A flip chip bonding apparatus and method for processing double-sided copper substrates
By using an electromagnetic coil and magnetohydrodynamic linkage design and a limit rod ball bearing structure, the problems of difficult chip pick-up and displacement in the processing of double-sided copper substrates were solved, achieving stable and damage-free chip bonding, and improving production efficiency and welding quality.
Patent Information
- Application Number
- CN202510935051.1
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- Filing Date
- 2025-07-08
- Publication Date
- 2025-10-24
- Estimated Expiration
- 2045-07-08
AI Technical Summary
Existing double-sided copper substrate processing and surface mount soldering equipment has problems such as high requirements for surface flatness leading to difficulty in pick-up, easy damage to the surface mount by mechanical clamping, and easy displacement of the surface mount after the solder paste is applied to the substrate, which affects the soldering quality and stability.
The design employs a linkage between electromagnetic coils and magnetohydrodynamics. Through non-contact clamping control, a rigid chain structure is formed by hardening the magnetohydrodynamics to fix the patch. Combined with a limiting rod and ball bearing structure, flexible positioning and synchronous welding of the patch are achieved, avoiding mechanical clamping damage. At the same time, a flip motor is used to realize synchronous feeding and welding of the patch.
It achieves stable pickup and positioning of rough surface patches, avoids patch damage, ensures welding quality and efficiency, solves the problem of patch displacement on the substrate, and improves production efficiency and product reliability.
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Figure CN120421628B_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The present application relates to the technical field of copper substrate processing, in particular to a patch welding device and method for double-sided copper substrate processing. BACKGROUND
[0002] In the field of electronic device manufacturing, double-sided copper substrates are widely used in various electronic products due to their good heat dissipation performance, mechanical performance and electrical performance. The patch welding step of double-sided copper substrate processing is a key step in the entire production process, and its processing quality and efficiency directly affect the performance and production cycle of electronic products. The patch welding device, as an important equipment for realizing the automation of this step, plays a crucial role in improving production efficiency and ensuring product quality.
[0003] However, the existing patch welding device for double-sided copper substrate processing has some problems to be solved. In the patch operation of the traditional device, a suction nozzle is usually used to suck and place the patch on the substrate. However, this method requires a high degree of smoothness on the surface of the patch, and if the surface of the patch is not smooth, the suction nozzle may not be able to generate enough suction force to successfully suck the patch. If a mechanical hand is used to replace the suction nozzle to hold the patch, the patch may be easily damaged due to improper force during the holding process, resulting in patch scrap, increased production cost and reduced production efficiency.
[0004] In addition, the existing device has unreasonable working procedures. The operation method is to first place the patch on the substrate, and then transport the substrate with the patch to the welding station for welding. This step-by-step operation makes the patch placement and welding processes unable to be performed simultaneously, and the solder paste applied on the substrate is in a fluid state before welding. During the transportation of the substrate, due to factors such as vibration and shaking, the patch on the substrate may easily shift, which not only affects the accuracy and stability of the welding, resulting in a decrease in welding quality, but also may cause problems such as virtual welding and detached welding, seriously affecting the performance and reliability of the double-sided copper substrate. SUMMARY
[0005] The present application aims to provide a patch welding device and method for double-sided copper substrate processing to solve the problems raised in the background.
[0006] To achieve the above-mentioned purpose, the present application provides the following technical solutions:
[0007] A patch welding device for double-sided copper substrate processing, comprising a stand, a turnover motor is installed on the back of the stand, a turnover table is connected to the output shaft of the turnover motor, a mechanical arm is installed on the upper part of the stand, a feeding and welding integrated mechanism is installed on one end of the mechanical arm to realize feeding and welding integration.
[0008] The feeding and welding integrated mechanism comprises a hot air blower connected to a mechanical arm, the bottom of the hot air blower is connected with a cylinder, the lower end of the cylinder is connected with a limiting shell, the lower end of the limiting shell is connected with a pipe body, the lower end of the pipe body is connected with a plate body, the inside of the plate body is provided with a cavity, the cavity is distributed with a spiral electromagnetic coil, and the bottom of the plate body is provided with a silica gel capsule, the inside of the silica gel capsule is filled with a magnetic fluid, and the feeding and welding integrated mechanism further comprises a trigger part for triggering the hardening of the magnetic fluid.
