High-flatness semiconductor chip mounting method

Abstract

The invention discloses a high-flatness semiconductor chip mounting method. The method comprises the following steps: S1, detecting first flatness information of the upper surface of a substrate to be mounted; s2, detecting second flatness information of the lower surface of the chip to be mounted; s3, comparing and analyzing the first planeness information and the second planeness information to obtain planeness deviation information between the first planeness information and the second planeness information; s4, adjusting the flatness of the lower surface of the to-be-mounted chip and / or the upper surface of the to-be-mounted substrate according to the flatness deviation information; s5, mounting a to-be-mounted chip on the upper surface of the to-be-mounted substrate; wherein the sequence of the step S1 and the step S2 can be exchanged. By adopting the technical scheme, the chip mounting planeness can be detected and adjusted, the mounting precision can be improved, and the bonding quality and the chip performance can be improved.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor chip mounting, and in particular to a semiconductor chip mounting method with high flatness. Background Art

[0002] In the field of semiconductor chip mounting, the chip mounting accuracy requirements are getting higher and higher. Among them, the flatness between the chip and the substrate has a crucial impact on the bonding quality and chip performance.

[0003] In traditional chip mounting and bonding processes, it is often difficult to accurately control the relative position between the chip and the substrate, resulting in poor flatness after mounting and thermal curing, which in turn affects the reliability and electrical performance of the bonding and cannot meet the increasingly stringent flatness requirements of semiconductor manufacturing processes. Summary of the Invention

[0004] The purpose of the present invention is to address the defects and shortcomings of the existing technology and provide a high-planarity semiconductor chip mounting method, which has the advantages of detecting and adjusting the flatness of chip mounting, improving mounting accuracy, and improving bonding quality and chip performance.

[0005] To achieve the above-mentioned object, the technical solution adopted by the present invention is: a high-planarity semiconductor chip mounting method, comprising:

[0006] S1: Detecting the first flatness information of the upper surface of the substrate to be mounted;

[0007] S2: Detecting the second flatness information of the lower surface of the chip to be mounted;

[0008] S3: Comparing and analyzing the first flatness information and the second flatness information to obtain flatness deviation information between the first flatness information and the second flatness information;

[0009] S4: adjusting the flatness of the lower surface of the chip to be mounted and / or the upper surface of the substrate to be mounted according to the flatness deviation information;

[0010] S5: Mounting the chip to be mounted on the upper surface of the substrate to be mounted;

[0011] The order of step S1 and step S2 can be swapped.

[0012] The present invention is further configured to include between step S4 and step S5:

[0013] S4.1: Repeat steps S1, S2, and S3 to obtain the adjusted flatness deviation information;

[0014] S4.2: Determine whether the adjusted flatness deviation information is less than the set value; if it is less than the set value, proceed to step S5; if it is greater than the set value, jump to step S4.

[0015] The present invention is further provided that the substrate to be mounted is disposed on the substrate carrying platform. In step S1: The first flatness detection module disposed above the substrate carrying platform detects the first flatness information of the upper surface of the substrate to be mounted.

[0016] The present invention is further provided that the chip to be mounted is disposed on the chip suction module. In step S2: The second flatness detection module disposed below the chip suction module detects the second flatness information of the lower surface of the chip to be mounted.

[0017] The present invention is further provided that the first flatness detection module includes: a first height measurement component; in step S1: The first height measurement component obtains the first flatness information of the upper surface of the substrate to be mounted by measuring the height information of multiple measurement points on the upper surface of the substrate to be mounted.

[0018] The present invention is further provided, characterized in that the second flatness detection module includes: a second height measurement component; in step S1: The second height measurement component obtains the second flatness information of the lower surface of the chip to be mounted by measuring the height information of multiple measurement points on the lower surface of the chip to be mounted.

[0019] The present invention is further provided that in step S4: The flatness of the lower surface of the chip to be mounted is adjusted by the first flatness adjustment module, and / or the flatness of the upper surface of the substrate to be mounted is adjusted by the second flatness adjustment module.

