Semiconductor chip tray centering device, semiconductor chip tray centering method, semiconductor chip tray conveying device and semiconductor chip tray conveying method

Abstract

The embodiment of the invention belongs to the technical field of semiconductor chips, and particularly relates to a semiconductor chip tray centering device and method and a semiconductor chip tray conveying device and method.The centering device comprises a lifter, a propeller and an L-shaped centering base; the lifter is used for controlling the vertical lifting of the L-shaped centering seat, so that the L-shaped centering seat is aligned with a semiconductor chip tray; the propeller is used for controlling the horizontal movement of the L-shaped centering seat so as to clamp or release a semiconductor chip tray; a positioning groove matched with a side edge structure of a semiconductor chip tray to be centered is formed in the inner side of the L-shaped centering base. According to the embodiment of the invention, the problems of low chip tray collection efficiency and high cost are solved.

Description

Technical Field

[0001] The embodiments of this specification relate to the technical field of semiconductor chips, and in particular, to a centering device and method for a semiconductor chip tray, a conveying device and method. Background Art

[0002] After the production and manufacturing of semiconductor chip trays, they usually need to be transferred and placed in batches for centralized processing. Due to the lack of a centering auxiliary mechanism for the side structure of the chip tray, the chip tray is prone to positioning deviation during conveying, and it is necessary for workers to manually align it to achieve the stacked placement of the chip tray, which affects the collection efficiency of the chip tray and increases the labor cost; at the same time, due to the low degree of automation of the chip tray conveying device and the large amount of human participation, it is difficult to achieve refined planning management. Summary of the Invention

[0003] The embodiments of this specification provide a centering device and method for a semiconductor chip tray, a conveying device and method, which are used to solve or at least partially solve the problems of low chip tray collection efficiency and high cost.

[0004] To solve the above technical problems, a first aspect of the embodiments of this specification provides a centering device for a semiconductor chip tray, and the centering device includes a lifter, a pusher and an L-shaped centering seat;

[0005] The lifter is used to control the vertical lifting of the L-shaped centering seat so that the L-shaped centering seat aligns with the semiconductor chip tray;

[0006] The pusher is used to control the horizontal movement of the L-shaped centering seat to clamp or release the semiconductor chip tray;

[0007] A positioning groove adapted to the side structure of the semiconductor chip tray to be centered is formed on the inner side of the L-shaped centering seat.

[0008] In the centering device for a semiconductor chip tray according to the embodiments of this specification, the positioning groove is a stepped positioning groove.

[0009] In the centering device for a semiconductor chip tray according to the embodiments of this specification, the steps in the stepped positioning groove have different shapes and / or sizes to adapt to semiconductor chip trays with side structures of different shapes and / or sizes.

[0010] In the centering device for a semiconductor chip tray according to the embodiments of this specification, the stepped positioning groove can be disassembled as a whole.

[0011] In the centering device for a semiconductor chip tray according to the embodiments of this specification, each step of the stepped positioning groove can be disassembled separately.

[0012] In the semiconductor chip tray centering device according to the embodiment of the present specification, a lifting seat is further included. The lifting seat is arranged on the lifting end of the lifter, the pusher is arranged on the lifting seat, and the L-shaped centering seat is arranged on the pushing end of the pusher.

[0013] In the semiconductor chip tray centering device according to the embodiment of the present specification, a telescopic guiding structure is further included. One end of the telescopic guiding structure is arranged on the lifting seat, and the other end of the telescopic guiding structure is arranged on the L-shaped centering seat.

[0014] In the second aspect of the embodiment of the present specification, a semiconductor chip tray conveying device is provided. The conveying device includes a conveying mechanism and the centering device;

[0015] The conveying device is used for conveying the semiconductor chip tray centered by the centering device.

[0016] In the semiconductor chip tray conveying device according to the embodiment of the present specification, a loading mechanism is further included. The loading mechanism is used for conveying the semiconductor chip tray to be centered to the centering device.

[0017] In the third aspect of the embodiment of the present specification, a semiconductor chip tray centering method is provided. The centering method includes:

[0018] Controlling the L-shaped centering seat to lift by using the lifter until the horizontal side of the L-shaped centering seat contacts the semiconductor chip tray to be centered;

[0019] Controlling the L-shaped centering seat to advance towards the semiconductor chip tray to be centered by using the pusher until the vertical side of the L-shaped centering seat contacts the semiconductor chip tray to be centered and the centering is completed.

