Robot clamping jaw and discharging method

Abstract

The invention discloses a robot clamping jaw and a discharging method, and relates to the technical field of semiconductor manufacturing, the robot clamping jaw comprises a piece feeding and discharging control device, a supporting structure connected to the end of the piece feeding and discharging control device and a plurality of adsorption piece sets evenly arranged on the supporting structure, and part of the adsorption piece sets are provided with telescopic moving mechanisms. When the movable mechanism is extended or shortened, the plane where the wafers on the adsorption piece group connected with the movable mechanism are located and the planes where the wafers on the other adsorption piece groups are located are parallel to each other and form an interval, and the multiple wafers can be taken and placed at the same time. Through the arrangement, the technical effect of taking and placing multiple wafers at a time is achieved, the wafer taking efficiency and the wafer discharging efficiency are improved, and meanwhile the occupied time of a robot clamping jaw is shortened.

Description

Technical Field

[0001] This application relates to the field of semiconductor manufacturing technology, and in particular to a robot gripper and a wafer unloading method. Background Art

[0002] Wafer polishing and grinding is one of the key processes in semiconductor manufacturing, mainly used for planarizing the wafer surface to ensure the accuracy and yield of subsequent processes such as lithography and thin film deposition.

[0003] The wafer polishing and grinding process is carried out in the planetary wheel of the polishing and grinding equipment. When the wafer is completed with polishing and grinding, it is necessary to unload the wafer from the planetary wheel and place it in the buffer device for buffering, which is convenient for moisturizing the wafer in the buffer device. The liquid is usually water. At present, the manipulator for unloading usually can only transport and buffer single wafers, resulting in a long occupation time of the manipulator during the unloading process and low efficiency of the entire polishing and grinding process.

[0004] Therefore, in order to improve the efficiency of unloading and release the manipulator in time, the applicant has developed a robot gripper that can transport multiple wafers simultaneously and can realize the picking and placing of multiple wafers at the same time. Summary of the Invention

[0005] To solve the deficiencies of the prior art, one of the purposes of this application is to provide a robot gripper that can realize the picking and placing of multiple wafers at the same time.

[0006] To achieve the above purpose, this application adopts the following technical solutions: A robot gripper, comprising: Comprising: An upper and lower wafer control device, A support structure, connected to the end of the upper and lower wafer control device and driven to move by an upper and lower wafer driving device; and Multiple suction attachment groups, arranged on the support structure and used for adsorbing multiple wafers on the planetary wheel; A retractable moving mechanism is arranged on some of the suction attachment groups; When the moving mechanism extends or contracts, the plane where the wafers on the suction attachment group connected to the moving mechanism are located and the plane where the wafers on the remaining suction attachment groups are located are parallel to each other and form a gap.

[0007] With the above settings, the number of the adsorption component groups is set according to the number of wafers on the planetary wheel, and the relative positions of the adsorption component groups are arranged to be consistent with the relative positions of the wafers on the planetary wheel. Multiple adsorption component groups can simultaneously adsorb all the wafers on the planetary wheel and transport them. After the moving mechanism adjusts the positions of the wafers, the wafer is driven by the wafer loading and unloading control device to adjust its position to the vertical state, and then all the wafers are simultaneously placed in the corresponding buffer device for storage and moisture preservation. The setting of the moving mechanism enables the wafers on the adsorption component groups to avoid mutual interference when being placed, thereby protecting the wafers and improving the efficiency of picking and placing at the same time.

[0008] Further, the adsorption component group includes a structural plate connected to the support structure; and a flexible rod disposed in the middle of the structural plate; the flexible rod extends from a position adjacent to the connection position of the structural plate and the support structure in a direction away from the connection position, one end of the flexible rod adjacent to the connection position is fixed, and the other end is cantilevered; negative pressure suction cups for sucking wafers are disposed on both the structural plate and the flexible rod; the negative pressure suction cups on the structural plate are disposed close to the connection position of the structural plate and the support structure, and the negative pressure suction cups on the flexible rod are disposed away from the fixed end of the flexible rod.

