Novel sintering device and method for silicon carbide embedded core-embedded module packaging circuit board

Abstract

The invention discloses a novel silicon carbide embedded core-embedded module packaging circuit board sintering device and method, and relates to the technical field of sintering processes. The device comprises a machine table, and a plurality of stations distributed at intervals are arranged on the machine table and sequentially comprise a feeding station, a plurality of preheating stations, a sintering station, a plurality of cooling stations and a discharging station; the lifting mechanisms are arranged on the machine table and located on the two sides of the multiple stations; the supporting mechanisms are located on the two sides of the multiple stations and movably connected with the lifting mechanism. The driving mechanism is arranged on the machine table and is in transmission connection with the supporting mechanism; and the sintering mechanism is arranged above the sintering station, the sintering mechanism can ascend and descend in the vertical direction, the sintering mechanism comprises a machining bin, an upper pressing die capable of ascending and descending is arranged in the machining bin, and a spray head used for providing inert gas is further arranged in the machining bin. According to the novel sintering device for the silicon carbide embedded core-embedded module packaging circuit board, the sintering quality and the sintering efficiency can be improved.

Description

Technical Field

[0001] The invention relates to the technical field of circuit board sintering, and in particular to a novel silicon carbide embedded buried core module package circuit board sintering device and method. Background Art

[0002] In the production process of circuit boards, a sintering process is required. However, since circuit boards (especially flexible circuit boards) easily absorb environmental moisture, it is easy for moisture to vaporize instantly during sintering, resulting in substrate delamination, blistering, or solder spatter. After sintering, it is easy for excessive grain growth to occur due to excessive temperature. In addition, the existing circuit board sintering process has the problem of low efficiency. Summary of the invention

[0003] The present invention aims to solve at least one of the technical problems existing in the prior art. To this end, the present invention proposes a novel sintering device and method for a silicon carbide embedded buried core module package circuit board, which can improve sintering efficiency and sintering quality.

[0004] On the one hand, a novel silicon carbide embedded buried core module package circuit board sintering device according to an embodiment of the present invention comprises: A machine platform, wherein a plurality of stations distributed at intervals are arranged on the machine platform, including a loading station, a plurality of preheating stations, a sintering station, a plurality of cooling stations and a unloading station in sequence, the preheating temperature of the plurality of preheating stations gradually increases, and the cooling rate of the plurality of cooling stations gradually decreases, each of the preheating station, the sintering station and the cooling station is provided with a bearing platform, the bearing platform is provided with a first positioning member, the bearing platform of the sintering station includes a base and a support platform, and the support platform is liftably arranged in the middle of the base; A lifting mechanism is arranged on the machine platform and is located on both sides of the plurality of workstations; A support mechanism, located on both sides of the plurality of workstations and movably connected to the lifting mechanism, the lifting mechanism being used to drive the support mechanism to rise or fall, the support mechanism comprising a plurality of retractable support components, and the support components being provided with a second positioning member; A driving mechanism, arranged on the machine platform and in driving connection with the supporting mechanism, the driving mechanism being used to drive the supporting mechanism to move in a distribution direction of the plurality of workstations; The sintering mechanism is arranged above the sintering station. The sintering mechanism can rise and fall in the vertical direction. The sintering mechanism includes a processing chamber, a liftable upper die is arranged inside the processing chamber, and a nozzle for providing inert gas is also arranged inside the processing chamber.

[0005] According to some embodiments of the present invention, the lifting mechanism includes two lifting devices symmetrically arranged on both sides of a plurality of the workstations. Each lifting device includes: A mounting plate, at the bottoms of both ends of the mounting plate, inclined blocks are respectively arranged. The bottoms of both ends of the mounting plate are respectively connected to the surface of the machine table through elastic connection devices, and the support mechanism is arranged on the mounting plate; A driver, located in the middle below the mounting plate. Telescopic devices are arranged at both ends of the driver. The bottom of one side of each inclined block close to the driver is higher than the bottom of the side far from the driver. The output end of each telescopic device is connected to a slider. Each slider is slidably arranged in a corresponding slide rail, and a pulley abutted against the bottom of the inclined block is arranged at the top end of the slider; A guide rod, arranged on the machine table. A first guide groove is arranged on the side of the mounting plate, and the first guide groove is sleeved outside the guide rod.

[0006] According to some embodiments of the present invention, the support mechanism includes two support components symmetrically arranged on both sides of a plurality of the workstations. The support component includes: A plurality of guide blocks, the plurality of guide blocks are arranged at intervals on the surface of the mounting plate, and a second guide groove is arranged on the side of the guide block facing the workstation; A support rod, the support rod passes through the second guide grooves of the plurality of guide blocks. One end of the support rod is connected to the drive mechanism, and a plurality of telescopic components are arranged on the side of the support rod facing the workstation. Each telescopic component is connected to a support plate; Wherein, the support plate is used for placing the plate to be processed. Second positioning holes corresponding to the second positioning members are arranged at the corners of the plate to be processed, and first positioning holes corresponding to the first positioning members are arranged in the middle of the plate to be processed. According to some embodiments of the present invention, a blanking mechanism is arranged on one side of the blanking workstation away from the cooling workstation. The blanking mechanism includes: A lifting table, multiple layers of first placement tables are arranged at intervals in the vertical direction on the lifting table. Each layer of the first placement table includes two first placement blocks arranged oppositely. Cooling air holes are arranged between adjacent layers of the first placement tables. A through hole is opened on the machine table corresponding to the lifting table, and the lifting table passes through the through hole; A transfer table, located below the machine table and passing through the inside of the lifting table. The two first placement blocks of the first placement table are respectively located on both sides of the transfer table; A grasping manipulator, arranged on the surface of the machine table and located on the side of the lifting table away from the cooling workstation.

[0007] According to some embodiments of the present invention, the driving mechanism includes: A fixing frame, arranged on the surface of the machine table; A feeding air cylinder, arranged on the fixing frame; A connecting plate, the two sides of the connecting plate are connected to the supporting mechanisms on both sides of multiple workstations, and the middle part of the connecting plate is connected to the output shaft of the feeding air cylinder. According to some embodiments of the present invention, the novel sintering device for a silicon carbide embedded core module encapsulated circuit board further includes a limiting mechanism, and the limiting mechanism is used to detect the position of the supporting mechanism and limit the moving stroke of the feeding air cylinder.

[0008] On the other hand, according to the circuit board sintering method of the embodiments of the present invention, which is applied to the above-mentioned novel sintering device for a silicon carbide embedded core module encapsulated circuit board, the circuit board sintering method includes: Initialization, making the first supporting component located at the loading station, and the remaining supporting components are respectively located at each preheating station, sintering station and each cooling station; Placing a plate to be processed on the first supporting component, and positioning the plate to be processed through the second positioning member and the second positioning hole; a first positioning hole corresponding to the first positioning member is arranged in the middle of the plate to be processed, and a second positioning hole corresponding to the second positioning member is arranged at the corner of the plate to be processed; Driving all the supporting components to move to the next station through the driving mechanism, so that the first supporting component is located at the first preheating station; Driving the supporting component to descend through the lifting mechanism, so that the plate to be processed on the first supporting component is placed on the bearing table of the first preheating station, and positioning the plate to be processed through the first positioning member and the first positioning hole; Driving the supporting component to continue to descend through the lifting mechanism, so that the first positioning member leaves the first positioning hole, and the supporting component contracts; Moving the first supporting component to the loading station through the driving mechanism, the supporting component extends, and the supporting component is lifted and reset through the lifting mechanism; Placing the next plate to be processed on the first supporting component, and returning to the step of driving all the supporting components to move to the next station through the driving mechanism, so that the first supporting component is located at the first preheating station; After the plate to be processed passes through multiple preheating stations in sequence for progressive preheating, the sintering mechanism sinters the plate to be processed. After sintering, the plate to be processed passes through multiple cooling stations in sequence for progressive cooling, and the cooled plate to be processed is placed at the blanking station.

