High-precision polishing machine for semiconductor cavity

Abstract

The invention belongs to the technical field of semiconductor processing, and particularly relates to a semiconductor cavity high-precision polishing machine which comprises a guide rail base, a motor, a shaft sleeve, a supporting plate, a transmission cylinder and a polishing assembly which are fixedly connected. The grinding assembly comprises a support, a protective shell, a shell, a take-up box, a spliced grinding belt, a supporting roller and an adjusting roller. The adjusting roller pulls the spliced grinding belt, the spliced grinding belt drives the second sliding roller on the supporting roller to slide along the first sliding groove, the size of the grinding assembly is reduced, the grinding assembly can easily stretch into a small-caliber cavity, the operation space of the grinding assembly is increased, and the probability that the grinding assembly collides with the cavity is reduced. While the size of the grinding assembly is reduced, the coarse grain grinding belt is switched to the fine grain grinding belt, the small-caliber cavity is polished through the coarse grain grinding belt, the polishing precision can be ensured, and the situation that the precision of a high-precision device is reduced due to the fact that the surface roughness of the small-caliber cavity is too high is avoided.

Description

Technical Field

[0001] The present invention belongs to the technical field of semiconductor processing, and particularly relates to a high-precision polishing machine for semiconductor cavities. Background Art

[0002] A semiconductor cavity refers to a hollow structure in a semiconductor device or system used to accommodate, protect, or perform specific functions. In the production and manufacturing of semiconductor cavities, in order to improve the accuracy of their output and reduce the side effects of processed burrs and flash components, the cavity component body needs to be polished and processed.

[0003] In the prior art during the polishing process of semiconductor cavities, the polishing parts generally have fixed size specifications. During the polishing process of small-diameter semiconductor cavities, it is difficult for the polishing parts to extend into their interiors, restricting the operation and causing the polishing parts to easily bump into the cavities during the cavity polishing process.

[0004] Moreover, different abrasive parts are used for semiconductor cavities of different diameters. Small-diameter cavities are usually used in high-precision devices and have higher requirements for polishing accuracy because any minor flaw may have a greater impact on their performance. Therefore, finer abrasive belts, such as those made of abrasives with smaller particle sizes, are required; large-diameter cavities are mostly used for encapsulation or basic manufacturing (such as wafer-level processing). Due to their large sizes, they have a relatively higher tolerance for minor defects to a certain extent and generally use relatively coarser abrasive belts. Summary of the Invention

[0005] The purpose of the present invention is to provide a high-precision polishing machine for semiconductor cavities in view of the deficiencies of the prior art to solve the technical problems in the prior art.

[0006] The purpose of the present invention can be achieved through the following technical solutions: A high-precision polishing machine for semiconductor cavities includes a guide rail base connected to the guide rail on the workbench. A motor is installed on the guide rail base, and the output end of the motor is fixedly connected to a shaft sleeve. A support plate is installed on the guide rail base, and a transmission cylinder is rotatably installed on the support plate. The transmission cylinder is fixedly connected to a polishing assembly. The shaft sleeve and the transmission shaft are connected through a slider and chute, and the other end of the transmission shaft is connected to the transmission cylinder for transmission; the polishing assembly includes a bracket, and a protective shell and a housing respectively installed at both ends of the bracket. A wire winding box is installed inside the protective shell, and a spliced abrasive belt is installed inside the bracket. A number of support rollers and adjusting rollers are respectively slidably installed inside the bracket. The spliced abrasive belt is installed successively through the support rollers and the adjusting rollers. A first sliding roller is installed on the adjusting roller, a sleeve is sleeved on the first sliding roller, and the sleeve is connected to the wire winding roller inside the wire winding box through a rope. The wire winding roller inside the wire winding box is coaxially connected to a transmission sleeve. By pushing the transmission shaft, the transmission shaft is connected to the transmission sleeve for transmission.

[0007] As a further optimization or improvement of this solution, a first chute and a second chute are respectively opened on the bracket. The support roller is slidably connected to the first chute through a second sliding roller. A compression spring is installed in the first chute and is connected to the second sliding roller. The adjusting roller is slidably connected to the second chute through a first sliding roller.

