Wafer carrying device and film pasting device

Abstract

The present application relates to the technical field of wafer gluing, and particularly relates to a wafer carrying and moving device and a film pasting device. The wafer carrying and moving device comprises a flattening assembly arranged on a seat body; a turnover assembly comprising a first support frame, a rotating table, a first driving module and a second driving module; the first support frame is arranged on the seat body; the first driving module is arranged on the seat body and is drivingly connected with the first support frame; the rotating table is arranged on the first support frame; the second driving module is arranged on the first support frame and is drivingly connected with the rotating table; a suction assembly comprising a suction member, a support plate, a third driving module and a fourth driving module; the support plate is arranged on the rotating table, and the suction member is arranged on the rotating table; the third driving module is arranged on the support plate and is drivingly connected with the suction member; the fourth driving module is arranged on the support plate and is drivingly connected with the suction member; and a detection assembly is arranged above the suction member. The wafer carrying and moving device can improve the flatness of the wafer, and can also realize accurate carrying and moving and angle adjustment of the wafer.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of wafer gluing, and in particular to a wafer carrying and moving device and a film pasting device. BACKGROUND

[0002] Since different types of wafers have different angle or position requirements when placed in the film pasting position of the film pasting device, if the wafer has an angle deviation and an inaccurate position, the film pasting device cannot accurately paste the film on the upper surface of the wafer, and therefore a device for carrying and moving the wafer is needed to pre-align the wafer when the wafer is carried and moved.

[0003] In some related technologies, for example, the patent with the publication number CN106486406B discloses an integrated circuit wafer pre-alignment device. The patent discloses the following scheme: a shaft driving device drives a wafer supporting disc to rotate through a shaft, so that the wafer rotates to a specified angle, then a Z-direction electric linear slide table drives a transposition vacuum chuck to move downward to be able to adsorb the wafer, then the Z-direction electric linear slide table drives the transposition vacuum chuck to move upward, and the Y-direction electric linear slide table and the X-direction electric linear slide table transport the wafer that has completed the pre-alignment to a specified position. However, this scheme has some technical problems, for example, the wafer needs to be placed on the wafer supporting disc, and the wafer supporting disc is driven to rotate by the shaft driving device, so that the wafer can complete the pre-alignment, and then the transposition vacuum chuck is driven by the electric linear slide tables to transport the wafer, which makes the whole process more complicated, and the coordinated work of multiple components of the device is needed, which affects the overall wafer carrying efficiency. In addition, if the uneven wafer is pasted with the film, air bubbles are easily formed between the composite film and the wafer, which affects the tightness and uniformity of the film pasting, and the surface of the uneven wafer cannot be fully pasted with the composite film, which causes the insufficient adhesion of the composite film, and the composite film is easily partially detached or raised during subsequent handling and processing, so that the wafer cannot be fully protected.

[0004] After the wafer is ground and before it is cut, the back adhesive film is pasted on the surface of the wafer to improve the strength of the wafer and reduce the occurrence of broken pieces during cutting. In the existing technology, the back adhesive film pasting process is as follows: first, the cover film of the composite film is peeled off, then the bottom film and the back adhesive film of the composite film are sent to the wafer film pasting station, then the back adhesive film is cut into a pasting area and a residual area by a cutting mechanism, then the residual area of the back adhesive film is peeled off by a peeling mechanism, and finally the pasting area is pasted on the wafer. However, this cutting method has a complicated overall structure and low cutting efficiency; at the same time, the process of peeling off the cover film first and then cutting also easily leaves residual glue, which affects the film pressing quality and the cutting effect of the subsequent process. SUMMARY

[0005] In order to overcome the deficiencies of the prior art, the wafer carrying and moving device and the film pasting device are provided.

[0006] The technical scheme adopted by the present application to solve its technical problems is:

[0007] In a first aspect, the wafer carrying and moving device comprises:

[0008] A seat body;

[0009] A flattening assembly arranged on the top surface of the seat body;

[0010] A turnover assembly comprising a first support frame, a rotating table, a first driving module and a second driving module; the first support frame is arranged on the top surface of the seat body; the first driving module is arranged on the seat body and drivingly connected with the first support frame, and can drive the first support frame to move; the rotating table is arranged on the first support frame; the second driving module is arranged on the first support frame and drivingly connected with the rotating table, and can drive the rotating table to turn over;

[0011] An adsorption assembly comprising an adsorption member, a support plate, a third driving module and a fourth driving module; the support plate is arranged on the rotating table, and the adsorption member is arranged on the top surface of the rotating table; the third driving module is arranged on the support plate and drivingly connected with the adsorption member, and can drive the adsorption member to rotate; the fourth driving module is arranged on the support plate and drivingly connected with the adsorption member, and can drive the adsorption member to move up and down;

[0012] A detection assembly located above the adsorption member.

[0013] As a preferred technical scheme of the present application, the rotating table comprises a rotating seat and a connecting frame; the rotating seat is rotatably arranged on the first support frame; the connecting frame is arranged on the rotating seat; the support plate is arranged on the connecting frame; and the second driving module is connected with the rotating seat.

[0014] As a preferred technical scheme of the present application, the third driving module comprises a motor, a driving gear, a driven gear, a transmission chain and a plurality of guide rollers; the motor is arranged on the support plate; the driving gear is sleeved on the power output end of the motor and located on the top surface of the support plate; the driven gear is arranged on the top surface of the support plate and located at the bottom of the adsorption member; each of the guide rollers is arranged on the top surface of the support plate and located at the two sides of the driving gear respectively; the transmission chain is sleeved on the guide rollers, and the transmission chain is engaged with the driving gear and the driven gear respectively.

[0015] As a preferred technical scheme of the present application, the support plate is provided with a through hole, the fourth driving module is arranged at the bottom of the support plate and the power output shaft thereof is connected with the bottom of the adsorption accessory after penetrating through the through hole.

[0016] As a preferred technical scheme of the present application, the flattening assembly comprises a second support frame, a lifting seat, a pressing disc, a fifth driving module and a sixth driving module; the fifth driving module is arranged on the seat body and is drivingly connected with the second support frame, and can drive the second support frame to move along the direction of the adsorption assembly; the lifting seat and the sixth driving module are arranged on the second support frame, the sixth driving module is drivingly connected with the lifting seat and can drive the lifting seat to lift and lower; the pressing disc is arranged on the lifting seat.

