly 2 to clean the outer periphery and the inside of the fixture assembly 2. The liquid formed by the cleaning falls into the waste liquid collection tank body 4 and is collected.

[0180] After cleaning the fixture assembly 2, control the rotating mechanism to drive the fixture assembly 2 to rotate around its own central axis to throw off the residual liquid on the fixture assembly 2 to dry the fixture assembly 2, so as to avoid contaminating the next wafer when the fixture assembly 2 picks up the next wafer.

[0181] As an alternative solution, a blowing structure is provided to blow dry the liquid on the fixture assembly 2 and the liquid on the wafer carried by the fixture assembly 2. Among them, the specific structure of the blowing structure belongs to the prior art, so it will not be elaborated here.

[0182] Preferably, as Figure 3 shown, when the opening and closing mechanism 3 is in a closed state, a plane is formed on the bottom surfaces of the plurality of opening and closing parts 31 close to the bottom surface of the electroplating cavity 1. Such a setting maximizes the area on the bottom surface of each opening and closing part 31 that can support the fixed ring 32, so that the opening and closing stability of each opening and closing part 31 is good and it is convenient to process the opening and closing part 31. Further preferably, at least one of the bottom surface of the opening and closing part 31 and the top surface of the fixed ring 32 is provided with an elastic sealing layer, and the elastic sealing layer is used to seal the gap between the bottom surface of the opening and closing part 31 and the top surface of the fixed ring 32, which can further prevent the cleaning of the fixture assembly 2 and the wafer from affecting the concentration of the electroplating solution in the electroplating cavity 1, and can further prevent external debris and the like from entering the electroplating cavity 1 and affecting the quality of the electroplating solution.

[0183] Preferably, as Figure 3 and Figure 6 shown, when the opening and closing mechanism 3 is in a closed state, a conical guiding surface is formed on the top surfaces of the plurality of opening and closing parts 31 away from the electroplating cavity 1, and the large end of the conical guiding surface is closer to the opening 11 relative to the small end of the conical guiding surface. That is, when the plurality of opening and closing parts 31 approach each other and are spliced into a whole, a conical guiding surface is formed on the top surfaces of the plurality of opening and closing parts 31. Thus, after the opening and closing mechanism 3 is in a closed state, when the fixture assembly 2 and the wafer carried by the fixture assembly 2 are cleaned, and when the fixture assembly 2 is cleaned alone, the liquid formed by the cleaning can quickly and efficiently flow into the waste liquid collection tank body 4 under the guiding action of the conical guiding surface.

[0184] Further preferably, as Figure 3As shown, in this embodiment, when the opening and closing mechanism 3 is in a closed state, a plane is formed on the bottom surfaces of the plurality of opening and closing portions 31 close to the electroplating cavity 1; and when the opening and closing mechanism 3 is in a closed state, a conical diversion surface is formed on the top surfaces of the plurality of opening and closing portions 31 away from the electroplating cavity 1, and the large end of the conical diversion surface is closer to the opening 11 than the small end of the conical diversion surface.

[0185] As Figure 3 and Figure 6 shown, when the plurality of opening and closing portions 31 form a conical diversion surface, along the height direction of the electroplating cavity 1, the center of the conical diversion surface is higher and the periphery is lower, so that the cleaning liquid can flow into the waste liquid collection tank body 4 more quickly and smoothly along the flow direction from the center of the conical diversion surface to the periphery of the conical diversion surface, achieving the purpose of more conveniently and quickly collecting the liquid formed by the cleaning fixture assembly 2 and the wafer.

[0186] In this embodiment, as Figure 3 shown, when the opening and closing mechanism 3 is in a closed state, a plane is formed on the bottom surfaces of the plurality of opening and closing portions 31 close to the electroplating cavity 1; as Figure 13 shown, from the third opening and closing end 313 to the first opening and closing end 311 of the opening and closing portion 31, the thickness of the opening and closing portion 31 gradually decreases, and from the third opening and closing end 313 to the second opening and closing end 312 of the opening and closing portion 31, the thickness of the opening and closing portion 31 gradually decreases. So that when the opening and closing mechanism 3 is in a closed state, a plane is formed on the bottom surfaces of the plurality of opening and closing portions 31 close to the electroplating cavity 1, and a conical diversion surface is formed on the top surfaces of the plurality of opening and closing portions 31 away from the electroplating cavity 1.

