Primary polishing and sorting device and method for wafer silicon wafers

Abstract

The invention discloses a primary polishing and sorting device and method for a wafer silicon wafer, and relates to the technical field of wafer silicon wafer manufacturing, and the primary polishing and sorting device and method comprises the following steps: S1, manually placing a wafer silicon wafer body into a polishing structure; s2, a rotating column drives conical teeth to rotate so as to carry out primary grinding on the wafer silicon wafer body; s3, manually separating the polishing structure to take out the wafer silicon wafer body; s4, the wafer silicon wafer body is conveyed to a conveying belt; s5, an infrared induction device detects the polishing condition of the wafer silicon wafer body; s6, after the detection is completed, performing different operations on the uniformly polished and non-uniformly polished wafer silicon wafer bodies; and S7, finally separating out the polished wafer silicon wafer body and the polished wafer silicon wafer body. Through the first abutting rod and the second abutting rod, manual intervention or complex sensor detection is not needed, and the whole operation process is simplified. Sorting is completed depending on physical conflict and gravity sliding, frequent manual operation or an electronic sensor is not needed, and the risk of human errors is reduced.

Description

Technical Field

[0001] The present invention relates to the technical field of wafer silicon manufacturing, and particularly relates to a device and method for initial grinding and sorting of wafer silicon. Background Art

[0002] Wafer silicon is the core raw material in the semiconductor manufacturing process. It is a circular semiconductor substrate, usually made of single crystal silicon. The purity, surface flatness, cleanliness, and impurity contamination of wafer silicon have extremely important impacts on chips, so its manufacturing process is extremely important. The processing flow of wafer silicon usually includes multiple steps such as cutting, grinding, polishing, and cleaning. Among these steps, initial grinding is a key link, which directly affects the surface quality of the wafer silicon and the subsequent processing efficiency. The main function of the initial grinding device is to perform preliminary mechanical treatment on the wafer silicon to remove defects such as saw marks and damaged layers generated by the cutting process on the wafer surface, and at the same time reduce the surface roughness, laying a foundation for subsequent fine processing steps such as polishing.

[0003] However, the existing wafer silicon grinding devices can usually only grind one side surface of the wafer and cannot process both side surfaces simultaneously, which greatly reduces the grinding efficiency. Moreover, during the grinding process, due to various reasons, the grinding may not be perfect. Single-sided grinding requires more time to complete the grinding process of the entire wafer, which directly leads to an increase in production costs. Because it takes longer to complete the grinding of the same batch of wafers, the utilization rate of the equipment is reduced, and at the same time, the labor and energy costs will also increase accordingly. And imperfect grinding will cause defects such as scratches and pits on the wafer surface, and these defects will be magnified during the subsequent chip manufacturing process, ultimately leading to a decline in chip performance.

[0004] There are relevant invention patents related to wafer silicon grinding, as follows: Chinese Patent Application No.: CN202410029926.7, Invention Patent Name: A Thinning Device for Wafer Silicon. This invention relates to the technical field of wafer thinning, and particularly relates to a thinning device for wafer silicon, including a bottom bracket. The top outer wall of the bottom bracket is fixedly connected with a middle bracket, and the top outer wall of the middle bracket is fixedly connected with a top bracket. A wafer is movably connected to the inner wall of each second sliding seat. A conveying device is arranged on the side of the first threaded rod away from the first sliding frame. A rotary cutting device is arranged on the bottom outer wall of the second rack. A first sliding rod is fixedly connected to the end of the third rack away from the second motor. A material taking device is arranged on the outer wall of the second sliding rod. A tape sticking device is arranged on the outer wall of the first sliding rod. This invention can perform tape sticking protection on the front surface of the wafer while taking materials, automatically cut the adhesive tape, and the cutting effect is good without adhesion or failure to cut, and at the same time can thin and grind the wafer to achieve automatic feeding.

[0005] However, in the above-mentioned existing patents, although it is possible to perform glue pasting protection on the front side of the wafer and at the same time thin and polish the wafer, there are still cases where only one side surface of the wafer can be polished, and during the initial polishing of the wafer, there are wafer silicon wafers that are not completely polished. At the same time, they enter the next process together with the completely polished wafer silicon wafers. The uncompletely polished wafer may require a longer polishing time in chemical mechanical polishing, and excessive polishing will damage the shallow structure. The uneven surface will also cause inconsistent etching rates, affecting the device size control. Summary of the Invention

[0006] The purpose of the present application is to provide an initial polishing and sorting device and method for wafer silicon wafers, which are used to solve the problem that the existing technology can only polish one side surface of the wafer and there are wafer silicon wafers that are not completely polished, and at the same time enter the next process together with the completely polished wafer silicon wafers.

