High-heat-dissipation double-sided aluminum substrate and manufacturing method thereof, electronic equipment and storage medium

Abstract

The invention discloses a high-heat-dissipation double-sided aluminum substrate, a manufacturing method of the high-heat-dissipation double-sided aluminum substrate, electronic equipment and a storage medium, and relates to the technical field of packaging substrates. The method comprises the following steps: cutting to obtain an aluminum substrate; drilling the aluminum substrate for the first time to obtain a first through hole; filling the first through hole with first resin; isolation base plates are arranged on the periphery of the aluminum substrate, and a substrate to be pressed is formed; laminating prepregs and copper foils on the two surfaces of the substrate to be laminated through a laminating mechanism to form a packaging substrate; performing secondary drilling on the packaging substrate to form a second through hole penetrating through the first resin; carrying out primary electroplating copper deposition on the packaging substrate to enable the second through hole to form a conducting hole; filling second resin in the via hole, and carrying out secondary electroplating copper deposition on the packaging substrate; manufacturing a circuit on the surface of the copper foil; and the isolation area and the isolation base plate are cut off through CNC equipment. According to the method provided by the embodiment of the invention, the heat dissipation capability can be improved, and the requirements of high-power and high-current electronic products can be met.

Description

Technical Field

[0001] The present invention relates to the technical field of packaging substrates, and in particular to a double-sided aluminum substrate with high heat dissipation, a manufacturing method thereof, an electronic device, and a storage medium. Background Art

[0002] At present, with the development of the electronics industry, high-power and high-current electronic products are increasingly widely used, and the requirements for packaging substrates as carriers of electronic components are also getting higher and higher. One of the more important points is the requirement for their heat dissipation effect. Since the power and current of such electronic products are relatively large, they will generate relatively high heat. If the heat dissipation problem cannot be properly solved, it will greatly affect the performance of the products. Currently, the commonly used heat dissipation method is usually to embed copper blocks inside the FR4 packaging substrate and use the copper blocks for heat dissipation. Although this method has a certain heat dissipation effect, as the circuit design inside the packaging substrate becomes more and more dense and there are more and more electronic components, the generated heat is also increasing, and the heat dissipation efficiency of this method can no longer meet the requirements. Summary of the Invention

[0003] The present invention aims to at least solve one of the technical problems existing in the prior art. For this purpose, the present invention provides a double-sided aluminum substrate with high heat dissipation, a manufacturing method thereof, an electronic device, and a storage medium, which can improve the heat dissipation ability and meet the requirements of high-power and high-current electronic products.

[0004] On the one hand, a manufacturing method of a double-sided aluminum substrate with high heat dissipation according to an embodiment of the present invention includes the following steps:

[0005] Cut the aluminum substrate;

[0006] Perform a first drilling on the aluminum substrate to obtain a first through hole;

[0007] Fill a first resin into the first through hole;

[0008] Arrange isolation pads around the aluminum substrate to form a substrate to be laminated;

[0009] Laminating prepreg and copper foil on both sides of the substrate to be laminated through a laminating mechanism to form a packaging substrate; wherein, isolation areas adapted to the isolation pads are reserved around the copper foil;

[0010] Perform a second drilling on the packaging substrate to form a second through hole penetrating the first resin;

[0011] Perform a first electroplating copper deposition on the packaging substrate so that the second through hole forms a via hole;

[0012] Fill a second resin into the via hole and perform a second electroplating copper deposition on the packaging substrate;

[0013] Fabricate circuits on the surface of the copper foil;

[0014] Cut off the isolation area and the isolation backing plate through a CNC device.

[0015] According to some embodiments of the present invention, the process of laminating prepreg and copper foil on both sides of the substrate to be laminated through a lamination mechanism to form a package substrate includes:

[0016] Laminate a first prepreg and a first copper foil on the first surface of the substrate to be laminated;

[0017] Open a groove on the second surface of the aluminum substrate;

[0018] Set a composite heat-conducting material on the inner wall of the groove;

[0019] Laminate a second prepreg and a second copper foil on the second surface of the substrate to be laminated; the second prepreg is provided with a window adapted to the groove, and the second copper foil is provided with a heat-conducting bump embedded in the groove.

[0020] According to some embodiments of the present invention, the step of opening a groove on the second surface of the aluminum substrate includes:

[0021] Clean the aluminum substrate with a cleaning agent;

[0022] Uniformly coat the aluminum substrate with photoresist by spin coating;

[0023] Expose and develop the photoresist to form a window;

[0024] Immerse the aluminum substrate in an etching solution to etch and form the groove at the window;

[0025] Remove the photoresist.

[0026] According to some embodiments of the present invention, the method further includes:

[0027] Set a solder mask layer on the surface of the copper foil;

[0028] Open a window on the solder mask layer to form pads;

[0029] Perform electroplating gold treatment on the pads.