[0009] With the above settings, after the negative pressure suction cup sucks the wafer, the wafer loading and unloading control device applies an upward force to the support structure to lift the wafer upward. Since there is polishing liquid between the wafer and the wafer placement platform of the planetary wheel, the tension of the polishing liquid will hinder the movement of the wafer. When the structural plate drives the wafer to move upward, the position where the flexible rod is connected to the wafer has a lag in upward movement. At the same time, the flexible rod bends due to its flexible deformation ability, making the wafer show a situation where one end is lifted and the other end still adheres to the planetary wheel. At this time, the wafer is in an inclined state and can better resist the tension of the polishing liquid, thereby avoiding the situation of wafer cracking when moving upward. It should be noted that since the elastic deformation of the flexible rod buffers the tension of the polishing liquid, the wafer is always on the same plane, thereby protecting the integrity of the wafer.

[0010] Further, the length direction of the flexible rod is set along the diameter of the wafer sucked by the corresponding adsorption component group.

[0011] With the above settings, the force on the wafer is more uniform and reasonable. On the one hand, it can enable the wafer to better withstand the pressure during the pressing process of the adsorption component group, so as to stably discharge the polishing liquid between the wafer and the planetary wheel. On the other hand, when lifting the wafer, the force borne by the wafer can be more uniform.

[0012] Further, a receiving groove penetrating in the thickness direction of the structural plate is formed in the middle of the structural plate, and at least a part of the flexible rod is located in the receiving groove.

[0013] With the above arrangement, when the suction attachment group adsorbs and lifts the wafer, the flexible rod will deform. The receiving groove penetrating in the thickness direction of the structural plate can provide a larger deformation space for the flexible rod, avoiding interference with the deformation of the flexible rod. At the same time, the penetrating receiving groove also facilitates the operator to observe the movement track and state of the flexible rod, facilitating timely adjustment of the operation or change of the lifting force.

[0014] Further, both ends of the receiving groove are located on the structural plate, and the flexible rod is located in the receiving groove.

[0015] With the above arrangement, the integrity of the structural plate is stronger, reducing the impact of the formation of the receiving groove on the overall strength reduction of the structural plate. At the same time, the flexible rod is hidden in the receiving groove, which not only facilitates the installation of the negative pressure suction cup, but also can protect the flexible rod during the installation of the suction attachment group.

[0016] Further, at least one negative pressure suction cup is provided on both sides of the flexible rod on the structural plate, and the number of negative pressure suction cups on both sides of the flexible rod on the structural plate is the same.

[0017] With the above arrangement, when the negative pressure suction cup adsorbs the wafer, the force on both sides of the wafer by the flexible rod is more uniform, thereby reducing the probability of the wafer being broken due to uneven force. Further, the negative pressure suction cup on the flexible rod is arranged at the overhanging end of the flexible rod.

[0018] With the above arrangement, the distance between the negative pressure suction cup on the flexible rod and the negative pressure suction cup on the structural plate can be closer to the diameter of the wafer, so that the edge of the wafer can also be stressed when the wafer is lifted, thereby reducing the probability of edge breakage. At the same time, the flexible rod can also release a greater ability to deform to resist the tension of the polishing liquid, enabling the wafer to be separated from the planetary wheel more quickly, conveniently and safely.

[0019] Further, a plurality of fixed suction cups are arranged at positions on the structural plate adjacent to the position of the negative pressure suction cup on the flexible rod, and the plurality of fixed suction cups are symmetrically arranged on both sides of the flexible rod.

[0020] With the above arrangement, when the suction attachment group presses down the wafer to discharge the polishing liquid below the wafer, the fixed suction cup can cooperate with the negative pressure suction cup so that the wafer is subjected to more uniform pressure, accelerating the discharge of the polishing liquid. Symmetrically arranging the fixed suction cups on both sides of the flexible rod can better cooperate with the drainage.

[0021] Further, a fork arm is arranged on the support structure for transporting a single wafer.

[0022] With the above settings, a single wafer can be transported to the required position without replacing the robot gripper, saving equipment costs and shortening the handling path.

[0023] Another object of the present application is to provide a blanking method that can efficiently transport multiple wafers in a single pick-and-place operation.