[0008] As a further optimization or improvement of this solution, an outer groove is opened in the second chute. A rack is arranged in the outer groove. A toothed ring is installed on the first sliding roller, and the toothed ring is in transmission connection with the rack. The combined grinding belt is composed of a coarse-grained grinding belt and a fine-grained grinding belt.

[0009] As a further optimization or improvement of this solution, a pressing plate is installed in the shell. The pressing plate is slidably matched with the shell through a sliding rod. A return spring is installed between the sliding rod and the shell. An electromagnetic chuck II is installed on one side of the bracket close to the shell, and the electromagnetic chuck II adsorbs the pressing plate.

[0010] As a further optimization or improvement of this solution, pressing blocks are installed on the first sliding roller and the second sliding roller. The position of the support roller and the adjusting roller is fixed by pressing the pressing blocks on the pressing plate.

[0011] As a further optimization or improvement of this solution, an electromagnetic chuck I is installed in the transmission sleeve, and a magnetic metal block is installed on the transmission shaft. The electromagnetic chuck I adsorbs the magnetic metal block; when the electromagnetic chuck I is powered on, the electromagnetic chuck I adsorbs the magnetic metal block, causing the transmission shaft to move into the transmission sleeve. At this time, the transmission shaft is in transmission connection with the transmission sleeve; when the electromagnetic chuck I is powered off, the transmission shaft resets, causing the transmission shaft to be in transmission connection with the transmission cylinder again.

[0012] As a further optimization or improvement of this solution, a wire threading cylinder is installed inside the bracket.

[0013] Advantages of the present invention: (1) By rotating the wire take-up roller of the present invention, the rope is stored inside the wire take-up box. The rope drives the first sliding roller and the adjusting roller to slide along the second chute through the sleeve, so that the adjusting roller pulls the combined grinding belt. By pulling the combined grinding belt with the adjusting roller, the combined grinding belt drives the second sliding roller on the support roller to slide along the first chute, causing the support roller to contract towards the inside of the bracket, reducing the volume of the grinding assembly, enabling the grinding assembly to easily extend into a small-diameter cavity, increasing the operating space of the grinding assembly, and reducing the probability of the grinding assembly knocking against the cavity.

[0014] While reducing the volume of the grinding assembly, the present invention switches the coarse-grained grinding belt to the fine-grained grinding belt. Polishing the small-diameter cavity with the coarse-grained grinding belt can ensure the polishing accuracy and prevent the surface roughness of the small-diameter cavity from being too high, resulting in a reduction in the accuracy of high-precision devices.

[0015] (2) During the process of switching the fine-grain grinding belt in the present invention, the rope drives the first sliding roller to slide along the second chute, so that the adjusting roller drives the second sliding roller on the supporting roller to slide along the first chute through the spliced grinding belt. At the same time, the compression spring is compressed. Under the action of the spring back of the compression spring, the fine-grain grinding belt is gradually stretched, so that the fine-grain grinding belt is closely attached to the supporting roller, avoiding the relaxation of the fine-grain grinding belt during the polishing of the small-diameter cavity, resulting in the distortion of the fine-grain grinding belt. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] The present invention will be further described below with reference to the accompanying drawings.

[0017] Figure 1 It is a schematic diagram of the overall structure of the present invention.

[0018] Figure 2 It is a schematic diagram of the connection structure between the support plate and the transmission cylinder.

[0019] Figure 3 It is a schematic diagram of the transmission connection between the transmission shaft and the shaft sleeve and the transmission cylinder respectively.

[0020] Figure 4 It is Figure 3 The enlarged view of the structure of part A of

[0021] Figure 5 It is a schematic diagram of the internal structure of the protective shell.

[0022] Figure 6 It is a schematic diagram of the internal structure of the bracket.

[0023] Figure 7 It is the front view of the inside of the protective shell.

[0024] Figure 8 It is Figure 7 The enlarged view of the structure of part B of

[0025] Figure 9 It is a schematic diagram of the structure of the coarse-grain grinding belt and the fine-grain grinding belt.

[0026] Figure 10 It is a schematic diagram of the structure of the second electromagnetic chuck.

[0027] Figure 11 It is a schematic diagram of the installation position of the pressing plate.