[0030] According to some embodiments of the present invention, the step of drilling the aluminum substrate once to obtain a first through hole includes:

[0031] Obtain a test sample;

[0032] Set multiple groups of deviation measurement target holes on the surface of the test sample;

[0033] Drill the test sample according to the preset drill tape coefficient to obtain a trial drill hole corresponding to the first group of the deviation measurement target holes;

[0034] When the deviation degree between the trial drill hole and the first group of the deviation measurement target holes exceeds the preset value, adjust the drill tape coefficient;

[0035] Drill the test sample according to the adjusted drill tape coefficient to obtain a trial drill hole corresponding to the next group of the deviation measurement target holes, and repeat this process until the deviation degree between the trial drill hole and the deviation measurement target holes of the current group is lower than the preset value, so as to obtain the final drill tape coefficient;

[0036] Obtain a drilling drill tape according to the final drill tape coefficient, and perform a first drilling on the aluminum substrate according to the drilling drill tape to obtain the first through hole;

[0037] Immerse the aluminum substrate in an alkaline cleaning solution for cleaning to remove aluminum chips.

[0038] According to some embodiments of the present invention, after manufacturing the circuit on the surface of the copper foil, it further includes:

[0039] Perform circuit AOI detection on the package substrate;

[0040] Drill target holes on the package substrate after detection.

[0041] According to some embodiments of the present invention, the lamination mechanism includes a frame, a lower lamination mechanism arranged on the surface of the frame, a lifting mechanism arranged on the frame and above the lower lamination mechanism, a blanking device arranged on one side of the lower lamination mechanism, the lifting mechanism is provided with a liftable upper lamination mechanism, the lower lamination mechanism is provided with a positioning groove, a jacking mechanism is arranged at the bottom of the positioning groove, and heating devices are arranged on both the upper lamination mechanism and the lower lamination mechanism; forming a package substrate by laminating a prepreg and a copper foil on both sides of the substrate to be laminated through the lamination mechanism includes:

[0042] After stacking the prepreg and the copper foil on both sides of the substrate to be laminated in sequence, place them in the positioning groove;

[0043] After the lifting mechanism drives the upper lamination mechanism to descend to a preset height, the upper lamination mechanism continues to descend until it contacts the lower lamination mechanism;

[0044] After the heating devices preheat the upper lamination mechanism and the lower lamination mechanism to a preset temperature, the upper lamination mechanism and the lower lamination mechanism are pressurized to a preset pressure to laminate the substrate to be laminated, the prepreg and the copper foil to form a package substrate;

[0045] After lamination, the temperature of the heating device gradually decreases. After the temperature reduction is completed, the upper lamination mechanism rises, and the lifting mechanism drives the upper lamination mechanism to reset;

[0046] The jacking mechanism pushes the packaging substrate to rise and leave the lower lamination mechanism, and the blanking device performs blanking on the packaging substrate.

[0047] On the other hand, the highly heat-dissipating double-sided aluminum substrate according to the embodiment of the present invention is manufactured by the manufacturing method of the highly heat-dissipating double-sided aluminum substrate in the above-mentioned embodiment.

[0048] On the other hand, an electronic device according to an embodiment of the present invention includes:

[0049] A memory for storing program instructions;

[0050] A processor for calling the program instructions stored in the memory and executing the manufacturing method of the highly heat-dissipating double-sided aluminum substrate as described above according to the obtained program instructions.

[0051] On the other hand, a storage medium according to an embodiment of the present invention stores computer-executable instructions, and the computer-executable instructions are used to cause a computer to execute the manufacturing method of the highly heat-dissipating double-sided aluminum substrate as described above.

[0052] The highly heat-dissipating double-sided aluminum substrate and its manufacturing method, electronic device, and storage medium according to the embodiment of the present invention have at least the following beneficial effects: By using an aluminum substrate instead of a traditional FR4 copper-clad substrate, it has better heat dissipation performance, and the aluminum substrate has high mechanical strength and is not easily bent, which can improve product quality and manufacturing yield and meet the requirements of high-power and high-current electronic products; By performing multiple drillings and multiple pluggings, the conduction of circuits on different layers can be achieved and the strength of the substrate can be ensured; By providing an isolation backing plate and an isolation area, it can play a better protective role for the aluminum substrate in the manufacturing process of the substrate.

[0053] The additional aspects and advantages of the present invention will be partly given in the following description, partly will become obvious from the following description, or will be understood through the practice of the present invention. Description of the Drawings

[0054] The above and / or additional aspects and advantages of the present invention will become obvious and easy to understand from the description of the embodiments in conjunction with the following drawings, where:

[0055] Figure 1 is a step flow chart of the manufacturing method of the highly heat-dissipating double-sided aluminum substrate according to the embodiment of the present invention;

[0056] Figure 2 is a structural schematic diagram of the aluminum substrate according to the embodiment of the present invention;

[0057] Figure 3 Structural schematic diagram of the substrate to be laminated according to an embodiment of the present invention;

[0058] Figure 4 Structural schematic diagram of the packaging substrate according to an embodiment of the present invention;

[0059] Figure 5 Structural schematic diagram of the packaging substrate after removing the isolation area and isolation backing plate according to an embodiment of the present invention;

[0060] Figure 6 Structural schematic diagram of the packaging substrate according to another embodiment of the present invention;

[0061] Figure 7 Structural schematic diagram of the lamination mechanism according to an embodiment of the present invention. Detailed implementation manners

[0062] The embodiments of the present invention will be described in detail below. The examples of the embodiments are shown in the accompanying drawings, where the same or similar reference numerals represent the same or similar elements or elements with the same or similar functions from beginning to end. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present application, and should not be construed as a limitation to the present application. For the step numbers in the following embodiments, they are only set for the convenience of description and illustration, and no limitation is imposed on the order between the steps. The execution order of each step in the embodiments can be adjusted adaptively according to the understanding of those skilled in the art.