[0017] In a second aspect, the present application also provides a film pasting device, which comprises the wafer carrying device, the conveying mechanism and the film pasting mechanism.

[0018] The frame body is arranged on the seat body of the wafer carrying device, and is provided with a film placing assembly and a film collecting assembly.

[0019] As a preferred technical scheme of the present application, the pre-cutting film assembly comprises a first rotating roller, a second rotating roller and a driver; the first rotating roller and the second rotating roller are both rotatably arranged on the frame body, and a distance for the composite film to pass through is arranged between the first rotating roller and the second rotating roller; the driver is arranged on the frame body and is drivingly connected with the first rotating roller and the second rotating roller, and can drive the first rotating roller and the second rotating roller to rotate; a film cutter is arranged on the side wall of the first rotating roller or the second rotating roller.

[0020] As a preferred technical scheme of the present application, the adhesive tape pasting assembly comprises a tape dispenser and a tape collector arranged on the frame body, and a seventh driving module, a film pressing roller and a clamping roller are arranged along the adhesive tape conveying direction of the tape dispenser and the tape collector; a distance for the adhesive tape to pass through is arranged between the film pressing roller and the clamping roller, the seventh driving module is drivingly connected with the film pressing roller and can drive the film pressing roller to move along the direction of the composite film.

[0021] As a preferred technical scheme of the present application, the film pressing assembly comprises a first moving frame, a second moving frame, a film sticking roller, a pressing roller, two eighth driving modules and two ninth driving modules; the film sticking roller is arranged on the first moving frame, and the pressing roller is arranged on the second moving frame; the two ninth driving modules are arranged on the first moving frame and the second moving frame respectively and can respectively drive the film sticking roller and the two pressing rollers to move up and down; each eighth driving module is arranged on the seat body and is drivingly connected with the first moving frame and the second moving frame, and can drive the first moving frame and the second moving frame to move towards or away from each other.

[0022] As a preferred technical scheme of the present application, the conveying mechanism further comprises a tenth driving module, a movable seat and a sticking assembly arranged on the movable seat; the movable seat is arranged on the seat body, and the tenth driving module is arranged on the seat body and is drivingly connected with the movable seat, and can drive the movable seat to move laterally;

[0023] The sticking assembly comprises a vacuum suction device, an eleventh driving module and a twelfth driving module; the eleventh driving module and the twelfth driving module are both arranged on the movable seat; the eleventh driving module is drivingly connected with the vacuum suction device and can drive the vacuum suction device to move longitudinally; and the twelfth driving module is drivingly connected with the vacuum suction device and can drive the vacuum suction device to move vertically.

[0024] Compared with the prior art, the present application has the following beneficial effects:

[0025] When the film sticking device of the present application is in operation, the fourth driving module controls the suction accessory to ascend, so that the suction accessory can accurately suck the wafer; the detection assembly is located above the suction accessory, and can detect the wafer sucked by the suction accessory; then the third driving module drives the suction accessory to rotate to a specified angle on the rotating table; then the wafer is flattened by the flattening assembly, so as to improve the flatness of the wafer; then the second driving module drives the rotating table to flip over, so that the originally upward surface of the wafer faces downward; the first driving module drives the first support frame to move on the seat body until the suction accessory with the sucked wafer approaches the conveying position of the film sticking device; the fourth driving module controls the suction accessory to descend, so that the wafer is released to the conveying position of the film sticking device, thereby realizing accurate carrying and angle adjustment of the wafer, and improving the flatness of the wafer.

[0026] The pre-cutting film assembly directly cuts the composite film in the conveying state, and the adhesive tape assembly is used to bond the adhesive tape on the surface of the cut composite film, so that the different areas connected by the adhesive tape on the film layer of the composite film can be easily peeled off when the adhesive tape on the composite film is peeled off by the subsequent adhesive tape assembly, and only the part that needs to be bonded to the wafer is left on the composite film, so that the wafer is bonded by the film assembly, and the peeled part of the composite film is recycled to the designated part, so that the problem of residual glue of the composite film can be avoided, and the overall operation efficiency is high. BRIEF DESCRIPTION OF DRAWINGS

[0027] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings needed in the embodiment description will be briefly introduced. Obviously, the drawings in the following description are some embodiments of the present application, and other drawings can also be obtained by those skilled in the art without creative labor.

[0028] Figure 1 is the overall structure diagram of the embodiment of the present application.

[0029] Figure 2 is the structure diagram of the wafer carrying device of the embodiment of the present application.

[0030] Figure 3 is the structure diagram of the turning assembly and the adsorption assembly of the embodiment of the present application.

[0031] Figure 4 is the structure explosion diagram of the adsorption assembly of the embodiment of the present application.

[0032] Figure 5 is the structure diagram of the adsorption assembly of the embodiment of the present application.

[0033] Figure 6 is the structure diagram of the flattening assembly of the embodiment of the present application.

[0034] Figure 7 is the structure diagram of the film bonding mechanism of the embodiment of the present application.

[0035] Figure 8 is the structure diagram of the pre-cutting film assembly of the embodiment of the present application.

[0036] Figure 9 is the structure diagram of the adhesive tape assembly of the embodiment of the present application.

[0037] Figure 10 is Figure 9 the partial enlarged view of A in

[0038] Figure 11 is the structure diagram of the film pressing assembly of the embodiment of the present application.

[0039] Figure 12 is a structural diagram of a conveying mechanism of an embodiment of the present application.

[0040] Figure 13 is a structural diagram of a jacking assembly of an embodiment of the present application.

[0041] Figure 14 is a structural diagram of a jacking assembly and a seat body of an embodiment of the present application.

[0042] Figure 15 is a structural diagram of another perspective of Figure 14

[0043] Figure 16 is a composite film and adhesive tape of an embodiment of the present application.