[0009] According to some embodiments of the present invention, the sintering of the plate to be processed by the sintering mechanism includes: After the support assembly places the plate to be processed on the support table, the support assembly contracts, and the support table descends to the surface of the base, so that the base and the support table support the plate to be processed; The sintering mechanism drives the processing chamber to descend to the surface of the machine table, so that the processing chamber surrounds the base; After the processing chamber provides inert gas through the nozzle, the upper pressing die descends to contact the plate to be processed to provide sintering pressure; After sintering the plate to be processed with a preset sintering pressure and sintering temperature, the upper pressing die and the processing chamber both rise and reset.

[0010] According to some embodiments of the present invention, a blanking mechanism is provided on one side of the blanking station away from the cooling station. The blanking mechanism includes a lifting table, a transfer table, and a gripping manipulator. The lifting table is vertically spaced with multiple layers of first placement tables. Each layer of the first placement table includes two first placement blocks arranged oppositely. Cooling air holes are provided between adjacent layers of the first placement tables. The machine table is provided with through holes corresponding to the lifting table, and the lifting table passes through the through holes; the transfer table is located below the machine table and passes through the inside of the lifting table. The two first placement blocks of the first placement table are respectively located on both sides of the transfer table; the gripping manipulator is provided on the surface of the machine table and is located on one side of the lifting table away from the blanking station; The placement of the cooled plate to be processed at the blanking station includes: When the support assembly moves the cooled plate to be processed to the blanking station, the gripping manipulator grabs the plate to be processed and places it on the first placement block of the corresponding layer of the first placement table, and provides cold air to the plate to be processed on the first placement block through the corresponding cooling air holes; After each plate to be processed is placed on the lifting table, the lifting table descends by the distance of one layer of the first placement table, and the blowing efficiency of the cooling air holes gradually decreases; When the first placement block descends to the transfer table, the plate to be processed on the first placement block is transferred to the transfer table; The transfer table conveys the plate to be processed to the blanking location; When placing the workpiece plate to be processed on the first placement table at the top layer of the lifting table, the lifting table directly descends to the surface of the transfer table, transfers the workpiece plates on all the first placement tables of the lifting table to the transfer table, and then the lifting table ascends and resets.

[0011] According to some embodiments of the present invention, a loading mechanism is further included at the loading station. The loading mechanism includes a loading table and a loading manipulator. The loading table includes multiple layers of retractable second placement tables. Both sides of each layer of the second placement table are provided with retractable second placement blocks. Each layer of the second placement table is used to place the corresponding workpiece plate to be processed. The loading manipulator is located on the side of the loading table away from the preheating station; Placing the workpiece plate to be processed on the first support assembly and positioning the workpiece plate through the second positioning member and the second positioning hole includes: When the support assembly is in a contracted state, the loading manipulator adsorbs the workpiece plate to be processed from the second placement table at the top layer, moves above the support assembly, and the second placement blocks of the second placement table at the top layer contract; When the support assembly is in an extended state, the loading manipulator places the workpiece plate on the support assembly and positions the workpiece plate through the first positioning member and the first positioning hole.

[0012] On the other hand, according to the storage medium of the embodiment of the present invention, the storage medium stores computer-executable instructions, and the computer-executable instructions are used to make a computer execute the circuit board sintering method described in the above embodiments.

[0013] The novel silicon carbide embedded core module packaging circuit board sintering device and method according to the embodiment of the present invention at least have the following beneficial effects: by preheating the workpiece plate to be processed multiple times before sintering and cooling the workpiece plate multiple times after sintering, and the preheating temperature gradually increases and the cooling rate gradually decreases, so as to improve the sintering quality of the workpiece plate and increase the product yield; through the mutual cooperation of the lifting mechanism, the support mechanism and the driving mechanism, the automatic transportation of the workpiece plate is realized, and the sintering rate of the workpiece plate is increased; by setting the processing chamber and the nozzle, an inert gas is provided for the sintering process, so as to prevent the workpiece plate from being oxidized in a high-temperature environment.

[0014] The additional aspects and advantages of the present invention will be partially given in the following description, partially become obvious from the following description, or be understood through the practice of the present invention. Description of the Drawings

[0015] The above and / or additional aspects and advantages of the present invention will become obvious and easy to understand from the description of the embodiments in conjunction with the following drawings, where: Figure 1 Schematic structural diagram of the sintering device for the novel silicon carbide embedded core module packaging circuit board according to an embodiment of the present invention; Figure 2 Schematic structural diagram of the sintering device for the novel silicon carbide embedded core module packaging circuit board according to an embodiment of the present invention after removing the plate to be processed; Figure 3 is Figure 2 Enlarged schematic diagram of part A shown; Figure 4 Schematic structural diagram of the plate to be processed according to an embodiment of the present invention; Figure 5 is Figure 2 Enlarged schematic diagram of part B shown; Figure 6 Schematic structural diagram of another perspective of the sintering device for the novel silicon carbide embedded core module packaging circuit board according to an embodiment of the present invention; Figure 7 is Figure 6 Enlarged schematic diagram of part C shown; Figure 8 Flow chart of the steps of the circuit board sintering method according to an embodiment of the present invention; Reference numerals: Machine platform 100, loading station 110, preheating station 120, sintering station 130, cooling station 140, unloading station 150, carrier table 160, base 161, support table 162, second positioning member 170, through hole 180, first positioning member 190; Lifting mechanism 200, mounting plate 210, inclined block 211, elastic connection device 212, first guide groove 213, driver 220, telescopic device 221, slider 222, slide rail 223, pulley 224, guide rod 230; Support mechanism 300, support assembly 310, guide block 311, support rod 312, telescopic assembly 313, support plate 314; Drive mechanism 400, fixed frame 410, feeding cylinder 420, connecting plate 430; Sintering mechanism 500, processing chamber 510; Unloading mechanism 600, lifting platform 610, first placing table 611, first placing block 612, transfer table 620, grasping manipulator 630, lifting drive device 640; Limiting mechanism 700; Plate to be processed 800, second positioning hole 810, first positioning hole 820; Control mechanism 900. Detailed implementation manners

[0016] Embodiments of the present invention will be described in detail below. Examples of the embodiments are shown in the accompanying drawings, where the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below by referring to the drawings are exemplary and are only used to explain the present application and should not be construed as a limitation to the present application. For the step numbers in the following embodiments, they are only set for the convenience of explanation and illustration, and no limitation is imposed on the order between the steps. The execution order of each step in the embodiments can be adaptively adjusted according to the understanding of those skilled in the art.

[0017] In the description of the present invention, it should be understood that with respect to the orientation description, such as the orientation or positional relationship indicated by up, down, front, back, left, right, etc., is based on the orientation or positional relationship shown in the accompanying drawings. It is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus should not be construed as a limitation to the present invention.

[0018] The terms "first", "second", "third", "fourth", etc. in the description and claims of the present invention and the accompanying drawings are used to distinguish different objects, rather than to describe a specific order. In addition, the terms "comprising" and "having" and any variations thereof are intended to cover non-exclusive inclusion. For example, a process, method, system, product, or device that includes a series of steps or units is not limited to the listed steps or units, but optionally further includes steps or units not listed, or optionally further includes other steps or units inherent to these processes, methods, products, or devices.

[0019] Referring to "embodiments" in the present invention means that a specific feature, structure, or characteristic described in connection with the embodiments can be included in at least one embodiment of the present invention. The phrase appearing in various positions in the specification does not necessarily refer to the same embodiment, nor is it an independent or alternative embodiment mutually exclusive with other embodiments. Those skilled in the art will explicitly and implicitly understand that the embodiments described herein can be combined with other embodiments.

