Gluing and developing equipment

Abstract

The invention provides gluing and developing equipment, and relates to the technical field of gluing and developing equipment, the gluing and developing equipment comprises an SPIN unit, a gluing device and a developing device, the SPIN unit comprises a bearing platform, the bearing platform is used for bearing a wafer and controlling the wafer to rotate, the wafer is provided with photoresist, after the wafer rotates, the photoresist forms a photoresist layer above the wafer, and the developing device is used for developing the photoresist layer above the wafer. Wherein the gluing device is located above the SPIN unit and can cut the photoresist layer to strip the photoresist layer on the upper surface of the wafer; compared with the prior art, accurate input and transmission of the wafer are completed through cooperation of the LoadPort and the semiconductor robot, the SPIN unit forms an initial photoresist layer through high-precision spin coating (dynamic calibration), and then the photoresist layer formed initially is cut through the gluing device, so that the wafer is conveniently transferred and conveyed to a subsequent process, and the production efficiency is improved. The photoresist layer is prevented from being damaged in the conveying process, and the PSPB robot and the MPB robot cooperate to complete flow control of the wafer in HP heating curing and CP cooling.

Description

Technical Field

[0001] The present invention relates to the technical field of spin coating and developing equipment, and particularly to a spin coating and developing equipment. Background Art

[0002] Spin coating and developing equipment plays a crucial role in the semiconductor manufacturing process. Especially in the lithography process, the uniformity and accuracy of the glue layer have a direct impact on the subsequent etching process and the yield of the chip.

[0003] Existing spin coating and developing equipment usually uses a SPIN unit to control the rotation of the wafer, and then outputs photoresist on the wafer. The centrifugal force is used to evenly spread the photoresist on the surface of the wafer to form a thin film with uniform thickness.

[0004] However, the formed photoresist film not only covers the upper surface of the wafer, but also covers a part of the area of the carrier platform in the SPIN unit, that is, a photoresist layer is formed on the carrier platform. The area of this photoresist layer is much larger than the upper surface area of the wafer. Since subsequent processes such as curing and exposure of the photoresist layer on the wafer surface are required, the wafer needs to be removed. In this state, during the process of removing the wafer, the photoresist layer on the carrier platform will be torn, and during the tearing process, the photoresist layer on the wafer surface is likely to be deformed or damaged, thus affecting the processing quality. Summary of the Invention

[0005] The purpose of the present invention is to provide a spin coating and developing equipment to solve the problem that the photoresist layer on the wafer surface is easily broken during the transfer and transportation of the wafer.

[0006] To achieve the above purpose, the present invention adopts the following technical solution. A spin coating and developing equipment includes a SPIN unit, a spin coating device, and a developing device. The SPIN unit includes a carrier platform for carrying the wafer and controlling the rotation of the wafer. There is photoresist on the wafer. After the wafer rotates, a photoresist layer is formed above the wafer, and the photoresist layer completely covers the wafer. The spin coating device is located above the SPIN unit and is used to output photoresist onto the wafer and can cut the photoresist layer to peel off the photoresist layer on the upper surface of the wafer.

[0007] The developing device is used to coat a developing solution on the photoresist layer on the wafer surface. During the coating process of the developing solution, the wafer is in a rotating motion state and the rotation speed can be adjusted so that the wafer can throw out the residues on the surface.

[0008] Further, the spin coating device includes a hanging plate and a glue outlet nozzle. The hanging plate is located above the carrier platform and is coaxially arranged with the wafer. The glue outlet nozzle is installed at the center of the lower surface of the hanging plate, and the photoresist is output to the center of the wafer through the glue outlet nozzle.

[0009] Further, the gluing device further includes an outer sheath and a lower sheath. The outer sheath is connected to the dropping tray through a support arm. The lower sheath is movably connected to the lower end of the outer sheath. After the lower sheath contacts the bearing platform, a working area is enclosed on the bearing platform.

[0010] Further, a cutting sleeve is connected to the support arm. When the cover plate is gradually moved downward until the cutting sleeve contacts the bearing platform, the cutting sleeve cuts the photoresist layer, so that the photoresist layer on the upper surface of the wafer is peeled off.

[0011] Further, the developing device includes a liquid coating mechanism and a base mechanism. The liquid coating mechanism is used to coat a developing solution on the wafer, and the base mechanism is used to control the movement of the wafer so that the wafer passes under the liquid coating mechanism.