[0009] The trigger part comprises a top rod longitudinally slidingly inserted into the pipe body, the lower end of the top rod is rotationally provided with a base, the bottom of the base is connected with the silica gel capsule through a return spring, and the upper end of the top rod is connected with a conductive plate, the inner wall of the limiting shell is provided with a copper ring matched with the outer edge size of the conductive plate, so that when the copper ring is sleeved on the conductive plate, the two are in contact with each other, at this time, a closed loop is formed between the copper ring and the electromagnetic coil, so that the magnetic fluid forms a chain structure along the magnetic field direction and hardens.
[0010] Preferably, when the silica gel capsule is in a reset state, the conductive plate is located below the copper ring and does not contact the copper ring, and the upper and lower parts of the conductive plate are both in the shape of a circular truncated cone.
[0011] Preferably, the inner wall of the pipe body is provided with a spiral groove, one side of the top rod is connected with a limiting rod in the pipe body, the end of the limiting rod away from the top rod is rotationally provided with a ball, and the ball is rotationally arranged in the spiral groove.
[0012] Preferably, the turnover table comprises a concave frame connected to the output shaft of a turnover motor, hydraulic cylinders are mounted on both sides of the concave frame, and the output shafts of the hydraulic cylinders are connected with clamping strips for clamping the copper substrate.
[0013] Preferably, one side of the clamping strip is provided with a positioning groove in the shape of V.
[0014] Preferably, the patch welding device for double-sided copper substrate processing further comprises a welding assembly, the welding assembly comprises a moving sleeve longitudinally slidingly sleeved outside the cylinder, L-shaped rods are connected to both sides of the moving sleeve, an annular pipe is connected between the lower ends of the two L-shaped rods, a plurality of air outlets are equidistantly arranged on the inner annular wall of the annular pipe, the air outlets are made of plastic material, and the air outlet end of the hot air blower is connected with the annular pipe through an air conveying pipe.
[0015] Preferably, the welding assembly further comprises a driving assembly, the driving assembly comprises notches arranged on both sides of the barrel respectively, gears are rotatably arranged in the notches, a connecting rod is hingedly connected to the upper edge of one side of the gear, one end of the connecting rod is hingedly connected to a corresponding L-shaped rod, the driving assembly further comprises a moving rod longitudinally slidingly inserted into the lower end of the barrel, the lower end of the moving rod longitudinally slides through the upper end of the limiting shell and is located above the copper ring, and the upper end of the moving rod is connected to a limiting strip in the barrel, the upper end of the limiting strip and the inner top side of the barrel are connected by a limiting spring, and the two sides of the limiting strip are both provided with a gear rack, the gear rack is engaged with a corresponding gear, and when the limiting spring is in a reset state, the annular pipe and the plate body have the same center.
[0016] A patch welding method for double-sided copper substrate processing, comprising welding a patch by using a patch welding device for double-sided copper substrate processing, the welding method comprising the following steps:
[0017] S1, drive the feeding and welding integrated mechanism to move by the mechanical arm, so that the positioning and feeding assembly clamps and feeds the patch, and the patch is fixed on the copper substrate;
[0018] S2, the positioning and feeding assembly drives the welding assembly to work, and the patch fixed on the copper substrate is welded;
[0019] S3, drive the turnover table to rotate 180 degrees by the turnover motor, and then repeat steps S1-S2 to weld the patch on the other side of the copper substrate.
[0020] Compared with the prior art, the patch welding method for double-sided copper substrate processing has the following beneficial effects:
[0021] Through the linkage design of the electromagnetic coil and the magnetic fluid, non-contact clamping control is realized, the conductive plate is in contact with the copper ring when the silica gel capsule is pressed down, the magnetic fluid is hardened to form a rigid chain structure after being electrified, the patch is fixed in a flexible wrapping manner, the magnetic fluid returns to a flowing state after being de-energized, the silica gel capsule automatically releases the patch, the rigid impact damage of the mechanical clamping jaw is avoided, and the problem that the suction nozzle cannot suck the rough patch on the surface is solved.
[0022] By cooperation of the ball at the end of the limiting rod and the spiral groove in the pipe body, when the ejector rod rises, it is forced to rotate upward, the contact surface between the conductive plate and the copper ring is changed from sliding friction to rolling friction, and the service life of the copper ring is prolonged.