[0020] In the production process of a circuit board, a sintering process needs to be carried out. However, since the circuit board (especially a flexible circuit board) is prone to absorbing environmental moisture, phenomena such as substrate delamination, blistering, or solder splash caused by instantaneous gasification of moisture during sintering are likely to occur; after sintering, problems such as excessive grain growth due to too high temperature are likely to occur. In addition, the existing sintering process of circuit boards has the problem of low efficiency.

[0021] To this end, an embodiment of the present invention provides a novel sintering device and method for a silicon carbide embedded buried core module packaged circuit board, which preheats the board to be processed multiple times before sintering and cools the board to be processed multiple times after sintering, and the preheating temperature gradually increases and the cooling rate gradually decreases, thereby improving the sintering quality of the board to be processed and improving the product yield; through the mutual cooperation of the lifting mechanism, the supporting mechanism and the driving mechanism, the automatic transportation of the board to be processed is realized, and the sintering rate of the board to be processed is improved; by setting a processing chamber and a nozzle, an inert gas is provided for the sintering process, thereby preventing the board to be processed from being oxidized in a high temperature environment.

[0022] The novel silicon carbide embedded buried core module package circuit board sintering device and method according to the embodiment of the present invention will be described in detail below with reference to the accompanying drawings.

[0023] On the one hand, if Figure 1 As shown, the embodiment of the present invention proposes a novel sintering device for a silicon carbide embedded core module package circuit board, the device comprising: a machine platform 100, a lifting mechanism 200, a supporting mechanism 300, a driving mechanism 400 and a sintering mechanism 500; wherein, a plurality of intervally distributed workstations are arranged on the machine platform 100, including a loading station 110, a plurality of preheating stations 120, a sintering station 130, a plurality of cooling stations 140, and a unloading station 150 from right to left, the preheating temperature of the plurality of preheating stations 120 gradually increases, and the cooling rate of the plurality of cooling stations 140 gradually decreases; as shown in FIG. Figure 2 and Figure 3 As shown, each preheating station 120, sintering station 130 and cooling station 140 is provided with a carrier 160, and the carrier 160 is provided with a first positioning member 190. The carrier 160 of the sintering station 130 also includes a base 161 and a support platform 162, and the support platform 162 is escalably arranged in the middle of the base 161; the lifting mechanism 200 is arranged on the machine 100 and is located on both sides of the plurality of stations; the support mechanism 300 is located on both sides of the plurality of stations and is movably connected to the lifting mechanism 200, and the lifting mechanism 200 is used to drive the support mechanism 300 to rise or fall, and the support mechanism 300 includes a plurality of A retractable support assembly 310 is provided, and the support assembly 310 is provided with a second positioning member 170; a driving mechanism 400 is provided on the machine platform 100 and is transmission-connected with the support mechanism 300, and the driving mechanism 400 is used to drive the support mechanism 300 to move in the distribution direction (i.e., the left and right direction) of multiple stations; a sintering mechanism 500 is provided above the sintering station 130, and the sintering mechanism 500 can rise and fall in the vertical direction, and the sintering mechanism 500 includes a processing chamber 510, and a liftable upper die is provided inside the processing chamber 510, and a nozzle for providing inert gas is also provided inside the processing chamber 510.

[0024] Specifically, the novel sintering device for a silicon carbide embedded core module packaging circuit board according to an embodiment of the present invention is used for automatically sintering a to-be-processed board 800. As Figure 4As shown, in this example, the plate 800 to be processed is provided with second positioning holes 810 at four corners and a first positioning hole 820 in the middle. When sintering the plate 800 to be processed, first load the plate 800 to be processed and place it at the loading station 110. For the loading station 110, preheating station 120, sintering station 130, and cooling station 140, there are corresponding support components 310, and the support components 310 are provided with second positioning members 170. Therefore, when loading, place the plate 800 to be processed on the support component 310 at the loading station 110, so that the second positioning members 170 of the support component 310 pass through the four second positioning holes 810 of the plate 800 to be processed, realizing the positioning of the plate 800 to be processed. After placing the plate 800 to be processed, drive the support mechanism 300 to move one station from right to left through the driving mechanism 400. At this time, all support components 310 move one station to the left, so that the support component 310 at the loading station 110 moves to the first preheating station 120, the support component 310 at the first preheating station 120 moves to the second preheating station 120, and so on. The support component 310 at the last preheating station 120 moves to the sintering station 130, the support component 310 at the sintering station 130 moves to the first cooling station 140, and the support component 310 at the first cooling station 140 moves to the second cooling station 140, and so on. At this time, the plate 800 originally located at the loading station 110 moves to the first preheating station 120 and is located above the first preheating station 120. Subsequently, drive the entire support mechanism 300 to descend through the lifting mechanism 200, so that the plate 800 to be processed is placed on the carrier table 160, and the first positioning member 190 of the carrier table 160 just passes through the first positioning hole 820 of the plate 800 to be processed, realizing the support and positioning of the plate 800 to be processed. Subsequently, the lifting mechanism 200 further drives the support mechanism 300 to descend, so that the second positioning member 170 leaves the second positioning hole 810, separating the support component 310 from the plate 800 to be processed; subsequently, the driving mechanism 400 drives the support mechanism 300 to move one station from left to right, so that each support component 310 returns to its original station again, that is, the support component 310 located at the first preheating station 120 returns to the loading station 110, and the remaining support components 310 all move one station to the left. At the same time, the lifting mechanism 200 drives the entire support mechanism 300 to rise, so that each support component 310 is reset. Repeating the above process, the plate 800 to be processed can be continuously transported from right to left, and the support component 310 at each station can transport the plate 800 to be processed at the current station to the next station, so that each plate 800 to be processed passes through the loading station 110, multiple preheating stations 120, sintering station 130, cooling station 140 in sequence, and finally reaches the unloading station 150.It should be noted that at the blanking station 150, a carrier table can also be provided to receive the to-be-processed plate 800 for blanking.

[0025] It should be noted that in the embodiment of the present application, there are multiple preheating stations 120, and the preheating temperature of each preheating station 120 gradually increases from right to left, so as to perform progressive preheating on the to-be-processed plate 800. The temperature during the first preheating is relatively low, mainly used to remove the environmental moisture absorbed on the surface of the to-be-processed plate 800, and avoid substrate delamination or solder joint spattering caused by rapid gasification of water during sintering. The temperature of the secondary preheating is relatively high, used to further evaporate the residual solvent and trace moisture in the deep layer of the to-be-processed plate 800, and reduce the risk of defects such as voids and sand holes after sintering. It should be noted that in this example, two preheating stations 120 are provided. In actual applications, more preheating stations 120 can also be provided to perform multiple preheatings on the to-be-processed plate 800, thereby improving the sintering quality.

[0026] Such as Figure 2As shown, in this example, the carrier table 160 of the sintering station 130 further includes a base 161 and a support table 162. The support table 162 is vertically movably arranged in the middle of the base 161, and the first positioning member 190 of the carrier table 160 is arranged on the support table 162. In the initial state, the support table 162 rises to the highest position, facilitating the reception of the plate to be processed 800 by the support table 162 when the support assembly 310 descends. Meanwhile, in this example, the support assembly 310 can be telescopic. When the support assembly 310 carries the plate to be processed 800, it is in the extended state. However, after the support assembly 310 places the plate to be processed 800 on the carrier table 160 and disengages from the plate to be processed 800, the support assembly 310 will change to the contracted state, thereby avoiding interfering with the descent of the plate to be processed 800 when the support table 162 drives the plate to be processed 800 to descend. After the support table 162 receives the plate to be processed 800, it will drive the plate to be processed 800 to descend to the surface of the base 161. At this time, the surface of the support table 162 is flush with the surface of the base 161, and the plate to be processed 800 is supported by the support table 162 and the base 161 together. Through this solution, it is possible to avoid the sintering pressure provided by the sintering mechanism 500 not being evenly applied to the plate to be processed 800 because the four sides of the plate to be processed 800 are not supported by the support table 162 during the sintering of the plate to be processed 800 by the sintering mechanism 500, thereby improving the sintering quality of the plate to be processed 800. When the sintering mechanism 500 sinteres the plate to be processed 800, it will drive the processing chamber 510 to descend to the surface of the machine table 100, thereby covering the carrier table 160 and the plate to be processed 800 at the sintering station 130, facilitating the provision of inert gas during the sintering process through the nozzle, avoiding oxidation of the plate to be processed 800 in a high-temperature environment, and improving the sintering reliability and product yield. During sintering, the upper pressing die inside the processing chamber 510 will descend to the surface of the plate to be processed 800, thereby applying the sintering pressure to sinter the plate to be processed 800. After sintering is completed, the upper pressing die rises and resets, and the processing chamber 510 also rises and resets. The plate to be processed 800 that has completed sintering is transferred to the cooling station 140 for cooling through the support assembly at the sintering station 130.