[0012] Further, the liquid coating mechanism includes a flow buffer tray. The inside of the flow buffer tray has a cavity. A plurality of spray parts are arranged on the lower surface of the flow buffer tray in an inclined manner, so that the developer can be sprayed out by the spray parts, and the sprayed developer falls on the wafer.

[0013] Further, the base mechanism includes a placement plate and a first slide rail device. An accommodation groove is arranged on the upper surface of the placement plate, and the wafer can be placed in the accommodation groove. At this time, the upper surface of the wafer is exposed from the accommodation groove. The first slide rail device is connected to the placement plate. When the first slide rail device moves, the placement plate performs a linear motion.

[0014] Further, the base mechanism further includes a balance rail and a mounting shell. The balance rail is located between the first slide rail device and the placement plate, so that the placement plate moves along the length direction of the balance rail. The mounting shell is located below the balance rail. A guide rail is arranged on the mounting shell, and the guide rail is connected to the placement plate, so that the placement plate can rotate when performing a linear motion.

[0015] Further, a tray is connected to the placement plate. The tray is located between the placement plate and the balance rail. The tray is connected to the first slide rail device, and a central vertical shaft is arranged on the tray.

[0016] Further, a transmission sleeve body is fixed on the placement plate. The transmission sleeve body is sleeved on the central vertical shaft. A gear disc is fixed on the transmission sleeve body, and the gear disc meshes with the guide rail.

[0017] One or more technical solutions provided in this application have at least the following technical effects or advantages:

[0018] 1. A glue coating and developing device provided by the present invention completes the precise input and transfer of wafers through the cooperation of a LoadPort and a semiconductor robot. The SPIN unit forms a preliminary photoresist layer through high-precision rotary coating (dynamic calibration), and then the preliminary formed photoresist layer is cut by a glue coating device to facilitate the transfer and conveyance of the wafer to subsequent processes, avoiding damage to the photoresist layer during the conveyance process. The PSPB robot and the MPB robot cooperate to complete the process control of wafer heating and curing in the HP and cooling in the CP;

[0019] 2. In the present invention, through the coordinated cooperation of the developing device with the PSPB robot and the MPB robot, rapid developing work can be achieved, and through the structural setting of the developing device, it helps to improve the efficiency of the developing work. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] In combination with the accompanying drawings and with reference to the following detailed description, the above and other features, advantages, and aspects of the embodiments of the present invention will become more apparent. In the drawings, the same or similar reference numerals denote the same or similar elements, where:

[0021] Figure 1 is a top view structural schematic diagram of the present invention;

[0022] Figure 2 is a side view structural schematic diagram of the present invention;

[0023] Figure 3 is a structural schematic diagram of the glue coating device of the present invention;

[0024] Figure 4 is a three-dimensional view of the developing device of the present invention;

[0025] Figure 5 is an exploded three-dimensional view of the developing device of the present invention;

[0026] Figure 6 is a three-dimensional view of the base mechanism of the present invention;

[0027] Figure 7 is a three-dimensional view of the support mechanism of the present invention;

[0028] Figure 8 is a three-dimensional view of the liquid coating mechanism of the present invention;

[0029] Figure 9 is a schematic diagram of the connection structure between the placement plate and the tray in the second embodiment of the present invention;

[0030] Figure 10 is a schematic diagram of the connection between the guide rail and the installation shell in the second embodiment of the present invention;

[0031] Figure 11 is a schematic diagram of the connection between the erasing component and the liquid leakage rack in the second embodiment of the present invention;

[0032] Figure 12 Structural schematic diagram of the coating liquid component for Embodiment 3 of the present invention.

[0033] Legend description:

[0034] 1. LoadPort; 2. Semiconductor robot; 3. EFEM; 4. Glue bottle drawer; 5. SPIN unit; 6. CP; 7. MPB robot; 8. HP; 9. PSPB robot; 10. Developing device

[0035] 101. Base mechanism; 1011. Installation base; 1012. Limit plate; 1013. Installation shell; 1014. Support plate; 1015. Working motor; 1016. Transmission track; 1017. First slide rail device; 1018. Balance rail; 1019. Placing plate

[0036] 102. Support mechanism; 1021. Support frame; 1022. Inner support seat; 1023. Working slide rail; 1024. Transmission motor; 1025. Balancer; 1026. Side plate; 1027. Strip-shaped opening

[0037] 103. Coating liquid mechanism; 1031. Arch frame; 1032. Adjusting frame; 1033. Second slide rail device; 1034. Tail plate; 1035. Extension plate; 1036. Vertical plate; 1037. Glue liquid tank; 1038. Connecting pipe; 1039. Delivery pipe; 10310. Docking leak-proof rack; 10311. Roller; 10314. Flow retardation plate; 10315. Spraying part

