Air conditioning system based on semiconductor refrigerating and heating technology

Abstract

The invention discloses an air conditioning system based on a semiconductor refrigerating and heating technology, which comprises a double-air-duct structure, a semiconductor chilling plate bidirectional working module and a heating and humidifying integrated module, and is characterized in that the double-air-duct structure comprises an air duct I and an air duct II, the semiconductor chilling plate bidirectional working module is positioned in the air duct I, and the heating and humidifying integrated module is positioned in the air duct II; the heating and humidifying integrated module is positioned in the air duct II; the semiconductor chilling plate bidirectional working module comprises a semiconductor chilling plate and an air heat exchanger, the cold end of the semiconductor chilling plate and the hot end of the air heat exchanger can be switched to be connected into the first air channel and the second air channel, and heat transfer is achieved between the semiconductor chilling plate and the air heat exchanger. The invention belongs to the technical field of semiconductor air conditioners, particularly relates to an air conditioning system based on a semiconductor refrigerating and heating technology, provides an integrated, high-precision and low-energy-consumption semiconductor air conditioning system, and solves the defects of single function, insufficient precision and low energy efficiency in the prior art.

Description

Technical Field

[0001] The present invention belongs to the technical field of semiconductor air conditioners, and specifically refers to an air conditioning system based on semiconductor refrigeration and heating technology. Background Art

[0002] In the field of air conditioning in small spaces (such as precision instrument cabins and cultural relic storage rooms), traditional air conditioning systems have problems such as large volume, risk of refrigerant leakage, and insufficient integration. Existing single-function semiconductor air conditioners can only achieve refrigeration or heating, lack a humidity adjustment module, have low precision in temperature and humidity control (humidity fluctuation > ±10% RH), and the waste heat at the hot end of the semiconductor refrigeration sheet is not effectively recovered, resulting in direct discharge of waste heat in summer and additional heating required in winter, with high energy consumption. Summary of the Invention

[0003] In view of the above problems, the present invention provides an integrated, high-precision, and low-energy-consumption semiconductor air conditioning system to solve the defects of single function, insufficient precision, and low energy efficiency in the prior art.

[0004] To solve the above technical problems, the technical solution adopted by the present invention is as follows: An air conditioning system based on semiconductor refrigeration and heating technology proposed by the present invention includes a double-air duct structure, a bidirectional working module of a semiconductor refrigeration sheet, and a heating and humidifying integrated module, where:

[0005] The double-air duct structure includes air duct one and air duct two. The bidirectional working module of the semiconductor refrigeration sheet is located in air duct one, and the heating and humidifying integrated module is located in air duct two. Air duct one realizes air heat exchange and waste heat recovery, and air duct two realizes air treatment;

[0006] The bidirectional working module of the semiconductor refrigeration sheet includes a semiconductor refrigeration sheet and an air heat exchanger. The cold end of the semiconductor refrigeration sheet and the hot end of the air heat exchanger can be switched to be connected to air duct one and air duct two, and the semiconductor refrigeration sheet and the air heat exchanger realize heat transfer.

[0007] Further, a fan one and a filter one are provided in air duct one. The filter one is close to the inlet of air duct one, and the semiconductor refrigeration sheet and the air heat exchanger are arranged between the filter one and the fan one.

[0008] Further, a fan two and a filter two are provided in air duct two. The heating and humidifying integrated module includes a heating component and a humidifying component. Among them, the filter two is close to the air inlet end of air duct two, the humidifying component is close to the air outlet end of air duct two, the heating component is arranged close to the humidifying component, and a fan two is arranged between the heating component and the humidifying component.

[0009] Further, a first temperature and humidity sensor is also provided at the humidifying component, a first temperature sensor is also provided on the other side close to the heating component, and a second temperature and humidity sensor is provided between the second filter and the thermoelectric cooling chip bidirectional working module.

