Circuit board high-precision slotting processing method and system, computer equipment, storage medium, program product and workpiece

Abstract

The invention relates to a circuit board high-precision slotting processing method and system, computer equipment, a computer readable storage medium, a computer program product and a workpiece. The method comprises the steps that rough machining equipment is controlled, an initial notch structure is machined on a circuit board to be slotted, and a preset spacing distance is arranged between the initial notch structure and the contour position of a preset notch area; and laser processing equipment is controlled, the side wall of the initial notch structure is trimmed so as to remove the preset interval distance, and a target notch structure is formed in the contour position of the preset notch area. By adopting the method, the taper defect of circuit board slotting can be reduced, and the circuit board slotting machining precision is improved.

Description

Technical Field

[0001] The present application relates to the technical field of printed circuit board processing, and particularly to a high-precision grooving processing method, system, computer device, computer-readable storage medium, computer program product and workpiece for a printed circuit board. Background Art

[0002] The cutting process of a printed circuit board is a key process in PCB (Printed Circuit Board) manufacturing. By performing windowing or grooving on the printed circuit board through laser cutting, the installation of components, electrical connection, heat dissipation design, and mechanical fixation can be achieved.

[0003] In traditional technologies, laser processing can be used for printed circuit board cutting. However, laser processing has a "taper" defect, that is, there is a problem that the cross-sectional area of the groove formed by cutting gradually decreases from top to bottom, which easily leads to the processing accuracy not meeting the actual requirements of the product. For the notch structure that needs to embed a chip, the chip may not be smoothly embedded into the bottom of the groove, resulting in problems such as poor chip contact and poor heat dissipation. Even if the chip is barely embedded, it is very easy to loosen or fall off, posing a short-circuit risk. Summary of the Invention

[0004] Based on this, in view of the above technical problems, it is necessary to provide a high-precision grooving processing method, system, computer device, computer-readable storage medium, computer program product and workpiece for a printed circuit board that can improve the grooving processing accuracy of the printed circuit board.

[0005] In a first aspect, the present application provides a high-precision grooving processing method for a printed circuit board, the method comprising:

[0006] Controlling a rough processing device to process an initial notch structure on a printed circuit board to be grooved, and a preset interval distance is set between the initial notch structure and the contour position of a preset notch area;

[0007] Controlling a laser processing device to trim the side wall of the initial notch structure to remove the preset interval distance and form a target notch structure at the contour position of the preset notch area.

[0008] In one embodiment, the rough processing device includes at least one of a mechanical processing device and a laser rough processing device, and the mechanical processing device includes at least one of a mechanical router, a mechanical drill, and a numerical control punching machine.

[0009] In one embodiment, the laser rough processing device is a laser processing device.

[0010] In one embodiment, the laser processing device includes a short-pulse laser processing device.

[0011] In one embodiment, the wavelength of the short-pulse laser beam emitted by the short-pulse laser processing device is in the green light band to the infrared band.

[0012] In one embodiment, controlling the roughing device to machine an initial notch structure on the circuit board to be notched, and a preset interval distance is set between the initial notch structure and the contour position of the preset notch area, including:

[0013] Controlling the roughing device to machine an initial notch structure on the circuit board to be notched along a preset roughing trajectory;

[0014] Before controlling the roughing device to machine an initial notch structure on the circuit board to be notched along a preset roughing trajectory, the method further includes:

[0015] Determining the contour position of the notch area;

[0016] Positioning the roughing trajectory according to the contour position of the notch area, wherein the roughing trajectory includes at least one of a straight trajectory and a curved trajectory, and the interval distance between the contour position of the notch area and the roughing trajectory is 1.5 - 3 times the spot diameter of the laser beam used in the trimming process.

[0017] In one embodiment, controlling the roughing device to machine an initial notch structure on the circuit board to be notched, and a preset interval distance is set between the initial notch structure and the contour position of the preset notch area, including:

[0018] Controlling the roughing device to machine an initial notch structure on the circuit board to be notched along a preset roughing trajectory;

[0019] Before controlling the roughing device to machine an initial notch structure on the circuit board to be notched along a preset roughing trajectory, the method further includes:

[0020] Determining the contour position of the notch area and the first machining accuracy value of the roughing device;

[0021] Positioning the roughing trajectory according to the contour position of the notch area and the first machining accuracy value.

[0022] In one embodiment, positioning the roughing trajectory according to the contour position of the notch area and the first machining accuracy value includes:

[0023] Performing a shrinking process on the contour position of the notch area based on the first machining accuracy value to obtain the roughing trajectory, wherein the interval distance between the contour position of the notch area and the roughing trajectory is equal to the first machining accuracy value.

[0024] In one embodiment, the preset interval distance is 50 - 70 μm.

[0025] In one embodiment, the laser processing device includes an ultrafast laser processing device, and the laser spot diameter corresponding to the ultrafast laser processing device is 25 - 35 μm.

[0026] In one embodiment, the laser processing device is controlled to trim the side wall of the initial notch structure to remove the preset interval distance and form a target notch structure at the contour position of the preset notch area, including:

[0027] Controlling the laser processing device to emit a laser beam to the circuit board to be notched, and controlling the laser beam to move multiple circles from the inner layer to the outer layer between the side wall of the initial notch structure and the contour position of the preset notch area, so as to trim the side wall of the initial notch structure outward to the contour position of the preset notch area.

[0028] In a second aspect, the present application further provides a high-precision slotting processing system for a circuit board. The system includes a controller, a laser processing device, and a rough processing device; the controller is configured to:

[0029] Control the rough processing device to process an initial notch structure on the circuit board to be notched, and a preset interval distance is set between the initial notch structure and the contour position of the preset notch area;

[0030] Control the laser processing device to trim the side wall of the initial notch structure to remove the preset interval distance and form a target notch structure at the contour position of the preset notch area.

[0031] In a third aspect, the present application further provides a computer device, including a memory and a processor. The memory stores a computer program, and when the processor executes the computer program, the following steps are implemented:

[0032] Control the rough processing device to process an initial notch structure on the circuit board to be notched, and a preset interval distance is set between the initial notch structure and the contour position of the preset notch area;

[0033] Control the laser processing device to trim the side wall of the initial notch structure to form a target notch structure at the contour position of the preset notch area.

[0034] In a fourth aspect, the present application further provides a computer-readable storage medium, on which a computer program is stored. When the computer program is executed by a processor, the following steps are implemented:

[0035] Control the rough processing device to process an initial notch structure on the circuit board to be notched, and a preset interval distance is set between the initial notch structure and the contour position of the preset notch area;

[0036] Control the laser processing device to trim the side wall of the initial notch structure to form a target notch structure at the contour position of the preset notch area.

[0037] In a fifth aspect, the present application also provides a computer program product, including a computer program which, when executed by a processor, implements the following steps:

[0038] Control a rough machining device to machine an initial notch structure on a circuit board to be grooved, and a preset spacing distance is provided between the initial notch structure and the contour position of a preset notch area;

[0039] Control a laser machining device to trim the side wall of the initial notch structure to form a target notch structure at the contour position of the preset notch area.

[0040] In a sixth aspect, the present application also provides a workpiece processed by the method as above.

