Modular high-strength high-efficiency heat dissipation circuit board

Abstract

The application discloses a modular high-strength high-efficiency heat dissipation circuit board, which comprises a first circuit board unit, a second circuit board unit, a third circuit board unit and a reinforcing connection unit. The circuit board is modularly assembled by multiple circuit board units, thereby realizing modular work and reducing maintenance cost when maintenance is needed. The reinforcing connection unit can reinforce the connection of multiple modules and realize heat dissipation of each module.

Description

Technical Field

[0001] This invention relates to the field of circuit board technology, and more specifically, to a modular high-strength and high-efficiency heat dissipation circuit board. Background Technology

[0002] Circuit boards (PCBs) support various electronic components and connect them through wires, pads, and other structures to form a complete circuit system. PCBs play a crucial role in electronic devices, providing support and connectivity for these components and are indispensable parts of electronic equipment.

[0003] Existing circuit boards are often single boards integrating microprocessors, power modules, sensor modules, and other necessary operating modules. However, if one module fails during use, it is often difficult to replace the faulty module alone; the entire circuit board must be replaced, resulting in high maintenance costs. While using a common method of connecting multiple circuit boards via data cables facilitates individual module replacement and maintenance, reducing costs, the overall structural integrity of multiple circuit boards installed within the device is questionable. Furthermore, different modules generate different amounts of heat and require different cooling solutions, making it difficult to implement targeted cooling for each module. Summary of the Invention

[0004] The present invention aims to overcome the shortcomings of the prior art and provide a modular, high-strength, and high-efficiency heat dissipation circuit board.

[0005] To achieve the above objectives, the present invention provides the following technical solution: a circuit board, comprising a first circuit board unit, a second circuit board unit, a third circuit board unit, and a reinforcing connection unit; the first circuit board unit includes a first circuit board, on which a first socket unit and a first connector are mounted; the second circuit board unit includes a second circuit board, on which a second socket unit and a second connector are mounted; the third circuit board unit includes a third circuit board, on which a first interface unit and a second interface unit are mounted; a connecting wire connects the first connector and the second connector; the reinforcing connection unit includes a first connecting part, a second connecting part, and a third connecting part.

[0006] Furthermore, the first interface unit can be plugged into the first socket unit; the second interface unit can be plugged into the second socket unit.

[0007] Furthermore, the first connecting part is fixedly connected to the first circuit board, the second connecting part is fixedly connected to the second circuit board, and the third connecting part is fixedly connected to the third circuit board.

[0008] Furthermore, the third connecting part is fixedly connected to both the first connecting part and the second connecting part.

[0009] Furthermore, the connecting cable includes a first plug that mates with a first socket, a second plug that mates with a second socket, and a data cable that connects the first plug and the second plug.

[0010] Furthermore, a first shielding cover is hinged to the first circuit board, and a second shielding cover is hinged to the second circuit board; the first connecting part includes a first tube, a first fixing plate, and a first connecting plate, the first tube having a first groove, and a first heat-conducting plate installed in the first groove; the second connecting part includes a second tube, a second fixing plate, and a second connecting plate, the second tube having a second groove, and a second heat-conducting plate installed in the second groove; the third connecting part includes a cover plate, a first support plate, two support feet, and two second support plates.

[0011] Thus, the first and second shielding covers can prevent the first and second circuit board units from being interfered with by the current at the third circuit board unit.

[0012] Furthermore, both the first fixing plate and the first connecting plate are fixedly connected to the first tube.

[0013] Furthermore, the first heat-conducting plate can abut against the first shielding cover.

[0014] Furthermore, the first fixing plate is fixedly connected to the first circuit board, and the first connecting plate is fixedly connected to both the first circuit board and the third circuit board.

[0015] Furthermore, both the second fixing plate and the second connecting plate are fixedly connected to the second tube.

[0016] Furthermore, the second heat-conducting plate can abut against the second shielding cover.

[0017] Furthermore, the second fixing plate is fixedly connected to the second circuit board, and the second connecting plate is fixedly connected to both the second and third circuit boards.

[0018] Furthermore, the first support plate, the two support feet, and the two second support plates are all fixedly connected to the third circuit board.