[0010] Further, a third temperature sensor and a third temperature sensor are also provided on the thermoelectric cooling chip bidirectional working module. The first temperature and humidity sensor, the first temperature sensor, the second temperature and humidity sensor, the third temperature sensor, and the third temperature sensor form a sensor closed-loop control system, and the sensor closed-loop control system monitors the temperature and humidity parameters of each node in real time.

[0011] The beneficial effects achieved by the present invention with the above structure are as follows:

[0012] 1. Realize the functions of two-way heat exchange and multi-functional integration: The thermoelectric cooling chip works bidirectionally, combined with the heating and humidifying modules, to achieve multi-mode switching such as "cooling and dehumidifying" and "heating and humidifying".

[0013] 2. Precise measurement and control: The multi-sensor layout (entrance, in-process, exit) forms a closed-loop control to improve the adjustment accuracy.

[0014] 3. Energy efficiency optimization: The refrigerating thermoelectric cooling chip determines its working state (cooling, cooling and dehumidifying) according to the actual demand and the state of the incoming air, exchanges heat with the outside air through the first air duct, recovers the waste heat of the thermoelectric cooling chip (when heating in winter) or discharges the waste heat (when cooling in summer), and reduces energy consumption. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 It is a schematic diagram of the double-air-duct working process and sensor layout.

[0016] Among them, 1. Double-air-duct structure, 11. First air duct, 111. First fan, 112. First filter, 12. Second air duct, 121. Second fan, 122. Second filter, 2. Thermoelectric cooling chip bidirectional working module, 21. Thermoelectric cooling chip, 22. Air heat exchanger, 3. Heating and humidifying integrated module, 31. Heating component, 32. Humidifying component, 4. Sensor closed-loop control system, 41. First temperature and humidity sensor, 42. First temperature sensor, 43. Second temperature and humidity sensor, 44. Third temperature sensor, 45. Third temperature sensor. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0017] Next, the technical solutions in the embodiments of the present invention will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments; based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention.

[0018] Example:

[0019] Please refer to Figure 1 :

[0020] An air conditioning system based on semiconductor refrigeration and heating technology, including a dual-duct structure 1, a semiconductor refrigeration chip bidirectional working module 2, and a heating and humidifying integrated module 3, where: The dual-duct structure 1 includes a duct one 11 and a duct two 12. A fan one 111 and a filter one 112 are provided in the duct one 11. The filter one 112 is close to the inlet of the duct one 11. The semiconductor refrigeration chip 21 and the air heat exchanger 22 are arranged between the filter one 112 and the fan one 111. A fan two 121 and a filter two 122 are provided in the duct two 12. The semiconductor refrigeration chip bidirectional working module 2 is located in the duct one 11, and the heating and humidifying integrated module 3 is located in the duct two 12. The heating and humidifying integrated module 3 includes a heating component 31 and a humidifying component 32. The heating component 31 is one of a PTC ceramic heater or a heat pipe, and other heating method heaters can also be used. Among them, the filter two 122 is close to the air inlet end of the duct two 12, the humidifying component 32 is close to the air outlet end of the duct two 12, the heating component 31 is arranged close to the humidifying component 32, and a fan two 121 is arranged between the heating component 31 and the humidifying component 32. The duct one 11 realizes air heat exchange and waste heat recovery, and the duct two 12 realizes air treatment; The semiconductor refrigeration chip bidirectional working module 2 includes a semiconductor refrigeration chip 21 and an air heat exchanger 22. The cold end of the semiconductor refrigeration chip 21 and the hot end of the air heat exchanger 22 can be switched and connected into the duct one 11 and the duct two 12. The semiconductor refrigeration chip (including the heat exchanger) and the air heat exchanger 22 realize heat transfer. The semiconductor refrigeration chip (including the heat exchanger) and the air heat exchanger 22 work bidirectionally, and the refrigeration and heating modes are switched by changing the direction of the current.

