Wafer conversion device and conversion method thereof

Abstract

The wafer conversion device comprises a conversion machine base, a wafer placement table is arranged on the conversion machine base, a plurality of upper blades and a plurality of limiting vertical rods are rotationally arranged on the wafer placement table through a stand column, and the stand column is in transmission connection with a first motor through a first gear set; a vertical plate is rotationally arranged at one end of the conversion machine base through a first bearing seat and provided with a lifting sliding block through a lead screw, a transverse supporting rod is rotationally arranged on one side of the lifting sliding block, and an upper material taking suction cup and a lower material taking suction cup are arranged at the end, provided with the transverse supporting rod, of the lifting sliding block through a material taking plate. According to the invention, a plurality of upper blades and limiting vertical rods are rotatably arranged on a conversion base at the lower part in a wafer placing table through a vertical column, so that a first motor and a first gear set drive the vertical column to rotate positively and negatively for adjustment, and the plurality of limiting vertical rods can be controlled to move for adjustment; therefore, the wafer horizontally placed on the wafer placing table can be conveniently centered, clamped and limited, the clamping and limiting stability is high, and the wafer conversion and use precision can be conveniently improved.

Description

Technical Field

[0001] The present invention relates to the technical field of wafer conversion equipment, and in particular to a wafer conversion device and a conversion method thereof. Background Art

[0002] Wafer conversion refers to the process of converting wafers from one state to another, usually involving operations such as wafer transfer, loading and unloading. Wafer conversion equipment plays a key role in this process. Wafer conversion equipment is mainly used to transfer wafers from one processing state to another during the semiconductor manufacturing process. For example, manual horizontal wafer converters can be suitable for different sizes of wafers, such as 2-inch, 3-inch, 4-inch, 5-inch, 6-inch and 8-inch wafers. These devices usually have adjustable height and compatibility with a variety of standard carrier boxes and wet cleaning baskets.

[0003] In the prior art, there is a wafer conversion device with application number 202222578787.2, in which the distance between the first guide and the second guide can be adjusted to accommodate wafer carriers of different sizes. The wafer conversion device of the present invention can solve the problem of wafer misalignment, stacking, scratches, and abrasions caused by manual conversion, which makes the wafer scrapped. However, it is inconvenient to center, clamp and limit the wafer, and the wafer is easy to move during placement and conversion, thereby affecting the accuracy of wafer conversion. Summary of the invention

[0004] The object of the present invention is to provide a wafer conversion device and a conversion method thereof, so as to solve the problem in the prior art that it is inconvenient to center, clamp and limit the wafer, and the wafer is easy to move during placement and conversion, thereby affecting the accuracy of wafer conversion.

[0005] To achieve the above-mentioned objectives, the present invention provides the following technical solutions: a wafer conversion device and a conversion method thereof, comprising a conversion base, a wafer placement table is provided on the upper side of the conversion base through a support rod, a plurality of upper blades are rotatably provided on the conversion base at the lower part of the wafer placement table through a column, and a limiting column is provided on the upper side of the plurality of upper blades, a first motor is connected to the outer side of the column through a first gear set, a vertical plate is rotatably provided at one end of the conversion base through a first bearing seat, a lifting slider is provided at one side of the vertical plate through a lead screw, a transverse support rod is rotatably provided on one side of the lifting slider, an upper suction cup and a lower suction cup are provided at one end of the transverse support rod through a feeding plate, and a second motor is connected to one end of the transverse support rod through a second gear set.

[0006] Furthermore, a limiting sliding hole is provided inside the wafer placement table, and one end of the limiting vertical rod slides through the limiting sliding hole.

[0007] Furthermore, the limiting upright rods and limiting sliding holes are slidably provided with four groups, and the limiting sliding holes are arc-shaped sliding holes.

[0008] Further, the vertical plate is vertically rotatably arranged with respect to the conversion base, a third motor is drivingly connected to the outside of the vertical plate through a third gear set, and the transverse support rod is vertically rotatably arranged with respect to the vertical plate.