[0187] Preferably, when the opening and closing mechanism 3 is in a closed state, at least one of the end faces in contact with each other on any two adjacent opening and closing portions 31 is provided with an elastic sealing layer, and the elastic sealing layer is used to seal the gap between any two adjacent opening and closing portions 31 when the opening and closing mechanism 3 is in a closed state, which can further improve the reliability of sealing the opening 11 of the electroplating cavity 1. Specifically, in any two adjacent opening and closing portions 31, at least one of the first arc surface of one and the second arc surface of the other is provided with an elastic sealing layer.

[0188] Preferably, as Figures 2 to 4 shown, the electroplating device further includes a diversion plate 5, and the diversion plate 5 is fixedly arranged on the electroplating cavity 1 and / or the waste liquid collection tank body 4 and is located in the waste liquid collection tank body 4; at least part of the diversion plate 5 is located outside the opening and closing mechanism 3, and is located below the opening and closing mechanism 3 along the height direction of the electroplating cavity 1; the liquid falling on the diversion plate 5 outside the opening and closing mechanism 3 can be diverted by the diversion plate 5 into the waste liquid collection tank body 4. After the opening and closing mechanism 3 is in a closed state, the conical diversion surface and the diversion plate 5 are used in cooperation, which can further improve the effect of guiding the liquid formed by cleaning to quickly and efficiently flow into the waste liquid collection tank body 4. Among them, the diversion plate 5 outside the opening and closing mechanism 3 refers to: the part of the diversion plate 5 located outside the opening and closing mechanism 3.

[0189] Based on the above uses of the flow guiding plate 5, correspondingly, during the cleaning of the fixture assembly 2 and the wafer and to prevent the liquid formed during cleaning from falling into the electroplating cavity 1, the installation positions of the fixture assembly 2 and the wafer should be higher than the installation position of the flow guiding plate 5. That is, along the height direction of the electroplating cavity 1, the preset cleaning position is higher than the installation position of the flow guiding plate 5, so that the liquid falling on the upper surface of the flow guiding plate 5 can be quickly and smoothly guided to the waste liquid collection tank body 4 for recycling.

[0190] In this embodiment, as Figures 2 to 4 shown, it is preferred that the flow guiding plate 5 is an annular plate. The radially outer peripheral wall of the flow guiding plate 5 is fixedly connected to the inner peripheral wall of the waste liquid collection tank body 4 along the circumferential direction. The fixing ring 32 is fixedly arranged along the circumferential direction on the flow guiding plate 5. The inner diameter of the flow guiding plate 5 is smaller than the diameter of the opening 11. The flow guiding plate 5 and the opening and closing mechanism 3 divide the waste liquid collection tank body 4 into an upper cavity 41 and a lower cavity 42. The electroplating cavity 1 is located in the lower cavity 42, and the flow guiding plate 5 is provided with a plurality of communication holes 51 that communicate the upper cavity 41 and the lower cavity 42 at intervals along the circumferential direction. With such a setting, the fixing ring 32 is fixedly arranged on the waste liquid collection tank body 4, and the structure is simple, convenient for assembly, and can effectively reduce the production cost. Further, as Figure 2 and Figure 4 shown, it is preferred that the plurality of communication holes 51 are arranged close to the radially outer peripheral wall of the flow guiding plate 5.

[0191] Correspondingly, during the recovery of the electroplating solution adhering to the fixture assembly 2 and the wafer so that the adhering electroplating solution falls into the electroplating solution in the electroplating cavity 1, the installation positions of the fixture assembly 2 and the wafer should be lower than the installation position of the flow guiding plate 5. That is, along the height direction of the electroplating cavity 1, the preset electroplating solution recovery position is lower than the installation position of the flow guiding plate 5. During the process of the fixture assembly 2 and the wafer rotating synchronously around the central axis of the fixture assembly 2 to throw off the electroplating solution, a part of the flow guiding plate 5 located directly above the opening 11 can block the thrown-off electroplating solution from splashing outside the electroplating cavity 1, so that the thrown-off electroplating solution can all fall into the electroplating cavity 1, thereby enabling better recovery of the electroplating solution.