[0041] In a seventh aspect, the present application also provides a high-precision grooving method for a circuit board, and the method includes:

[0042] Machine an initial notch structure on a circuit board to be grooved, and a preset spacing distance is provided between the initial notch structure and the contour position of a preset notch area;

[0043] Trim the side wall of the initial notch structure to remove the preset spacing distance and form a target notch structure at the contour position of the preset notch area.

[0044] For the above high-precision grooving method, system, computer device, computer-readable storage medium, computer program product and workpiece for a circuit board, by controlling a rough machining device to machine an initial notch structure on a circuit board to be grooved, and a preset spacing distance is provided between the initial notch structure and the contour position of a preset notch area, low-precision grooving of the circuit board can be achieved; and then by controlling a laser machining device to trim the side wall of the initial notch structure to form a target notch structure at the contour position of the preset notch area, high-precision trimming of the low-precision initial notch structure can be achieved. Compared with the laser grooving method, since the prior rough machining has achieved grooving, the laser trimming does not need to penetrate the entire layer of material, so there is no need to accumulate a large amount of energy at the same site. Therefore, although the distribution range of the laser energy at the top of the groove is wider, the accumulated energy is lower and is not sufficient for large-scale elimination. Therefore, it is not easy to appear "taper" defects, thereby further improving the machining accuracy and improving the electrical performance and reliability of the circuit board. Description of the Drawings

[0045] To more clearly illustrate the technical solutions in the embodiments of the present application or related technologies, the following will briefly introduce the drawings required for use in the description of the embodiments of the present application or related technologies. Obviously, the drawings in the following description are only some embodiments of the present application. For those of ordinary skill in the art, without creative efforts, other related drawings can also be obtained based on these drawings.

[0046] Figure 1 Schematic diagram of the notch structure formed by mechanical grooving in an embodiment;

[0047] Figure 2 Cross-sectional view of the side wall of the notch structure formed by laser grooving in an embodiment;

[0048] Figure 3 Schematic diagram of the laser beam energy distribution in an embodiment;

[0049] Figure 4 Schematic flow chart of the high-precision grooving processing method for a circuit board in an embodiment;

[0050] Figure 5 Schematic diagram of forming a rough machining trajectory by shrinking the contour position of the notch area in an embodiment;

[0051] Figure 6 Scene schematic diagram of the side wall trimming process in an embodiment;

[0052] Figure 7 Schematic diagram of the structure of the high-precision grooving processing system for a circuit board in an embodiment;

[0053] Figure 8 Internal structure diagram of a computer device in an embodiment. Detailed implementation manners

[0054] In order to make the objectives, technical solutions and advantages of the present application more clear and understandable, the present application will be further described in detail below in conjunction with the drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present application and are not used to limit the present application.

[0055] High-precision grooving of circuit boards is a key process in PCB (Printed Circuit Board) manufacturing. By grooving on the circuit board, the installation of components, electrical connection, heat dissipation design, and mechanical fixation can be achieved. Circuit boards can include ordinary PCB boards, multilayer boards, HDI (High-Density Interconnect) boards, FPC (Flexible Printed Circuit) boards, and also IC (Integrated Circuit) packaging substrates. High-precision grooving of circuit boards includes forms such as grooving and windowing. Among them, grooving can be used for embedding chips or installing heat sinks, etc., and windowing can be used for interlayer electrical connection or signal transmission, etc.

[0056] Through grooving, the chip can be embedded into the circuit board. In order to avoid damaging the chip or affecting the electrical performance of the circuit board, the processing accuracy requirements for grooving are usually relatively high.

[0057] Although mechanical processing has a relatively low cost, its processing accuracy is also relatively low. Since mechanical processing acts on the material to be processed by the high-speed rotation of the cutting tool, the dimensional accuracy of the cutting tool and the processing method are limited, which determines that in the processing process, it is very easy to cause problems such as uneven processing cross-sections, breakage or notches, or large arcs at the corners of the groove structure. As an example, using mechanical processing to make a square through-groove, the morphology of the formed through-groove is as Figure 1 shown. The edge morphology of the square through-groove is not good, and there are large arcs at the positions that need to be processed into right angles. For example, the cutting tools used in mechanical processing equipment include milling cutters and drill bits. Limited by the dimensions of the milling cutter and drill bit, and the displacement or deformation of the milling cutter or drill bit during processing due to force, etc., it has a greater impact on the processing accuracy of mechanical milling machines and mechanical drilling machines. And the dimensions of the milling cutter and drill bit are limited by their materials, strength, etc., and the processing accuracy can usually only reach dozens or even more than one hundred micrometers. When embedding chips, it may cause chip damage due to size mismatch, friction, etc., that is, it cannot meet the installation requirements for embedding chips.

[0058] Laser grooving is widely used in circuit board grooving in the PCB field due to its good processing accuracy, but laser grooving has a natural "taper" defect. Exemplarily, as Figure 2 shown, when laser processing the circuit board 202 in the direction indicated by the arrow in Figure 2 , the side wall 204 of the formed processing cross-section is an inclined plane. This is because the laser beam focused on the position to be processed is distributed in a hyperbolic shape. The light spot at the beam waist position is the smallest, gradually diverging towards both ends, and the energy density will also increase as the light spot decreases. Exemplarily, as Figure 3 shown, Figure 3For the hyperbolic model of the focused beam in an embodiment, the spot size of the action area is the smallest and the energy density is the highest. The laser beam diverges in the focusing area far from the action area, and the energy density decreases. During the processing, whether controlling the focusing area of the laser beam to change with the change of the processing position in the depth direction; or keeping the position of the laser beam unchanged in the height direction and forming a notch structure in the depth direction through the action accumulation of the laser beam, the side wall of the processed section after laser processing will present a certain inclination angle due to this hyperbolic model, resulting in the inconsistency between the top slot width and the bottom width of the processed section and the occurrence of the taper problem.

[0059] Based on this, the present application proposes a high-precision slotting processing method for circuit boards, which adopts a combined processing method of rough slotting and fine processing of slot wall trimming. This method is significantly superior to the traditional mechanical slotting and laser slotting methods in terms of precision. The high precision of the present application is specifically manifested as follows: compared with the traditional mechanical slotting, the slot wall processed by the present application is flatter and the corner radian is smaller, effectively improving the edge sharpness and shape precision; compared with the traditional laser slotting, the present application can significantly reduce the taper of the slot wall, further improving the dimension precision and consistency of the slotting.

[0060] It can be understood that during the actual test process, it is found that even when using lasers with the same laser parameters for slotting and trimming, the slotting will generate taper, while the trimming will not generate taper. For example, controlling an ultrafast laser with a diameter of 30 μm to continuously process 3 circles along the contour line of the preset notch area can break through the material at the contour line position of the notch area to form a notch structure. However, the notch structure formed by directly slotting with a laser has a significant taper. From the position close to the laser to the position far from the laser, the caliber of the notch gradually decreases, resulting in the fact that the caliber at the deep part of the notch is actually smaller than the contour of the notch area. If the chip is precisely matched with the contour of the notch area, it may not be completely accommodated in the notch; at this time, further controlling the ultrafast laser with a diameter of 30 μm to circle and trim along the side wall of the formed notch with taper can further eliminate the material that has not been completely eliminated at the deep part of the notch to the position of the contour area contour line. The reason for this difference may be that during the trimming, since the notch has been formed, the heat dissipation and waste chip removal effects generated during the trimming process are better. Therefore, although the laser parameters have not changed, the position where the laser energy acts on the material and the thermal influence generated are different. During the trimming process, the laser energy can be more concentrated at the material to be trimmed, and the thermal influence is smaller, so it is not easy to form taper.

