Liquid path circulation heating type wafer electroplating equipment

Abstract

The invention provides liquid path circulation heating type wafer electroplating equipment which comprises a rack plating tank, an overflow tank and a heating tank, the rack plating tank is provided with two overflow plates symmetrically distributed in the length direction, a plurality of overflow openings are evenly distributed in the top ends of the overflow plates, the overflow tank is arranged around the rack plating tank, the heating tank communicates with the bottom face of the overflow tank, and a heating device is arranged in the heating tank; at least one group of wafer hangers are placed in the rack plating tank, electroplating liquid flows into the overflow tank from the rack plating tank through an overflow port formed in the top end of the overflow plate and then flows into the heating tank, and the electroplating liquid flows back into the rack plating tank after being heated by the heating device in the heating tank. According to the invention, the distribution uniformity of ions in the electroplating liquid is improved in a liquid path circulation manner, so that the wafer electroplating effect is improved.

Description

Technical Field

[0001] The present invention relates to the field of semiconductor electroplating equipment, and particularly to a wafer electroplating equipment with liquid circuit circulation heating. Background Art

[0002] The wafer manufacturing process includes an electroplating process. In the electroplating process, the front side of the wafer forming the device contacts the electroplating solution, and a metal film layer is deposited on the front side of the wafer to achieve electrical interconnection between multiple devices formed on the front side of the wafer. Specifically, rack plating is a commonly used electroplating method for wafers, and a rack needs to be used for auxiliary cooperation to immerse the wafer in the electroplating solution for electroplating.

[0003] During electroplating, the positive electrode of the power supply is electrically connected to the electroplating solution, and the negative electrode of the power supply is connected to the wafer; when the current is conducted, the positively charged cations in the electroplating solution move towards the cathode of the circuit, undergo a reduction reaction on the surface of the wafer, and form an electroplated layer covering the surface of the wafer. In the prior art, when rack plating a wafer, after injecting the electroplating solution into the rack plating tank, the wafer is then immersed in the electroplating solution, and after the wafer electroplating is completed, the electroplating solution is drained from the rack plating tank 1. In the above-mentioned prior wafer rack plating equipment, during the wafer rack plating process, the electroplating solution always contacts the wafer in a nearly static state and electroplates it. Due to the uneven contact between the electroplating solution and the wafer surface, there is a problem of uneven ion distribution, which in turn affects the electroplating effect on the wafer surface.

[0004] In view of this, it is necessary to improve the wafer electroplating equipment in the prior art to solve the above problems. It should be noted that the above introduction of the background art is only for the convenience of clearly and completely explaining the technical solution of the present application and facilitating the understanding of those skilled in the art. It cannot be considered that the above technical solutions are well-known to those skilled in the art just because these solutions are described in the background art part of the present application. Summary of the Invention

[0005] The purpose of the present invention is to disclose a wafer electroplating equipment with liquid circuit circulation heating, which improves the uniformity of ion distribution in the electroplating solution through the liquid circuit circulation method, and further improves the wafer electroplating effect.

[0006] To achieve the above purpose, the present invention provides a wafer electroplating equipment with liquid circuit circulation heating, which is characterized by including: a rack plating tank, an overflow tank, and a heating tank. The rack plating tank has two overflow plates symmetrically distributed along the length direction, and a plurality of overflow ports are evenly distributed at the top of the overflow plates. The overflow tank is arranged around the rack plating tank, the heating tank is communicated with the bottom surface of the overflow tank, and a heating device is arranged in the heating tank;

[0007] At least one set of wafer fixtures is placed in the rack plating tank. The electroplating solution flows from the rack plating tank through an overflow port opened at the top of the overflow plate into the overflow tank and then into the heating tank. After being heated by the heating device in the heating tank, the electroplating solution flows back into the rack plating tank.

[0008] As a further improvement of the present invention, two sets of wafer fixtures are respectively arranged near the two overflow plates in the rack plating tank. The two sets of wafer fixtures respectively hold a wafer in a direction parallel to the plane where the overflow plate is located.

[0009] Two stirring plates are arranged on the side where the two sets of wafer fixtures are close to each other. The two stirring plates are driven by a driving mechanism to reciprocate horizontally along the length direction in the rack plating tank. The driving mechanism includes a driving motor and a connecting component connected to the driving end of the driving motor. The top of the stirring plate forms a connecting rod, and the connecting rod passes through the side wall of the rack plating tank perpendicular to the overflow plate and is connected to the connecting component.