[0192] It can be understood that in other embodiments, a connecting piece can also be used alone to fix the fixing ring 32 to the electroplating cavity 1 and / or the waste liquid collection tank body 4, and a connecting piece can be used alone to fix the flow guiding plate 5 to the electroplating cavity 1 and / or the waste liquid collection tank body 4.

[0193] Optionally, an electric heating structure is provided on the surface of the opening and closing part 31; and / or, an electric heating structure is formed inside the opening and closing part 31. The electric heating structure is used to heat and evaporate the liquid on the opening and closing part 31. With this arrangement, it is avoided that the liquid remaining on the opening and closing part 31 falls into the electroplating cavity 1 during the process of the opening and closing mechanism 3 switching from the closed state to the open state, thereby affecting the concentration of the electroplating solution in the electroplating cavity 1, and thus the effect and quality of electroplating the wafer with the electroplating solution in the electroplating cavity 1 can be further ensured. Specifically, the electric heating structure is an electric heating wire or the like.

[0194] Optionally, in this embodiment, as Figure 3 shown, the electroplating cavity 1 is suspended in the lower cavity 42 of the waste liquid collection tank body 4. The specific structure of the electroplating cavity 1 being suspended is not limited to using a support structure such as a support frame. As an alternative solution, the electroplating cavity 1 is placed or fixed on the bottom wall of the lower cavity 42 of the waste liquid collection tank body 4.

[0195] Specifically, a discharge port is provided at the bottom of the waste liquid collection tank body 4, and a switching valve capable of selectively opening and closing the lower cavity 42 and the outside is provided at the discharge port. So that the liquid collected in the waste liquid collection tank body 4 can be discharged to the outside through the discharge port.

[0196] This embodiment provides a specific structural implementation solution for implementing the above method embodiment. It can be understood that this structural implementation solution is only the preferred solution in the above method embodiment. Other similar solutions that close the opening 11 during cleaning to prevent the electroplating solution in the electroplating cavity 1 from being diluted are within the implementation scope of the above method embodiment.

[0197] Embodiment III

[0198] The present invention also provides a storage medium storing a computer program, and the computer program can be executed by an electroplating device to implement the method for preventing electroplating solution dilution described in Embodiment I.

[0199] Obviously, the above embodiments of the present invention are only examples for clearly explaining the present invention, and are not limitations on the implementation manners of the present invention. For those of ordinary skill in the art, various obvious changes, re-adjustments, and substitutions can be made without departing from the protection scope of the present invention. It is not necessary and impossible to enumerate all the implementation manners here. Any modifications, equivalent substitutions, and improvements made within the spirit and principle of the present invention shall be included in the protection scope of the claims of the present invention.

Claims

1. A method for preventing the dilution of electroplating solution, characterized in that, The method for preventing dilution of the electroplating solution is applied to an electroplating device, which includes an electroplating chamber (1) and a fixture assembly (2). The electroplating chamber (1) can hold the electroplating solution, and the fixture assembly (2) can carry a wafer and immerse it into the electroplating solution in the electroplating chamber (1) through an opening (11) above the electroplating chamber (1) to perform an electroplating process; The method for preventing dilution of the electroplating solution includes: After the fixture assembly (2) carries the wafer to complete the electroplating process in the electroplating solution in the electroplating chamber (1), control the fixture assembly (2) to carry the wafer up to a preset cleaning position, and the preset cleaning position is higher than the position where the opening (11) is located; Close the opening (11) of the electroplating chamber (1) to prevent the liquid formed during cleaning of the fixture assembly (2) and the wafer carried by the fixture assembly (2) from falling into the electroplating solution in the electroplating chamber (1); Clean the fixture assembly (2) and the wafer carried by the fixture assembly (2) to remove the electroplating solution attached to the fixture assembly (2) and the wafer carried by the fixture assembly (2).