[0027] It should be noted that in the embodiments of the present application, there are multiple cooling stations 140, and the cooling rate of each cooling station 140 gradually decreases from right to left, so as to perform stepwise cooling on the plate to be processed 800. The cooling rate during the first cooling is relatively high, enabling the plate to be processed 800 to cool down quickly, accelerating the departure from the brittle temperature range of the material, and reducing excessive grain growth; the cooling rate during the secondary cooling is relatively low, which is used to reduce residual stress and avoid warping or solder joint microcracks of the plate to be processed 800. It should be noted that in this example, two cooling stations 140 are provided. In practical applications, more cooling stations 140 can also be provided to perform multiple coolings on the plate to be processed 800, thereby ensuring product quality.

[0028] According to the novel sintering device for a silicon carbide embedded core module packaging circuit board according to an embodiment of the present invention, by preheating the plate to be processed 800 multiple times before sintering, and cooling the plate to be processed 800 multiple times after sintering, and the preheating temperature gradually increases while the cooling rate gradually decreases, thereby improving the sintering quality of the plate to be processed 800 and enhancing the product yield; through the mutual cooperation of the lifting mechanism 200, the support mechanism 300 and the driving mechanism 400, the automatic transportation of the plate to be processed 800 is realized, and the sintering rate of the plate to be processed 800 is increased; by providing an inert gas for the sintering process by setting the processing chamber 510 and the nozzle, the plate to be processed 800 is prevented from being oxidized in a high-temperature environment.

[0029] Further, in some embodiments of the present application, the lifting mechanism 200 includes two lifting devices symmetrically arranged on both sides of multiple workstations (the front and rear sides shown). Figure 1 As shown in Figure 2 and Figure 5 each lifting device includes: a mounting plate 210, a driver 220 and a guide rod 230. Among them, inclined blocks 211 are respectively arranged at the bottoms of the left and right ends of the mounting plate 210. The bottom of each inclined block 211 on the side close to the driver 220 is higher than the bottom of the side far from the driver 220. The bottoms of both ends of the mounting plate 210 are respectively connected to the surface of the machine table 100 through elastic connection devices 212, and the support mechanism 300 is arranged on the mounting plate 210; the driver 220 is located in the middle below the mounting plate 210. Telescopic devices 221 are arranged at both ends of the driver 220. The output end of each telescopic device 221 is connected to a slider 222. Each slider 222 is slidably arranged in a corresponding slide rail 223. A pulley 224 that abuts against the bottom of the inclined block 211 is arranged at the top of the slider 222; the guide rod 230 is arranged on the machine table 100, and a first guide groove 213 is arranged on the side of the mounting plate 210, and the first guide groove 213 is sleeved outside the guide rod 230.

[0030] Specifically, in this example, when the driver 220 drives the slider 222 to move from left to right along the slide rail 223 through the telescopic device 221, since the height of the bottom on the right side of the inclined block 211 is relatively high, under the interaction of the pulley 224 and the inclined block 211, the mounting plate 210 will gradually descend, thereby driving the support mechanism 300 to descend; when the driver 220 drives the slider 222 to move from right to left along the slide rail 223 through the telescopic device 221, since the height of the bottom on the left side of the inclined block 211 is relatively low, under the interaction of the pulley 224 and the inclined block 211, the mounting plate 210 will gradually ascend, thereby driving the support mechanism 300 to ascend. Among them, the telescopic device 221 can be a telescopic rod or the output shaft of a cylinder. Since the length of the mounting plate 210 is relatively long, sliders 222 and inclined blocks 211 are provided on both the left and right sides of the driver 220, which can make both sides of the mounting plate 210 move synchronously, making the lifting of the mounting plate 210 more stable. At the same time, since the mounting plate 210 is provided with a first guide groove 213 and the first guide groove 213 is sleeved outside the guide rod 230, the mounting plate 210 can ascend or descend along the guide rod 230, making the lifting of the mounting plate 210 and the support mechanism 300 more stable. By providing a pulley 224 on the top of the slider 222, relative movement between the pulley 224 and the inclined block 211 can occur more easily, making the lifting drive more stable.

[0031] Further, in some embodiments of the present application, the support mechanism 300 includes two support components 310 symmetrically arranged on both sides of a plurality of workstations (i.e., Figure 1 the front and back sides shown), as Figure 6 and Figure 7As shown, the support assembly 310 includes: a plurality of guide blocks 311 and a support rod 312. The plurality of guide blocks 311 are arranged at intervals on the surface of the mounting plate 210. A second guide groove is provided on the side of the guide block 311 facing the working station. The support rod 312 passes through the second guide grooves of the plurality of guide blocks 311. One end of the support rod 312 is connected to the driving mechanism 400. A plurality of telescopic assemblies 313 are provided on the side of the support rod 312 facing the working station. Each telescopic assembly 313 is connected to a support plate 314. Specifically, the support rod 312 passes through the second guide groove of the guide block 311. When the driving mechanism 400 drives the support rod 312 to move, the support rod 312 can move along the second guide groove, thereby achieving stable movement. At the same time, since the telescopic assembly 313 is provided on the support rod 312 and the telescopic assembly 313 is connected to the support plate 314, when the support rod 312 moves, it will drive the telescopic assembly 313 and the support plate 314 to move together. The support plate 314 is used to place the plate 800 to be processed, and a second positioning member 170 is provided on the support plate 314, which can achieve the positioning of the plate 800 to be processed. The telescopic assembly 313 can be a telescopic rod or a telescopic cylinder, etc., and is used to drive the plate 800 to be processed closer to or farther away from the working station.

[0032] Further, in some embodiments of the present application, as Figure 1 shown, the driving mechanism 400 includes a fixed frame 410, a feeding cylinder 420 and a connecting plate 430. The fixed frame 410 is arranged on the surface of the machine table 100. The feeding cylinder 420 is arranged on the fixed frame 410. Both sides of the connecting plate 430 are connected to the support mechanisms 300 on both sides of the plurality of working stations. The middle of the connecting plate 430 is connected to the output shaft of the feeding cylinder 420. Specifically, in this example, the fixed frame 410 is used to fix and install the feeding cylinder 420. The output shaft of the feeding cylinder 420 is connected to the connecting plate 430. By the telescopic movement of the feeding cylinder 420, the connecting plate 430 can be driven to move left and right. At the same time, the connecting plate 430 is connected to the support rods 312 of the front and rear support assemblies 310. During the left and right movement of the connecting plate 430, the support rods 312 will be driven to move left and right, thereby realizing the left and right movement of the support assembly 310. Further, in some embodiments of the present application, as Figure 1As shown, the sintering device for the new type of silicon carbide embedded core module packaging circuit board further includes a limiting mechanism 700. The limiting mechanism 700 is used to detect the position of the support mechanism 300 and limit the moving stroke of the feeding cylinder 420. It should be noted that the limiting mechanism 700 can use a displacement sensor or other types of sensors to detect the moving stroke of the feeding cylinder 420, ensuring that the feeding cylinder 420 drives the support mechanism 300 to move a distance of one working station each time, ensuring the accuracy of the moving distance of the support mechanism 300; alternatively, the limiting mechanism 700 can also include a limiting block for restricting the movement of the support mechanism 300. When the support mechanism 300 moves to a specific position, the limiting block blocks the support mechanism 300 from continuing to move.