[0020] The present invention is further provided that the chip to be mounted is disposed below the first flatness adjustment module. The first flatness adjustment module includes: a plurality of elastic sheets stacked in the Z-axis direction and connected with gaps, and a plurality of adjusting screws; a plurality of adjusting holes are provided through the plurality of elastic sheets along the Z-axis direction around the elastic sheets, and the adjusting screws are disposed in the adjusting holes, and the distance between the plurality of elastic sheets can be changed by stretching or pushing the elastic sheets through the adjusting screws;

[0021] In step S4: Selectively adjust the plurality of adjusting screws to adjust the flatness of the lower surface of the chip to be mounted.

[0022] The present invention is further provided that the chip to be mounted is disposed below the first flatness adjustment module. The first flatness adjustment module includes: an electric angular position table;

[0023] In step S4: The electric angular position table automatically adjusts the flatness of the lower surface of the chip to be mounted according to the flatness deviation information.

[0024] The present invention is further configured that in step S5: during the chip and substrate mounting process, a thermosetting device is used for heating to cure the bonding material between the chip and the substrate.

[0025] After adopting the above technical solution, the beneficial effects of the present invention are as follows:

[0026] In the present invention, by comparing and analyzing the first flatness information on the upper surface of the substrate to be mounted and the second flatness information on the lower surface of the chip to be mounted, the flatness deviation information between the first flatness information and the second flatness information is obtained; according to the flatness deviation information, the flatness of the lower surface of the chip to be mounted and / or the upper surface of the substrate to be mounted is adjusted; so that the chip to be mounted and the substrate to be mounted are mounted with a smaller flatness deviation, ensuring that the mounted and thermoset product meets the high flatness standard, and improving the bonding quality and chip performance. Description of the Drawings

[0027] In order to more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the following will briefly introduce the drawings required for use in the description of the embodiments or the prior art. Obviously, the following drawings are only some embodiments of the present invention. For those of ordinary skill in the art, without creative efforts, other drawings can also be obtained based on these drawings.

[0028] Figure 1 is a schematic diagram of the present invention;

[0029] Figure 2 is another schematic diagram of the present invention;

[0030] Figure 3 is a schematic structural diagram of Embodiment 2 of the present invention;

[0031] Figure 4 is a schematic structural diagram of another perspective of Embodiment 2 of the present invention;

[0032] Figure 5 is a schematic structural diagram of the operating head and the chip carrier platform in Embodiment 2 of the present invention;

[0033] Figure 6 is a schematic structural diagram of the chip carrier platform in Embodiment 2 of the present invention;

[0034] Figure 7 is a schematic structural diagram of the operating head in Embodiment 2 of the present invention;

[0035] Figure 8 is a schematic structural diagram of the chip suction module and the first flatness adjustment module in Embodiment 2 of the present invention;

[0036] Figure 9It is a schematic structural diagram of the first flatness adjustment module in the second embodiment of the present invention;

[0037] Figure 10 It is a schematic structural diagram of another perspective of the first flatness adjustment module in the second embodiment of the present invention.

[0038] Explanation of reference numerals: 100, frame; 200, substrate carrying platform; 300, chip suction module; 310, suction head; 400, first flatness detection module; 500, second flatness detection module; 600, first flatness adjustment module; 410, first vision module; 510, second vision module; 800, upper operating head; 810, first driving member; 820, second driving member; 320, third driving member; 610, elastic sheet; 620, adjustment hole; 210, substrate adjustment driving member. Detailed implementation manners

[0039] In order to more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the following will briefly introduce the drawings required for the description of the embodiments or the prior art. Obviously, the following drawings are only some embodiments of the present invention. For those of ordinary skill in the art, without creative efforts, other drawings can also be obtained based on these drawings.

[0040] Embodiment 1:

[0041] This embodiment relates to a semiconductor chip mounting method with high flatness. As Figure 1-2 shown, it includes the following steps:

[0042] S1: Detect the first flatness information of the upper surface of the substrate to be mounted;

[0043] S2: Detect the second flatness information of the lower surface of the chip to be mounted;

[0044] S3: Compare and analyze the first flatness information and the second flatness information to obtain the flatness deviation information between the first flatness information and the second flatness information;

[0045] S4: Adjust the flatness of the lower surface of the chip to be mounted and / or the upper surface of the substrate to be mounted according to the flatness deviation information;

[0046] S5: Mount the chip to be mounted on the upper surface of the substrate to be mounted;

[0047] So that the chip to be mounted and the substrate to be mounted are mounted with a small flatness deviation, ensuring that the mounted product meets the high flatness standard and improving the bonding quality and chip performance.