[0009] Further, one end of the transverse support rod is rotatably arranged on one side of the lifting slider through a second bearing block, and the second motor is fixedly arranged on one side of the lifting slider.

[0010] Further, both the upper material-taking suction cup and the lower material-taking suction cup are pneumatic suction cups, and a plurality of upper material-taking suction cups and lower material-taking suction cups are arranged in an annular array.

[0011] A wafer conversion method uses the described wafer conversion device and includes the following steps:

[0012] S1. Place the wafer to be transferred and converted on the wafer placement table;

[0013] S2. By means of a plurality of upper blades and limiting vertical rods rotatably arranged on the conversion base in the lower part of the wafer placement table through a column, the first motor and the first gear set are used to drive the column to rotate forward and backward for adjustment, so as to control the movement and adjustment of the plurality of limiting vertical rods, thereby facilitating the centering clamping and limiting of the wafer placed flat on the wafer placement table;

[0014] S3. By means of the upper material-taking suction cup and the lower material-taking suction cup arranged on both sides of the material-taking plate, two wafers can be respectively sucked and fixed and simultaneously converted to a specified position for transfer processing.

[0015] Compared with the prior art, the beneficial effects of the present invention are:

[0016] 1. The present invention uses a plurality of upper blades and limiting vertical rods rotatably arranged on the conversion base in the lower part of the wafer placement table through a column, so that the first motor and the first gear set are used to drive the column to rotate forward and backward for adjustment, and the movement and adjustment of the plurality of limiting vertical rods can be controlled, thereby facilitating the centering clamping and limiting of the wafer placed flat on the wafer placement table. The clamping and limiting stability is relatively high, and the wafer is not easily moved during wafer picking, placing and conversion, which is convenient for improving the accuracy of wafer conversion use.

[0017] 2. The present invention is provided with a transverse support rod rotatably on one side of the lifting slider. One end of the transverse support rod is provided with an upper material-taking suction cup and a lower material-taking suction cup through a material-taking plate. One end of the transverse support rod is drivingly connected to a second motor through a second gear set. By means of the upper material-taking suction cup and the lower material-taking suction cup arranged on both sides of the material-taking plate, two wafers can be sucked and fixed and simultaneously converted to a specified position for transfer processing, improving the efficiency of wafer conversion.

[0018] 3. In the present invention, the vertical plate is vertically rotatably arranged with the conversion base, and the outside of the vertical plate is drivingly connected with a third motor through a third gear set, so that the vertical plate can be horizontally rotated and adjusted by driving the third motor, thereby being able to adjust the horizontal conversion angle of the wafer. At the same time, the lifting slider and the transverse support rod are lifted and adjusted by driving the lead screw, so as to meet the wafer conversion and use processing at different heights. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] The drawings are used to provide a further understanding of the present invention, and constitute a part of the specification. They are used together with the embodiments of the present invention to explain the present invention, and do not constitute a limitation to the present invention. In the drawings:

[0020] Figure 1 is a schematic structural diagram of the first perspective of the present invention;

[0021] Figure 2 is a schematic structural diagram of the second perspective of the present invention;

[0022] Figure 3 is a schematic installation structure diagram of the limit vertical rod of the present invention.

[0023] In the figure: 1, conversion base; 2, column; 3, limit vertical rod; 4, upper blade; 5, wafer placement table; 6, support rod; 7, first bearing seat; 8, vertical plate; 9, lead screw; 10, lifting slider; 11, second bearing seat; 12, transverse support rod; 13, second gear set; 14, second motor; 15, picking plate; 16, upper picking suction cup; 17, lower picking suction cup; 18, third gear set; 19, third motor; 20, limit sliding hole; 21, first gear set; 22, first motor. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0024] The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present invention without creative efforts shall fall within the protection scope of the present invention.

