Photovoltaic inverter adopting closed internal circulation heat dissipation
By adopting a closed internal circulation heat dissipation system in the photovoltaic inverter and using inert gas and semiconductor refrigeration components, the heat dissipation problem caused by air factors is solved, the stability and durability of the inverter are improved, and the service life is extended.
Patent Information
- Application Number
- CN202411816552.X
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2024-12-11
- Publication Date
- 2025-07-11
- Estimated Expiration
- Not applicable · inactive patent
AI Technical Summary
The existing photovoltaic inverters relies on natural heat dissipation and air cooling, and are easily affected by water vapor and dust in the air, resulting in component damage and reduced heat dissipation effect, affecting device performance and life.
The closed internal circulation heat dissipation system is adopted, and inert gas such as helium or argon is used to circulate in the sealed box. It combines semiconductor refrigeration components and fans for efficient heat dissipation, isolates external dust and water vapor, and uses the chemical stability and high thermal conductivity of the inert gas for internal heat management.
Effectively prevent component oxidation, reduce the probability of arc generation, improve conversion efficiency, extend the life of the inverter, and ensure stability and durability.
Smart Images
Figure CN120301339A_ABST
Abstract
Description
Technical Field
[0001] The present invention relates to the technical field of photovoltaic inverters, and particularly relates to a photovoltaic inverter adopting closed internal circulation heat dissipation. Background Art
[0002] A photovoltaic inverter is a key inverter in a photovoltaic power generation system, and its main function is to convert direct current generated by photovoltaic cells into alternating current to meet the needs of various electrical appliances or to be incorporated into the power grid. During the operation of the photovoltaic inverter, due to the frequent switching actions of power semiconductor devices (such as IGBT modules, etc.) and the presence of components such as resistors in the circuit, a large amount of heat will be generated.
[0003] At present, the heat dissipation methods of photovoltaic inverters mainly include natural heat dissipation, air-cooled heat dissipation, etc. The heat dissipation of photovoltaic inverters mainly relies on these two methods of natural heat dissipation and air-cooled heat dissipation. Both need to rely on the circulation with the surrounding air to achieve heat dissipation. However, the surrounding air inevitably contains water vapor and dust. After long-term operation, the water vapor will gradually erode the electrical components inside the photovoltaic inverter, causing damage to them. And the continuous accumulation of dust is likely to block the heat dissipation channels and affect the heat dissipation effect, resulting in the rise of the internal temperature of the photovoltaic inverter. This will not only weaken the performance and reliability of power semiconductor devices, but also reduce the conversion efficiency. Seriously, it may induce inverter failures and greatly shorten its service life.
[0004] Therefore, how to solve the heat dissipation problem caused by air factors and improve the stability and durability of photovoltaic inverters is an urgent problem to be solved by those skilled in the art. Summary of the Invention
[0005] In order to solve the heat dissipation problem caused by air factors and improve the stability and durability of photovoltaic inverters, the present application provides a photovoltaic inverter adopting closed internal circulation heat dissipation.
[0006] The photovoltaic inverter adopting closed internal circulation heat dissipation provided by the present application adopts the following technical solutions: A photovoltaic inverter adopting closed internal circulation heat dissipation includes a sealed box, on which a refrigeration component, a valve component, a DC input component, and an AC output component are sealedly installed. An internal circulation component thermally connected to the refrigeration component is sealedly arranged on the sealed box. Both the refrigeration component and the internal circulation component are electrically connected to the DC input component. The valve component is used to input an inert gas with heat conduction ability into the sealed box. The refrigeration component can circulate and cool the inert gas through the internal circulation component. An inverter body is installed on the internal circulation component, and the inverter body is electrically connected to the DC input component and the AC output component.
[0007] Further, the sealed box includes a back plate, the refrigeration assembly and the valve assembly are both fixedly and sealedly installed on the back plate, a box body is sealedly installed on the back plate, the DC input assembly and the AC output assembly are both installed on the box body, a panel is sealedly installed on the box body, and a mounting bracket is fixedly connected to one side of the back plate away from the box body.
[0008] Further, the refrigeration assembly includes a hot plate and a cold plate, and a plurality of electrically connected P-type semiconductors and N-type semiconductors are arranged between the hot plate and the cold plate. The P-type semiconductors and the N-type semiconductors are electrically connected to the DC input assembly. A heat dissipation device is connected to one side of the hot plate away from the P-type semiconductors and the N-type semiconductors, and the cold plate is thermally connected to the internal circulation assembly on one side away from the P-type semiconductors and the N-type semiconductors.
[0009] Further, the heat dissipation device includes a heat dissipation base, the heat dissipation base is fixedly connected to the hot plate, a plurality of uniformly distributed heat dissipation grooves are formed in the heat dissipation base, an air inlet cavity penetrating through the heat dissipation grooves is formed in the heat dissipation base, a first fan is installed on the heat dissipation base corresponding to the air inlet cavity, and the first fan is electrically connected to the DC input assembly.
[0010] Further, the valve assembly includes a first connecting pipe and a second connecting pipe that penetrate the sealed box in a sealed manner. One ends of the first connecting pipe and the second connecting pipe located outside the sealed box are detachably connected with an inflation pipe.