[0010] As a further improvement of the present invention, the connecting component includes a driving wheel, a driving seat and a driving rod. The driving end of the driving motor is coaxially assembled with a connecting wheel, and the driving wheel is eccentrically assembled on the lower surface of the connecting wheel.

[0011] The driving seat includes a driving block and a mounting plate. The driving block is provided with a guiding hole for the driving wheel to be embedded. The mounting plate is provided with a guide rail parallel to the length direction of the stirring plate. The driving block slides along the length direction of the guide rail under the push of the driving wheel.

[0012] One end of the driving rod is connected to the driving seat, and a connecting seat is arranged at the end of the driving rod far from the driving seat. The two sides of the connecting seat in the length direction are respectively connected to the connecting rods of the two stirring plates.

[0013] As a further improvement of the present invention, the two sets of wafer fixtures respectively include a hanging plate. Guide members are respectively formed on both sides of the hanging plate perpendicular to the length direction. Two guide grooves are respectively formed on both sides of the two side plates of the rack plating tank perpendicular to the overflow plate in the direction close to each other along the height direction. The guide members are embedded in the guide grooves and slide along the height direction of the guide grooves.

[0014] The wafer fixture also has a wafer clamping seat, which positions the wafer at the side wall of the hanging plate. The wafer clamping seat forms a relief opening for the wafer to contact the electroplating solution.

[0015] As a further improvement of the present invention, the wafer clamping seat includes a mounting ring, a clamping back plate and a clamping ring. The mounting ring is assembled on the side of the hanging plate far from the overflow plate. A lifting plate is integrally formed at the top of the mounting ring, and the lifting plate extends upward and is connected to a lifting device.

[0016] The clamping back plate is assembled on the side of the mounting ring away from the hanging plate. The relief opening is formed through the clamping ring. The wafer is clamped between the clamping back plate and the clamping ring. The side of the clamping part close to the clamping back plate forms several convex shapes and is a positioning part for fixed connection with the hanging plate through a connecting piece.

[0017] As a further improvement of the present invention, a positioning ring in contact with the wafer is further provided on the side of the clamping back plate away from the mounting ring. The positioning ring, the clamping back plate, and the mounting ring and the hanging plate are fixedly connected to each other through a connecting piece.

[0018] As a further improvement of the present invention, a liquid supply tank is fixedly assembled on the lower surface of the bottom wall of the hanging plating tank. A plurality of filter holes are opened on the bottom wall of the hanging plating tank. The electroplating solution in the heating tank flows into the liquid supply tank through a liquid path, and then the liquid level rises to enter the hanging plating tank through the filter holes.

[0019] Two guiding grooves are formed on the upper surface of the bottom wall of the hanging plating tank along the length direction. The bottom ends of the two stirring plates are respectively embedded in one guiding groove and translate along the length direction of the guiding groove.

[0020] A metal electrolysis block for providing metal ions to the electroplating solution is arranged on the bottom surface of the hanging plating tank on the side where the two stirring plates are close to each other.

[0021] As a further improvement of the present invention, an assembly groove is formed on the side of the hanging plate away from the overflow plate. The positioning ring, the clamping back plate, and the mounting ring are installed in the assembly groove.

[0022] As a further improvement of the present invention, the heating device is arranged as a plurality of heating rods arranged along the height direction of the heating tank.

[0023] As a further improvement of the present invention, a friction reducing wheel is arranged on the outer side wall of the overflow tank. The connecting rod passes through the side wall of the hanging plating tank and then passes through the side wall of the overflow tank and is in rolling cooperation with the friction reducing wheel. A plurality of water passing holes are formed through the stirring plate.

[0024] Compared with the prior art, the beneficial effects of the present invention are as follows: Through the liquid path circulation heating type wafer electroplating equipment composed of a hanging plating tank, an overflow tank, and a heating tank, the wafer is placed in the hanging plating tank through a wafer fixture. The electroplating solution is continuously introduced into the hanging plating tank, and then flows into the overflow tank through the overflow openings formed at the tops of the overflow plates formed on both sides of the hanging plating tank. The main purpose of the design of the overflow tank is to have a larger space to collect the electroplating solution overflowing from the hanging plating tank and drain the electroplating solution into the heating tank. The electroplating solution is heated to an appropriate temperature by the heating device in the heating tank and then introduced into the hanging plating tank again to electroplate the surface of the wafer. Through the above scheme, the electroplating solution is always kept in a flowing state during the wafer electroplating process, so as to maintain the uniformity of the dispersion of metal ions in the electroplating solution, and further improve the electroplating effect on the wafer.

