Tin removing device

Abstract

According to the tin removal device, residual tin on the product to be subjected to tin removal can be automatically cleaned, the tin removal device is automatically cleaned, and the product to be subjected to tin removal is prevented from being damaged. The tin removing device comprises a mounting plate, a tin sucking assembly and a tin removing assembly. The tin sucking assembly is connected with the mounting plate and comprises a suction nozzle, the suction nozzle comprises a first part and a second part which are oppositely arranged, a hollow part penetrating through the first part and the second part is formed in the suction nozzle, the first part is used for containing the tin removing assembly, and a tin outlet is formed in the side face of the first part and communicates with the hollow part. The tin outlet is used for allowing the suction nozzle to suck molten tin on the product to be detinned in a vacuum manner and allowing the molten tin in the suction nozzle to flow out of the suction nozzle; the tin removing assembly is connected with the tin sucking assembly and comprises a through needle, the first end of the through needle is concentric with the first part in the first part of the suction nozzle and is in sliding connection with the inner wall of the suction nozzle, and the through needle is used for being driven to move in the suction nozzle in the first direction.

Description

Technical Field

[0001] This application relates to the technical field of circuit board processing, and particularly to a tin removal device. Background Art

[0002] As the integration degree of circuit boards waiting for tin removal products is getting higher and the functions are getting richer, the number of components on the products to be desoldered is also increasing. When the factory needs to repair or recycle the products to be desoldered, etc., the operator needs to manually disassemble the components on the products to be desoldered after hot air melting the tin, then clean the residual tin on the products to be desoldered through a soldering iron, hot air gun, etc., and then install new components onto the products to be desoldered by welding. However, the sizes of the components on the products to be desoldered are inconsistent, and the number of solder joints is large. When the operator manually cleans the residual tin on the products to be desoldered through a soldering iron, hot air gun, etc., it is easy to scratch the solder pads. At the same time, with the increase in labor costs, manual operation by the operator will increase the cost of the factory. In addition, when the operator cleans the residual tin on the products to be desoldered through a soldering iron, hot air gun, etc., the cleaning time is difficult to control. When the cleaning time is long, it is easy to cause the surrounding components to be poorly welded. Summary of the Invention

[0003] In view of the above, it is necessary to provide a tin removal device that can automatically clean the residual tin on the products to be desoldered, self-clean the suction nozzles of the tin removal device, and avoid damaging the products to be desoldered.

[0004] This application provides a tin removal device. The tin removal device includes a mounting plate, a tin suction assembly, and a tin cleaning assembly, wherein: the tin suction assembly is connected to the mounting plate. The tin suction assembly includes a suction nozzle. The suction nozzle includes a first part and a second part arranged oppositely. The suction nozzle is formed with a hollow part penetrating through the first part and the second part. The first part is used to accommodate the tin cleaning assembly. A tin outlet is formed on the side surface of the first part. The tin outlet is communicated with the hollow part. The tin outlet is used for the suction nozzle to vacuum-absorb the molten tin on the product to be desoldered and for the molten tin in the suction nozzle to flow out of the suction nozzle. The tin cleaning assembly is connected to the tin suction assembly. The tin cleaning assembly includes a through-pin. The first end of the through-pin is concentric with the first part in the first part and is slidably connected to the inner wall of the suction nozzle. The through-pin is used to be driven to move in the suction nozzle along a first direction.

[0005] In one embodiment, the tin suction assembly further includes a tin storage tank. The tin storage tank is connected to the mounting plate in a second direction perpendicular to the first direction. A sealed accommodation space is formed in the tin storage tank. The first part is fixed in the accommodation space. The tin outlet is communicated with the accommodation space. The second part is exposed outside the tin storage tank.

[0006] In one embodiment, the solder storage tank includes a housing and a cover plate. The first end of the housing is connected to the mounting plate in the second direction. The second end of the housing is formed with a receiving groove, the notch of the receiving groove faces the second direction, the second end of the housing is opposite to the first end of the housing, and the cover plate is detachably covered on the housing at the notch of the receiving groove to form a receiving space.

[0007] In one embodiment, the second end of the housing includes a first end face and a second end face arranged opposite to each other. The first end of the cover plate is rotatably connected to the second end of the housing at the first end face. The second end of the cover plate includes a fastening portion, and the second end of the cover plate is opposite to the first end of the cover plate. The solder storage tank includes a lock, and the lock is rotatably connected to the second end of the housing at the second end face. The lock includes a lock frame body and a lock rod. The lock frame body is rotatably connected to the second end of the housing at the second end face. The lock frame body includes a first frame and a second frame arranged opposite to each other. The two opposite ends of the lock rod are respectively rotatably connected to the first frame and the second frame. The lock rod and the lock frame body form a fastening hole for receiving the fastening portion. The second end of the cover plate is detachably connected to the second end of the housing at the second end face through the fastening portion and the fastening hole.

[0008] In one embodiment, a diversion groove with one end open is formed in the solder storage tank. The receiving space includes the diversion groove. The diversion groove extends along the first direction. The first end of the diversion groove is connected to the solder outlet through the open end of the diversion groove. An air intake through hole is formed on the solder storage tank. The notch of the diversion groove faces the second direction. The air intake through hole is connected to the second end of the diversion groove through the notch of the diversion groove. The second end of the diversion groove is opposite to the first end of the diversion groove.