[0011] Further, one end of the first connecting pipe located inside the sealed box is connected with a piston pipe, a piston is hermetically and slidably connected inside the piston pipe, a first conveying pipe is fixedly connected to the side wall of the piston pipe, the first conveying pipe extends towards the top of the sealed box, one end of the piston pipe away from the first connecting pipe is coaxially and fixedly connected with a second conveying pipe, the lower end of the second conveying pipe extends towards the bottom of the sealed box, the outside of the second conveying pipe is communicated with the second connecting pipe, a connecting rod fixedly connected to the piston is arranged inside the second conveying pipe, the connecting rod is hermetically and slidably connected to the upper end of the second conveying pipe, a blocking block is fixedly connected to the lower end of the connecting rod corresponding to the end of the second conveying pipe extending towards the bottom of the sealed box, a spring is sleeved outside the connecting rod, one end of the spring is fixedly connected to the piston, and the other end of the spring is fixedly connected to the second conveying pipe.
[0012] Further, the DC input component includes a first sealed connection seat which is fixedly and sealingly connected to the sealed box. Inside the first sealed connection seat, a number of DC conductive columns are fixedly and sealingly connected. One end of the DC conductive column located inside the sealed box is correspondingly electrically connected to the inverter body, and one end of the DC conductive column located outside the sealed box is electrically connected to a first wiring seat.
[0013] Further, the AC output component includes a second sealed connection seat which is fixedly and sealingly connected to the sealed box. Inside the second sealed connection seat, a number of AC conductive columns are fixedly and sealingly connected. One end of the AC conductive column located inside the sealed box is correspondingly electrically connected to the inverter body, and one end of the AC conductive column located outside the sealed box is electrically connected to a second wiring seat.
[0014] Further, the internal circulation component includes a mounting seat which is fixedly and thermally connected to the refrigeration component. An installation cavity for installing the inverter body is provided on the mounting seat. A number of uniformly distributed heat conduction grooves penetrating the installation cavity are provided on the mounting seat. A second fan is installed on the mounting seat corresponding to the heat conduction grooves, and the second fan is electrically connected to the DC input component.
[0015] Further, the inert gas is configured as helium.
[0016] The beneficial effects achieved are as follows: In this application, by sealingly installing the inverter body in the sealed box, it can isolate external dust, moisture, etc. It can not only prevent dust from entering, but also protect the internal electronic components from being damaged by water vapor and oxygen erosion, and effectively solve the heat dissipation problem caused by air factors, ensuring the stability and durability of the photovoltaic inverter and being beneficial to extending the service life of the inverter.
[0017] In this application, by injecting helium gas inside the sealed box, it can not only avoid the oxidation of electronic components and metal parts, thereby enhancing the stability of the inverter operation; but also reduce the probability of arc generation, improve the conversion efficiency of the inverter; and can also more efficiently take away the heat from the inverter body 700, being beneficial to extending the service life of the inverter. Description of the Drawings
[0018] Figure 1 It is a schematic diagram of the overall structure of an embodiment of this application.
[0019] Figure 2 It is a schematic diagram of the structural decomposition of an embodiment of this application.
[0020] Figure 3 It is a schematic diagram of the internal structure of an embodiment of this application.
[0021] Figure 4 It is a schematic exploded view of the refrigeration component in an embodiment of the present application.
[0022] Figure 5 It is a schematic exploded view of the heat dissipation device in an embodiment of the present application.
[0023] Figure 6 It is a schematic internal structure view of the valve component in an embodiment of the present application.
[0024] Figure 7 It is a schematic exploded view of the DC input component in an embodiment of the present application.
[0025] Figure 8 It is a schematic exploded view of the AC output component in an embodiment of the present application.
[0026] Figure 9 It is a schematic exploded view of the internal circulation component in an embodiment of the present application.
[0027] Explanation of reference numerals: 100, sealed box; 101, back plate; 102, box body; 103, panel; 104, mounting rack; 200, refrigeration component; 201, hot plate; 202, cold plate; 203, P-type semiconductor; 204, N-type semiconductor; 205, heat dissipation device; 206, heat dissipation base; 207, heat dissipation groove; 208, air inlet cavity; 209, mounting plate; 210, mounting hole; 211, first fan; 300, valve component; 301, first connecting pipe; 302, second connecting pipe; 303, charging pipe; 304, piston pipe; 305, piston; 306, first conveying pipe; 307, second conveying pipe; 308, connecting rod; 309, blocking block; 310, spring; 400, DC input component; 401, first sealed connection seat; 402, DC conductive column; 403, first wiring seat; 500, AC output component; 501, second sealed connection seat; 502, AC conductive column; 503, second wiring seat; 504, AC output line; 505, cover plate; 600, internal circulation component; 601, mounting seat; 602, mounting cavity; 603, heat conduction groove; 604, second fan; 605, air guide cover; 700, inverter body. Detailed implementation manners
[0028] The following will Figures 1-9 make a further detailed description of the present application in conjunction with the attached
[0029] In the description of the present application, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc., indicating the orientation or positional relationship, are based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as limiting the present invention. In addition, the terms "first", "second", and "third" are used for descriptive purposes only and cannot be understood as indicating or implying relative importance.
[0030] In the description of this application, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.