[0019] Furthermore, the first tube is fixedly connected to one of the second support plates, and the second tube is fixedly connected to the other second support plate.

[0020] Furthermore, one side of the first shielding cover is hinged to the first circuit board; one side of the second shielding cover is hinged to the second circuit board.

[0021] Furthermore, the first circuit board, the second circuit board, and the third circuit board all have through holes.

[0022] This makes it convenient to install the first, second, and third circuit boards into the corresponding devices.

[0023] Furthermore, the cross-sections of the first support plate, the support foot, and the second support plate are all L-shaped.

[0024] Furthermore, air outlet gaps are formed between the first support plate and the two support legs.

[0025] Furthermore, an air intake gap is formed between the two second support plates.

[0026] Furthermore, it also includes two pressing units; a U-shaped connecting part is connected between the first tube and the second tube, the U-shaped connecting part including a first convex plate, a second convex plate and a third connecting plate; the first heat-conducting plate is hinged to the first groove, and the second heat-conducting plate is hinged to the second groove; the pressing unit includes a first L-shaped slide, a first pressure plate, a first limiting rod, an insert rod, a second L-shaped slide, a second pressure plate and a second limiting rod, the second limiting rod having an insertion hole; the first L-shaped slide has a first slot, and the second L-shaped slide has a second slot.

[0027] Furthermore, both the first L-shaped slide and the second L-shaped slide have locking bolts.

[0028] Furthermore, the first pressure plate is fixedly connected to the first L-shaped slide, the first limiting rod is fixedly connected to the first pressure plate, and the insertion rod is fixedly connected to the first limiting rod.

[0029] Furthermore, the second pressure plate is fixedly connected to the second L-shaped slide, the second limiting rod is fixedly connected to the second pressure plate, and the insertion hole cooperates with the insertion rod.

[0030] Furthermore, the two clamping units cooperate with the first connecting part and the second connecting part, respectively.

[0031] Furthermore, the first protruding plate is fixedly connected to the first tube, and the second protruding plate is fixedly connected to the second tube.

[0032] Furthermore, the third connecting plate connects the first convex plate and the second convex plate.

[0033] Furthermore, the third connecting plate is fixedly connected to the third circuit board.

[0034] Furthermore, the insertion rod has a rubber coating.

[0035] This increases the friction between the insert and the slot, requiring external force to disengage the insert from the slot.

[0036] Furthermore, the third circuit board has a rectangular notch.

[0037] Furthermore, the rectangular notch is located between the first convex plate and the second convex plate.

[0038] This allows the first and second circuit boards to be further away from the core components at the third circuit board, thus preventing interference with the first and second circuit boards.

[0039] Furthermore, the slots of the first L-shaped slide and the second L-shaped slide of the clamping unit that cooperate with the first connecting part are inserted by the first protrusion; the slots of the first L-shaped slide and the second L-shaped slide of the clamping unit that cooperate with the second connecting part are inserted by the second protrusion.

[0040] Furthermore, both the first and second pressure plates are in an elastic, curved shape.

[0041] Thus, the first and second pressure plates exert a certain downward pressure, causing the first heat-conducting plate to abut against the first shielding cover and the second heat-conducting plate to abut against the second shielding cover, thereby achieving better heat conduction.

[0042] Furthermore, the first heat-conducting plate has a first heat-conducting pad and multiple first heat dissipation fins.

[0043] This allows for heat dissipation of the first circuit board.

[0044] Furthermore, the second heat-conducting plate has a second heat-conducting pad and multiple second heat dissipation fins.

[0045] This allows for heat dissipation of the second circuit board.

[0046] Furthermore, the cover plate has multiple third heat dissipation fins; multiple first heat dissipation fins each have a first limiting hole, and multiple second heat dissipation fins each have a second limiting hole.

[0047] Thus, the third heat sink fins can dissipate heat from the third circuit board.

[0048] Furthermore, the first limiting hole can be inserted by the first limiting rod and the second limiting rod; the second limiting hole can be inserted by the first limiting rod and the second limiting rod.

[0049] Furthermore, multiple sensor interface units are installed on the first circuit board.

[0050] Furthermore, a microprocessor and a wireless communication unit are mounted on the second circuit board.

