Spraying device of semiconductor equipment

Abstract

The invention discloses a spraying device of semiconductor equipment, which comprises a first spraying piece capable of moving along a first direction and used for spraying liquid to an outer ring area of a wafer; the second spraying piece is connected to the first spraying piece so as to move synchronously with the spraying pieces; the second spraying piece is annularly arranged and forms a containing space, and the containing space is used for containing the first spraying piece; a spraying channel is formed in the second spraying piece, so that the liquid can pass through the spraying channel; the second spraying piece is provided with a spraying surface, and the spraying surface is arranged right opposite to the wafer; the plurality of spraying parts are all arranged on the spraying surface, and the spraying parts are communicated with the spraying channel; and the plurality of spraying parts have different angles along the first direction, so that the liquid is uniformly sprayed to different positions of the inner ring area of the wafer from the spraying parts after flowing through the spraying channel. According to the invention, the developing solution on the surface of the wafer can be uniformly distributed, and the problem of excessive development on the surface of the wafer is improved.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor devices, and particularly to a spraying device for a semiconductor device. Background Art

[0002] In the field of semiconductor manufacturing, the lithography process is one of the key steps to achieve high-precision pattern transfer, and the development process is a crucial link in the lithography process.

[0003] In the development process of the prior art, the phenomenon of the accumulation of developer droplets on the surface of the wafer is likely to occur, that is, the developer forms local accumulation on the photoresist surface, resulting in an accelerated development speed in the local area. In addition, the consumption of the developer in the prior art is relatively high. Especially when dealing with thick films, more developer is required to ensure the development effect. Excessive developer will cause uneven distribution of the developer on the photoresist surface and also lead to overdevelopment. At the same time, in the prior art, the developer is directly sprayed onto the wafer surface, and splashing may occur during the spraying process, resulting in uneven distribution of the developer and also leading to the problem of overdevelopment.

[0004] Therefore, it is necessary to provide a new spraying device for a semiconductor device to solve the above problems existing in the prior art. Summary of the Invention

[0005] The purpose of the present invention is to provide a spraying device for a semiconductor device, which is used to spray the developer on the wafer, and can make the developer on the wafer surface evenly distributed, and improve the problem of overdevelopment on the wafer surface.

[0006] To achieve the above purpose, the technical solution of the present invention is as follows: A spraying device for a semiconductor device, comprising: A first spraying member movable along a first direction, configured to spray liquid onto the outer ring area of the wafer; A second spraying member connected to the first spraying member to move synchronously with the spraying member; the second spraying member is annularly arranged and forms a receiving space for receiving the first spraying member; a spraying channel is formed in the second spraying member for passing the liquid; the second spraying member has a spraying surface facing the wafer; A plurality of spraying parts are all arranged on the spraying surface, and the spraying parts are communicated with the spraying channel; the plurality of spraying parts have different angles along the first direction, so that the liquid flows through the spraying channel and is evenly sprayed from the spraying parts to different positions in the inner ring area of the wafer.

[0007] By adopting the above technical solution, a second spraying member is arranged outside the first spraying member. When spraying the inner ring area of the wafer, the annular second spraying member works. Through the spraying parts with different angles on the spraying surface, spraying on different positions of the inner ring area of the wafer is realized. During this process, the wafer keeps rotating, and in cooperation with the spraying of the second spraying member, the developing solution is evenly distributed in the inner ring area of the wafer. The first spraying member can move along the first direction. After the spraying of the inner ring area of the wafer is completed, the first spraying member sprays the outer ring area of the wafer. During this process, the wafer keeps rotating so that the developing solution is evenly distributed in the outer ring area of the wafer, thereby realizing uniform spraying of the developing solution on the surface of the wafer and improving the problem of overdevelopment caused by uneven spraying of the developing solution. The spraying device of the present invention can also effectively reduce the splashing phenomenon of the developing solution by optimizing the spraying method. In the prior art, when the developing solution is directly sprayed onto the surface of the wafer, splashing easily occurs, resulting in uneven distribution of the developing solution and further causing problems such as overdevelopment. At the same time, through the annular design of the second spraying member and the spraying parts with different angles, the developing solution can be sprayed onto the surface of the wafer in a more gentle and uniform manner, avoiding splashing and further improving the stability and reliability of the developing process.