[0048] Among them, the order of step S1 and step S2 can be interchanged.

[0049] Between step S4 and step S5, it also includes:

[0050] S4.1: Repeat steps S1, S2, and S3 to obtain the adjusted flatness deviation information;

[0051] S4.2: Determine whether the adjusted flatness deviation information is less than the set value; if it is less than the set value, proceed to step S5; if it is greater than the set value, jump to step S4. Repeatedly adjust the flatness of the lower surface of the chip to be mounted and / or the upper surface of the substrate to be mounted to meet the set standard and satisfy the requirements of chip mounting. Among them, the operator can adjust the size of the set value according to the actual required mounting accuracy.

[0052] The substrate to be mounted is arranged on the substrate carrying platform 200. In step S1: The first flatness detection module 400 arranged above the substrate carrying platform 200 detects the first flatness information of the upper surface of the substrate to be mounted.

[0053] The chip to be mounted is arranged on the chip suction module 300. In step S2: The second flatness detection module 500 arranged below the chip suction module 300 detects the second flatness information of the lower surface of the chip to be mounted.

[0054] The first flatness detection module 400 includes: a first height measurement component; in step S1: The first height measurement component obtains the first flatness information of the upper surface of the substrate to be mounted by measuring the height information of multiple measurement points on the upper surface of the substrate to be mounted.

[0055] The second flatness detection module 500 includes: a second height measurement component; in step S1: The second height measurement component obtains the second flatness information of the lower surface of the chip to be mounted by measuring the height information of multiple measurement points on the lower surface of the chip to be mounted.

[0056] In step S4: The flatness of the lower surface of the chip to be mounted is adjusted by the first flatness adjustment module 600, and / or the flatness of the upper surface of the substrate to be mounted is adjusted by the second flatness adjustment module.

[0057] In this embodiment, the chip to be mounted is disposed below the first flatness adjustment module 600. The first flatness adjustment module 600 includes: a plurality of elastic sheets 610 stacked along the Z-axis direction and connected with a gap, and a plurality of adjusting screws; a plurality of adjusting holes 620 are provided through the plurality of elastic sheets 610 along the Z-axis direction around the elastic sheets 610, and the adjusting screws are disposed in the adjusting holes 620, and the distance between the plurality of elastic sheets 610 can be changed by stretching or pushing the elastic sheets 610 through the adjusting screws; in step S4: selectively adjusting the plurality of adjusting screws to adjust the flatness of the lower surface of the chip to be mounted. Of course, in other embodiments, the first flatness module can also be configured into other structures, and the flatness of the lower surface of the chip to be mounted is adjusted through other steps. For example: the first flatness adjustment module 600 includes: an electric angular position table; in step S4: the electric angular position table automatically adjusts the flatness of the lower surface of the chip to be mounted according to the flatness deviation information.

[0058] As a preferred solution, during the chip and substrate mounting process, a heat curing device is used for heating to cure the bonding material between the chip and the substrate, and the mounting bonding of the chip is completed.

[0059] Embodiment 2:

[0060] This embodiment relates to a semiconductor chip mounting device with high flatness, which is applied to the mounting method described in Embodiment 1; as Figure 2-10 shown, it includes a frame 100, and the frame 100 is provided with: a substrate carrying platform 200, a chip suction module 300, a first flatness detection module 400, a second flatness detection module 500, a mounting flatness analysis module, and a first flatness adjustment module 600.

[0061] Among them, the substrate carrying platform 200 is disposed in the middle of the frame 100 for carrying the substrate. The substrate carrying platform 200 includes a fixing member for fixing the substrate to maintain the stability of the substrate. The chip suction module 300 is disposed above the substrate carrying platform 200. The chip suction module 300 includes: a suction head 310 for sucking the chip to be mounted, and a chip transfer driving member for driving the suction head 310 to move; the suction head 310 is driven by the chip transfer driving member to move to complete operations such as chip picking, transferring, and mounting, and the degree of automation of the operation process is high.