[0020] Further, after the centering is completed, it further includes:

[0021] Controlling the L-shaped centering seat to move away from the semiconductor chip tray that has completed centering by using the pusher.

[0022] Further, after controlling the L-shaped centering seat to move away from the semiconductor chip tray that has completed centering by using the pusher, it further includes:

[0023] If the specification of the next semiconductor chip tray to be centered is different from that of the semiconductor chip tray that has completed centering this time, controlling the L-shaped centering seat to descend by using the lifter until the lifter returns to the initial position.

[0024] In the fourth aspect of the embodiment of the present specification, a semiconductor chip tray conveying method is provided. The conveying method includes:

[0025] Control the conveying mechanism to convey the semiconductor chip tray that has been centered to the designated position.

[0026] The semiconductor chip tray centering device, method, conveying device and method provided by the embodiments of this specification effectively achieve the centering of the semiconductor chip tray by setting a centering device including a lifter, a pusher and an L-shaped centering seat. Among them, the lifter controls the vertical lifting of the L-shaped centering seat to align the L-shaped centering seat with the semiconductor chip tray, which can effectively determine the lifting height of the L-shaped centering seat to ensure accurate centering. The pusher is used to control the horizontal movement of the L-shaped centering seat to clamp or release the semiconductor chip tray, and can squeeze the semiconductor chip tray to complete centering. A positioning groove adapted to the side structure of the semiconductor chip tray to be centered is formed on the inner side of the L-shaped centering seat, so that the contact surface that fits the side structure of the semiconductor chip tray is the largest, thereby increasing the stability during centering. At the same time, the conveying device is provided with a conveying mechanism and the above-mentioned centering device to convey the semiconductor chip tray centered by the centering device to realize the automatic stacking of the trays.

[0027] To make the above and other purposes, features and advantages of the embodiments of this specification more obvious and understandable, the following specifically gives preferred embodiments and, in conjunction with the accompanying drawings, makes the following detailed description. Description of the Drawings

[0028] In order to more clearly illustrate the technical solutions in the embodiments of this specification or the prior art, the following will briefly introduce the drawings required for use in the description of the embodiments or the prior art. Obviously, the following drawings are only some embodiments of this specification. For those of ordinary skill in the art, without creative efforts, other drawings can also be obtained based on these drawings.

[0029] Figure 1 Shows a schematic structural diagram of the semiconductor chip tray centering device according to the embodiment of this specification;

[0030] Figure 2 Shows a schematic structural diagram of the other side of the semiconductor chip tray centering device according to the embodiment of this specification;

[0031] Figure 3 Shows a schematic structural diagram of the semiconductor chip tray conveying device and the chip tray main body in a matching state according to the embodiment of this specification;

[0032] Figure 4 Shows a schematic overall structural diagram of the semiconductor chip tray conveying device according to the embodiment of this specification;

[0033] Figure 5 Shows a schematic structural diagram of the conveying mechanism in the semiconductor chip tray conveying device according to the embodiment of this specification;

[0034] Figure 6 The flowchart of the semiconductor chip tray centering method according to the embodiments of this specification is shown;

[0035] Figure 7 The schematic diagram of the centering device according to the embodiments of this specification to achieve chip tray centering is shown;

[0036] Figure 8 The schematic diagram of the centering device according to the embodiments of this specification to achieve another chip tray centering is shown.

[0037] Explanation of the reference numerals in the drawings:

[0038] 1. Bracket;

[0039] 2. Conveyor mechanism;

[0040] 201. Bottom plate; 202. Movable plate; 203. Guide rail; 204. Slide block; 205. Linear module; 206. Fixed seat; 207. Support seat; 208. Pallet;

[0041] 3. Loading mechanism;

[0042] 301. Support frame; 302. Roller seat; 303. Roller body;

[0043] 4. Semiconductor chip tray;

[0044] 5. Centering device;

[0045] 501. Extension seat; 502. Lifter; 503. Lifting seat; 504. Pusher; 505. L-shaped centering seat; 506. Linear bearing; 507. Guide rod; 508. First positioning groove; 509. Second positioning groove. Detailed implementation manners

[0046] Next, the technical solutions in the embodiments of this specification will be clearly and completely described in conjunction with the drawings in the embodiments of this specification. Obviously, the described embodiments are only a part of the embodiments of this specification, rather than all the embodiments. Based on the embodiments in this specification, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the scope of protection of the embodiments of this specification.