[0023] When the patch is fed, the welding assembly can work synchronously, so that the feeding and welding are performed synchronously, the displacement of the patch on the substrate is avoided, and the welding quality of the patch is ensured. BRIEF DESCRIPTION OF DRAWINGS
[0024] Figure 1 It is a schematic diagram of the overall structure of the present application;
[0025] Figure 2 This is a schematic structural diagram of the integrated feeding and welding mechanism of the present invention;
[0026] Figure 3 It is a structural schematic diagram of the positioning and loading assembly of the present invention;
[0027] Figure 4 This is a schematic diagram of the disassembled structure of the positioning and loading assembly of the present invention;
[0028] Figure 5 Schematic diagram of the internal structure of the tube body of the present invention;
[0029] Figure 6 This is a schematic structural diagram of a welding assembly according to the present invention;
[0030] Figure 7 It is a schematic diagram of the internal structure of the cylinder of the present invention;
[0031] Figure 8 It is a schematic structural diagram of the turning table of the present invention.
[0032] In the accompanying drawings, the list of parts represented by each number is as follows: 1. Column; 2. Flip motor; 3. Robotic arm; 4. Hot air blower; 5. Cylinder; 6. Limit shell; 7. Tube; 8. Plate; 9. Silicon capsule; 10. Cavity; 11. Electromagnetic coil; 12. Magnetic fluid; 13. Return spring; 14. Push rod; 15. Conductive plate; 16. Copper ring; 17. Base; 18. Spiral groove; 19. Limit rod; 20. Ball; 21. Moving sleeve; 22. L-shaped rod; 23. Ring tube; 24. Air outlet; 25. Notch; 26. Gear; 27. Connecting rod; 28. Moving rod; 29. Limit bar; 30. Rack; 31. Limit spring; 32. Air duct; 33. Concave frame; 34. Hydraulic cylinder; 35. Clamp; 36. Positioning groove. DETAILED DESCRIPTION
[0033] The following will clearly and completely describe the technical solutions in the embodiments of the present invention in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.
[0034] The present invention provides two technical solutions:
[0035] Example 1: Figure 1 As shown, a patch welding device for processing a double-sided copper substrate includes a column 1, a flip motor 2 is installed on the back of the column 1, the output shaft of the flip motor 2 is connected to a flip table, a robotic arm 3 is installed on the upper part of the column 1, and an integrated feeding and welding mechanism is installed at one end of the robotic arm 3 to realize integrated feeding and welding.
[0036] As Figures 2-4 shown, the feeding and welding integrated mechanism comprises a hot air blower 4 connected to the mechanical arm 3, the bottom of the hot air blower 4 is connected with a cylinder 5, the lower end of the cylinder 5 is connected with a limiting shell 6, the lower end of the limiting shell 6 is connected with a pipe body 7, the lower end of the pipe body 7 is connected with a plate body 8, the inside of the plate body 8 is provided with a cavity 10, the cavity 10 is distributed with a spiral electromagnetic coil 11, and the bottom of the plate body 8 is provided with a silica gel capsule 9, the inside of the silica gel capsule 9 is filled with a magnetic fluid 12, and the feeding and welding integrated mechanism further comprises a trigger part for triggering the hardening of the magnetic fluid 12.
[0037] As Figures 2-4 shown, the trigger part comprises a top rod 14 longitudinally slidingly inserted into the pipe body 7, the lower end of the top rod 14 is rotationally provided with a base 17, the bottom of the base 17 and the silica gel capsule 9 are connected through a return spring 13, and the upper end of the top rod 14 is connected with a conductive plate 15, the inner wall of the limiting shell 6 is provided with a copper ring 16 matched with the outer edge size of the conductive plate 15, so that when the copper ring 16 is sleeved on the conductive plate 15, the two are in contact with each other, at this time, a closed loop is formed between the copper ring 16 and the electromagnetic coil 11, so that the magnetic fluid 12 is hardened along the magnetic field direction to form a chain structure.
[0038] As Figure 4 shown, when the silica gel capsule 9 is in the reset state, the conductive plate 15 is located below the copper ring 16 and does not contact with it, the upper and lower parts of the conductive plate 15 are in the shape of a circular truncated cone, so that the outer diameter of the upper and lower parts of the conductive plate 15 is smaller than the inner diameter of the copper ring 16, facilitating the conductive plate 15 to pass through the copper ring 16 and contact with it to connect the power supply of the electromagnetic coil 11.