[0031] The embodiment of the present application discloses a photovoltaic inverter using closed internal circulation heat dissipation.
[0032] Please refer to Figures 1 to 9 In one embodiment of the present application, a photovoltaic inverter using closed internal circulation heat dissipation includes a sealed box 100, on which a refrigeration component 200, a valve component 300, a DC input component 400, and an AC output component 500 are sealed and installed. An internal circulation component 600 thermally connected to the refrigeration component 200 is sealed and installed on the sealed box 100. The refrigeration component 200 and the internal circulation component 600 are both electrically connected to the DC input component 400. The valve assembly 300 is used to input helium into the sealed box 100. The refrigeration component 200 can circulate and cool the helium through the internal circulation component 600. An inverter body 700 is installed on the internal circulation component 600, and the inverter body 700 is electrically connected to the DC input component 400 and the AC output component 500.
[0033] In the embodiment of the present application, the implementation principle of a photovoltaic inverter using closed internal circulation heat dissipation is: First, helium is injected into the sealed box 100 using the valve assembly 300, and the air in the sealed box 100 is exhausted. During operation, the direct current generated by the solar panel is input into the inverter body 700 in the sealed box 100 via the direct current input assembly 400. The inverter body 700 uses its internal inverter circuit to convert the direct current into alternating current, which is output through the alternating current output assembly 500 for use by the alternating current load or incorporated into the power grid. In this process, the power conversion of the inverter body 700 generates heat.
[0034] When direct current passes through the DC input component 400, the refrigeration component 200 and the internal circulation component 600 electrically connected to the DC input component 400 will be powered on and started. After the refrigeration component 200 and the internal circulation component 600 are powered on and started, they will cool down the inverter body 700 to ensure that the inverter body 700 can work normally and stably. And at night or when the solar panels do not generate direct current under poor lighting conditions, the DC input component 400 will not supply electrical energy to the refrigeration component 200 and the internal circulation component 600, and the refrigeration component 200, the internal circulation component 600 and the inverter body 700 will all automatically stop working. This design can effectively ensure the stable operation of the inverter body 700 while also reducing the energy consumption of the refrigeration component 200 and the internal circulation component 600.
[0035] And structurally, by installing the inverter body 700 on the internal circulation component 600, on the one hand, the heat generated by the inverter body 700 can be directly conducted to the refrigeration component 200 through the internal circulation component 600 for heat dissipation. On the other hand, the internal circulation component 600 will also drive helium to continuously circulate in the sealed box 100, and the heat generated by the inverter body 700 will be transferred to the circulating helium. The heat-carrying helium will be conducted to the refrigeration component 200 through the internal circulation component 600 for heat dissipation.
[0036] Helium is an inert gas with very stable chemical properties. In the air, the electronic components and metal parts of the inverter may be oxidized. While in a helium environment, due to the absence of oxygen, the oxidation of electronic components and metal parts can be avoided. For example, the metal parts such as copper foil circuits and pins on the circuit board will not rust or be corroded, which helps to maintain the good electrical and mechanical properties of the components, thereby enhancing the stability of the inverter operation.
[0037] Compared with air, helium has a higher ionization energy, which makes helium less likely to be ionized to generate an arc under the same electric field strength. When the inverter is working, especially during the frequent switching process of switching devices (such as IGBTs), an arc may be generated. In a helium environment, the probability of arc generation can be reduced, the energy loss and the risk of component damage caused thereby can be reduced, and the conversion efficiency of the inverter can be improved.
[0038] Due to the high thermal conductivity of helium, which is about 5-6 times that of air. A large amount of heat is generated during the operation of the inverter body 700. In a helium environment, heat can be transferred from the inverter body 700 to the surrounding environment more efficiently. Especially for high-power inverters, the temperature of the IGBT modules inside rises quickly. In a helium environment, heat can be dissipated quickly, the temperature of the power devices can be reduced, and the performance degradation and failure probability caused by overheating can be reduced, which is beneficial to extending the service life of the inverter.
[0039] It can be understood that in other embodiments of the present application, helium can also be replaced with other inert gases having heat conduction ability. For example, argon, which is also an inert gas with stable chemical properties and will not react with the electronic components in the inverter. Although its thermal conductivity is lower than that of helium, in some application scenarios where the requirement for heat dissipation efficiency is not particularly high, it can replace helium and mainly play the advantage of its chemical stability to protect the electronic components from chemical damage such as oxidation.
[0040] Please refer to Figures 1 to 9 , in a specific embodiment of the present application, the sealing box 100 includes a back plate 101, a refrigeration component 200 and a valve component 300 are both fixedly and sealedly installed on the back plate 101. A box body 102 is sealedly installed on the back plate 101. A DC input component 400 and an AC output component 500 are both installed on the box body 102. A panel 103 is sealedly installed on the box body 102. On the side of the back plate 101 away from the box body 102, a mounting bracket 104 is fixedly connected.