[0044] Reference numerals in the drawings

[0045] 1, seat body;

[0046] 2, turnover assembly; 21, first support frame; 22, rotating table; 221, rotating seat; 222, connecting frame; 23, first driving module; 24, second driving module;

[0047] 3, adsorption assembly; 31, adsorption part; 32, support plate; 321, through hole; 33, third driving module; 331, motor; 332, driving gear; 333, driven gear; 334, transmission chain; 335, guide roller; 34, fourth driving module;

[0048] 4, detection assembly;

[0049] 5, flattening assembly; 51, second support frame; 52, lifting seat; 53, pressing disc; 54, fifth driving module; 55, sixth driving module;

[0050] 6, conveying mechanism; 61, tenth driving module; 62, movable seat; 63, attaching assembly; 631, vacuum adsorber; 632, eleventh driving module; 633, twelfth driving module; 64, jacking assembly; 641, jacking frame; 6411, through hole; 642, primary air cylinder; 643, secondary air cylinder 643;

[0051] 7, film attaching mechanism; 71, frame body; 72, film placing assembly; 73, film collecting assembly; 74, pre-cut film assembly; 741, first rotating roller; 742, second rotating roller; 743, driving module; 744, film cutter; 75, adhesive tape attaching assembly; 751, feeder; 752, collector; 753, seventh driving module; 754, film pressing roller; 755, clamping roller; 76, film pressing assembly; 761, first moving frame; 762, second moving frame; 763, film attaching roller; 764, pressing roller; 765, eighth driving module; 766, ninth driving module. ​DETAILED DESCRIPTION

[0052] The technical solutions in the embodiments of the present application will be described clearly and completely below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are some of the embodiments of the present application, rather than all the embodiments of the present application. Based on the embodiments in the present application, all other embodiments obtained by a person of ordinary skill in the art without creative effort belong to the scope of protection of the present application.

[0053] It should be understood that the terms "comprise" and "include" as used in the specification and the appended claims indicate the presence of the described features, integers, steps, operations, elements, and / or components but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and / or groups thereof.

[0054] It should also be understood that the terms used in the present application specification are only for the purpose of describing specific embodiments and are not intended to limit the present application. As used in the present application specification and the appended claims, the singular forms "a", "an" and "the" are intended to include the plural forms unless the context clearly indicates otherwise.

[0055] It should be further understood that the term "and / or" as used in the present application specification and the appended claims means any combination of one or more of the associated listed items and all possible combinations thereof, and includes these combinations.

[0056] To solve the technical problems that the wafer carrying efficiency is low in the existing wafer carrying device, and in the process of film pasting, air bubbles are easily formed between the composite film and the wafer, the wafer and the composite film are difficult to be fully pasted, the composite film is prone to local peeling or warping, and the wafer cannot be fully protected, embodiments of the present application provide a wafer carrying device.

[0057] The specific structure of the wafer carrying device provided by the embodiments of the present application will be described in detail below. According to the drawings shown in the drawings of the specification, the specific structure of the wafer carrying device includes a seat body 1, a flattening assembly 5, a turnover assembly 2, a suction assembly 3 and a detection assembly 4.

[0058] According to the drawings Figure 1 As shown in the drawings, the flattening assembly 5 is arranged on the top surface of the seat body 1.

[0059] Specifically, before the wafer is transported to the film pasting process, due to the existence of some wafers with uneven conditions, in order to avoid the situation that the surface of such wafers cannot be fully pasted with the composite film, the wafer is subjected to uniform pressure by the laminating assembly before being transported to the film pasting process, so that the uneven surface of the wafer gradually tends to be flat under the action of pressure. For the local protrusions or depressions of the wafer, by applying the pressure, the wafer undergoes a certain degree of plastic deformation or elastic deformation, so as to fill the depressions or flatten the protrusions. In this way, the flatness of the wafer is improved, and a more uniform surface is provided for the subsequent film pasting process.

[0060] According to Figure 2 As shown in the figure, the turnover assembly 2 includes a first support frame 21, a rotating table 22, a first driving module 23 and a second driving module 24; the first support frame 21 is arranged on the top surface of the seat body 1; the first driving module 23 is arranged on the seat body 1 and drivingly connected with the first support frame 21, and can drive the first support frame 21 to move; the rotating table 22 is arranged on the first support frame 21; the second driving module 24 is arranged on the first support frame 21 and drivingly connected with the rotating table 22, and can drive the rotating table 22 to turn over.

[0061] Specifically, when the wafer is transported close to the rotating table 22, it is fixed and adsorbed by the adsorption assembly 3 of the rotating table 22, ensuring that the wafer remains stable during subsequent operations. After the wafer is laminated by the flattening assembly 5, the first driving module 23 is drivingly connected with the first support frame 21, so that the first support frame 21 can be driven to move on the top surface of the seat body 1. Under the precise control of the first driving module 23, the first support frame 21 can be moved to a specified position. When the wafer moves to the specified position with the first support frame 21, the second driving module 24 is arranged on the first support frame 21 and drivingly connected with the rotating table 22, so that the rotating table 22 can be driven to turn over. During the turnover process of the rotating table 22, the wafer is fixed and adsorbed by the adsorption assembly 3, so the wafer turns over with the rotating table 22 until the original upper surface of the wafer faces downward. At this time, the adsorption assembly 3 releases the wafer according to the instruction, so that the wafer is released to a specified position for subsequent film pasting or other processing procedures. In this way, the wafer can be accurately transported to the specified position, ensuring the positional accuracy of the wafer during the movement process, thereby improving the automation degree and production efficiency of the wafer processing.

[0062] It can be understood that the first driving module 23 of the embodiment of the present application comprises a motor, a guide screw and a moving nut; specifically, the motor can convert electrical energy into mechanical energy, so as to output rotary motion, that is, the rotary motion of the motor is transmitted to the guide screw through a shaft coupling, since the guide screw is an axial part with a spiral groove, when the screw is rotated under the driving of the motor, the spiral structure thereof can make the moving nut cooperating therewith generate linear motion, that is, the rotary motion is converted into linear motion, the moving nut is fixedly connected with the first support frame 21, when the moving nut generates linear motion under the driving of the screw, the first support frame 21 connected with the moving nut is driven to move linearly on the seat body 1, so as to realize conveying the wafer to a specified position.

[0063] According to Figures 3-5 As shown in FIG. 3, the adsorption assembly 3 comprises an adsorption member 31, a support plate 32, a third driving module 33 and a fourth driving module 34; the support plate 32 is arranged on the rotating table 22, and the adsorption member 31 is arranged on the top surface of the rotating table 22; the third driving module 33 is arranged on the support plate 32 and drivingly connected with the adsorption member 31, and can drive the adsorption member 31 to rotate; the fourth driving module 34 is arranged on the support plate 32 and drivingly connected with the adsorption member 31, and can drive the adsorption member 31 to ascend and descend.