[0024] To achieve the above object, the present application adopts the following technical solutions: A blanking method that uses a robot gripper for handling, including the following steps: Move the robot gripper to the planetary gear and adsorb 3 or 4 wafers on the planetary gear; Move the robot gripper to the buffer device, and adjust the position of the corresponding upper wafer through the movable mechanism so that there is a gap and they are parallel to each other between the plane where the wafers on the suction attachment group connected to the movable mechanism are located and the plane where the remaining wafers are located; Move the robot gripper to make the wafers vertical and at the same time place all the wafers on the robot gripper on the buffer device.

[0025] The present application provides a robot gripper that realizes the transportation of multiple wafers by setting multiple suction attachment groups, and cooperates with the movable mechanism to adjust the positions of the wafers adsorbed on some of the suction attachment groups, so that there is a gap and they are parallel to each other between the plane where the wafers on the suction attachment group connected to the movable mechanism are located and the plane where the wafers on the remaining suction attachment groups are located, thereby achieving the technical effect of simultaneously placing all the wafers on the robot gripper on the buffer device. Description of the Drawings

[0026] Figure 1 Schematic diagram of the robot gripper in the embodiment of the present application; Figure 2 Schematic diagram of the support structure and the suction attachment group; Figure 3 Schematic diagram after the suction attachment group adsorbs the wafers; Figure 4 Schematic diagram of the support structure and the suction attachment group from another perspective; Figure 5 Force simulation diagram of the suction attachment group in Test 1; Figure 6 Force simulation diagram of the suction attachment group in Test 2; Figure 7 Force simulation diagram of the suction attachment group in Test 3.

[0027] Reference Signs: 100, upper and lower wafer control device; 200, support structure; 210, fork arm; 300, Adsorption component group; 310, Moving mechanism; 320, Structural plate; 321, Accommodating groove; 322, Fixed suction cup; 330, Flexible rod; 400, Negative pressure suction cup. Detailed implementation mode

[0028] In order to enable those skilled in the art to better understand the solution of this application, the technical solutions in the specific implementation modes of this application will be clearly and completely described below in conjunction with the accompanying drawings in the implementation modes of this application.

[0029] It should be noted that the orientation nouns such as up, down, left, right, front, and back mentioned in this article, or ordinal numbers such as "first, second, third, fourth", are all based on the accompanying drawings of the specification as a reference and are introduced for the convenience of description. It does not mean any limitation on the order of the components. In addition, since the functions of some parts of the components provided in the above embodiments are the same, this specification uses a unified naming method for these parts. The above has introduced the pipeline connection device provided by the related technical solutions in detail. Specific embodiments are used in this article to elaborate. The description of the above embodiments is only used to help understand the method and its core idea of the present invention, and does not impose any form of limitation on the present invention.

[0030] As Figure 1 shown, this application provides a robot gripper for moving back and forth between a loading module, a wafer buffering module, a polishing and grinding machine, and a wafer unloading buffering module. The robot gripper includes a wafer loading and unloading control device 100, a support structure 200 connected to the wafer loading and unloading control device 100, and a plurality of adsorption component groups 300 fixed to the support structure 200.

[0031] Optionally, the wafer loading and unloading control device 100 is a manipulator for controlling the movement of the support structure 200.

[0032] Optionally, a fork arm 210 for handling a single wafer is provided on the support structure 200. Optionally, the fork arm 210 is a U-shaped sheet structure and has an adsorption function, and can take out a single wafer from the loading module and carry it.

[0033] Optionally, the arrangement quantity and manner of the plurality of adsorption component groups 300 on the support structure 200 are the same as the quantity and placement manner of the wafers on the planetary wheel. 3 or 4 wafers can be placed on the planetary wheel, that is, 3 or 4 adsorption component groups 300 can be arranged. As Figure 2 and 3 shown, taking the arrangement of three adsorption component groups 300 as an example, the intervals between adjacent adsorption component groups 300 are the same, and the fork arm 210 is arranged between two of the adsorption component groups 300.

[0034] Specifically, a retractable moving mechanism 310 is provided on some of the suction and attachment groups 300. The moving mechanism 310 can be selected as a pneumatic slide or other linear retractable structures.

[0035] In some embodiments, a moving mechanism 310 (not shown in the figure) is provided on one of the suction and attachment groups 300. When the wafer is in a horizontal state, after the moving mechanism 310 is shortened, the horizontal plane where the wafer on the suction and attachment group 300 connected to the moving mechanism 310 is located above the horizontal plane where the wafers on the remaining suction and attachment groups 300 are located, facilitating the placement of the three wafers in the buffer device without interference.