[0033] Furthermore, in some embodiments of the present application, a blanking mechanism 600 is provided on the side of the blanking station 150 away from the cooling station 140. It should be noted that for the loading station 110, the preheating station 120, the sintering station 130, the cooling station 140, and the blanking station 150, the distance between each station is equal. For the blanking mechanism 600, the blanking mechanism 600 is located on the left side of the blanking station 150, ensuring that when the driving mechanism 400 drives the support mechanism 300 to move a distance of one working station to the left, the support component 310 originally located at the last cooling station 140 is located at the blanking station 150 and there is no interference with the blanking mechanism 600. As Figure 1As shown in the figure, the blanking mechanism 600 includes a lifting table 610, a conveying table 620, and a gripping manipulator 630. The lifting table 610 is provided with multiple layers of first placement tables 611 spaced apart in the vertical direction. Each layer of the first placement table 611 includes two relatively arranged first placement blocks 612. Cooling air holes are provided between adjacent layers of the first placement tables 611. A through hole 180 is opened at the corresponding blanking station 150 of the machine table 100, and the lifting table 610 passes through the through hole 180. The conveying table 620 is located below the machine table 100 and passes through the inside of the lifting table 610. The two first placement blocks 612 of the first placement table 611 are respectively located on both sides of the conveying table 620. The gripping manipulator 630 is arranged on the surface of the machine table 100 and is located on the side of the lifting table 610 away from the cooling station 140. When the support assembly 310 moves the to-be-processed plate 800 to the left by the distance of one station, the to-be-processed plate 800 is located at the blanking station 150. The gripping manipulator 630 extends, takes the to-be-processed plate 800 from the support assembly 310, and then the gripping manipulator 630 retracts and moves the to-be-processed plate 800 from right to left onto the first placement table 611. Subsequently, the lifting table 610 descends by the distance of one layer of the first placement table 611. Every time the lifting table 610 receives a to-be-processed plate 800, it descends by one layer. When the first placement table 611 with the to-be-processed plate 800 descends to the conveying table 620, since the two first placement blocks 612 are located on both sides of the conveying table 620, the two first placement blocks 612 can descend below the conveying table 620, while the to-be-processed plate 800 cannot descend below the conveying table 620 but remains on the surface of the conveying table 620, so that the conveying table 620 discharges the to-be-processed plate 800. It should be noted that the cooling air holes between adjacent layers of the first placement tables 611 will provide cooling gas to completely restore the to-be-processed plate 800 to normal temperature, and the rate of providing cooling gas by the cooling air holes will gradually decrease with each descent of the lifting table 610, thereby saving energy consumption. As Figure 1 shown, the lifting of the lifting table 610 is driven by a lifting drive device 640.

[0034] Furthermore, as Figure 1 shown, in some embodiments of the present application, the novel silicon carbide embedded core module packaging circuit board sintering device further includes a control mechanism 900. The control mechanism 900 is used to control the actions of the entire novel silicon carbide embedded core module packaging circuit board sintering device. Control buttons such as start, stop, emergency stop, rise, fall, forward, and backward are provided on the control mechanism 900. Users can set an automated program through the control mechanism 900 or perform manual operations.

[0035] On the other hand, as Figure 8As shown in the figure, based on the above-mentioned novel sintering device for a circuit board with a silicon carbide embedded core module package, the present invention also proposes a circuit board sintering method, which includes the following steps: Step S100: Initialize, so that the first support component 310 is located at the loading station 110, and the remaining support components 310 are respectively located at each preheating station 120, sintering station 130, and each cooling station 140; Step S200: Place the board to be processed 800 on the first support component 310, and position the board to be processed 800 through the second positioning member 170 and the second positioning hole 810; Step S300: Drive all the support components 310 to move to the next station through the driving mechanism 400, so that the first support component 310 is located at the first preheating station 120; Step S400: Drive the support component 310 to descend through the lifting mechanism 200, so that the board to be processed 800 on the first support component 310 is placed on the carrier 160 of the first preheating station 120, and position the board to be processed 800 through the first positioning member 190 and the first positioning hole 820; Step S500: Drive the support component 310 to continue to descend through the lifting mechanism 200, so that the first positioning member 190 leaves the first positioning hole 820, and the support component 310 contracts; Step S600: Move the first support component 310 to the loading station 110 through the driving mechanism 400, the support component 310 extends, and the support component 310 is lifted and reset through the lifting mechanism 200; Step S700: Place the next board to be processed 800 on the first support component 310, and return to step S300; Step S800: After the board to be processed 800 is progressively preheated through multiple preheating stations 120, sinter the board to be processed 800 through the sintering mechanism 500. The sintered board to be processed 800 is progressively cooled through multiple cooling stations 140, and the cooled board to be processed 800 is placed at the unloading station 150.

[0036] Specifically, the novel sintering device for a circuit board with a silicon carbide embedded core module package according to the embodiment of the present invention is used for automatically sintering the board to be processed 800. As Figure 4As shown, in this example, the plate 800 to be processed is provided with second positioning holes 810 at four corners and a first positioning hole 820 in the middle. When sintering the plate 800 to be processed, first load the plate 800 to be processed and place it at the loading station 110. For the loading station 110, preheating station 120, sintering station 130, and cooling station 140, there are corresponding support components 310, and the support components 310 are provided with second positioning members 170. Therefore, when loading, place the plate 800 to be processed on the support component 310 at the loading station 110, so that the second positioning member 170 of the support component 310 passes through the four second positioning holes 810 of the plate 800 to be processed, realizing the positioning of the plate 800 to be processed. After placing the plate 800 to be processed, drive the support mechanism 300 to move one station from right to left through the drive mechanism 400. At this time, all the support components 310 move one station to the left, so that the support component 310 at the loading station 110 moves to the first preheating station 120, the support component 310 at the first preheating station 120 moves to the second preheating station 120, and so on. The support component 310 at the last preheating station 120 moves to the sintering station 130, the support component 310 at the sintering station 130 moves to the first cooling station 140, and the support component 310 at the first cooling station 140 moves to the second cooling station 140, and so on. At this time, the plate 800 originally located at the loading station 110 moves to the first preheating station 120 and is located above the first preheating station 120. Subsequently, drive the entire support mechanism 300 to descend through the lifting mechanism 200, so that the plate 800 to be processed is placed on the carrier table 160, and the first positioning member 190 of the carrier table 160 just passes through the first positioning hole 820 of the plate 800 to be processed, realizing the support and positioning of the plate 800 to be processed. Subsequently, the lifting mechanism 200 further drives the support mechanism 300 to descend, so that the second positioning member 170 leaves the second positioning hole 810, separating the support component 310 from the plate 800 to be processed. Subsequently, the drive mechanism 400 drives the support mechanism 300 to move one station from left to right, so that each support component 310 returns to its original station again, that is, the support component 310 located at the first preheating station 120 returns to the loading station 110, and the remaining support components 310 all move one station to the left. At the same time, the lifting mechanism 200 drives the entire support mechanism 300 to rise, so that each support component 310 is reset. Repeating the above process, the plate 800 to be processed can be continuously transported from right to left. The support component 310 at each station can transport the plate 800 to be processed at the current station to the next station, so that each plate 800 to be processed passes through the loading station 110, multiple preheating stations 120, sintering station 130, cooling station 140 in sequence, and finally reaches the unloading station 150.