[0025] Please refer to Figure 1 , Figure 2 , Figure 3, in the embodiments of the present invention, a wafer conversion device and its conversion method include a conversion base 1. On the upper side of the conversion base 1, a wafer placement table 5 is provided through a support rod 6. On the conversion base 1 at the lower part inside the wafer placement table 5, a plurality of upper blades 4 are rotatably provided through a column 2, and a limiting vertical rod 3 is provided on the upper side of each of the plurality of upper blades 4. The outside of the column 2 is drivingly connected to a first motor 22 through a first gear set 21. One end of the conversion base 1 is rotatably provided with a vertical plate 8 through a first bearing seat 7. On one side of the vertical plate 8, a lifting slider 10 is provided through a lead screw 9. On one side of the lifting slider 10, a transverse support rod 12 is rotatably provided. One end of the transverse support rod 12 is provided with a pick-up upper suction cup 16 and a pick-up lower suction cup 17 through a pick-up plate 15. Both the pick-up upper suction cup 16 and the pick-up lower suction cup 17 are pneumatic suction cups, and a plurality of pick-up upper suction cups 16 and pick-up lower suction cups 17 are arranged in an annular array, so that two wafers can be held and fixed simultaneously for conversion to a specified position for transmission, improving the efficiency of wafer conversion.

[0026] As Figure 1 and Figure 2 shown, in order to switch the pick-up upper suction cup 16 and the pick-up lower suction cup 17 for picking and placing materials by rotating the pick-up plate 15, a second motor 14 is also drivingly connected to one end of the transverse support rod 12 through a second gear set 13. One end of the transverse support rod 12 is rotatably arranged on one side of the lifting slider 10 through a second bearing seat 11, and the second motor 14 is fixedly arranged on one side of the lifting slider 10, so that it is convenient to vertically rotate the transverse support rod 12 on one side of the vertical plate 8, and at the same time, the pick-up plate 15 is driven to horizontally rotate and adjust through the second motor 14 and the second gear set 13, thereby facilitating the switching of the pick-up upper suction cup 16 and the pick-up lower suction cup 17 for picking and placing material processing.

[0027] As Figure 1 and Figure 3 shown, in order to improve the stability of the limiting vertical rod 3 for moving and clamping materials, a limiting sliding hole 20 is also provided inside the wafer placement table 5, and one end of the limiting vertical rod 3 slidably penetrates through the limiting sliding hole 20. Four groups of limiting vertical rods 3 and limiting sliding holes 20 are slidably arranged, and the limiting sliding hole 20 is an arc-shaped sliding hole, which is used for sliding guidance when the limiting vertical rod 3 moves and adjusts, and is beneficial to improving the stability of the limiting vertical rod 3 for moving and clamping materials.

[0028] As Figure 1 and Figure 2 shown, in order to adjust the horizontal conversion position of the wafer, the vertical plate 8 is also vertically rotatably arranged with the conversion base 1. The outside of the vertical plate 8 is drivingly connected to a third motor 19 through a third gear set 18, so that the vertical plate 8 is driven to horizontally rotate through the third motor 19 and the third gear set 18, thereby being able to adjust the horizontal conversion position of the wafer.

[0029] A wafer conversion method using the described wafer conversion device includes the following steps:

[0030] S1. Place the wafer to be transferred and converted on the wafer placement table 5;

[0031] S2. Utilize a plurality of upper blades 4 and limit vertical rods 3 rotatably provided on the conversion base 1 at the lower part inside the wafer placement table 5 through the column 2, so that by driving the column 2 to rotate forward and backward through the first motor 22 and the first gear set 21 for adjustment, the movement adjustment of a plurality of limit vertical rods 3 can be controlled, thereby facilitating the centering clamping and limiting of the wafer placed flat on the wafer placement table 5;

[0032] S3. Utilize the upper pick-up suction cups 16 and lower pick-up suction cups 17 provided on both sides of the pick-up plate 15 to respectively hold and fix two wafers and simultaneously convert them to a specified position for transfer processing.