[0063] In the description of the present invention, it should be understood that the orientation or positional relationship indicated by terms such as up, down, front, back, left, right, etc. is based on the orientation or positional relationship shown in the accompanying drawings, and is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be construed as a limitation to the present invention.

[0064] The terms "first", "second", "third", "fourth", etc. in the specification, claims and drawings of the present invention are used to distinguish different objects, rather than to describe a specific order. In addition, the terms "comprising" and "having" and any variations thereof are intended to cover non-exclusive inclusion. For example, a process, method, system, product or device that includes a series of steps or units is not limited to the listed steps or units, but may optionally further include steps or units not listed, or may optionally further include other steps or units inherent to these processes, methods, products or devices.

[0065] References to "embodiments" in this invention mean that the specific features, structures, or characteristics described in connection with the embodiments can be included in at least one embodiment of the invention. The phrase appears in various places in the specification and does not necessarily refer to the same embodiment, nor is it an independent or alternative embodiment mutually exclusive with other embodiments. Those skilled in the art will explicitly and implicitly understand that the embodiments described herein can be combined with other embodiments.

[0066] Currently, with the development of the electronics industry, high-power and high-current electronic products are increasingly widely used, and the requirements for packaging substrates, which are the carriers of electronic components, are also getting higher and higher. One of the more important points is the requirement for their heat dissipation effect. Since the power and current of such electronic products are relatively large, they will generate relatively high heat. If the heat dissipation problem cannot be properly solved, it will greatly affect the performance of the products. The heat dissipation methods currently used usually involve embedding copper blocks inside FR4 packaging substrates and using the copper blocks for heat dissipation. Although this method has a certain heat dissipation effect, as the circuit design inside the packaging substrate becomes more and more dense and there are more and more electronic components, the generated heat is also increasing, and the heat dissipation efficiency of this method can no longer meet the requirements.

[0067] Therefore, the embodiments of the present invention provide a double-sided aluminum substrate with high heat dissipation, its manufacturing method, an electronic device, and a storage medium. By using an aluminum substrate to replace the traditional FR4 copper-clad substrate, it has better heat dissipation performance, and the aluminum substrate has high mechanical strength and is not easily bent, which can improve the product quality and production yield and meet the requirements of high-power and high-current electronic products; by performing multiple drilling and multiple plugging, the conduction of circuits on different layers can be achieved and the strength of the substrate can be ensured; by setting isolation pads and isolation areas, it can play a better protective role for the aluminum substrate during the manufacturing process of the substrate.

[0068] The following will describe in detail the double-sided aluminum substrate with high heat dissipation, its manufacturing method, an electronic device, and a storage medium according to the embodiments of the present invention with reference to the accompanying drawings.

[0069] On the one hand, as Figure 1 shown, the manufacturing method of the double-sided aluminum substrate with high heat dissipation according to the embodiments of the present invention includes the following steps:

[0070] Step S100: Cut the aluminum substrate 100.

[0071] Specifically, as Figure 2As shown, the aluminum substrate 100 has opposite first surface 110 and second surface 120. When manufacturing a circuit board, first, the material is cut. According to the design dimensions, the required aluminum substrate 100 is prepared. Compared with the traditional FR4 copper-clad substrate, the aluminum substrate 100 has better heat dissipation ability and mechanical strength, which can significantly improve the heat dissipation ability of the subsequent circuit board and enhance the impact resistance of the circuit board, avoiding problems such as bending during the manufacturing process of the circuit board.

[0072] Step S200: Drill the aluminum substrate 100 once to obtain a first through-hole;

[0073] Specifically, mechanical drilling or laser drilling can be used to drill the aluminum substrate 100 to form a first through-hole. In this example, to improve the accuracy of drilling, the above step S200 includes the following steps:

[0074] Step S210: Obtain a test sample;

[0075] Step S220: Set multiple groups of deviation measurement target holes on the surface of the test sample;

[0076] Step S230: Perform a trial drill on the test sample according to the preset drill tape coefficient to obtain a trial drill hole corresponding to the first group of deviation measurement target holes;

[0077] Step S240: When the deviation degree between the trial drill hole and the first group of deviation measurement target holes exceeds the preset value, adjust the drill tape coefficient;

[0078] Step S250: According to the adjusted drill tape coefficient, perform a trial drill on the test sample to obtain a trial drill hole corresponding to the next group of deviation measurement target holes, and repeat this process until the deviation degree between the trial drill hole and the current group of deviation measurement target holes is lower than the preset value to obtain the final drill tape coefficient;

[0079] Step S260: Obtain a drilling drill tape according to the final drill tape coefficient, and perform a first drill on the aluminum substrate 100 according to the drilling drill tape to obtain a first through-hole;

[0080] Step S270: Immerse the aluminum substrate 100 in an alkaline cleaning solution for cleaning to remove aluminum chips.