[0062] The first flatness detection module 400 is disposed above the substrate carrying platform 200 and is used to detect the first flatness information of the upper surface of the substrate carrying platform 200 or the upper surface of the substrate to be mounted on the substrate carrying platform 200. The first flatness information includes: the inclination trend of the first plane. The second flatness detection module 500 is disposed below the chip suction module and is used to detect the second flatness information of the lower surface of the suction head 310 or the lower surface of the chip to be mounted on the suction head 310; the second flatness information includes: the inclination trend of the second plane. The mounting flatness analysis module is electrically connected to the first flatness detection module 400 and the second flatness detection module 500 respectively, and can obtain the first flatness information and the second flatness information, and can compare and analyze the first flatness information and the second flatness information, so as to obtain the flatness deviation information and the flatness adjustment information of the two. The first flatness adjustment module 600 is disposed on the chip suction module 300 and is used to adjust the flatness of the lower surface of the suction head 310 or the lower surface of the chip to be mounted on the suction head 310. The flatness of the lower surface of the suction head 310 or the lower surface of the chip to be mounted on the suction head 310 can be adjusted according to the flatness deviation information and the flatness adjustment information obtained by the mounting flatness analysis module, so that the flatness deviation between the lower surface of the suction head 310 and the upper surface of the substrate carrying platform 200, or between the lower surface of the suction head 310 and the upper surface of the substrate to be mounted on the substrate carrying platform 200, or between the lower surface of the chip to be mounted on the suction head 310 and the upper surface of the substrate carrying platform 200, or between the lower surface of the chip to be mounted on the suction head 310 and the upper surface of the substrate to be mounted on the substrate carrying platform 200 is greatly reduced, realizing the precise adjustment of the chip mounting flatness; only after that will the chip be mounted on the substrate through the chip suction module 300 to ensure that a higher flatness standard is achieved after mounting, improving the bonding quality and chip performance. In this embodiment, the first flatness adjustment module 600 can cooperate with the first flatness detection module 400, the second flatness detection module 500 and the mounting flatness analysis module to repeatedly adjust the flatness deviation to achieve a lower flatness deviation and realize a good mounting effect.

[0063] In this embodiment, the substrate carrying platform 200 further includes: a second flatness adjustment module, and the second flatness adjustment module is used to adjust the flatness of the upper surface of the substrate carrying platform 200 or the upper surface of the substrate to be mounted on the substrate carrying platform 200. By the mutual cooperation of the first flatness adjustment module 600 and the second flatness adjustment module, the device has a larger adjustment range and can adapt to more different types of chips and substrates. At the same time, the two flatness adjustment modules make the flatness deviation adjustment process simpler and more convenient.

[0064] As a preferred solution, the mounting flatness analysis module can display the flatness deviation information and flatness adjustment information through a display or external device for the operator to observe, and use it as a basis for flatness adjustment, and manually adjust the flatness deviation through the first flatness adjustment module 600 or the second flatness adjustment module; the mounting flatness analysis module can also be directly electrically connected to the first flatness adjustment module 600 or the second flatness adjustment module to transmit the flatness deviation information and flatness adjustment information to the first flatness adjustment module 600 or the second flatness adjustment module, and the first flatness adjustment module 600 or the second flatness adjustment module can automatically make adjustments based on the flatness deviation information and flatness adjustment information.

[0065] In this embodiment, the first flatness detection module 400 includes a first height measurement component, which is used to measure the height information of various locations on the upper surface of the substrate support platform 200 or the upper surface of the substrate to be mounted on the substrate support platform 200, and analyze the measured height information to obtain first flatness information. The measured height information also provides height data for chip placement, achieving a good placement effect. As a preferred embodiment, the first height measurement component includes a laser height measurement component or a spectral confocal height measurement component to achieve a good height measurement effect.