[0038] 1201. Suspension arm; 1202. Cover plate; 1203. Glue outlet nozzle; 1204. Outer sheath; 1205. Slide opening; 1206. Support arm; 1207. Slide block; 1208. Elastic resetting part; 1209. Ball bearing; 1210. Lower position sleeve; 1211. Press-cut sleeve

[0039] 1041. Extension plate; 1042. Suspension tray; 1043. Compression reset spring; 1044. Guide rod

[0040] 1050. Tray; 1051. Central vertical shaft; 1052. Transmission sleeve body; 1053. Gear disc; 1054. Guide rail; 1055. Accommodation groove Detailed implementation manners

[0041] To make the objectives, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention. Apparently, the described embodiments are some, but not all, of the embodiments of the present invention. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present invention without creative efforts shall fall within the protection scope of the present invention.

[0042] In addition, the term "and / or" in this article is only a description of the association relationship of associated objects, indicating that three relationships may exist. For example, A and / or B may represent: A exists alone, A and B exist simultaneously, and B exists alone. In addition, the character " / " in this article generally represents an "or" relationship between the associated objects before and after.

[0043] Embodiment 1

[0044] As Figures 1-3 shown, the present invention provides a technical solution: a glue coating and developing device includes: an EFEM (Equipment Front End Module) 3 and a PSPB robot (Post Spin&PostBake Robot) 9. Among them, a LoadPort (loading port) 1 and a semiconductor robot 2 are provided on the EFEM 3. The semiconductor robot 2 is located above the LoadPort 1. A glue bottle drawer 4 is provided on one side of the EFEM 3. A SPIN unit (spin processing unit) 5 is provided on the side of the glue bottle drawer 4 away from the EFEM 3. The SPIN unit 5 mainly consists of a rotating motor, a bearing platform, a drive circuit, a control system, etc. The rotating motor is connected to the wafer bearing platform through a drive shaft. The SPIN unit 5 is also located on the side of the PSPB robot (Post Spin&Post Bake Robot) 9. An HP (Hot Plate) 8 and an MPB robot (Main Process Robot) 7 are also provided on the side of the PSPB robot 9. After placing the wafer on the LoadPort 1, the wafer is transferred to the SPIN unit 5 by the semiconductor robot 2. The wafer is coated with glue at the SPIN unit 5. Then the wafer coated with glue is transported by the PSPB robot to the HP 8 for drying. Then the wafer is transferred by the MPB robot 7 so that the wafer is transferred to the CP (Cold Plate) 6. After the wafer is cooled by the CP 6, the wafer is exposed. After the photoresist layer on the wafer is exposed, the wafer is transported to a developing device, and the exposed / non-exposed areas on the wafer are processed by the developing device 10.

[0045] A glue coating device is arranged above the SPIN unit 5, and the glue coating device is used to transport the photoresist liquid to the surface of the wafer. At this time, the wafer is located on the SPIN unit 5, and the SPIN unit 5 controls the wafer to rotate so that the photoresist layer on the surface is more uniform. The glue coating device includes a vertically retractable arm 1201, the upper end of the arm 1201 is fixed on the top wall of the chamber where the SPIN unit 5 is located, and the lower end of the arm 1201 is connected to a cover plate 1202, and the cover plate 1202 is located above the carrying platform of the SPIN unit 5. A conveying channel is provided inside 1202, and the conveying channel is connected to the glue bottle in the glue bottle drawer 4 through a conveying hose. A glue outlet 1203 is installed at the center of the lower surface of the cover plate 1202, and the photoresist liquid in the glue bottle can be discharged downward through the glue outlet 1203, so that the photoresist can fall on the upper surface of the wafer. However, it should be noted that the cover plate 1202 and the wafer on the carrying platform are coaxially arranged. At this time, the photoresist will fall on the center of the wafer. As the carrying platform rotates, a photoresist layer of uniform thickness can be formed on the surface of the wafer;