[0051] Furthermore, a charging port, a battery cell, a battery management circuit, and a DC-DC converter are installed on the third circuit board.

[0052] Furthermore, the multiple sensor interface units include a temperature sensor interface and a humidity sensor interface.

[0053] Furthermore, the multiple sensor interface units include a gas sensor interface and an acceleration sensor interface.

[0054] Furthermore, two first limiting rods are fixedly connected to the first pressure plate, and two second limiting rods are fixedly connected to the second pressure plate.

[0055] Furthermore, each first heat dissipation fin has two first limiting holes, and each second heat dissipation fin has two second limiting holes.

[0056] Furthermore, the first fixing plate, the first connecting plate, the second fixing plate, the second connecting plate, the third connecting plate, the first support plate, the two support feet, and the two second support plates all have bolt through holes, and the first circuit board, the second circuit board, and the third circuit board all have threaded holes that mate with the bolt through holes.

[0057] Furthermore, the first connecting part and the first circuit board are fixedly connected by bolts.

[0058] Furthermore, the second connecting part and the second circuit board are fixedly connected by bolts.

[0059] Furthermore, the third connecting part and the third circuit board are fixedly connected by bolts.

[0060] Furthermore, the first heat-conducting plate, the second heat-conducting plate, and the cover plate are all made of metal.

[0061] Preferably, it is made of a copper-aluminum alloy.

[0062] Furthermore, both the first and second tube sections are made of metallic materials.

[0063] Preferably, it is made of a copper-aluminum alloy.

[0064] Beneficial effects:

[0065] 1. The circuit board of this application adopts a modular assembly method of multiple circuit boards to achieve modular operation, thereby reducing maintenance costs when maintenance is required.

[0066] 2. The circuit board of this application can achieve reinforced connection of multiple modules through the reinforced connection unit, and can also achieve heat dissipation of each module. Attached Figure Description

[0067] Figure 1 This is a schematic diagram of the circuit board;

[0068] Figure 2 This is a magnified view of region A;

[0069] Figure 3 This is a magnified view of region B.

[0070] Figure 4 A schematic diagram showing the separation of the first L-shaped slide and the second L-shaped slide;

[0071] Figure 5 This is a magnified view of region C;

[0072] Figure 6 This is a magnified view of region D;

[0073] Figure 7 A schematic diagram showing the first and second heat-conducting plates and the first and second shielding covers opened;

[0074] Figure 8 This is a magnified view of region E.

[0075] Figure 9 A schematic diagram showing the separation of the reinforcement connection unit from the first, second, and third circuit board units;

[0076] Figure 10 This is a magnified view of region F;

[0077] Figure 11 This is a schematic diagram showing the separation of the first, second, and third circuit board units;

[0078] Figure 12 This is a magnified view of region G;

[0079] Figure 13 This is a magnified view of region H.

[0080] Explanation of reference numerals in the attached drawings: First circuit board 1.1; First socket unit 1.2; First connector 1.3; First shielding cover 1.4; Sensor interface unit 1.5; Second circuit board 2.1; Second socket unit 2.2; Second connector 2.3; Second shielding cover 2.4; Third circuit board 3.1; Rectangular notch 3.1.1; First interface unit 3.2; Second interface unit 3.3; Charging socket 3.4; Battery unit 3.5; First tube 4.1; First fixing plate 4.2; First connecting plate 4.3; First heat-conducting plate 5; First heat-conducting pad 5.1; First heat dissipation fin 5.2; First limiting hole 5.2.1; Second tube 6.1; Second fixing plate 6.2; Second connecting plate 6.3; Second heat-conducting plate 7; Second heat dissipation fin 7.1; Second limiting hole 7.1.1; Cover plate 8.1; First support plate 8.2; Support foot 8.3; Second support plate 8.4; Third heat dissipation fin 8.5; Third connecting plate 9; First L-shaped slide 10.1; First pressure plate 10.2; First limiting rod 10.3; Insert rod 10.4; Second L-shaped slide 10.5; Second pressure plate 10.6; Second limiting rod 10.7; Locking bolt 10.8. Detailed Implementation

[0081] Embodiments of the present invention are described in detail below, examples of which are illustrated in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and intended to explain the present invention, and should not be construed as limiting the present invention.