[0021] Please refer to Figure 1 :

[0022] A humidity and temperature sensor one 41 is also provided at the humidifying component 32, a temperature sensor one 42 is also provided on the other side close to the heating component 31, and a humidity and temperature sensor two 43 is provided between the filter two 122 and the semiconductor refrigeration chip bidirectional working module 2; A temperature sensor three 44 and a temperature sensor three 45 are also provided on the semiconductor refrigeration chip bidirectional working module 2. The humidity and temperature sensor one 41, the temperature sensor one 42, the humidity and temperature sensor two 43, the temperature sensor three 44, and the temperature sensor three 45 form a sensor closed-loop control system 4. The sensor closed-loop control system 4 monitors the temperature and humidity parameters of each node in real time, and the semiconductor refrigeration chip 21, the air heat exchanger 22, the heating component 31, and the humidifying component 32 are dynamically adjusted by the data of the sensor closed-loop control system 4.

[0023] Air treatment process: The outside air is filtered by Filter 2 122 and then enters Duct 2 12. The initial state is detected by Humidity and Temperature Sensor 2 43. According to the set parameters, it passes through the cold end or the hot end of the thermoelectric cooler 21 in sequence. According to the mode switch: when refrigerating, the cold end cools down or cools and dehumidifies, and the humidity and temperature can be determined according to the actual needs in the space; when heating, the hot end heats up, the heating component 31 and the humidifying component 3 work, and finally it is sent into the space by Blower 2 122, and the processed state is fed back in real time through Humidity and Temperature Sensor 1 41;

[0024] Waste heat recovery process: The heat exchange air enters Duct 1 11 through Filter 1 112, exchanges heat with the hot end or the cold end of the thermoelectric cooler 21, and is discharged by Blower 1 111 to achieve heat transfer. The external controller (prior art) adjusts the current of the thermoelectric cooler 21, the power of the heating component 31, and the frequency of the humidifying component 32 according to the set humidity and temperature in the space and the feedback of the sensor closed-loop control system 4 to ensure that the output parameters meet the standards, where the temperature difference is ±0.1°C and the humidity difference is ±3%RH.

[0025] Example 2:

[0026] I. Component selection:

[0027] Scenario: Temperature and humidity control in a precision intelligent cabin

[0028] Parameter settings:

[0029] Target temperature: 22°C ± 0.3°C, humidity: 45% ± 3%RH;

[0030] Current of the thermoelectric cooler: 4 Temperature Sensor 1 (refrigeration mode), 6 Temperature Sensor 1 (heating mode);

[0031] Heating power: 50W (summer reheating), 120W (winter assistance).

[0032] Test results:

[0033] The temperature and humidity reach the standard within 30 minutes, and the fluctuation range is 0.1°C / 2%RH;

[0034] The average daily energy consumption is 0.8 kWh, saving 70% electricity compared with the traditional system.

[0035] II. Working mode:

[0036] Refrigeration mode:

[0037] The cold end of the thermoelectric cooler is connected to Duct 2 12 (cooling and dehumidifying or cooling), and the hot end is connected to Duct 1 11 for heat discharge;

[0038] Air flow: Filtration → Detection by humidity and temperature sensor II 43 → Cooling and dehumidifying, cooling at the cold end of the thermoelectric cooler 21 (Whether dehumidification and cooling here is only cooling or dehumidification and cooling is determined by the actual air parameters detected by humidity and temperature sensor II 43 and the set parameters of the space)) → Heating component 31 (reheating) → Humidifying component 32 → Sent into the space by fan II 121.

[0039] Heating mode:

[0040] The hot end of the thermoelectric cooler 21 is connected to air duct II 12 (heating up), and the cold end is connected to air duct I 11 to absorb heat;

[0041] Air flow: Filtration → Detection by humidity and temperature sensor II 43 → Hot end of the thermoelectric cooler 21 → Heating component 31 → Humidifying component 32 → Sent into the space by fan II 121.