[0007] An initial polishing and sorting device for wafer silicon wafers includes a frame body and a wafer silicon wafer body. A transmission groove is opened inside the frame body. Two rotating columns are symmetrically and rotatably connected inside the transmission groove. Two transmission belts are symmetrically meshed on the outer surfaces of the rotating columns. The top of the transmission belt is provided with an upper polishing block and a lower polishing block. The wafer silicon wafer body is arranged in the middle of the upper polishing block and the lower polishing block. The upper polishing block and the lower polishing block are used to polish the wafer silicon wafer body. The rotating columns and the transmission belts are used to transmit after the wafer silicon wafer body is polished. Thus, both sides of the wafer silicon wafer body can be polished simultaneously.

[0008] As a further improvement of the present invention, connecting rods are fixedly connected to the top of the upper polishing block and the bottom of the lower polishing block. Gripping rods are fixedly connected to the sides of the connecting rods away from the center of the frame body. Gripping handles are fixedly connected to the ends of the gripping rods away from the connecting rods. A series of telescopic rods are arranged inside the mutually corresponding sides of the two connecting rods. Supporting telescopic rods and springs are fixedly connected to the sides of the two connecting rods away from each other. The springs are arranged outside the supporting telescopic rods. Thus, the upper polishing block and the lower polishing block can clamp the wafer silicon wafer body.

[0009] As a further improvement of the present invention, sliding grooves are opened in the frame body at the positions of the gripping rods. The ends of the supporting telescopic rods and the springs away from the connecting rods are fixedly connected to the surfaces of the sliding grooves. Two semi-circular fixing frames are fitted and clamped to the outside of the wafer silicon wafer body. Tapered teeth are fixedly connected to the sides of the outer surfaces of the semi-circular fixing frames away from the wafer silicon wafer body. Fitting fixing grooves are opened on the sides of the semi-circular fixing frames close to the wafer silicon wafer body. The shape of the fitting fixing grooves completely fits the wafer silicon wafer body. Thus, while protecting the outer ring of the wafer silicon wafer body, it can also drive the wafer silicon wafer body to rotate and polish.

[0010] As a further improvement of the present invention, a transmission chain is meshed outside the rotating column near one side of the semi-circular fixed frame. An engaging wheel is meshed at the inner top end of the transmission chain. A conical wheel is fixedly connected to the side of the engaging wheel close to the semi-circular fixed frame. The conical wheel is meshed with a conical tooth. A fixed rod is rotatably connected to the side of the engaging wheel away from the conical wheel. One end of the fixed rod away from the engaging wheel is fixedly connected to the side of the frame body. Thus, grinding can be driven by the rotation of the rotating column.

[0011] As a further improvement of the present invention, a fixed column is fixedly connected to the middle of the frame body. A sliding ladder one is fixedly connected to the side of the fixed column away from the frame body. A contact rod one is fixedly connected to the inner side of the frame body at the top end of the sliding ladder one. A sorting groove is fixedly connected to the side of the frame body bottom away from the rotating column. Thus, the wafer silicon sheet body that is completely ground and incompletely ground can be separated and collected.

[0012] As a further improvement of the present invention, a sliding ladder two is fixedly connected to the inner side of the frame body near the upper grinding block. A clamping hole is opened at the bottom end of the transmission groove where the transmission belt is located. A contact rod two is fixedly connected to the side of the frame body away from the sorting groove at the bottom end of the upper grinding block. Thus, after the wafer silicon sheet body is ground, it can be tilted and slide onto the surface of the transmission belt from the sliding ladder two.

[0013] As a further improvement of the present invention, a connecting line is arranged inside the clamping hole. One top end of the connecting line is fixedly connected with an infrared sensing device. The infrared sensing device is fixedly connected to the top surface of the transmission groove. One end of the connecting line away from the infrared sensing device is fixedly connected with a telescopic motor at the top. The output end of the telescopic motor is fixedly connected with an electric telescopic rod. The top end of the electric telescopic rod is fixedly connected with an attaching block. Thus, the grinding condition of the wafer silicon sheet body can be detected.