[0041] During the working process, the mounting bracket 104 can be used to install the back plate 101, the box body 102 and the panel 103 as a whole. By arranging the refrigeration component 200 and the valve component 300 on the back plate 101, and the DC input component 400 and the AC output component 500 on the box body 102, the positions are concentrated and the functional areas are clear. The installation efficiency can be improved by operating in sequence, and the problem components can be quickly located during maintenance. At the same time, the sealed installation method can isolate external dust, moisture, etc., and protect the electronic components in the internal components such as the DC input component 400, the AC output component 500, the internal circulation component 600 and the inverter body 700 from being damaged by water vapor and oxygen erosion, and also effectively solve the heat dissipation problem caused by air factors, ensuring the stability and durability of the photovoltaic inverter and being beneficial to extending the service life of the inverter.
[0042] Moreover, by adopting the multi-layer structure composed of the back plate 101, the box body 102 and the panel 103 and cooperating with each other. Through the sealed connection between the layers and the stable installation with other components, the overall structure is firm and reliable. During the operation process, it can effectively prevent the structure from deforming or being damaged due to factors such as external force collision or internal pressure change, ensure the normal operation of the internal components of the inverter, reduce the potential safety hazards caused by structural problems, and provide a solid foundation for the stable operation of the inverter.
[0043] Please refer to Figures 1 to 9 , in a specific embodiment of the present application, the back plate 101, the box body 102 and the panel 103 are connected by means of screw locking, and sealing gaskets are provided at the joints between the back plate 101, the box body 102 and the panel 103 for sealing, so as to effectively ensure the sealing performance and structural stability of the sealing box 100.
[0044] Please refer to Figures 1 to 9 In a specific embodiment of the present application, the refrigeration component 200 includes a hot plate 201 and a cold plate 202. A number of electrically connected P-type semiconductors 203 and N-type semiconductors 204 are arranged between the hot plate 201 and the cold plate 202. The P-type semiconductors 203 and N-type semiconductors 204 are electrically connected to the DC input component 400. A heat dissipation device 205 is connected to the side of the hot plate 201 away from the P-type semiconductors 203 and N-type semiconductors 204. The side of the cold plate 202 away from the P-type semiconductors 203 and N-type semiconductors 204 is thermally connected to the internal circulation component 600.
[0045] During the working process, after the DC input component 400 provides direct current to the refrigeration component 200, the current will flow through the electrically connected P-type semiconductors 203 and N-type semiconductors 204. Based on the Peltier effect of semiconductors, when direct current passes through the thermoelectric couple composed of P-type semiconductors and N-type semiconductors, a temperature difference will be generated at the connection of the two semiconductors.
[0046] Specifically, among these semiconductor elements between the hot plate 201 and the cold plate 202, the current causes the temperature on the side of the hot plate 201 to rise, while the temperature on the side of the cold plate 202 to drop.
[0047] The heat dissipation device 205 connected to the hot plate 201 will dissipate the heat generated by the hot plate 201 to maintain the heat balance on the side of the hot plate 201 at a relatively high temperature state, ensuring the continuous progress of the refrigeration process. The side of the cold plate 202 away from the semiconductor is thermally connected to the internal circulation component 600, so that the reduced temperature of the cold plate 202 can be transferred to the internal circulation component 600 through heat conduction, thereby realizing the refrigeration operation on the internal circulation component 600.
[0048] This design uses the Peltier effect of semiconductors to achieve refrigeration, without large and complex components such as compressors in traditional refrigeration methods. It has a fast startup speed, can achieve a refrigeration effect in a short time, can quickly respond to refrigeration requirements, has the advantage of a fast refrigeration startup speed, and is very suitable for cooling and heat dissipation. Moreover, the entire refrigeration component 200 is mainly composed of a hot plate 201, a cold plate 202, semiconductor elements, and a heat dissipation device, etc. Compared with traditional heat dissipation devices, its structure is more compact and occupies less space.
[0049] Please refer to Figures 1 to 9 In a specific embodiment of the present application, a first control module and a first temperature sensor are provided between the connection circuit of the DC input component 400 and the P-type semiconductors 203 and N-type semiconductors 204. The first temperature sensor is arranged on the inverter body 700. The first control module can adjust the magnitude of the current input to the P-type semiconductors 203 and N-type semiconductors 204 according to the feedback signal of the first temperature sensor.
[0050] During operation, by adjusting the DC power provided by the DC input component 400, the current intensity passing through the P-type semiconductor 203 and the N-type semiconductor 204 can be more accurately controlled, and then the cooling temperature of the cold plate 202 can be accurately adjusted as needed, thereby achieving precise control of the cooling temperature and meeting different temperature control requirements.
[0051] Please refer to Figures 1 to 9 In a specific embodiment of the present application, the hot plate 201 and the cold plate 202 are both made of materials with good thermal conductivity, such as aluminum plate, copper plate, etc. In this embodiment, aluminum plate is preferably used because the thermal conductivity of aluminum is about 237W / (m·K). It has the advantages of light weight and relatively low price, and also has good thermal conductivity.
[0052] Please refer to Figures 1 to 9 In a specific embodiment of the present application, the heat dissipation device 205 includes a heat sink 206, which is fixedly connected to the heat plate 201 using thermal conductive adhesive. The heat sink 206 and the heat plate 201 are connected using thermal conductive adhesive, which can effectively reduce thermal resistance and ensure that heat is quickly transferred from the heat plate 201 to the heat sink 206.