[0082] This invention provides a modular high-strength and high-efficiency heat dissipation circuit board, as shown in the figure, comprising a first circuit board unit, a second circuit board unit, a third circuit board unit, and a reinforcing connection unit. The first circuit board unit includes a first circuit board 1.1, on which a first socket unit 1.2 and a first connector 1.3 are mounted. The second circuit board unit includes a second circuit board 2.1, on which a second socket unit 2.2 and a second connector 2.3 are mounted. The third circuit board unit includes a third circuit board 3.1, on which a first interface unit 3.2 capable of being plugged into the first socket unit 1.2 and a second interface unit 3.3 capable of being plugged into the second socket unit 2.2 are mounted. A connecting wire (not shown in the figure) connects the first connector 1.3 and the second connector 2.3. The reinforcing connection unit includes a first connecting part fixedly connected to the first circuit board 1.1, a second connecting part fixedly connected to the second circuit board 2.1, and a third connecting part fixedly connected to the third circuit board 3.1. The third connecting part is fixedly connected to both the first and second connecting parts. A first shielding cover 1.4 is hinged to the first circuit board 1.1, and a second shielding cover 2.4 is hinged to the second circuit board 2.1. The first connecting part includes a first tube 4.1, a first fixing plate 4.2 connected to the first tube 4.1, and a first connecting plate 4.3 connected to the first tube 4.1. The first tube 4.1 has a first groove, and a first heat-conducting plate 5 capable of abutting against the first shielding cover 1.4 is installed in the first groove. The first fixing plate 4.2 is fixedly connected to the first circuit board 1.1, and the first connecting plate 4.3 is fixedly connected to both the first circuit board 1.1 and the third circuit board 3.1. The second connecting part includes a second tube 6.1, a first fixing plate 4.2 connected to the first tube 4.1, and a first connecting plate 4.3 connected to the first tube 4.1. The second fixing plate 6.2 connected to the second tube section 6.1 and the second connecting plate 6.3 connected to the second tube section 6.1 are included. The second tube section 6.1 has a second groove, and a second heat-conducting plate 7 that can abut against the second shielding cover 2.4 is installed in the second groove. The second fixing plate 6.2 is fixedly connected to the second circuit board 2.1, and the second connecting plate 6.3 is fixedly connected to both the second circuit board 2.1 and the third circuit board 3.1. The third connecting section includes a cover plate 8.1, a first support plate 8.2, two support feet 8.3, and two second support plates 8.4. The first support plate 8.2, the two support feet 8.3, and the two second support plates 8.4 are all fixedly connected to the third circuit board 3.1.

[0083] The first support plate 8.2, the support foot 8.3, and the second support plate 8.4 all have L-shaped cross-sections; an air outlet is formed between the first support plate 8.2 and the two support feet 8.3; an air inlet is formed between the two second support plates 8.4. The first heat-conducting plate 5 has a first heat-conducting pad 5.1 and multiple first heat dissipation fins 5.2; the second heat-conducting plate 7 has a second heat-conducting pad and multiple second heat dissipation fins 7.1; and the cover plate 8.1 has multiple third heat dissipation fins 8.5. The circuit board further includes two clamping units, which respectively cooperate with the first connecting part and the second connecting part; a U-shaped connecting part is connected between the first tube part 4.1 and the second tube part 6.1, the U-shaped connecting part including a first convex plate fixedly connected to the first tube part 4.1, a second convex plate fixedly connected to the second tube part 6.1, and a third connecting plate 9 connecting the first convex plate and the second convex plate, the third connecting plate 9 being fixedly connected to the third circuit board 3.1; the first heat-conducting plate 5 is hinged to the first groove part, and the second heat-conducting plate 7 is hinged to the second groove part; the clamping unit includes a first L-shaped slide 10.1, a first pressure plate 10.2 connected to the first L-shaped slide 10.1, and a fixedly connected... The system includes a first limiting rod 10.3, a plug rod 10.4 connected to the first limiting rod 10.3, a second L-shaped slide 10.5, a second pressure plate 10.6 connected to the second L-shaped slide 10.5, and a second limiting rod 10.7 fixedly connected to the second pressure plate 10.6. The second limiting rod 10.7 has a plug hole that mates with the plug rod 10.4. The first L-shaped slide 10.1 has a first slot, and the second L-shaped slide 10.5 has a second slot. Multiple first heat dissipation fins 5.2 each have a first limiting hole 5.2.1, and multiple second heat dissipation fins 7.1 each have a second limiting hole 7.1.1. Locking bolts 10.8 are present at both the first L-shaped slide 10.1 and the second L-shaped slide 10.5.