[0037] It should be noted that in the embodiments of the present application, there are multiple preheating stations 120, and the preheating temperature of each preheating station 120 gradually increases from right to left, so as to perform progressive preheating on the plate to be processed 800. The temperature during the first preheating is relatively low, mainly used to remove the environmental moisture absorbed on the surface layer of the plate to be processed 800, and avoid delamination of the substrate or solder splash caused by rapid gasification of water during sintering. The temperature of the secondary preheating is relatively high, which is used to further evaporate the residual solvent and trace moisture in the deep layer of the plate to be processed 800, and reduce the risk of defects such as voids and sand holes after sintering. It should be noted that in this example, two preheating stations 120 are set. In actual applications, more preheating stations 120 can also be set to perform multiple preheatings on the plate to be processed 800, so as to improve the sintering quality.

[0038] It should be noted that in the embodiments of the present application, there are multiple cooling stations 140, and the cooling rate of each cooling station 140 gradually decreases from right to left, so as to perform decreasing cooling on the plate to be processed 800. The cooling rate during the first cooling is relatively high, so that the plate to be processed 800 can be quickly cooled down, quickly get out of the brittle temperature range of the material, and reduce excessive grain growth; the cooling rate of the secondary cooling is relatively low, which is used to reduce the residual stress and avoid warping or solder microcracks of the plate to be processed 800. It should be noted that in this example, two cooling stations 140 are set. In actual applications, more cooling stations 140 can also be set to perform multiple coolings on the plate to be processed 800, so as to ensure the product quality.

[0039] Such as Figure 2As shown, in this example, the carrier 160 of the sintering station 130 further includes a base 161 and a support platform 162. The support platform 162 is disposed in the middle of the base 161 in a liftable manner, and the first positioning member 190 of the carrier 160 is disposed on the support platform 162. In the initial state, the support platform 162 rises to the highest position, facilitating the reception of the plate to be processed 800 by the support platform 162 when the support assembly 310 descends. At the same time, in this example, the support assembly 310 can be telescopic. When the support assembly 310 carries the plate to be processed 800, it is in an extended state. However, after the support assembly 310 places the plate to be processed 800 on the carrier 160 and disengages from the plate to be processed 800, the support assembly 310 will change to a contracted state, thus avoiding interfering with the descent of the plate to be processed 800 when the support platform 162 drives the plate to be processed 800 to descend. After the support platform 162 receives the plate to be processed 800, it will drive the plate to be processed 800 to descend to the surface of the base 161. At this time, the surface of the support platform 162 is flush with the surface of the base 161, and the plate to be processed 800 is supported by the support platform 162 and the base 161 together. Through this solution, it is possible to avoid the situation where when the sintering mechanism 500 sinters the plate to be processed 800, since the four sides of the plate to be processed 800 are not supported by the support platform 162, the sintering pressure provided by the sintering mechanism 500 cannot be evenly applied to the plate to be processed 800, thereby improving the sintering quality of the plate to be processed 800.

[0040] In this example, when sintering the plate to be processed 800, it specifically includes the following four steps: (1) After the support assembly 310 places the plate to be processed 800 on the support platform 162, the support assembly 310 contracts, and the support platform 162 descends to the surface of the base 161, enabling the base 161 and the support platform 162 to support the plate to be processed 800; (2) The sintering mechanism 500 drives the processing chamber 510 to descend to the surface of the machine table 100, causing the processing chamber 510 to surround the base 161; (3) After the processing chamber 510 provides inert gas through the nozzle, the upper pressing die descends to contact the plate to be processed 800 to provide sintering pressure; (4) After sintering the plate to be processed 800 with the preset sintering pressure and sintering temperature, both the upper pressing die and the processing chamber 510 rise and reset.

[0041] Specifically, when the sintering mechanism 500 sinters the plate 800 to be processed, it drives the processing chamber 510 to descend to the surface of the machine table 100, thereby covering the carrier table 160 and the plate 800 to be processed at the sintering station 130, facilitating the supply of inert gas during the sintering process through the nozzle, avoiding oxidation of the plate 800 to be processed in a high-temperature environment, and improving the sintering reliability and product yield. During sintering, the upper pressing die inside the processing chamber 510 descends to the surface of the plate 800 to be processed, thereby applying a sintering pressure to sinter the plate 800 to be processed. After sintering is completed, the upper pressing die rises and resets, and the processing chamber 510 also rises and resets. The processed plate 800 that has completed sintering is transferred to the cooling station 140 for cooling through the support assembly at the sintering station 130.

[0042] Furthermore, in some embodiments of the present application, as Figure 1 shown, a blanking mechanism 600 is provided on the side of the blanking station 150 away from the cooling station 140. It should be noted that for the loading station 110, the preheating station 120, the sintering station 130, the cooling station 140, and the blanking station 150, the distance between each station is equal. For the blanking mechanism 600, the blanking mechanism 600 is located on the left side of the blanking station 150, ensuring that when the driving mechanism 400 drives the support mechanism 300 to move left by the distance of one station, the support assembly 310 originally located at the last cooling station 140 is located at the blanking station 150 and there is no interference with the blanking mechanism 600. The blanking mechanism 600 includes a lifting table 610, a transfer table 620, and a gripping manipulator 630. The lifting table 610 is provided with multiple layers of first placement tables 611 spaced apart in the vertical direction. Each layer of the first placement table 611 includes two relatively arranged first placement blocks 612. Cooling air holes are provided between adjacent layers of the first placement tables 611. A through hole 180 is opened at the position of the machine table 100 corresponding to the blanking station 150, and the lifting table 610 passes through the through hole 180; the transfer table 620 is located below the machine table 100 and passes through the inside of the lifting table 610. The two first placement blocks 612 of the first placement table 611 are respectively located on both sides of the transfer table 620; the gripping manipulator 630 is provided on the surface of the machine table 100 and is located on the side of the lifting table 610 away from the cooling station 140. The blanking of the plate 800 to be processed by the blanking mechanism 600 specifically includes the following five steps: (1) When the support assembly 310 moves the cooled plate 800 to be processed to the blanking station 150, the gripping manipulator 630 grabs and places the plate 800 to be processed on the first placement block 612 of the corresponding layer of the first placement table 611, and cooling gas is provided to the plate 800 to be processed on the first placement block 612 through the corresponding cooling air holes; (2)After placing a plate 800 to be processed on the lifting table 610 each time, the lifting table 610 descends by the distance of one layer of the first placement table 611, and the blowing efficiency of the cooling air holes gradually decreases; (3)When the first placement block 612 descends to the transfer table 620, the plate 800 to be processed on the first placement block 612 is transferred to the transfer table 620; (4)The transfer table 620 transfers the plate 800 to be processed to the blanking position; (5)When the topmost first placement table 611 of the lifting table 610 places the plate 800 to be processed, the lifting table 610 directly descends to the surface of the transfer table 620, transfers all the plates 800 to be processed on the lifting table 610 to the transfer table 620, and then the lifting table 610 rises to reset.

[0043] Specifically, when the support assembly 310 moves the cooled plate 800 to be processed to the blanking station 150, the gripping manipulator 630 extends, removes the plate 800 to be processed from the support assembly 310, and then the gripping manipulator 630 retracts and moves the plate 800 from right to left onto the first placement table 611; subsequently, the lifting table 610 descends by the distance of one layer of the first placement table 611. Each time the lifting table 610 receives a plate 800 to be processed, it descends by one layer of the distance. When the first placement table 611 with the plate 800 to be processed descends to the transfer table 620, since the two first placement blocks 612 are located on both sides of the transfer table 620, the two first placement blocks 612 can descend below the transfer table 620, while the plate 800 to be processed cannot descend below the transfer table 620 but remains on the surface of the transfer table 620, so that the transfer table 620 discharges the plate 800 to be processed. It should be noted that the cooling air holes between adjacent layers of the first placement table 611 provide cooling gas to completely restore the plate 800 to be processed to normal temperature, and the rate of providing cooling gas by the cooling air holes gradually decreases with each descent of the lifting table 610, thus saving energy consumption. As Figure 1 shown, the lifting of the lifting table 610 is driven by a lifting drive device 640.