[0047] It should be understood that the orientation or positional relationship indicated by the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "axial", "radial", "circumferential", etc. is based on the orientation or positional relationship shown in the drawings. It is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation. Therefore, it should not be construed as a limitation to the present invention.

[0048] It should be noted that unless otherwise clearly specified and defined, the terms "mount", "connect", and "couple" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be directly connected, or indirectly connected through an intermediate medium, and it can be the communication inside two elements. For those of ordinary skill in the art, the specific meanings of the above terms in the present invention can be understood according to specific situations.

[0049] It should be noted that the terms "first", "second", etc. in this specification, the claims and the above-mentioned drawings are used to distinguish similar objects, and are not necessarily used to describe a specific order or sequence. It should be understood that such data can be interchanged under appropriate circumstances, so that the embodiments of the present specification described here can be implemented in an order other than those illustrated or described here. In addition, the terms "comprise" and "have" and any variations thereof are intended to cover non-exclusive inclusion. For example, a process, method, device, product or equipment that includes a series of steps or units does not necessarily limit to those steps or units clearly listed, but may include other steps or units not clearly listed or inherent to these processes, methods, products or equipment.

[0050] To solve the above problems, an embodiment of this specification provides a semiconductor chip tray centering device, which can solve the problems of low chip tray collection efficiency and high cost in the prior art.

[0051] Figure 1 and Figure 2 are the structural schematic diagrams of a semiconductor chip tray centering device provided by an embodiment of this specification. As Figure 1 and Figure 2 shown, the centering device 5 includes a lifter 502, a pusher 504, and an L-shaped centering seat 505;

[0052] The lifter 502 is used to control the vertical lifting of the L-shaped centering seat 505 so that the L-shaped centering seat 505 aligns with the semiconductor chip tray; the pusher is used to control the horizontal movement of the L-shaped centering seat to clamp or release the semiconductor chip tray; a positioning groove adapted to the side structure of the semiconductor chip tray to be centered is formed on the inner side of the L-shaped centering seat 505.

[0053] The lifter 502 is used to lift the centering device 5 so that the centering device 5 aligns with the semiconductor chip tray, and then the pusher 504 pushes towards the semiconductor chip tray, driving the L-shaped centering seats 505 on both sides to squeeze the semiconductor chip tray to achieve centering.

[0054] Through the above device, the centering of the semiconductor chip tray 4 is effectively realized; among them, the lifter 502 controls the vertical lifting of the L-shaped centering seat 505 so that the L-shaped centering seat 505 aligns with the semiconductor chip tray 4, which can effectively determine the lifting height of the L-shaped centering seat 505 to ensure accurate centering. The pusher 504 is used to control the horizontal movement of the L-shaped centering seat 505 to clamp or release the semiconductor chip tray 4, and can squeeze the semiconductor chip tray 4 to complete centering. Positioning grooves 508, 509 adapted to the side structure of the semiconductor chip tray 4 to be centered are formed on the inner side of the L-shaped centering seat 505, so that the contact surface that fits the side structure of the semiconductor chip tray 4 is the largest, thereby increasing the stability during centering.

[0055] In an embodiment of the present specification, the positioning grooves are stepped positioning grooves 508, 509, that is, the first positioning groove 508 and the second positioning groove 509. The first positioning groove 508 has a larger size and is used to position the common semiconductor chip tray. The second positioning groove 509 has a smaller size and has multiple tiers, and can adapt to semiconductor chip trays with different side structures. Among them, each tier of the first positioning groove 508 and the second positioning groove 509 has different shapes and / or sizes to adapt to semiconductor chip trays with different side structures of different shapes and / or sizes.

[0056] In another embodiment of the present specification, the positioning grooves 508, 509 can be detachably assembled as a whole to adapt to more centering tasks of trays. Each tier of the first positioning groove 508 and the second positioning groove 509 can also be separately disassembled to more flexibly adapt to semiconductor chip trays with different side structures.

