Electronic paper display device

Abstract

The invention discloses an electronic paper display device, which comprises a lower substrate, an electronic ink layer, a flexible circuit board and an upper protection layer, the electronic ink layer and the flexible circuit board are arranged on the top surface of the lower substrate, the upper protection layer is arranged on the top surface of the electronic ink layer, and the upper protection layer is arranged on the top surface of the flexible circuit board. The upper protection layer is provided with a derivative structure, and a part of the derivative structure covers the top surface of the flexible circuit board. Therefore, a Vcom (reference voltage) signal of the flexible circuit board can be directly transmitted to the upper protection layer, and a lug part is not required to be cut from the electronic ink layer to accommodate the conductive silver adhesive, so that the cutting utilization rate and the usable range of the electronic ink layer are improved.

Description

Technical Field

[0001] The present invention relates to a display device, and particularly to an electronic paper display device. Background Art

[0002] Please refer to Figure 7 and Figure 8 As shown, a conventional electronic paper display device includes an array substrate 100, an electronic ink layer 110, a flexible circuit board 120, a transparent conductive layer 130, and a conductive silver paste 140. The electronic ink layer 110 and the flexible circuit board 120 are disposed on the array substrate 100. The transparent conductive layer 130 is disposed on the electronic ink layer 110. The conductive silver paste 140 is disposed between the array substrate 100 and the transparent conductive layer 130. The array substrate 100 and the transparent conductive layer 130 are electrically connected through the conductive silver paste 140. The Vcom signal of the flexible circuit board 120 will be transmitted to the transparent conductive layer 130 through the array substrate 100 and the conductive silver paste 140, so as to form an electric field between the array substrate 100 and the transparent conductive layer 130 to drive the electronic ink layer 110.

[0003] In order to reserve a conduction channel for the conductive silver paste 140, as Figure 5 and Figure 6 shown, the electronic ink layer 110 usually forms more than two protruding parts 150. Each of the more than two protruding parts 150 has a through hole 160. The conductive silver paste 140 is filled in the through holes 160 of the more than two protruding parts 150. However, in the prior art, the electronic ink layer is usually cut to remove a part to form the more than two protruding parts 150, which will cause waste of the electronic ink layer 110 and reduce the available range of the electronic ink layer 110.

[0004] Therefore, it is indeed necessary to propose a better solution to solve the deficiencies of the prior art. Summary of the Invention

[0005] In view of the above deficiencies of the prior art, the main object of the present invention is to provide an electronic paper display device, which improves the cutting utilization rate and available range of the electronic ink layer through the improved structure of the electronic paper display device.

[0006] To solve the above problems of the prior art, the main technical solution adopted by the present invention is to make the aforementioned electronic paper display device include: a lower substrate; an electronic ink layer, which is disposed on the top surface of the lower substrate; a flexible circuit board, which is disposed on the top surface of the lower substrate; An upper protective layer is provided on the top surface of the electronic ink layer, and the upper protective layer has a derivative structure, and a part of the derivative structure covers the top surface of the flexible circuit board.

[0007] Preferably, the derivative structure of the upper protective layer further includes: A connecting portion is provided between the electronic ink layer and the flexible circuit board; A covering portion covers the top surface of the flexible circuit board and is connected to the connecting portion, and the bottom surface of the connecting portion is in contact with the top surface of the lower substrate.

[0008] Preferably, the connecting portion further includes: A first connecting section is connected to the upper protective layer located on the top surface of the electronic ink layer; A second connecting section is connected to the first connecting section; A third connecting section is connected to the second connecting section and the covering portion; Wherein, the bottom surface of the connecting portion is formed by the bottom surface of the second connecting section, and the bottom surface of the second connecting section is in contact with the top surface of the lower substrate.

[0009] Preferably, the first connecting section is attached to the edge of the electronic ink layer, the bottom surface of the second connecting section is attached to the top surface of the lower substrate, and the third connecting section is attached to the edge of the flexible circuit board.

