A double-sided polishing machine for silicon carbide based on CMP polishing technology

Abstract

This invention discloses a dedicated double-sided polishing machine for silicon carbide based on CMP polishing technology, belonging to the field of silicon carbide polishing technology. It includes a polishing machine base for support, with a control box mounted on the side of the base. The machine comprises a polishing liquid cylinder mounted on the upper side of the base, a polishing chamber mounted on the upper side of the base, and a dustproof chamber mounted on the upper side of the polishing chamber. The polishing liquid cylinder is equipped with a cooling circulation mechanism. This dedicated double-sided polishing machine for silicon carbide based on CMP polishing technology features an adsorption seat with a rotating plate assembly set at equal angles, enabling automatic loading and unloading, effectively improving the polishing efficiency of silicon carbide wafers, meeting the requirements of production line automation. Combined with a mature robotic arm mechanism, it can complete automated production line processing, ensuring that the polished parts do not produce steps, and improving the surface precision of the product through radial back-and-forth movement during polishing.

Description

Technical Field

[0001] This invention relates to the field of polishing technology for silicon carbide, specifically to a double-sided polishing machine for silicon carbide based on CMP polishing technology. Background Technology

[0002] Silicon carbide, as an emerging third-generation semiconductor material, is favored by the industry due to its large bandgap, high breakdown electric field, high thermal conductivity, high saturated electron mobility, and ability to withstand high power compared to traditional first- and second-generation semiconductors. However, during production, silicon carbide is difficult to process and polish, which affects the production efficiency of silicon carbide.

[0003] To overcome the aforementioned shortcomings, existing technology (Chinese patent application CN202323157443.5, filed on 2023-11-22) provides a silicon carbide polishing machine with a cleaning device. An electric cylinder drives a mounting housing, a first motor, and a connecting rod to move until the polishing pad abuts against both sides of the silicon carbide part. During this process, the extension length of the output end of the electric cylinder can be adjusted according to the pressure sensed by the electric cylinder until the pressure applied to the surface of the silicon carbide part by both electric cylinders is the same. This avoids one polishing pad being too tightly or too loosely in contact with the surface of the silicon carbide part, and it can also be used to process silicon carbide parts of different thicknesses. Furthermore, it allows for adjustment of the position of the silicon carbide part when held by personnel. Adapting to different needs, this solution not only overcomes the low processing efficiency of traditional methods that can only polish silicon carbide parts on one side, but also, thanks to the shift plate, allows the equipment to pause processing only during the shift plate's movement, resulting in better processing continuity. Furthermore, existing technology (Chinese patent application CN202220611307.5, filed March 21, 2022) describes a double-sided polishing machine for silicon carbide processing. This machine uses a motor to drive gears, which, through the interaction of the gears and gear rings, cause one of the second fixed shafts to rotate. The interaction of the limiting groove and the limiting prism allows both second fixed shafts to rotate simultaneously. Furthermore, the second fixed shaft drives the second sprocket to rotate. Through the design of the chain, the first sprocket, and the second sprocket, another first fixed shaft rotates, causing the lower and upper polishing discs to rotate simultaneously. This allows for simultaneous polishing of both surfaces, improving polishing efficiency. This also relates to existing technology (Chinese patent application CN202220394740.8, filed on 2022-02-25) of a silicon carbide double-sided polishing machine with a dust collection device. The mounting cavity in the mounting frame is used to install the motor of the grinding assembly. Grinding operations are performed in the grinding cavity, effectively preventing dust from entering the motor and causing damage, thus improving the motor's service life. The pressure mechanism can engage with the limit cam and is equipped with… The buffer spring at the other end of the limiting cam can compress the limiting cam and ensure its connection with the claw-type clamping mechanism, enabling the polishing head to be driven by a motor for polishing. It can effectively remove dust generated during the use of the double-sided polishing machine, preventing dust from adhering to the polishing head and avoiding the impact of adhering particles on the polishing quality during subsequent polishing. Although existing technologies can complete the polishing, the processing difficulty of obtaining finished silicon carbide wafers is much higher than that of traditional semiconductors, especially the polishing of silicon carbide. Due to the extremely high hardness and stable chemical properties of silicon carbide, traditional polishing processes have very low processing efficiency and cannot meet the actual production and use requirements.