[0014] A grinding and sorting method for a wafer silicon sheet, the specific steps include: S1, Manually place the wafer silicon sheet body into the grinding structure; S2, The rotating column drives the conical tooth to rotate to perform primary grinding on the wafer silicon sheet body; S3, Manually separate and take out the wafer silicon sheet body from the grinding structure; S4, Transfer the wafer silicon sheet body to the transmission belt; S5, The infrared sensing device detects the grinding condition of the wafer silicon sheet body; S6, After the detection, different operations are performed on the wafer silicon sheet bodies with uniform and non-uniform grinding; S7, Finally, the wafer silicon sheet bodies with good and bad grinding are separated.

[0015] As a further improvement of the present invention, in the steps S1 - S2, the placement is carried out by an operator wearing an anti - static suit to place the wafer silicon body between two semi - circular fixing frames. The wafer silicon body is fixed by fitting into the fitting fixing groove. Then, the semi - circular fixing frame and the wafer silicon body are simultaneously placed on the top of the lower grinding block. The elastic force of the spring is used to fix the wafer silicon body. The conical wheel rotates to drive the conical tooth to rotate, and the rotation of the conical tooth drives the wafer silicon body to rotate and grind inside the upper grinding block and the lower grinding block. Thus, the wafer silicon body can be ground effectively.

[0016] As a further improvement of the present invention, in the steps S5 - S7, the infrared sensing device detects the wafer silicon body. When the infrared sensing device detects that the wafer silicon body is not completely ground, it starts the telescopic motor through the connecting wire. The telescopic motor is used to control the telescopic movement of the electric telescopic rod. The telescopic movement of the electric telescopic rod drives the attachment block to move upward. At this time, the wafer silicon body will just move to the top of the attachment block. The upward movement of the attachment block drives the wafer silicon body to move into the first sliding ladder. The sorting groove is used to collect the intact and non - intact wafer silicon bodies. Thus, the intact and non - intact wafer silicon bodies after grinding can be separately collected.

[0017] Compared with the prior art, the beneficial effects of the present invention are as follows: Through the rotating column, conical wheel, conical tooth, upper grinding block and lower grinding block, the rotation of the rotating column drives the conical wheel to rotate through the transmission chain. Due to the meshing of the conical wheel and the conical tooth, the rotation of the conical tooth can be driven simultaneously by the rotation of the rotating column. Due to the fixation of the wafer silicon body by the upper grinding block and the lower grinding block, the rotation of the conical tooth and the fixation of the upper grinding block and the lower grinding block cause the friction between the wafer silicon body and the upper grinding block and the lower grinding block to grind the upper and lower ends of the wafer silicon body. Thus, the effect of grinding both sides of the wafer silicon body simultaneously is achieved. The double - side synchronous processing can eliminate the "memory effect" caused by single - side grinding, make the surface roughness of both surfaces of the wafer silicon body more uniform, and the double - side uniform stress can avoid unilateral stress concentration and reduce the surface defect density. The double - side grinding is completed in a single process, reducing the auxiliary time such as wafer flipping and loading / unloading, and significantly improving the equipment throughput. The flat surface after double - side grinding can reduce the polishing pressure and time of the CMP step and avoid over - polishing damage to the shallow trench isolation structure.

[0018] Through the semi-circular fixing frame, conical teeth, fitting fixing groove and the wafer silicon body, the two semi-circular fixing frames are fitted together, so that the fitting fixing groove opened inside the semi-circular fixing frame adheres to and fixes the wafer silicon body, thus achieving the effect of fixing the wafer silicon body. And through the design of conical teeth, it can mesh and rotate with the conical wheel. At the same time, through the semi-circular fixing frame designed around the wafer silicon body, it can also play an anti-collision protection effect during the transmission of the wafer silicon body. Direct contact transmission may cause surface scratches on the wafer silicon body due to particles or mechanical vibration. The non-contact design of the semi-circular fixing frame combined with airflow control reduces the surface scratch density by more than 90%, ensuring the integrity of the metal wiring layer. Moreover, impact is likely to cause the wafer silicon body to break. Through the protection of the semi-circular fixing frame, the risk of the wafer silicon body being broken by impact can be reduced. The wafer silicon body is thin and brittle, and direct impact may cause hidden cracks or structural defects. Through the flexible buffer design of the semi-circular fixing frame, local stress can be dispersed, thus preventing damage caused by vibration or misoperation.