[0061] In an exemplary embodiment, such as Figure 4As shown, a high-precision grooving method for a circuit board is provided. In this embodiment, the execution entity of this method is taken as an example of a terminal for illustration. Among them, the terminal can be a high-precision grooving processing device for a circuit board or a high-precision grooving processing system for a circuit board, or can also be other terminals capable of regulating a high-precision grooving processing device for a circuit board or a high-precision grooving processing system for a circuit board, such as various personal computers, notebook computers, smart phones, tablet computers, Internet of Things devices, and portable wearable devices, etc. The high-precision grooving processing device for a circuit board can be a laser processing device equipped with only a single laser, or can be a laser processing device integrated with multiple lasers with different processing precisions, or can also be a device capable of both mechanical processing and laser processing. For example, the processing device is integrated with mechanical processing elements and laser processing elements. The Internet of Things device can be a smart speaker, a smart TV, a smart air conditioner, a smart vehicle-mounted device, a projection device, etc. The portable wearable device can be a smart watch, a smart bracelet, a head-mounted device, etc. The head-mounted device can be a virtual reality (VR) device, an augmented reality (AR) device, a smart glasses, etc. It can be understood that the execution entity of this method can also be a server, or can also be a system including a terminal and a server, and is realized through the interaction between the terminal and the server.

[0062] In this embodiment, the method includes the following steps S10 - S20. Among them:

[0063] Step S10, control the rough processing device to process an initial notch structure on the circuit board to be grooved, and a preset interval distance is set between the initial notch structure and the contour position of the preset notch area.

[0064] Among them, high-precision grooving processing of a circuit board can refer to a process of processing a notch structure with a specific shape on a circuit board or other materials. Among them, the notch structure is used to bury precision devices such as chips, so it is necessary to have a notch wall morphology structure with higher precision. The notch structure includes notches of any shape. The shape of the notch can be square, circular, or any shape composed of straight lines and curves. The notch includes blind notches or through notches. The number of notch structures can be one or multiple.

[0065] The initial notch structure can refer to the notch structure roughly processed by the rough processing device on the circuit board to be grooved. It can be understood that rough processing can refer to a processing process with lower processing precision requirements compared to subsequent finishing processing techniques. That is, the processing precision of rough processing can be lower than that of the finishing processing technique, or can be equivalent to the processing precision of the finishing processing technique.

[0066] In some feasible embodiments, the machining accuracy of rough machining can be lower than that of the trimming machining process. Generally, the higher the machining accuracy, the slower the machining speed and the lower the machining efficiency, or the higher the cost of the machining equipment required for the higher machining accuracy. Since after rough machining, it is still necessary to further trim the grooves of the rough machining with higher accuracy, a machining equipment with a lower machining accuracy but a faster machining speed can be selected as the rough machining equipment for rough machining of the grooves.

[0067] The rough machining equipment can refer to the machining equipment capable of grooving the plate, and can include at least one of a mechanical router, a mechanical drilling machine, a CNC punching machine, a laser rough machining equipment, etc.

[0068] In some feasible embodiments, the laser rough machining equipment used for rough machining should be able to adopt a machining speed equivalent to or faster than that of the mechanical machining equipment, and the machining accuracy during rough machining can be lower than the machining accuracy when trimming the side walls. It can be understood that the laser rough machining equipment used for rough machining and the laser machining equipment used for trimming the side walls can be the same or different. That is, the same laser machining equipment can be used, which is set to a faster machining speed required for rough machining for rough machining, and then set to the machining accuracy required for trimming to trim the side walls of the groove after rough machining. For example, the laser machining equipment can select a laser machining equipment with a pulse width less than or equal to the nanosecond level, and the laser machining equipment used for trimming the side walls can select a laser machining equipment with a pulse width at the nanosecond level and above. When the machining efficiency of this laser machining equipment can reach the level equivalent to that of the mechanical machining equipment, this laser machining equipment can also be used for rough machining.

[0069] The circuit board to be grooved can refer to the circuit board substrate that needs to process the groove structure.

[0070] The contour position of the groove area can be determined in advance through groove area design. Among them, the groove area can refer to the area on the circuit board or material where grooves need to be machined. Outside the groove area is the circuit board area, and other machining can also be carried out on the circuit board area, which is not limited in this embodiment. The groove area can refer to the geometric shape marked in the design drawing, or the range of materials that need to be removed during actual machining.

[0071] As an example, before machining the circuit board grooves, the preset contour position of the groove area imported by the user, collected during the machining process, or pre-stored on the terminal can be obtained first, and the rough machining trajectory can be determined based on the preset contour position of the groove area. During the process of machining the circuit board grooves, the machining tool of the rough machining equipment can be controlled to move along the rough machining trajectory, and through the moving machining tool, an initial groove structure can be formed on the circuit board to be grooved.

[0072] In some feasible embodiments, the rough machining trajectory may be located within the notch area, at a position spaced a certain distance from the contour position of the notch area.

[0073] As another example, it is also possible not to determine the rough machining trajectory, but to control the machining tool of the rough machining equipment to move outside the preset notch area contour position and at a certain distance from the preset notch area contour position. Through the moving machining tool, an initial notch structure is formed on the circuit board to be grooved.

[0074] In this embodiment, the high-precision grooving process of the circuit board at least includes two steps: rough grooving and grooving trimming. Rough grooving may refer to grooving at a position near the machining position of the notch structure and spaced a certain distance from the notch area contour through a rough machining equipment with relatively low machining accuracy. Since there is a certain distance between the rough machining grooving position and the notch area contour, even if its accuracy is low, it is not easy to damage the circuit board area outside the notch area. However, between the notch area contour and the rough machining grooving position, there will still be materials that need to be eliminated but have not been eliminated. Grooving trimming may refer to trimming the side walls of the groove formed by rough machining through a laser machining equipment with relatively high machining accuracy, so that the actually machined side walls of the groove are extrapolated to the position of the pre-designed notch area contour. At the same time, laser machining processes through the photothermal or photochemical effect of the laser beam on the machining material, and the machining accuracy is higher. Therefore, it can effectively improve the flatness of the side walls of the groove, reduce the corner arc, and reduce the risk of the machining material breaking, thereby avoiding damage to the chip when it is embedded in the notch and improving the electrical performance and reliability of the circuit board.

[0075] Step S20: Control the laser machining equipment to trim the side walls of the initial notch structure to remove the preset interval distance and form a target notch structure at the preset notch area contour position.

[0076] Among them, the laser machining equipment may refer to a laser machining equipment capable of trimming the side walls of the initial notch structure.

[0077] In some feasible embodiments, the rough machining equipment and the laser machining equipment can be completed either by using a combination of two different devices or by integrating the rough machining related devices and the laser trimming machining related devices in the same device. For example: In the circuit board processing workshop, the mechanical router and the ultrafast laser machining equipment are placed opposite each other. After the mechanical router completes the rough grooving, it is transferred to the ultrafast laser machining equipment through an automated conveying device for trimming.