[0004] To address the aforementioned issues, there is an urgent need for innovative designs based on existing silicon carbide polishing machines. Summary of the Invention

[0005] The purpose of this invention is to provide a dedicated double-sided polishing machine for silicon carbide based on CMP polishing technology, in order to solve the problem mentioned in the background art that the processing difficulty of obtaining finished silicon carbide wafers is much higher than that of traditional semiconductors, especially the polishing of silicon carbide. Due to the extremely high hardness and stable chemical properties of silicon carbide, traditional polishing processes have very low processing efficiency and are difficult to meet the actual production and use requirements.

[0006] To achieve the above objectives, the present invention provides the following technical solution: a silicon carbide-specific double-sided polishing machine based on CMP polishing technology, comprising a polishing machine base for support, and a control box mounted on the side of the polishing machine base; including: a polishing liquid cylinder mounted on the upper side of the polishing machine base, a polishing chamber mounted on the upper side of the polishing machine base, and a dustproof chamber mounted on the upper side of the polishing chamber, and a cooling circulation mechanism provided on the polishing liquid cylinder; a support plate mounted on the inner surface of the polishing chamber, a gear seat rotatably connected to the upper side of the support plate, and a drive gear meshing with the outer surface of the gear seat, a rotating plate mounted on the upper side of the gear seat, and a through hole opened on the inner surface of the rotating plate, and a limit sliding mechanism provided on the rotating plate.

[0007] Preferably, the polishing liquid cylinder and the polishing machine base form an integrated structure, the polishing machine base and the polishing chamber form a supporting structure, and the polishing chamber and the dustproof chamber form a dustproof structure.

[0008] The above structure facilitates effective control of silicon carbide detection results during use, and improves stability and safety.

[0009] Preferably, the cooling circulation mechanism includes a polishing assembly mounted on the lower surface of the polishing liquid cylinder, and a first cooling water chamber is formed in the side wall of the polishing liquid cylinder. A cooling plate is mounted on the lower surface of the polishing assembly, and a second cooling water chamber is formed on the inner surface of the cooling plate. The inner surface of the cooling plate has an inlet and an outlet, and the inlet and outlet are staggered at different heights. The polishing liquid cylinder and the polishing assembly form an integrated structure, and the polishing liquid cylinder and the first cooling water chamber form a cooling structure. The cooling plate, the inlet, and the outlet form a water circulation structure.

[0010] The above structure allows for effective control of cooling water circulation during use, improving circulation efficiency.

[0011] Preferably, a central control reducer is installed on the lower side of the inner surface of the polishing machine base, and an outlet flow channel is rotatably connected to the inner surface of the central control reducer. An outlet is installed on the lower side of the outlet flow channel, and an inlet is provided on the side of the outlet flow channel. An inlet flow channel is installed on the outer surface of the inlet flow channel, and the inlet flow channel is nested on the outside of the outlet flow channel.

[0012] The above structure allows for easy control of flow stability and temperature control during use by adjusting the inlet and outlet settings.

[0013] Preferably, the support plate and the polishing chamber form a nested structure, and the support plate forms a meshing and rotating structure with the drive gear through the gear seat. The gear seat and the rotating plate form an integral structure, and the through holes are set at equal angles with respect to the central axis of the inner surface of the rotating plate.

[0014] The above structure effectively supports the rotating plate and controls the rotation angle during use, facilitating subsequent polishing.

[0015] Preferably, the limiting sliding mechanism includes a slide rail mounted on the upper surface of the rotating plate, a movable seat slidably connected to the upper surface of the slide rail, and a mounting seat mounted on the upper surface of the movable seat. A servo motor is mounted on the outer side of the mounting seat, and a drive gear is rotatably connected to the surface of the servo motor. A driven gear is meshed with the outer surface of the drive gear, positioning the driven gear rotated above the mounting seat. The rotating plate forms a limiting moving structure with the slide rail and the movable seat. The movable seat, the mounting seat, and the servo motor are integrally connected. The servo motor meshes with the drive gear and the driven gear, and the driven gear and the mounting seat form a nested rotation.