[0025] Secondly, based on the electroplating solution that is circulated between the hanging plating tank, the overflow tank, and the heating tank, a stirring plate is formed in the hanging plating tank to further maintain the fluidity of the electroplating solution in the hanging plating tank. That is, the electroplating solution is introduced into the hanging plating tank from below, and its liquid level continuously rises until it flows into the overflow tank through the overflow port formed by the overflow plate. That is, during the above process, the electroplating solution flows in the height direction of the hanging plating tank. Then, the driving mechanism is used to drive the stirring plate to move along the length direction of the hanging plating tank, so as to further enable the electroplating solution to form fluidity along the length direction in the hanging plating tank during the rising process, thereby improving the fluidity of the electroplating solution in two dimensions and further enhancing the uniformity of the dispersion of metal ions in the electroplating solution.

[0026] Finally, a liquid supply tank connected to the bottom end of the hanging plating tank, a metal electrolysis block, and filter holes formed on the bottom wall of the hanging plating tank are provided. The electroplating solution in the heating tank is guided into the liquid supply tank through an external liquid path. When the electroplating solution in the liquid supply tank flows into the hanging plating tank from bottom to top through the filter holes, it comes into contact with the metal electrolysis block, and metal ions are replenished into the electroplating solution through the electrolysis of the metal electrolysis block to improve the electroplating effect on the surface of the wafer. Description of the Drawings

[0027] Figure 1 It is a schematic diagram showing the overall structure of the wafer electroplating equipment with liquid path circulation heating according to the present invention;

[0028] Figure 2 is Figure 1 A schematic sectional view taken along the F-F direction;

[0029] Figure 3 It is an exploded view showing the specific structures of various parts in the present invention;

[0030] Figure 4 It is a schematic diagram showing the specific assembly manner of the driving mechanism and the stirring plate in the present invention;

[0031] Figure 5 is Figure 2 An enlarged view of part A in;

[0032] Figure 6 is Figure 2 An enlarged view of part B in;

[0033] Figure 7 is Figure 3 An enlarged view of part C in;

[0034] Figure 8 is Figure 3 An enlarged view of part D in;

[0035] Figure 9 is Figure 4 An enlarged view of part E in;

[0036] Figure 10 This is a schematic diagram showing the liquid path connection relationship between the heating tank and the liquid supply tank in the present invention. Detailed implementation manners

[0037] The present invention will be described in detail below with reference to the embodiments shown in the drawings. However, it should be noted that these embodiments do not limit the present invention. Any equivalent transformation or substitution in terms of function, method, or structure made by those of ordinary skill in the art based on these embodiments shall fall within the protection scope of the present invention.

[0038] Refer Figures 1 to 10 As shown, this is a specific implementation manner of a liquid path circulation heating type wafer electroplating device disclosed by the present invention. Compared with the wafer hanging electroplating device in the prior art, it is composed of a hanging electroplating tank 1, an overflow tank 2, and a heating tank 3. A wafer (not shown) is placed in the hanging electroplating tank 1 through a wafer hanger 12. The electroplating solution is continuously introduced into the hanging electroplating tank 1 and then flows into the overflow tank 2 through an overflow port 111 formed at the top of the overflow plates 11 formed on both sides of the hanging electroplating tank 1. The main purpose of designing the overflow tank 2 is to have a relatively large space to collect the electroplating solution overflowing from the hanging electroplating tank 1 and drain the electroplating solution into the heating tank 3. After the electroplating solution is heated to an appropriate temperature by the heating device of the heating tank 3, it is introduced into the hanging electroplating tank 1 again to electroplate the surface of the wafer. Through the above solution, the present invention always maintains the flowing state of the electroplating solution during the wafer electroplating process, thereby maintaining the uniformity of the dispersion of metal ions in the electroplating solution, and further improving the electroplating effect on the wafer.