[0009] In one embodiment, the suction nozzle includes a third part. The two opposite ends of the third part are respectively fixedly connected to the first part and the second part. The outer peripheral wall of the third part includes a cutting plane. A receiving space is formed on the solder storage tank for receiving the third part. An installation through hole is further formed on the outer wall of the solder storage tank. The solder suction assembly further includes a fixing member. The fixing member passes through the installation through hole and abuts against the cutting plane to fix the suction nozzle on the solder storage tank.

[0010] In one embodiment, the solder cleaning assembly further includes a driving member. The driving member is connected to the solder storage tank in the first direction and is connected to the second end of the cleaning needle. The driving member is used to drive the cleaning needle to move away from or close to the driving member along the first direction within the suction nozzle.

[0011] In one embodiment, the driving member includes a driving member housing, and the driving member housing is fixedly connected to the solder storage tank in the first direction.

[0012] In one of the embodiments, the tin removal device also includes a first support positioning block, a second support positioning block, a support rod and an elastic member, the first support positioning block is fixedly connected to the mounting plate in the second direction, the second support positioning block is fixedly connected to the tin storage tank in the second direction, the first end of the support rod is fixed to the first support positioning block, the second end of the support rod is movably connected to the second support positioning block, and the elastic member is sleeved on the support rod and is located between the first support positioning block and the second support positioning block.

[0013] In one of the embodiments, the detinning device also includes a first positioning member and a second positioning member, which are fixedly connected to the mounting plate in a second direction, the second direction is perpendicular to the first direction, and the line segment formed by the first positioning member and the second positioning member is at a preset inclination angle with the axial direction of the suction nozzle. The first positioning member and the second positioning member are used to support and fix the hot air gun so that the hot air gun blows hot air to the product to be detinned directly below the suction nozzle.

[0014] The present application forms an air path by connecting the tin outlet with the hollow part, and when the air at the tin outlet is extracted, vacuum suction is formed between the suction nozzle and the molten tin on the product to be detinned, so that the molten tin on the product to be detinned can be sucked through the air, and the molten tin in the suction nozzle can flow out of the suction nozzle from the tin outlet; at the same time, the first end of the through needle is concentric with the first part in the first part, so that the through needle can be prevented from being accurately inserted into the suction nozzle, and at the same time, the first end of the through needle is slidably connected with the inner wall of the suction nozzle, so that the residual tin attached to the inner wall of the suction nozzle can be completely pushed out of the suction nozzle through the through needle, so that some residual tin can be avoided in the suction nozzle when cleaning the suction nozzle, and the suction nozzle can be avoided from being blocked; in addition, the molten tin on the product to be detinned can be vacuum sucked by the suction nozzle, so that the tin can be removed in a non-contact manner, so that the suction nozzle can avoid damaging the product to be detinned. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 It is a structural schematic diagram of a detinning device, a product to be detinned and a hot air gun according to an embodiment of the present application.

[0016] Figure 2 yes Figure 1 A front view of the detinning device is shown with the cover opened.

[0017] Figure 3 yes Figure 1 A bottom view of the suction nozzle of the detinning device is shown.

[0018] Figure 4 yes Figure 1 A structural schematic diagram of a floating assembly of a tin removal device is shown.

[0019] Figure 5 yes Figure 4 An exploded schematic diagram of the float assembly is shown.

[0020] Figure 6Yes Figure 1 It is a schematic structural diagram of the tin suction component of the tin removal device shown in Figure 1 .

[0021] Figure 7 Yes Figure 6 It is an exploded schematic diagram of the tin suction component shown in Figure 6 .

[0022] Figure 8 Yes Figure 1 It is a sectional view of the tin suction component and the through pin shown in Figure 1 .

[0023] Figure 9 Yes Figure 1 It is a schematic structural diagram of the tin cleaning component and the third heat insulation block of the tin removal device shown in Figure 1 .

[0024] Figure 10 Yes Figure 9 It is an exploded schematic diagram of the tin cleaning component shown in Figure 9 .