[0046] In order to make the environment clean, an outer sheath 1204 is connected to the cover plate 1202. The outer sheath 1204 is cylindrical, and its diameter is larger than the diameter of the cover plate 1202 and the wafer. A sliding mouth 1205 is arranged on the inner wall of the outer sheath 1204. The sliding mouth 1205 extends along the axial direction of the outer sheath 1204. A radially extending support arm 1206 is fixed on the circumferential surface of the cover plate 1202. A slider 1207 is fixed to the outer end of the support arm 1206. The slider 1207 is located in the sliding mouth 1205. An elastic reset member 1208 is arranged in the sliding mouth 1205. The lower end of the elastic reset member 1208 is connected to the slider 1207, and the upper end of the elastic reset member 1208 is connected to the high end of the sliding mouth 1205. When the cover plate 1202 is controlled to move downward by the lifting arm 1201, the outer sleeve 1204 also moves downward. The lower end of the outer sleeve 1204 is connected to a low sleeve 1210 through a ball bearing 1209. The diameter of the low sleeve 1210 is larger than the diameter of the outer sleeve 1204. As the cover plate 1202 moves downward, the low sleeve 1210 is against the carrying platform. When the carrying platform rotates, the low sleeve 1210 also rotates accordingly. At this time, the low sleeve 1210 forms an operating area on the carrying platform. The wafer is located in this operating area, and the photoresist is also located in this operating area. Even if the photoresist is affected by centrifugal force during the process of forming a glue layer on the wafer, the photoresist cannot leave the operating area.

[0047] A cutting sleeve 1211 is also fixed on the above-mentioned support arm 1206. The edge of the lower port of the cutting sleeve 1211 is a cutting edge. After the photoresist is sprayed, the rotation of the bearing platform is stopped, and at the same time, the output of the photoresist is stopped. At this time, the cover plate 1202 is gradually moved downward until the lower port of the cutting sleeve 1211 contacts the bearing platform. The inner diameter of the cutting sleeve 1211 is slightly larger than the diameter of the wafer, but the difference should not be too large. The optimal difference is between 0.2 - 0.4 mm. In this way, the photoresist layer in the working area can be cut, separating the photoresist layer on the upper surface of the wafer from the photoresist layers in other parts, that is, the photoresist layer on the upper surface of the wafer can be peeled off, facilitating the removal of the wafer without damaging the photoresist layer on its surface.

[0048] Refer to Figure 1 、 Figure 4 and Figure 5 As shown in

[0049] Refer to Figure 6 As shown in

[0050] the base mechanism 101 includes a mounting base 1011. Limit plates 1012 are provided at both ends of the mounting base 1011. A support platform plate 1014 is provided on the mounting base 1011. There is a certain vertical distance between the support platform plate 1014 and the mounting base 1011. A driving track 1016 is provided above the support platform plate 1014. The driving track 1016 is connected to a working motor 1015. The output speed of the working motor 1015 can be adjusted in two gears. The movement of the driving track 1016 can be controlled by the working motor. The working motor 1015 is located on the mounting base 1011. An installation shell 1013 is also assembled on the mounting base 1011. An opening is provided on the installation shell 1013. A placement plate 1019 is connected by the driving track 1016. The placement plate 1019 is located above the installation shell 1013. The linear reciprocating movement of the placement plate 1019 can be controlled by the driving track 1016.During specific connection, a first slide rail device 1017 is installed on the driving track 1016. Above the first slide rail device 1017, a balance rail 1018 is provided. The placement plate 1019 is located above the balance rail and is connected to the first slide rail device 1017. The balance rail 1018 is located on the installation shell 1013. When the driving track 1016 moves, the placement plate 1019 can be driven to move through the first slide rail device 1017. At this time, the first slide rail device 1017 moves within the opening of the installation shell 1013. After the wafer is placed on the placement plate, it can drive the wafer to move. Therefore, the moving direction of the driving track 1016 determines the moving direction of the placement plate 1019. The working motor 1015 that controls the movement of the driving track 1016 is a bidirectional driving motor. According to the change in the rotation direction of its output shaft, the moving direction of the driving track 1016 can be changed.

[0051] Refer to Figure 7 As shown, the support mechanism 102 is installed on the base mechanism 101 and is used to keep the base mechanism 101 and the liquid coating mechanism 103 in a vertically arranged position state. Among them, the liquid coating mechanism 103 is located above the base mechanism 101. The support mechanism 102 includes a support frame 1021. The support frame 1021 is a portal frame. A chamber is provided on the cross beam of the support frame 1021. An inner support seat 1022 is installed in the chamber. The bottom of the inner support seat 1022 is welded in the chamber of the support frame 1021. A working slide rail 1023 is provided on the inner support seat 1022. The working slide rail 1023 can be connected to the inner support seat 1022 or to the support frame 1021. A strip-shaped opening 1027 is provided on the cross beam of the support frame 1021. The strip-shaped opening 1027 communicates with the chamber. After the inner support seat 1022 is installed in the chamber of the support frame 1021, the liquid coating mechanism 103 can be connected to the working slide rail. A transmission motor 1024 and a balancer 1025 are installed on the inner support seat 1022. The transmission motor 1024 and the balancer 1025 are respectively located at positions close to both ends of the working slide rail 1023. The transmission motor 1024 is connected to the working slide rail 1023. The transmission motor 1024 can control the working of the transmission components on the working slide rail. The transmission components can be a gear set or a track. A side plate 1026 is also provided on the inner support seat 1022. The side plate 1026 can cover the chamber on the support frame 1021. At this time, the inner support seat 1022 is located in the chamber.