[0078] The target notch structure may refer to the notch structure formed by trimming the side walls of the initial notch structure. Since further material needs to be removed between the position of the side wall of the initial notch structure and the contour of the notch area during trimming, the target notch structure is located outside the initial notch structure. Among them, the target notch structure being located outside the initial notch structure may mean that the distance of the target notch structure from the geometric center of the circuit board is greater than the distance of the initial notch structure from the geometric center of the circuit board.

[0079] Exemplarily, after forming the initial notch structure, the laser processing equipment can be controlled to emit a laser beam, and the laser beam can be controlled to move between the side wall of the initial notch structure and the contour of the notch area. The side wall of the initial notch structure is trimmed by the moving laser beam, and the preset interval distance is removed, and finally the target notch structure is formed.

[0080] In some feasible embodiments, before trimming the side wall of the initial notch structure, the trimming processing trajectory of the laser beam during the laser trimming process can be planned in advance based on the rough machining trajectory and the position of the notch area contour to obtain the trimming processing trajectory. When trimming the side wall of the initial notch structure, the laser beam can be controlled to move along the pre-designed trimming processing trajectory.

[0081] In some feasible embodiments, the trimming processing trajectory can be circular or spiral. Among them, the trimming processing trajectory being circular means that the processing path of the focused spot of the laser beam during the trimming process consists of at least one concentric circle, and the groove wall of the initial notch structure is trimmed layer by layer from the inside to the outside. After each circle of trimming is completed, the radius increases at an equal or unequal synchronous pitch, and the next circle of trimming is carried out until the groove wall is pushed out to coincide with the notch area contour.

[0082] The trimming processing trajectory being spiral means that the focused spot of the laser beam moves with a continuously changing radius during the trimming process, forming a smooth spiral line from the inside to the outside, and the path has no discontinuity and no sudden turning corners until the groove wall is pushed out to coincide with the notch area contour.

[0083] In some feasible embodiments, the trimming processing trajectory can have multiple layers. For example, it can include multiple rings or spiral lines that are gradually retracted or expanded layer by layer.

[0084] In some feasible embodiments, the trimming processing trajectory can be located outside the rough machining trajectory and inside the notch area contour. Some of the trajectory points in the trimming processing trajectory can coincide with the rough machining trajectory or the notch area contour.

[0085] In some feasible implementation manners, the trimming machining trajectory can be such that the position deviation between the side wall of the target notch structure obtained after trimming and the notch area contour is less than a preset position deviation threshold value. That is, the side wall of the initial notch structure is extrapolated to the notch area contour to obtain a target notch structure that matches the previously designed notch area.

[0086] In the above high-precision slotting machining method for a circuit board, by controlling a rough machining device, an initial notch structure is machined on the circuit board to be slotted. There is a preset interval distance between the initial notch structure and the preset notch area contour position, and low-precision slotting of the circuit board can be achieved. Furthermore, by controlling a laser machining device to trim the side wall of the initial notch structure, a target notch structure is formed at the preset notch area contour position, and high-precision trimming of the low-precision initial notch structure can be achieved. Compared with the laser slotting method, since the rough machining has already achieved slotting, the laser trimming does not need to penetrate the entire layer of material. Therefore, there is no need to accumulate a large amount of energy at the same site. Therefore, although the distribution range of the laser energy at the top of the slot is wider, the accumulated energy is lower and is not sufficient to perform a large-scale elimination. Therefore, it is not easy to appear "taper" defects, and thus the machining accuracy can be further improved, and the electrical performance and reliability of the circuit board can be improved.

[0087] In an exemplary embodiment, the initial notch structure is machined by a rough machining device, and the rough machining device includes at least one of a mechanical machining device and a laser rough machining device. The mechanical machining device includes at least one of a mechanical router, a mechanical drill, and a numerical control punching machine.

[0088] It should be noted that generally, the higher the machining accuracy, the slower the machining speed and the lower the machining efficiency. Using a laser rough machining device for rough machining, although the machining accuracy is relatively high, the machining efficiency is low, and it is also easy to cause carbonization of the side wall of the notch structure.

[0089] Among them, the mechanical machining device can refer to a device that processes a workpiece by mechanical force. Among them, the mechanical force can refer to cutting, drilling, stamping, etc. The mechanical machining device can utilize the mechanical movement of machining tools such as cutters, drills, and punches to remove materials or change the shape, size, and surface quality of the workpiece.

[0090] The laser rough machining device can refer to a laser machining device used for slotting and machining the initial notch structure. The laser rough machining device can be the same as or different from the laser machining device used for side wall trimming.

[0091] In an exemplary embodiment, the laser rough machining device is a laser machining device.

[0092] In this embodiment, rough machining is performed by a mechanical processing device, which can significantly improve the processing efficiency. Then, trimming is performed by a high-precision laser processing device, which can better eliminate problems such as uneven machining cross-sections, breakage or notches caused by the low machining accuracy of rough machining, and large radians at the corners, ensuring that the final target notch structure has high dimensional accuracy and a smoother sidewall. Thus, the purpose of simultaneously improving the processing efficiency and processing accuracy of high-precision slotting of circuit boards is achieved.

[0093] In an exemplary embodiment, the laser processing device includes a short-pulse laser processing device.

[0094] The short-pulse laser processing device may refer to a laser processing device that can emit and utilize a short-pulse laser beam for processing. A short-pulse laser beam refers to a laser beam whose pulse width is less than or equal to the nanosecond order of magnitude, including nanosecond pulse width, picosecond pulse width, and femtosecond pulse width.

[0095] In some feasible embodiments, the short-pulse laser processing device includes an ultrafast laser processing device and a nanosecond laser processing device. Among them, the ultrafast laser processing device may refer to a laser processing device that can emit an ultrafast laser. The nanosecond laser processing device may refer to a laser processing device that can emit a nanosecond laser. Ultrafast laser refers to a laser whose pulse width is less than or equal to the picosecond order of magnitude. Nanosecond laser refers to a laser whose pulse width is of the nanosecond order of magnitude.

[0096] In some other feasible embodiments, the laser that emits the short-pulse laser beam can also be a carbon dioxide laser. The original laser pulse emitted by the carbon dioxide laser is a long-pulse laser beam with a microsecond order of magnitude, but the long-pulse laser beam can be switched into the short-pulse laser beam required for processing through a pulse control device, such as through radio frequency pulse modulation technology.

[0097] The conductive material layer of the circuit board usually uses copper or aluminum, which has a low absorption rate of laser, only 0.5% - 10%. The carbon dioxide laser emitted by the carbon dioxide laser has a long wavelength, usually between 9.3 µm and 10.6 µm, and a long pulse width. Although the long-pulse carbon dioxide laser can be switched into the short-pulse laser beam required for processing through a pulse control device, it is impossible to make the peak power of the carbon dioxide laser beam reach the damage threshold of conductive materials such as copper or aluminum. However, the short-pulse laser beams emitted by ultrafast lasers and nanosecond lasers, such as laser beams with picosecond pulse width or nanosecond pulse width, have a large peak power and can quickly damage copper. Therefore, when using carbon dioxide laser processing, the surface of the conductive material layer must be browned or blackened before processing, or a windowing process must be performed at the processing position of the multi-layer interconnection structure to pre-remove the surface conductive material layer, and then the carbon dioxide laser is used to ablate and remove the insulating material layer to process and form a notch structure. The process flow steps are numerous and the processing efficiency is slow.

