SMD packaging high-speed A0I test equipment

Abstract

The invention discloses SMD packaging high-speed A0I testing equipment, and relates to the technical field of optical testing, and the equipment comprises a supporting unit which comprises an operation table and an operation table which is arranged at the top of the operation table and is used for supporting the whole body; the feeding unit comprises a feeding assembly arranged on the top of the operation table and used for feeding, and a cleaning assembly matched with the feeding assembly to conduct cleaning and electric conduction on the SMD plate. After the detection assembly completes detection, the SMD boards can be automatically classified, defective boards are pushed to the collection assembly for unified recovery processing, qualified boards are conveyed to the packaging assembly for packaging, the production efficiency is improved, the labor cost and the labor intensity are reduced, the error rate caused by manual operation is reduced, and the production efficiency is improved. In addition, by removing dust and static electricity, the circuit performance of the SMD board is protected, damage possibly caused by accumulation of the static electricity and the dust is avoided, and therefore the overall production quality and the product reliability are remarkably improved.

Description

Technical Field

[0001] The present invention relates to the field of optical testing technology, and in particular to a high-speed AOI testing device for SMD packaging. Background Art

[0002] SMD is a surface mount device and requires automatic optical inspection (AOI) during the production process. When AOI performs automatic inspection, the machine automatically scans and collects images through a camera, compares the tested solder joints with the qualified parameters in the database, and detects defects through image processing.

[0003] The SMD boards produced by current testing and packaging work are prone to static electricity. Under the influence of static electricity, dust is easily attached to the surface of the SMD boards, which will directly affect the detection accuracy of the AOI inspection equipment. At the same time, the static charge inside the SMD boards may also cause fluctuations in the detection light, thereby affecting the normal operation of the AOI inspection equipment. Summary of the Invention

[0004] In view of the above problems existing in the existing SMD package high-speed A0I test equipment, the present invention is proposed.

[0005] Therefore, the present invention provides a high-speed AOI test equipment for SMD packaging, which aims to solve the problem that dust easily adheres to the surface of SMD boards, which directly affects the detection accuracy of AOI inspection equipment for SMD boards. At the same time, the electrostatic charge inside the SMD boards may also cause fluctuations in the detection light, thereby affecting the normal operation of the AOI inspection equipment.

[0006] In order to solve the above technical problems, the present invention provides the following technical solutions: a support unit, comprising an operating table; The loading unit includes a loading assembly disposed on the top of the operating table and a cleaning assembly cooperating with the loading assembly to clean the surface of the SMD board; The cleaning component includes an electric push rod 1 provided on the feeding component for driving, a moving part provided at the output end of the electric push rod 1, a soft brush plate provided inside the moving part for cleaning dust on the surface of the SMD board, and a conductive plate provided inside the moving part for removing static electricity from the inside of the SMD board. The soft brush plate and the conductive plate are both slidably connected to the feeding component, and cooperate with the feeding component to clean dust and remove static electricity from the SMD board before testing, thereby ensuring the detection accuracy of the SMD board; A conductive member is provided at one end of the conductive plate, and the conductive member passes through the moving member and is connected to the feeding assembly, which is used to guide the static electricity absorbed by the conductive plate out to prevent static electricity from remaining; Inspection and packaging unit, used for AOI inspection and packaging of SMD boards.

[0007] As a preferred solution of the SMD package high-speed AOI test equipment described in the present invention, the loading assembly includes a fixing frame 1 arranged on the top of the operating table, a guide member arranged on the top of the fixing frame 1, a connecting block arranged on the top of the connecting block, a guide block arranged on the top of the connecting block, a loading plate arranged on the top of the guide block, and a clamping member arranged on the top of the loading plate.

[0008] As a preferred solution of the SMD package high-speed AOI test equipment of the present invention, wherein: a material discharge trough is arranged inside the loading plate, and the material discharge trough cooperates with the clamping piece.

[0009] As a preferred solution of the SMD package high-speed AOI test equipment of the present invention, a return spring is provided inside the clamping part, an extrusion block is provided at the other end of the return spring, and the extrusion block is slidably connected to the clamping part.

[0010] As a preferred solution of the SMD package high-speed AOI test equipment described in the present invention, it includes: a fixing component arranged on the top of the operating table for inspecting and fixing the SMD board, an inspection component arranged on the fixing component for inspecting the SMD board, a collection component arranged at the bottom of the fixing component for recycling unqualified SMD boards, and a packaging component arranged at the other end of the fixing component for packaging qualified SMD boards, and the packaging component is connected to the collecting component.