[0039] In this embodiment, when in use, the movement of the feeding and welding integrated mechanism is controlled by the mechanical arm 3. First, the positioning and feeding assembly is moved to the position where the patch needs to be welded, and then it is moved to the position of the patch. When the silica gel capsule 9 contacts the patch, the conductive plate 15 does not contact the copper ring 16 at this time, that is, the electromagnetic coil 11 is not powered on, the magnetic fluid 12 is in a flowing state, and the silica gel capsule 9 is also in a soft state. Then the positioning and feeding assembly continues to press down. When the silica gel capsule 9 presses the patch, the bottom of the silica gel capsule 9 will be concave and wrap the upper part of the patch, thereby pressing the return spring 13 to move upward. The return spring 13 drives the ejector rod 14 to move upward, and the ejector rod 14 drives the conductive plate 15 to move upward. When the conductive plate 15 passes through the inside of the copper ring 16, the copper ring 16 will contact the outer edge of the conductive plate 15, thereby connecting the power supply of the electromagnetic coil 11. Under the action of the magnetic field, the magnetic fluid 12 will form a chain structure in the direction of the magnetic field and harden, so that the patch wrapped by the silica gel capsule 9 will not fall off, thereby positioning the patch without damaging the patch. Then the mechanical arm 3 moves the patch to the position where the patch is welded on the substrate. After the patch contacts the substrate, the mechanical arm 3 drives the silica gel capsule 9 to continue to press down, thereby continuing to push the ejector rod 14 to move upward, and the ejector rod 14 drives the conductive plate 15 to continue to move upward, so that the conductive plate 15 moves out of the copper ring 16. At this time, the conductive plate 15 does not contact the copper ring 16, thereby turning off the power supply of the electromagnetic coil 11. The electromagnetic coil 11 returns to the fluid state, so that the silica gel capsule 9 does not generate clamping force on the patch. Then the mechanical arm 3 drives the silica gel capsule 9 to move upward. At this time, the silica gel capsule 9 and the return spring 13 will reset under the elasticity, thereby resetting the conductive plate 15. The conductive plate 15 will quickly move to the bottom of the copper ring 16, thereby completing the feeding work of the patch.
[0040] As shown in Figure 5 , on the basis of embodiment one, the inner wall of the pipe body 7 is provided with a spiral groove 18, one side of the ejector rod 14 is connected with a limiting rod 19 in the pipe body 7, the end of the limiting rod 19 away from the ejector rod 14 is rotatably provided with a ball 20, and the ball 20 is rotatably arranged in the spiral groove 18. When the ejector rod 14 moves longitudinally, the ball 20 at one end of the limiting rod 19 will slide in the spiral groove 18 on the inner wall of the pipe body 7, thereby making the ejector rod 14 rotate upward. In this way, after the conductive plate 15 contacts the copper ring 16, the sliding becomes rotational friction, thereby reducing the wear of the copper ring 16 and prolonging the service life of the copper ring 16.
[0041] Further, as shown in Figure 1 and Figure 8 , the turnover table includes a concave frame 33 connected to the output shaft of the turnover motor 2. The two sides of the concave frame 33 are each provided with a hydraulic cylinder 34, and the output shaft of the hydraulic cylinder 34 is connected with a clamping strip 35 for clamping the copper substrate. The copper substrate is placed between the two clamping strips 35. The movement of the clamping strip 35 is controlled by the hydraulic cylinder 34, so that the two sides of the copper substrate are respectively clamped into the positioning grooves 36 on the two clamping strips 35.
[0042] AsFigure 1 and Figure 8 As shown in the figure, one side of the clamping strip 35 is provided with a positioning groove 36, the positioning groove 36 is V-shaped, the inner diameter of the positioning groove 36 is smaller than the thickness of the substrate, and after the two sides of the substrate are inserted into the positioning groove 36, the substrate is well positioned.
[0043] Example two: as shown in the figure, Figure 2 and Figures 6-7 The patch welding device for processing double-sided copper substrates further comprises a welding assembly, the welding assembly comprises a moving sleeve 21 which is longitudinally sleeved on the outside of the cylinder 5, both sides of the moving sleeve 21 are connected with L-shaped rods 22, the lower ends of the two L-shaped rods 22 are connected with a ring-shaped tube 23, a plurality of air outlets 24 are equidistantly arranged on the inner ring wall of the ring-shaped tube 23, the air outlets 24 are made of plastic material, the angle of the air outlets 24 can be adjusted so that the air outlets 24 can better blow air around the patch, and the welding quality of the patch is ensured, and the air outlet end of the hot air machine 4 is connected with the ring-shaped tube 23 through a wind pipe 32.