[0064] Specifically, when it is needed to fix and adsorb the wafer, the fourth driving module 34 is used to drive the adsorption member 31 to ascend, so as to move the adsorption member 31 from the initial position to a position capable of contacting the wafer, in this process, the fourth driving module 34 can accurately control the ascending height of the adsorption member 31, so as to ensure that the adsorption member 31 can accurately contact the wafer and generate adsorption force for fixing and adsorbing the wafer. When the adsorption member 31 ascends to contact the wafer, negative pressure is generated to tightly adsorb the wafer. At this time, the detection assembly 4 starts to detect the adsorbed wafer, for example, checks whether the position, angle and orientation of the wafer are correct. When it is needed to adjust the orientation or angle of the wafer, the third driving module 33 is used to drive the adsorption member 31 to rotate on the rotating table 22 about the axis thereof, at this time, the wafer fixed and adsorbed by the adsorption member 31 can be made to rotate, until the wafer rotates to a specified angle or orientation, so as to meet the requirements of the subsequent process on the attitude of the wafer. After the wafer is rotated to the specified angle by the adsorption member 31, the first driving module 23 is used to drive the first support frame 21 to move on the seat body 1, so as to convey the wafer to a specified position, and then the fourth driving module 34 is used to drive the adsorption member 31 to descend, until the wafer descends to a specified release position, and then the adsorption member 31 stops fixing and adsorbing, so as to stably place the wafer on the specified position, thus, the process of fixing and adsorbing the wafer, adjusting the angle of the wafer, conveying the wafer and releasing the wafer is completed, the wafer is accurately adjusted in angle, so as to ensure the subsequent film pasting process.

[0065] According to Figure 2As shown, the detection assembly 4 is located above the suction accessory 31. Specifically, the detection assembly 4 can provide feedback information for the third driving module 33 by identifying the angle of the wafer. For example, when the wafer needs to be rotated to a specific angle, the detection assembly 4 is used to monitor the actual angle of the wafer in real time and compare it with the preset angle. If a deviation is found, the third driving module 33 can be controlled to drive the suction accessory 31 to rotate in time so that the wafer reaches the accurate angle, thereby ensuring the subsequent process.

[0066] According to Figure 3 As shown, in some specific embodiments, the rotating table 22 includes a rotating seat 221 and a connecting frame 222. The rotating seat 221 is rotatably arranged on the first support frame 21. The connecting frame 222 is arranged on the rotating seat 221. The support plate 32 is arranged on the connecting frame 222. The second driving module 24 is connected with the rotating seat 221.

[0067] Specifically, the second driving module 24 is connected with the rotating seat 221 to drive the rotating seat 221 to rotate. Since the rotating seat 221 is rotatably arranged on the first support frame 21, the rotating seat 221 is driven to rotate around the connecting shaft with the first support frame 21 under the driving action of the second driving module 24. It should be understood that the connecting frame 222 is arranged on the rotating seat 221. When the rotating seat 221 rotates, the connecting frame 222 rotates with the rotating seat 221. That is, the connecting frame 222 connects the rotating seat 221 and the support plate 32 and transmits the rotation of the rotating seat 221 to the support plate 32. In this way, the support plate 32 rotates with the rotating seat 221 and the connecting frame 222 to flip the suction assembly 3 arranged on the support plate 32 and the wafer located on the suction assembly 3 under the driving action of the rotating seat 221, so that the wafer is flipped during the transfer process, which facilitates the subsequent release of the wafer to the designated position.

[0068] It should be understood that the second driving module 24 of the embodiment of the present application is a motor. The power output shaft of the motor is connected with the rotating seat 221. When the motor is started, the rotating seat 221 is driven to rotate by driving the power output shaft to rotate.

[0069] In some specific embodiments, the third driving module 33 comprises a motor 331, a driving gear 332, a driven gear 333, a transmission chain 334 and a plurality of guide rollers 335; the motor is arranged on the support plate 32, the driving gear 332 is sleeved on the power output end of the motor 331 and located on the top surface of the support plate 32, the driven gear 333 is arranged on the top surface of the support plate 32 and located at the bottom of the suction accessory 31, each guide roller 335 is arranged on the top surface of the support plate 32 and located at the two sides of the driving gear 332 respectively, the transmission chain 334 is sleeved on the guide rollers 335, and the transmission chain 334 is engaged with the driving gear 332 and the driven gear 333 respectively.

[0070] Specifically, the motor is arranged on the support plate 32, and the power output end thereof can perform rotary motion. Since the driving gear 332 is sleeved on the power output end of the motor and located on the top surface of the support plate 32. The transmission chain 334 is sleeved on the plurality of guide rollers 335, which provides support and guidance for the transmission chain 334, ensuring that the transmission chain 334 can stably run. The outer side of part of the transmission chain 334 is engaged with the driving gear 332. When the motor operates, the rotary motion of the power output end can drive the driving gear 332 to rotate synchronously. Due to the engagement between the gear and the chain, the driving gear 332 can drive the transmission chain 334 to move. The transmission chain 334 moves along a specific path under the guidance of the guide rollers 335, and can generate power in the process and transmit the power to the driven gear 333. That is, with the movement of the transmission chain 334, the driven gear 333 can be driven to rotate. Since the driven gear 333 is arranged on the top surface of the support plate 32 and located at the bottom of the suction accessory 31, when the driven gear 333 rotates, it directly drives the suction accessory 31 to rotate, so that the suction accessory 31 is rotated to a specified angle. In this way, the power of the motor can be effectively transmitted to the suction accessory 31 through this transmission mode, realizing the accurate rotation of the suction accessory 31 on the rotating table 22, ensuring that the wafer can be accurately adjusted to a specified angle after being sucked, and meeting the strict requirements of subsequent processes on the angle of the wafer.

[0071] For example, if the suction accessory 31 needs to rotate 30 degrees clockwise, the power output end of the motor is controlled to rotate, and at this time the driving gear 332 drives the driven gear 333 to rotate through the transmission chain 334, so as to accurately rotate the suction accessory 31 by 30 degrees.

[0072] It should be noted that by arranging a plurality of guide rollers 335 and arranging each guide roller 335 on the top surface of the support plate 32, the transmission chain 334 is supported and guided, so that the transmission chain 334 is kept in the correct position and in tension, avoiding problems such as deviation, relaxation or jumping of the transmission chain 334 during movement, thereby ensuring the stability and reliability of power transmission.