2. The method for preventing dilution of electroplating solution according to claim 1, wherein Before controlling the fixture assembly (2) to carry the wafer up to a preset cleaning position after controlling the fixture assembly (2) to carry the wafer to perform the electroplating process in the electroplating solution in the electroplating chamber (1), the method for preventing dilution of the electroplating solution further includes: Control the fixture assembly (2) to carry the wafer up to a preset electroplating solution recovery position; the preset electroplating solution recovery position is located between the opening (11) and the surface of the electroplating solution in the electroplating chamber (1); Clean the electroplating solution attached to the fixture assembly (2) and the wafer carried by the fixture assembly (2) so that the cleaned electroplating solution falls into the electroplating solution in the electroplating chamber (1).

3. The method for preventing dilution of electroplating solution according to claim 2, wherein The specific steps for cleaning the electroplating solution attached to the fixture assembly (2) and the wafer carried by the fixture assembly (2) include: Control the fixture assembly (2) to rotate around its own central axis to drive the carried wafer to rotate synchronously, and perform liquid throwing cleaning on the electroplating solution attached to the fixture assembly (2) and the wafer carried by the fixture assembly (2); and / or, blow air to the fixture assembly (2) and the wafer carried by the fixture assembly (2) to perform air blowing cleaning on the electroplating solution attached to the fixture assembly (2) and the wafer carried by the fixture assembly (2).

4. The method for preventing dilution of electroplating solution according to claim 1, wherein After cleaning the fixture assembly (2) and the wafer carried by the fixture assembly (2) to remove the electroplating solution attached to the fixture assembly (2) and the wafer carried by the fixture assembly (2), the following steps are further included: Dry the fixture assembly (2) and the wafer carried by the fixture assembly (2). The drying methods include: controlling the fixture assembly (2) to rotate around its own central axis to drive the carried wafer to rotate synchronously, and spin-drying the cleaning liquid attached to the fixture assembly (2) and the wafer carried by the fixture assembly (2); and / or, blowing air onto the fixture assembly (2) and the wafer carried by the fixture assembly (2) to blow-dry the cleaning liquid attached to the fixture assembly (2) and the wafer carried by the fixture assembly (2).

5. The method for preventing dilution of electroplating solution according to claim 1, wherein After cleaning the fixture assembly (2) and the wafer carried by the fixture assembly (2) to remove the electroplating solution attached to the fixture assembly (2) and the wafer carried by the fixture assembly (2), the following steps are further included: Controlling the fixture assembly (2) to carry the wafer up to a preset wafer removal position, where the preset wafer removal position is higher than the preset cleaning position; Controlling the fixture assembly (2) to open and removing the wafer from the fixture assembly (2); Controlling the fixture assembly (2) to close; Controlling the fixture assembly (2) to descend to the preset cleaning position; When the opening (11) is closed, cleaning the closed fixture assembly (2); When the opening (11) is closed, drying the closed fixture assembly (2).

6. The method for preventing dilution of electroplating solution according to claim 5, wherein After drying the closed fixture assembly (2), the following steps are further included: Controlling the fixture assembly (2) to open; When the opening (11) is closed, cleaning the interior of the opened fixture assembly (2); When the opening (11) is closed, drying the opened fixture assembly (2).

7. The method for preventing dilution of electroplating solution according to any one of claims 1-6, characterized in that, The electroplating device further includes an opening / closing mechanism (3), and the opening / closing mechanism (3) is arranged at the opening (11) of the electroplating cavity (1); the opening / closing mechanism (3) has an open state and a closed state; when the opening / closing mechanism (3) is in the open state, the fixture assembly (2) can move up and down through the opening (11); when the opening / closing mechanism (3) is in the closed state, the opening / closing mechanism (3) closes the opening (11); The specific steps for closing the opening (11) of the electroplating cavity (1) include: Controlling the opening / closing mechanism (3) to be in the closed state, and closing the opening (11) of the electroplating cavity (1) through the opening / closing mechanism (3).