[0010] Preferably, the upper protective layer includes: A first transparent adhesive layer is provided on the top surface of the electronic ink layer; A first transparent conductive layer is provided on the top surface of the first transparent adhesive layer; A first upper substrate is provided on the top surface of the first transparent conductive layer; The derivative structure includes: A second transparent adhesive layer is provided on the top surfaces of the lower substrate and the flexible circuit board and is connected to the first transparent adhesive layer; A second transparent conductive layer is provided on the top surface of the second transparent adhesive layer and is connected to the first transparent conductive layer; A second upper substrate is provided on the top surface of the second transparent conductive layer and is connected to the first upper substrate.

[0011] Preferably, a conductive portion can be further formed upward on the top surface of the flexible circuit board, and the second transparent conductive layer of the derivative structure covers the conductive portion.

[0012] Preferably, the range of the upper protective layer is larger than that of the electronic ink layer, and the edge of the upper protective layer protrudes from the edge of the electronic ink layer and fits against the top surface of the lower substrate.

[0013] Preferably, it further includes an integrated circuit, which is disposed on the top surface of the lower substrate and between the electronic ink layer and the flexible circuit board.

[0014] Preferably, the derivative structure is formed with an opening corresponding to the integrated circuit, and the integrated circuit is exposed through the opening.

[0015] Preferably, the derivative structure is in the shape of a long strip, and the integrated circuit is located between the derivative structures.

[0016] In the present invention, the top surface of the flexible circuit board is covered by the derivative structure of the upper protective layer, so that the Vcom (reference voltage) signal of the flexible circuit board can be directly transmitted to the upper protective layer, without cutting out protruding ears in the electronic ink layer to accommodate conductive silver paste, thereby achieving the purpose of improving the cutting utilization rate and available range of the electronic ink layer. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 A top view of the first embodiment of the electronic paper display device of the present invention; Figure 2A For an embodiment of the present invention Figure 1 A cross-sectional view along line A-A'; Figure 2B For an embodiment of the present invention Figure 1 Another cross-sectional view along line A-A'; Figure 3 For an embodiment of the present invention Figure 4 A cross-sectional view along line B-B'; Figure 4 A top view of the second embodiment of the electronic paper display device of the present invention; Figure 5 Another top view of the second embodiment of the electronic paper display device of the present invention; Figure 6 Another top view of the second embodiment of the electronic paper display device of the present invention; Figure 7 A top view of a conventional electronic paper display device; Figure 8 A cross-sectional view of a conventional electronic paper display device along line C-C'. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0018] Regarding the first embodiment of the electronic paper display device of the present invention, please refer to Figure 1 andFigure 2A As shown, it includes a lower substrate 10, an electronic ink layer 20, a flexible circuit board 30 and an upper protective layer 41. The electronic ink layer 20 is disposed on one side of the top surface of the lower substrate 10. The flexible circuit board 30 is disposed on the other side of the top surface of the lower substrate 10 and has a spacing from the electronic ink layer 20. The upper protective layer 41 is disposed on the top surface of the electronic ink layer 20. Moreover, the upper protective layer 41 has a derivative structure 42, and a part of the derivative structure 42 covers the top surface of the flexible circuit board 30. In this embodiment, the lower substrate 10 may be composed of a thin-film transistor (TFT) array substrate.

[0019] With the above structure, the derivative structure 42 of the upper protective layer 41 covers the top surface of the flexible circuit board 30, so that the Vcom (reference voltage) signal of the flexible circuit board 30 can be directly transmitted to the upper protective layer 41, without cutting out a protruding portion in the electronic ink layer 20 to accommodate conductive silver paste, thereby improving the cutting utilization rate and available range of the electronic ink layer.