[0008] Optionally, a plurality of the spraying channels are provided, and the plurality of the spraying channels are spaced apart along the first direction. The spraying surface is arc-shaped and is divided into an inner ring liquid outlet part, a middle ring liquid outlet part, and an outer ring liquid outlet part from inside to outside. A plurality of the spraying parts are respectively arranged at intervals along the circumferences of the inner ring liquid outlet part, the middle ring liquid outlet part, and the outer ring liquid outlet part, so that the liquid is respectively sprayed onto different positions on the surface of the wafer from the inner ring liquid outlet part, the middle ring liquid outlet part, and the outer ring liquid outlet part.

[0009] Optionally, two adjacent spraying parts in the inner ring liquid outlet part are spaced apart along the first direction, so that the two adjacent spraying parts have different spraying angles, and a first liquid spraying circle and a second liquid spraying circle are formed on the inner ring liquid outlet part.

[0010] Optionally, the spraying parts in the middle ring liquid outlet part are arranged vertically. The spraying parts in the inner ring liquid outlet part are inclined, and the included angle between the spraying parts in the inner ring liquid outlet part and the spraying parts in the middle ring liquid outlet part is 25° - 70°. The spraying parts in the outer ring liquid outlet part are inclined, and the included angle between the spraying parts in the outer ring liquid outlet part and the spraying parts in the middle ring liquid outlet part is 25° - 35°.

[0011] Optionally, the spraying parts in the first liquid spraying circle are inclined, and the included angle between the spraying parts in the first liquid spraying circle and the spraying parts in the middle ring liquid outlet part is 60° - 70°. The spraying part of the second liquid spraying ring is inclined, and the included angle between it and the spraying part of the middle ring liquid outlet part is 25°-35°.

[0012] Optionally, the first spraying member includes: A spraying member having a liquid inlet and a liquid outlet, the spraying member is bent so that there is an angle between the liquid outlet and the liquid inlet; A telescopic member that can be telescoped in the vertical direction, one end is arranged on the spraying member, the telescopic member is hollow and communicated with the liquid inlet, so that the liquid flows through the telescopic member and then enters the spraying member and flows out from the liquid outlet; Wherein, after the second spraying member finishes spraying, the first spraying member and the second spraying member move synchronously to the outer ring area of the wafer, the spraying member extends out of the accommodation space, and the liquid flows through the spraying member to spray the outer ring area of the wafer.

[0013] Optionally, it further includes: A controller, arranged in the accommodation space; A control member, one end is connected to the controller, and the other end is connected to the spraying member; The controller drives the spraying member to move through the control member to control the spraying member to extend out of the accommodation space or retract into the accommodation space.

[0014] Optionally, after the spraying member retracts into the accommodation space, the vertical distance from the bottom wall of the spraying member to the bottom wall of the second spraying member is greater than 16 mm; the horizontal distance from the liquid outlet to the inner wall of the accommodation space is greater than 15 mm.

[0015] Optionally, a first sensor is arranged on the bottom wall of the spraying member to detect the distance from the bottom wall of the spraying member to the surface of the wafer; a second sensor is arranged on the side wall of the spraying member to detect the distance from the liquid outlet to the inner wall of the accommodation space.

[0016] Optionally, it further includes: A supply device, both the first spraying member and the second spraying member are communicated with the supply device, and the supply device provides liquid to the first spraying member and / or the second spraying member to spray the wafer. Description of the Drawings

[0017] Figure 1 Schematic diagram of the structure of the first spraying member of the embodiment of the present invention retracted into the accommodation space; Figure 2 Cross-sectional view of the position of the spraying part on the second spraying member when the spraying part of the embodiment of the present invention is in the shape of a hole and is provided with one spraying channel; Figure 3A cross-sectional view of the position of the spraying part on the second spraying member when the spraying part of the embodiment of the present invention is in a hole shape and is provided with a plurality of spraying channels; Figure 4 A cross-sectional view of the position on the second spraying member when the spraying part of the embodiment of the present invention is in a tubular shape; Figure 5 A developed view of the spraying surface and a schematic diagram of the position of the spraying part on the spraying surface according to the embodiment of the present invention; Figure 6 A schematic diagram of the structure in which the first spraying member of the embodiment of the present invention extends out of the accommodation space.

[0018] Reference numerals: 100, first spraying member; 110, spraying member; 112, liquid outlet; 120, telescopic member; 200, second spraying member; 210, accommodation space; 220, spraying channel; 230, spraying surface; 231, inner ring liquid outlet part; 232, first liquid spraying ring; 233, second liquid spraying ring; 234, middle ring liquid outlet part; 235, outer ring liquid outlet part; 240, spraying part; 310, controller; 320, control member; 330, first sensor; 340, second sensor. Detailed implementation manners

[0019] To make the objectives, technical solutions, and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below. Apparently, the described embodiments are some, but not all, of the embodiments of the present invention. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present invention without creative efforts shall fall within the protection scope of the present invention. Unless otherwise defined, the technical terms or scientific terms used herein shall have the ordinary meanings understood by those of ordinary skill in the art in the field to which the present invention belongs. The words such as "including" used herein mean that the elements or objects appearing before this word cover the elements or objects listed after this word and their equivalents, without excluding other elements or objects.