[0081] Specifically, first, obtain a test template for testing the drilling accuracy. The material and characteristics of the test template are the same as those of the aluminum substrate 100. Set multiple groups of deviation-measuring target holes on the surface of the test template. It should be noted that the multiple groups of deviation-measuring target holes correspond to the first through-holes. Divide the multiple first through-holes into multiple groups, and each group of first through-holes has a corresponding group of deviation-measuring target holes. Then, perform a trial drill on the test template according to the preset drill tape coefficient to obtain the trial drill holes corresponding to the first group of deviation-measuring target holes. If the trial drill holes basically coincide with the deviation-measuring target holes, it indicates that the drill tape coefficient is accurate, and the current drill tape coefficient can be used to set the drilling drill tape and drill the aluminum substrate 100. If the deviation degree between the trial drill holes and the deviation-measuring target holes is large, it indicates that there is an error in the drill tape coefficient. It is necessary to adjust the drill tape coefficient according to the deviation between the trial drill holes and the deviation-measuring target holes, and continue to perform a trial drill on the next group of deviation-measuring target holes of the test template. Repeat this process until the trial drill holes basically coincide with the deviation-measuring target holes. At this time, the final drill tape coefficient can be determined. Finally, obtain the drilling drill tape according to the final drill tape coefficient, and perform a primary drill on the aluminum substrate 100 according to the drilling drill tape to obtain the first through-holes. After drilling, immerse the aluminum substrate 100 in an alkaline cleaning solution for cleaning to remove the aluminum chips generated by drilling. By first using the test template for trial drilling, determining the accurate drill tape coefficient, and then drilling the aluminum substrate 100, the drilling accuracy can be improved, the quality of the product can be guaranteed, and the yield of the product can be increased.

[0082] Step S300: Fill the first resin into the first through-holes;

[0083] Specifically, before filling the first resin, the first through-holes can be roughened first to enhance the adhesion between the first resin and the hole wall. Then, fill the first resin into the first through-holes by means of printing, pressure injection, vacuum filling, etc., to ensure that the first through-holes are completely filled. Then, harden the first resin by high-temperature baking to form a stable solid structure. Subsequently, grind the first resin to remove the part of the first resin that overflows the surface of the first through-holes. By filling the first resin into the first through-holes, the purpose of insulation can be achieved, and the strength of the substrate can be enhanced, avoiding the substrate from bending and deforming due to external forces. By filling the hole surface with resin, the multi-layer interconnection technology can be realized.

[0084] Step S400: Set the isolation pads 200 around the aluminum substrate 100 to form the substrate to be laminated 300;

[0085] Specifically, the isolation pads 200 can be set around the aluminum substrate 100 by means of bonding, etc., so that the isolation pads 200 can play a role in protecting the periphery of the aluminum substrate 100. Since the entire aluminum substrate 100 is made of aluminum material, when the aluminum substrate 100 is subsequently placed in liquids such as electroplating solution or etching solution, the isolation pads 200 can prevent the four side frames of the aluminum substrate 100 from reacting with the liquid, causing pollution or damage to the aluminum substrate 100.

[0086] Step S500: Press the prepreg 400 and copper foil 500 on both sides of the substrate 300 to be pressed through the pressing mechanism 700 to form the package substrate 600; wherein, an isolation area 510 adapted to the isolation spacer 200 is reserved around the copper foil 500.

[0087] Specifically, before pressing, the surfaces of the substrate 300 to be pressed and the copper foil 500 are pre-treated first. The pre-treatment steps include cleaning and removing impurities such as the oxide layer to improve the subsequent pressing effect. After the pre-treatment is completed, as Figure 4 shown, the aluminum substrate 100, prepreg 400, and copper foil 500 are stacked in sequence, and then the aluminum substrate 100, prepreg 400, and copper foil 500 are pressed through the pressing mechanism 700 to form the package substrate 600. It should be noted that an isolation area 510 adapted to the isolation spacer 200 is reserved around the copper foil 500. In the subsequent process, the isolation area 510 needs to be removed and does not need to participate in the circuit manufacturing.

[0088] Step S600: Perform secondary drilling on the package substrate 600 to form a second through-hole penetrating the first resin.

[0089] Specifically, since the first through-hole is filled with the first resin and is an insulating hole, it cannot conduct the circuits on the upper and lower surfaces of the package substrate 600. Therefore, in order to realize the conduction of the circuits on different layers of the package substrate 600, it is necessary to perform secondary drilling on the package substrate 600 on the basis of the first through-hole to penetrate the copper foil 400 and the first resin to form the second through-hole.

[0090] Step S700: Perform primary electroplating copper deposition on the package substrate 600 to make the second through-hole become a via hole.