[0066] In this embodiment, the second flatness detection module 500 includes a second height measurement component, which is used to measure the height information of the lower surface of the adsorption head 310 or the lower surface of the chip to be mounted on the adsorption head 310, and analyze the measured height information to obtain second flatness information. The measured height information also provides height data for chip placement, achieving a good placement effect. As a preferred embodiment, the second height measurement component includes a laser height measurement component or a spectral confocal height measurement component to achieve a good height measurement effect.

[0067] As a preferred solution, the mounting device also includes: a first visual module 410, which is arranged above the substrate carrying platform 200, and is used to identify the substrate to be mounted on the substrate carrying platform 200, detect the quality of the substrate to be mounted, and can also position the substrate to be mounted to achieve a good mounting effect. At the same time, the first visual module 410 can also identify the substrate after mounting to determine the mounting effect. In this embodiment, the mounting device also includes: a second visual module 510, which is arranged below the chip suction module 300, and is used to identify the chip to be mounted on the adsorption head 310, detect the quality of the substrate to be mounted, avoid mounting a bad chip on the substrate, and can also position the chip to be mounted to achieve a good mounting effect.

[0068] In this embodiment, the mounting device further includes: an upper operating head 800, a first driving member 810 for driving the upper operating head 800 to move in the X direction, and a second driving member 820 for driving the operating head to move in the Y direction. The first vision module 410, the first flatness detection module 400, and the chip suction module 300 are all mounted on the operating head; so as to realize the first vision module 410 moving to well identify the substrate to be mounted on the substrate carrying platform 200; realize the first flatness detection module 400 moving to well detect the flatness of the upper surface of the substrate carrying platform 200 and the upper surface of the substrate to be mounted on the upper substrate carrying platform 200. The chip transfer driving member includes a third driving member 320 mounted on the operating head for driving the chip to move along the Z-axis (height direction). Through the cooperation of the first driving member 810, the second driving member 820, and the third driving member 320, the suction head 310 can be moved in three axes, ensuring that the chip suction module 300 can well complete the work of chip picking, transferring, and mounting.

[0069] As a preferred solution, the suction head 310 is mounted below the first flatness adjustment module 600. The first flatness adjustment module 600 includes: a plurality of elastic sheets 610 stacked in the Z-axis direction and connected with a gap, and a plurality of adjusting screws; wherein around the elastic sheets 610, a plurality of adjusting holes 620 are provided through the plurality of elastic sheets 610 in the Z-axis direction, and the adjusting screws are arranged in the adjusting holes 620. By selectively adjusting the adjusting screws on one side, the adjusting screws stretch or push the elastic sheets 610 to change the distance between the plurality of elastic sheets 610 at the position of the adjusting screws, so as to change the inclination direction and strength of the lower surface of the flatness adjustment module, so as to adjust the flatness of the lower surface of the suction head 310 or the lower surface of the chip to be mounted on the suction head 310. Of course, in other embodiments, the flatness adjustment module can also be of other structures. To adjust the flatness of the lower surface of the suction head 310 or the lower surface of the chip to be mounted on the suction head 310. For example, piezoelectric materials are used, and the piezoelectric materials are deformed through the inverse piezoelectric effect to achieve the effect of adjusting the flatness, or it is set as an electric angular position table, and the electric angular position table is electrically connected to the mounting flatness analysis module, so that the electric angular position table can adjust the flatness of the lower surface of the suction head or the lower surface of the chip to be mounted on the suction head according to the analysis result of the mounting flatness analysis module, realizing the automatic adjustment of the mounting flatness.

[0070] In this embodiment, the structure of the second flatness adjustment module is the same as that of the first flatness adjustment module 600.

[0071] In this embodiment, a substrate adjustment driving member 210 is further provided on the rack 100. The substrate adjustment driving member 210 is used to drive the substrate carrying platform 200 to move in the X-axis, Y-axis or Z-axis directions, so as to adjust the position of the chip above the substrate carrying platform 200. As a preferred solution, the substrate adjustment driving member 210 is a driving member with a small stroke and high precision, which is used to finely adjust the position of the chip above the substrate carrying platform 200 to achieve a good mounting effect.

[0072] As a preferred solution, the mounting device further includes: a thermosetting device, which is used to heat during the chip and substrate mounting process to cure the bonding material between the chip and the substrate, and complete the mounting bonding of the chip.