[0036] In other embodiments, the moving mechanism 310 is provided on two of the suction and attachment groups 300. When the wafer is in a horizontal state, after the moving mechanism 310 is extended, the horizontal plane where the wafer on the suction and attachment group 300 connected to the moving mechanism 310 is located below the horizontal plane where the wafers on the remaining suction and attachment groups 300 are located, facilitating the placement of the three wafers in the buffer device without interference.

[0037] Combined Figure 3 and Figure 4 , optionally, the suction and attachment group 300 includes a structural plate 320 and a flexible rod 330 provided in the middle of the structural plate 320. The flexible rod 330 extends from a position near the connection between the structural plate 320 and the support structure 200 in a direction away from this connection position. One end of the flexible rod 330 near this connection position is fixed to the structural plate 320, and the other end is cantilevered. Negative pressure suction cups 400 for sucking the wafer are provided on both the structural plate 320 and the flexible rod 330. The negative pressure suction cups 400 on the structural plate 320 are provided near the connection position between the structural plate 320 and the support structure 200, and the negative pressure suction cups 400 on the flexible rod 330 are provided away from the end where the flexible rod 330 is fixed.

[0038] After the suction and attachment group 300 adsorbs the wafer through the negative pressure suction cup 400, the upper and lower wafer control device 100 drives the support structure 200 to move upward and applies an upward force to the wafer through the negative pressure suction cup 400 on the structural plate 320. Due to the presence of the polishing liquid and the flexible deformation ability of the flexible rod 330, the upward force applied by the negative pressure suction cup 400 on the flexible rod 330 to the wafer is smaller, thereby achieving the technical effect of slowly lifting the wafer from one side first to overcome the polishing liquid tension.

[0039] Optionally, the length direction of the flexible rod 330 is set along the diameter of the wafer sucked by the corresponding suction and attachment group 300, facilitating the more stable discharge of the polishing liquid below the wafer when the adsorption assembly presses down on the wafer.

[0040] Optionally, a receiving groove 321 penetrating in the thickness direction is formed in the middle of the structural plate 320, and at least a part of the flexible rod 330 is located in the receiving groove 321, which can not only enable the structural plate 320 to better avoid the deformation of the flexible rod 330, but also protect the connection position between the flexible rod 330 and the structural plate 320.

[0041] In some embodiments, one end of the receiving groove 321 is located on the structural plate 320, and the other end penetrates the end face of the structural plate 320, so that the overhanging end of the flexible rod 330 passes through the penetrating end of the receiving groove 321 (not shown in the figure).

[0042] In other embodiments, both ends of the receiving groove 321 are located on the structural plate 320, and the flexible rod 330 is located in the receiving groove 321. Specifically, the thickness of the flexible rod 330 is smaller than the thickness of the structural plate 320, so that the flexible rod 330 in the non-operating state can be completely hidden in the receiving groove 321 to protect the flexible rod 330. Such a setting can not only give enough deformation space to the flexible rod 330, but also ensure better integrity of the structural plate 320.

[0043] Optionally, at least one negative pressure suction cup 400 is provided on both sides of the flexible rod 330 on the structural plate 320, and the number of negative pressure suction cups 400 on both sides of the flexible rod 330 on the structural plate 320 is the same. Specifically, one negative pressure suction cup 400 is provided on each side of the flexible rod 330 on the structural plate 320, and the two negative pressure suction cups 400 are symmetrically arranged with the flexible rod 330 as the symmetry line.

[0044] Optionally, the negative pressure suction cup 400 on the flexible rod 330 is arranged at the overhanging end of the flexible rod 330, so that the distance between the negative pressure suction cup 400 on the structural plate 320 and the negative pressure suction cup 400 on the flexible rod 330 is closer to the diameter of the wafer, thereby facilitating the removal of the wafer from the planetary wheel with polishing liquid.

[0045] Optionally, a plurality of fixed suction cups 322 are arranged on the structural plate 320 at positions adjacent to the negative pressure suction cup 400 on the flexible rod 330, and the plurality of fixed suction cups 322 are symmetrically arranged on both sides of the flexible rod 330. Specifically, two fixed suction cups 322 are arranged on the structural plate 320.