[0053] Please refer to Figures 1 to 9 In a specific embodiment of the present application, the heat sink 206 is also fixedly connected to the sealing box 100 by screw locking, which increases the firmness of the connection. During the operation of the equipment, even if it is subjected to vibration or other external forces, it can maintain a stable position relationship, and will not affect the heat dissipation effect or damage other components due to displacement, thereby ensuring the overall reliability and stability of the equipment.
[0054] Please refer to Figures 1 to 9 In a specific embodiment of the present application, a plurality of evenly distributed heat dissipation slots 207 are provided on the heat dissipation seat 206, and an air inlet cavity 208 penetrating the heat dissipation slots 207 is provided on the heat dissipation seat 206. The design of the air inlet cavity 208 and the heat dissipation slots 207 optimizes the air flow path, so that air can flow evenly through the heat dissipation seat 206 and fully take away the heat. This reasonable air flow design can improve the uniformity of the heat dissipation effect, avoid local overheating, ensure the stable heat dissipation performance of the entire heat dissipation seat 206, and is conducive to improving the performance and life of the refrigeration components connected thereto and the entire device.
[0055] Please refer to Figures 1 to 9, in a specific embodiment of the present application, a mounting plate 209 is installed on the heat dissipation base 206 corresponding to the air inlet cavity 208. Mounting holes 210 are formed in the mounting plate 209, and a first fan 211 is installed inside the mounting holes 210. The first fan 211 is electrically connected to the DC input component 400. The heat dissipation grooves 207 increase the heat dissipation area. Combining with the forced air cooling effect of the first fan 211, the heat dissipation efficiency is greatly improved, and a large amount of heat generated by the hot plate 201 can be quickly dissipated, ensuring the stable operation of the refrigeration component.
[0056] During the working process, when the DC current generated by the solar panel passes through the DC input component 400, the refrigeration component 200 will work, and the temperature of the hot plate 201 increases due to the semiconductor Peltier effect. The heat is quickly conducted to the heat dissipation base 206 through the thermal conductive adhesive. The densely arranged heat dissipation grooves 207 on the heat dissipation base 206 increase the contact area with the air, which is beneficial to heat dissipation. At the same time, the DC input component 400 supplies power to the first fan 211, and the first fan 211 rotates to suck air from the air inlet cavity 208. When the air flows through the heat dissipation grooves 207, the heat on the heat dissipation base 206 is taken away, accelerating the heat dissipation process, thereby maintaining the relative stability of the temperature of the hot plate 201 and ensuring the continuous and efficient operation of the entire refrigeration system.
[0057] Please refer to Figures 1 to 9 , in a specific embodiment of the present application, a second control module and a second temperature sensor are provided between the connection circuit of the DC input component 400 and the first fan 211. The second temperature sensor is arranged on the hot plate 201, and the second control module can adjust the magnitude of the current input to the first fan 211 according to the feedback signal of the first temperature sensor.
[0058] During the working process, by adjusting the magnitude of the direct current provided by the DC input component 400, the rotation speed of the first fan 211 can be more accurately controlled, and then the hot plate 201 can be cooled as needed to achieve reliable control of the temperature of the hot plate 201 and meet the heat dissipation requirements of the hot plate 201.
[0059] Please refer to Figures 1 to 9 , in a specific embodiment of the present application, the heat dissipation base 206 is also made of a material with good thermal conductivity, such as: aluminum plate, copper plate, etc. In this embodiment, an aluminum plate is preferably used because the thermal conductivity of aluminum is about 237 W / (m·K). It has the advantages of light weight, relatively low price, and good thermal conductivity.
[0060] Please refer to Figures 1 to 9 , in a specific embodiment of the present application, the valve assembly 300 includes a first connecting pipe 301 and a second connecting pipe 302 that penetrate the sealing box 100 in a sealed manner. One end of the first connecting pipe 301 located outside the sealing box 100 is connected with an inflation pipe 303.
[0061] In use, an external inflating device can be used to inflate the inside of the sealed box 100 through the inflating pipe 303 and the first connecting pipe 301, or an external inflating device can be used to inflate the inside of the sealed box 100 through the inflating pipe 303 and the second connecting pipe 302.
[0062] Please refer to Figures 1 to 9 , in a specific embodiment of the present application, one end of the first connecting pipe 301 located inside the sealed box 100 is connected to a piston pipe 304. A piston 305 is hermetically and slidably connected inside the piston pipe 304. A first delivery pipe 306 is fixedly connected to the side wall of the piston pipe 304. The first delivery pipe 306 extends towards the top of the sealed box 100. One end of the piston pipe 304 away from the first connecting pipe 301 is coaxially and fixedly connected to a second delivery pipe 307. The lower end of the second delivery pipe 307 extends towards the bottom of the sealed box 100. The outside of the second delivery pipe 307 communicates with the second connecting pipe 302. A connecting rod 308 fixedly connected to the piston 305 is provided inside the second delivery pipe 307. The connecting rod 308 is hermetically and slidably connected to the upper end of the second delivery pipe 307. A blocking block 309 is fixedly connected to the lower end of the connecting rod 308 corresponding to the end where the second delivery pipe 307 extends towards the bottom of the sealed box 100. A spring 310 is sleeved outside the connecting rod 308. One end of the spring 310 is fixedly connected to the piston 305, and the other end of the spring 310 is fixedly connected to the second delivery pipe 307.