[0073] According to Figure 5As shown, in some specific embodiments, the support plate 32 has a through hole 321, and the fourth driving module 34 is arranged at the bottom of the support plate 32 and has a power output shaft penetrating through the through hole 321 and connected with the bottom of the suction accessory 31.

[0074] Specifically, when the suction accessory 31 needs to be lifted or lowered, the cylinder is used to push the piston inside to move upward. Since the piston is connected with the power output shaft, the power output shaft also moves upward under the pushing of the piston. Since the power output shaft penetrates through the through hole 321 on the support plate 32 and is connected with the bottom of the suction accessory 31, the suction accessory 31 can be lifted or lowered.

[0075] The through hole 321 of the support plate 32 is used to avoid the power output shaft of the cylinder, so that the power output shaft can smoothly penetrate through the support plate 32 and be connected with the suction accessory 31, and ensure that the power output shaft can keep stable linear movement during lifting and lowering movement.

[0076] According to Figure 6 As shown, in some specific embodiments, the flattening assembly 5 includes a second support frame 51, a lifting seat 52, a pressing disc 53, a fifth driving module 54 and a sixth driving module 55. The fifth driving module 54 is arranged in the seat body 1 and drivingly connected with the second support frame 51, so as to drive the second support frame 51 to move along the direction of the suction assembly 3. The lifting seat 52 and the sixth driving module 55 are both arranged in the second support frame 51, and the sixth driving module 55 is drivingly connected with the lifting seat 52 and can drive the lifting seat 52 to lift and lower. The pressing disc 53 is arranged in the lifting seat 52.

[0077] Specifically, the fifth driving module 54 is used to drive the second support frame 51 to move along the direction of the adsorption assembly 3, which enables the flattening assembly 5 to approach the adsorption assembly 3 on which the wafer has been fixed. Through the accurate control of the fifth driving module 54, it can be ensured that the pressing disc 53 can be accurately moved to the position directly above the wafer, which facilitates the subsequent laminating operation. After the second support frame 51 moves to the specified position, the sixth driving module 55 is used to drive the lifting seat 52 to move downward. Since the pressing disc 53 is arranged on the lifting seat 52, when the lifting seat 52 descends, the pressing disc 53 is synchronously driven to move downward until the pressing disc 53 can approach the wafer at a suitable speed and force. When the pressing disc 53 descends to the upper surface of the wafer, a certain pressure is continuously applied to the wafer for laminating. At this time, since the sixth driving module 55 continuously provides stable pressure, the pressing disc 53 can uniformly press the wafer on the adsorption assembly 3 until the wafer is laminated. After the laminating operation is completed, the wafer is formed into a flat wafer. Subsequently, the sixth driving module 55 drives the lifting seat 52 to drive the pressing disc 53 to ascend, so that the pressing disc 53 leaves the surface of the wafer. Finally, the fifth driving module 54 is used to drive the second support frame 51 to move away from the adsorption assembly 3, so that the flattening assembly 5 returns to the initial position and waits for the next laminating task.

[0078] It should be noted that the pressing disc 53 can be accurately set and controlled according to the characteristics of the wafer, the laminating process requirements and other factors, so as to ensure that the wafer will not be damaged in the laminating process and good laminating effect can be achieved.

[0079] The specific structure of the film pasting equipment provided by the embodiment of the present application will be described in detail below. According to the drawings in the accompanying drawings, the specific structure of the film pasting equipment includes a conveying mechanism 6, a film pasting mechanism 7 and the wafer carrying and moving equipment in any of the above embodiments. The conveying mechanism 6 is slidingly arranged on the seat body 1 of the wafer carrying and moving equipment.

[0080] According to Figure 7 As shown in the drawings, the specific structure of the film pasting mechanism 7 includes a frame body 71, which is arranged on the seat body 1 of the wafer carrying and moving equipment. The frame body 71 is provided with a film releasing assembly 72 and a film recycling assembly 73. A pre-cutting film assembly 74, a tape pasting assembly 75 and a film pressing assembly 76 are arranged along the conveying direction of the composite film between the film releasing assembly 72 and the film recycling assembly 73.

[0081] Specifically, the film releasing assembly 72 is used to release the composite film, and the film recycling assembly 73 is used to recycle the waste composite film after the wafer is pasted with the film. The composite film is arranged on the film releasing assembly 72 and is in a winding state in the initial state. One end of the composite film is led out and connected to the film recycling assembly 73. When the film recycling assembly 73 is in operation, the remaining waste composite film after the film pasting is completed is gradually wound on the film recycling assembly 73, so that the conveying of the composite film is realized.

[0082] According to Figure 16 It is to be noted that the composite film includes three film layers, i.e., a first film layer A1, a second film layer A2 and a third film layer A3. The second film layer A2 is used to be bonded to the wafer surface, the first film layer A1 covers the bonding surface of the second film layer A2, and the third film layer A3 covers the upper surface of the second film layer A2. When the film is attached, the first film layer A1 needs to be torn off first to expose the bonding surface of the second film layer A2. After the partial adhesive surface of the second film layer A2 is attached to the wafer surface, the third film layer A3 is then recycled to the film collecting assembly 73.

[0083] The pre-cut film assembly 74 of the embodiment of the present application is used to pre-cut the composite film A on the side close to the bonding (the first film layer A1) to form a cutting mark penetrating through the first film layer A1 and the second film layer A2, so as to form a first region A11 close to the surface of the first film layer A1 and a second region A12 located in the first region A11 and isolated from each other, and a third region A21 and a fourth region A22 on the second film layer A2. It can be understood that the first region A11 is opposite to the third region A21, and the second region A12 is opposite to the fourth region A22. The shapes of the second region A12 and the fourth region A22 are the same as the shape of the wafer.

[0084] The adhesive tape attaching assembly 75 of the embodiment of the present application is used to continuously attach the adhesive tape B on the surface of the first film layer A1, so as to restore the connection relationship between the first region A11 and each second region A12. When the first region A11, the second region A12 of the first film layer A1 and the third region A21 of the second film layer A2 are torn off in the subsequent process, the first region A11 and the second region A12 are fixed by the adhesive tape B, so that the first film layer A1 can be torn off completely at one time. Since the third region A21 corresponds to the first region A11, the first region A11 is adhered to the third region A21 when it is torn off. Therefore, the first region A11 and the second region A12 do not need to be torn off separately.