[0046] The present application also provides a blanking method, including the following steps: The suction attachment group 300 is moved above the planetary wheel by the wafer loading and unloading control device 100 to adsorb all the wafers on the planetary wheel. Specifically, the number of wafers on a single planetary wheel can be 3 or 4, and each suction attachment group 300 adsorbs one wafer.

[0047] Press down the support structure 200 through the wafer loading and unloading control device 100 to apply pressure to the upper surface of the wafer to discharge the liquid between the wafer and the planetary wheel. Specifically, the discharged liquid is polishing liquid.

[0048] Move the robot gripper to the buffer device, and adjust the position of the corresponding upper wafer through the movable mechanism 310, so that there is a gap and they are parallel to each other between the plane where the wafer on the suction attachment group 300 connected to the movable mechanism 310 is located and the planes where the other wafers are located.

[0049] Optionally, when there are 4 wafers on a single planetary wheel, the movable mechanism 310 is arranged on two of the suction attachment groups 300, and the positions of the corresponding two wafers are adjusted through the movable mechanism 310, so that there is a gap and they are parallel to each other between the planes where these two wafers are located and the planes where the other two wafers are located. Specifically, the two suction attachment groups 300 provided with the movable mechanism 310 can be elongated or shortened.

[0050] Optionally, when there are 3 wafers on a single planetary wheel; In some embodiments, the movable mechanism 310 is arranged on two of the suction attachment groups 300, and the movable mechanism 310 is elongated to adjust the positions of the two wafers on the corresponding suction attachment group 300. When all the wafers are in the horizontal plane, the horizontal planes where the two wafers on the suction attachment group 300 corresponding to the movable mechanism 310 are located are lower than the horizontal plane where the remaining one wafer is located.

[0051] In other embodiments, the movable structure 310 is arranged on one of the suction attachment groups 300, and the movable mechanism 310 is shortened to adjust the position of the wafer on the corresponding suction attachment group 300. When all the wafers are in the horizontal plane, the horizontal plane where the one wafer on the suction attachment group 300 corresponding to the movable mechanism 310 is located is higher than the horizontal planes where the other two wafers are located.

[0052] Move the robot gripper through the wafer loading and unloading control device 100 to make the wafer vertical and at the same time place all the wafers on the robot gripper on the buffer device.

[0053] It should be noted that when three negative pressure suction cups 400 and two fixed suction cups 322 are used in this application, the deformation generated by the flexible rod 330 can smoothly lift the wafer and ensure that the wafer is not broken by external forces. Specifically, a 12-inch wafer is used as the test object for the force simulation test of the suction attachment group 300, and the following three groups of tests are set respectively.

[0054] Test 1: As Figure 5 shown, lift the wafer in an environment where there is no polishing liquid between the wafer and the planetary wheel. The weight load of a 12-inch wafer is 1.5N. When the total load on the three negative pressure suction cups 400 is designed to be 2N, the maximum deformation of the flexible rod 330 is 1.3mm.

[0055] Test 2: If Figure 6 As shown, the wafer is lifted in an environment where there is polishing liquid between the wafer and the planetary wheel. The weight load of the 12-inch wafer is 1.5N, and the simulated tension of the polishing liquid between the planetary wheel and the wafer is 3.5N, that is, the total load on the three negative pressure suction cups 400 is 5N, and the maximum deformation of the flexible rod 330 is 2.86mm.

[0056] Test 3: If Figure 7 As shown, when a pressure of 20N is applied to the support structure 200, the maximum deformation of the adsorption component group is 0.09mm.

[0057] When a 12-inch wafer is selected as the lifting object, the extraction of the wafer needs to meet three conditions. First, the wafer is placed in the slot, and the deformation of the flexible rod 330 cannot affect the wafer from entering the corresponding slot for processing or storage; second, the wafer can be tilted and lifted without being damaged under the hindrance of liquid tension; third, the wafer can withstand uniform force during the pressure drainage process to achieve rapid drainage without being crushed.