[0057] In another embodiment of the present specification, the centering device 5 further includes a lifting seat 503. The lifting seat 503 is arranged on the lifting end of the lifter 502, the pusher 504 is arranged on the lifting seat 503, and the L-shaped centering seat 505 is arranged on the pushing end of the pusher.

[0058] Specifically, the output end of the lifter 502 is connected to the horizontal outer side of the lifting seat 503; the transmission rod of the pusher passes through the vertical inner side of the lifting seat 503 and is connected to the vertical outer side of the L-shaped centering seat 505; wherein, the lifter 502 can be a lifting cylinder, the pusher 504 can be a pushing cylinder, and the transmission rod can be a piston rod.

[0059] In another embodiment of this specification, the centering device 5 further includes a telescopic guiding structure. One end of the guiding structure is arranged on the lifting seat 503, and the other end of the guiding structure is arranged on the L-shaped centering seat 505.

[0060] Specifically, in a preferred installation manner in the embodiment of this specification, two guiding structures are passed through the vertical inner side of the lifting seat 503 and connected to the vertical outer side of the L-shaped centering seat 505, and are respectively on both sides away from the pusher 504;

[0061] Wherein, the guiding structure includes a linear bearing 506 and a guiding rod 507. The linear bearing 506 is fixedly arranged on the vertical inner side of the L-shaped lifting seat 503. The guiding rod 507 is slidably arranged in the linear bearing 506, passes through the vertical inner side of the lifting seat 503, and is connected to the vertical outer side of the L-shaped centering seat 505. When the pusher 504 pushes the L-shaped centering seat 505 to move, the L-shaped centering seat 505 slides stably through the two guiding rods 507 sliding in the corresponding linear bearings 506 respectively, greatly improving the accuracy of centering and positioning.

[0062] After the centering device 5 completes the centering task, the robot arm can be used for grasping or the conveyor belt can be used for transportation to convey the semiconductor chip tray that has been centered to the designated position. In one embodiment of this specification, a semiconductor chip tray conveying device is provided to further solve the problems of low collection efficiency and high cost of the semiconductor chip tray.

[0063] Specifically, as Figures 3 to 5 shown, the conveying device includes a conveying mechanism 2 and a centering device 5. Among them, the centering device 5 further includes an extension seat 501. The extension seat 501 is arranged on one side of the centering device 5 and is used to connect the conveying mechanism 2. When the semiconductor chip tray 4 to be centered is placed on the conveying mechanism 2, after the centering device 5 centers the semiconductor chip tray 4, the conveying mechanism 2 then conveys the centered semiconductor chip tray 4 to the designated position.

[0064] Specifically, as Figure 3 shown, the conveying mechanism 2 further includes a bottom plate 201. Guide rails 203 are symmetrically arranged at the top of the bottom plate 201. A sliding seat 204 is slidably arranged on the guide rails 203. An activity plate 202 is arranged at the top of the sliding seat 204. Support seats 207 are constructed on both sides of the top of the activity plate 202. A tray 208 for supporting the semiconductor chip tray is fixedly installed at the top of the support seats 207.

[0065] The conveying mechanism 2 further includes a linear module 205, which is installed on both sides close to the movable plate 202, and a fixed seat 206 is fixedly installed at the driving end of the linear module 205. The fixed seat 206 is fixedly connected to the movable plate 202. The linear module 205 further ensures the efficiency and stability of the semiconductor chip tray 4 during conveying.

[0066] The semiconductor chip tray conveying device further includes a bracket 1. The conveying mechanism 2 is fixedly arranged between the two sides of the bracket 1. The two centering devices 5 are arranged on both sides of the starting end of the bracket 1 through the extension seat 501.

[0067] In another embodiment of this specification, the conveying device further includes a feeding mechanism 3. The feeding mechanism 3 is fixedly connected to the starting ends of both sides of the bracket 1 and is responsible for conveying the semiconductor chip tray 4 to be centered to the conveying mechanism 2. The feeding mechanism 3 includes a support frame 301. The support frame 301 is fixedly connected to the starting ends of both sides of the bracket 1, and the support frame 301 is parallel to the conveying mechanism 2.