[0091] By performing electroless copper deposition on the package substrate 600, a layer of electroless copper is attached to the inner wall of the second through-hole to provide a conductive basis for subsequent electroplating, and then electroplating is performed on the package substrate 600 to realize the metallization of the second through-hole and obtain a via hole.

[0092] Step S800: Fill the via hole with the second resin and perform secondary electroplating copper deposition on the package substrate 600.

[0093] Specifically, the second resin is filled into the vias by means of printing, pressure injection, vacuum filling, etc., to ensure that the vias are completely filled. Then, the second resin is hardened by high-temperature baking to form a stable solid structure. Subsequently, the second resin is ground to remove the part that overflows the surface of the vias. By filling the vias with the second resin, the strength of the packaging substrate 600 can be enhanced, preventing the packaging substrate 600 from bending and deforming due to external forces. By filling the holes with resin, multi-layer interconnection technology is achieved, facilitating the production of fine lines.

[0094] Step S900: Fabricate a circuit on the surface of the copper foil 500.

[0095] Specifically, a photosensitive dry film is attached to the surface of the copper foil 500, and then the photosensitive dry film is exposed and developed to form a circuit pattern. Then, the copper foil 500 is etched according to the circuit pattern to form a circuit on the surface of the copper foil 500. Among them, the vias are used to connect the circuits on the upper and lower surfaces of the packaging substrate 600.

[0096] Step S1000: Cut the isolation area 510 and the isolation spacer 200 by a CNC device.

[0097] Specifically, as Figure 5 shown, after cutting the isolation area 510 and the isolation spacer 200 by a cutting device, the final required circuit board is obtained.

[0098] According to the method for manufacturing a high-heat-dissipating double-sided aluminum substrate of an embodiment of the present invention, by using the aluminum substrate 100 to replace the traditional FR4 copper-clad substrate, it has better heat dissipation performance, and the aluminum substrate 100 has high mechanical strength and is not easy to bend, which can improve the product quality and production yield and meet the requirements of high-power and high-current electronic products. By performing multiple drilling and multiple plugging of holes, the conduction of circuits on different layers can be achieved, and the strength of the substrate can be ensured. By providing the isolation spacer 200 and the isolation area 510, the aluminum substrate 100 can be better protected during the manufacturing process of the substrate.

[0099] Furthermore, as Figure 6 shown, in some embodiments of the present application, the above step S500: The step of forming the packaging substrate 600 by pressing the prepreg 400 and the copper foil 500 on both sides of the substrate 300 to be pressed by the pressing mechanism 700 includes the following steps:

[0100] Step S510: Press the first prepreg 410 and the first copper foil 530 on the first surface 110 of the substrate 300 to be pressed.

[0101] Step S520: Open a groove on the second surface 120 of the aluminum substrate 100.

[0102] Step S530: Set the composite heat-conducting material 130 on the inner wall of the groove;

[0103] Step S540: Press the second prepreg 420 and the second copper foil 540 on the second surface 120 of the substrate 300 to be pressed; The second prepreg 420 is provided with a window adapted to the groove, and the second copper foil 540 is provided with a heat-conducting bump 520 adapted to the groove.

[0104] Specifically, first, a groove is formed on the second surface 120 of the aluminum substrate 100, and the composite heat-conducting material 130 is set on the inner wall of the groove, so that the composite heat-conducting material can enhance the heat conductivity and prevent the aluminum substrate 100 from directly contacting with the heat-conducting bump 520 to cause reaction. By providing the heat-conducting bump 520 on the second copper foil, when pressing, the heat-conducting bump 520 can be embedded into the groove, so that the heat-conducting bump 520 contacts the aluminum substrate 100 through the composite heat-conducting material 130, thereby further enhancing the heat dissipation performance and efficiency of the package substrate 600.

[0105] In this example, in order to form a groove on the second surface of the aluminum substrate 100, the following four steps are included:

[0106] (1) Clean the aluminum substrate 100 with a cleaning agent;

[0107] (2) Uniformly coat the photoresist on the aluminum substrate 100 by spin coating;

[0108] (3) Expose and develop the photoresist to form a window;

[0109] (4) Immerse the aluminum substrate 100 in the etching solution to etch and form a groove at the window;

[0110] (5) Remove the photoresist.

[0111] Specifically, first, use a cleaning agent to remove the grease and oxides on the aluminum substrate 100, then rinse the aluminum substrate 100 with deionized water and dry it. Then, by spin coating, uniformly coat the photoresist on the surface of the aluminum substrate 100 to ensure uniform coating thickness. Then expose and develop the photoresist to form a window at the position where the groove is to be formed, and protect the positions where the groove is not to be formed through the photoresist. Then immerse the aluminum substrate 100 in the etching solution, and control the etching time to adjust the depth of the groove. The longer the time, the greater the depth. After etching, take out the aluminum substrate 100 and rinse it with deionized water, and then use an appropriate solvent to remove the remaining photoresist protection layer.

[0112] Furthermore, in some embodiments of the present application, after making the circuit on the surface of the copper foil 500, it further includes:

[0113] Perform circuit AOI inspection on the package substrate 600;

[0114] Drill target holes in the encapsulated substrate 600 after detection.