[0025] Description of main component symbols

[0026] Tin removal device 1

[0027] Product to be desoldered 2

[0028] Mounting plate 10

[0029] Tin suction component 20

[0030] Tin cleaning component 30

[0031] Suction nozzle 21

[0032] First part 211

[0033] Second part 212

[0034] Hollow part 213

[0035] Side surface 214

[0036] Tin outlet 215

[0037] Through pin 31

[0038] Inner wall 216

[0039] Floating component 40

[0040] First support and positioning block 41

[0041] Second support and positioning block 42

[0042] Support rod 43

[0043] Elastic member 44

[0044] Tin suction component connection plate 45

[0045] Guide rail 46

[0046] Slider 47

[0047] Guide rail groove 471

[0048] First heat insulation block 50

[0049] Tin storage tank 22

[0050] Receiving space 220

[0051] Shell 221

[0052] Cover plate 222

[0053] Receiving groove 2211

[0054] Receiving groove 2221

[0055] Sealing ring 223

[0056] First end face 2213

[0057] Second end face 2214

[0058] Plug pin 224

[0059] Latching part 2222

[0060] Inclined plane 2223

[0061] Latch 225

[0062] Latch frame 2251

[0063] Latch rod 2252

[0064] First frame 2253

[0065] Second frame 2254

[0066] Latching hole 2255

[0067] Third frame 2256

[0068] Connector 2257

[0069] Fixing part 2258

[0070] Sleeve 2259

[0071] Flow guide groove 226

[0072] Air inlet through hole 227

[0073] Interface 228

[0074] Third part 217

[0075] Outer peripheral wall 218

[0076] Cutting plane 219

[0077] Receiving space 229

[0078] Outer wall 230

[0079] Mounting through hole 231

[0080] Fixing member 23

[0081] Driving member 32

[0082] Driving member housing 321

[0083] Piston rod 322

[0084] Connecting block 33

[0085] Support and guide block 34

[0086] Limit groove 341

[0087] Limit piece 35

[0088] Second heat insulation block 60

[0089] Third heat insulation block 70

[0090] First positioning member 80

[0091] Second positioning member 90

[0092] Hot air gun 3

[0093] The following specific embodiments will further illustrate the present application in conjunction with the above-mentioned drawings. Specific embodiments

[0094] In the description of the embodiments of the present application, technical terms such as "first" and "second" are only used to distinguish different objects, and cannot be understood as indicating or implying relative importance or implicitly indicating the quantity, specific order or primary-secondary relationship of the indicated technical features.

[0095] It should be noted that when an element is considered to be "connected" to another element, it can be directly connected to the other element or there may be an intervening element therebetween. When an element is considered to be "disposed on" another element, it can be directly disposed on the other element or there may be an intervening element therebetween. In this application, unless otherwise clearly specified and defined, terms such as "mounted", "connected", "connected to", "fixed" and the like should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be directly connected or indirectly connected through an intermediate medium, and it can be the communication inside two elements. For those of ordinary skill in the art, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0096] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by those of ordinary skill in the technical field to which this application belongs. The terms used in the description of this application herein are only for the purpose of describing specific embodiments and are not intended to limit this application. The terms "comprising" and "provided with" and any variations thereof in the description and claims of this application and the above drawings are intended to cover non-exclusive inclusion.

[0097] Reference herein to "an embodiment" means that a particular feature, structure, or characteristic described in connection with the embodiment can be included in at least one embodiment of this application. The phrase appears in various places in the specification and does not necessarily refer to the same embodiment, nor is it an independent or alternative embodiment mutually exclusive of other embodiments. Those skilled in the art will explicitly and implicitly understand that the embodiments described herein can be combined with other embodiments.

[0098] Please refer to Figures 1-3 , Figure 1 which is a schematic structural diagram of a tin removal device, a product to be desoldered, and a hot air gun according to an embodiment of this application, Figure 2 is Figure 1 a front view when the cover plate of the tin removal device shown is opened, Figure 3 is Figure 1An overhead view of the suction nozzle of the detinning device shown. The detinning device 1 can automatically clean the residual tin on the product 2 to be detinned and perform self-cleaning. The detinning device 1 includes a mounting plate 10, a detinning assembly 20 and a tin cleaning assembly 30. The mounting plate 10 is used to support the detinning assembly 20. The detinning assembly 20 is connected to the mounting plate 10. In some embodiments, the detinning assembly 20 is movably connected to the mounting plate 10. The detinning assembly 20 is used to clean the residual tin on the product 2 to be detinned. The detinning assembly 20 includes a suction nozzle 21, and the suction nozzle 21 includes a first part 211 and a second part 212 arranged opposite to each other, and the suction nozzle 21 is formed with a hollow part 213 that passes through the first part 211 and the second part 212. The first part 211 of the suction nozzle 21 is used to accommodate the tin cleaning component 30. The side 214 of the first part 211 of the suction nozzle 21 is formed with a tin outlet 215. The tin outlet 215 is connected to the hollow part 213. The tin outlet 215 is used for the suction nozzle 21 to vacuum suck the molten tin on the product 2 to be detinned, and for the molten tin in the suction nozzle 21 to flow out of the suction nozzle 21. The tin cleaning component 30 is connected to the tin suction component 20. The tin cleaning component 30 includes a needle 31. The first end of the needle 31 is concentric with the first part 211 of the suction nozzle 21 in the first part 211 of the suction nozzle 21, and is slidably connected to the inner wall 216 of the suction nozzle 21. The needle 31 is used to be driven to move along the first direction in the suction nozzle 21.

[0099] In some embodiments, the first direction may be the Z-axis direction, such as Figure 1 and Figure 2 As shown, the present application does not limit this. Exemplarily, the first direction may be a vertical direction.