[0063] During the working process, when inflating the inside of the sealed box 100 through the inflating pipe 303 and the first connecting pipe 301, the gas to be filled is input from the top of the sealed box 100, while when inflating the inside of the sealed box 100 through the inflating pipe 303 and the second connecting pipe 302, the gas to be filled is input from the bottom of the sealed box 100.
[0064] When helium needs to be input into the sealed box 100, since the density of helium (He) is about 0.1786 g / L (under standard conditions), and air is a mixture of various gases with an average density of about 1.293 g / L (under standard conditions). Therefore, the density of helium is much smaller than that of air. So, helium is filled into the sealed box 100 through the first connecting pipe 301. When gas is filled into the first connecting pipe 301 through the filling pipe 303, the gas enters the piston pipe 304, and then pushes the piston 305 to slide along the piston pipe 304 in a direction away from the first connecting pipe 301. During the movement of the piston 305, the spring 310 will be compressed, and at the same time, the blocking block 309 will be driven to move through the connecting rod 308. When the piston 305 moves to a certain position, the first delivery pipe 306 is connected to the internal space of the sealed box 100, and the blocking block 309 will also release the blockage of the second delivery pipe 307, and helium starts to be input from the top of the sealed box 100, and the original air inside the sealed box 100 will be discharged from the bottom of the sealed box 100 through the second delivery pipe 307.
[0065] When argon needs to be input into the sealed box 100, since the density of argon (Ar) is about 1.784 kg / m³ (under standard conditions), and the density of air is about 1.293 kg / m³ (under standard conditions). Therefore, the density of argon is greater than that of air. So, argon is filled into the sealed box 100 through the second connecting pipe 302. When gas is filled into the second connecting pipe 302 through the filling pipe 303, the gas enters the second delivery pipe 307, and then pushes the blocking block 309 to release the blockage of the second delivery pipe 307. At the same time, the piston 305 will be driven to slide along the piston pipe 304 in a direction away from the first connecting pipe 301 through the connecting rod 308, and then the first delivery pipe 306 is connected to the internal space of the sealed box 100, and the original air inside the sealed box 100 will be discharged from the top of the sealed box 100 through the first delivery pipe 306.
[0066] Please also refer to Figures 1 to 9 In a specific embodiment of the present application, the DC input component 400 includes a first sealed connection seat 401, the first sealed connection seat 401 is fixedly and sealingly connected to the sealed box 100, several DC conductive columns 402 are fixedly and sealingly connected inside the first sealed connection seat 401, one end of the DC conductive column 402 located inside the sealed box 100 is correspondingly electrically connected to the inverter body 700, and one end of the DC conductive column 402 located outside the sealed box 100 is electrically connected to a first wiring seat 403, and a plurality of wiring ports are arranged in parallel on the first wiring seat 403.
[0067] During operation, the direct current provided by the solar photovoltaic panel is connected to the first terminal block 403 through a wire adapted thereto, and the current is conducted from the first terminal block 403 to the direct current conducting column 402. Since the direct current conducting column 402 achieves good electrical connection at both ends inside and outside the sealed box 100, and its end inside the sealed box 100 is electrically connected to the inverter body 700, the electrical energy of the external direct current power supply can be smoothly transmitted to the inverter body 700 through the direct current conducting column 402, thereby providing the required direct current electrical energy for the normal operation of the inverter. The setting of the first terminal block 403 makes the connection between the external direct current power supply and the direct current conducting column 402 very convenient. The operator only needs to connect the adapted wire to the first terminal block 403 in the correct way to complete the power supply access. This simple and clear connection method facilitates the installation, debugging, and subsequent maintenance operations of the equipment, reducing the operation difficulty and workload.
[0068] Please refer to Figures 1 to 9 , in a specific embodiment of the present application, the AC output assembly 500 includes a second sealed connection seat 501, which is fixedly and sealingly connected to the sealed box 100. A plurality of AC conducting columns 502 are fixedly and sealingly connected inside the second sealed connection seat 501. The end of the AC conducting column 502 inside the sealed box 100 is correspondingly electrically connected to the inverter body 700. The second sealed connection seat 501 is firmly and sealingly connected to the sealed box 100, and the AC conducting columns 502 inside it are also fixedly and sealingly connected. This sealing design can effectively block external impurities such as dust and water vapor from entering the inside of the sealed box 100, avoiding damage to the inverter body 700 and other internal components, such as preventing short circuits caused by dust and corrosion caused by water vapor, ensuring the cleanliness and stability of the internal environment of the equipment, and being beneficial to extending the service life of the equipment. The end of the AC conducting column 502 outside the sealed box 100 is electrically connected to a second terminal block 503.
[0069] During operation, when the inverter body 700 converts the input direct current into alternating current, the generated alternating current will be transmitted to the end of the AC conducting column 502 inside the sealed box 100 that is electrically connected to it. As a channel for electrical energy transmission, the AC conducting column 502 will smoothly conduct the alternating current from the inverter body 700 to its end outside the sealed box 100, and then through the second terminal block 503 electrically connected to this end, output the alternating current to external load or power grid and other electrical equipment, thereby realizing the function of the inverter to convert direct current into alternating current and output it externally.