[0052] Refer to Figure 4 、 Figure 5 and Figure 8As shown, when the above-mentioned transfer motor 1024 operates, the liquid coating mechanism 103 can be controlled to move. Specifically, the liquid coating mechanism 103 includes an arch frame 1031, and the arch frame 1031 is a bent frame. At this time, the arch frame 1031 is divided into a horizontal section and a vertical section. An adjustment frame 1032 is installed on the horizontal section of the arch frame 1031. The adjustment frame 1032 is used to connect to the working slide rail 1023 on the support mechanism 102. Therefore, a second slide rail device 1033 is installed on the adjustment frame 1032. The second slide rail device 1033 is used to cooperate with the working slide rail 1023. When the transmission component on the working slide rail moves, it can drive the second slide rail device 1033 to move along the length direction of the working slide rail 1023, thereby driving the arch frame 1031 to move;

[0053] An extension board 1035 is further provided on the arch frame 1031. The extension board 1035 is installed on the vertical section of the arch frame 1031. A liquid coating assembly is also installed on the vertical section of the arch frame 1031. When the arch frame 1031 moves along the length direction of the working slide rail, the liquid coating assembly also moves accordingly, thereby enabling the development liquid to be coated on the upper surface of the wafer.

[0054] The liquid coating assembly therein includes a glue liquid tank 1037. The glue liquid tank 1037 is docked with the arch frame 1031 through a vertical board 1036. The glue liquid tank 1037 is docked with a connecting pipe 1038. The connecting pipe 1038 is connected to a liquid leakage rack 10310 through a delivery pipe 1039. The liquid leakage rack 10310 is a flat strip, which is provided with a notch. The notch extends along the length direction of the flat strip. A roller 10311 is installed in the notch. The roller 10311 is connected to the liquid leakage rack 10310 through a central shaft rod. A circulation cavity is provided inside the flat strip. The circulation cavity is communicated with the delivery pipe 1039. A liquid leakage port is also provided on the flat strip. The liquid leakage port is communicated with the circulation cavity. The development liquid can enter the circulation cavity after passing through the delivery pipe 1039, and then fall on the roller 10311 after passing through the liquid leakage port. When the wafer passes under the roller 10311 and there is contact between the two, due to the action of friction, the roller 10311 can roll, thereby coating the development liquid on the surface of the wafer.

[0055] Refer to Figure 9 and Figure 10As shown, in Embodiment 2 of the present application, as a preferred embodiment, the placement plate 1019 can be connected with a tray 1050. The tray 1050 is located between the placement plate 1019 and the balance rail 1018. The placement plate 1019 in this embodiment is preferably a disc body. The tray 1050 is connected with the first slide rail device 1017, that is, when the first slide rail device 1017 makes a linear motion, the tray 1050 also makes a linear motion accordingly. A central vertical shaft 1051 is arranged at the central position of the tray 1050, and the placement plate 1019 is connected with the central vertical shaft 1051 on the tray 1050, and the placement plate 1019 can rotate. A transmission sleeve body 1052 is fixed on the lower surface of the placement plate 1019. The transmission sleeve body 1052 is sleeved on the central vertical shaft 1051, and a gear disc 1053 is fixed on the transmission sleeve body 1052. The gear disc 1053 is located between the tray 1050 and the placement plate 1019. A guide rail 1054 is arranged on the installation shell. The guide rail 1054 meshes with the gear disc 1053. When the first slide rail device 1017 makes a linear motion, the gear disc 1053 will move linearly synchronously. Since the gear disc 1053 meshes with the guide rail 1054 and the guide rail 1054 is arranged on the installation shell 1013 and the guide rail 1054 is in a non-movable state, the gear disc 1053 will rotate during this process, thereby driving the placement plate 1019 to rotate. A receiving groove 1055 is arranged on the placement plate 1019, and the wafer can be placed in the receiving groove 1055. At this time, the upper surface of the wafer leaks out from the receiving groove 1055. Therefore, when the first slide rail device 1017 makes a linear motion, the wafer located in the receiving groove 1055 also rotates accordingly. When the wafer contacts the roller 10311, the uniformity of the developer coating can be increased.