[0100] The tin removal device 1 of the present application is connected with the hollow part 213 through the tin outlet 215 to form an air path. When the air at the tin outlet 215 is extracted, a vacuum suction force is formed between the suction nozzle 21 and the molten tin on the product 2 to be detinned, and the molten tin on the product 2 to be detinned can be sucked through the air, and the molten tin in the suction nozzle 21 can flow out of the suction nozzle 21 from the tin outlet 215; at the same time, the first end of the needle 31 is concentric with the first part 211 of the suction nozzle 21 in the first part 211 of the suction nozzle 21, so as to avoid The needle 31 cannot be accurately inserted into the suction nozzle 21. At the same time, the first end of the needle 31 is slidably connected to the inner wall 216 of the suction nozzle 21. The needle 31 can completely push the residual tin attached to the inner wall 216 of the suction nozzle 21 out of the suction nozzle 21, so as to avoid some residual tin remaining in the suction nozzle 21 when cleaning the suction nozzle 21, thereby avoiding clogging of the suction nozzle 21. In addition, the molten tin on the product 2 to be detinned is vacuum-sucked by the suction nozzle 21, so that the tin can be removed in a non-contact manner, thereby avoiding the suction nozzle 21 from damaging the product 2 to be detinned.

[0101] In some embodiments, the mounting plate 10 may be connected to a driving device (not shown), and the mounting plate 10 may be driven by the driving device to perform up and down movement in a first direction, forward and backward movement in a second direction, or left and right movement in a third direction.

[0102] In some embodiments, the second direction may be the X-axis direction, and the third direction may be the Y-axis direction. As Figure 1 shown, the present application does not limit this. The solder sucking assembly 20 can be connected to a vacuum pumping device (not shown in the figure), and the solder sucking assembly 20 can be evacuated by the vacuum pumping device. Exemplarily, the second direction and the third direction can be two linear directions perpendicular to each other in the horizontal direction.

[0103] In some embodiments, the driving device can drive the mounting plate 10 to move under the control of a controller (not shown in the figure), and the vacuum pumping device can evacuate the solder sucking assembly 20 under the control of the controller.

[0104] Please refer to Figure 1 , Figure 4 and Figure 5 . In addition to the above, the tin removing device 1 further includes a floating assembly 40. The floating assembly 40 is connected between the mounting plate 10 and the solder sucking assembly 20. The floating assembly 40 includes a first support positioning block 41, a second support positioning block 42, a support rod 43 and an elastic member 44. The first support positioning block 41 is fixedly connected to the mounting plate 10 in the second direction. In some embodiments, the first support positioning block 41 is also located below the solder sucking assembly 20, and the first support positioning block 41 is used to support the solder sucking assembly 20. The second support positioning block 42 is fixedly connected to the solder sucking assembly 20 in the second direction. In some embodiments, the floating assembly 40 further includes a solder sucking assembly connecting plate 45, and the second support positioning block 42 is fixedly connected to the solder sucking assembly 20 in the second direction through the solder sucking assembly connecting plate 45. In some embodiments, the second support positioning block 42 and the first support positioning block 41 are located on the same side of the mounting plate 10, and the second support positioning block 42 is located above the first support positioning block 41. The first end of the support rod 43 is fixed to the first support positioning block 41, and the second end of the support rod 43 is movably connected to the second support positioning block 42. The elastic member 44 is sleeved on the support rod 43 and is located between the first support positioning block 41 and the second support positioning block 42. In some embodiments, the elastic member 44 is a spring, and the present application does not limit this. Through the floating assembly 40, the present application can realize the floating of the solder sucking assembly 20 in the first direction, and avoid damaging the components on the product 2 to be desoldered when the solder sucking assembly 20 moves between the components on the product 2 to be desoldered.

[0105] In some embodiments, the floating component 40 further includes a guide rail 46 and a slider 47. The guide rail 46 is fixedly connected to the mounting plate 10. On one side of the slider 47 facing the guide rail 46, a guide rail groove 471 is formed for receiving the guide rail 46, and the slider 47 is fixedly connected to the solder sucking component 20. In some embodiments, the slider 47 is fixedly connected to the solder sucking component 20 through a solder sucking component connecting plate 45. The slider 47 can be driven to drive the solder sucking component 20 to move in a first direction along the guide rail 46. The present application also enables the solder sucking component 20 to perform a linear motion smoothly in the first direction through the guide rail 46 and the slider 47.

[0106] In some embodiments, please refer to Figure 1 and Figure 5 , the desoldering device 1 further includes a first heat insulation block 50, and the first heat insulation block 50 is fixedly connected between the floating component 40 and the solder sucking component 20. In some embodiments, the first heat insulation block 50 is fixedly connected between the solder sucking component connecting plate 45 and the solder sucking component 20. The first heat insulation block 50 is used to prevent the heat of the solder sucking component 20 from being conducted to the floating component 40. The present application can prevent the heat of the solder sucking component 20 from being conducted to the floating component 40 and the driving device connected to the floating component 40 through the first heat insulation block 50, and can prevent the driving device from being damaged.

[0107] In some embodiments, please refer to Figure 1 , Figure 2 , Figure 6 , Figure 7 and Figure 8 , the solder sucking component 20 further includes a solder storage tank 22, and the solder storage tank 22 is connected to the mounting plate 10 in a second direction. In some embodiments, the solder storage tank 22 is movably connected to the mounting plate 10 in the second direction through the floating component 40. A sealed receiving space 220 is formed in the solder storage tank 22. The receiving space 220 is used to store molten solder. The first part 211 of the suction nozzle 21 is fixed to the receiving space 220, the tin outlet 215 is communicated with the receiving space 220, and the second part 212 of the suction nozzle 21 is exposed outside the solder storage tank 22. The suction nozzle 21 sucks the molten solder on the product 2 to be desoldered into the solder storage tank 22 through the second part 212 and the tin outlet 215 of the suction nozzle 21.