[0016] The above structure effectively improves the stability of the moving seat during use, and the stability of the adsorption tube is controlled by the cooperation of the driving gear and the driven gear.

[0017] Preferably, an adsorption tube is installed on the inner surface of the driven gear, and an adapter is rotatably connected to the upper surface of the adsorption tube. An adsorption seat is installed on the lower surface of the adsorption tube. At the same time, a vacuum adsorption hole is opened on the inner surface of the adsorption seat, and a guide tube is provided on the outer side of the adsorption seat. The guide tube is positioned and installed on the lower surface of the rotating plate.

[0018] The above structure improves adsorption stability during use and, in conjunction with the rotation of the adsorption tube, allows for controlled rotation during the later stages of silicon carbide polishing.

[0019] Preferably, the driven gear and the adsorption tube form an integrated structure, and the adsorption tube and the adapter form a nested rotating structure. The adsorption tube and the vacuum adsorption hole form a through structure through the adsorption seat. At the same time, the guide tube and the lower side of the rotating plate are embedded and installed, and the outer surface of the guide tube has an arc-shaped structure.

[0020] The above structure effectively improves the assembly stability of the adsorption tube during use, and the adapter further enhances the connection stability.

[0021] Preferably, a support seat is mounted on the upper surface of the gear seat, and a second servo motor is mounted on the upper surface of the support seat. A rotating component is threadedly connected to the lower surface of the second servo motor via a threaded rod, and the rotating component is limited to slide on the inner surface of the support seat. Meanwhile, a connecting rod is rotatably connected to the outer surface of the rotating component, and a fixing component is rotatably connected to the lower side of the connecting rod, and the fixing component is mounted on the outer surface of the movable seat.

[0022] The above structure makes it easy to control the position of the support base during use, thereby adjusting the position of the moving base according to polishing requirements.

[0023] Preferably, the gear seat and the support seat are embedded in the lower surface of the gear seat and the support seat, and the support seat forms a limiting lifting structure with the rotating component through the servo motor, and the rotating component forms a pushing structure with the moving seat through the connecting rod and the fixing component.

[0024] The above structure improves the stability of the moving seat position adjustment during use, prevents tilting, and enhances the polishing effect.

[0025] Compared with the prior art, the beneficial effects of the present invention are:

[0026] 1. This silicon carbide-specific double-sided polishing machine based on CMP polishing technology is equipped with an adsorption seat assembled with a rotating plate and set at equal angles. It can realize automatic loading and unloading, effectively improve the polishing efficiency of silicon carbide wafers, meet the requirements of production line automation, and, when combined with a mature robotic arm mechanism, can complete automated processing on the production line, ensuring that the polished parts do not produce steps. Furthermore, the radial back-and-forth movement during polishing improves the surface precision of the product.

[0027] 2. This silicon carbide-specific double-sided polishing machine based on CMP polishing technology is equipped with a cooling circulation mechanism. This facilitates the polishing components assembled in the polishing fluid cylinder to work with the polishing fluid, and the cooling circulation is carried out through the first cooling water chamber. Furthermore, the cooling plate assembled on the lower side of the polishing fluid cylinder and its second cooling water chamber, along with the inlet and outlet, improve the cooling circulation effect. In addition, the outlet flow channel assembled in the cooling plate and the liquid outlet are used for water discharge, and the inlet flow channel nested outside the outlet flow channel, in conjunction with the liquid inlet, is used for water circulation and cooling of the first cooling water chamber and the cooling plate.

