Test platform of acquisition and transmission system

Abstract

The invention discloses a test platform of an acquisition and transmission system, which relates to the field of signal acquisition and transmission and comprises a plurality of PCBs (printed circuit boards), a plurality of acquisition node modules are arranged on each PCB in series, and a connector is arranged at each of two ends of each PCB; the network interfaces are arranged on the two sides of each PCB, the adjacent PCBs are electrically connected and communicated through the network interfaces, and the acquisition node modules close to the network interfaces are electrically connected and communicated with the corresponding network interfaces; the power supply module is mounted on the PCB, inputs high voltage through a connector, converts the high voltage into low voltage and then supplies power to the acquisition node modules; and the dial switch is used for adjusting the power supply mode of the acquisition node module according to the type of an instrument power supply externally connected with the connector. According to the invention, the state of the acquisition and transmission system on equipment is simulated by adopting a mode of mutual connection of the printed boards, so that the system has expandability and can be suitable for different scales and different development scenes; and meanwhile, the requirements of modularization and flexible replacement of each functional module are met.

Description

Technical Field

[0001] The present invention relates to the field of signal acquisition and transmission, and particularly to a test platform for an acquisition and transmission system. Background Art

[0002] Acquisition and transmission projects are often large in scale, with a wide variety of electronic modules in terms of type and number, involving multiple disciplines such as analog circuits, digital circuits, network technologies, and communication technologies, making testing relatively complex. The application environment of the acquisition and transmission system is special, and the test environment formed needs to have a high degree of similarity to the actual application to detect problems as early as possible. Moreover, the test environment needs to be reliable and stable, and repeated verification and testing are required at the initial stage of the project. In the past, acquisition and transmission system projects mostly adopted the method of fixing acquisition node modules on insulating pads to achieve the test effect. In the existing technical solutions, the wiring is complicated, the occupied space is large, it is inconvenient to carry out field tests, and the true working state of the acquisition and transmission system under full scale cannot be simulated. Summary of the Invention

[0003] The object of the present invention is to overcome the deficiencies existing in the prior art, and to provide a test platform for an acquisition and transmission system, which simulates the state of the acquisition and transmission system on the device by means of printed circuit boards (PCBs) connected to each other. It not only has scalability and can be applicable to different scales and different development scenarios, but also has modularity, and each functional module can be flexibly replaced as needed.

[0004] The object of the present invention is achieved by the following technical solutions: This test platform for an acquisition and transmission system includes:

[0005] A plurality of PCBs, on each of which a plurality of acquisition node modules are connected in series, and a connector is provided at each end of each PCB. Adjacent PCBs are connected through the connectors, and the connectors are also used to externally connect a low-voltage instrument power supply or a high-voltage instrument power supply. When externally connecting the low-voltage instrument power supply, the connector directly supplies power to each acquisition node module;

[0006] Network interfaces, which are provided on both sides of each PCB. Adjacent PCBs are electrically connected and communicate with each other through the network interfaces. The acquisition node module close to the network interface is electrically connected and communicates with the corresponding network interface, and adjacent acquisition node modules are electrically connected and communicate with each other in sequence;

[0007] A power supply module, which is installed on the PCB, inputs high voltage through the connector, converts it into low voltage and then supplies power to each acquisition node module; and

[0008] A DIP switch, which is equipped on the power supply module, and the DIP switch is used to adjust the power supply mode for the acquisition node module according to the type of the instrument power supply externally connected by the connector.

[0009] As a further technical solution, the power supply module includes a digital voltage power supply module, which is installed on the PCB board in a jacked manner. The number of digital voltage power supply modules is equal to that of the acquisition node modules. Each digital voltage power supply module inputs high voltage through a connector, converts it into low voltage, and then provides digital low voltage to the corresponding acquisition node module.

[0010] As a further technical solution, the power supply module includes an analog voltage power supply module, which is installed on the PCB board in a jacked manner. The analog voltage power supply module inputs high voltage through a connector, converts it into low voltage, and then provides analog low voltage to the corresponding acquisition node module.