[0044] Further, in some embodiments of the present application, a loading mechanism (not shown in the figure) is further included at the loading station 110. The loading mechanism includes a loading table and a loading manipulator. The loading table includes multiple layers of second placement tables. Both sides of each layer of the second placement table have retractable second placement blocks. Each layer of the second placement table is used to place the corresponding plate 800 to be processed. The loading manipulator is located on the side of the loading table away from the preheating station 120; The above step S200: Placing the plate 800 to be processed on the first support assembly 310 and positioning the plate 800 to be processed through the second positioning member 170 and the second positioning hole 810 includes the following two steps: (1) When the support component 310 is in the contracted state, the loading manipulator adsorbs the plate to be processed 800 from the second placement table on the topmost layer, moves above the support component 310, and the second placement block of the second placement table on the topmost layer contracts; (2) When the support component 310 is in the extended state, the loading manipulator places the plate to be processed 800 on the support component 310 and positions the plate to be processed 800 through the first positioning member 190 and the first positioning hole 820.

[0045] By providing the loading mechanism, automatic loading of the plate to be processed 800 is achieved, thereby improving the sintering efficiency.

[0046] According to the circuit board sintering method of the embodiment of the present invention, by preheating the plate to be processed 800 multiple times before sintering and cooling the plate to be processed 800 multiple times after sintering, and the preheating temperature gradually increases while the cooling rate gradually decreases, the sintering quality of the plate to be processed 800 is improved and the product yield is increased; through the mutual cooperation of the lifting mechanism 200, the support mechanism 300, and the driving mechanism 400, automatic transportation of the plate to be processed 800 is achieved, and the sintering rate of the plate to be processed 800 is increased; by providing the processing chamber 510 and the nozzle, an inert gas is provided for the sintering process, thereby preventing the plate to be processed 800 from being oxidized in a high-temperature environment; by providing the loading mechanism and the unloading mechanism 600, the loading and unloading rate of the plate to be processed 800 is increased.

[0047] On the other hand, the embodiment of the present invention also provides a storage medium, which is a computer-readable storage medium. The storage medium stores a computer program, and when the computer program is executed by a processor, the above-mentioned circuit board sintering method is implemented.

[0048] As a non-transitory computer-readable storage medium, the memory can be used to store non-transitory software programs and non-transitory computer-executable programs. In addition, the memory may include high-speed random access memory, and may also include non-transitory memory, such as at least one magnetic disk storage device, a flash memory device, or other non-transitory solid-state storage devices. In some embodiments, the memory may optionally include a memory remotely disposed relative to the processor, and these remote memories may be connected to the processor through a network. Examples of the above networks include, but are not limited to, the Internet, an enterprise intranet, a local area network, a mobile communication network, and combinations thereof. The device embodiments described above are merely illustrative, and the units described as separate components may or may not be physically separated, and may be located in one place, or may be distributed to multiple network units. Some or all of the modules may be selected according to actual needs to achieve the purpose of the solution of this embodiment.

[0049] Although specific embodiments have been described herein, those of ordinary skill in the art will recognize that many other modifications or alternative embodiments are also within the scope of the present disclosure. For example, any one of the functions and / or processing capabilities described in connection with a particular device or component can be performed by any other device or component. Additionally, although various exemplary implementations and architectures have been described in accordance with embodiments of the present disclosure, those of ordinary skill in the art will recognize that many other modifications to the exemplary implementations and architectures described herein are also within the scope of the present disclosure.

[0050] Certain aspects of the present disclosure have been described above with reference to block diagrams and flowcharts of systems, methods, systems, and / or computer program products according to exemplary embodiments. It should be understood that one or more blocks in the block diagrams and flowcharts, and combinations of blocks in the block diagrams and flowcharts, can be implemented respectively by executing computer-executable program instructions. Similarly, according to some embodiments, some blocks in the block diagrams and flowcharts may not need to be executed in the order shown, or may not need to be executed at all. Additionally, additional components and / or operations beyond those shown in the blocks of the block diagrams and flowcharts may be present in certain embodiments.

[0051] Accordingly, the blocks in the block diagrams and flowcharts support combinations of means for performing the specified functions, combinations of elements or steps for performing the specified functions, and means for program instructions for performing the specified functions. It should also be understood that each block in the block diagrams and flowcharts, and combinations of blocks in the block diagrams and flowcharts, can be implemented by a special purpose hardware computer system that performs a particular function, element, or step, or by a combination of special purpose hardware and computer instructions.

[0052] The program modules, applications, etc. described herein may include one or more software components, including, for example, software objects, methods, data structures, etc. Each such software component may include computer-executable instructions that, in response to execution, cause at least a portion of the functions described herein (e.g., one or more operations of the exemplary methods described herein) to be performed.

[0053] Software components can be coded in any of a variety of programming languages. An exemplary programming language can be a low-level programming language, such as an assembly language associated with a particular hardware architecture and / or operating system platform. Software components including assembly language instructions may need to be converted to executable machine code by an assembler before being executed by the hardware architecture and / or platform. Another exemplary programming language can be a higher-level programming language, which can be portable across multiple architectures. Software components including a higher-level programming language may need to be converted to an intermediate representation by an interpreter or compiler before execution. Other examples of programming languages include, but are not limited to, macro languages, shell or command languages, job control languages, scripting languages, database query or search languages, or report writing languages. In one or more exemplary embodiments, software components containing instructions in one of the above examples of programming languages can be directly executed by an operating system or other software components without first being converted into another form.

[0054] Software components can be stored as files or other data storage constructs. Software components with similar types or related functions can be stored together in, for example, a particular directory, folder, or library. Software components can be static (e.g., pre-set or fixed) or dynamic (e.g., created or modified at execution time).

[0055] The embodiments of the present invention have been described in detail above in conjunction with the accompanying drawings. However, the present invention is not limited to the above embodiments, and various changes can be made without departing from the spirit of the present invention within the knowledge scope of those of ordinary skill in the art.

Claims

1. A novel sintering device for a circuit board of a silicon carbide embedded core module package, characterized in that include: A machine platform, wherein a plurality of stations distributed at intervals are arranged on the machine platform, including a loading station, a plurality of preheating stations, a sintering station, a plurality of cooling stations and a unloading station in sequence, the preheating temperature of the plurality of preheating stations gradually increases, and the cooling rate of the plurality of cooling stations gradually decreases, each of the preheating station, the sintering station and the cooling station is provided with a bearing platform, the bearing platform is provided with a first positioning member, the bearing platform of the sintering station includes a base and a support platform, and the support platform is liftably arranged in the middle of the base; A lifting mechanism is arranged on the machine platform and is located on both sides of the plurality of workstations; A support mechanism, located on both sides of the plurality of workstations and movably connected to the lifting mechanism, the lifting mechanism being used to drive the support mechanism to rise or fall, the support mechanism comprising a plurality of retractable support components, and the support components being provided with a second positioning member; A driving mechanism, arranged on the machine platform and in driving connection with the supporting mechanism, the driving mechanism being used to drive the supporting mechanism to move in a distribution direction of the plurality of workstations; The sintering mechanism is arranged above the sintering station. The sintering mechanism can rise and fall in the vertical direction. The sintering mechanism includes a processing chamber, a liftable upper die is arranged inside the processing chamber, and a nozzle for providing inert gas is also arranged inside the processing chamber.