[0028] 3. This CMP polishing technology-based double-sided polishing machine for silicon carbide is equipped with a limiting sliding mechanism. A rotating plate assembled on a support plate controls the limited movement of the silicon carbide by an adsorption seat assembled at equal angles on its upper side. This mechanism, combined with the position adjustment of the adsorption seat, controls the adsorption of porous silicon carbide under vacuum. Furthermore, it works with the mounting base to adjust the adsorption tube vertically. Additionally, a servo motor assembled on the support base effectively controls the position of the rotating component, thereby adjusting the moving seat on the fixed component of the connecting rod assembly. This improves the stability of the moving seat adjustment and controls the position of the adsorbed silicon carbide, enhancing the polishing effect. Attached Figure Description

[0029] Figure 1 This is a schematic diagram of the three-dimensional structure of the polishing machine base of the present invention;

[0030] Figure 2 This is a schematic diagram of the internal three-dimensional structure of the polishing machine base of the present invention;

[0031] Figure 3 This is a half-sectional perspective view of the three-dimensional structure of the polishing machine base of the present invention;

[0032] Figure 4 This is a half-section three-dimensional structural diagram of the polishing liquid cylinder of the present invention;

[0033] Figure 5 This is a partial cross-sectional three-dimensional structural diagram of the polishing component of the present invention;

[0034] Figure 6 This is a schematic diagram of the three-dimensional structure of the cooling plate of the present invention;

[0035] Figure 7 This is a three-dimensional structural diagram of the movable seat of the present invention;

[0036] Figure 8 This is a half-sectional perspective view of the three-dimensional structure of the mounting base of the present invention;

[0037] Figure 9 This is a partial cross-sectional three-dimensional structural diagram of the rotating plate of the present invention.

[0038] In the diagram: 1. Polishing machine base; 2. Control box; 3. Polishing liquid cylinder; 301. Polishing assembly; 302. Cooling water chamber one; 4. Polishing chamber; 5. Dustproof chamber; 6. Cooling plate; 7. Cooling water chamber two; 8. Inlet; 9. Outlet; 10. Central control reducer; 11. Outlet channel; 12. Liquid outlet; 13. Liquid inlet; 14. Inlet channel; 15. Support plate; 16. Gear seat; 17. Drive gear; 18. Rotating plate; 19. Through hole; 20. Slide rail; 21. Moving seat; 22. Mounting seat; 23. Servo motor one; 24. Drive gear; 25. Driven gear; 26. Adsorption tube; 27. Adapter; 28. Adsorption seat; 29. ​​Vacuum adsorption hole; 30. Guide tube; 31. Support seat; 32. Servo motor two; 33. Rotating component; 34. Connecting rod; 35. Fixing component. Detailed Implementation

[0039] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0040] Please see Figures 1-9 The present invention provides a technical solution: a silicon carbide-specific double-sided polishing machine based on CMP polishing technology, which is provided with a polishing machine base 1 for support, and a control box 2 is installed on the side of the polishing machine base 1.

[0041] Example 1: As Figures 1-6The technical solution shown in the invention provides the following technical solution: A silicon carbide-specific double-sided polishing machine based on CMP polishing technology, comprising: a polishing liquid cylinder 3, installed on the upper side of a polishing machine base 1, with a polishing chamber 4 installed on the upper side of the polishing machine base 1, and a dustproof chamber 5 installed on the upper side of the polishing chamber 4; the polishing liquid cylinder 3 is provided with a cooling circulation mechanism; the polishing liquid cylinder 3 and the polishing machine base 1 form an integrated structure, and the polishing machine base 1 and the polishing chamber 4 form a supporting structure, and the polishing chamber 4 and the dustproof chamber 5 form a dustproof structure; the cooling circulation mechanism includes a polishing component 301 installed on the lower surface of the polishing liquid cylinder 3, and a cooling water chamber 302 is opened in the side wall of the polishing liquid cylinder 3; a cooling plate 6 is installed on the lower surface of the polishing component 301, and the cooling... The inner surface of the cooling plate 6 is provided with a cooling water chamber 7, and the inner surface of the cooling plate 6 is provided with a water inlet 8 and a water outlet 9, which are arranged at different heights. The polishing liquid cylinder 3 and the polishing assembly 301 form an integrated structure, and the polishing liquid cylinder 3 and the cooling water chamber 302 form a cooling structure. At the same time, the cooling plate 6, the water inlet 8 and the water outlet 9 form a water circulation structure. A central control reducer 10 is installed on the lower side of the inner surface of the polishing machine base 1, and the inner surface of the central control reducer 10 is rotatably connected to the outlet flow channel 11. The lower side of the outlet flow channel 11 is provided with a liquid outlet 12, and the side of the outlet flow channel 11 is provided with a liquid inlet 13. The outer surface of the liquid inlet 13 is provided with an inlet flow channel 14, which is nested on the outside of the outlet flow channel 11.