[0098] Therefore, to improve the processing efficiency, the short-pulse laser beam preferably uses an ultrafast laser or a nanosecond laser. Both the ultrafast laser and the nanosecond laser can quickly break through the conductive material layer without pre-treating the conductive material layer of the circuit board in advance, which can effectively simplify the process flow and improve the overall transfer efficiency of the circuit board production process.

[0099] In an exemplary embodiment, the short-pulse laser processing device is an ultrafast laser processing device. The ultrafast laser processing device is provided with an ultrafast laser for emitting an ultrafast laser beam. The ultrafast laser includes a picosecond laser and a femtosecond laser. The ultrafast laser can output a short-pulse laser beam with a pulse width less than or equal to the picosecond order. Due to the extremely short pulse time, the laser energy is concentrated and released in an extremely short time, so the peak power is extremely high, reaching the GW (Gigawatt) level, which makes the laser energy concentrated in a very small time and space range, triggering multi-photon absorption and / or avalanche ionization at the processing position of the material, breaking the molecular chain of the material, vaporizing the material, forming smaller particles, and realizing the rapid removal of the material. Since the laser energy of the ultrafast laser can be concentrated in a smaller space range, that is, the spot size of the focused spot formed on the material surface is smaller, it is helpful to control the dimensional accuracy of the processing. Especially when mechanical processing is used for roughing, resulting in a larger arc at the corner, the ultrafast laser can trim the corner arc to be closer to the actual required notch profile, further improving the processing accuracy. Moreover, the interaction time between the laser pulse of the ultrafast laser and the material is extremely short, causing less thermal impact on the material around the notch structure, no carbon slag is generated during the processing, and the carbonization degree of the processed groove wall is extremely low, so a better groove wall morphology can be processed.

[0100] In an exemplary embodiment, the wavelength of the short-pulse laser beam emitted by the short-pulse laser processing device is in the green light band to the infrared band.

[0101] It can be understood that during actual processing, for the purpose of maximizing processing efficiency and optimizing processing accuracy, a short-pulse laser beam with an appropriate wavelength can be selected according to the processing depth and aperture size requirements of the notch structure.

[0102] In some feasible embodiments, the wavelengths of the short-pulse laser beam include the infrared band, the green light band, and the ultraviolet band, and the wavelength is in the range of 343~1064nm. Among them, 343nm corresponds to the violet light wavelength, and it can be emitted by a ultraviolet nanosecond laser or a ultraviolet picosecond laser; 1064nm corresponds to the infrared wavelength, and it can be emitted by an infrared picosecond laser or an infrared femtosecond laser. In the interval of the green light band to the infrared band, the wavelength is in the range of 515nm to 1064nm.

[0103] The focused spot size of a laser beam is directly proportional to the wavelength of the laser beam. The focused spot size formed by a short-pulse laser beam with too short a wavelength is too small, which will lead to a decrease in processing efficiency, an elongation of the processing time, and an excessive processing time may also lead to an increase in thermal influence, resulting in carbonization of the groove wall. In addition, due to the production principle of solid-state lasers, the maximum output power of lasers with shorter wavelengths is lower, which is determined by the frequency doubling efficiency during the laser generation process. Therefore, the maximum output power of ultraviolet lasers is less than that of green or infrared band lasers. In order to make the energy density of the focused spot formed by the laser beam output by the ultraviolet laser large enough to quickly penetrate the circuit board, the size of the focused spot must be small, and a smaller-sized focused spot will significantly reduce the processing efficiency, elongate the processing time, and an excessive processing time may also lead to an increase in thermal influence, resulting in carbonization of the groove wall.

[0104] Select short-pulse laser beams in the green and infrared bands. The laser power is large, enabling the focused spot to have the characteristics of both high energy density and a relatively large size, which is conducive to improving the processing efficiency of the notch structure, reducing thermal influence, and thus reducing carbonization of the groove wall.

[0105] In some feasible embodiments, the wavelength of the short-pulse laser beam can be selected according to the thermal sensitivity characteristics of the material of the circuit board to be grooved.

[0106] It can be understood that when the wavelength of the short-pulse laser beam is too long, such as a short-pulse laser beam with an infrared wavelength, although it can form a large-sized focused spot and the laser with an infrared wavelength has a high power, both are conducive to efficient grooving processing. However, a large amount of heat will be generated during the processing of the short-pulse laser beam with an infrared wavelength, causing carbonization of the material and having an adverse impact on the processing quality of the hole structure.

[0107] In some feasible embodiments, a short-pulse laser beam in the green band can be selected for heat-sensitive materials. For example, when processing ABF (Ajinomoto Build-up Film) materials, a green picosecond laser or a green femtosecond laser is used; for materials that value processing efficiency but can tolerate a certain amount of heat influence, a short-pulse laser beam in the infrared band is selected. For example, when processing BT (Bismaleimide Triazine) resin materials, an infrared picosecond laser or an infrared femtosecond laser is used.

[0108] In an exemplary embodiment, control the roughing equipment to process an initial notch structure on the circuit board to be grooved. There is a preset interval distance between the initial notch structure and the contour position of the preset notch area, including:

[0109] Control the roughing equipment to process the initial notch structure on the circuit board to be grooved along the preset roughing trajectory.

[0110] Exemplarily, the rough machining trajectory can be pre-planned. Then, during actual grooving, the pre-planned rough machining trajectory is imported into the rough machining equipment, and then the machining tool of the rough machining equipment is controlled to move along the rough machining trajectory. Through the moving machining tool, an initial notch structure is formed on the circuit board to be grooved.

[0111] Before controlling the rough machining equipment to machine the initial notch structure on the circuit board to be grooved along the preset rough machining trajectory, the method further includes:

[0112] Determine the contour position of the notch area;

[0113] Locate the rough machining trajectory according to the contour position of the notch area, wherein the rough machining trajectory includes at least one of a straight trajectory and a curved trajectory, and the interval distance between the contour position of the notch area and the rough machining trajectory is 1.5 - 3 times the spot diameter of the laser beam used in the trimming process.

[0114] It should be noted that if the rough machining trajectory is far from the contour of the notch area and the spot diameter of the laser beam is small, the subsequent trimming time will be very long and the machining efficiency will be low. If the rough machining trajectory is too close to the contour of the notch area and the spot diameter of the laser beam is large, the laser energy density of the laser beam may be insufficient, and it may affect the circuit board area outside the notch area, resulting in damage to the circuit board area. In this way, it may reduce the stability after the chip is embedded in the notch area and cause looseness, and it may also affect the structure and function of other components in the circuit board area.

[0115] Among them, the contour position of the notch area can refer to the specific position of the boundary of the notch area on the circuit board to be grooved, and can be described by a set of coordinate data, which is used to determine the geometric shape and position of the notch area.