[0020] The following will be combined with the attached Figures 1-6 , and a further detailed description will be given of the specific implementation manners of the present invention.

[0021] An embodiment of the present invention provides a spraying device. The spraying device is used for semiconductor equipment and sprays a wafer in the semiconductor equipment. Among them, the spraying device includes: A first spraying member 100 movable along a first direction, which is used to spray liquid on the outer ring area of the wafer; The second spraying member 200 is connected to the first spraying member 100 to move synchronously with the spraying member; the second spraying member 200 is annularly arranged to form a receiving space 210 for receiving the first spraying member 100; a spraying channel 220 is formed in the second spraying member 200 for passing the liquid; the second spraying member 200 has a spraying surface 230 facing the wafer; A plurality of spraying parts 240 are all arranged on the spraying surface 230, and the spraying parts 240 are communicated with the spraying channel 220; the plurality of spraying parts 240 have different angles along a first direction, so that after the liquid flows through the spraying channel 220, it is uniformly sprayed from the spraying parts 240 to different positions in the inner ring area of the wafer.

[0022] In some embodiments, the surface of the wafer is divided into an inner ring area and an outer ring area, wherein the inner ring area is circular, the outer ring area is annular, and the outer ring area is coaxially arranged with the inner ring area, and at the same time, the outer ring area is located outside the inner ring area.

[0023] In some specific embodiments, refer to Figure 1 , the wafer is sprayed with developing solution by means of two spraying members sleeved. Specifically, the second spraying member 200 is annularly arranged to form a receiving space 210, the first spraying member 100 is tubular and passes through the receiving space 210, and the bottom side wall of the second spraying member 200 is used to spray the liquid. During the working process, the bottom of the annular second spraying member 200 and the first spraying member 100 can both spray the liquid to spray different positions of the wafer, thereby improving the problem of uneven spraying on the surface of the wafer, and thus improving the problem of overdevelopment caused by too much developing solution in the central area of the wafer.

[0024] In some specific embodiments, refer to Figure 1 , the spraying surface 230 of the second spraying member 200 is the bottom surface of the second spraying member 200, and the spraying surface 230 faces the wafer, so that the liquid flowing through the spraying surface 230 can be sprayed onto the surface of the wafer. More specifically, a plurality of spraying parts 240 are arranged on the spraying surface 230, and the spraying parts 240 are communicated with the spraying channel 220, so that the liquid can flow through the spraying channel 220 and be sprayed onto the surface of the wafer through the spraying parts 240.

[0025] In some more specific embodiments, refer to Figure 4 , the spraying part 240 is tubular, fixedly arranged on the spraying surface 230 and communicated with the spraying channel 220, so that the liquid in the spraying channel 220 can be transferred to the surface of the wafer through the spraying part 240.

[0026] In some more specific embodiments, refer to Figure 2, the spraying part 240 is in a hole shape. The hole-shaped spraying part 240 is opened on the spraying surface 230 and penetrates through the spraying surface 230 to communicate with the spraying channel 220, so that the liquid in the spraying channel 220 can be transferred to the wafer surface through the spraying part 240. In this embodiment, it is preferred that the spraying part 240 is in a hole shape.

[0027] More specifically, referring to Figure 2 and Figure 3 , there are multiple spraying parts 240, and the multiple spraying parts 240 are evenly distributed along the circumferential direction of the spraying surface 230 to facilitate spraying on the wafer surface. At the same time, the multiple spraying parts 240 have different angles in the first direction, so that the liquid flowing through the spraying part 240 can have different angles, and thus be sprayed to different positions on the wafer surface. In some specific embodiments, the first direction is the radial direction of the second spraying member 200.

[0028] In some embodiments, there is one spraying channel 220, and multiple spraying parts 240 are all communicated with the spraying channel 220. During the spraying process, each spraying part 240 can spray out liquid.