8. The method for preventing dilution of electroplating solution according to claim 7, wherein The opening / closing mechanism (3) includes an opening / closing part (31), and the opening / closing part (31) can selectively open the opening (11) to make the opening / closing mechanism (3) in the open state, or selectively close the opening (11) to make the opening / closing mechanism (3) in the closed state; The specific steps for controlling the opening / closing mechanism (3) to be in the closed state include: Controlling the opening / closing part (31) to close the opening (11) to make the opening / closing mechanism (3) in the closed state.

9. The method for preventing dilution of electroplating solution according to claim 8, characterized in that, The opening and closing mechanism (3) further includes a fixed ring (32) and a driving ring (33). The fixed ring (32) is fixed relative to the electroplating cavity (1). The driving ring (33) is rotatably sleeved on the outer periphery of the fixed ring (32), and the driving ring (33) and the fixed ring (32) are coaxially arranged. The driving ring (33) can rotate relative to the fixed ring (32) to drive the opening and closing part (31) to open or close the opening (11). The specific steps for controlling the opening and closing part (31) to close the opening (11) include: Controlling the driving ring (33) to rotate relative to the fixed ring (32) to drive the opening and closing part (31) to close the opening (11).

10. The method for preventing dilution of electroplating solution according to claim 9, wherein The opening and closing mechanism (3) further includes a connecting rod (34). Along the axial direction of the driving ring (33), the connecting rod (34) is located between the opening and closing part (31) and the driving ring (33). The upper end surface of the driving ring (33) in the axial direction is provided with a first mounting position. The first rod end (341) of the connecting rod (34) is rotatably connected to the first mounting position. The upper end surface of the fixed ring (32) in the axial direction is provided with a second mounting position (321). The first opening and closing end (311) of the opening and closing part (31) is rotatably connected to the second mounting position (321). The second rod end (342) of the connecting rod (34) is rotatably connected to the second opening and closing end (312) of the opening and closing part (31). Along the circumferential direction of the fixed ring (32), the first mounting position is located between the second mounting position (321) and the second rod end (342) of the connecting rod (34), or the second rod end (342) of the connecting rod (34) is located between the first mounting position and the second mounting position (321). The driving ring (33) can rotate relative to the fixed ring (32) and synchronously drive the connecting rod (34) to rotate around the first mounting position, and synchronously drive the opening and closing part (31) to rotate around the second mounting position (321) to open or close the opening (11). The specific steps for controlling the driving ring (33) to rotate relative to the fixed ring (32) to drive the opening and closing part (31) to close the opening (11) include: Controlling the driving ring (33) to rotate relative to the fixed ring (32) and synchronously drive the connecting rod (34) to rotate around the first mounting position, and synchronously drive the opening and closing part (31) to rotate around the second mounting position (321), so that the opening and closing part (31) closes the opening (11).

11. The method for preventing dilution of electroplating solution according to claim 8, wherein An electric heating structure is arranged on the surface of the opening and closing part (31), and / or an electric heating structure is formed inside the opening and closing part (31). The electric heating structure is used to heat and evaporate the liquid on the opening and closing part (31). The method for preventing dilution of the electroplating solution further includes: Before switching the opening and closing mechanism (3) from the closed state to the open state, controlling the electric heating structure to heat and evaporate the liquid on the upper surface of the opening and closing part (31).

12. An electroplating device, characterized in that, It includes an electroplating cavity (1) and a fixture assembly (2). The electroplating cavity (1) can hold electroplating solution. The fixture assembly (2) can carry a wafer and immerse it into the electroplating solution in the electroplating cavity (1) through an opening (11) above the electroplating cavity (1) to perform an electroplating process. The electroplating device can execute the method for preventing dilution of electroplating solution according to any one of claims 1-11 based on the electroplating cavity (1) and the fixture assembly (2).

13. A storage medium, characterized in that, It stores a computer program, and the computer program can be executed by the electroplating device to implement the method for preventing dilution of electroplating solution according to any one of claims 1-11.

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