[0116] Exemplarily, during the machining design process of the notch area, the contour position of the notch area of the required notch structure can be determined, and then the trajectory is planned according to the contour position of the notch area to determine the rough machining trajectory. Among them, the determined rough machining trajectory can include at least one of a straight trajectory and a curved trajectory. For example, it can be a curved trajectory at the corner and a straight trajectory at non-corner positions; and the determined rough machining trajectory should make the interval distance between the contour position of the notch area and the rough machining trajectory be 1.5 - 3 times the spot diameter of the laser beam used in the trimming process, such as 1.5 times, 2 times, 3 times, etc. In this way, the number of trimming passes can be controlled within 2 - 3 passes, thereby improving the laser machining efficiency.

[0117] In an exemplary embodiment, controlling the rough machining equipment to machine the initial notch structure on the circuit board to be grooved, with a preset interval distance set between the initial notch structure and the preset contour position of the notch area, includes:

[0118] Control the roughing equipment to machine an initial notch structure on the circuit board to be grooved along a preset roughing trajectory.

[0119] Exemplarily, the roughing trajectory can be pre-planned. Then, during actual grooving, the pre-planned roughing trajectory is imported into the roughing equipment, and then the machining tool of the roughing equipment is controlled to move along the roughing trajectory. Through the moving machining tool, an initial notch structure is formed on the circuit board to be grooved.

[0120] Before controlling the roughing equipment to machine an initial notch structure on the circuit board to be grooved along a preset roughing trajectory, the method further includes:

[0121] Determine the contour position of the notch area and the first machining accuracy value of the roughing equipment;

[0122] Locate the roughing trajectory according to the contour position of the notch area and the first machining accuracy value.

[0123] It should be noted that if the roughing trajectory is far from the contour of the notch area, the subsequent trimming time will be very long and the machining efficiency will be low. If the roughing trajectory is too close to the contour of the notch area, the roughing may affect the circuit board area outside the notch area, resulting in damage to the circuit board area. In this way, it may not only lead to a decrease in the stability after the chip is embedded in the notch area and cause loosening, but also may affect the structure and function of other components in the circuit board area.

[0124] Among them, the contour position of the notch area can refer to the specific position of the boundary of the notch area on the circuit board to be grooved, which can be described by a set of coordinate data and is used to determine the geometric shape and position of the notch area.

[0125] The first machining accuracy value can refer to the accuracy that the roughing equipment can achieve during machining, and can include at least one of dimensional accuracy, shape accuracy, and position accuracy.

[0126] Exemplarily, during the machining design process of the notch area, the contour information of the notch area of the required notch structure and the roughing equipment information of the selected roughing equipment can be determined. After the machining design of the notch area is completed, the contour information of the notch area and the roughing equipment information can be obtained from the design result; then the contour position information of the notch area is extracted from the contour information of the notch area to determine the contour position of the notch area, and the machining accuracy information is extracted from the roughing equipment information to determine the first machining accuracy value of the roughing equipment.

[0127] After determining the contour position of the notch area and the first machining accuracy value of the rough machining equipment, the first machining accuracy value can be used as the distance threshold between the rough machining trajectory and the contour of the notch area. As long as the distance between the rough machining trajectory and the contour of the notch area exceeds this distance threshold, the rough machining equipment will not cause damage to the circuit board area. Therefore, outside the first machining accuracy value from the contour of the notch area, combined with other machining conditions such as the minimum movement distance, the rough machining trajectory can be planned, and the corresponding rough machining trajectory information can be generated based on the planned rough machining trajectory.

[0128] In this embodiment, positioning the rough machining trajectory based on the first machining accuracy value of the rough machining equipment can adapt to the actual conditions of the rough machining equipment, better control the distance between the rough machining trajectory and the contour of the machining area, and avoid causing damage to the circuit board area. When it is determined that no damage will be caused to the circuit board area, the distance between the rough machining trajectory and the contour of the notch area can be minimized as much as possible to improve the machining efficiency.

[0129] In an exemplary embodiment, positioning the rough machining trajectory according to the contour position of the notch area and the first machining accuracy value includes:

[0130] Performing a shrinking process on the contour position of the notch area based on the first machining accuracy value to obtain the rough machining trajectory, where the interval distance between the contour position of the notch area and the rough machining trajectory is equal to the first machining accuracy value.

[0131] Among them, the rough machining trajectory is obtained by inward shrinking the contour position of the notch area with the geometric center of the notch area as the reference point. Therefore, each contour line in the contour of the notch area corresponds one-to-one with each trajectory line in the rough machining trajectory, the corresponding contour line and trajectory line are parallel to each other, and the interval distance between each pair of contour lines and trajectory lines is equal to the interval distance between other pairs of contour lines and trajectory lines. The interval distance between the contour position of the notch area and the rough machining trajectory can be represented by the interval distance between any pair of contour lines and trajectory lines.

[0132] Exemplarily, based on the first machining accuracy value, the shrinking distance of each point on the contour of the notch area can be determined. Furthermore, the contour position of the notch area is shrunk inward to form a new ring, so that the interval distance between the new ring and the ring formed by the contour position of the notch area remains constant, all equal to the first machining accuracy value, and the position corresponding to the new ring is determined as the rough machining trajectory. For example, as Figure 5 shown, assuming the first machining accuracy value is Δd, the contour position 502 of the notch area can be shrunk inward until the interval distance between the shrunk rectangular frame and the contour position 502 of the notch area is equal to Δd, and the rough machining trajectory 504 is obtained.

[0133] In this embodiment, on the one hand, through the shrinking process, the distances between various positions on the initial grooving sidewall and the contour of the notch area can be made more uniform. In this way, the minimization of the residual material between the initial grooving sidewall and the contour of the notch area can be achieved when it is determined that no damage will be caused to the circuit board area. On the other hand, by making the interval distance between the contour position of the notch area and the rough machining trajectory equal to the first machining accuracy value, the minimization of the interval distance between the rough machining trajectory and the contour of the notch area can be achieved when it is determined that no damage will be caused to the circuit board area. Thus, the time required for trimming is further reduced, and the high-precision grooving processing efficiency of the circuit board is improved.

[0134] In an exemplary embodiment, the preset interval distance is 50 - 70 μm.

[0135] The machining accuracy of the machining equipment is about ±75 μm. For a machining equipment with slightly higher machining accuracy, the machining accuracy can reach 50 - 70 μm. To avoid damage to the circuit board area during rough machining or causing the notch area to be too large in size, the preset interval distance can be determined to be 50 - 70 μm to ensure that the preset interval distance is greater than the machining accuracy of the machining equipment, thereby avoiding damage to the circuit board area during rough machining.

[0136] In an exemplary embodiment, the laser processing equipment includes an ultrafast laser processing equipment, and the laser spot diameter corresponding to the ultrafast laser processing equipment is 25 - 35 μm.

[0137] When trimming the sidewall of the initial notch structure, it is usually carried out by controlling the laser beam to circle along the sidewall of the initial notch structure. For example, as Figure 6 shown, the laser spot 602 of the laser beam can circle along the sidewall of the initial notch structure between the contour 604 of the notch area and the sidewall 606 of the initial notch structure. It can be understood that when the preset interval distance is greater than the laser spot diameter of the laser beam, the laser beam can circle multiple times, and the laser processing range of each circle can partially overlap with the laser processing range of the adjacent circle, and the adjacent spots in the same circle can also partially overlap.