[0039] Refer Figures 1 to 10As shown in the figure, the liquid path circulation heating type wafer electroplating equipment (hereinafter referred to as electroplating equipment) in this embodiment includes: a hanging plating tank 1, an overflow tank 2, and a heating tank 3. The hanging plating tank 2 has two overflow plates 11 symmetrically distributed along the length direction. A number of overflow ports 111 are evenly distributed at the top ends of the overflow plates 11. The overflow tank 2 is arranged around the hanging plating tank 1. The heating tank 3 is communicated with the bottom surface of the overflow tank 2, and a heating device 31 is arranged in the heating tank 3. Not less than one group of wafer hangers 12 are placed in the hanging plating tank 1. The electroplating solution flows from the hanging plating tank 1 through the overflow ports 111 opened at the top ends of the overflow plates 11 into the overflow tank 2 and then into the heating tank 3. After being heated by the heating device 31 in the heating tank 3, the electroplating solution flows back into the hanging plating tank 2. It should be noted that in this embodiment, the method of introducing the electroplating solution into the hanging plating tank 1 is specifically to first introduce the electroplating solution into the heating tank 3, heat it to a suitable electroplating temperature by the heating device 31, and then introduce it from the heating tank 3 into the hanging plating tank 1. And during the subsequent process, the action of introducing the electroplating solution is always maintained so that the electroplating solution can continuously overflow from the overflow plate 11 into the overflow tank 2 and flow back into the heating tank 3, thereby maintaining the flowing state of the electroplating solution to ensure the uniformity of the distribution of metal ions, and further ensuring the electroplating effect on the wafer. Specifically, in this embodiment, the heating device 31 is selected as a multi-channel heating rod 311 arranged along the height direction of the heating tank 3.

[0040] As shown Figures 1 to 4 and Figure 9 As shown, two groups of wafer hangers 12 are respectively arranged near the two overflow plates 11 in the hanging plating tank 1. The two groups of wafer hangers 12 respectively hold a wafer in a direction parallel to the plane where the overflow plate 11 is located. Two stirring plates 13 are arranged on the side where the two groups of wafer hangers 12 are close to each other. The two stirring plates 13 are driven by a driving mechanism to reciprocally translate along the length direction in the hanging plating tank 1. The driving mechanism 5 includes a driving motor 51 and a connecting component 52 connected to the driving end of the driving motor 51. A connecting rod 132 is formed at the top end of the stirring plate 13. After passing through the side wall of the hanging plating tank 1 perpendicular to the overflow plate 111, the connecting rod 132 is connected to the connecting component 52. It should be noted that the overflow tank 2 is arranged around the outside of the hanging plating tank 1 as shown, so the connecting rod 132 also passes through the side wall of the overflow tank 2. Figures 1 to 4 As shown, the overflow tank 2 is arranged around the outside of the hanging plating tank 1, so the connecting rod 132 also passes through the side wall of the overflow tank 2.

[0041] As shown Figures 1 to 10 As shown, a liquid supply tank 6 is fixedly assembled on the lower surface of the bottom wall of the hanging plating tank 1. A number of filter holes 15 are opened on the bottom wall of the hanging plating tank 1. The electroplating solution in the heating tank 1 flows into the liquid supply tank 6 through the liquid path 65, and the liquid level rises to enter the hanging plating tank 1 through the filter holes 15. Two guiding grooves 16 are formed on the upper surface of the bottom wall of the hanging plating tank 1 along the length direction. The bottom ends of the two stirring plates 13 are respectively embedded in one guiding groove 16 and translate along the length direction of the guiding groove 16. A metal electrolysis block 17 for providing metal ions to the electroplating solution is arranged on the bottom surface of the hanging plating tank 1 on the side where the two stirring plates 13 are close to each other. For details, please refer toFigure 10 As shown, the heating tank 3 has a liquid supply port 32 and a liquid passage port 33, the liquid supply tank 6 has a liquid inlet 61 and a liquid discharge port 62, and the liquid path 65 connects the liquid supply port 32 and the liquid inlet 62 to supply the electroplating solution heated to an appropriate electroplating temperature in the heating tank 3 into the liquid supply tank 6. It should be noted that a liquid pump 64 and a filter 65 are also connected to the liquid path 65.