[0019] Through the first abutting rod and the second abutting rod, when the wafer silicon body is polished and needs to be moved onto the surface of the conveyor belt, at this time, control the upper polishing block and the lower polishing block to separate. Due to the horizontal design of the upper polishing block and the lower polishing block, the wafer silicon body cannot be tilted. When the lower polishing block drives the wafer silicon body to move to the second abutting rod, at this time, a resistance will be applied to the bottom end of the wafer silicon body, so that the front end and the rear end of the wafer silicon body are tilted, and then it just slides onto the surface of the conveyor belt through the second sliding ladder. When it is necessary to separate the wafer silicon body with imperfect polishing, control the wafer silicon body to move upward, and the front end of the wafer silicon body will be abutted by the first abutting rod, so that the wafer silicon body is tilted, and thus the wafer silicon body will slide down along the first sliding ladder, thereby achieving the effect of separating the intact and imperfect wafer silicon bodies. When the lower polishing block drives the wafer to move to the second abutting rod, the tilting action caused by the bottom abutment is precisely controlled by the mechanical limit of the second sliding ladder, so that the wafer silicon body slides smoothly into the target conveyor belt, thus avoiding the risk of free fall or collision. And the secondary tilt triggered by the abutment with the first abutting rod after moving upward and sliding down along the first sliding ladder to the recovery path, without manual intervention or complex sensor detection, will achieve the simplification of the overall operation process. Relying on physical abutment and gravity sliding to complete sorting, without frequent manual operation or electronic sensors, will reduce the risk of human error. The sorting logic is based on the cooperation of the self-gravity of the wafer silicon body and the mechanical structure, reducing the dependence on precise control systems or optical detection equipment, and is very suitable for high-cleanliness or cost-sensitive environments.

[0020] Through the infrared sensing device, connecting wire, telescopic motor, electric telescopic rod and attachment block, the infrared sensing device detects the polished silicon wafer body. When it is detected that the silicon wafer body is not completely polished, the telescopic motor is controlled to start. At this time, the silicon wafer body will just move to the top of the attachment block under the drive of the conveyor belt. The start of the telescopic motor will drive the attachment block to move upward, which can just move the silicon wafer body upward. When the silicon wafer body contacts the resistance rod 1, the silicon wafer body will slide along the slide ladder 1 to a slot in the sorting slot, thereby achieving the effect of separating the incompletely polished silicon wafer body. The infrared sensing device detects the polishing quality in real time and immediately triggers the telescopic motor to start, which is precisely synchronized with the moving timing of the conveyor belt to ensure seamless connection of the sorting action, thereby avoiding the lag of traditional manual sampling and preventing unqualified silicon wafer bodies from flowing into the next link. The resistance rod 1 only acts on the edge of the silicon wafer body, completely avoiding the front circuit layer, and avoiding micro scratches or metal contamination caused by traditional mechanical claw clamping. Moreover, the detection and sorting actions of the infrared sensing device are synchronized with the main transmission line of the conveyor belt, which does not take up additional cycle time and ensures that the production line speed is not affected by sorting. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For those skilled in the art, other drawings can be obtained based on these drawings without paying any creative work.

[0022] Figure 1 It is a schematic diagram of the three-dimensional structure of the present invention.

[0023] Figure 2 It is a schematic diagram of the three-dimensional structure of the frame, the sorting slot and the transmission slot in the present invention.

[0024] Figure 3 It is a schematic diagram of the three-dimensional structure of the frame, the transmission belt and the fixing rod in the present invention.

[0025] Figure 4 It is a schematic diagram of the three-dimensional structure of the rotating column, the transmission belt and the conical wheel in the present invention.

[0026] Figure 5 It is a schematic diagram of the three-dimensional structure of the frame, the upper grinding block and the attachment block in the present invention.

[0027] Figure 6 It is a schematic diagram of the cross-sectional structure of the bottom end of the frame in the present invention.

[0028] Figure 7 It is a schematic diagram of the cross-sectional structure of the frame body located at the sliding groove in the present invention.

[0029] Figure 8 This is a three-dimensional structural schematic diagram of the mid-infrared induction device, telescopic motor and attaching block in the present invention.

[0030] Figure 9 This is a three-dimensional structural diagram of the connecting rod, grip rod and spring in the present invention.

[0031] Figure 10 This is a three-dimensional structural schematic diagram of the upper grinding block and the lower grinding block in the present invention.

[0032] Figure 11 This is a three-dimensional structural schematic diagram of the semi-circular fixing frame, conical teeth and the wafer silicon body in the present invention.