[0085] The adhesive tape attaching assembly 75 is located beside the pre-cut film assembly 74. When the composite film A is pre-cut, the adhesive tape B can be attached to prevent the first region A11 and / or the second region A12 of the composite film A from falling off or wrinkling in the subsequent conveying process, which affects the quality of the adhesive film B.

[0086] The second film layer A2 is pressed by the film pressing assembly 76 to be able to abut against the upper surface of the wafer at this time, so that the second film layer A2 can be stably adhered to the upper surface of the wafer. Finally, the remaining third film layer A3 is gradually wound on the film collecting assembly 73.

[0087] According to Figure 8As shown, in some specific embodiments, the pre-cutting film assembly 74 comprises a first rotating roller 741, a second rotating roller 742 and a driver 743; the first rotating roller 741 and the second rotating roller are both rotationally arranged on the frame 71, and a distance for the composite film to pass through is provided between the first rotating roller 741 and the second rotating roller; the driver 743 is arranged on the frame 71 and is drivingly connected with the first rotating roller 741 and the second rotating roller, and can drive the first rotating roller 741 and the second rotating roller to rotate; a side wall of the first rotating roller 741 or the second rotating roller 742 is provided with a film cutter 744.

[0088] Specifically, when the device starts to work, the first rotating roller 741 and the second rotating roller are simultaneously driven to rotate by the driver 743. The rotation speed and rotation direction of the first rotating roller 741 and the second rotating roller are accurately controlled by the driver 743, so that the two rotating rollers can rotate at the same linear speed, and the composite film can be kept in a stable conveying state when passing through the pre-cutting assembly. Since the film cutter 744 is arranged on the side wall of the first rotating roller 741 or the second rotating roller, for example, the film cutter 744 is arranged on the side wall of the first rotating roller 741, when the first rotating roller 741 is driven to rotate by the driver 743, the film cutter 744 follows the rotation of the first rotating roller 741 and continuously contacts the first film layer A1 of the composite film, and at the same time, the composite film can be pre-cut, so that the composite film forms a cutting mark penetrating the first film layer A1 and the second film layer A2. Thus, in the subsequent film pasting process, the first film layer A1 can be easily torn off.

[0089] It can be understood that the driver 743 of the embodiment of the present application comprises a driver, a driving wheel and two first driven wheels and second driven wheels which are meshed with each other, the driver is arranged on the frame 71, the driving wheel is sleeved on the power output shaft of the driver, the first driven wheel and the second driven wheel are respectively sleeved on one end of the first rotating roller 741 and the second rotating roller, and the driving wheel is meshed with the first driven wheel, so that when the driver drives the driving wheel to rotate, the first driven wheel and the second driven wheel can be simultaneously driven to rotate, so that the first rotating roller 741 and the second rotating roller can simultaneously rotate at the same speed.

[0090] According to Figure 9 As shown, in some specific embodiments, the adhesive tape assembly 75 comprises a tape feeder 751 and a tape collector 752 arranged on the frame 71, a seventh driving module 753, a film pressing roller 754 and a clamping roller 755 are arranged along the adhesive tape conveying direction of the tape feeder 751 and the tape collector 752; a distance for the adhesive tape B to pass through is provided between the film pressing roller 754 and the clamping roller 755, the seventh driving module 753 is drivingly connected with the film pressing roller 754 and can drive the film pressing roller 754 to move along the direction of the composite film.

[0091] Specifically, the adhesive tape B is arranged on the feeder 751, one end of the adhesive tape B is led out from the feeder 751, and the adhesive tape B can be arranged between the film pressing roller 754 and the clamping roller 755 along the set conveying direction. Since the conveying of the adhesive tape B between the feeder 751 and the collector 752 is a continuous process, the collector 752 can finally be used to recycle the remaining adhesive tape waste after the adhesive tape B is used. The film pressing roller 754 and the clamping roller 755 are spaced apart by a certain distance, which is flexibly set according to the thickness and width of the adhesive tape and the like, to ensure that the adhesive tape B can be smoothly arranged and positioned accurately. After the adhesive tape B is arranged between the film pressing roller 754 and the clamping roller 755, the clamping roller 755 is used to press the adhesive tape B to prevent the adhesive tape B from deviating during conveying. Then, the seventh driving module 753 drives the film pressing roller 754 to move along the direction of the composite film, so that the film pressing roller 754 contacts and applies a certain pressure to the adhesive tape B, so that the adhesive tape is pressed on the surface of the first film layer A1. Since the adhesive tape B has its own adhesion, it can be closely attached to the first film layer A1. In this way, as the adhesive tape B is continuously conveyed, the film pressing roller 754 continuously attaches the adhesive tape B to the surface of the first film layer A1, realizing the continuous attachment of the adhesive tape B on the first film layer A1. In this way, the adhesive tape B simultaneously adheres the first region A11 and each second region A12. When the first region A11, the second region A12 of the first film layer A1 and the third region A21 of the second film layer A2 are subsequently torn apart, since the first region A11 and the second region A12 are connected and fixed by the adhesive tape B, the entire first film layer A1 can be torn apart at one time.

[0092] It can be understood that the seventh driving module 753 of the embodiment of the present application is a gas cylinder and a linkage, the linkage is arranged on the power transmission shaft of the gas cylinder, one end of the film pressing roller 754 is connected to the linkage, and in operation, the gas cylinder drives the film pressing roller 754 to move along the direction of the composite film through the linkage.

[0093] According to Figure 11 As shown in FIG. 8, in some specific embodiments, the film pressing assembly 76 includes a first moving frame 761, a second moving frame 762, a film pressing roller 763, a pressing roller 764, two eighth driving modules 765 and two ninth driving modules 766. The film pressing roller 763 is arranged on the first moving frame 761, and the pressing roller 764 is arranged on the second moving frame 762. The two ninth driving modules 766 are respectively arranged on the first moving frame 761 and the second moving frame 762 and can respectively drive the film pressing roller 763 and the two pressing rollers 764 to move up and down. Each eighth driving module 765 is arranged on the seat body 1 and is drivingly connected with the first moving frame 761 and the second moving frame 762, respectively, and can drive the first moving frame 761 and the second moving frame 762 to move in the direction of approaching or moving away from each other.