[0029] In some embodiments, there are multiple spraying channels 220, and the multiple spraying channels 220 are spaced apart along the horizontal direction; The spraying surface 230 is arranged in an arc shape and is divided into an inner ring liquid outlet part 231, a middle ring liquid outlet part 234 and an outer ring liquid outlet part 235 from inside to outside; multiple spraying parts 240 are respectively arranged at intervals along the circumferential direction of the inner ring liquid outlet part 231, the middle ring liquid outlet part 234 and the outer ring liquid outlet part 235, so that the liquid is sprayed to different positions on the wafer surface from the inner ring liquid outlet part 231, the middle ring liquid outlet part 234 and the outer ring liquid outlet part 235 respectively.

[0030] Among them, referring to Figure 1 and Figure 5 , there are multiple spraying channels 220, and the multiple spraying parts 240 correspond to the positions of the spraying channels 220 at different positions. Specifically, the spraying surface 230 is sequentially divided into an inner ring liquid outlet part 231, a middle ring liquid outlet part 234 and an outer ring liquid outlet part 235 from inside to outside. Among them, multiple spraying parts 240 are respectively arranged at intervals along the circumferential direction of the inner ring liquid outlet part 231, the middle ring liquid outlet part 234 and the outer ring liquid outlet part 235. The inner ring liquid outlet part 231, the middle ring liquid outlet part 234 and the outer ring liquid outlet part 235 respectively correspond to different spraying channels 220. Liquid is introduced into different spraying channels 220, so that the liquid is sprayed out from the spraying parts 240 of the inner ring liquid outlet part 231, the middle ring liquid outlet part 234 or the outer ring liquid outlet part 235, thereby facilitating controlling the liquid to be sprayed to different positions on the wafer surface.

[0031] In some specific embodiments, in order for the liquid to be sprayed onto different positions on the surface of the wafer, the spraying portions 240 on the inner ring liquid outlet portion 231 and the outer ring liquid outlet portion 235 are both inclined, so as to facilitate spraying the liquid onto different positions on the surface of the wafer.

[0032] In some specific embodiments, the spraying surface 230 is arc-shaped, so that the spraying portions 240 at different positions on the spraying surface 230 are inclined. Specifically, since the spraying surface 230 is arc-shaped, the spraying portions 240 on the inner ring liquid outlet portion 231 and the outer ring liquid outlet portion 235 are inclined, and the specific inclination angle will be introduced later.

[0033] The two adjacent spraying portions 240 in the inner ring liquid outlet portion 231 are arranged at intervals in the horizontal direction, so that the two adjacent spraying portions 240 have different spraying angles, so as to form a first liquid spraying ring 232 and a second liquid spraying ring 233 on the inner ring liquid outlet portion 231.

[0034] In order to further adjust the spraying position of the spraying portion 240, in the inner ring liquid outlet portion 231, the two adjacent spraying portions 240 are arranged at intervals in the first direction, so as to form a first liquid spraying ring 232 and a second liquid spraying ring 233 on the inner ring liquid outlet portion 231, that is, the spraying portions 240 in the first liquid spraying ring 232 and the spraying portions 240 in the second liquid spraying ring 233 are arranged in a staggered manner. At the same time, since the spraying surface 230 is arc-shaped, the spraying portions 240 in the first liquid spraying ring 232 and the spraying portions 240 in the second liquid spraying ring 233 have different spraying angles.

[0035] In some embodiments, the spraying members within the range of the first liquid spraying ring 232 and the spraying members within the range of the second liquid spraying ring 233 are both connected to the same spraying channel 220.

[0036] In some embodiments, the spraying members within the range of the first liquid spraying ring 232 and the spraying members within the range of the second liquid spraying ring 233 are connected to different spraying channels 220.

[0037] Among them, since the spraying surface 230 is arc-shaped, due to the different positions of the first liquid spraying ring 232, the second liquid spraying ring 233, the middle ring liquid outlet portion 234 and the outer ring liquid outlet portion 235 on the spraying surface 230, and the spraying members are in the shape of holes and the axes of the spraying members are all perpendicular to the spraying surface 230, the spraying portions 240 in the first liquid spraying ring 232, the second liquid spraying ring 233, the middle ring liquid outlet portion 234 and the outer ring liquid outlet portion 235 have different angles and can spray the liquid onto different positions on the surface of the wafer.

[0038] More specifically, during the wafer processing, the center of the wafer usually undergoes overdevelopment. More specifically, the overdevelopment generally occurs within the circular area formed by a wafer surface radius of 50 - 80 mm, that is, the inner ring area of the wafer surface. Therefore, during the spraying process, it is especially necessary to ensure the uniformity of the developing solution within this range. Therefore, by setting the angle of the spraying portion 240, the spraying range of the liquid is adjusted so that the circular area formed by a wafer surface radius of 50 - 80 mm can always receive a uniform and fresh developing solution.