[0033] Figure 12 This is a three-dimensional structural schematic diagram of the semi-circular fixing frame, conical teeth and the fitting fixing groove in the present invention.

[0034] In the figure: 101, frame body; 102, fixing column; 103, sliding ladder 1; 104, contact rod 1; 105, sorting groove; 106, sliding ladder 2; 107, clamping hole; 108, sliding groove; 109, contact rod 2; 110, transmission groove; 201, rotating column; 202, transmission belt; 203, transmission chain; 204, meshing wheel; 205, conical wheel; 206, semi-circular fixing frame; 207, conical teeth; 208, fitting fixing groove; 209, upper grinding block; 210, lower grinding block; 211, connecting rod; 212, grip rod; 213, series telescopic rod; 214, support telescopic rod; 215, spring; 216, grip; 217, fixing rod; 301, mid-infrared induction device; 302, connecting wire; 303, telescopic motor; 304, electric telescopic rod; 305, attaching block; 400, wafer silicon body. Specific embodiments

[0035] Next, the technical solutions in the embodiments of the present invention will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention.

[0036] Embodiment, taking the operation of grinding as an example, a primary grinding and sorting device for wafer silicon, as Figures 3 - 12As shown in the figure, it includes a frame body 101 and a wafer silicon body 400. A transfer groove 110 is provided inside the frame body 101. Two rotating columns 201 are symmetrically and rotatably connected inside the transfer groove 110. Two transfer belts 202 are symmetrically engaged on the outer surfaces of the rotating columns 201. An upper grinding block 209 and a lower grinding block 210 are provided at the top of the transfer belt 202. The wafer silicon body 400 is arranged in the middle of the upper grinding block 209 and the lower grinding block 210. The upper grinding block 209 and the lower grinding block 210 are used to grind the wafer silicon body 400, and the rotating columns 201 and the transfer belts 202 are used to transfer the wafer silicon body 400 after grinding. Connecting rods 211 are fixedly connected to the top of the upper grinding block 209 and the bottom of the lower grinding block 210. Gripping rods 212 are fixedly connected to the sides of the connecting rods 211 away from the center of the frame body 101. Gripping handles 216 are fixedly connected to the ends of the gripping rods 212 away from the connecting rods 211. A series of telescopic rods 213 are arranged inside the corresponding sides of the two connecting rods 211. Support telescopic rods 214 and springs 215 are fixedly connected to the sides of the two connecting rods 211 away from each other. The spring 215 is arranged outside the support telescopic rod 214. Sliding grooves 108 are provided in the frame body 101 at the positions of the gripping rods 212. The ends of the support telescopic rods 214 and the springs 215 away from the connecting rods 211 are fixedly connected to the surfaces of the sliding grooves 108. Two semi-circular fixing frames 206 are fixedly clamped to the outside of the wafer silicon body 400. Tapered teeth 207 are fixedly connected to the sides of the outer surfaces of the semi-circular fixing frames 206 away from the wafer silicon body 400. Fitting fixing grooves 208 are provided on the sides of the semi-circular fixing frames 206 close to the wafer silicon body 400. The shape of the fitting fixing grooves 208 is completely fitted with the wafer silicon body 400. A transmission chain 203 is engaged on the outside of the rotating column 201 close to the semi-circular fixing frame 206. A meshing wheel 204 is engaged at the top inside the transmission chain 203. A tapered wheel 205 is fixedly connected to the side of the meshing wheel 204 close to the semi-circular fixing frame 206. The tapered wheel 205 is engaged with the tapered teeth 207. A fixing rod 217 is rotatably connected to the side of the meshing wheel 204 away from the tapered wheel 205. The end of the fixing rod 217 away from the meshing wheel 204 is fixedly connected to the side of the frame body 101. The upper and lower ends of the wafer silicon body 400 are ground by the frictional force between the wafer silicon body 400, the upper grinding block 209 and the lower grinding block 210, so as to achieve the effect of grinding both sides of the wafer silicon body 400 simultaneously. The double-sided synchronous processing can eliminate the "memory effect" caused by single-sided grinding, and make the surface roughness of the two surfaces of the wafer silicon body 400 more uniform.