[0108] In some embodiments, the solder storage tank 22 includes a housing 221 and a cover plate 222. The first end of the housing 221 is connected to the mounting plate 10 in the second direction. In some embodiments, the first end of the housing 221 is movably connected to the mounting plate 10 in the second direction through a floating assembly 40. A receiving groove 2211 is formed at the second end of the housing 221, and the notch of the receiving groove 2211 faces the second direction. The second end of the housing 221 is opposite to the first end of the housing 221. The cover plate 222 is detachably disposed on the housing 221 at the notch of the receiving groove 2211 to form a receiving space 220. In this application, the cover plate 222 is detachably disposed on the housing 221 at the notch of the receiving groove 2211, which facilitates the subsequent removal of the cover plate 222 from the housing 221 and the cleaning of the residual solder stored in the solder storage tank 22.

[0109] In some embodiments, a receiving groove 2221 is formed at the position where the cover plate 222 is disposed on the housing 221. The solder storage tank 22 further includes a sealing ring 223. The sealing ring 223 is received in the receiving groove 2221, and the sealing ring 223 is used to seal the receiving space 220. In this application, by disposing the sealing ring 223 between the cover plate 222 and the housing 221, the cover plate 222 and the housing 221 can be sealed, and further the receiving space 220 can be sealed.

[0110] In some embodiments, the second end of the housing 221 includes a first end face 2213 and a second end face 2214 that are oppositely arranged. The first end of the cover plate 222 is rotatably connected to the second end of the housing 221 at the first end face 2213. In some embodiments, the solder storage tank 22 further includes a bolt 224, and the first end of the cover plate 222 is rotatably connected to the second end of the housing 221 at the first end face 2213 through the bolt 224. The second end of the cover plate 222 includes a fastening portion 2222, and the second end of the cover plate 222 is opposite to the first end of the cover plate 222. In some embodiments, the end of the fastening portion 2222 away from the first end of the cover plate 222 includes an inclined surface 2223, and the inclined surface 2223 forms an acute angle with the end of the fastening portion 2222. The solder storage tank 22 includes a latch 225, and the latch 225 is rotatably connected to the second end of the housing 221 at the second end face 2214. The latch 225 includes a latch frame body 2251 and a latch rod 2252. The latch frame body 2251 is rotatably connected to the second end of the housing 221 at the second end face 2214. The latch frame body 2251 includes a first frame edge 2253 and a second frame edge 2254 that are oppositely arranged. The opposite ends of the latch rod 2252 are respectively rotatably connected to the first frame edge 2253 and the second frame edge. The latch rod 2252 and the latch frame body 2251 jointly form a fastening hole 2255 for receiving the fastening portion 2222. The second end of the cover plate 222 is detachably connected to the second end of the housing 221 at the second end face 2214 through the fastening portion 2222 and the fastening hole 2255. In some embodiments, the fastening portion 2222 of the cover plate 222 is inserted into the fastening hole 2255 through the inclined surface 2223, so as to detachably connect the second end of the cover plate 222 to the second end of the housing 221 at the second end face 2214.

[0111] In some embodiments, the latch frame body 2251 further includes a third frame edge 2256, and the third frame edge 2256 is fixed between the first frame edge 2253 and the second frame edge 2254. In some embodiments, the third frame edge 2256 can be a rotating shaft, and the present application does not limit this. The latch 225 further includes a connecting member 2257, and the connecting member 2257 includes a fixing portion 2258 and a sleeve 2259. The fixing portion 2258 is fixedly connected to the second end of the housing 221, and the sleeve 2259 is fixedly connected to the fixing portion 2258. The third frame edge 2256 can pass through the sleeve 2259, and the opposite ends are respectively rotatably connected to the first frame edge 2253 and the second frame edge 2254. In some embodiments, the opposite ends of the third frame edge 2256 can be respectively received in the first frame edge 2253 and the second frame edge 2254, and the present application does not limit this.

[0112] In some embodiments, a diversion groove 226 with an open end is formed in the solder storage tank 22, and the accommodation space 220 includes the diversion groove 226. The diversion groove 226 extends in a first direction, and a first end of the diversion groove 226 is communicated with the solder outlet 215 through the open end of the diversion groove 226. An air intake through hole 227 is formed in the solder storage tank 22. The air intake through hole 227 may be formed in the cover plate 222 of the solder storage tank 22. The air intake through hole 227 may also be formed in the housing 221 of the solder storage tank 22, and the present application does not limit this. The notch of the diversion groove 226 faces a second direction, the air intake through hole 227 is communicated with a second end of the diversion groove 226 through the notch of the diversion groove 226, and the second end of the diversion groove 226 is opposite to the first end of the diversion groove 226. In some embodiments, the solder storage tank 22 further includes an interface 228. A first end of the interface 228 is communicated with the diversion groove 226 through the air intake through hole 227, a second end of the interface 228 is connected to a vacuum pumping device, and the first end of the interface 228 is opposite to the second end of the interface 228. The interface 228 may be a cylindrical structure, and the present application does not limit this.