[0042] The electroplating solution enters the heating tank 3 through the liquid passage port 33 of the heating tank 3. After being heated for a period of time, it flows into the liquid supply tank 6 through the liquid supply port 32, the liquid path 65, and the liquid inlet 61. And during the process of flowing along the liquid path 65, the electroplating solution can also be filtered once through the filter 65 to reduce the impurities existing in the electroplating solution. After the electroplating solution flows into the liquid supply tank 6 through the liquid inlet 61, the liquid level gradually rises and then flows into the hanging plating tank 1 through a plurality of filter holes 15 formed in the bottom wall of the hanging plating tank 1. And during the process of the electroplating solution entering the hanging plating tank 11 through the filter holes 15, it continuously contacts the metal electrolysis block 17, and metal ions are supplemented into the electroplating solution through the electrolysis of the metal electrolysis block 17, thereby ensuring the electroplating effect on the surface of the wafer.

[0043] Furthermore, since metal ions are continuously supplemented by the electrolysis of the metal electrolysis block 17 during the process of the electroplating solution flowing into the hanging plating tank 1 from bottom to top, there is a problem of uneven distribution of metal ions in the electroplating solution. The concentration of metal ions in the electroplating solution near the metal electrolysis block 17 is higher. To ensure the distribution effect of metal ions in the electroplating solution, in this embodiment, the stirring plate 13 is set to move continuously along the length direction of the hanging plating tank 1. After the electroplating solution enters the hanging plating tank 1 from the liquid supply tank 6, its liquid level continuously rises until it flows into the overflow tank 2 at the overflow port 222 formed by the overflow plate 11, that is, the electroplating solution flows along the height direction of the hanging plating tank 1 in the above process; then the driving mechanism drives the stirring plate 13 to move along the length direction of the hanging plating tank 1 to further enable the electroplating solution to form fluidity along its length direction in the hanging plating tank during the rising process, so as to improve the fluidity of the electroplating solution in two dimensions to further improve the uniformity of the dispersion of metal ions in the electroplating solution, so that the metal ions generated by the metal electrolysis block 17 can be more evenly distributed in the electroplating solution. The above process of the electroplating solution flowing from the heating tank 3 into the liquid supply tank 6, then entering the hanging plating tank 1, overflowing from the hanging plating tank 1 to the overflow tank 2, and then flowing back into the heating tank 3 and flowing into the hanging plating tank 1 again through the liquid supply tank 6 continues during the wafer electroplating process and will not be elaborated here. Until the wafer electroplating is completed, the residual electroplating solution in the heating tank 3 and the liquid supply tank 6 can be discharged respectively through the liquid passage port 33 and the liquid discharge port 62, and the liquid discharge port 62 can synchronously discharge the electroplating solution remaining in the hanging plating tank 1 after the wafer electroplating is completed.

[0044] See Figure 2 、 Figure 4 and Figure 9As shown in the figure, the connecting component 52 includes a driving wheel 521, a driving seat 522 and a driving rod 523. The driving end of the driving motor 51 is coaxially assembled with a connecting wheel 511, and the driving wheel 521 is eccentrically assembled on the lower surface of the connecting wheel 511; the driving seat 522 includes a driving block 5221 and a mounting plate 5223. The driving block 5221 is provided with a guiding hole 5222 for the driving wheel 521 to be embedded. The mounting plate 5221 is provided with a guide rail 5224 parallel to the length direction of the stirring plate 13. The driving block 5221 slides along the length direction of the guide rail 5224 under the push of the driving wheel 521; one end of the driving rod 523 is connected to the driving block 5221, and a connecting seat 524 is provided at the end of the driving rod 523 away from the driving seat 522. The two sides of the connecting seat 524 in the length direction are respectively connected to the connecting rods 132 of the two stirring plates 13.

[0045] It should be noted that in this embodiment, the connecting wheel 511 is set as a cam. After the wafer is placed in the hanging plating tank 1 and the plating solution is introduced into the hanging plating tank 1, the driving motor 51 is started. The driving end of the driving motor 51 drives the connecting wheel 511 to rotate. During the rotation of the connecting wheel 511, the driving wheel 521 eccentrically connected to the connecting wheel 511 rotates simultaneously with the rotation of the connecting wheel 511. The rotation radius of the driving wheel 521 is equal to the straight-line distance between the center of the driving wheel 521 and the connection point between the connecting wheel 511 and the driving end of the driving motor 51. During the rotation of the driving wheel 521, the guiding hole 5222 formed in a waist shape and perpendicular to the length direction of the guide rail 5224 drives the driving block 5221 to slide back and forth along the length direction of the guide rail 5224 within the rotation diameter length range of the driving wheel 521. The driving rod 523 connected to the driving block 5221 displaces with the driving block 5221, and then drives the connecting seat 524 to drive the two stirring plates 13 assembled on its opposite sides to linearly displace in the hanging plating tank 1 along the direction parallel to the length of the guide rail 5224, so as to stir the plating solution in the hanging plating tank 1, thereby accelerating the movement speed of metal ions and improving the uniformity of the distribution of metal ions in the hanging plating tank 1.