[0068] Specifically, roller seats 302 are fixedly arranged on both sides of the top end of the support frame 301. Through holes are equidistantly arranged on both sides inside the roller seats 302. A roller body 303 is fixedly installed between the two opposite through holes. A plurality of roller bodies 303 form a sliding plane for reducing friction when the semiconductor chip tray 4 moves, so as to increase the moving speed of the semiconductor chip tray 4 and reduce the wear of the semiconductor chip tray 4.

[0069] Moreover, the sliding plane is parallel to the tray 208, which can ensure that the semiconductor chip tray 4 moves horizontally during the entire conveying process from the feeding mechanism 3 to the conveying mechanism 2, ensuring the conveying stability and efficiency of the semiconductor chip tray 4.

[0070] In one embodiment of this specification, a method for centering a semiconductor chip tray is provided to solve the problems of low chip tray collection efficiency and high cost in the prior art.

[0071] Specifically, as Figure 6 shown, the method for centering a semiconductor chip tray includes:

[0072] Step 610: Use the lifter to control the L-shaped centering seat to lift until the horizontal side of the L-shaped centering seat touches the semiconductor chip tray to be centered;

[0073] Step 620: Use the pusher to control the L-shaped centering seat to push towards the semiconductor chip tray to be centered until the vertical side of the L-shaped centering seat touches the semiconductor chip tray to be centered and the centering is completed.

[0074] In this embodiment, first, it is determined whether the horizontal side of the L-shaped centering seat touches the semiconductor chip tray to be centered, so as to determine whether the L-shaped centering seat is aligned with the semiconductor chip tray. After alignment, the pusher is used to control the L-shaped centering seat to advance towards the semiconductor chip tray to be centered, so that the L-shaped centering seat squeezes the semiconductor chip tray, completing the centering of the semiconductor chip tray. It is possible to use a centering device with a smaller size to achieve centering, thereby reducing the manufacturing cost of the centering device and improving the centering accuracy.

[0075] In an embodiment of this specification, after the semiconductor chip tray 4 is centered, the pusher 504 is used to control the L-shaped centering seat to move away from the centered semiconductor chip tray 4 to prepare for the next centering of the semiconductor chip tray. In this way, if the specification of the next semiconductor chip tray to be centered is the same as that of the semiconductor chip tray 4 that has been centered this time, the pusher 504 can be directly controlled to continue to push the L-shaped centering seat 505 towards the semiconductor chip tray to complete the centering, taking into account both the centering efficiency and accuracy.

[0076] In addition, if the specification of the next semiconductor chip tray to be centered is different from that of the semiconductor chip tray 4 that has been centered this time, the elevator 502 is used to control the L-shaped centering seat 505 to descend until the elevator 502 returns to the initial position. This is done to be able to adapt to the side structures of different specifications of the semiconductor chip tray, such as Figure 7 and Figure 8 the centering methods of semiconductor chip trays with two different side structure lengths shown, Figure 7 the side structure of the semiconductor chip tray in Figure 8 is longer than that of the semiconductor chip tray in

[0077] First, taking Figure 7 as an example, it is detected that the chip tray A has reached the position to be centered. The elevator 502 of the centering device 5 controls the L-shaped centering seat 505 to lift up from the first position (initial position) S1. When the horizontal side of the L-shaped centering seat 505 touches the chip tray A during the lifting process, the elevator 502 stops the lifting work, and the L-shaped centering seat 505 remains stationary. At this time, the L-shaped centering seat 505 reaches the second position S2, and the chip tray A falls into the first tier of the L-shaped centering seat. After confirming alignment, the pusher 504 of the centering device 5 controls the L-shaped centering seat 505 to move horizontally from the second position S2 towards the chip tray A until the vertical side of the L-shaped centering seat 505 touches the chip tray A and continues to squeeze towards the chip tray A to complete the centering and reaches the third position S3.

[0078] After alignment is completed, if it is detected that the next semiconductor chip tray to be aligned has the same specifications as chip tray A (the length and / or shape of the side structure are the same), the thruster 504 controls the L-shaped alignment seat 505 to move horizontally away from chip tray A from the third position S3 until it returns to the second position S2.

[0079] After alignment is completed, if it is detected that the next semiconductor chip tray to be aligned has different specifications from chip tray A (the length and / or shape of the side structure are different), the lifter 502 also needs to control the L-shaped alignment seat 505 to descend until it returns to the initial position (the first position S1).