[0084] Multiple sensor interface units 1.5 are installed at the first circuit board 1.1; a microprocessor and a wireless communication unit are installed at the second circuit board 2.1; and a charging port 3.4, a battery unit 3.5, a battery management circuit, and a DC-DC converter are installed at the third circuit board 3.1. Two first limiting rods 10.3 are fixedly connected to the first pressure plate 10.2, and two second limiting rods 10.7 are fixedly connected to the second pressure plate 10.6; each first heat dissipation fin 5.2 has two first limiting holes 5.2.1, and each second heat dissipation fin 7.1 has two second limiting holes 7.1.1. Bolt through holes are provided at the first fixing plate 4.2, the first connecting plate 4.3, the second fixing plate 6.2, the second connecting plate 6.3, the third connecting plate 9, the first support plate 8.2, the two support feet 8.3, and the two second support plates 8.4. Threaded holes that mate with the bolt through holes are provided at the first circuit board 1.1, the second circuit board 2.1, and the third circuit board 3.1.

[0085] Working Principle: The circuit board of this application consists of a first circuit board unit, a second circuit board unit, and a third circuit board unit, thus enabling the circuit board to be composed of multiple modular circuit boards. In the embodiments of this application, the third circuit board unit provides power to the first and second circuit board units. Multiple sensors can be connected and installed at the first circuit board unit (the sensors can be connected to the sensor interface unit via sensor connection cables and connectors), and communication with a microprocessor can be achieved through the connection cables. The microprocessor can perform overall control and data processing, and a remote communication unit can achieve remote communication. Direct plug-in / plug-out is possible between the first and third circuit board units, and between the second and third circuit board units. The first and second circuit board units are connected via connection cables.

[0086] Furthermore, the first connecting part, the second connecting part, and the third connecting part are fixedly connected to the first circuit board, the second circuit board, and the third circuit board, respectively, thereby strengthening the connection between the first circuit board unit, the second circuit board unit, and the third circuit board unit, making the entire circuit board more stable. The first circuit board unit has a first shielding cover, and the second circuit board unit has a second shielding cover, thus preventing the first and second circuit board units from being interfered with by the current from the third circuit board unit. The first heat-conducting plate abuts against the first shielding cover, and the second heat-conducting plate abuts against the second shielding cover, so that the first heat dissipation fins on the first heat-conducting plate and the second heat dissipation fins on the second heat-conducting plate can dissipate heat from the first and second circuit boards. The third heat dissipation fins on the cover plate of the third circuit board can also dissipate heat from the third circuit board. Furthermore, in actual use, the third circuit board has higher heat dissipation requirements due to the installation of battery units, DC / DC converters, etc., while the first and second circuit boards have relatively lower heat dissipation requirements. Therefore, the first and second pipes can be used to connect airflow generating devices (such as cooling fans or ventilation ducts with cooling airflow) to the equipment where the circuit boards are located. The cooling airflow from the first and second pipes can help to quickly remove the heat from the first and second heat-conducting plates. The cooling airflow will also directly blow through the space between the third circuit board and the cover plate from the other end of the first and second pipes, thus achieving better heat dissipation at the location of the third circuit board.

[0087] Furthermore, the first and second shielding covers of this application are hinged, as are the first and second heat-conducting plates. When the first and second L-shaped slides of the clamping unit approach each other, the insertion rod and the insertion hole can cooperate with each other, thereby limiting and clamping the heat-conducting plates and shielding covers. This not only limits and clamps the shielding covers and heat-conducting plates, but also achieves better heat conduction. When the first and second L-shaped slides move away from each other, the heat-conducting plates and shielding covers can be easily opened, making it convenient to maintain the circuit board when maintenance is required.