[0039] In order for the liquid sprayed by the second spraying member 200 to uniformly cover the above-mentioned area, the spraying portion 240 of the middle ring liquid outlet portion 234 is set vertically. The spraying portion 240 of the inner ring liquid outlet portion 231 is inclined, and the included angle between it and the spraying portion 240 of the middle ring liquid outlet portion 234 is 25° - 70°. The spraying portion 240 of the outer ring liquid outlet portion 235 is inclined, and the included angle between it and the spraying portion 240 of the middle ring liquid outlet portion 234 is 25° - 35°.

[0040] In some specific embodiments, since the spraying range is fixed and the spraying height of the first spraying member 100 is fixed, the angles of the spraying portions 240 in the inner ring liquid outlet portion 231, the middle ring liquid outlet portion 234, and the outer ring liquid outlet portion 235 can be obtained. Specifically, the spraying portion 240 of the middle ring liquid outlet portion 234 is set vertically to spray the wafer surface in the vertical direction. The included angle between the spraying portion 240 of the inner ring liquid outlet portion 231 and the spraying portion 240 of the middle ring liquid outlet portion 234 is 25° - 70°; so that the liquid sprayed by the inner ring liquid outlet portion 231 can cover the surface of the wafer from the center to the spraying portion 240 of the middle ring liquid outlet portion 234; the included angle between the spraying portion 240 of the outer ring liquid outlet portion 235 and the spraying portion 240 of the middle ring liquid outlet portion 234 is 25° - 35°. So that the liquid sprayed by the outer ring liquid outlet portion 235 can cover the surface of the wafer from the edge to the spraying portion 240 of the middle ring liquid outlet portion 234. In some more specific embodiments, the vertical direction is the axial direction of the second spraying member.

[0041] In some more specific embodiments, the spraying portion 240 of the first liquid spraying ring 232 is inclined, and the included angle between it and the spraying portion 240 of the middle ring liquid outlet portion 234 is 60° - 70°. The spraying portion 240 of the second liquid spraying ring 233 is inclined, and the included angle between it and the spraying portion 240 of the middle ring liquid outlet portion 234 is 25° - 35°. The spraying portions 240 in the first liquid spraying ring 232 and the second liquid spraying ring 233 cooperate with each other so that the liquid sprayed by the inner ring liquid outlet portion 231 can cover the surface of the wafer from the center to the spraying portion 240 of the middle ring liquid outlet portion 234.

[0042] The first spraying member 100 includes: A spraying member 110 having a liquid inlet and a liquid outlet 112, the spraying member 110 being bent so that there is an angle between the liquid outlet 112 and the liquid inlet; A telescopic member 120 that can be telescoped in the vertical direction, one end being provided on the spraying member 110, the telescopic member 120 being hollow and communicating with the liquid inlet, so that the liquid provided by the supply device flows through the telescopic member 120 and then enters the spraying member 110 and flows out from the liquid outlet 112; Wherein, after the second spraying member 200 finishes spraying, the first spraying member 100 and the second spraying member 200 move synchronously to the outer ring area of the wafer, and the spraying member 110 extends out of the accommodation space 210, and the liquid flows through the spraying member 110 to spray the outer ring area of the wafer.

[0043] In some embodiments, during the wafer spraying process, first the second spraying member 200 sprays the inner ring area of the wafer. During this process, the first spraying member 100 stops spraying. After the second spraying member 200 finishes spraying the inner ring area of the wafer, the second spraying member 200 stops spraying, and the first spraying member 100 and the second spraying member 200 move synchronously to the outer ring area. At this time, the first spraying member 100 extends out of the accommodation space 210 and starts to spray the wafer; so that the surface of the wafer is evenly sprayed.

[0044] In some specific embodiments, the first spraying member 100 and the second spraying member 200 are driven by a robotic arm to move in the horizontal direction. The first spraying member 100 and the second spraying member 200 are both fixedly provided at the execution end of the robotic arm. The fixing method can be snap connection, bonding or bolt fixing, etc., which is not limited here, as long as the robotic arm can drive the first spraying member 100 and the second spraying member 200 to move. More specifically, the structure of the robotic arm is prior art and will not be elaborated here.

[0045] In some embodiments, referring to Figure 1 and Figure 6 , the telescopic member 120 is a corrugated pipe, so that the telescopic member 120 can be telescoped in the vertical direction. The telescopic member 120 is fixed to the spraying member 110. The fixing method can be bonding, snap connection or bolt fixing, etc., which is not limited here, as long as the end of the telescopic member 120 and the spraying member 110 can be hermetically connected; specifically, after the telescopic member 120 is fixed to the spraying member 110, the liquid inlet communicates with the inside of the telescopic member 120, so that the developing solution can flow through the inside of the telescopic member 120 and then enter the spraying member 110 through the liquid inlet and be sprayed out through the liquid outlet 112.