[0028] The labels in the figure are: 1. Guide rail seat; 2. Support plate; 3. Bush; 4. Transmission shaft; 5. Transmission cylinder; 6. Grinding assembly; 601. Bracket; 602. Composite grinding belt; 6021. Coarse-grain grinding belt; 6022. Fine-grain grinding belt; 603. Protective shell; 604. Housing; 605. Wire take-up box; 606. Transmission sleeve; 607. Electromagnetic chuck I; 608. Magnetic metal block; 609. Slide groove I; 610. Slide groove II; 611. Outer groove; 612. Support roller; 613. Adjusting roller; 614. Threading cylinder; 615. Slide roller I; 616. Sleeve; 617. Rope; 618. Tooth ring; 619. Rack; 620. Slide roller II; 621. Compression spring; 622. Pressure block; 623. Electromagnetic chuck II; 624. Pressure plate; 625. Slide bar; 626. Return spring. Specific embodiments

[0029] Next, the technical solutions in the embodiments of the present invention will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without making creative efforts belong to the scope of protection of the present invention.

[0030] See Figures 1-9 , a high-precision polishing machine for semiconductor cavities, which includes a guide rail seat 1. The guide rail seat 1 is connected to the guide rail on the workbench. A motor is installed on the guide rail seat 1. The output end of the motor is fixedly connected to a bush 3. A support plate 2 is installed on the guide rail seat 1. A transmission cylinder 5 is rotatably installed on the support plate 2. The transmission cylinder 5 is fixedly connected to a grinding assembly 6. The bush 3 and the transmission shaft 4 are connected by a slider and slide groove. The other end of the transmission shaft 4 is connected to the transmission cylinder 5 for transmission. The grinding assembly 6 includes a bracket 601, and a protective shell 603 and a housing 604 respectively installed at both ends of the bracket 601. A wire take-up box 605 is installed in the protective shell 603. A composite grinding belt 602 is installed in the bracket 601. A number of support rollers 612 and adjusting rollers 613 are respectively slidably installed in the bracket 601. The composite grinding belt 602 is installed through the support rollers 612 and the adjusting rollers 613 in sequence. A slide roller I 615 is installed on the adjusting roller 613. A sleeve 616 is sleeved on the slide roller I 615. The sleeve 616 is connected to the wire take-up roller inside the wire take-up box 605 through a rope 617. The wire take-up roller inside the wire take-up box 605 is coaxially connected to a transmission sleeve 606. By pushing the transmission shaft 4, the transmission shaft 4 is connected to the transmission sleeve 606 for transmission.

[0031] Specifically, a first chute 609 and a second chute 610 are respectively formed in the bracket 601. The support roller 612 is slidably connected to the first chute 609 through a second sliding roller 620. A compression spring 621 is installed in the first chute 609, and the compression spring 621 is connected to the second sliding roller 620. The adjusting roller 613 is slidably connected to the second chute 610 through a first sliding roller 615.

[0032] Specifically, an electromagnetic chuck 607 is installed in the transmission sleeve 606, and a magnetic metal block 608 is installed on the transmission shaft 4. The electromagnetic chuck 607 adsorbs the magnetic metal block 608. After the electromagnetic chuck 607 is powered on, the electromagnetic chuck 607 adsorbs the magnetic metal block 608, causing the transmission shaft 4 to move into the transmission sleeve 606. At this time, the transmission shaft 4 is in transmission connection with the transmission sleeve 606. After the electromagnetic chuck 607 is powered off, the transmission shaft 4 resets, causing the transmission shaft 4 to be in transmission connection with the transmission cylinder 5 again.

[0033] It should be noted that first, the guide rail base 1 is installed on the electric guide rail on the workbench, and then the driving motor is fixedly installed on the guide rail base 1. The output end of the motor is connected to the shaft sleeve 3 through bolts. The polishing assembly 6 is moved through the guide rail, and the polishing assembly 6 is driven by the motor to rotate for polishing the semiconductor cavity.