[0020] As Figure 2A shown, in this embodiment, the derivative structure 42 of the upper protective layer 41 further includes a connecting portion 421 and a covering portion 422. The connecting portion 421 is disposed between the electronic ink layer 20 and the flexible circuit board 30 and is connected to the upper protective layer 41. The covering portion 422 covers the top surface of the flexible circuit board 30 and is connected to the connecting portion 421. In this embodiment, the connecting portion 421 may be in a curved arc shape and contact the top surface of the lower substrate 10.

[0021] In this embodiment, as Figure 2B shown, the connecting portion 421 may further include a first connecting segment 4211, a second connecting segment 4212 and a third connecting segment 4213. The first connecting segment 4211 is connected to the upper protective layer 41 located on the top surface of the electronic ink layer 20. The second connecting segment 4212 is connected to the first connecting segment 4211. The third connecting segment 4213 is connected to the second connecting segment 4212 and the covering portion 422. Among them, the bottom surface of the connecting portion 421 is formed by the bottom surface of the second connecting segment 4212, and the bottom surface of the second connecting segment 4212 contacts the top surface of the lower substrate 10.

[0022] As Figure 2BAs shown, to improve the sealing effect of the present invention, in this embodiment, the first connecting section 4211 and the third connecting section 4213 may be vertically arranged, while the second connecting section 4212 may be horizontally arranged. The side surface of the first connecting section 4211 is mutually attached to the edge of the electronic ink layer 20, the bottom surface of the second connecting section 4212 is mutually attached to the top surface of the lower substrate 10, and the side surface of the third connecting section 4213 is mutually attached to the edge of the flexible circuit board 30.

[0023] Regarding the second embodiment of the present invention, please refer to Figure 3 and Figure 4 As shown, its main technical content is substantially the same as that of the first embodiment, except that the upper protective layer 41 includes a first transparent adhesive layer 411, a first transparent conductive layer 412, and a first upper substrate 413. The first transparent adhesive layer 411 is disposed on the top surface of the electronic ink layer 20; the first transparent conductive layer 412 is disposed on the top surface of the first transparent adhesive layer 411; and the first upper substrate 413 is disposed on the top surface of the first transparent conductive layer 412.

[0024] In addition, in this embodiment, the derivative structure 42 includes a second transparent adhesive layer 423, a second transparent conductive layer 424, and a second upper substrate 425. The second transparent adhesive layer 423 is disposed on the top surfaces of the lower substrate 10 and the flexible circuit board 30 and is connected to the first transparent adhesive layer 411; the second transparent conductive layer 424 is disposed on the top surface of the second transparent adhesive layer 423 and is connected to the first transparent conductive layer 412; and the second upper substrate 425 is disposed on the top surface of the second transparent conductive layer 424 and is connected to the first upper substrate 413. In this embodiment, the adhesive material used for the first transparent adhesive layer 411 of the upper protective layer 41 and the second transparent adhesive layer 423 of the derivative structure 42 may be a thermosetting adhesive or a pressure-sensitive adhesive.

[0025] As Figure 3 and Figure 4As shown, in this embodiment, one or more conductive portions 31 may be further formed upward on the top surface of the flexible circuit board 30. The second adhesive layer 423 of the derivative structure 42 surrounds the one or more conductive portions 31, and the second transparent conductive layer 424 of the derivative structure 42 covers the one or more conductive portions 31. In this embodiment, the one or more conductive portions 31 may be respectively constituted by a solder bump. In addition, in this embodiment, the bottom surface of the flexible circuit board 30 and the top surface of the lower substrate 10 may be connected to each other through an anisotropic conductive film (ACF) (not shown in the figure). The number of the above-mentioned conductive portions 31 may also be only one according to the design requirements, and the present invention does not limit the number of the conductive portions 31. The Vcom signal on the flexible circuit board 30 is transmitted to the second transparent conductive layer 424 and the first transparent conductive layer 412 through the conductive portion 31.

[0026] In addition, in this embodiment, the range of the upper protective layer 41 is larger than the range of the electronic ink layer 20. The edge of the upper protective layer 41 protrudes out of the edge of the electronic ink layer 20 and fits with the top surface of the lower substrate 10 to wrap the electronic ink layer 20 to form a sealed effect.