[0046] In some specific embodiments, the ejecting member 110 is bent such that there is an angle between the liquid outlet 112 and the liquid inlet, so that the developer ejected from the liquid outlet 112 can contact the unsprayed part of the wafer surface, and thus cooperate with the second spraying member 200 to spray the developer on the wafer surface.

[0047] To facilitate the control of the movement of the telescopic member 120, the spraying device further includes: A controller 310, disposed in the accommodation space 210; A control member 320, one end of which is connected to the controller 310 and the other end is connected to the ejecting member 110; The controller 310 drives the ejecting member 110 to move through the control member 320 to control the ejecting member 110 to extend out of the accommodation space 210 or retract into the accommodation space 210.

[0048] Among them, the controller 310 can be fixedly disposed on the inner wall of the accommodation space 210 or on the side wall of the telescopic member 120 within the accommodation space 210; the fixing method of the controller 310 can be bonding, clamping or bolt fixing, etc., which is not limited here, mainly to ensure that the control member 320 will not move within the accommodation space 210. It should be noted that when the controller 310 is fixedly disposed on the side wall of the telescopic member 120, the part of the telescopic member 120 where the controller 310 is fixedly disposed cannot be telescoped. For example, the top of the telescopic member 120 is tubular and non-telescopic, the middle part of the telescopic member 120 is a bellows, one end of the bellows is connected to the tubular part at the top of the telescopic member 120, the other end is connected to the ejecting member 110, and the controller 310 is fixedly disposed on the tubular part at the top of the telescopic member 120.

[0049] More specifically, both ends of the control member 320 are respectively connected to the controller 310 and the ejecting member 110. When the controller 310 is started, it drives the control key to move, thereby driving the ejecting member 110 to move. At this time, the telescopic member 120 extends or contracts to adaptively adjust the position, so as to facilitate the control of the ejecting member 110 to extend out of the accommodation space 210 or retract from the outside of the accommodation space 210 into the accommodation space 210.

[0050] In some embodiments, the controller 310 is an electric cylinder, the control member 320 is rod-shaped, one end of the control member 320 is connected to the piston rod of the controller 310, and the other end is connected to the side wall of the ejecting member 110. When the controller 310 is started, it drives the control member 320 to move through the piston rod, thereby driving the ejecting member 110 to move.

[0051] In some embodiments, the controller 310 is a motor, a gear is keyed on the rotating shaft of the control member 320, the control member 320 is a rack, and one end of the control member 320 is fixed to the side wall of the ejection member 110, and the gear and the rack are meshed with each other, so that when the controller 310 is started, the ejection member 110 is driven to move through the meshing of the gear and the rack.

[0052] In some embodiments, when the second spray member 200 is working, the first spray member 100 stops working and retracts into the accommodation space 210. When the first spray member 100 is working, the second spray member 200 stops working, and the first spray member 100 extends out of the accommodation space 210. In this process, after the spray member 110 is retracted into the accommodation space 210, the vertical distance from the bottom wall of the spray member 110 to the bottom wall of the second spray member 200 is greater than 16 mm, and the horizontal distance from the liquid outlet 112 to the inner wall of the accommodation space 210 is greater than 15 mm. When the second spray member 200 is working, the liquid sprayed by the second spray member 200 will not contact the first spray member 100, thereby reducing the interference of the first spray member 100 on the working process of the second spray member 200. When the spraying member 110 extends out of the accommodating space 210 , the vertical distance from the bottom wall of the spraying member 110 to the bottom wall of the second spraying member 200 is greater than 6 mm, so that the second spraying member 200 will not interfere with the working process of the first spraying member 100 .

[0053] More specifically, the first spray member 100 and the second spray member 200 are used together. When the center of the wafer is developed, the second spray member 200 is used to reduce the impact of the developer on the photoresist in the center of the wafer, and at the same time, the developer is obtained in the center of the wafer to make the development process more uniform. The spraying time in the center of the wafer is about 10-20S. After the spraying is completed, the second spray member 200 is immediately closed, and the first spray member 100 and the second spray member 200 move to a predetermined position. At this time, the first spray member 100 is opened to spray the developer on the wafer. Specifically, the first spray member 100 moves to 25 mm from the center of the wafer to start spraying the developer. At the same time, the wafer speed is increased to about 120-150 rpm. The entire wafer is fully developed by adjusting the moving speed of the first spray member 100. At the same time, the spray member 110 is bent so that the developer can flow out smoothly. With the high speed of the wafer, the occurrence of developer backsplash can be reduced when the centrifugal force is small.