[0044] As shown in the figure, Figure 2 and Figures 6-7 The welding assembly further comprises a driving assembly, the driving assembly comprises notches 25 arranged on both sides of the cylinder 5, gears 26 are rotatably arranged in the notches 25, the one side edge of the gear 26 is hinged with a connecting rod 27, one end of the connecting rod 27 is hinged on the corresponding L-shaped rod 22, the driving assembly further comprises a moving rod 28 which is longitudinally slidably inserted into the lower end of the cylinder 5, the lower end of the moving rod 28 longitudinally slides through the upper end of the limiting shell 6 and is located above the copper ring 16, and the upper end of the moving rod 28 is connected with a limiting strip 29 in the cylinder 5, the upper end of the limiting strip 29 and the inner top side of the cylinder 5 are connected through a limiting spring 31, both sides of the limiting strip 29 are provided with a rack 30, the rack 30 is engaged with the corresponding gear 26, and when the limiting spring 31 is in the reset state, the ring-shaped tube 23 and the plate body 8 have the same center.
[0045] When the silica gel capsule 9 makes the patch contact with the substrate and continues to move downward, the conductive plate 15 is driven upward by the top rod 14, the moving rod 28 is pushed upward by the conductive plate 15, the limiting strip 29 is driven upward by the moving rod 28, the two racks 30 on the two sides of the limiting strip 29 drive the two gears 26 meshed with them to rotate, the connecting rod 27 is driven to perform eccentric motion when the gears 26 rotate, the L-shaped rod 22 is pulled downward by the connecting rod 27, the moving sleeve 21 slides up and down on the cylinder body 5, the annular tube 23 is moved downward, the annular tube 23 is attached to the substrate, and the silica gel capsule 9 firmly presses the patch at this time, which plays a reinforcing role on the patch, so that the patch is firmly attached to the solder paste on the substrate, and the patch is not easy to loosen during welding. Then the air heater 4 works, the air heater 4 delivers hot air to the annular tube 23, and then the hot air is sprayed out of the air outlet head 24 and sprayed around the patch, so as to heat and weld the solder paste around the patch. After welding, when the silica gel capsule 9 leaves the patch, the conductive plate 15 is reset, the conductive plate 15 does not continue to push the moving rod 28, the limiting spring 31 resets the limiting strip 29, so that the moving sleeve 21 is reset, that is, the annular tube 23 is reset, and the annular tube 23 moves to the plate body 8 position, so as not to affect the normal patch feeding operation.
[0046] A patch welding method for double-sided copper substrate processing, comprising welding the patch by using a patch welding device for double-sided copper substrate processing, and the welding method comprises the following steps:
[0047] S1, drive the feeding and welding integrated mechanism to move by the mechanical arm 3, so that the positioning and feeding assembly clamps and feeds the patch, and the patch is fixed on the copper substrate;
[0048] S2, the positioning and feeding assembly drives the welding assembly to work, and the patch fixed on the copper substrate is welded;
[0049] S3, drive the turnover table to rotate 180 degrees by the turnover motor 2, and then repeat steps S1-S2 to weld the patch on the other side of the copper substrate.
[0050] It should be noted that in this paper, relationship terms such as first and second are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between the entities or operations. Moreover, the terms "include", "contain" or any other variants thereof are intended to cover non-exclusive inclusion, so that the process, method, article or equipment including a series of elements not only includes those elements, but also includes other elements not explicitly listed or inherent to such process, method, article or equipment.
[0051] While embodiments of the application have been shown and described, it is to be understood that the embodiments described are merely exemplary of the principles and application of the present application. Numerous modifications and adaptions can be effected without departing from the spirit and scope of the present application, which is not limited to the exact construction and arrangement described. It is intended, therefore, to cover all modifications and adaptions that fall within the scope of the claims and their equivalents.