[0070] Please refer to Figures 1 to 9, in a specific embodiment of the present application, an AC output line 504 is connected to the second terminal block 503, and a cover plate 505 is detachably connected to the second sealed connection seat 501. After the inverter transmits the converted alternating current to the second terminal block 503 through the AC conductive post 502, the alternating current is transmitted outward through the AC output line 504 to supply external electrical equipment or connect to the power grid, etc. The cover plate 505 is detachably connected to the second sealed connection seat 501. During normal operation, the cover plate 505 can protect components such as the AC conductive post 502 inside the second sealed connection seat 501, preventing dust, foreign objects, etc. from entering and affecting the conductive performance or causing faults such as short circuits; when it is necessary to repair, maintain or adjust the connection lines of the AC conductive post 502 or the second terminal block 503, the cover plate 505 can be removed to facilitate the operator to perform relevant operations.
[0071] Please refer to Figures 1 to 9 , in a specific embodiment of the present application, the internal circulation component 600 includes a mounting seat 601. The mounting seat 601 is fixedly connected to the cold plate 202 of the refrigeration component 200 by thermal conductive adhesive. An installation cavity 602 for installing the inverter body 700 is provided on the mounting seat 601. A number of uniformly distributed heat conduction grooves 603 that penetrate the installation cavity 602 are provided on the mounting seat 601. An air guide cover 605 is installed corresponding to the heat conduction grooves 603 on the mounting seat 601. A second fan 604 is fixedly installed on the air guide cover 605, and the second fan 604 is electrically connected to the DC input component 400.
[0072] During the working process, when the refrigeration component 200 works, the temperature of the cold plate 202 decreases, and the low temperature is conducted to the mounting seat 601 of the internal circulation component 600 connected thereto through the thermal conductive adhesive. The installation cavity 602 on the mounting seat 601 is used to place the inverter body 700, so that the inverter body 700 can conduct heat with the low-temperature mounting seat 601 to achieve preliminary cooling.
[0073] Then, the DC input component 400 supplies power to the second fan 604 to make it rotate. The air flow generated by the rotation of the second fan 604 will flow through the uniformly distributed heat conduction grooves 603 on the mounting seat 601 that penetrate the installation cavity 602, accelerating the gas flow, thereby further removing the heat of the mounting seat 601 and the inverter body 700, strengthening the heat dissipation effect, and maintaining the inverter body 700 within a suitable working temperature range.
[0074] This design forms an efficient heat dissipation path by thermally connecting the cold plate 202 of the refrigeration component 200 to the mounting base 601 and combining the air flow driven by the second fan 604 passing through the heat conduction groove 603. It can not only use the low temperature of the cold plate 202 for preliminary cooling but also rely on forced air cooling by the fan for further heat dissipation, effectively preventing the inverter body 700 from performance degradation or damage due to overheating, especially suitable for inverters operating at high power. Moreover, the overall structure of the internal circulation component 600 is designed compactly, integrating components such as the mounting base 601, heat conduction groove 603, and second fan 604, and being tightly connected to the refrigeration component 200 through thermal conductive glue, achieving good heat dissipation function within a limited space without occupying too much space inside the sealed box, which is beneficial to the reasonable layout of other components inside the sealed box.
[0075] Please also refer to Figures 1 to 9 , in a specific embodiment of the present application, the mounting base 601 is also made of a material with good thermal conductivity, such as: aluminum plate, copper plate, etc. In this embodiment, an aluminum plate is preferably used because the thermal conductivity of aluminum is about 237 W / (m・K). It has the advantages of light weight and relatively low price, and also has good thermal conductivity.
[0076] Please also refer to Figures 1 to 9 , in a specific embodiment of the present application, a third control module and a third temperature sensor are provided between the connection circuit of the DC input component 400 and the second fan 604. The third temperature sensor is arranged inside the sealed box 100, and the third control module can adjust the magnitude of the current input to the second fan 604 according to the feedback signal of the third temperature sensor.
[0077] During the working process, by adjusting the magnitude of the direct current provided by the DC input component 400, the rotation speed of the second fan 604 can be more accurately controlled, and then the inside of the sealed box 100 can be cooled as needed, achieving reliable control of the temperature inside the sealed box 100 and further ensuring the reliability of the working environment temperature of the inverter body 700.
[0078] The above are all preferred embodiments of the present application, and do not limit the protection scope of the present application accordingly. Therefore: All equivalent changes made according to the structure, shape, and principle of the present application should be covered within the protection scope of the present application.
Claims
1. A photovoltaic inverter using closed-loop internal circulation for heat dissipation, characterized in that: It includes a sealed box (100), on which a refrigeration component (200), a valve component (300), a DC input component (400), and an AC output component (500) are hermetically installed. An internal circulation component (600) that is thermally connected to the refrigeration component (200) is hermetically arranged on the sealed box (100). Both the refrigeration component (200) and the internal circulation component (600) are electrically connected to the DC input component (400). The valve component (300) is used to input an inert gas with heat conduction ability into the sealed box (100). The refrigeration component (200) can circulate and cool the inert gas through the internal circulation component (600). An inverter body (700) is installed on the internal circulation component (600), and the inverter body (700) is electrically connected to the DC input component (400) and the AC output component (500).