[0094] Specifically, in operation, the two ninth drive modules 766 drive the film-attaching roller 763 and the pressing roller 764 to move downward, so that the film-attaching roller 763 and the pressing roller 764 gradually approach the composite film and the wafer, at this time, the adhesive surface of the second film layer A2 of the composite film is pushed to be close to the wafer, but has not yet contacted the surface of the wafer, so as to facilitate the subsequent film-attaching operation. After the film-attaching roller 763 and the pressing roller 764 are lowered to the appropriate position, the eighth drive module 765 starts to drive the first moving frame 761 and the second moving frame 762 to approach each other. In this process, the film-attaching roller 763 and the pressing roller 764 move together with the moving frames where they are located, further approaching the wafer. When the first moving frame 761 moves in the direction of the second moving frame 762, one of the ninth drive modules 766 continues to drive the film-attaching roller 763 to exert a continuous pressure on the composite film, so that the adhesive surface (the fourth region A22) of the second film layer A2 is pushed to be able to be attached to the upper surface of the wafer; at the same time, the pressing roller 764 also plays an auxiliary role, that is, it can exert a certain pressure on the composite film and the wafer on the other side, to ensure that the composite film remains flat during the attaching process, avoiding problems such as bubbles or wrinkles, thereby setting up to accurately attach the adhesive surface (the fourth region A22) of the second film layer A2 to the wafer by the film-attaching roller 763 with appropriate force and speed, to ensure the quality and effect of film-attaching. Finally, after the film-attaching operation on the wafer is completed, the film-attaching roller 763 and the pressing roller 764 are raised and reset under the drive of the ninth drive module 766, back to the initial position, so as to perform the next film-attaching operation; at the same time, the first moving frame 761 and the second moving frame 762 are reset to the initial position under the drive of the eighth drive module 765.

[0095] It can be understood that each eighth drive module 765 of the embodiment of the present application is the same as the scheme of the first drive module 23, and will not be described in detail. The ninth drive module 766 is a pneumatic cylinder, which is used to drive the film-attaching roller 763 and the pressing roller 764 to move downward respectively, so as to push the composite film.

[0096] According to Figure 12 As shown in FIG. 6, in some specific embodiments, the conveying mechanism 6 further comprises a tenth drive module 61, a movable seat 62, and an attaching assembly 63 arranged on the movable seat 62; the movable seat 62 is arranged on the seat body 1, and the tenth drive module 61 is arranged on the seat body 1 and drivingly connected with the movable seat 62, and can drive the movable seat 62 to move in the transverse direction.

[0097] Specifically, under the driving of the tenth driving module 61, the movable seat 62 starts to move in the transverse direction. Since the attaching assembly 63 is arranged on the movable seat 62, the attaching assembly 63 can move together with the movable seat 62, so that the movable seat 62 can be accurately moved to the specified wafer taking position, that is, the attaching assembly 63 is close to the suction accessory 31 of the wafer carrying device at this time; then, after the first support frame 21 is driven by the first driving module 23 of the wafer carrying device to move to the specified position, after the suction accessory 31 is controlled by the fourth driving module 34 to descend to the position close to the attaching assembly 63, and after the suction accessory 31 stops the suction action, the wafer is released to the attaching assembly 63 of the conveying mechanism 6; then, under the driving of the tenth driving module 61, the movable seat 62 drives the attaching assembly 63 and the wafer placed on the attaching assembly 63 to move to the specified wafer pasting position at the same time, and when the movable seat 62 moves to the specified wafer pasting position, the wafer is conveyed to the specified wafer pasting position by the attaching assembly 63, so as to facilitate the wafer pasting operation on the wafer in the subsequent wafer pasting process.

[0098] After completing the wafer conveying and wafer pasting operation once, the tenth driving module 61 can drive the movable seat 62 to return to the initial position, so as to facilitate the suction of the wafer released from the suction assembly 3 in the next time, thereby realizing the cyclic operation of the entire wafer pasting process.

[0099] According to Figure 12 As shown in FIG. 6, in a further embodiment, the attaching assembly 63 comprises a vacuum suction device 631, an eleventh driving module 632 and a twelfth driving module 633; the eleventh driving module 632 and the twelfth driving module 633 are arranged on the movable seat 62; the eleventh driving module 632 is drivingly connected with the vacuum suction accessory 31 and can drive the vacuum suction device 631 to move in the longitudinal direction; the twelfth driving module 633 is drivingly connected with the vacuum suction device 631 and can drive the vacuum suction device 631 to move in the vertical direction.

[0100] Specifically, the vacuum suction device 631 is used to fix the suction wafer, the eleventh driving module 632 is used to drive the vacuum suction device 631 to move in the longitudinal direction, the twelfth driving module 633 is used to drive the vacuum suction device 631 to move in the vertical direction, and the vacuum suction device 631 is controlled to move to the specified position, so that the wafer located on the vacuum suction device 631 can be at the specified wafer pasting position.

[0101] It can be understood that the eleventh driving module 632 is the same as the first driving module 23; or another embodiment, for example, the eleventh driving module 632 includes a guide rail, a cylinder and a moving piece, the guide rail is arranged on the movable seat 62, the moving piece is arranged on the vacuum adsorber 631, and the moving piece moves on the guide rail, the power output shaft of the cylinder is connected with the vacuum adsorber 631, the vacuum adsorber 631 is pushed by the cylinder, so that the moving piece arranged on the vacuum adsorber 631 moves on the guide rail, so that the vacuum adsorber 631 moves to the specified position. The twelfth driving module 633 is a lifting cylinder, and the power output shaft of the lifting cylinder is used to push the vacuum adsorber 631 to move up and down, so that the wafer can be pushed to the specified film pasting position.

[0102] According to Figures 13-15 As shown in FIG. 6, in a further embodiment, a jacking assembly 64 is further arranged below the conveying mechanism. When the adhesive surface (the fourth area A22) of the second film layer A2 is pasted on the upper surface of the wafer, the jacking assembly 64 is used to jack the third film layer A3 until the third film layer A3 is separated from the adhesive surface (the fourth area A22) of the second film layer A2, and then the jacking assembly 64 is reset.

[0103] It can be understood that the jacking assembly 64 of the embodiment of the present application includes a jacking frame 641, a first cylinder 642 and a second cylinder 643. The power output shaft of the first cylinder 642 is connected with the second cylinder 643, and the second cylinder 643 is connected with the bottom of the jacking frame 641. In this way, when the first cylinder 642 drives the second cylinder 643 to move up through the power output shaft, the jacking frame 641 is close to the third film layer A3. The second cylinder is used to drive the jacking frame 641 to move up by a certain distance until the top of the jacking frame 641 can drive the third film layer A3 to separate from the adhesive surface (the fourth area A22) of the second film layer A2. Finally, the first cylinder 642 drives the second cylinder 643 to reset, and the second cylinder 643 drives the jacking frame 641 to reset.