[0033] The working principle and usage process of the present invention: When in use, place the wafer to be transferred and converted on the wafer placement table 5. Utilize a plurality of upper blades 4 and limit vertical rods 3 rotatably provided on the conversion base 1 at the lower part inside the wafer placement table 5 through the column 2, so that by driving the column 2 to rotate forward and backward through the first motor 22 and the first gear set 21 for adjustment, the movement adjustment of a plurality of limit vertical rods 3 can be controlled, thereby facilitating the centering clamping and limiting of the wafer placed flat on the wafer placement table 5. The stability of the clamping and limiting is relatively high, which is convenient for improving the accuracy of wafer conversion and use. Then, utilize the upper pick-up suction cups 16 and lower pick-up suction cups 17 provided on both sides of the pick-up plate 15 to respectively hold and fix two wafers and simultaneously convert them to a specified position for transfer processing, improving the efficiency of wafer conversion.

[0034] Finally, it should be noted that the above are only preferred embodiments of the present invention and are not used to limit the present invention. Although the present invention has been described in detail with reference to the foregoing embodiments, for those skilled in the art, they can still modify the technical solutions recorded in the foregoing embodiments, or perform equivalent replacements for some of the technical features. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principle of the present invention shall be included within the protection scope of the present invention.

Claims

1. A wafer conversion device, comprising a conversion base (1), characterized in that, On the upper side of the conversion pedestal (1), a wafer placement table (5) is provided through a support rod (6). On the conversion pedestal (1) at the lower part inside the wafer placement table (5), a plurality of upper blades (4) are rotatably provided through columns (2). And limit vertical rods (3) are provided on the upper sides of the plurality of upper blades (4). The outer side of the column (2) is drivingly connected to a first motor (22) through a first gear set (21). One end of the conversion pedestal (1) is rotatably provided with a vertical plate (8) through a first bearing seat (7). On one side of the vertical plate (8), a lifting slider (10) is provided through a lead screw (9). On one side of the lifting slider (10), a transverse support rod (12) is rotatably provided. At one end of the transverse support rod (12), a pick-up upper suction cup (16) and a pick-up lower suction cup (17) are provided through a pick-up plate (15). One end of the transverse support rod (12) is drivingly connected to a second motor (14) through a second gear set (13).

2. The wafer conversion device according to claim 1, wherein A limit sliding hole (20) is provided inside the wafer placement table (5), and one end of the limit vertical rod (3) slidably penetrates through the limit sliding hole (20).

3. A wafer conversion device according to claim 2, characterized in that, Four groups of the limit vertical rods (3) and the limit sliding holes (20) are slidably provided, and the limit sliding holes (20) are arc-shaped sliding holes.

4. A wafer conversion device according to claim 1, characterized in that, The vertical plate (8) is rotatably provided perpendicular to the conversion pedestal (1), and the transverse support rod (12) is rotatably provided perpendicular to the vertical plate (8).

5. A wafer conversion device according to claim 4, wherein One end of the transverse support rod (12) is rotatably provided on one side of the lifting slider (10) through a second bearing seat (11), and the second motor (14) is fixedly provided on one side of the lifting slider (10).

6. The wafer conversion device according to claim 1, wherein, Both the pick-up upper suction cup (16) and the pick-up lower suction cup (17) are pneumatic suction cups, and a plurality of pick-up upper suction cups (16) and pick-up lower suction cups (17) are arranged in an annular array.

7. A wafer conversion method, characterized in that, Using a wafer conversion device according to any one of claims 1-6, includes the following steps: S1. Place the wafer to be transferred and converted on the wafer placement table (5); S2. Utilize the plurality of upper blades (4) and the limit vertical rods (3) rotatably provided through the columns (2) on the conversion pedestal (1) at the lower part inside the wafer placement table (5), so that by driving the column (2) to rotate forward and backward through the first motor (22) and the first gear set (21) to adjust, control the movement adjustment of the plurality of limit vertical rods (3), thereby performing centering clamping and limiting on the wafer placed flat on the wafer placement table (5); S3. Utilize the pick-up upper suction cup (16) and the pick-up lower suction cup (17) provided on both sides of the pick-up plate (15) to respectively suck and fix two wafers and simultaneously transfer them to a specified position for transfer processing.

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