[0042] During use, the internal components of the control box 2 are activated, and sufficient polishing fluid is injected into the polishing fluid cylinder 3 assembled on the polishing machine base 1 to ensure that the liquid level completely covers the product during processing. The coolant is then transported through the inlet channel 14 and the liquid inlet 13 installed at the bottom of the polishing machine base 1 and delivered to the first cooling water chamber 302 of the polishing fluid cylinder 3. The coolant is then transported to the water inlet 8 by the cooling plate 6 assembled on the polishing assembly 301 connected to the polishing fluid cylinder 3, and circulated in the second cooling water chamber 7 of the cooling plate 6 to cool the bottom of the polishing assembly 301. The coolant is then discharged through the water outlet 9 of the cooling plate 6 and the liquid outlet 12 assembled on the outlet channel 11. In conjunction with the central control reducer 10, the temperature of the processed surface is kept within a reasonable range by continuously circulating the cooling water.

[0043] Example 2: Figure 1 , Figure 2 , Figure 3 , Figure 7 and Figure 8The technical solution shown, based on Embodiment 1, further discloses the position adjustment of the adsorption seat 28 for adsorption polishing, the specific details of which are as follows: a support plate 15 is installed on the inner surface of the polishing chamber 4, and a gear seat 16 is rotatably connected to the upper side of the support plate 15, and a drive gear 17 is meshed with the outer surface of the gear seat 16. A rotating plate 18 is installed on the upper side of the gear seat 16, and a through hole 19 is provided on the inner surface of the rotating plate 18. The rotating plate 18 is also provided with a limit sliding mechanism; the support plate 15 and the polishing chamber 4 form a nested structure, and the support plate 15 is connected to the gear... The gear seat 16 and the drive gear 17 form a meshing rotation structure, and the gear seat 16 and the rotating plate 18 form an integral structure. The through hole 19 is set at an equal angle to the central axis of the inner surface of the rotating plate 18. The limiting sliding mechanism includes a slide rail 20 mounted on the upper surface of the rotating plate 18, and a movable seat 21 is slidably connected to the upper surface of the slide rail 20. A mounting seat 22 is mounted on the upper surface of the movable seat 21. A servo motor 23 is mounted on the outer side of the mounting seat 22, and a drive gear 24 is rotatably connected to the surface of the servo motor 23. The outer surface of the drive gear 24 is also connected to the drive gear 24. A driven gear 25 is meshed with the mounting base 22, and the driven gear 25 is positioned and rotated above the mounting base 22. The rotating plate 18 forms a limiting movement structure with the movable base 21 via the slide rail 20. The movable base 21, the mounting base 22, and the servo motor 23 are integrally connected. The servo motor 23 meshes with the driven gear 25 via the driving gear 24, and the driven gear 25 and the mounting base 22 form a nested rotation. An adsorption tube 26 is mounted on the inner surface of the driven gear 25, and an adapter 27 is rotatably connected to the upper surface of the adsorption tube 26. The lower surface of the adsorption tube 26... An adsorption seat 28 is mounted on the surface, and a vacuum adsorption hole 29 is opened on the inner surface of the adsorption seat 28. A guide tube 30 is provided on the outer side of the adsorption seat 28, and the guide tube 30 is positioned and installed on the lower surface of the rotating plate 18. The driven gear 25 and the adsorption tube 26 form an integrated structure, and the adsorption tube 26 and the adapter 27 form a nested rotating structure. The adsorption tube 26 forms a through structure through the adsorption seat 28 and the vacuum adsorption hole 29. At the same time, the guide tube 30 is embedded in the lower side of the rotating plate 18, and the outer surface of the guide tube 30 has an arc-shaped structure.