[0056] Refer to Figure 11As shown, in this embodiment, an erasing component may also be provided on the coating liquid component. The erasing component is used to remove the remaining liquid on the placement plate. The erasing component includes an extension plate 1041 fixed on the liquid leakage rack 10310. The length direction of the extension plate 1041 is perpendicular to the length direction of the liquid leakage rack. There are two extension plates 1041, and the two extension plates 1041 are symmetrically arranged with the liquid leakage rack as the center line. At least two through holes are provided on each extension plate 1041, and a guiding component is connected through the two through holes. A soft brush hair is fixed on the guiding component. The guiding component includes a hanging plate 1042 arranged horizontally. Two guiding rods 1044 are fixed on the hanging plate 1042. Each guiding rod 1044 passes through the corresponding through hole. The soft brush hair is fixed on the lower surface of the hanging plate 1042. A compression return spring 1043 is arranged between the hanging plate 1042 and the extension plate 1041. The compression return spring 1043 is sleeved on the guiding rod 1044. Through the compression return spring 1043, the soft brush hair on the hanging plate 1042 can be made to contact the placement plate. When the first slide rail device 1017 makes a linear motion, the placement plate can be driven to move. At this time, the remaining liquid on the surface of the placement plate is removed by the soft brush hair.

[0057] In different processes, the rotation speed of the placement plate 1019 is different. For example, at the beginning of the developing process, the placement plate 1019 is at the first gear rotation speed. At this time, the rotation speed of the placement plate 1019 is relatively slow, which can make the developer fully contact the photoresist layer. After the developer and the photoresist layer react for a period of time, the placement plate 1019 can be adjusted to the second gear rotation speed. At this time, the rotation speed of the placement plate 1019 is increased, thereby increasing the centrifugal force of the developer on the placement plate 1019. At this time, the developer and the like can be thrown out.

[0058] Refer to Figure 12 As shown, in Embodiment 3, as a further improvement to the preferred embodiment, the liquid leakage rack 10310 in the above coating liquid component can be replaced with a flow buffer plate 10314. The inside of the flow buffer plate 10314 has a cavity. The center of the flow buffer plate 10314 is connected to the delivery pipe through a docking member. This delivery pipe is a metal pipe, and the delivery pipe is communicated with the cavity inside the flow buffer plate 10314. A plurality of spray members 10315 inclinedly arranged are provided on the lower surface of the flow buffer plate 10314. The developer located in the glue liquid tank can be sprayed out by the spray members 10315. After being sprayed out, the developer falls on the wafer. Since the wafer rotates with the placement plate 1019, spraying on the surface of the wafer can be formed through the spray members 10315.

[0059] In this application, the glue solution tank 1037 can be connected to two stock solution tanks through an input pipeline. Clear water and developer are stored in the two stock solution tanks respectively. A butterfly valve is provided on the input pipeline. By controlling the butterfly valve, the type of liquid input into the glue solution tank 1037 can be selected. During the development operation, the developer can be input first, and then the input liquid can be switched to clear water to clean the surfaces of the wafer and the placement plate.

[0060] An opening for the flow of liquid can be provided on the mounting base 1011, which can be used for the flow of cleaning liquid. A container for collection can also be provided below the mounting base 1011 to avoid environmental pollution.

[0061] In this application, after the wafer enters the equipment through LoadPort1, it is transferred by the semiconductor robot 2 through the EFEM3 to the glue bottle drawer 4 area to pick up glue, and then transferred to the SPIN unit 5 for spin coating; the PSPB robot 9 transfers the wafer to the HP8 for heating and curing, and then transports it to the CP6 for cooling through the MPB robot 7, and finally the development operation is completed by the developing device 10.

[0062] The transfer motor 1024 of the support mechanism 102 and the balancer 1025 work together with the slide rail 1023, and each unit realizes high-precision transfer and process connection through the robot and the slide rail system.