[0054] In order to accurately control the distance between the first spray member 100 and the wafer and the second spray member 200, a micro distance sensor needs to be added and matched with an automatic control system to dynamically adjust the distance to ensure the stability of the development process. Specifically, a first sensor 330 is provided on the bottom wall of the spray member 110 to detect the distance from the bottom wall of the spray member 110 to the wafer surface; a second sensor 340 is provided on the side wall of the spray member 110 to detect the distance from the liquid outlet 112 to the inner wall of the accommodating space 210.

[0055] In some embodiments, both the first sensor 330 and the second sensor 340 are distance sensors.

[0056] In some specific embodiments, the distance from the second spraying member 200 to the wafer surface is 10 mm. The first sensor 330 detects the distance from the bottom of the first spraying member 100 to the wafer surface. After the spraying member 110 retracts into the accommodation space 210, the distance from the bottom wall of the spraying member 110 to the wafer surface is greater than 16 mm, that is, the vertical distance from the bottom wall of the spraying member 110 to the bottom wall of the second spraying member 200 is greater than 6 mm; when the spraying member 110 extends out of the accommodation space 210, the distance from the bottom wall of the spraying member 110 to the wafer surface is less than 4 mm, that is, the vertical distance from the bottom wall of the spraying member 110 to the bottom wall of the second spraying member 200 is greater than 6 mm.

[0057] To facilitate the wafer spraying process, the spraying device further includes: A supply device. Both the first spraying member 100 and the second spraying member 200 are in communication with the supply device. The supply device supplies liquid to the first spraying member 100 and / or the second spraying member 200 to spray the wafer.

[0058] In some embodiments, the supply device is used to supply a developing solution. More specifically, the first spraying member 100 and the second spraying member 200 respectively correspond to different supply devices, so that the process of the supply device supplying the developing solution to the first spraying member 100 and the second spraying member 200 is independent of each other, facilitating the separate control of the spraying processes of the first spraying member 100 and the second spraying member 200.

[0059] In some specific embodiments, when there is only one spraying channel 220 in the second spraying member 200, the supply device corresponds to one spraying channel 220 and supplies the developing solution into the spraying channel 220.

[0060] In some specific embodiments, when there are multiple spraying channels 220 in the second spraying member 200, it can be that one supply device corresponds to multiple spraying channels 220 and supplies the developing solution into the multiple spraying channels 220 simultaneously, or there are multiple supply devices, and each spraying channel 220 corresponds to one supply device, so that the supply device supplies the developing solution to each spraying channel 220 separately.

[0061] More specifically, the supply device is connected to the first spraying member 100 and the second spraying member 200 through pipelines, so that the developing solution can enter the first spraying member 100 or the spraying channel 220 through the pipelines.

[0062] The implementation principle of a spraying device of a semiconductor device according to an embodiment of the present application is that the second spraying member 200 sprays the inner ring area of the wafer. During this process, the first spraying member 100 stops spraying. After the second spraying member 200 finishes spraying the inner ring area of the wafer, the second spraying member 200 stops spraying. The first spraying member 100 and the second spraying member 200 move synchronously to the outer ring area. At this time, the first spraying member 100 extends outside the accommodation space 210 and starts spraying the wafer; so that the surface of the wafer is evenly sprayed, thereby improving the problem that the middle part of the wafer will be over-developed.

[0063] Although the embodiments of the present invention have been described in detail above, it is obvious to those skilled in the art that various modifications and changes can be made to these embodiments. However, it should be understood that such modifications and changes are all within the scope and spirit of the present invention described in the claims. Moreover, the present invention described herein may have other embodiments and can be implemented or realized in various ways.

Claims

1. A spraying device for a semiconductor device, characterized in that, Including: A first spraying member (100) movable in a first direction for spraying liquid onto the outer peripheral region of a wafer; A second spraying member (200) connected to the first spraying member (100) to move synchronously with the first spraying member (100); the second spraying member (200) is annularly arranged to form a receiving space (210) for receiving the first spraying member (100); a spraying channel (220) is formed in the second spraying member (200) for passing the liquid; the second spraying member (200) has a spraying surface (230) facing the wafer; A plurality of spraying parts (240) are all arranged on the spraying surface (230), and the spraying parts (240) communicate with the spraying channel (220); the plurality of spraying parts (240) have different angles in the first direction, so that after the liquid flows through the spraying channel (220), it is evenly sprayed from the spraying parts (240) to different positions in the inner peripheral region of the wafer.