[0138] The preset interval distance, which is a multiple less than or equal to the laser spot diameter, can be used to trim the side wall of the initial slot to be closer to the contour of the slot opening area by winding multiple circles. When the preset interval distance is fixed, the larger the spot size, the smaller the multiple factor of the laser spot diameter, the fewer the number of circles to be wound, and the higher the processing efficiency. However, the energy at the spot will also decrease accordingly, and the laser beam needs to stay at each action point for a longer time to completely remove the material, resulting in a more significant thermal effect and a more obvious taper. On the contrary, if the spot size is too small and the multiple factor of the laser spot diameter is too large, the number of circles to be wound increases, and the processing efficiency increases exponentially. Therefore, when the laser spot diameter corresponding to the laser processing equipment is determined to be 25 - 35 μm and the preset interval distance is 50 - 70 μm, a spot with a diameter of 25 - 35 μm can complete the processing by winding two circles, and the energy concentrated by the 25 - 35 μm spot can remove the material within a short residence time, without causing carbonization of the processed surface and can also significantly reduce the side wall taper.

[0139] In an exemplary embodiment, the laser processing equipment is controlled to trim the side wall of the initial slot structure to remove the preset interval distance and form a target slot structure at the position of the preset slot opening area contour, including:

[0140] The laser processing equipment is controlled to emit a laser beam to the circuit board to be slotted, and based on the rough machining trajectory information and the slot opening area contour information, the laser beam is controlled to move multiple circles from the side wall of the initial slot structure between the side wall of the initial slot structure and the position of the preset slot opening area contour from the inner layer to the outer layer, so as to trim the side wall of the initial slot structure outward to the position of the preset slot opening area contour.

[0141] It should be noted that the moving path of the laser beam during the trimming of the side wall should ensure that the action range of the laser beam covers the range between the side wall of the initial slot structure and the position of the preset slot opening area contour, so as to trim the side wall of the initial slot structure to be close to the slot opening area contour and obtain a target slot structure matching the size of the slot opening area. However, if the moving path of the laser beam is trimmed in a way of gradually expanding from the starting point, for example, first machining radially outward from the side wall of the initial slot structure to the slot opening area contour, and then folding back to the side wall of the initial slot structure, and repeating such a folding-back machining, the laser energy is continuously superimposed for several adjacent times, and the accumulation of laser energy will lead to an intensified thermal effect, easily causing carbonization of the side wall and a relatively obvious side wall taper.

[0142] Exemplarily, after forming the initial notch structure, the laser processing equipment is controlled to emit a laser beam towards the circuit board to be notched. Synchronously, based on the rough machining trajectory information and the notch area contour information, the movement range of the laser beam is defined. The laser beam is controlled to start from any position on the side wall of the initial notch structure and circle along the side wall of the initial notch structure. By using the laser beam to eliminate the outermost layer of the side wall of the initial notch structure, after the outermost layer is eliminated in a circle, the material located outside the original outermost layer is exposed to form a new outermost layer. The laser beam can be controlled to move outwards to the new outermost layer and circle again, and so on until the new outermost layer is the notch area contour, and then the target notch structure matching the notch area size can be obtained.

[0143] In this embodiment, by means of trimming in a circle from the inner layer to the outer layer, after laser processing at each machining point, it is possible to move away from the machining point at a faster speed, reduce energy aggregation, thereby reducing the thermal influence and reducing the side wall taper.

[0144] It should be understood that although the steps in the flowcharts involved in the above embodiments are sequentially shown according to the indications of the arrows, these steps are not necessarily executed in the order indicated by the arrows. Unless there is a clear indication in this article, the execution of these steps has no strict order limit, and these steps can be executed in other orders. Moreover, at least a part of the steps in the flowcharts involved in the above embodiments may include multiple steps or multiple stages. These steps or stages are not necessarily executed at the same time, but can be executed at different times. The execution order of these steps or stages is not necessarily sequential, but can be executed alternately or alternately with at least a part of other steps or steps or stages in other steps.

[0145] Based on the same inventive concept, the embodiment of the present application also provides a high-precision circuit board notching processing system for implementing the high-precision circuit board notching processing method involved above. The solution provided by this device to solve the problem is similar to the solution described in the above method. Therefore, the specific limitations in one or more embodiments of the high-precision circuit board notching processing system provided below can refer to the limitations on the high-precision circuit board notching processing method in the above text, and will not be repeated here.

[0146] As Figure 7 shown, the high-precision circuit board notching processing system includes a controller 706, a rough machining device 702, and a laser processing device 704; the controller 706 is configured to:

[0147] Control the rough machining device 702 to machine an initial notch structure on the circuit board to be notched; there is a preset interval distance between the initial notch structure and the position of the preset notch area contour;

[0148] Control the laser processing device 704 to trim the side walls of the initial notch structure to remove the preset spacing distance and form a target notch structure.

[0149] In an exemplary embodiment, the controller can also implement the steps in the above method embodiments.

[0150] In an exemplary embodiment, a computer device is provided. The computer device can be a terminal, and its internal structure diagram can be as Figure 8 shown. The computer device includes a processor, a memory, an input / output interface, a communication interface, a display unit, and an input device. Among them, the processor, the memory, and the input / output interface are connected through a system bus, and the communication interface, the display unit, and the input device are connected to the system bus through the input / output interface. Among them, the processor of the computer device is used to provide computing and control capabilities. The memory of the computer device includes a non-volatile storage medium and an internal memory. The non-volatile storage medium stores an operating system and a computer program. The internal memory provides an environment for the operation of the operating system and the computer program in the non-volatile storage medium. The input / output interface of the computer device is used to exchange information between the processor and external devices. The communication interface of the computer device is used to communicate with external terminals in a wired or wireless manner. The wireless manner can be achieved through WIFI, a mobile cellular network, near field communication (NFC), or other technologies. When the computer program is executed by the processor, it implements a high-precision slotting processing method for a circuit board. The display unit of the computer device is used to form a visually visible picture, which can be a display screen, a projection device, or a virtual reality imaging device. The display screen can be a liquid crystal display screen or an electronic ink display screen. The input device of the computer device can be a touch layer covered on the display screen, or a button, a trackball, or a touchpad provided on the housing of the computer device, or an external keyboard, a touchpad, or a mouse, etc.

[0151] Those skilled in the art can understand that Figure 8 the structure shown in

[0152] merely represents a block diagram of some structures related to the solution of the present application, and does not constitute a limitation on the computer device to which the solution of the present application is applied. The specific computer device may include more or fewer components than those shown in the figure, or combine some components, or have different component arrangements.

[0153] In one embodiment, a computer-readable storage medium is provided, on which a computer program is stored, and when the computer program is executed by a processor, the steps in the foregoing method embodiments are implemented.

[0154] In one embodiment, a computer program product is provided, including a computer program, and when the computer program is executed by a processor, the steps in the foregoing method embodiments are implemented.

[0155] It should be noted that the user information (including but not limited to user device information, user personal information, etc.) and data (including but not limited to data for analysis, stored data, displayed data, etc.) involved in this application are all information and data authorized by the user or fully authorized by all parties, and the collection, use, and processing of relevant data need to comply with relevant regulations.