[0037] As Figures 1 - 2As shown, a fixed column 102 is fixedly connected to the middle of the frame 101, a sliding ladder 103 is fixedly connected to the side of the fixed column 102 away from the frame 101, a resisting rod 104 is fixedly connected to the top of the sliding ladder 103 on the inner side of the frame 101, and a sorting slot 105 is fixedly connected to the side of the bottom of the frame 101 away from the rotating column 201. A sliding ladder 2 106 is fixedly connected to the inner side of the frame 101 near the upper grinding block 209, a transmission slot 110 is provided with a fixing hole 107 at the bottom end of the transmission belt 202, and a resisting rod 2 109 is fixedly connected to the side of the frame 101 away from the sorting slot 105 at the bottom end of the upper grinding block 209. When the lower grinding block 210 drives the wafer to move to the second contact rod 109, the tilting action imposed by the bottom contact is precisely controlled by the mechanical limit of the second slide ladder 106, so that the wafer body 400 slides smoothly into the target conveyor belt 202, thereby avoiding the risk of free fall or collision. After moving up, the contact with the first contact rod 104 triggers a secondary tilt, and the wafer slides down the slide ladder 103 to the recovery path, without manual intervention or complex sensor detection, which simplifies the overall operation process.

[0038] like Figures 6 - 8 As shown, a connecting wire 302 is provided inside the fixing hole 107, and an infrared sensing device 301 is fixedly connected to one top of the connecting wire 302, and the infrared sensing device 301 is fixedly connected to the top surface of the transmission slot 110, and a telescopic motor 303 is fixedly connected to the top of one end of the connecting wire 302 away from the infrared sensing device 301, and an electric telescopic rod 304 is fixedly connected to the output end of the telescopic motor 303, and an attachment block 305 is fixedly connected to the top of the electric telescopic rod 304. The infrared sensing device 301 detects the polishing quality in real time, and immediately triggers the telescopic motor 303 to start, which is precisely synchronized with the moving timing of the conveyor belt 202, ensuring seamless connection of the sorting action, thereby avoiding the lag of traditional manual sampling and preventing unqualified wafer silicon wafer bodies 400 from flowing into the next link.

[0039] The present invention also provides a method for polishing and sorting silicon wafers, as shown in the figure, the specific steps include: S1. Manually place the wafer silicon body 400 into the grinding structure. First, fix the wafer silicon body 400 to be ground with two semi-circular fixing frames 206 in advance, so that the fitting fixing groove 208 fits the side of the wafer silicon body 400. Since there are various existing ways to fix the two semi-circular fixing frames 206, the description of the fixing method will not be repeated. Due to the elastic action of the spring 215 between the upper grinding block 209 and the lower grinding block 210, the initial state is only the thickness of the wafer silicon body 400 between them. Hold the upper grinding block 209 and the lower grinding block 210 with the grip 216 and move them along the sliding groove 108. At this time, place the wafer silicon body 400 to be ground on the top of the lower grinding block 210, and then release the grip 216, so that the upper grinding block 209 and the lower grinding block 210 clamp the wafer silicon body 400 under the elastic action of the spring 215. This clamping does not affect the rotation of the wafer silicon body 400 inside the upper grinding block 209 and the lower grinding block 210, and only limits the wafer silicon body 400 in the vertical direction.

[0040] S2. The rotating column 201 drives the conical tooth 207 to rotate to perform initial grinding on the wafer silicon body 400. After the wafer silicon body 400 is fixed, since a rotating motor is installed at the rotating column 201 to drive the conveyor belt 202, at this time, the rotation of the rotating column 201 will drive the meshing wheel 204 to rotate through the transmission chain 203. Due to the fixation of the conical wheel 205 and the meshing wheel 204, and the core of the conical wheel 205 and the conical tooth 207, the rotation of the rotating column 201 will drive the conical tooth 207 to rotate. The rotation of the conical tooth 207 will drive the wafer silicon body 400 to rotate and grind inside the upper grinding block 209 and the lower grinding block 210. Thus, the effect of grinding the wafer silicon body 400 can be achieved.

[0041] S3. Manually separate the grinding structure and take out the wafer silicon body 400. After grinding, manually hold the grip 216 to separate the upper grinding block 209 and the lower grinding block 210 from the wafer silicon body 400. After separation, at this time, the conical tooth 207 will no longer mesh with the conical wheel 205 and will stop rotating. Then when the semi-circular fixing frame 206 touches the second contact rod 109, one end of the semi-circular fixing frame 206 will be resisted by the second contact rod 109, and at this time, the wafer silicon body 400 will tilt.