2. The spray device according to claim 1, characterized in that, A plurality of the spraying channels (220) are provided, and the plurality of spraying channels (220) are spaced apart along the first direction; The spraying surface (230) is arc-shaped and is divided into an inner ring liquid outlet part (231), a middle ring liquid outlet part (234) and an outer ring liquid outlet part (235) from inside to outside; a plurality of the spraying parts (240) are respectively arranged at intervals along the circumferences of the inner ring liquid outlet part (231), the middle ring liquid outlet part (234) and the outer ring liquid outlet part (235), so that the liquid is respectively sprayed from the inner ring liquid outlet part (231), the middle ring liquid outlet part (234) and the outer ring liquid outlet part (235) to different positions on the surface of the wafer.

3. The spray device according to claim 2, characterized in that, Two adjacent spraying parts (240) in the inner ring liquid outlet part (231) are spaced apart along the first direction, so that the two adjacent spraying parts (240) have different spraying angles, and a first liquid spraying ring (232) and a second liquid spraying ring (233) are formed on the inner ring liquid outlet part (231).

4. The spraying device according to claim 3, wherein The spraying parts (240) of the middle ring liquid outlet part (234) are arranged vertically; The spraying parts (240) of the inner ring liquid outlet part (231) are inclined, and the included angle between the spraying parts (240) of the inner ring liquid outlet part (231) and the spraying parts (240) of the middle ring liquid outlet part (234) is 25° - 70°; The spraying parts (240) of the outer ring liquid outlet part (235) are inclined, and the included angle between the spraying parts (240) of the outer ring liquid outlet part (235) and the spraying parts (240) of the middle ring liquid outlet part (234) is 25° - 35°.

5. The spray device according to claim 4, characterized in that, The spraying parts (240) of the first liquid spraying ring (232) are inclined, and the included angle between the spraying parts (240) of the first liquid spraying ring (232) and the spraying parts (240) of the middle ring liquid outlet part (234) is 60° - 70°; The spraying parts (240) of the second liquid spraying ring (233) are inclined, and the included angle between the spraying parts (240) of the second liquid spraying ring (233) and the spraying parts (240) of the middle ring liquid outlet part (234) is 25° - 35°.

6. The spray device according to claim 1, characterized in that The first spraying member (100) includes: A spraying member (110) having a liquid inlet and a liquid outlet (112), wherein the spraying member (110) is bent such that there is an angle between the liquid outlet (112) and the liquid inlet; A telescopic member (120) that can be telescoped in the vertical direction, one end of which is provided on the spraying member (110). The telescopic member (120) is hollow and communicated with the liquid inlet, so that the liquid flows through the telescopic member (120) and then enters the spraying member (110) and flows out from the liquid outlet (112); Wherein, after the second spraying member (200) finishes spraying, the first spraying member (100) and the second spraying member (200) synchronously move to the outer ring area of the wafer, and the spraying member (110) extends out of the accommodation space (210), and the liquid flows through the spraying member (110) to spray the outer ring area of the wafer.

7. The spray device according to claim 6, characterized in that, Further comprising: A controller (310) provided in the accommodation space (210); A control member (320) having one end connected to the controller (310) and the other end connected to the spraying member (110); The controller (310) drives the spraying member (110) to move through the control member (320) to control the spraying member (110) to extend out of the accommodation space (210) or retract into the accommodation space (210).

8. The spray device according to claim 6, characterized in that, After the spraying member (110) retracts into the accommodation space (210), the vertical distance from the bottom wall of the spraying member (110) to the bottom wall of the second spraying member (200) is greater than 16 mm; the horizontal distance from the liquid outlet (112) to the inner wall of the accommodation space (210) is greater than 15 mm.

9. The spray device according to claim 7, characterized in that, The bottom wall of the spraying member (110) is provided with a first sensor (330) to detect the distance from the bottom wall of the spraying member (110) to the surface of the wafer; the side wall of the spraying member (110) is provided with a second sensor (340) to detect the distance from the liquid outlet (112) to the inner wall of the accommodation space (210).

10. The spray device according to any one of claims 1-9, characterized in that, Further comprising: A supply device, both the first spraying member (100) and the second spraying member (200) are communicated with the supply device, and the supply device supplies liquid to the first spraying member (100) and / or the second spraying member (200) to spray the wafer.

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