[0046] It should be noted that in this embodiment, a plurality of water passing holes 131 are formed in the stirring plate 13 and are evenly distributed along its height direction, so as to reduce the resistance from the plating solution when the stirring plate 13 moves in the hanging plating tank 1 and make its translation process smoother. Further, the length and width of the guiding groove 16 opened on the bottom wall of the hanging plating tank 1 are both larger than those of the stirring plate 13, so as to play a role in guiding the displacement of the stirring plate 13 and improve the movement stability of the stirring plate 13. And, a friction reducing wheel 18 is arranged on the outer side wall of the overflow tank 2. The connecting rod 131 passes through the side wall of the hanging plating tank 1 and then passes through the overflow tank 2 and is in rolling cooperation with the friction reducing wheel 18 to reduce the friction when the stirring plate 13 moves.

[0047] See Figures 2 to 8As shown, the two groups of wafer fixtures 12 respectively include a hanging plate 121. On both sides perpendicular to the length direction of the hanging plate 121, a guiding member 1211 is formed respectively. On one side close to each other of the two side plates formed by the hanging plating tank 1 perpendicular to the overflow plate 11, two guiding grooves 14 are formed along their height directions. The guiding member 1211 is embedded in the guiding groove 14 and slides along the height direction of the guiding groove 14. The wafer fixture 12 also has a wafer clamping seat 122. The wafer clamping seat 122 positions the wafer at the side wall of the hanging plate 121. The wafer clamping seat 122 forms a relief opening 1221 for the wafer to contact the electroplating solution. Specifically, the wafer clamping seat 122 includes a mounting ring 1222, a clamping back plate 1223, and a clamping ring 1224. The mounting ring 1222 is assembled on the side of the hanging plate 121 away from the overflow plate 11. At the top of the mounting ring 1222, a lifting plate 1225 is integrally formed. After the lifting plate 1225 extends upward, it is connected to the lifting device 7. The clamping back plate 1223 is assembled on the side of the mounting ring 1222 away from the hanging plate 121. The relief opening 1221 is formed through the clamping ring 1224. A wafer (not shown) is clamped between the clamping back plate 1223 and the clamping ring 1224. On the side of the clamping ring 1224 close to the clamping back plate 1223, several convex forms are formed and used as positioning members 1226 for fixedly connecting with the hanging plate 121 through a connecting member (not shown). On the side of the clamping back plate 1223 away from the mounting ring 1224, a positioning ring 1227 in contact with the wafer is further provided. The positioning ring 1227, the clamping back plate 1223, and the mounting ring 1222 are fixedly connected to each other through a connecting member (not shown) with the hanging plate 121. On the side of the hanging plate 121 away from the overflow plate 11, an assembly groove 1212 is formed. The positioning ring 1227, the clamping back plate 1223, and the mounting ring 1224 are installed in the assembly groove 1212.

[0048] It should be noted that in this embodiment, the lifting device 7 connected to the lifting plate 1225 of the mounting ring 1222 is set as an L-shaped plate as Figure 1 shown. And the two lifting plates 1225 respectively overlap on the tops of the two side walls formed by the overflow groove 2 along the length direction. By applying an upward force to the lifting device 7, the whole wafer fixture 12 can be lifted from the hanging plating tank 1 until the guiding member 1211 of the hanging plate 121 disengages from the guiding groove 14. At this time, the whole wafer fixture 12 is located outside the hanging plating tank 12. The operation of taking out the electroplated wafer from the wafer fixture 12 or the operation of assembling the wafer to be electroplated into the wafer fixture 12 can be carried out. Hereinafter, the example of assembling the wafer into the wafer fixture 12 is used for illustration.