[0080] Secondly, taking Figure 8 as an example, when it is detected that chip tray B has reached the position to be aligned, the lifter 502 of the alignment device 5 controls the L-shaped alignment seat 505 to lift upward from the first position (the initial position) S1'. When the horizontal side of the L-shaped alignment seat 505 touches chip tray B during the lifting process, the lifter 502 stops the lifting operation, and the L-shaped alignment seat 505 remains stationary. At this time, the L-shaped alignment seat 505 reaches the second position S2', and chip tray B falls into the second tier of the L-shaped alignment seat. After confirming alignment, the thruster 504 of the alignment device 5 controls the L-shaped alignment seat 505 to move horizontally towards chip tray B until the vertical side of the L-shaped alignment seat 505 touches chip tray B, and continues to squeeze towards chip tray B to complete alignment and reaches the third position S3'.

[0081] After alignment is completed, if it is detected that the next semiconductor chip tray to be aligned has the same specifications as chip tray B (the length and / or shape of the side structure are the same), the thruster 504 controls the L-shaped alignment seat 505 to move horizontally away from chip tray A until it returns to the second position S2.

[0082] After alignment is completed, if it is detected that the next semiconductor chip tray to be aligned has different specifications from chip tray B (the length and / or shape of the side structure are different), the lifter 502 also needs to control the L-shaped alignment seat 505 to descend until it returns to the initial position (the first position S1').

[0083] In another embodiment of this specification, before controlling the alignment device 5 to work, it is also necessary to detect whether each tier of the positioning slots 508 and 509 of the L-shaped alignment seat 505 is adapted to the side structure of the semiconductor chip tray to be aligned. If not, the staff needs to replace the positioning slots 508 and 509 of the L-shaped alignment seat 505, or disassemble some tiers of the positioning slots 508 and 509. The specific replacement method is determined according to the actual plan, and this specification does not make a limitation.

[0084] It should be understood that the number of tiers is determined according to the actual assembly situation, and the shape of the tiers is determined according to the side structure of the semiconductor chip tray to be centered actually, which can be square, wavy, diagonal, broken line or irregular shape, etc. Therefore, the number of tiers and the shape of the positioning grooves 508 and 509 are not limited in this specification.

[0085] In an embodiment of this specification, a method for conveying a semiconductor chip tray is provided to further solve the problems of low collection efficiency and high cost of the semiconductor chip tray.

[0086] Specifically, the method for conveying a semiconductor chip tray includes:

[0087] Controlling the conveying mechanism to convey the centered semiconductor chip tray to a specified position.

[0088] When the semiconductor chip tray 4 is centered and the centering device 5 moves horizontally away from the semiconductor chip tray 4 (for example, returns to the second position S2 or S2'), the conveying mechanism starts to work and conveys the semiconductor chip tray 4 to a predetermined position; after continuously performing the conveying work, multiple semiconductor chip trays 4 are automatically stacked.

[0089] In another embodiment of this specification, the method for conveying a semiconductor chip tray further includes detecting whether the feeding mechanism 3 supports the semiconductor chip tray to be centered. If so, the semiconductor chip tray conveying device controls the feeding mechanism 3 to roll and move the semiconductor chip tray to be centered to the conveying mechanism 2. At this time, the bottom of the semiconductor chip tray is supported by the conveying mechanism 2 and the bracket 1. Then, the centering device 5 controls the L-shaped centering seat 505 to complete the centering task of the semiconductor chip tray.

[0090] It should be noted that the semiconductor chip tray centering device and method, and the conveying device and method provided in the embodiments of this specification can be applied not only to the semiconductor chip technology field, but also to any reasonable container centering task. For example, for glass with different side structures, only the centering device suitable for the glass material needs to be replaced with reference to this specification. For tableware such as bowls and cups, only the disinfection and cleaning work of the centering device needs to be strengthened, and then a new centering device can be produced by selecting a suitable material and referring to this specification. The same applies to electronic products, flower pots, cardboard boxes, pen holders, etc., and will not be elaborated here.