[0042] S4. Transfer the wafer silicon body 400 to the conveyor belt 202. The tilted wafer silicon body 400 will slide along the second sliding ladder 106. Due to the angle design of the second sliding ladder 106, the wafer silicon body 400 will just slide onto the surface of the conveyor belt 202.

[0043] S5. The infrared induction device 301 detects the grinding condition of the wafer silicon body 400. Due to the rotational drive of the rotating column 201 on the conveyor belt 202, at this time, the wafer silicon body 400 will move to the top of the infrared induction device 301 under the movement of the conveyor belt 202. Due to the simple program preset inside the infrared induction device 301, different program settings will be triggered when it detects whether the grinding of the wafer silicon body 400 is complete.

[0044] S6. After the detection, different operations are performed on the wafer silicon bodies 400 with uniform and non-uniform grinding. When the infrared induction device 301 detects that the surface of the wafer silicon body 400 is completely ground, at this time, the wafer silicon body 400 will move to the first box of the sorting slot 105 under the drive of the conveyor belt 202; when the infrared induction device 301 detects that the surface of the wafer silicon body 400 is not completely ground, at this time, the start program will be triggered, and the signal will be transmitted to the telescopic motor 303 through the connection line 302 for startup. The startup of the telescopic motor 303 drives the attachment block 305 to move upward. At this time, the wafer silicon body 400 is precisely synchronized with the attachment block 305 and will be exactly at the top of the attachment block 305 and move upward. Since the set position of the first contact rod 104 is exactly on the right side of the wafer silicon body 400, when the attachment block 305 continues to move upward, the first contact rod 104 will contact the wafer silicon body 400, so that the wafer silicon body 400 will pour and slide along the first sliding ladder 103 into another box of the sorting slot 105. The sorting logic is based on the cooperation of the self-gravity of the wafer silicon body 400 and the mechanical structure, reducing the dependence on the precision control system or optical detection equipment, and is very suitable for high-cleanliness or cost-sensitive environments.

[0045] S7. Finally, the wafer silicon bodies 400 with good and bad grinding are separated.

[0046] Finally, it should be noted that the above are only the preferred embodiments of the present invention and are not used to limit the present invention. Although the present invention has been described in detail with reference to the foregoing embodiments, for those skilled in the art, they can still modify the technical solutions described in the foregoing embodiments, or perform equivalent replacements for some of the technical features. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principle of the present invention shall be included in the protection scope of the present invention.

Claims

1. An initial grinding and sorting device for a wafer, comprising a frame body (101) and a wafer body (400), characterized in that, Inside the housing (101), a transmission groove (110) is provided. Inside the transmission groove (110), two rotating columns (201) are symmetrically and rotatably connected. On the outer surface of the rotating column (201), two transmission belts (202) are symmetrically engaged. At the top of the transmission belt (202), an upper grinding block (209) and a lower grinding block (210) are provided. The wafer silicon substrate body (400) is arranged in the middle of the upper grinding block (209) and the lower grinding block (210). The upper grinding block (209) and the lower grinding block (210) are used to grind the wafer silicon substrate body (400). The rotating column (201) and the transmission belt (202) are used to transmit the wafer silicon substrate body (400) after grinding is completed.

2. The initial grinding and sorting device for a wafer silicon chip according to claim 1, wherein: At the top of the upper grinding block (209) and the bottom of the lower grinding block (210), connecting rods (211) are fixedly connected. On the side of the connecting rod (211) away from the center of the housing (101), a grip rod (212) is fixedly connected. At the end of the grip rod (212) away from the connecting rod (211), a grip (216) is fixedly connected. Inside the corresponding sides of the two connecting rods (211), a series telescopic rod (213) is provided. On the sides of the two connecting rods (211) away from each other, a support telescopic rod (214) and a spring (215) are fixedly connected. The spring (215) is arranged outside the support telescopic rod (214).

3. The initial grinding and sorting device for a wafer silicon chip according to claim 2, characterized in that: At the position of the grip rod (212) on the housing (101), sliding grooves (108) are provided. The ends of the support telescopic rod (214) and the spring (215) away from the connecting rod (211) are fixedly connected to the surface of the sliding groove (108). On the outside of the wafer silicon substrate body (400), two semi-circular fixing frames (206) are fitted and fixed. On the side of the outer surface of the semi-circular fixing frame (206) away from the wafer silicon substrate body (400), a tapered tooth (207) is fixedly connected. On the side of the semi-circular fixing frame (206) close to the wafer silicon substrate body (400), a fitting fixing groove (208) is provided. The shape of the fitting fixing groove (208) is completely fitted with the wafer silicon substrate body (400).