[0042] Low power consumption mode: Turn off the thermoelectric cooler 21, and only fine-tune through the heating component 31 or the humidifying component 32 or natural ventilation to further reduce energy consumption.

[0043] III. Control algorithm:

[0044] Adopt a hybrid control algorithm combining PID and expert system. According to the deviation between the sensor feedback and the set value, dynamically adjust the current of the thermoelectric cooler, heating power, and humidifying frequency to ensure the stability of air parameters.

[0045] Although the embodiments of the present invention have been shown and described, for those of ordinary skill in the art, it can be understood that various changes, modifications, substitutions, and variations can be made to these embodiments without departing from the principles and spirit of the present invention. The scope of the present invention is defined by the appended claims and their equivalents.

[0046] Unless otherwise clearly defined and limited, the terms "set", "installed", "connected", and "connected" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be directly connected or indirectly connected through an intermediate medium, and it can be the communication inside two components. For those of ordinary skill in the art, the specific meanings of the above terms in this application can be understood according to specific situations.

[0047] The above has described the present invention and its implementation manners. This description is not restrictive. What is shown in the drawings is only one of the implementation manners of the present invention, and the actual structure is not limited thereto. Generally speaking, if those of ordinary skill in the art are inspired by it and design similar structural manners and embodiments without departing from the purpose of the present invention without creative efforts, they should all belong to the protection scope of the present invention.

Claims

1. An air conditioning system based on semiconductor refrigeration and heating technology, characterized in that, It includes a dual-duct structure (1), a thermoelectric cooler bidirectional working module (2), and a heating and humidifying integrated module (3), where: The dual-duct structure (1) includes duct one (11) and duct two (12). The thermoelectric cooler bidirectional working module (2) is located in duct one (11), and the heating and humidifying integrated module (3) is located in duct two (12). Duct one (11) realizes air heat exchange and waste heat recovery, and duct two (12) realizes air treatment. The thermoelectric cooler bidirectional working module (2) includes a thermoelectric cooler (21) and an air heat exchanger (22). The cold end of the thermoelectric cooler (21) and the hot end of the air heat exchanger (22) can be switched to be connected into duct one (11) and duct two (12), and the thermoelectric cooler (21) and the air heat exchanger (22) realize heat transfer.

2. The air conditioning system based on the semiconductor refrigeration and heating technology according to claim 1, characterized in that: A fan one (111) and a filter one (112) are provided in duct one (11). The filter one (112) is close to the inlet of duct one (11), and the thermoelectric cooler (21) and the air heat exchanger (22) are arranged between the filter one (112) and the fan one (111).

3. The air conditioning system based on the semiconductor refrigeration and heating technology according to claim 2, wherein: A fan two (121) and a filter two (122) are provided in duct two (12). The heating and humidifying integrated module (3) includes a heating component (31) and a humidifying component (32). Among them, the filter two (122) is close to the air inlet end of duct two (12), the humidifying component (32) is close to the air outlet end of duct two (12), the heating component (31) is arranged close to the humidifying component (32), and the fan two (121) is arranged between the heating component (31) and the humidifying component (32).

4. The air conditioning system based on the semiconductor refrigeration and heating technology according to claim 3, characterized in that: A temperature and humidity sensor one (41) is also provided at the humidifying component (32), a temperature sensor one (42) is also provided on the other side close to the heating component (31), and a temperature and humidity sensor two (43) is provided between the filter two (122) and the thermoelectric cooler bidirectional working module (2).

5. The air conditioning system based on the semiconductor refrigeration and heating technology according to claim 4, characterized in that: A temperature sensor two (44) and a temperature sensor three (45) are also provided on the thermoelectric cooler bidirectional working module (2). The temperature and humidity sensor one (41), the temperature sensor one (42), the temperature and humidity sensor two (43), the temperature sensor two (44), and the temperature sensor three (45) form a sensor closed-loop control system (4), and the sensor closed-loop control system (4) monitors the temperature and humidity parameters of each node in real time.

Images