2. The photovoltaic inverter adopting closed - loop internal circulation heat dissipation according to claim 1, wherein: The sealed box (100) includes a back panel (101). Both the refrigeration component (200) and the valve component (300) are fixedly and hermetically installed on the back panel (101). A box body (102) is hermetically installed on the back panel (101). The DC input component (400) and the AC output component (500) are both installed on the box body (102). A front panel (103) is hermetically installed on the box body (102). A mounting bracket (104) is fixedly connected to the side of the back panel (101) away from the box body (102).
3. The photovoltaic inverter with a closed internal circulation heat dissipation according to claim 1, characterized in that: The refrigeration component (200) includes a hot plate (201) and a cold plate (202). A number of electrically connected P-type semiconductors (203) and N-type semiconductors (204) are arranged between the hot plate (201) and the cold plate (202). The P-type semiconductors (203) and the N-type semiconductors (204) are electrically connected to the DC input component (400). A heat dissipation device (205) is connected to the side of the hot plate (201) away from the P-type semiconductors (203) and the N-type semiconductors (204). The side of the cold plate (202) away from the P-type semiconductors (203) and the N-type semiconductors (204) is thermally connected to the internal circulation component (600).
4. A photovoltaic inverter using closed - loop internal circulation for heat dissipation according to claim 3, characterized in that: The heat dissipation device (205) includes a heat dissipation base (206). The heat dissipation base (206) is fixedly connected to the hot plate (201). A number of uniformly distributed heat dissipation grooves (207) are formed on the heat dissipation base (206). An air inlet cavity (208) that penetrates the heat dissipation grooves (207) is formed on the heat dissipation base (206). A first fan (211) is installed on the heat dissipation base (206) corresponding to the air inlet cavity (208). The first fan (211) is electrically connected to the DC input component (400).
5. A photovoltaic inverter using closed-loop internal circulation for heat dissipation according to claim 1, characterized in that: The valve assembly (300) includes a first connecting pipe (301) and a second connecting pipe (302) that penetrate through the sealing box (100). One end of the first connecting pipe (301) and the second connecting pipe (302) located outside the sealing box (100) is detachably connected to an inflation pipe (303).
6. The photovoltaic inverter with closed internal circulation heat dissipation according to claim 5, characterized in that: One end of the first connecting pipe (301) located inside the sealing box (100) is connected to a piston pipe (304). A piston (305) is hermetically and slidably connected inside the piston pipe (304). A first delivery pipe (306) is fixedly connected to the side wall of the piston pipe (304). The first delivery pipe (306) extends towards the top of the sealing box (100). One end of the piston pipe (304) away from the first connecting pipe (301) is coaxially and fixedly connected to a second delivery pipe (307). The lower end of the second delivery pipe (307) extends towards the bottom of the sealing box (100). The outside of the second delivery pipe (307) communicates with the second connecting pipe (302). A connecting rod (308) fixedly connected to the piston (305) is provided inside the second delivery pipe (307). The connecting rod (308) is hermetically and slidably connected to the upper end of the second delivery pipe (307). A blocking block (309) is fixedly connected to the lower end of the connecting rod (308) corresponding to the end where the second delivery pipe (307) extends towards the bottom of the sealing box (100). A spring (310) is sleeved outside the connecting rod (308). One end of the spring (310) is fixedly connected to the piston (305), and the other end of the spring (310) is fixedly connected to the second delivery pipe (307).
7. A photovoltaic inverter using closed - loop internal circulation for heat dissipation according to claim 1, characterized in that: The DC input assembly (400) includes a first sealing connection seat (401). The first sealing connection seat (401) is fixedly and hermetically connected to the sealing box (100). A number of DC conductive columns (402) are fixedly and hermetically connected inside the first sealing connection seat (401). One end of the DC conductive columns (402) located inside the sealing box (100) is electrically connected to the inverter body (700) correspondingly. One end of the DC conductive columns (402) located outside the sealing box (100) is electrically connected to a first wiring seat (403).
8. A photovoltaic inverter adopting closed - loop internal - circulation heat dissipation according to claim 1, characterized in that: The AC output assembly (500) includes a second sealing connection seat (501). The second sealing connection seat (501) is fixedly and hermetically connected to the sealing box (100). A number of AC conductive columns (502) are fixedly and hermetically connected inside the second sealing connection seat (501). One end of the AC conductive columns (502) located inside the sealing box (100) is electrically connected to the inverter body (700) correspondingly. One end of the AC conductive columns (502) located outside the sealing box (100) is electrically connected to a second wiring seat (503).
9. A photovoltaic inverter using closed - loop internal circulation for heat dissipation according to claim 1, characterized in that: The inner circulation component (600) includes a mounting base (601). The mounting base (601) is fixedly and thermally connected to the refrigeration component (200). An installation cavity (602) for installing the inverter body (700) is formed on the mounting base (601). A number of heat conduction grooves (603) which are evenly distributed and penetrate through the installation cavity (602) are formed on the mounting base (601). A second fan (604) is installed on the mounting base (601) corresponding to the heat conduction grooves (603). The second fan (604) is electrically connected to the DC input component (400).
10. A photovoltaic inverter adopting closed - loop internal circulation heat dissipation according to any one of claims 1 - 9, characterized in that: The inert gas is configured as helium gas.