4. The initial grinding and sorting device for a wafer silicon chip according to claim 3, characterized in that: On the outside of the rotating column (201) close to the semi-circular fixing frame (206), a transmission chain (203) is engaged. At the inner top of the transmission chain (203), a meshing wheel (204) is engaged. On the side of the meshing wheel (204) close to the semi-circular fixing frame (206), a tapered wheel (205) is fixedly connected. The tapered wheel (205) is engaged with the tapered tooth (207). On the side of the meshing wheel (204) away from the tapered wheel (205), a fixed rod (217) is rotatably connected. The end of the fixed rod (217) away from the meshing wheel (204) is fixedly connected to the side of the housing (101).

5. The initial grinding and sorting device for a wafer silicon chip according to claim 4, wherein: A fixed column (102) is fixedly connected to the middle of the frame (101); a sliding ladder (103) is fixedly connected to the side of the fixed column (102) away from the frame (101); a resisting rod (104) is fixedly connected to the top of the sliding ladder (103) on the inner side of the frame (101); and a sorting slot (105) is fixedly connected to the side of the bottom end of the frame (101) away from the rotating column (201).

6. The primary grinding and sorting device for a wafer silicon chip as described in claim 5, characterized in that: A second sliding ladder (106) is fixedly connected to the inner side of the frame (101) near the upper grinding block (209); a fixing hole (107) is provided at the bottom end of the conveying belt (202) at the conveying slot (110); and a second abutment rod (109) is fixedly connected to the bottom end of the upper grinding block (209) at the side of the frame (101) away from the sorting slot (105).

7. The primary grinding and sorting device for a wafer silicon chip according to claim 6, wherein: A connecting wire (302) is arranged inside the fastening hole (107); a top end of the connecting wire (302) is fixedly connected to an infrared sensing device (301); the infrared sensing device (301) is fixedly connected to the top surface of the transmission slot (110); a top end of the connecting wire (302) away from the infrared sensing device (301) is fixedly connected to a telescopic motor (303); an output end of the telescopic motor (303) is fixedly connected to an electric telescopic rod (304); and a top end of the electric telescopic rod (304) is fixedly connected to an attachment block (305).

8. A sorting method comprising the initial grinding and sorting device according to any one of claims 1 to 7, characterized in that, The specific steps include: S1, manually placing the silicon wafer body (400) into the polishing structure; S2, the rotating column (201) drives the conical teeth (207) to rotate to perform initial grinding on the silicon wafer body (400); S3, manually separating and polishing the structure to remove the silicon wafer body (400); S4, transferring the silicon wafer body (400) to a conveyor belt (202); S5, the infrared sensing device (301) detects the polishing condition of the silicon wafer body (400); S6, after the inspection is completed, the uniformly polished and non-uniformly polished wafer silicon wafer bodies (400) are subjected to different operations; S7, finally separating the polished and imperfect wafer silicon wafer bodies (400).

9. The sorting method of a wafer silicon chip according to claim 8, characterized in that: In the steps S1-S2, the placing is performed by an operator wearing antistatic clothing to place the silicon wafer body (400) between two semicircular fixing frames (206), the silicon wafer body (400) is fitted and fixed to the fitting fixing groove (208), the semicircular fixing frame (206) and the silicon wafer body (400) are simultaneously placed on the top of the lower grinding block (210), the silicon wafer body (400) is fixed by the elasticity of the spring (215), the conical wheel (205) rotates to drive the conical teeth (207) to rotate, and the rotation of the conical teeth (207) drives the silicon wafer body (400) to rotate and grind inside the upper grinding block (209) and the lower grinding block (210).

10. The sorting method of a wafer silicon chip according to claim 8, characterized in that: In the steps S5 - S7, the infrared induction device (301) detects the wafer silicon body (400). When the infrared induction device (301) detects that the wafer silicon body (400) is not polished completely, the connection line (302) starts the telescopic motor (303). The telescopic motor (303) is used to control the telescopic movement of the electric telescopic rod (304). The telescopic movement of the electric telescopic rod (304) will drive the attachment block (305) to move upward. At this time, the wafer silicon body (400) will just move to the top of the attachment block (305). The upward movement of the attachment block (305) will drive the wafer silicon body (400) to move into the first sliding ladder (103). The sorting groove (105) is used to collect the intact and non - intact wafer silicon bodies (400).

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