[0044] During silicon carbide polishing, controlling the loading and unloading position of the movable seat 21 moves the adsorption tube 26 assembled on the mounting seat 22 upwards, causing the adsorption seats 28 and vacuum adsorption holes 29 mounted on the adsorption tube 26 to adsorb and load the silicon carbide. Simultaneously, controlling the support plate 15 assembled in the polishing chamber 4 rotates the drive gear 17, adjusting the gear seat 16 as it rotates on the support plate 15. This, in turn, rotates the rotating plate 18 by a certain angle, controlling another set of adsorption seats 28 to adsorb silicon carbide. Once all the adsorption seats 28 on the rotating plate 18 have adsorbed silicon carbide, the height of the adsorption tube 26 can be adjusted by controlling the mounting seat 22. The adapter 27 moves down synchronously, and the silicon carbide adsorbed by the adsorption seat 28 contacts the polishing component 301. The servo motor 23 mounted on the mounting base 22 drives the drive gear 24 to rotate, and the driven gear 25 is engaged to control the rotation of the adsorption tube 26, thereby driving the silicon carbide to perform synchronous rotary polishing. In conjunction with the drive gear 17, the rotation of the gear seat 16 is adjusted, and the position is alternately polished synchronously to improve the polishing effect. The silicon carbide can be used for rotary polishing in the polishing liquid cylinder 3. In addition, the use of the guide tube 30 allows the polishing liquid to flow back from the outer ring to the center, improving the polishing effect.

[0045] Example 3: Figure 1 , Figure 3 and Figure 9 The technical solution shown, based on Embodiment 2, further discloses the position adjustment and transformation of the movable seat 21, the specific details of which are as follows: A support seat 31 is installed on the upper surface of the gear seat 16, and a servo motor 32 is installed on the upper surface of the support seat 31. A rotating component 33 is threadedly connected to the lower surface of the servo motor 32 via a threaded rod, and the rotating component 33 is limited to slide on the inner surface of the support seat 31. At the same time, a connecting rod 34 is rotatably connected to the outer surface of the rotating component 33, and a fixing component 35 is rotatably connected to the lower side of the connecting rod 34, and the fixing component 35 is installed on the outer surface of the movable seat 21. The gear seat 16 and the lower surface of the support seat 31 are embedded and installed, and the support seat 31 forms a limiting lifting structure with the rotating component 33 via the servo motor 32, and the rotating component 33 forms a pushing structure with the movable seat 21 via the connecting rod 34 and the fixing component 35.

[0046] When the radial position of the adsorption seat 28 on the moving seat 21 is adjusted, the servo motor 32 of the control support seat 31 is controlled to adjust the thread limit of the rotating part 33, thereby controlling the rotating part 33 to move up and down, driving the connecting rod 34 to control the position of the fixing part 35, thereby adjusting the position of the moving seat 21 on which the fixing part 35 is installed. This allows the adsorption tube 26 assembled on the moving seat 21 to slide within the through hole 19 of the rotating plate 18, thereby improving the polishing effect and preventing steps from forming on the polished part.

[0047] The contents not described in detail in this specification are existing technologies known to those skilled in the art.