[0011] As a further technical solution, the PCB board is provided with reserved interfaces, which include signal input interfaces and sensor interfaces.

[0012] The beneficial effects of the present invention are as follows:

[0013] 1. The four acquisition node modules on each PCB board are taken as a unit, and multiple units can be docked through connectors, so as to achieve scale expansion. The connection is efficient and convenient, with strong scalability, a compact overall structure, and a small occupied space;

[0014] 2. The test platform provides two power supply methods, namely low-voltage instrument power input and high-voltage instrument power input. The dip switches are used to isolate the two power-on methods, which plays the role of ensuring the safety of the power supply module and the electrical appliances;

[0015] 3. The platform reserves test interfaces for signal input and sensors, meeting the test requirements of multiple indicators such as the self-noise, phase, and sensors of the transmission system;

[0016] 4. The power supply modules are all installed in a jacked manner, meeting the requirements of modularization, replaceability, and reusability. Description of the Drawings

[0017] Figure 1 It is a schematic structural diagram of the present invention.

[0018] Figure 2 It is a schematic circuit connection structure diagram of the power supply module and the dip switch in the present invention.

[0019] Description of the reference numerals: PCB board 1, digital voltage power supply module 2, acquisition node module 3, analog voltage power supply module 4, network interface 5, connector 6, reserved interface 7, dip switch 8. Detailed Embodiments

[0020] The following will introduce the present invention in detail with reference to the drawings:

[0021] Embodiment: As shown in the attached Figure 1 、 2As shown in the figure, the test platform of this acquisition and transmission system includes a PCB board 1, a digital voltage power supply module 2, an acquisition node module 3, an analog voltage power supply module 4, a network interface 5, a connector 6, a reserved interface 7, and a DIP switch 8.

[0022] Reference appendix Figure 1 , in the figure, the outer square represents the PCB board 1, and the middle dashed box is a break symbol indicating that the number of PCB boards 1 is not limited to one, and there can be several PCB boards 1 connected in sequence. Four acquisition node modules 3 are serially arranged on each PCB board 1 (in this embodiment, the number of acquisition node modules 3 is four, and it can also be other numbers), and the acquisition node modules 3 are used for acquisition. A connector 6 is provided at both the upper and lower ends of each PCB board 1, and adjacent PCB boards 1 are connected through the connector 6. At the same time, for the uppermost PCB board 1, the connector 6 is also used to externally connect a low-voltage instrument power supply or a high-voltage instrument power supply. When externally connecting a low-voltage instrument power supply, the connector 6 can directly supply power to each acquisition node module 3, and the power supply lines are as Figure 1 shown by the blue and red lines in the figure, providing analog low voltage and / or digital low voltage.

[0023] The network interface 5 is provided on both the left and right sides of each PCB board 1, and adjacent PCB boards 1 are electrically connected and communicated through the network interface 5 (i.e., Figure 1 shown by the curved arrow in the figure). At the same time, the acquisition node module 3 close to the network interface 5 is electrically connected and communicated with the corresponding network interface 5, and adjacent acquisition node modules 3 are electrically connected and communicated in sequence.

[0024] The digital voltage power supply module 2 and the analog voltage power supply module 4 form a power supply module, and both are installed on the PCB board 1 in a socket type, meeting the requirements of modularity, replaceability, and reusability. Among them, the number of digital voltage power supply modules 2 is equal to that of the acquisition node modules 3, both being four. Each digital voltage power supply module 2 inputs high voltage through the connector 6, converts it into low voltage, and then provides digital low voltage to the corresponding acquisition node module 3, simulating the effect of the acquisition and transmission system on the device. The analog voltage power supply module 4 (with a quantity of one) also inputs high voltage through the connector 6, converts it into low voltage, and then provides analog low voltage to the acquisition node module 3 respectively.

[0025] Furthermore, as Figure 2 shown in the figure, DIP switches 8 are equipped on both power supply modules. The DIP switches 8 can adjust the power supply mode for the acquisition node modules 3 according to the type of the instrument power supply externally connected to the connector 6, and isolate the two power-on methods by using the DIP switches 8, achieving the effect of ensuring the safety of the power supply module and the electrical equipment.