[0034] Polishing of large-diameter cavities; under normal conditions, after the motor is started, the motor drives the transmission shaft 4 to rotate through the shaft sleeve 3. Under the action of the transmission cooperation between the transmission shaft 4 and the transmission cylinder 5, the motor drives the bracket 601 to rotate. Refer to Figure 9 , and at this time, the semiconductor large-diameter cavity is polished by the coarse-grained abrasive belt 6021.

[0035] Polishing of small-diameter cavities; when polishing a small-diameter cavity, the electromagnetic chuck 607 is powered on. The electromagnetic chuck 607 adsorbs the magnetic metal block 608 on the transmission shaft 4, causing the transmission shaft 4 to move toward the inside of the transmission sleeve 606. Through the cooperation between the slider on the transmission shaft 4 and the chute in the transmission sleeve 606, the transmission shaft 4 is in transmission connection with the transmission sleeve 606. When the motor drives the transmission shaft 4 to rotate through the shaft sleeve 3, the transmission shaft 4 drives the transmission sleeve 606 to rotate. The transmission sleeve 606 drives the take-up roller inside the take-up box 605 to rotate. As the take-up roller rotates, refer to Figure 8 , the rope 617 is received into the inside of the take-up box 605. The rope 617 drives the first sliding roller 615 and the adjusting roller 613 to slide along the second chute 610 through the sleeve 616, so that the adjusting roller 613 pulls the spliced abrasive belt 602. By pulling the spliced abrasive belt 602 by the adjusting roller 613, the spliced abrasive belt 602 drives the second sliding roller 620 on the support roller 612 to slide along the first chute 609, causing the support roller 612 to contract toward the inside of the bracket 601, reducing the volume of the polishing assembly 6, enabling the polishing assembly 6 to easily extend into the small-diameter cavity, increasing the operating space of the polishing assembly 6, and reducing the probability of the polishing assembly 6 bumping against the cavity.

[0036] When the first sliding roller 615 slides along the second chute 610, under the action of the engagement between the toothed ring 618 on the first sliding roller 615 and the rack 619, during the process of the first sliding roller 615 sliding along the second chute 610, the first sliding roller 615 drives the adjusting roller 613 to rotate, so that the adjusting roller 613 drives the assembled polishing belt 602 to move. As the assembled polishing belt 602 rotates, the fine-grained polishing belt 6022 replaces the coarse-grained polishing belt 6021. While reducing the volume of the polishing assembly 6, the present invention switches the coarse-grained polishing belt 6021 to the fine-grained polishing belt 6022. Polishing the small-diameter cavity with the coarse-grained polishing belt 6021 can ensure the polishing accuracy and avoid the surface roughness of the small-diameter cavity being too high, resulting in a reduction in the accuracy of high-precision devices.

[0037] Fixed position; the second electromagnetic chuck 623 is energized, and the second electromagnetic chuck 623 adsorbs the pressure plate 624 inside the housing 604. The pressure plate 624 presses the pressure blocks 622 on the second sliding roller 620 and the first sliding roller 615, so that the supporting roller 612 and the adjusting roller 613 are fixed at the current position. The first electromagnetic chuck 607 is powered off, and the transmission shaft 4 automatically resets, so that the transmission shaft 4 is in driving connection with the transmission cylinder 5. The motor drives the bracket 601 to rotate, so that the fine-grained polishing belt 6022 polishes the small-diameter cavity.

[0038] It should be noted that since the fine-grained polishing belt 6022 is mainly used for fine polishing, the abrasive particles are fine and the base material is soft, so the overall elasticity of the fine-grained polishing belt 6022 is relatively high; since the abrasive particles of the coarse-grained polishing belt 6021 are coarse and the base material is hard, the overall elasticity of the coarse-grained polishing belt 6021 is relatively low and the deformation during polishing is small. After switching the coarse-grained polishing belt 6021 to the fine-grained polishing belt 6022, due to the soft and highly elastic characteristics of the fine-grained polishing belt 6022 itself, during the process of polishing the small-diameter cavity, the fine-grained polishing belt 6022 is prone to relaxation under the action of inertia, resulting in displacement or distortion of the fine-grained polishing belt 6022.