[0113] In some embodiments, please refer to Figure 3 and Figure 7 , the suction nozzle 21 includes a third part 217, and opposite ends of the third part 217 are respectively fixedly connected to the first part 211 and the second part 212. In some embodiments, the third part 217 is generally a cylindrical structure, and the present application does not limit this. The outer peripheral wall 218 of the third part 217 includes a tangent plane 219, and a receiving space 229 is formed in the solder storage tank 22. In some embodiments, the receiving space 229 matches the shape of the third part 217. The receiving space 229 is used to receive the third part 217, and an installation through hole 231 is further formed in the outer wall 230 of the solder storage tank 22. The solder suction assembly 20 further includes a fixing member 23, and the fixing member 23 passes through the installation through hole 231 and abuts against the tangent plane 219 of the suction nozzle 21 to fix the suction nozzle 21 to the solder storage tank 22. The fixing member 23 may be a screw, a screw rod, etc., and the present application does not limit this. Through the installation through hole 231 and the tangent plane 219, the present application enables the suction nozzle 21 to be detachably installed on the solder storage tank 22, facilitating subsequent replacement of the suction nozzle 21, avoiding replacement of the entire machine, and reducing the cost of the factory.

[0114] In some embodiments, please refer to Figure 1 , Figure 6 , Figure 9 and Figure 10, the tin cleaning assembly 30 further includes a driving member 32, and the driving member 32 is connected to the tin storage tank 22 in the first direction. In some embodiments, the driving member 32 is connected to the housing 221 of the tin storage tank 22 in the first direction. The driving member 32 is connected to the second end of the through-pin 31, and the driving member 32 is configured to drive the through-pin 31 to move away from the driving member 32 in the first direction within the nozzle 21. In some embodiments, the driving member 32 can also be configured to drive the through-pin 31 to move towards the driving member 32 in the first direction within the nozzle 21.

[0115] In some embodiments, the driving member 32 includes a driving member housing 321, and the driving member housing 321 is fixedly connected to the tin storage tank 22 in the first direction. In some embodiments, the driving member 32 is a cylinder. The driving member housing 321 is the cylinder body of the driving member 32, and the piston rod 322 of the driving member 32 is fixedly connected to the through-pin 31. The driving member 32 can be configured to drive the through-pin 31 to move away from the driving member 32 in the first direction within the nozzle 21 through the piston rod 322 of the driving member 32. The driving member 32 can be configured to drive the through-pin 31 to move towards the driving member 32 in the first direction within the nozzle 21 through the piston rod 322 of the driving member 32. In some embodiments, the tin cleaning assembly 30 further includes a connecting block 33, and the piston rod 322 of the driving member 32 is fixedly connected to the through-pin 31 through the connecting block 33.

[0116] In some embodiments, the solder cleaning assembly 30 further includes a support guide block 34. The support guide block 34 is fixedly connected between the driving member 32 and the solder storage tank 22. The support guide block 34 is used to support and fix the driving member housing 321. A limiting groove 341 extending in the first direction is formed on the support guide block 34. The limiting groove 341 is used to accommodate the through-pin 31 and the piston rod 322. The limiting groove 341 can be used to accommodate the second end of the through-pin 31. It can be understood that the limiting groove 341 can omit accommodating the piston rod 322, and the present application does not limit this. The notch of the limiting groove 341 can face the second direction. The solder cleaning assembly 30 further includes a limiting piece 35. The limiting piece 35 is arranged at one end of the limiting groove 341 away from the driving member 32. In some embodiments, the limiting piece 35 is fixed at one end of the limiting groove 341 away from the driving member 32, and the second end of the through-pin 31 passes through the limiting piece 35 and is accommodated in the limiting groove 341. The number of the limiting pieces 35 can be adjusted. Different numbers of limiting pieces 35 can form different movable distances of the limiting groove 341 and can limit different moving distances of the through-pin 31 in the limiting groove 341. The limiting piece 35 is used to limit the distance that the through-pin 31 moves away from the driving member 32 along the first direction. In some embodiments, the limiting piece 35 limits the distance that the through-pin 31 moves away from the driving member 32 along the first direction by abutting against the connecting block 33. It can be understood that the limiting piece 35 can also limit the distance that the through-pin 31 moves away from the driving member 32 along the first direction by abutting against the piston rod 322 or the through-pin 31, etc., and the present application does not limit this. The present application can adjust the movable distance of the through-pin 31 in the limiting groove 341 by adjusting the number of the limiting pieces 35 to adapt to different suction nozzles 21.