[0063] In the specific implementation process, equipment initialization and calibration are carried out first, mainly in the following aspects: First, it is necessary to accurately detect the external interface position of the semiconductor robot 2 and ensure its smooth operation. The control system during the detection process needs to accurately calculate the position deviation and adjust it through feedback so that the semiconductor robot 2 is in the accurate position;

[0064] Second, confirm that the glue bottle drawer 4 can be opened and closed smoothly and can accurately extract the required glue bottle. The position of the glue bottle is detected by a sensor to prevent problems such as glue leakage or inability to extract the glue bottle caused by position deviation;

[0065] Third, the control system will confirm the position of the SPIN unit 5 through the positioning system to ensure that the SPIN unit 5 can rotate smoothly. The working accuracy and stability of the SPIN unit 5 are crucial for the glue coating effect. After the above equipment initialization and calibration are completed, the LoadPort1 in the EFEM3 is responsible for transferring the semiconductor chip to be processed into the equipment and placing it in the correct position through the robotic arm. The control system will start the transfer path to ensure that the LoadPort1 can accurately send the chip into the processing area of the semiconductor robot 2;

[0066] Then, the PSPB robot 9, the MPB robot 7, and each robotic arm need to cooperate synchronously to complete the extraction and transfer of wafers (semiconductor chips). The control system will perform precise scheduling according to the action sequence among the robots to avoid interference or action delay. In particular, the MPB robot 7 and the PSPB robot 9 need to cooperate precisely to ensure the error-free transfer of wafers.

[0067] During the spin coating process, since the SPIN unit 5 mainly consists of a rotating motor, a carrier platform, a drive circuit, and a control system, etc., the rotating motor is connected to the carrier platform through a drive shaft. When the motor receives the instruction sent by the control system, it will drive the carrier platform to rotate at a set speed and time, so that the wafer placed on the carrier platform rotates at a high speed. There is a spin coating device above the wafer. The spin coating device is not only limited to coating the glue, but can also drip the glue. Its main function is to transport the glue to the wafer, adjust the rotation speed of the SPIN unit 5, and ensure that the glue can form a uniform coating on the chip surface. The rotation speed and direction of the motor are mainly controlled by the drive circuit to meet the requirements of different processes for the rotation speed and direction of the wafer. At the same time, the control system precisely controls the start, stop, and speed adjustment of the SPIN unit according to the preset process parameters. The drive circuit and preset parameters, etc. are all prior arts and will not be elaborated here.

[0068] After completing the above spin coating action, the control system will detect the uniformity, thickness, and adhesion of the spin coating through devices such as vision sensors and thickness sensors. The device will collect images of the wafer surface and analyze the spin coating quality through the image processing unit to determine whether it meets the process requirements. If equipment failures or abnormal operations occur during the spin coating process, the cause of the failure needs to be identified. Troubleshooting can include recalibrating the sensors, adjusting the action accuracy of the robotic arm, and replacing damaged components.

[0069] After the gluing process is completed, the processed wafer is output to HP8 (Hot Plate) where the glue layer on the wafer surface is dried. Then the dried wafer is transported to CP6 (Cold Plate) for cooling. An exposure component is provided above CP6, and the cooled wafer is exposed through the exposure component. After the glued wafer is exposed, an exposed area is formed on the glue layer. If the glue layer on the wafer surface is a positive photoresist, the molecular chains of the photoresist in the exposed area will be broken, thus increasing its solubility in the developer; if the glue layer on the wafer surface is a negative photoresist, the photoresist molecules in the exposed area will undergo a cross-linking reaction and become insoluble in the developer. Then the exposed wafer is transported to the developing device by the MPB robot, and the glue layer on the wafer comes into contact with the developer in the developing device, finally forming the required pattern on the surface of the wafer. During the developing process, the control system monitors the flow rate of the liquid in the glue liquid tank 1037 and adjusts the pressure of the glue liquid tank 1037 according to actual needs to ensure that the liquid can flow into the developing device stably;

[0070] Working principle:

[0071] As Figures 1-8 shown, the wafer is first accurately input by the LoadPort1 device. The semiconductor robot 2 transfers it to the glue bottle drawer 4 area in the clean environment of the EFEM3 to pick up glue, and detects the position of the glue bottle through a sensor to ensure that there is no glue leakage. Subsequently, the wafer is sent to the SPIN unit 5 for spin coating, and its rotation speed and glue contact accuracy are dynamically calibrated by the control system. At this stage, the device ensures the accurate docking of the SPIN unit 5 and the glue bottle drawer 4 through the positioning system.

[0072] After the gluing is completed, the vision sensor and thickness sensor perform multi-dimensional analysis on the coating uniformity, thickness, and adhesion. If abnormalities are detected (such as uneven glue or equipment failure), the sensors are recalibrated or the accuracy of the robotic arm is adjusted. Finally, the wafer is output to HP8 by the PSPB robot 9 for drying to cure the glue layer on the wafer surface. Then the wafer is output to CP6 by the MPB robot 7 for cooling, and then undergoes exposure and developing processes.