[0058] Depend on Figure 5 It can be seen that the maximum deformation of the flexible rod 330 caused by lifting the wafer without resistance is 1.3 mm, which meets the requirements for the wafer to enter various slots. Figure 6 It can be seen that under the resistance of liquid tension, the maximum deformation of the flexible rod 330 can exceed 2.8mm and reach 2.86mm. At the same time, the three negative pressure suction cups 400 are on the same plane, which can make the wafer tilt but smoothly leave the liquid tension area, overcoming the liquid tension while protecting the integrity of the wafer. Figure 7 It can be seen that after applying downward pressure to the support structure 200, the maximum deformation of the structural plate 320 is 0.09 mm. Therefore, the pressure transmitted to the wafer through the three negative pressure suction cups 400 and the two fixed suction cups 322 is relatively uniform, that is, the upper surface of the wafer is subjected to relatively consistent and evenly distributed pressure, so that the liquid below is quickly discharged while avoiding the risk of the wafer being broken by external force.

[0059] It should be understood that those skilled in the art can make improvements or changes based on the above description, and all these improvements and changes should fall within the scope of protection of the claims attached to this application.

Claims

1. A robot gripper, characterized in that, Comprising: Upper and lower wafer control device (100), Support structure (200), connected to the end of the upper and lower wafer control device (100) and driven to move by the upper and lower wafer driving device; And Multiple suction attachment groups (300), arranged on the support structure (200) and used to adsorb multiple wafers on the planetary gear; A retractable moving mechanism (310) is arranged on a part of the suction attachment groups (300); After the moving mechanism (310) extends or contracts, a gap is formed and is parallel between the plane where the wafers on the suction attachment group (300) connected to the moving mechanism (310) are located and the plane where the wafers on the remaining suction attachment groups (300) are located.

2. The robot gripper according to claim 1, wherein The suction attachment group (300) includes A structural plate (320), connected to the support structure (200); and Flexible rods (330), arranged in the middle of the structural plate (320); The flexible rods (330) extend from the position adjacent to the connection position of the structural plate (320) and the support structure (200) in a direction away from this connection position. One end of the flexible rod (330) adjacent to this connection position is fixed, and the other end is cantilevered; Negative pressure suction cups (400) for sucking wafers are arranged on both the structural plate (320) and the flexible rods (330); the negative pressure suction cups (400) on the structural plate (320) are arranged close to the connection position of the structural plate (320) and the support structure (200), and the negative pressure suction cups (400) on the flexible rods (330) are arranged away from the fixed end of the flexible rod (330).

3. The robot gripper according to claim 2, characterized in that The length direction of the flexible rod (330) is arranged along the diameter of the wafer sucked by the corresponding suction attachment group (300).

4. The robot gripper according to claim 2, wherein A receiving groove (321) penetrating through its thickness direction is opened in the middle of the structural plate (320), and at least a part of the flexible rod (330) is located in the receiving groove (321).

5. The robot gripper according to claim 4, wherein Both ends of the receiving groove (321) are located on the structural plate (320), and the flexible rod (330) is located in the receiving groove (321).

6. The robot gripper according to any one of claims 2-5, characterized in that, At least one negative pressure suction cup (400) is arranged on both sides of the flexible rod (330) on the structural plate (320), and the number of negative pressure suction cups (400) on both sides of the flexible rod (330) on the structural plate (320) is the same.

7. The robotic gripper according to claim 2, wherein, The negative pressure suction cups (400) on the flexible rods (330) are arranged at the cantilevered end of the flexible rods (330).

8. The robot gripper according to claim 2, wherein, A plurality of fixed suction cups (322) are arranged on the structural plate (320) adjacent to the position where the negative pressure suction cups (400) are arranged on the flexible rod (330), and the plurality of fixed suction cups (322) are symmetrically arranged on both sides of the flexible rod (330).

9. The robot gripper according to claim 1, wherein, A fork arm (210) is arranged on the support structure (200) for transporting a single wafer.

10. A blanking method, which uses the robot gripper described in any one of claims 1-9 for handling, is characterized in that, Including the following steps: Move the robot gripper to the planetary gear and adsorb 3 or 4 wafers on the planetary gear; Move the robot gripper to the buffer device, and adjust the position of the corresponding upper wafer through the moving mechanism (310) so that a gap is formed and is parallel between the plane where the wafers on the suction attachment group (300) connected to the moving mechanism (310) are located and the plane where the remaining wafers are located. The mobile robot gripper positions the wafers vertically and simultaneously places all the wafers on the robot gripper on the buffer device.

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