[0115] By performing line AOI detection on the encapsulated substrate 600, it is possible to detect whether there are problems with the lines, remove the products with problems, and prevent defective products from flowing out. Then, drill target holes in the detected encapsulated substrate 600 to facilitate subsequent processes to position the encapsulated substrate 600 through the target holes.

[0116] Furthermore, in some embodiments of the present application, the method for manufacturing a highly heat-dissipating double-sided aluminum substrate further includes the following steps:

[0117] Set a solder mask layer on the surface of the copper foil 500;

[0118] Open windows in the solder mask layer to form solder pads;

[0119] Perform electroplating with gold on the solder pads.

[0120] Specifically, the solder mask layer can prevent the areas that do not need to be soldered from being accidentally soldered during the soldering process, preventing short circuits and protecting circuit components; at the same time, the solder mask layer can protect the copper layer from oxidation and corrosion, extending the service life of the circuit board. To set the solder mask layer, the solder mask ink can be coated and UV-cured to form the solder mask layer. After forming the solder mask layer, it is also necessary to open windows in the solder mask layer through processes such as laminating, exposure, and development to expose the positions of the solder pads. To prevent oxidation of the solder pad surface, it is also necessary to electroplate with gold on the surface of the solder pad to protect the solder pad, reduce wear and damage of the solder pad during the soldering process, and extend the service life of the solder pad. After soldering mask, characters can also be set on the encapsulated substrate 600, and processes such as lead-free solder spraying can be performed. Finally, the encapsulated substrate 600 is cut, formed, finally tested, and packaged for storage.

[0121] Furthermore, as Figure 7 shown, in some embodiments of the present invention, the lamination mechanism 700 includes a frame 710, a lower lamination mechanism 720 disposed on the surface of the frame 710, a lifting mechanism 730 disposed on the frame 710 and above the lower lamination mechanism 720. The lifting mechanism 730 is provided with a liftable upper lamination mechanism 740. A positioning groove 750 is provided in the lower lamination mechanism 720, and a jacking mechanism 760 is provided at the bottom of the positioning groove 750. Both the upper lamination mechanism 740 and the lower lamination mechanism 720 are provided with heating devices 770. A blanking device (not shown in the figure) is provided on one side of the lower lamination mechanism 720. The above step S400: Laminating the prepreg 400 and the copper foil 500 on both sides of the substrate 300 to be laminated through the lamination mechanism 700 to form the encapsulated substrate 600, including:

[0122] After stacking the prepreg 400 and the copper foil 500 on both sides of the substrate 300 to be laminated in sequence, place them in the positioning groove 750;

[0123] After the lifting mechanism 730 drives the upper lamination mechanism 740 to descend to a preset height, the upper lamination mechanism 740 continues to descend until it contacts the lower lamination mechanism 720;

[0124] After the heating device 770 pre-heats the upper lamination mechanism 740 and the lower lamination mechanism 720 to a preset temperature, the upper lamination mechanism 740 and the lower lamination mechanism 720 are pressurized to a preset pressure to laminate the substrate 300 to be laminated, the prepreg 400 and the copper foil 500, forming the encapsulated substrate 600;

[0125] After lamination, after the heating device 770 gradually reduces the temperature, the upper lamination mechanism 740 rises, and the lifting mechanism 730 drives the upper lamination mechanism 740 to reset;

[0126] The jacking mechanism 760 pushes the encapsulated substrate 600 to rise and leave the lower lamination mechanism 720, and the blanking device blanks the second substrate 500.

[0127] Specifically, in this example, the lifting mechanism 730 includes a lifting rod 731, a lead screw 732, and a driver 733. The lifting rod 731 is threadedly connected to the lead screw 732, and the driver 733 is used to drive the lead screw 732 to rotate, thereby driving the lifting rod 731 to rise or fall. When lamination is to be performed, the lifting rod 731 descends a certain height and then remains stationary, while the upper lamination mechanism 740 continues to descend until it contacts the lower lamination mechanism 720 for lamination. It should be noted that the upper lamination mechanism 740 is also provided with a telescopic air rod for driving the lifting of the upper lamination mechanism 740. During lamination, the heating device 770 pre-heats the upper lamination mechanism 740 and the lower lamination mechanism 720 to a preset temperature, causing the prepreg 400 to soften, and then applying high pressure to make it flow and fill the voids, maintaining a high temperature until the prepreg 400 is completely cured. Subsequently, the temperature is slowly reduced to prevent internal stress. After the temperature drops to a certain extent, the upper lamination mechanism 740 rises, and the lifting mechanism 730 drives the upper lamination mechanism 740 to reset; then, the jacking mechanism 760 pushes the encapsulated substrate 600 away from the lower lamination mechanism 720, facilitating the blanking device to blank the encapsulated substrate 600. The blanking device may include a moving mechanism, a suction cup, and a blanking platform. When blanking is to be performed, the moving mechanism drives the suction cup to move above the positioning groove, then drives the suction cup to descend to adsorb the encapsulated substrate 600, and then the moving mechanism drives the suction cup to move to the blanking platform for blanking.