[0049] Specifically, the above-mentioned mounting ring 1222, clamping backplate 1223, and positioning ring 1227 are always fixedly connected to the hanging plate 121 through connectors such as bolts (not shown). The positioning ring 1227 can be further selected to be made of an elastic material such as a rubber ring, etc., to reduce the contact area between the wafer and the wafer holder 122, thereby avoiding frictional damage to the wafer surface. Place the hanging plate 121 on a flat surface, make the wafer fit with the positioning ring 1227 in a posture parallel to the clamping backplate 1223, and then cover the clamping ring 1224 above the side of the wafer to be electroplated. At this time, the clamping ring 1224 entirely covers the wafer surface, and several positioning members 1226 it has surround the edge of the wafer and then fit with the hanging plate 121. The positioning members 1226 are fixed to the hanging plate 121 through connectors selected as bolts, thereby achieving the effect of positioning the wafer on the hanging plate 121. Then, the two groups of wafer fixtures 12 are respectively placed into the hanging plating tank 1 again. The two groups of wafer fixtures 12 are respectively embedded in the guiding grooves 14 through the guiding members 1211 of the hanging plate 121 to achieve the purpose of stably hanging in the hanging plating tank 1 in the vertical direction. Moreover, in this embodiment, through the above design of the structures of the two groups of wafer fixtures 12, they are distributed at positions close to the two overflow plates 11, so as to achieve the purpose of simultaneously performing hanging plating on two wafers in the same hanging plating tank 1, reducing the time required for batch wafer electroplating by 50%, and thus effectively improving the electroplating efficiency of the wafers.

[0050] Furthermore, to cooperate with the two groups of wafer fixtures 12 for simultaneous hanging plating, in this embodiment, two mutually parallel stirring plates 13 are correspondingly provided. The two stirring plates 13 and the two groups of wafer fixtures 12 are all arranged in a mutually parallel posture, objectively effectively reducing the space required in their width direction, that is, effectively reducing the width of the hanging plating tank 1 while improving the electroplating efficiency of the wafers. It should be noted that in this embodiment, the heating tank 3 is fixedly connected to the side wall of one of the overflow plates 11 of the hanging plating tank 1, and the top opening of the heating tank 3 communicates with the bottom wall of the overflow tank 2, so as to further compress the overall volume of the electroplating equipment.

[0051] The series of detailed descriptions listed above are only specific descriptions of the feasible embodiments of the present invention, and they are not intended to limit the protection scope of the present invention. Any equivalent embodiments or changes made without departing from the technical spirit of the present invention should be included within the protection scope of the present invention.

[0052] For those skilled in the art, it is obvious that the present invention is not limited to the details of the above-described exemplary embodiments, and the present invention can be implemented in other specific forms without departing from the spirit or basic characteristics of the present invention. Therefore, in any aspect, the embodiments should be regarded as exemplary and non-limiting. The scope of the present invention is defined by the appended claims rather than the above description. Therefore, all changes falling within the meaning and scope of the equivalent elements of the claims are intended to be embraced within the present invention. Any reference signs in the claims should not be construed as limiting the claims involved.

[0053] In addition, it should be understood that although this specification is described according to embodiments, not every embodiment only contains an independent technical solution. This narrative manner of the specification is only for clarity. Those skilled in the art should regard the specification as a whole, and the technical solutions in each embodiment can also be appropriately combined to form other embodiments that can be understood by those skilled in the art.

Claims

1. A liquid circuit circulation heating type wafer electroplating device, characterized in that, Including: A rack plating tank, an overflow tank, and a heating tank. The rack plating tank has two overflow plates symmetrically distributed along the length direction. A plurality of overflow ports are evenly distributed at the top ends of the overflow plates. The overflow tank is arranged around the rack plating tank. The heating tank is communicated with the bottom surface of the overflow tank, and a heating device is arranged in the heating tank; Not less than one set of wafer hangers are placed in the rack plating tank. The electroplating solution flows from the rack plating tank through the overflow ports opened at the top ends of the overflow plates into the overflow tank and then into the heating tank. After being heated by the heating device in the heating tank, the electroplating solution flows back into the rack plating tank.