[0039] During the process of switching the coarse-grained polishing belt 6021 to the fine-grained polishing belt 6022 of the present invention, the rope 617 drives the first sliding roller 615 to slide along the second chute 610, so that the first sliding roller 615 and the adjusting roller 613 move towards the inside of the bracket 601. At this time, the adjusting roller 613 drives the second sliding roller 620 on the supporting roller 612 to slide along the first chute 609 through the assembled polishing belt 602. At the same time, the compression spring 621 is compressed. Under the rebounding action of the compression spring 621, the fine-grained polishing belt 6022 is gradually stretched, so that the fine-grained polishing belt 6022 is closely attached to the supporting roller 612, avoiding the fine-grained polishing belt 6022 from being relaxed during the process of polishing the small-diameter cavity, resulting in distortion of the fine-grained polishing belt 6022.

[0040] See Figures 7-9, a second chute 610 is provided with an outer groove 611, the outer groove 611 is internally provided with a rack 619, a gear ring 618 is installed on the first roller 615, and the gear ring 618 is in driving connection with the rack 619. The combined polishing belt 602 is composed of a coarse-grained polishing belt 6021 and a fine-grained polishing belt 6022.

[0041] It should be noted that the combined polishing belt 602 is formed by splicing the coarse-grained polishing belt 6021 and the fine-grained polishing belt 6022. Driven by the adjustment roller 613 sliding along the inside of the second chute 610, the adjustment roller 613 drives the second roller 620 on the support roller 612 to slide along the first chute 609 through the combined polishing belt 602, so that the support roller 612 contracts towards the inside of the bracket 601, reducing the volume of the polishing assembly 6; Driven by the adjustment roller 613 sliding along the inside of the second chute 610, under the action of the engagement between the gear ring 618 on the first roller 615 and the rack 619, the adjustment roller 613 slides along the second chute 610 and rotates, switching the coarse-grained polishing belt 6021 to the fine-grained polishing belt 6022, and polishing and grinding the small-diameter cavity through the fine-grained polishing belt 6022.

[0042] See Figures 10-11 , a pressing plate 624 is installed in the housing 604, the pressing plate 624 is slidably matched with the housing 604 through a slide bar 625, a return spring 626 is installed between the slide bar 625 and the housing 604, and an electromagnetic chuck two 623 is installed on one side of the bracket 601 close to the housing 604, and the electromagnetic chuck two 623 adsorbs the pressing plate 624.

[0043] Specifically, pressing blocks 622 are installed on the first roller 615 and the second roller 620, and the pressing plate 624 fixes the positions of the support roller 612 and the adjustment roller 613 by pressing the pressing blocks 622.

[0044] It should be noted that pressing blocks 622 are installed on both the second roller 620 and the first roller 615. When the electromagnetic chuck two 623 is energized, the electromagnetic chuck two 623 adsorbs the pressing plate 624 inside the housing 604. The pressing plate 624 fixes the second roller 620 and the first roller 615 on the bracket 601 by pressing the pressing blocks 622 on the second roller 620 and the first roller 615, thereby realizing the fixation of the current positions of the support roller 612 and the adjustment roller 613.

[0045] See Figure 6 and Figure 9 , a wire threading cylinder 614 is installed inside the bracket 601.

[0046] It should be noted that the power supply wires of the electromagnetic chuck two 623 and the electromagnetic chuck one 607 pass through the wire threading cylinder 614, thereby avoiding wire harness interference with the operation of the polishing assembly 6.

[0047] Working principle of the present invention: Large-diameter cavity polishing; Under normal conditions, after the motor is started, the motor drives the transmission shaft 4 to rotate through the bushing 3. Under the action of the transmission cooperation between the transmission shaft 4 and the transmission cylinder 5, the motor drives the bracket 601 to rotate. Refer to Figure 9 , at this time, the large-diameter semiconductor cavity is polished by the coarse-grain grinding belt 6021.