[0128] On the other hand, the embodiment of the present invention also proposes a highly heat-dissipating double-sided aluminum substrate, which is manufactured by the manufacturing method of the highly heat-dissipating double-sided aluminum substrate described in the above embodiment.

[0129] The double-sided aluminum substrate with high heat dissipation according to the embodiments of the present invention uses the aluminum substrate 100 to replace the traditional FR4 copper-clad substrate, has better heat dissipation performance, and the aluminum substrate 100 has high mechanical strength and is not easily bent, which can improve the product quality and production yield and meet the requirements of high-power and high-current electronic products; by performing multiple drilling and multiple plugging, the conduction of circuits on different layers can be achieved and the strength of the substrate can be ensured; by providing the isolation backing plate 200 and the isolation area 510, the aluminum substrate 100 can be well protected during the substrate manufacturing process.

[0130] It should be noted that the content in the above method embodiments is applicable to this embodiment. The functions specifically implemented in this embodiment are the same as those in the above method embodiments, and the beneficial effects achieved are also the same as those achieved in the above method embodiments.

[0131] On the other hand, the embodiments of the present invention also propose an electronic device, including:

[0132] A processor, which can be implemented by using a general-purpose central processing unit (CPU), a microprocessor, an application-specific integrated circuit (ASIC), or one or more integrated circuits, etc., and is used to execute relevant programs to implement the technical solutions provided in the embodiments of the present application;

[0133] A memory, which can be implemented in the form of a read-only memory (ROM), a static storage device, a dynamic storage device, or a random access memory (RAM), etc. The memory can store an operating system and other application programs. When implementing the technical solutions provided in the embodiments of this specification through software or firmware, the relevant program codes are stored in the memory and are called by the processor to execute the manufacturing method of the double-sided aluminum substrate with high heat dissipation in the embodiments of the present application.

[0134] The embodiments of the present application also provide a storage medium, which is a computer-readable storage medium. The storage medium stores a computer program, and when the computer program is executed by a processor, it implements the above-mentioned manufacturing method of the double-sided aluminum substrate with high heat dissipation.

[0135] As a non-transitory computer-readable storage medium, the memory can be used to store non-transitory software programs and non-transitory computer-executable programs. In addition, the memory may include high-speed random access memory, and may also include non-transitory memory, such as at least one magnetic disk storage device, a flash memory device, or other non-transitory solid-state storage devices. In some embodiments, the memory may optionally include a memory remotely disposed relative to the processor, and these remote memories can be connected to the processor through a network. Examples of the above networks include, but are not limited to, the Internet, an intranet, a local area network, a mobile communication network, and combinations thereof. The device embodiments described above are merely illustrative, where the units described as separate components may or may not be physically separated, and may be located in one place, or may also be distributed to multiple network units. Some or all of the modules can be selected according to actual needs to achieve the purpose of the solution of this embodiment.

[0136] Those of ordinary skill in the art can understand that all or some of the steps and systems disclosed above can be implemented as software, firmware, hardware, and appropriate combinations thereof. Some or all of the physical components can be implemented as software executed by a processor, such as a central processing unit, a digital signal processor, or a microprocessor, or can be implemented as hardware, or can be implemented as an integrated circuit, such as an application-specific integrated circuit. Such software can be distributed on a computer-readable medium, which can include a computer storage medium (or non-transitory medium) and a communication medium (or transitory medium). As is well known to those of ordinary skill in the art, the term computer storage medium includes volatile and non-volatile, removable and non-removable media implemented in any method or technology for storing information, such as computer-readable instructions, data structures, program modules, or other data. Computer storage media includes, but is not limited to, RAM, ROM, EEPROM, flash memory or other memory technologies, CD-ROM, digital versatile disk (DVD) or other optical disk storage, magnetic cassettes, tapes, magnetic disk storage or other magnetic storage devices, or any other medium that can be used to store the desired information and can be accessed by a computer. In addition, as is well known to those of ordinary skill in the art, a communication medium generally includes computer-readable instructions, data structures, program modules, or other data in a modulated data signal such as a carrier wave or other transmission mechanism, and can include any information delivery medium.

[0137] The above is a specific description of the preferred embodiments of the present invention, but the present invention is not limited to the above embodiments. Those skilled in the art can also make various equivalent deformations or substitutions without departing from the spirit of the present invention, and these equivalent deformations or substitutions are all included within the scope defined by the claims of the present invention.

Claims

1. A manufacturing method of a double-sided aluminum substrate with high heat dissipation, characterized in that It includes the following steps: Cut the aluminum substrate to obtain it; Drill the aluminum substrate once to obtain the first through hole; Fill the first resin into the first through hole; Set isolation pads around the aluminum substrate to form a substrate to be laminated; Press the prepreg and copper foil on both sides of the substrate to be laminated through a pressing mechanism to form a packaged substrate; wherein, isolation areas adapted to the isolation pads are reserved around the copper foil; Drill the packaged substrate a second time to form a second through hole penetrating the first resin; Perform first electroplating copper deposition on the packaged substrate so that the second through hole forms a via hole; Fill the second resin into the via hole and perform second electroplating copper deposition on the packaged substrate; Fabricate circuits on the surface of the copper foil; Cut the isolation areas and the isolation pads through a CNC device.