[0104] It should be understood that the top of the jacking frame 641 is provided with a through hole 6411, and the wafer attached to the vacuum adsorber 631 is located directly below the through hole 6411 at this time. This arrangement can prevent the jacking frame 641 from affecting the film pasting process of the wafer, and ensure that the adhesive surface (the fourth area A22) of the second film layer A2 can be stably pasted on the upper surface of the wafer.

[0105] The above merely illustrates the specific embodiments of the present application, but the protection scope of the present application is not limited thereto, and any skilled person in the art can easily think of various equivalent modifications or replacements within the technical range disclosed by the present application, and these modifications or replacements shall be covered within the protection scope of the present application. Therefore, the protection scope of the present application shall be subject to the protection scope of the claims.

Claims

1. A wafer carrier moving apparatus characterized by comprising: The wafer carrier moving device comprises: a seat body; a flattening assembly arranged on the top surface of the seat body; a turnover assembly comprising a first support frame, a rotating table, a first driving module and a second driving module; the first support frame is arranged on the top surface of the seat body; the first driving module is arranged on the seat body and is drivingly connected with the first support frame, and can drive the first support frame to move; the rotating table is arranged on the first support frame; the second driving module is arranged on the first support frame and is drivingly connected with the rotating table, and can drive the rotating table to turn over; a suction assembly comprising a suction member, a support plate, a third driving module and a fourth driving module; the support plate is arranged on the rotating table, and the suction member is arranged on the top surface of the rotating table; the third driving module is arranged on the support plate and is drivingly connected with the suction member, and can drive the suction member to rotate; the fourth driving module is arranged on the support plate and is drivingly connected with the suction member, and can drive the suction member to move up and down; a detection assembly located above the suction member; the third driving module comprises a motor, a driving gear, a driven gear, a transmission chain and a plurality of guide rollers; the motor is arranged on the support plate, the driving gear is sleeved on the power output end of the motor and located on the top surface of the support plate, the driven gear is arranged on the top surface of the support plate and located at the bottom of the suction member, each guide roller is arranged on the top surface of the support plate and located on the two sides of the driving gear respectively, the transmission chain is sleeved on the guide rollers, and the transmission chain is meshed with the driving gear and the driven gear respectively.

2. The wafer carrier transfer apparatus according to claim 1, wherein the rotating table comprises a rotating seat and a connecting frame; the rotating seat is rotatably arranged on the first support frame; the connecting frame is arranged on the rotating seat; the support plate is arranged on the connecting frame; and the second driving module is connected with the rotating seat.

3. The wafer carrier transfer apparatus according to claim 1, wherein the support plate penetrates a through hole; the fourth driving module is arranged at the bottom of the support plate, and the power output shaft thereof penetrates the through hole and is connected with the bottom of the suction member.

4. The wafer carrier transfer apparatus according to claim 1, wherein the flattening assembly comprises a second support frame, a lifting seat, a pressing disc, a fifth driving module and a sixth driving module; the fifth driving module is arranged on the seat body and is drivingly connected with the second support frame, and can drive the second support frame to move along the direction of the suction assembly; the lifting seat and the sixth driving module are both arranged on the second support frame; the sixth driving module is drivingly connected with the lifting seat and can drive the lifting seat to move up and down; and the pressing disc is arranged on the lifting seat.

5. A film attaching apparatus characterized by comprising: the film pasting device comprises the wafer carrier moving device of any one of claims 1-4, a conveying mechanism and a film pasting mechanism; the conveying mechanism is slidingly arranged on the seat body of the wafer carrier moving device; and the film pasting mechanism comprises: a frame body arranged on the seat body of the wafer carrier moving device; the frame body is provided with a film placing assembly and a film collecting assembly; a pre-cut film assembly, a tape pasting assembly and a film pressing assembly are arranged along the conveying direction of the composite film between the film placing assembly and the film collecting assembly.

6. The film pasting apparatus according to claim 5, wherein The pre-cut film assembly comprises a first rotating roller, a second rotating roller and a driver; the first rotating roller and the second rotating roller are both rotationally arranged on the frame body, and a distance for the composite film to pass through is provided between the first rotating roller and the second rotating roller; the driver is arranged on the frame body and is drivingly connected with the first rotating roller and the second rotating roller, and can drive the first rotating roller and the second rotating roller to rotate; a side wall of the first rotating roller or the second rotating roller is provided with a film cutter.

7. The film pasting apparatus according to claim 5, wherein The tape sticking assembly comprises a tape feeder and a tape collector arranged on the frame body, a seventh driving module, a film pressing roller and a clamping roller arranged along the tape conveying direction of the tape feeder and the tape collector; a distance for the tape to pass through is provided between the film pressing roller and the clamping roller, the seventh driving module is drivingly connected with the film pressing roller and can drive the film pressing roller to move along the direction of the composite film. 8.The film pasting apparatus according to claim 5, characterized in that, The film pressing assembly comprises a first moving frame, a second moving frame, a film sticking roller, a pressing roller, two eighth driving modules and two ninth driving modules; the film sticking roller is arranged on the first moving frame, and the pressing roller is arranged on the second moving frame; The two ninth driving modules are respectively arranged on the first moving frame and the second moving frame and can respectively drive the film sticking roller and the two pressing rollers to move up and down; Each of the eighth driving modules is arranged on the seat body and is drivingly connected with the first moving frame and the second moving frame, and can respectively drive the first moving frame and the second moving frame to move in the direction of approaching or moving away from each other. 9.The film pasting apparatus according to claim 5, characterized in that, The conveying mechanism further comprises a tenth driving module, a movable seat and a sticking assembly arranged on the movable seat; the movable seat is arranged on the seat body, and the tenth driving module is arranged on the seat body and is drivingly connected with the movable seat, and can drive the movable seat to move in the transverse direction; The sticking assembly comprises a vacuum suction device, an eleventh driving module and a twelfth driving module; the eleventh driving module and the twelfth driving module are both arranged on the movable seat; the eleventh driving module is drivingly connected with the vacuum suction device and can drive the vacuum suction device to move in the longitudinal direction; the twelfth driving module is drivingly connected with the vacuum suction device and can drive the vacuum suction device to move in the vertical direction.

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