Claims
1. A double-sided copper substrate processing paster welding device, comprising a stand (1), a turnover motor (2) is installed on the back of the stand (1), a turnover table is connected to the output shaft of the turnover motor (2), a mechanical arm (3) is installed on the upper part of the stand (1), characterized in that: One end of the mechanical arm (3) is provided with a feeding and welding integrated mechanism to realize feeding and welding integration. The feeding and welding integrated mechanism comprises a hot air blower (4) connected to the mechanical arm (3), the bottom of the hot air blower (4) is connected with a cylinder (5), the lower end of the cylinder (5) is connected with a limiting shell (6), the lower end of the limiting shell (6) is connected with a pipe body (7), the lower end of the pipe body (7) is connected with a plate body (8), the inside of the plate body (8) is provided with a cavity (10), the cavity (10) is distributed with a spiral electromagnetic coil (11), and the bottom of the plate body (8) is provided with a silica gel capsule (9), the inside of the silica gel capsule (9) is filled with a magnetic fluid (12), and the feeding and welding integrated mechanism further comprises a trigger part for triggering the hardening of the magnetic fluid (12). The trigger part comprises a top rod (14) longitudinally slidingly inserted into the pipe body (7), the lower end of the top rod (14) is rotatably provided with a base (17), the bottom of the base (17) is connected with the silica gel capsule (9) through a return spring (13), and the upper end of the top rod (14) is connected with a conductive plate (15), the inner wall of the limiting shell (6) is provided with a copper ring (16) matching the outer edge size of the conductive plate (15), so that when the copper ring (16) is sleeved on the conductive plate (15), they are in contact with each other, at this time, a closed loop is formed between the copper ring (16) and the electromagnetic coil (11), so that the magnetic fluid (12) forms a chain structure along the magnetic field direction and hardens; When the silica gel capsule (9) is in a reset state, the conductive plate (15) is located below the copper ring (16) and does not contact it, and the upper and lower parts of the conductive plate (15) are in the shape of a circular truncated cone; The inner wall of the pipe body (7) is provided with a spiral groove (18), one side of the top rod (14) is connected with a limiting rod (19) in the pipe body (7), the end of the limiting rod (19) away from the top rod (14) is rotatably provided with a ball (20), and the ball (20) is rotatably arranged in the spiral groove (18).
2. A paster for soldering of a double-sided copper substrate processing according to claim 1, characterized in that: The turnover table comprises a concave frame (33) connected to the output shaft of the turnover motor (2), hydraulic cylinders (34) are mounted on both sides of the concave frame (33), and the output shaft of the hydraulic cylinder (34) is connected with a clamping strip (35) for clamping the copper substrate.
3. A paster for soldering of a double-sided copper substrate processing according to claim 2, characterized in that: One side of the clamping strip (35) is provided with a positioning groove (36), and the positioning groove (36) is V-shaped.
4. The apparatus of claim 1 wherein: the apparatus is a double-sided copper substrate processing paster. The patch welding device for double-sided copper substrate processing further comprises a welding assembly, the welding assembly comprises a moving sleeve (21) longitudinally slidingly sleeved outside the cylinder (5), the two sides of the moving sleeve (21) are connected with L-shaped rods (22), the lower ends of the two L-shaped rods (22) are connected with an annular pipe (23), a plurality of air outlet heads (24) are equidistantly arranged on the inner annular wall of the annular pipe (23), the air outlet heads (24) are made of plastic material, and the air outlet end of the hot air blower (4) is connected with the annular pipe (23) through an air conveying pipe (32).
5. The apparatus according to claim 4, wherein: The welding assembly further comprises a driving assembly, the driving assembly comprises notches (25) arranged on both sides of the cylinder (5) respectively, a gear (26) is rotatably arranged in the notch (25), a connecting rod (27) is hinged to the edge of one side of the gear (26), one end of the connecting rod (27) is hinged to the corresponding L-shaped rod (22), the driving assembly further comprises a moving rod (28) longitudinally slidingly arranged in the lower end of the cylinder (5), the lower end of the moving rod (28) longitudinally slides through the upper end of the limiting shell (6) and is located above the copper ring (16), and the upper end of the moving rod (28) is connected with a limiting strip (29) in the cylinder (5), the upper end of the limiting strip (29) and the inner top side of the cylinder (5) are connected through a limiting spring (31), and the two sides of the limiting strip (29) are provided with a rack (30), the rack (30) is engaged with the corresponding gear (26), and when the limiting spring (31) is in the reset state, the annular pipe (23) and the plate body (8) have the same center.
6. A method for soldering a patch to a double-sided copper substrate processing, characterized by: The patch is welded by a patch welding device processed by the double-sided copper substrate according to any one of claims 1-5, and the welding method comprises the following steps: S1, driving the feeding and welding integrated mechanism to move by the mechanical arm (3), so that the positioning and feeding assembly clamps and feeds the patch, and fixes it on the copper substrate; S2, the positioning and feeding assembly drives the welding assembly to work, and the patch fixed on the copper substrate is welded; S3, the turnover table is rotated by 180 degrees by the turnover motor (2), and then steps S1-S2 are repeated to weld the patch on the other side of the copper substrate.
Citation Information
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