[0048] Small-diameter cavity polishing; When polishing a small-diameter cavity, the electromagnetic chuck 607 is energized, and the electromagnetic chuck 607 adsorbs the magnetic metal block 608 on the transmission shaft 4, causing the transmission shaft 4 to move towards the inside of the transmission sleeve 606. Through the cooperation between the slider on the transmission shaft 4 and the inner chute of the transmission sleeve 606, the transmission shaft 4 is in transmission connection with the transmission sleeve 606. When the motor drives the transmission shaft 4 to rotate through the bushing 3, the transmission shaft 4 drives the transmission sleeve 606 to rotate, and the transmission sleeve 606 drives the wire winding roller inside the wire winding box 605 to rotate. As the wire winding roller rotates, refer to Figure 8 , the rope 617 is stored inside the wire winding box 605. The rope 617 drives the roller 615 and the adjusting roller 613 to slide along the chute 610 through the sleeve 616, so that the adjusting roller 613 pulls the assembled grinding belt 602. By pulling the assembled grinding belt 602 by the adjusting roller 613, the assembled grinding belt 602 drives the roller 620 on the support roller 612 to slide along the chute 609, causing the support roller 612 to contract towards the inside of the bracket 601, reducing the volume of the grinding assembly 6, enabling the grinding assembly 6 to easily extend into the small-diameter cavity, increasing the operating space of the grinding assembly 6, and reducing the probability of the grinding assembly 6 bumping against the cavity.

[0049] When the roller 615 slides along the chute 610, under the action of the meshing between the toothed ring 618 on the roller 615 and the rack 619, during the process of the roller 615 sliding along the chute 610, the roller 615 drives the adjusting roller 613 to rotate, causing the adjusting roller 613 to drive the assembled grinding belt 602 to move. As the assembled grinding belt 602 rotates, the fine-grain grinding belt 6022 replaces the coarse-grain grinding belt 6021. While reducing the volume of the grinding assembly 6, the present invention switches the coarse-grain grinding belt 6021 to the fine-grain grinding belt 6022. Polishing the small-diameter cavity with the coarse-grain grinding belt 6021 can ensure the polishing accuracy and avoid the surface roughness of the small-diameter cavity being too high, resulting in a reduction in the accuracy of high-precision devices.

[0050] Fixing the position; The electromagnetic chuck 623 is energized, and the electromagnetic chuck 623 adsorbs the pressure plate 624 inside the housing 604. The pressure plate 624 presses the pressure blocks 622 on the roller 620 and the roller 615, fixing the current positions of the support roller 612 and the adjusting roller 613. The electromagnetic chuck 607 is de-energized, and the transmission shaft 4 automatically resets, making the transmission shaft 4 in transmission connection with the transmission cylinder 5. By driving the bracket 601 to rotate with the motor, the fine-grain grinding belt 6022 polishes the small-diameter cavity.

[0051] Specifically, since the fine-grained abrasive belt 6022 is mainly used for fine polishing, with fine abrasive particles and a soft substrate, the overall elasticity of the fine-grained abrasive belt 6022 is relatively high; due to the coarse abrasive particles and hard substrate of the coarse-grained abrasive belt 6021, the overall elasticity of the coarse-grained abrasive belt 6021 is relatively low, and the deformation during polishing is small. After switching the coarse-grained abrasive belt 6021 to the fine-grained abrasive belt 6022, due to the soft and highly elastic characteristics of the fine-grained abrasive belt 6022 itself, during the polishing process of the small-diameter cavity, under the action of inertia, the fine-grained abrasive belt 6022 is prone to relaxation, resulting in displacement or distortion of the fine-grained abrasive belt 6022.

[0052] In the process of switching the fine-grained abrasive belt 6022 in the present invention, the rope 617 drives the first roller 615 to slide along the second chute 610, causing the first roller 615 and the adjusting roller 613 to move towards the inside of the bracket 601. At this time, the adjusting roller 613 drives the second roller 620 on the supporting roller 612 to slide along the first chute 609 through the combined abrasive belt 602. At the same time, the compression spring 621 is compressed. Under the rebounding action of the compression spring 621, the fine-grained abrasive belt 6022 is gradually stretched, making the fine-grained abrasive belt 6022 closely attached to the supporting roller 612, avoiding the relaxation of the fine-grained abrasive belt 6022 during the polishing process of the small-diameter cavity and resulting in the distortion of the fine-grained abrasive belt 6022.