[0156] Those of ordinary skill in the art can understand that all or part of the processes of implementing the methods in the above embodiments can be completed by instructing relevant hardware through a computer program. The computer program can be stored in a non-volatile computer-readable storage medium. When the computer program is executed, it can include the processes of the embodiments of the above methods. Among them, any reference to a memory, database, or other medium used in the embodiments provided in this application can include at least one of non-volatile memory and volatile memory. Non-volatile memory can include read-only memory (ROM), magnetic tape, floppy disk, flash memory, optical memory, high-density embedded non-volatile memory, resistive random access memory (ReRAM), magnetoresistive random access memory (MRAM), ferroelectric random access memory (FRAM), phase change memory (PCM), graphene memory, etc. Volatile memory can include random access memory (RAM) or external cache memory, etc. By way of illustration and not limitation, RAM can be in various forms, such as static random access memory (SRAM) or dynamic random access memory (DRAM), etc. The databases involved in the embodiments provided in this application can include at least one of relational databases and non-relational databases. Non-relational databases can include distributed databases based on blockchain, etc., without limitation. The processors involved in the embodiments provided in this application can be general-purpose processors, central processing units, graphics processing units, digital signal processors, programmable logic devices, data processing logics based on quantum computing, artificial intelligence (AI) processors, etc., without limitation.

[0157] In one embodiment, a high-precision grooving method for a circuit board is provided. The method includes:

[0158] Processing an initial notch structure on the circuit board to be grooved, with a preset interval distance set between the initial notch structure and the contour position of the preset notch area;

[0159] Trimming the side walls of the initial notch structure to remove the preset interval distance and form a target notch structure at the contour position of the preset notch area.

[0160] It should be noted that the high-precision grooving processing method for circuit boards provided in this embodiment is a process method, which can be implemented by at least one of manual and machine. Except for the implementation subject not being limited, others can be similar to the above high-precision grooving processing method for circuit boards with automatic control. This embodiment can also implement the steps in the above method embodiments, and this embodiment will not elaborate too much here.

[0161] The technical features of the above embodiments can be combined arbitrarily. For the sake of concise description, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, it should be considered as the scope recorded in this application.

[0162] The above embodiments only express several implementation manners of this application, and their descriptions are relatively specific and detailed, but they should not be construed as limiting the patent scope of this application. It should be noted that for those of ordinary skill in the art, without departing from the concept of this application, several deformations and improvements can still be made, and these all belong to the protection scope of this application. Therefore, the protection scope of this application should be subject to the appended claims.

Claims

1. A high-precision grooving processing method for a circuit board, characterized in that, The method includes: Controlling a rough machining device to machine an initial notch structure on a circuit board to be notched, where a preset interval distance is set between the initial notch structure and the contour position of a preset notch area; Controlling a laser machining device to trim the side wall of the initial notch structure to remove the preset interval distance and form a target notch structure at the contour position of the preset notch area.

2. The method according to claim 1, characterized in that The rough machining device includes at least one of a mechanical machining device and a laser rough machining device, and the mechanical machining device includes at least one of a mechanical router, a mechanical drill, and a CNC punching machine.

3. The method according to claim 2, characterized in that, The laser rough machining device is the laser machining device.

4. The method according to claim 1, characterized in that, The laser machining device includes a short-pulse laser machining device.

5. The method according to claim 4, wherein The wavelength of the short-pulse laser beam emitted by the short-pulse laser machining device is in the green light band to the infrared band.

6. The method according to claim 1, characterized in that The controlling the rough machining device to machine an initial notch structure on a circuit board to be notched, where a preset interval distance is set between the initial notch structure and the contour position of a preset notch area, includes: Controlling the rough machining device to machine an initial notch structure on the circuit board to be notched along a preset rough machining trajectory; Before the controlling the rough machining device to machine an initial notch structure on the circuit board to be notched along a preset rough machining trajectory, the method further includes: Determining the contour position of the notch area; Positioning the rough machining trajectory according to the contour position of the notch area, where the rough machining trajectory includes at least one of a straight trajectory and a curved trajectory, and the interval distance between the contour position of the notch area and the rough machining trajectory is 1.5 - 3 times the spot diameter of the laser beam used in the trimming process.

7. The method according to claim 1, wherein The controlling the rough machining device to machine an initial notch structure on a circuit board to be notched, where a preset interval distance is set between the initial notch structure and the contour position of a preset notch area, includes: Controlling the rough machining device to machine an initial notch structure on the circuit board to be notched along a preset rough machining trajectory; Before the controlling the rough machining device to machine an initial notch structure on the circuit board to be notched along a preset rough machining trajectory, the method further includes: Determining the contour position of the notch area and the first machining accuracy value of the rough machining device; Positioning the rough machining trajectory according to the contour position of the notch area and the first machining accuracy value.

8. The method according to claim 7, characterized in that, The positioning the rough machining trajectory according to the contour position of the notch area and the first machining accuracy value includes: Performing a shrinking process on the contour position of the notch area based on the first machining accuracy value to obtain the rough machining trajectory, where the interval distance between the contour position of the notch area and the rough machining trajectory is equal to the first machining accuracy value.

9. The method according to claim 1, wherein The preset interval distance is 50 - 70μm.

10. The method according to claim 9, wherein The laser machining device includes an ultrafast laser machining device, and the laser spot diameter corresponding to the ultrafast laser machining device is 25 - 35μm.

11. The method according to any one of claims 1 to 10, characterized in that, The controlling the laser machining device to trim the side wall of the initial notch structure to remove the preset interval distance and form a target notch structure at the contour position of the preset notch area, includes: Control a laser processing device to emit a laser beam towards a circuit board to be grooved, and control the laser beam to start from the side wall of the initial notch structure and move multiple circles from the inner layer to the outer layer between the side wall of the initial notch structure and the contour position of the preset notch area, so as to trim the side wall of the initial notch structure outwards to the contour position of the preset notch area.

12. A high-precision grooving processing system for a circuit board, characterized in that, The system includes a controller, a laser processing device and a rough processing device; the controller is configured to: Control the rough processing device to process an initial notch structure on the circuit board to be grooved, and a preset interval distance is set between the initial notch structure and the contour position of the preset notch area; Control the laser processing device to trim the side wall of the initial notch structure, so as to remove the preset interval distance and form a target notch structure at the contour position of the preset notch area.

13. A computer device, comprising a memory and a processor, the memory storing a computer program, characterized in that, When the processor executes the computer program, the steps of the method according to any one of claims 1 to 11 are implemented.

14. A computer-readable storage medium having a computer program stored thereon, characterized in that, When the computer program is executed by a processor, the steps of the method according to any one of claims 1 to 11 are implemented.

15. A computer program product, comprising a computer program, characterized in that, When the computer program is executed by a processor, the steps of the method according to any one of claims 1 to 11 are implemented.

16. A workpiece, characterized in that, The workpiece is processed by the method according to any one of claims 1 to 11.

17. A high-precision grooving processing method for a circuit board, characterized in that, The method includes: Process an initial notch structure on the circuit board to be grooved, and a preset interval distance is set between the initial notch structure and the contour position of the preset notch area; Trim the side wall of the initial notch structure, so as to remove the preset interval distance and form a target notch structure at the contour position of the preset notch area.

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