[0027] In this embodiment, as Figure 4 shown, it further includes an integrated circuit 50. The integrated circuit 50 is disposed on the top surface of the lower substrate 10 and between the electronic ink layer 20 and the flexible circuit board 30. In this embodiment, the derivative structure 42 is rectangular.

[0028] In addition, please refer to Figure 5 shown. In this embodiment, the derivative structure 42 is formed with an opening 426 corresponding to the integrated circuit 50, and the integrated circuit 50 is exposed through the opening 426.

[0029] In addition, regarding the third embodiment of the present invention, please refer to Figure 6 shown. Its main technical content is substantially the same as that of the second embodiment, but the main difference lies in the different shapes and sizes of the derivative structure 42. In this embodiment, the shape of the derivative structure 42 is in the form of a plurality of long strips, and the integrated circuit 50 is located between the derivative structures 42.

Claims

1. An electronic paper display device, characterized in that, Comprising: A lower substrate; An electronic ink layer provided on the top surface of the lower substrate; A flexible circuit board provided on the top surface of the lower substrate; An upper protective layer provided on the top surface of the electronic ink layer, and the upper protective layer has a derivative structure, and a part of the derivative structure covers the top surface of the flexible circuit board.

2. The electronic paper display device according to claim 1, wherein The derivative structure of the upper protective layer further includes: A connecting portion provided between the electronic ink layer and the flexible circuit board; A covering portion covering the top surface of the flexible circuit board and connected to the connecting portion, and the bottom surface of the connecting portion is in contact with the top surface of the lower substrate.

3. The electronic paper display device according to claim 2, wherein The connecting portion further includes: A first connecting segment connected to the upper protective layer located on the top surface of the electronic ink layer; A second connecting segment connected to the first connecting segment; A third connecting segment connected to the second connecting segment and the covering portion; Wherein, the bottom surface of the connecting portion is formed by the bottom surface of the second connecting segment, and the bottom surface of the second connecting segment is in contact with the top surface of the lower substrate.

4. The electronic paper display device according to claim 3, wherein The first connecting segment is attached to the edge of the electronic ink layer, the bottom surface of the second connecting segment is attached to the top surface of the lower substrate, and the third connecting segment is attached to the edge of the flexible circuit board.

5. The electronic paper display device according to claim 1, wherein The upper protective layer includes: A first transparent adhesive layer provided on the top surface of the electronic ink layer; A first transparent conductive layer provided on the top surface of the first transparent adhesive layer; A first upper substrate provided on the top surface of the first transparent conductive layer; The derivative structure includes: A second transparent adhesive layer provided on the top surfaces of the lower substrate and the flexible circuit board and connected to the first transparent adhesive layer; A second transparent conductive layer provided on the top surface of the second transparent adhesive layer and connected to the first transparent conductive layer; A second upper substrate provided on the top surface of the second transparent conductive layer and connected to the first upper substrate.

6. The electronic paper display device according to claim 5, wherein, A conductive portion can be further formed upward on the top surface of the flexible circuit board, and the second transparent conductive layer of the derivative structure covers the conductive portion.

7. The electronic paper display device according to claim 1, characterized in that, The range of the upper protective layer is larger than the range of the electronic ink layer, and the edge of the upper protective layer protrudes from the edge of the electronic ink layer and is in contact with the top surface of the lower substrate.

8. The electronic paper display device according to claim 1, wherein Further including an integrated circuit, the integrated circuit is provided on the top surface of the lower substrate and is provided between the electronic ink layer and the flexible circuit board.

9. The electronic paper display device according to claim 8, wherein, The derivative structure forms an opening corresponding to the integrated circuit, and the integrated circuit is exposed through the opening.

10. The electronic paper display device according to claim 8, wherein The derivative structure is in the shape of a long strip, and the integrated circuit is located between the derivative structures.

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