[0053] The above shows and describes the basic principles, main features and advantages of the present invention. Those skilled in the art should understand that the present invention is not limited by the above embodiments. The above embodiments and the descriptions in the specification only illustrate the principles of the present invention. Without departing from the spirit and scope of the present invention, the present invention will have various changes and improvements, and these changes and improvements all fall within the scope of the present invention claimed.

Claims

1. A high-precision polishing machine for semiconductor cavities, characterized in that: It includes a guide rail base (1), which is connected to the guide rail on the workbench. A motor is installed on the guide rail base (1), and the output end of the motor is fixedly connected to a bushing (3). A support plate (2) is installed on the guide rail base (1), and a transmission cylinder (5) is rotatably installed on the support plate (2). The transmission cylinder (5) is fixedly connected to a grinding assembly (6). The bushing (3) and a transmission shaft (4) are connected by a slider and chute for transmission, and the other end of the transmission shaft (4) is in transmission connection with the transmission cylinder (5). The grinding assembly (6) includes a bracket (601), a protective shell (603) and a housing (604) respectively installed at both ends of the bracket (601). A wire reel box (605) is installed in the protective shell (603). A spliced grinding belt (602) is installed in the bracket (601). A number of support rollers (612) and adjusting rollers (613) are respectively slidably installed in the bracket (601). The spliced grinding belt (602) is installed successively passing through the support rollers (612) and the adjusting rollers (613). A first sliding roller (615) is installed on the adjusting roller (613). A sleeve (616) is sleeved on the first sliding roller (615). The sleeve (616) is connected to the wire reel inside the wire reel box (605) through a rope (617). The wire reel inside the wire reel box (605) is coaxially connected to a transmission sleeve (606). By pushing the transmission shaft (4), the transmission shaft (4) is in transmission connection with the transmission sleeve (606).

2. The high-precision polishing machine for semiconductor cavities according to claim 1, wherein: A first chute (609) and a second chute (610) are respectively opened on the bracket (601). The support roller (612) is slidably connected to the first chute (609) through a second sliding roller (620). A compression spring (621) is installed in the first chute (609), and the compression spring (621) is connected to the second sliding roller (620). The adjusting roller (613) is slidably connected to the second chute (610) through the first sliding roller (615).

3. The high-precision polishing machine for semiconductor cavities according to claim 2, wherein: An outer groove (611) is opened in the second chute (610). A rack (619) is arranged in the outer groove (611). A toothed ring (618) is installed on the first sliding roller (615), and the toothed ring (618) is in transmission connection with the rack (619). The spliced grinding belt (602) is composed of a coarse-grained grinding belt (6021) and a fine-grained grinding belt (6022).

4. A high-precision polishing machine for semiconductor cavities according to claim 1, characterized in that: A pressing plate (624) is installed in the housing (604). The pressing plate (624) is slidably matched with the housing (604) through a sliding rod (625). A return spring (626) is installed between the sliding rod (625) and the housing (604). An electromagnetic chuck two (623) is installed on one side of the bracket (601) close to the housing (604), and the electromagnetic chuck two (623) adsorbs the pressing plate (624).

5. A high-precision polishing machine for semiconductor cavities according to claim 4, characterized in that: Pressing blocks (622) are installed on the first sliding roller (615) and the second sliding roller (620). The position of the support roller (612) and the adjusting roller (613) is fixed by pressing the pressing blocks (622) by the pressing plate (624).

6. The high-precision polishing machine for semiconductor cavities according to claim 1, wherein: An electromagnetic chuck one (607) is installed inside the transmission sleeve (606), and a magnetic metal block (608) is installed on the transmission shaft (4). The electromagnetic chuck one (607) adsorbs the magnetic metal block (608). When the electromagnetic chuck one (607) is powered on, the electromagnetic chuck one (607) adsorbs the magnetic metal block (608), causing the transmission shaft (4) to move into the transmission sleeve (606). At this time, the transmission shaft (4) is in transmission connection with the transmission sleeve (606). When the electromagnetic chuck one (607) is powered off, the transmission shaft (4) resets, causing the transmission shaft (4) to be in transmission connection with the transmission cylinder (5) again.

7. A high-precision polishing machine for semiconductor cavities according to claim 1, characterized in that: A wire threading cylinder (614) is installed inside the bracket (601).

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