[0117] In some embodiments, please refer to Figure 1 and Figure 9 , in addition to the above, the desoldering device 1 further includes a second heat insulation block 60 and a third heat insulation block 70. The second heat insulation block 60 is fixedly connected between the support guide block 34 and the solder storage tank 22. In some embodiments, the second heat insulation block 60 is connected to the support guide block 34 and the solder storage tank 22 in the first direction. The second heat insulation block 60 is used to prevent the heat of the solder storage tank 22 from being conducted to the support guide block 34. In some embodiments, the second end of the through-pin 31 passes through the second heat insulation block 60 and the limiting piece 35 and is accommodated in the limiting groove 341. The third heat insulation block 70 is fixedly connected between the support guide block 34 and the driving member housing 321. In some embodiments, the third heat insulation block 70 is connected to the support guide block 34 and the driving member housing 321 in the first direction. The third heat insulation block 70 is used to prevent the heat of the solder storage tank 22 from being conducted to the driving member 32 through the support guide block 34. In some embodiments, the piston rod 322 passes through the third heat insulation block 70 and is accommodated in the limiting groove 341. Through the second heat insulation block 60, the present application can prevent the heat of the solder storage tank 22 from being conducted to the support guide block 34, and through the third heat insulation block 70, the present application can prevent the heat of the solder storage tank 22 from being conducted to the driving member 32 through the support guide block 34, and can prevent the driving member 32 from being damaged.

[0118] In some embodiments, please refer to Figure 1 , Figure 2 and Figure 4 , in addition to the tin removal device 1, the tin removal device 1 further includes a first positioning member 80 and a second positioning member 90. The first positioning member 80 and the second positioning member 90 are fixedly connected to the mounting plate 10 in the second direction. In some embodiments, the second positioning member 90 is fixedly connected to the mounting plate 10 in the second direction through the first support positioning block 41. The second positioning member 90 is concentric with the second part 212 of the suction nozzle 21. The line segment formed by the first positioning member 80 and the second positioning member 90 forms a preset inclination angle with the axial direction of the suction nozzle 21. The first positioning member 80 and the second positioning member 90 are used to support and fix the hot air gun 3, so that the hot air gun 3 blows hot air on the product 2 to be desoldered directly below the suction nozzle 21. The hot air gun 3 can blow hot air on the solder pad to be desoldered of the product 2 to be desoldered directly below the suction nozzle 21. In some embodiments, the first positioning member 80 is used to support and fix the handle of the hot air gun 3, and the second positioning member 90 is used to support and fix the head of the hot air gun 3. In the present application, the hot air gun 3 can be made to blow hot air on the product 2 to be desoldered directly below the suction nozzle 21 through the first positioning member 80 and the second positioning member 90.

[0119] Please refer to Figure 1 , Figure 3 , Figure 6 , Figure 7 and Figure 10 , when desoldering the product 2 to be desoldered, the solder pad to be desoldered of the product 2 to be desoldered is positioned, and the mounting plate 10 can be driven to move, driving the suction nozzle 21 to move above the solder pad to be desoldered of the product 2 to be desoldered and forming a certain gap with the solder pad to be desoldered. The hot air gun 3 blows hot air on the solder pad to be desoldered of the product 2 to be desoldered within a preset time, so that the solder on the solder pad to be desoldered melts into molten tin. At this time, the interface 228 can be evacuated. Through the air intake through hole 227, the diversion groove 226, the tin outlet 215 of the suction nozzle 21 and the hollow part 213 of the suction nozzle 21, the suction nozzle 21 can be evacuated. The mounting plate 10 can be driven to move along a preset path, driving the suction nozzle 21 to move above the solder pad to be desoldered. A vacuum suction force is formed between the suction nozzle 21 and the molten tin of the product 2 to be desoldered, and the suction nozzle 21 adsorbs the molten tin of the solder pad to be desoldered of the product 2 to be desoldered to the tin storage tank 22. After the molten tin of the product 2 to be desoldered is adsorbed to the tin storage tank 22, the mounting plate 10 can be driven to move, driving the suction nozzle 21 to move to a safe position, and the driving member 32 drives the through needle 31 to move away from the driving member 32 in the first direction within the suction nozzle 21, so that the through needle 31 penetrates through the inner diameter of the suction nozzle 21, and the residual tin attached to the inner wall 216 of the suction nozzle 21 is completely ejected from the suction nozzle 21, completing the desoldering of the product 2 to be desoldered and the self-cleaning of the suction nozzle 21.

[0120] It can be understood that the product 2 to be desoldered can be a solder pad, and the present application does not limit this.

[0121] It is understandable that the installation plate 10 is driven to move along a preset path to drive the suction nozzle 21 to move above the solder pad to be desoldered, which can be omitted, and the present application does not limit this.

[0122] It is understandable that the safe position can be, for example, a position that does not interfere with the product 2 to be desoldered, etc., and the present application does not limit this.

[0123] It is understandable that after the suction nozzle 21 adsorbs the molten solder on the solder pad to be desoldered of the product 2 to be desoldered into the solder storage tank 22, the installation plate 10 can be continuously driven to move, driving the suction nozzle 21 to move above another solder pad to be desoldered, forming a certain gap with the other solder pad to be desoldered, and continuing to adsorb the molten solder on the other solder pad to be desoldered of the product 2 to be desoldered into the solder storage tank 22 until all the molten solder on the solder pads to be desoldered of the product 2 to be desoldered is adsorbed into the solder storage tank 22. The present application does not limit this.

[0124] It is understandable that after the through-pin 31 completely ejects the residual solder adhering to the inner wall 216 of the suction nozzle 21 from the suction nozzle 21, the driving member 32 can drive the through-pin 31 to move in the first direction towards the driving member 32 within the suction nozzle 21, and then the through-pin 31 can return to its initial state. The present application does not limit this.