[0088] Although the present invention has been illustrated and described with reference to preferred embodiments, those skilled in the art should understand that various changes and modifications can be made to the present invention without departing from the scope defined by the claims.

Claims

1. A modular high-strength high-efficiency heat dissipation circuit board, characterized by, The application relates to a circuit board unit, which comprises a first circuit board unit, a second circuit board unit, a third circuit board unit and a reinforcing connection unit; the first circuit board unit comprises a first circuit board, a first socket unit and a first socket seat are arranged on the first circuit board; the second circuit board unit comprises a second circuit board, a second socket unit and a second socket seat are arranged on the second circuit board; the third circuit board unit comprises a third circuit board, a first interface unit and a second interface unit are arranged on the third circuit board; a connecting wire is arranged between the first socket seat and the second socket seat; the reinforcing connection unit comprises a first connecting part, a second connecting part and a third connecting part. A first shielding cover is hingedly arranged on the first circuit board, and a second shielding cover is hingedly arranged on the second circuit board; the first connecting part comprises a first pipe part, a first fixed plate and a first connecting plate, the first pipe part is provided with a first recess part, and a first heat conduction plate is arranged on the first recess part; the second connecting part comprises a second pipe part, a second fixed plate and a second connecting plate, the second pipe part is provided with a second recess part, and a second heat conduction plate is arranged on the second recess part; the third connecting part comprises a covering plate, a first supporting plate, two supporting legs and two second supporting plates.

2. The modular high-strength high-efficiency heat dissipation circuit board according to claim 1, characterized by, The first supporting plate, the supporting legs and the second supporting plates are all L-shaped in section; air outlet gaps are formed between the first supporting plate and the two supporting legs; an air inlet gap is formed between the two second supporting plates.

3. The modular high-strength high-efficiency heat dissipating circuit board according to claim 1, characterized by, The first pipe part and the second pipe part are connected with a U-shaped connecting part, the U-shaped connecting part comprises a first protruding plate, a second protruding plate and a third connecting plate; the first heat conduction plate is hingedly arranged on the first recess part, and the second heat conduction plate is hingedly arranged on the second recess part; the pressing unit comprises a first L-shaped sliding seat, a first pressing plate, a first limiting rod, a plug rod, a second L-shaped sliding seat, a second pressing plate and a second limiting rod, the second limiting rod is provided with a plug hole; the first L-shaped sliding seat is provided with a first insertion groove, the second L-shaped sliding seat is provided with a second insertion groove, and the first L-shaped sliding seat and the second L-shaped sliding seat are both provided with locking bolts.

4. The modular high-strength high-efficiency heat dissipation circuit board according to claim 3, characterized by, The first heat conduction plate is provided with a first heat conduction pad and a plurality of first heat dissipation fins; the second heat conduction plate is provided with a second heat conduction pad and a plurality of second heat dissipation fins; the covering plate is provided with a plurality of third heat dissipation fins; the plurality of first heat dissipation fins are all provided with first limiting holes, and the plurality of second heat dissipation fins are all provided with second limiting holes.

5. The modular high-strength high-efficiency heat dissipating circuit board according to claim 3, wherein, A plurality of sensor interface units are arranged on the first circuit board; a microprocessor and a wireless communication unit are arranged on the second circuit board; a charging socket, a battery unit, a battery management circuit and a DC-DC converter are arranged on the third circuit board.

6. The modular high-strength high-efficiency heat dissipating circuit board according to claim 3, wherein, Two first limiting rods are fixedly connected to the first pressing plate, and two second limiting rods are fixedly connected to the second pressing plate; each first heat dissipation fin is provided with two first limiting holes, and each second heat dissipation fin is provided with two second limiting holes.

7. The modular high-strength high-efficiency heat dissipating circuit board according to claim 3, wherein, The first fixed plate, the first connecting plate, the second fixed plate, the second connecting plate, the third connecting plate, the first supporting plate, the two supporting legs and the two second supporting plates are all provided with bolt through holes, and the first circuit board, the second circuit board and the third circuit board are all provided with threaded holes matched with the bolt through holes.

Images