[0091] The semiconductor chip tray centering device and method, and the conveying device and method provided by the embodiments of this specification effectively achieve the centering of the semiconductor chip tray by setting a centering device including a lifter, a pusher, and an L-shaped centering seat. Among them, the lifter controls the vertical lifting of the L-shaped centering seat to align the L-shaped centering seat with the semiconductor chip tray, which can effectively determine the lifting height of the L-shaped centering seat to ensure accurate centering. The pusher is used to control the horizontal movement of the L-shaped centering seat to clamp or release the semiconductor chip tray, and can squeeze the semiconductor chip tray to complete centering. A positioning groove adapted to the side structure of the semiconductor chip tray to be centered is formed on the inner side of the L-shaped centering seat, so that the contact surface that fits the side structure of the semiconductor chip tray is the largest, thereby increasing the stability during centering. At the same time, the conveying device is provided with a conveying mechanism and the above-mentioned centering device to convey the semiconductor chip tray centered by the centering device to realize the automatic stacking of the trays.

[0092] In the embodiments of this specification, the use of the terms "comprising" or "including" to describe the combination of elements, components, parts, or steps here also contemplates embodiments consisting essentially of these elements, components, parts, or steps. Here, by using the term "may", it is intended to indicate that any attribute described as "may" included is optional. Multiple elements, components, parts, or steps can be provided by a single integrated element, component, part, or step. Alternatively, a single integrated element, component, part, or step can be divided into multiple separate elements, components, parts, or steps. The disclosure of "a" or "an" used to describe an element, component, part, or step does not mean to exclude other elements, components, parts, or steps.

[0093] The present invention is described with reference to the flowcharts and / or block diagrams of methods, apparatuses, and computer program products according to embodiments of the present invention. It should be understood that each flow and / or block in the flowchart and / or block diagram, and the combination of flows and / or blocks in the flowchart and / or block diagram, can be implemented by computer program instructions. These computer program instructions can be provided to the processor of a general-purpose computer, a special-purpose computer, an embedded processor, or other programmable data processing device to generate a machine, so that the instructions executed by the processor of the computer or other programmable data processing device generate a device for realizing the functions specified in Figure 1 one flow or multiple flows and / or blocks Figure 1 one block or multiple blocks.

[0094] These computer program instructions can also be stored in a computer-readable memory that can direct a computer or other programmable data processing device to work in a specific manner, so that the instructions stored in the computer-readable memory generate a manufactured article including an instruction device, and the instruction device realizes the functions in the flow Figure 1 one flow or multiple flows and / or blocks Figure 1The functions specified in one or more boxes.

[0095] These computer program instructions can also be loaded onto a computer or other programmable data processing device, so that a series of operation steps are executed on the computer or other programmable device to generate a computer-implemented process. Thus, the instructions executed on the computer or other programmable device provide for implementing the steps of the functions specified in one Figure 1 one process or more processes and / or boxes Figure 1 step of the functions specified in one or more boxes.

[0096] In a typical configuration, a computing device includes one or more processors (CPUs), an input / output interface, a network interface, and memory.

[0097] The memory may include non-permanent memory in the computer-readable medium, in the form of random access memory (RAM) and / or non-volatile memory, such as read-only memory (ROM) or flash memory (flash RAM). The memory is an example of a computer-readable medium.

[0098] Computer-readable media includes permanent and non-permanent, removable and non-removable media that can store information by any method or technology. The information can be computer-readable instructions, data structures, program modules, or other data. Examples of computer storage media include, but are not limited to, phase change memory (PRAM), static random access memory (SRAM), dynamic random access memory (DRAM), other types of random access memory (RAM), read-only memory (ROM), electrically erasable programmable read-only memory (EEPROM), flash memory or other memory technologies, compact disc read-only memory (CD-ROM), digital versatile disc (DVD) or other optical storage, magnetic cassette tapes, magnetic disk storage or other magnetic storage devices, or any other non-transmission media that can be used to store information accessible by a computing device. As defined herein, computer-readable media does not include transitory media such as modulated data signals and carrier waves.

[0099] It should also be noted that the term "comprising", "including" or any other variant thereof is intended to cover non-exclusive inclusion, so that a process, method, or device comprising a series of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such process, method, or device. Without further limitation, an element defined by the statement "comprising an..." does not exclude the presence of additional identical elements in the process, method, or device comprising the element.