[0073] During the development process, it is mainly executed by the development device 10. The working motor 1015 of its base mechanism 101 drives the transmission track 1016, driving the first slide rail device 1017 to move the placement plate 1019 along the length direction of the balance rail 1018, transporting the wafer to the placement plate 1019 to achieve wafer positioning. In the liquid coating mechanism 103, the liquid in the glue tank 1037 is transported to the docking liquid leakage rack 10310 through the connecting pipe 1038 and the conveying pipe 1039. The roller 10311 completes uniform liquid coating under the coordinated control of the adjustment frame 1032 and the second slide rail device 1033. The control system adjusts the pressure of the glue tank in real time to ensure that the liquid in the glue tank can be output smoothly.

[0074] The above specific implementation manners do not constitute a limitation to the protection scope of the present invention. Those skilled in the art should understand that various modifications, combinations, sub-combinations and substitutions can be made according to design requirements and other factors. Any modifications, equivalent substitutions and improvements made within the spirit and principle of the present invention shall be included within the protection scope of the present invention.

Claims

1. A glue coating and developing device, characterized in that, Comprising: A SPIN unit, including a carrying platform for carrying a wafer and controlling the rotation of the wafer. There is photoresist on the wafer. After the wafer rotates, a photoresist layer is formed above the wafer, and the photoresist layer completely covers the wafer. A coating device, located above the SPIN unit, for outputting photoresist onto the wafer and capable of cutting the photoresist layer to strip the photoresist layer on the upper surface of the wafer. A developing device, for coating a developing solution on the photoresist layer on the wafer surface. During the coating of the developing solution, the wafer is in a rotating motion state and the rotation speed can be adjusted so that the wafer can throw out the residues on the surface.

2. The glue coating and developing device according to claim 1, wherein The coating device includes: a hanging plate, located above the carrying platform and coaxially arranged with the wafer. A glue outlet nozzle, installed at the center of the lower surface of the hanging plate, and outputting photoresist to the center of the wafer through the glue outlet nozzle.

3. The glue coating and developing device according to claim 2, wherein The coating device further includes an outer sheath, connected to the hanging plate. A lower sleeve, movably connected to the lower end of the outer sheath. After the lower sleeve contacts the carrying platform, a working area is enclosed on the carrying platform. A support arm, with both ends respectively connected to the outer sheath and the hanging plate.

4. The glue coating and developing device according to claim 3, characterized in that, A cutting sleeve is connected to the support arm. When the cover plate is gradually moved downward until the cutting sleeve contacts the carrying platform, the cutting sleeve cuts the photoresist layer to strip the photoresist layer on the upper surface of the wafer.

5. The glue coating and developing device according to claim 1, wherein, The developing device includes: A liquid coating mechanism for coating a developing solution on the wafer. A base mechanism for controlling the movement of the wafer so that the wafer passes under the liquid coating mechanism.

6. The glue coating and developing device according to claim 5, wherein The liquid coating mechanism includes: A slow-flow plate, with a cavity inside. The lower surface of the slow-flow plate is provided with a number of inclined spraying parts, so that the developer can be sprayed out by the spraying parts, and the sprayed developer falls on the wafer.

7. The glue coating and developing device according to claim 5, characterized in that, The base mechanism includes: A placement plate, the upper surface of the placement plate is provided with a receiving groove, and the wafer can be placed in the receiving groove. At this time, the upper surface of the wafer is exposed from the receiving groove. A first slide rail device, connected to the placement plate. When the first slide rail device moves, the placement plate performs a linear motion.

8. The glue coating and developing device according to claim 7, characterized in that The base mechanism further includes: A balance rail, located between the first slide rail device and the placement plate, enabling the placement plate to move along the length direction of the balance rail. A mounting shell, located below the balance rail. A guide rail is provided on the mounting shell, and the guide rail is connected to the placement plate, enabling the placement plate to rotate when performing a linear motion.

9. The glue coating and developing device according to claim 8, wherein The placement plate is connected with a tray. The tray is located between the placement plate and the balance rail. The tray is connected to the first slide rail device, and a central vertical shaft is provided on the tray.

10. The glue coating and developing device according to claim 9, wherein, A transmission sleeve body is fixed on the placement plate. The transmission sleeve body is sleeved on the central vertical shaft, and a gear disk is fixed on the transmission sleeve body. The gear disk meshes with the guide rail.

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