[0125] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present application and not to limit them. Although the present application has been described in detail with reference to the preferred embodiments, those of ordinary skill in the art should understand that the technical solutions of the present application can be modified or equivalently replaced without departing from the spirit and scope of the technical solutions of the present application.

Claims

1. A tin removal device, characterized in that, The tin removal device includes a mounting plate, a tin suction assembly, and a tin cleaning assembly, where: The tin suction assembly is connected to the mounting plate. The tin suction assembly includes a suction nozzle. The suction nozzle includes a first part and a second part arranged oppositely. The suction nozzle is formed with a hollow part penetrating through the first part and the second part. The first part is used to accommodate the tin cleaning assembly. A tin outlet is formed on the side surface of the first part. The tin outlet is communicated with the hollow part. The tin outlet is used for the suction nozzle to vacuum-extract the molten tin on the product to be de-tinned, and is used for the molten tin in the suction nozzle to flow out of the suction nozzle. The tin cleaning assembly is connected to the tin suction assembly. The tin cleaning assembly includes a through-pin. The first end of the through-pin is concentric with the first part in the first part and is slidably connected to the inner wall of the suction nozzle. The through-pin is used to be driven to move in the suction nozzle along a first direction.

2. The tin removal device according to claim 1, wherein: The tin suction assembly further includes a tin storage tank. The tin storage tank is connected to the mounting plate in a second direction perpendicular to the first direction. A sealed accommodation space is formed in the tin storage tank. The first part is fixed in the accommodation space. The tin outlet is communicated with the accommodation space. The second part is exposed outside the tin storage tank.

3. The tin removal device according to claim 2, wherein: The tin storage tank includes a housing and a cover plate. The first end of the housing is connected to the mounting plate in the second direction. The second end of the housing is formed with an accommodation groove. The notch of the accommodation groove faces the second direction. The second end of the housing is opposite to the first end of the housing. The cover plate is detachably covered on the housing at the notch of the accommodation groove to form the accommodation space.

4. The tin removal device according to claim 3, wherein: The second end of the housing includes a first end face and a second end face arranged oppositely. The first end of the cover plate is rotatably connected to the second end of the housing at the first end face. The second end of the cover plate includes a fastening portion. The second end of the cover plate is opposite to the first end of the cover plate. The tin storage tank includes a lock. The lock is rotatably connected to the second end of the housing at the second end face. The lock includes a lock frame and a lock rod. The lock frame is rotatably connected to the second end of the housing at the second end face. The lock frame includes a first frame and a second frame arranged oppositely. The opposite ends of the lock rod are respectively rotatably connected to the first frame and the second frame. The lock rod and the lock frame jointly form a fastening hole. The fastening hole is used to accommodate the fastening portion. The second end of the cover plate is detachably connected to the second end of the housing at the second end face through the fastening portion and the fastening hole.

5. The tin removal device according to claim 2, wherein: A diversion groove with an open end is formed in the tin storage tank. The accommodation space includes the diversion groove. The diversion groove extends along the first direction. The first end of the diversion groove is communicated with the tin outlet through the open end of the diversion groove. An air intake through hole is formed on the tin storage tank. The notch of the diversion groove faces the second direction. The air intake through hole is communicated with the second end of the diversion groove through the notch of the diversion groove. The second end of the diversion groove is opposite to the first end of the diversion groove.

6. The desoldering device according to claim 2, wherein: The suction nozzle includes a third part. The two opposite ends of the third part are respectively fixedly connected to the first part and the second part. The outer peripheral wall of the third part includes a tangent plane. A receiving space is formed on the tin storage tank for receiving the third part. An installation through hole is further formed on the outer wall of the tin storage tank. The desoldering assembly further includes a fixing member. The fixing member passes through the installation through hole and abuts against the tangent plane to fix the suction nozzle on the tin storage tank.

7. The desoldering device according to claim 2, wherein: The tin cleaning assembly further includes a driving member. The driving member is connected to the tin storage tank in the first direction. The driving member is connected to the second end of the through-pin. The driving member is used to drive the through-pin to move away from or close to the driving member along the first direction within the suction nozzle.

8. The desoldering device according to claim 7, wherein: The driving member includes a driving member housing. The driving member housing is fixedly connected to the tin storage tank in the first direction.

9. The desoldering device according to claim 2, wherein: The desoldering device further includes a first support positioning block, a second support positioning block, a support rod and an elastic member. The first support positioning block is fixedly connected to the mounting plate in the second direction. The second support positioning block is fixedly connected to the tin storage tank in the second direction. The first end of the support rod is fixed to the first support positioning block. The second end of the support rod is movably connected to the second support positioning block. The elastic member is sleeved on the support rod and is located between the first support positioning block and the second support positioning block.

10. The desoldering device according to claim 1, wherein: The desoldering device further includes a first positioning member and a second positioning member. The first positioning member and the second positioning member are fixedly connected to the mounting plate in the second direction. The second direction is perpendicular to the first direction. The line segment formed by the first positioning member and the second positioning member forms a preset inclination angle with the axial direction of the suction nozzle. The first positioning member and the second positioning member are used to support and fix the hot air gun so that the hot air gun blows hot air on the product to be desoldered directly below the suction nozzle.

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