[0100] Those skilled in the art should understand that the embodiments of this specification can be provided as methods, systems, or computer program products. Therefore, this specification can take the form of a complete hardware embodiment, a complete software embodiment, or an embodiment combining software and hardware aspects. Moreover, this specification can take the form of a computer program product implemented on one or more computer-usable storage media (including but not limited to disk memory, CD-ROM, optical memory, etc.) containing computer-usable program code.

[0101] This specification can be described in the general context of computer-executable instructions executed by a computer, such as program modules. Generally, program modules include routines, programs, objects, components, data structures, etc. that perform specific tasks or implement specific abstract data types. This specification can also be practiced in a distributed computing environment where tasks are performed by remote processing devices connected through a communication network. In a distributed computing environment, program modules can be located in local and remote computer storage media including storage devices.

[0102] Each embodiment in this specification is described in a progressive manner. The key point of each embodiment is to illustrate the differences from other embodiments. For the same or similar parts among the embodiments, reference can be made to each other. The above embodiments are only used to illustrate the technical concept and characteristics of the present invention, and their purpose is to enable those skilled in the art to understand the content of the present invention and implement it accordingly. However, the protection scope of the present invention cannot be limited thereby. Any equivalent changes or modifications made according to the spirit and essence of the present invention should be covered within the protection scope of the present invention.

Claims

1. A semiconductor chip tray centering device, characterized in that, The centering device includes a lifter, a pusher, and an L-shaped centering seat; The lifter is used to control the vertical lifting of the L-shaped centering seat so that the L-shaped centering seat aligns with the semiconductor chip tray; The pusher is used to control the horizontal movement of the L-shaped centering seat to clamp or release the semiconductor chip tray; A positioning groove adapted to the side structure of the semiconductor chip tray to be centered is formed on the inner side of the L-shaped centering seat.

2. The centering device according to claim 1, characterized in that, The positioning groove is a stepped positioning groove.

3. The centering device according to claim 2, characterized in that, The steps in the stepped positioning groove have different shapes and / or sizes to adapt to semiconductor chip trays with side structures of different shapes and / or sizes.

4. The centering device according to claim 2, characterized in that, The stepped positioning groove can be disassembled as a whole.

5. The centering device according to claim 3, characterized in that, Each step of the stepped positioning groove can be disassembled individually.

6. The centering device according to claim 1, characterized in that, The centering device further includes a lifting seat, the lifting seat is arranged on the lifting end of the lifter, the pusher is arranged on the lifting seat, and the L-shaped centering seat is arranged on the pushing end of the pusher.

7. The centering device according to claim 6, characterized in that, The centering device further includes a telescopic guiding structure, one end of the telescopic guiding structure is arranged on the lifting seat, and the other end of the telescopic guiding structure is arranged on the L-shaped centering seat.

8. A semiconductor chip tray conveying device, characterized in that, The conveying device includes a conveying mechanism and the centering device according to any one of claims 1-7; The conveying device is used to convey the semiconductor chip tray centered by the centering device.

9. The conveying device according to claim 8, wherein, The conveying device further includes a loading mechanism, and the loading mechanism is used to convey the semiconductor chip tray to be centered to the centering device.

10. A method for centering a semiconductor chip tray, characterized in that, The centering method is applied to the centering device according to any one of claims 1-7, and the centering method includes: Using the lifter to control the L-shaped centering seat to lift until the horizontal side of the L-shaped centering seat touches the semiconductor chip tray to be centered; Using the pusher to control the L-shaped centering seat to push towards the semiconductor chip tray to be centered until the vertical side of the L-shaped centering seat touches the semiconductor chip tray to be centered and the centering is completed.

11. The centering method according to claim 10, characterized in that, After the centering is completed, it further includes: Using the pusher to control the L-shaped centering seat to move away from the centered semiconductor chip tray.

12. The centering method according to claim 11, wherein After using the pusher to control the L-shaped centering seat to move away from the centered semiconductor chip tray, it further includes: If the specification of the next semiconductor chip tray to be centered is different from that of the semiconductor chip tray that has been centered this time, use the lifter to control the L-shaped centering seat to descend until the lifter returns to the initial position.

13. A method for transporting a semiconductor chip tray, characterized in that, The conveying method is applied to the conveying device according to claim 8 or 9, and the conveying method includes: Controlling the conveying mechanism to convey the centered semiconductor chip tray to the designated position.

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