[0026] Preferably, a reserved interface 7 is provided on the PCB board. The reserved interface 7 includes a signal input interface and a sensor interface, meeting the test requirements for multiple indicators such as the self-noise, phase, and sensors of the transmission system.

[0027] The working process of the present invention:

[0028] In the present invention, each unit (a single PCB board 1) can install 4 acquisition node modules 3. Multiple units (i.e., between multiple PCB boards 1) can be docked through a connector 6, thereby realizing the expansion of scale. As Figure 1 shown. There are two power-on methods for the test platform to work properly. One is to directly supply power to the acquisition node module 3 after connecting a low-voltage instrument power supply to the connector 6. The power supply line is as Figure 1 shown by the blue and red lines, providing analog low voltage and / or digital low voltage. The second is to use a 300V instrument power supply (i.e., a high-voltage instrument power supply, as Figure 1 shown by the purple line), convert it into low voltage through a DC-DC power module (a digital voltage power module 2 and an analog voltage power module 4), and then supply power to the acquisition node module 3, thereby simulating the effect of the acquisition and transmission system on the device. Each DC-DC power module is equipped with a DIP switch 8, which mainly isolates the two power-on methods and plays a role in ensuring the safety of the power module and the electrical appliance.

[0029] The test platform of the present invention provides two power supply methods. At the same time, the platform also reserves test interfaces for signal input and sensors, meeting the test requirements for multiple indicators such as the self-noise, phase, and sensors of the transmission system. In addition, the power modules are all installed in a socket manner, meeting the requirements of modularization, replaceability, and reusability. Compared with the existing solutions, this solution has a simple and clear layout, safe and reliable operation, reduces the space and time required for testing, and is particularly applicable to application scenarios with high miniaturization requirements.

[0030] It can be understood that for those skilled in the art, equivalent replacement or change of the technical solutions and inventive concepts of the present invention should fall within the protection scope of the appended claims of the present invention.

Claims

1. A test platform for a collection and transmission system, characterized in that, Including: A number of PCB boards (1), a number of acquisition node modules (3) are serially arranged on each PCB board (1), connectors (6) are arranged at both ends of each PCB board (1), adjacent PCB boards (1) are connected through the connectors (6), and the connectors (6) are also used to externally connect a low-voltage instrument power supply or a high-voltage instrument power supply. When externally connecting the low-voltage instrument power supply, the connectors (6) directly supply power to each acquisition node module (3); Network interfaces (5) are arranged on both sides of each PCB board (1). Adjacent PCB boards (1) are electrically connected and communicate with each other through the network interfaces (5). The acquisition node modules (3) close to the network interfaces (5) are electrically connected and communicate with the corresponding network interfaces (5), and adjacent acquisition node modules (3) are sequentially electrically connected and communicate with each other; A power supply module is installed on the PCB board (1), inputs high voltage through the connector (6), and after converting it into low voltage, supplies power to each acquisition node module (3); And A DIP switch (8) is provided on the power supply module. The DIP switch (8) is used to adjust the power supply mode for the acquisition node modules (3) according to the type of the instrument power supply externally connected by the connector (6).

2. The test platform of the acquisition and transmission system according to claim 1, wherein: The power supply module includes a digital voltage power supply module (2), which is installed on the PCB board (1) in a jack type. The number of digital voltage power supply modules (2) is equal to the number of acquisition node modules (3). Each digital voltage power supply module (2) inputs high voltage through the connector (6), and after converting it into low voltage, provides digital low voltage to the corresponding acquisition node module (3).

3. The test platform of the acquisition and transmission system according to claim 1 or 2, characterized in that: The power supply module includes an analog voltage power supply module (4), which is installed on the PCB board (1) in a jack type. The analog voltage power supply module (4) inputs high voltage through the connector (6), and after converting it into low voltage, provides analog low voltage to the acquisition node modules (3).

4. The test platform of the acquisition and transmission system according to claim 1, characterized in that: A reserved interface (7) is provided on the PCB board. The reserved interface (7) includes a signal input interface and a sensor interface.

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