2. The novel sintering device for a silicon carbide embedded core module packaging circuit board according to claim 1, characterized in that, The lifting mechanism comprises two lifting devices symmetrically arranged on both sides of the plurality of workstations, each of the lifting devices comprising: A mounting plate, wherein the bottoms of both ends of the mounting plate are respectively provided with inclined blocks, the bottoms of both ends of the mounting plate are respectively connected to the surface of the machine table through elastic connection devices, and the supporting mechanism is arranged on the mounting plate; A driver is located in the middle of the lower part of the mounting plate, and telescopic devices are provided at both ends of the driver. The bottom of each inclined block close to the driver is higher than the bottom of the side away from the driver. The output end of each telescopic device is connected to a slider, and each slider is slidably arranged in a corresponding slide rail. The top of the slider is provided with a pulley abutting against the bottom of the inclined block. A guide rod is arranged on the machine platform, and a first guide groove is arranged on the side of the mounting plate. The first guide groove is sleeved on the outside of the guide rod.

3. The novel sintering device for a silicon carbide embedded core module packaging circuit board according to claim 2, wherein The support mechanism comprises two support assemblies symmetrically arranged on both sides of the plurality of workstations, and the support assemblies comprise: A plurality of guide blocks, wherein the plurality of guide blocks are arranged at intervals on the surface of the mounting plate, and a second guide groove is arranged on a side of the guide block facing the work station; A support rod, the support rod is inserted into the second guide grooves of the plurality of guide blocks, one end of the support rod is connected to the driving mechanism, a plurality of telescopic components are arranged on the side of the support rod facing the workstation, and each of the telescopic components is connected to a support plate; The support plate is used to place the plate to be processed, the corners of the plate to be processed are provided with second positioning holes corresponding to the second positioning pieces, and the middle of the plate to be processed is provided with a first positioning hole corresponding to the first positioning piece.

4. The novel sintering device for a silicon carbide embedded core module packaging circuit board according to claim 1, characterized in that, A blanking mechanism is provided on one side of the blanking station away from the cooling station. The blanking mechanism includes: A lifting table, on which multiple layers of first placement tables are spaced apart in the vertical direction. Each layer of the first placement table includes two relatively arranged first placement blocks. Cooling air holes are provided between adjacent layers of the first placement tables. A through hole is opened in the machine table corresponding to the lifting table, and the lifting table passes through the through hole. A transfer table, located below the machine table and passing through the inside of the lifting table. The two first placement blocks of the first placement table are respectively located on both sides of the transfer table. A gripping manipulator, provided on the surface of the machine table and located on the side of the lifting table away from the blanking station.

5. The sintering device for the novel silicon carbide embedded core module packaging circuit board according to claim 1, characterized in that, The driving mechanism includes: A fixing frame, provided on the surface of the machine table. A feeding air cylinder, provided on the fixing frame. A connecting plate, the two sides of which are connected to the supporting mechanisms on both sides of multiple workstations, and the middle of which is connected to the output shaft of the feeding air cylinder.

6. The sintering device for the novel silicon carbide embedded core module packaging circuit board according to claim 5, characterized in that, The novel silicon carbide embedded core module packaging circuit board sintering device further includes a limiting mechanism, which is used to detect the position of the supporting mechanism and limit the moving stroke of the feeding air cylinder.

7. A method for sintering a circuit board, characterized in that, Applied to the novel silicon carbide embedded core module packaging circuit board sintering device as described in claim 1, the circuit board sintering method includes: Initialization, making the first supporting component located at the loading station, and the remaining supporting components are respectively located at each preheating station, sintering station and each cooling station. Placing a to-be-processed board on the first supporting component, and positioning the to-be-processed board through the second positioning member and the second positioning hole; a first positioning hole corresponding to the first positioning member is provided in the middle of the to-be-processed board, and a second positioning hole corresponding to the second positioning member is provided at the corner of the to-be-processed board. Driving all the supporting components to move to the next workstation through the driving mechanism, so that the first supporting component is located at the first preheating station. Driving the supporting component to descend through the lifting mechanism, so that the to-be-processed board on the first supporting component is placed on the loading platform of the first preheating station, and positioning the to-be-processed board through the first positioning member and the first positioning hole. Driving the supporting component to continue to descend through the lifting mechanism, so that the first positioning member leaves the first positioning hole, and the supporting component contracts. Moving the first supporting component to the loading station through the driving mechanism, the supporting component extends, and the supporting component is lifted and reset through the lifting mechanism. Placing the next to-be-processed board on the first supporting component, and returning to the step of driving all the supporting components to move to the next workstation through the driving mechanism, so that the first supporting component is located at the first preheating station. After the to-be-processed plate passes through multiple preheating stations in sequence for progressive preheating, the to-be-processed plate is sintered by the sintering mechanism. After sintering, the to-be-processed plate passes through multiple cooling stations in sequence for progressive cooling, and the cooled to-be-processed plate is placed at the blanking station.

8. The circuit board sintering method according to claim 7, wherein The sintering of the to-be-processed plate by the sintering mechanism includes: After the supporting assembly places the to-be-processed plate on the supporting table, the supporting assembly contracts, and the supporting table descends to the surface of the base, so that the base and the supporting table support the to-be-processed plate; The sintering mechanism drives the processing chamber to descend to the surface of the machine table, so that the processing chamber surrounds the base; After the processing chamber provides inert gas through the nozzle, the upper pressing die descends to contact the to-be-processed plate to provide sintering pressure; After sintering the to-be-processed plate with a preset sintering pressure and sintering temperature, both the upper pressing die and the processing chamber rise and reset.

9. The circuit board sintering method according to claim 7, characterized in that, A blanking mechanism is arranged on one side of the blanking station away from the cooling station. The blanking mechanism includes a lifting table, a transfer table, and a gripping manipulator. The lifting table is vertically provided with multiple layers of first placement tables at intervals. Each layer of the first placement table includes two first placement blocks arranged oppositely. Cooling air holes are arranged between adjacent layers of the first placement tables. The machine table is provided with through holes corresponding to the lifting table, and the lifting table passes through the through holes; the transfer table is located below the machine table and passes through the inside of the lifting table. The two first placement blocks of the first placement table are respectively located on both sides of the transfer table; the gripping manipulator is arranged on the surface of the machine table and is located on the side of the lifting table away from the blanking station; The placement of the cooled to-be-processed plate at the blanking station includes: When the supporting assembly moves the cooled to-be-processed plate to the blanking station, the gripping manipulator grabs the to-be-processed plate and places it on the first placement block of the corresponding layer of the first placement table, and cold air is provided to the to-be-processed plate on the first placement block through the corresponding cooling air holes; After each to-be-processed plate is placed on the lifting table, the lifting table descends by the distance of one layer of the first placement table, and the blowing efficiency of the cooling air holes gradually decreases; When the first placement block descends to the transfer table, the to-be-processed plate on the first placement block is transferred to the transfer table; The transfer table conveys the to-be-processed plate to the blanking position; When the topmost layer of the first placement table of the lifting table places the to-be-processed plate, the lifting table directly descends to the surface of the transfer table, transfers the to-be-processed plates on all the first placement tables of the lifting table to the transfer table, and then the lifting table rises and resets.

10. The circuit board sintering method according to claim 9, characterized in that, The loading station further includes a loading mechanism, which includes a loading table and a loading manipulator. The loading table includes multiple layers of retractable second placement tables. On both sides of each layer of the second placement table, there are retractable second placement blocks. Each layer of the second placement table is used to place the corresponding plate to be processed. The loading manipulator is located on the side of the loading table away from the preheating station; Placing the plate to be processed on the first support component and positioning the plate to be processed through the second positioning member and the second positioning hole includes: When the support component is in a retracted state, the loading manipulator adsorbs the plate to be processed from the uppermost layer of the second placement table, moves above the support component, and the second placement blocks of the uppermost layer of the second placement table contract; When the support component is in an extended state, the loading manipulator places the plate to be processed on the support component and positions the plate to be processed through the first positioning member and the first positioning hole.

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