[0073] The above is only used to illustrate the technical solution of the present invention and not to limit it. Any other modifications or equivalent replacements made by those of ordinary skill in the art to the technical solution of the present invention shall be covered by the scope of the claims of the present invention as long as they do not depart from the spirit and scope of the technical solution of the present invention.

Claims

1. A semiconductor chip mounting method with high flatness, characterized in that Including: S1: Detect the first flatness information of the upper surface of the substrate to be mounted; S2: Detect the second flatness information of the lower surface of the chip to be mounted; S3: Compare and analyze the first flatness information and the second flatness information to obtain the flatness deviation information between the first flatness information and the second flatness information; S4: Adjust the flatness of the lower surface of the chip to be mounted and / or the upper surface of the substrate to be mounted according to the flatness deviation information; S5: Mount the chip to be mounted on the upper surface of the substrate to be mounted; Wherein, the order of step S1 and step S2 can be interchanged.

2. The method for mounting a semiconductor chip with high flatness according to claim 1, wherein Between step S4 and step S5, it further includes: S4.1: Repeat step S1, S2, S3 to obtain the adjusted flatness deviation information; S4.2: Determine whether the adjusted flatness deviation information is less than the set value; if it is less than the set value, enter step S5; if it is greater than the set value, jump to step S4.

3. The semiconductor chip mounting method with high flatness according to claim 1, characterized in that The substrate to be mounted is arranged on the substrate carrying platform (200). In step S1: The first flatness detection module (400) arranged above the substrate carrying platform (200) is used to detect the first flatness information of the upper surface of the substrate to be mounted.

4. The semiconductor chip mounting method with high flatness according to claim 1, wherein The chip to be mounted is arranged on the chip suction module (300). In step S2: The second flatness detection module (500) arranged below the chip suction module (300) is used to detect the second flatness information of the lower surface of the chip to be mounted.

5. The method for mounting a semiconductor chip with high flatness according to claim 3, characterized in that, The first flatness detection module (400) includes: a first height measurement component; In step S1: The first height measurement component obtains the first flatness information of the upper surface of the substrate to be mounted by measuring the height information of multiple measurement points on the upper surface of the substrate to be mounted.

6. The semiconductor chip mounting method with high flatness according to claim 4, characterized in that, The second flatness detection module (500) includes: a second height measurement component; In step S1: The second height measurement component obtains the second flatness information of the lower surface of the chip to be mounted by measuring the height information of multiple measurement points on the lower surface of the chip to be mounted.

7. The semiconductor chip mounting method with high flatness according to claim 1, characterized in that, In step S4: The flatness of the lower surface of the chip to be mounted is adjusted by the first flatness adjustment module (600), and / or the flatness of the upper surface of the substrate to be mounted is adjusted by the second flatness adjustment module.

8. The method for mounting a semiconductor chip with high flatness according to claim 7, wherein The chip to be mounted is arranged below the first flatness adjustment module (600). The first flatness adjustment module (600) includes: a plurality of elastic sheets (610) stacked in the Z-axis direction and connected with gaps, and a plurality of adjusting screws; A plurality of adjusting holes (620) are arranged around the elastic sheets (610) and penetrate through the plurality of elastic sheets (610) in the Z-axis direction. The adjusting screws are arranged in the adjusting holes (620), and the distance between the plurality of elastic sheets (610) can be changed by stretching or pushing the elastic sheets (610) through the adjusting screws; In step S4: Selectively adjust the plurality of adjusting screws to adjust the flatness of the lower surface of the chip to be mounted.

9. The semiconductor chip mounting method with high flatness according to claim 7, characterized in that, The chip to be mounted is arranged below the first flatness adjustment module (600). The first flatness adjustment module (600) includes: an electric angular position table; In step S4: The electric angular stage automatically adjusts the flatness of the lower surface of the chip to be mounted according to the flatness deviation information.

10. The semiconductor chip mounting method with high flatness according to claim 1, wherein In step S5: During the chip and substrate mounting process, a thermosetting device is used for heating to cure the bonding material between the chip and the substrate.

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