[0048] Although embodiments of the invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A silicon carbide-specific double-sided polishing machine based on CMP polishing technology, comprising a polishing machine base for support, and a control box installed on the side of the polishing machine base; Its features are, include: A polishing liquid cylinder is installed on the upper side of the polishing machine base, and a polishing chamber is installed on the upper side of the polishing machine base. A dustproof chamber is installed on the upper side of the polishing chamber, and the polishing liquid cylinder is equipped with a cooling circulation mechanism. A support plate is installed on the inner surface of the polishing chamber, and a gear seat is rotatably connected to the upper side of the support plate. A drive gear is meshed with the outer surface of the gear seat. A rotating plate is installed on the upper side of the gear seat, and a through hole is opened on the inner surface of the rotating plate. The rotating plate is also provided with a limit sliding mechanism. The limiting sliding mechanism includes a slide rail mounted on the upper surface of the rotating plate, a movable seat slidably connected to the upper surface of the slide rail, and a mounting seat mounted on the upper surface of the movable seat. A servo motor is mounted on the outer side of the mounting seat, and a drive gear is rotatably connected to the surface of the servo motor. A driven gear is meshed with the outer surface of the drive gear, positioning the driven gear above the mounting seat. The rotating plate and the movable seat together form a limiting moving structure. An adsorption tube is installed on the inner surface of the driven gear, and an adapter is rotatably connected to the upper surface of the adsorption tube. An adsorption seat is installed on the lower surface of the adsorption tube. At the same time, a vacuum adsorption hole is opened on the inner surface of the adsorption seat, and a guide tube is provided on the outer side of the adsorption seat. The guide tube is positioned and installed on the lower surface of the rotating plate. A support seat is installed on the upper surface of the gear seat, and a servo motor 2 is installed on the upper surface of the support seat. A rotating component is threadedly connected to the lower surface of the servo motor 2 through a threaded rod, and the rotating component is limited to slide on the inner surface of the support seat. Meanwhile, a connecting rod is rotatably connected to the outer surface of the rotating component, and a fixing component is rotatably connected to the lower side of the connecting rod, and the fixing component is installed on the outer surface of the movable seat. The gear seat and the support seat are embedded in the lower surface of the gear seat and the support seat. The support seat and the rotating part form a limit lifting structure through the servo motor and the rotating part form a push structure through the connecting rod and the fixed part and the moving seat.

2. The silicon carbide-specific double-sided polishing machine based on CMP polishing technology according to claim 1, characterized in that: The polishing liquid cylinder and the polishing machine base form an integrated structure, the polishing machine base and the polishing chamber form a supporting structure, and the polishing chamber and the dustproof chamber form a dustproof structure.

3. A silicon carbide-specific double-sided polishing machine based on CMP polishing technology according to claim 1, characterized in that: The cooling circulation mechanism includes a polishing assembly mounted on the lower surface of the polishing liquid cylinder, and a cooling water chamber I is formed in the side wall of the polishing liquid cylinder. A cooling plate is mounted on the lower surface of the polishing assembly, and a cooling water chamber II is formed on the inner surface of the cooling plate. The inner surface of the cooling plate has an inlet and an outlet, which are staggered at different heights. The polishing liquid cylinder and the polishing assembly form an integrated structure, and the polishing liquid cylinder and the first cooling water chamber form a cooling structure. The cooling plate, the inlet, and the outlet form a water circulation structure.

4. A silicon carbide-specific double-sided polishing machine based on CMP polishing technology according to claim 3, characterized in that: A central control reducer is installed on the lower inner surface of the polishing machine base, and an outlet flow channel is rotatably connected to the inner surface of the central control reducer. An outlet port is installed on the lower side of the outlet flow channel, and an inlet port is provided on the side of the outlet flow channel. An inlet flow channel is installed on the outer surface of the inlet port, and the inlet flow channel is nested on the outside of the outlet flow channel.

5. A silicon carbide-specific double-sided polishing machine based on CMP polishing technology according to claim 1, characterized in that: The support plate and the polishing chamber form a nested structure, and the support plate forms a meshing and rotating structure with the drive gear through the gear seat. The gear seat and the rotating plate form an integral structure, and the through holes are set at equal angles with respect to the central axis of the inner surface of the rotating plate.

6. A silicon carbide-specific double-sided polishing machine based on CMP polishing technology according to claim 1, characterized in that: The movable base, the mounting base, and the servo motor form an integrated connection. The servo motor has a meshing structure with the driving gear and the driven gear, while the driven gear and the mounting base form a nested rotation.

7. A silicon carbide-specific double-sided polishing machine based on CMP polishing technology according to claim 6, characterized in that: The driven gear and the adsorption tube form an integrated structure, and the adsorption tube and the adapter form a nested rotating structure. The adsorption tube and the vacuum adsorption hole form a through structure through the adsorption seat. At the same time, the guide tube and the lower side of the rotating plate are embedded and installed, and the outer surface of the guide tube has an arc-shaped structure.

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