2. The manufacturing method of the double-sided aluminum substrate with high heat dissipation according to claim 1, characterized in that The step of pressing the prepreg and copper foil on both sides of the substrate to be laminated through a pressing mechanism to form a packaged substrate includes: Press the first prepreg and the first copper foil on the first surface of the substrate to be laminated; Open a groove on the second surface of the aluminum substrate; Set a composite heat-conducting material on the inner wall of the groove; Press the second prepreg and the second copper foil on the second surface of the substrate to be laminated; the second prepreg is provided with a window adapted to the groove, and the second copper foil is provided with heat-conducting bumps embedded in the groove.

3. The manufacturing method of the double-sided aluminum substrate with high heat dissipation according to claim 2, characterized in that The step of opening a groove on the second surface of the aluminum substrate includes: Clean the aluminum substrate with a cleaning agent; Uniformly coat the aluminum substrate with photoresist by spin coating; Expose and develop the photoresist to form a window; Immerse the aluminum substrate in an etching solution to etch and form the groove at the window; Remove the photoresist.

4. The manufacturing method of the double-sided aluminum substrate with high heat dissipation according to claim 1, wherein The method further includes: Set a solder mask layer on the surface of the copper foil; Open a window on the solder mask layer to form a pad; Perform electroplating gold treatment on the pad.

5. The manufacturing method of the double-sided aluminum substrate with high heat dissipation according to claim 1, characterized in that The step of drilling the aluminum substrate once to obtain the first through hole includes: Obtain a test sample; Set multiple groups of deviation measurement target holes on the surface of the test sample; Drill the test sample according to a preset drill tape coefficient to obtain a trial drill hole corresponding to the first group of the deviation measurement target holes; When the deviation degree between the trial drill hole and the first group of the deviation measurement target holes exceeds a preset value, adjust the drill tape coefficient; Drill the test sample according to the adjusted drill tape coefficient to obtain a trial drill hole corresponding to the next group of the deviation measurement target holes, and repeat this process until the deviation degree between the trial drill hole and the deviation measurement target holes of the current group is lower than the preset value to obtain the final drill tape coefficient; Obtain a drilling drill tape according to the final drill tape coefficient and drill the aluminum substrate once according to the drilling drill tape to obtain the first through hole; Immerse the aluminum substrate in an alkaline cleaning solution for cleaning to remove aluminum chips.

6. The manufacturing method of the double-sided aluminum substrate with high heat dissipation according to claim 1, characterized in that, After fabricating the circuits on the surface of the copper foil, it further includes: Perform circuit AOI detection on the packaged substrate; Make target holes on the packaged substrate after detection.

7. The manufacturing method of the double-sided aluminum substrate with high heat dissipation according to claim 1, characterized in that, The lamination mechanism includes a frame, a lower lamination mechanism disposed on the surface of the frame, a lifting mechanism disposed on the frame and above the lower lamination mechanism, and a blanking device disposed on one side of the lower lamination mechanism. The lifting mechanism is provided with a liftable upper lamination mechanism. A positioning groove is provided in the lower lamination mechanism, and a jacking mechanism is provided at the bottom of the positioning groove. Heating devices are provided on both the upper lamination mechanism and the lower lamination mechanism; The process of forming a packaged substrate by laminating a prepreg and a copper foil on both sides of the substrate to be laminated by the lamination mechanism includes: After stacking the prepreg and the copper foil on both sides of the substrate to be laminated in sequence, place them in the positioning groove; After the lifting mechanism drives the upper lamination mechanism to descend to a preset height, the upper lamination mechanism continues to descend until it contacts the lower lamination mechanism; After the heating devices preheat the upper lamination mechanism and the lower lamination mechanism to a preset temperature, the upper lamination mechanism and the lower lamination mechanism are pressurized to a preset pressure to laminate the substrate to be laminated, the prepreg and the copper foil to form a packaged substrate; After lamination, the heating devices gradually reduce the temperature. After the temperature reduction is completed, the upper lamination mechanism rises, and the lifting mechanism drives the upper lamination mechanism to return to its original position; The jacking mechanism pushes the packaged substrate to rise and leave the lower lamination mechanism, and the blanking device blanks the packaged substrate.

8. A double-sided aluminum substrate with high heat dissipation, characterized in that, It is made by the method for manufacturing a highly heat-dissipating double-sided aluminum substrate according to any one of claims 1-7.

9. An electronic device, characterized in that, It includes: A memory for storing program instructions; A processor for calling the program instructions stored in the memory and executing the method for manufacturing a highly heat-dissipating double-sided aluminum substrate according to any one of claims 1-7 according to the obtained program instructions.

10. A storage medium, characterized in that, The storage medium stores computer-executable instructions for causing a computer to execute the method for manufacturing a highly heat-dissipating double-sided aluminum substrate according to any one of claims 1-7.

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