2. The liquid path circulation heating type wafer electroplating equipment according to claim 1, wherein Two sets of wafer hangers are respectively arranged near the two overflow plates in the rack plating tank. The two sets of wafer hangers respectively hold a wafer in a direction parallel to the plane where the overflow plates are located; Two stirring plates are arranged on the side where the two sets of wafer hangers are close to each other. The two stirring plates are driven by a driving mechanism to reciprocate and translate along the length direction in the rack plating tank. The driving mechanism includes a driving motor and a connecting component connected to the driving end of the driving motor. A connecting rod is formed at the top end of the stirring plate. The connecting rod passes through the side wall of the rack plating tank perpendicular to the overflow plate and is connected to the connecting component.

3. The liquid path circulation heating type wafer electroplating equipment according to claim 2, wherein The connecting component includes a driving wheel, a driving seat, and a driving rod. The driving end of the driving motor is coaxially assembled with a connecting wheel, and the driving wheel is eccentrically assembled on the lower surface of the connecting wheel; The driving seat includes a driving block and a mounting plate. The driving block is provided with a guiding hole for the driving wheel to be embedded. The mounting plate is provided with a guide rail parallel to the length direction of the stirring plate. The driving block slides along the length direction of the guide rail under the push of the driving wheel; One end of the driving rod is connected to the driving seat. A connecting seat is arranged at the end of the driving rod far from the driving seat. The two sides of the length direction of the connecting seat are respectively connected to the connecting rods of the two stirring plates.

4. The liquid path circulation heating type wafer electroplating equipment according to claim 2, characterized in that, The two sets of wafer hangers respectively include a hanging plate. Guide members are respectively formed on both sides perpendicular to the length direction of the hanging plate. Two guide grooves are respectively formed on both sides close to each other along the height direction of the two side plates of the rack plating tank perpendicular to the overflow plate. The guide members are embedded in the guide grooves and slide along the height direction of the guide grooves; The wafer hanger also has a wafer clamping seat. The wafer clamping seat positions the wafer at the side wall of the hanging plate. The wafer clamping seat forms a relief opening for the wafer to contact the electroplating solution.

5. The liquid path circulation heating type wafer electroplating equipment according to claim 4, characterized in that, The wafer clamping seat includes a mounting ring, a clamping back plate, and a clamping ring. The mounting ring is assembled on the side of the hanging plate far from the overflow plate. A lifting plate is integrally formed at the top end of the mounting ring. The lifting plate extends upward and is connected to a lifting device; The clamping back plate is assembled on the side of the mounting ring far from the hanging plate. The relief opening is formed through the clamping ring. The wafer is clamped between the clamping back plate and the clamping ring. A plurality of convex forms are formed on the side of the clamping ring close to the clamping back plate and are positioning members for being fixedly connected to the hanging plate through a connecting member.

6. The liquid path circulation heating type wafer electroplating equipment according to claim 5, characterized in that, A positioning ring in contact with the wafer is further arranged on the side of the clamping back plate far from the mounting ring. The positioning ring, the clamping back plate, and the mounting ring and the hanging plate are fixedly connected to each other through a connecting member.

7. The liquid path circulation heating type wafer electroplating equipment according to claim 2, characterized in that, A liquid supply tank is fixedly assembled on the lower surface of the bottom wall of the rack plating tank. A number of filter holes are formed in the bottom wall of the rack plating tank. The electroplating solution in the heating tank flows into the liquid supply tank through a liquid path, and then the liquid level rises to enter the rack plating tank through the filter holes. Two guiding grooves are formed on the upper surface of the bottom wall of the rack plating tank along the length direction. The bottom ends of the two stirring plates are respectively embedded in one guiding groove and translated along the length direction of the guiding groove. A metal electrolysis block for providing metal ions to the electroplating solution is arranged on the bottom surface of the rack plating tank on the side where the two stirring plates are close to each other.

8. The liquid path circulation heating type wafer electroplating equipment according to claim 6, characterized in that, An assembly groove is formed on the side of the hanging plate away from the overflow plate. The positioning ring, the clamping back plate and the mounting ring are installed in the assembly groove.

9. The liquid path circulation heating type wafer electroplating equipment according to claim 1, characterized in that, The heating device is arranged as a plurality of heating rods arranged along the height direction of the heating tank.

10. The liquid path circulation heating type wafer electroplating equipment according to claim 2, characterized in that, A friction reducing wheel is arranged on the outer side wall of the overflow tank. The connecting rod passes through the side wall of the rack plating tank and then passes through the side wall of the overflow tank and is in rolling cooperation with the friction reducing wheel. A number of water passing holes are formed through the stirring plate.

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