[0011] As a preferred solution of the SMD package high-speed AOI test equipment described in the present invention, the fixing component includes a fixing frame 2 arranged on the top of the operating table, a material feeding piece arranged on the top of the fixing frame 2, and a material picking piece arranged at the rear end of the material feeding piece, and the bottom of the material picking piece is connected to the operating table.

[0012] As a preferred solution of the SMD package high-speed AOI test equipment described in the present invention, a motor is provided on the top of the operating table, a rotating disk is provided at the output end of the motor, a detection table is provided on the top of the rotating disk, a fixed shell is provided on the top of the rotating disk, an electric push rod 2 is provided inside the fixed shell, and the electric push rod 2 cooperates with the detection table.

[0013] As a preferred solution of the SMD package high-speed AOI test equipment described in the present invention, the detection component includes an AOI detection part arranged on the top of the operating table, and a control part arranged on the top of the operating table, and the control part is electrically connected to the AOI detection part.

[0014] As a preferred solution of the SMD package high-speed AOI testing equipment described in the present invention, the collection component includes a waste area arranged on the top of the operating table, and a waste guide arranged on the top of the waste area, and the waste guide cooperates with the electric push rod 2.

[0015] As a preferred solution of the SMD package high-speed AOI testing equipment described in the present invention, the collection component includes a waste area arranged on the top of the operating table, and a waste guide arranged on the top of the waste area, and the waste guide cooperates with the electric push rod 2.

[0016] As a preferred solution of the SMD package high-speed AOI test equipment described in the present invention, the packaging assembly includes a fixing frame three arranged on the top of the waste area, a conveying member arranged on the fixing frame three, a packaging member arranged on the conveying member, a packaging storage member arranged on the packaging member, and a guide plate arranged at one end of the conveying member, and the guide plate cooperates with the inspection table.

[0017] The beneficial effects of the present invention are as follows: through the coordinated cooperation of the feeding component and the cleaning component, the automatic feeding of the SMD board and the removal of dust and static electricity on the surface of the SMD board are realized, the speed and accuracy of AOI detection are improved, the interference of dust and static electricity on detection is reduced, and it is ensured that the detection equipment can more clearly and accurately identify defects on the SMD board, thereby improving the detection efficiency and quality control level. At the same time, after the detection component completes the detection, it can automatically classify the SMD boards, push the defective boards to the collection component for unified recycling and processing, and transport the qualified boards to the packaging component for packaging, which not only improves production efficiency, reduces labor costs and labor intensity, and reduces the error rate caused by manual operation, but also protects the circuit performance of the SMD board by removing dust and static electricity, avoids damage that may be caused by static electricity and dust accumulation, thereby significantly improving the overall production quality and product reliability. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the following briefly introduces the drawings required for use in the description of the embodiments. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0019] Figure 1 It is a schematic diagram of the overall structure of the SMD package high-speed AOI test equipment of the present invention.

[0020] Figure 2 This is a side structural schematic diagram of the SMD package high-speed AOI test equipment of the present invention.

[0021] Figure 3 The invention is a SMD package high-speed A0I test equipment Figure 2 A is an enlarged structural diagram of FIG.

[0022] Figure 4 This is a schematic diagram of the structure of the feeding assembly of the SMD packaging high-speed AOI test equipment of the present invention.

[0023] Figure 5 This is a schematic diagram of the cross-sectional structure of the feeding component of the SMD packaging high-speed A0I test equipment of the present invention.

[0024] Figure 6 This is a schematic diagram of the top cross-sectional structure of the loading component of the SMD packaging high-speed A0I test equipment of the present invention.

[0025] Figure 7 The invention is a SMD package high-speed A0I test equipment Figure 6 Schematic diagram of the enlarged structure at point B.

[0026] Figure 8 This is a schematic diagram of the detection unit structure of the SMD package high-speed AOI test equipment of the present invention.

[0027] Figure 9 This is a schematic diagram of the cross-sectional structure of the detection unit of the SMD package high-speed AOI test equipment of the present invention.

[0028] Figure 10 This is a schematic diagram of the packaging unit structure of the SMD packaging high-speed AOI test equipment of the present invention.

[0029] Explanation of reference numerals: 100, support unit; 101, operating table; 200, loading unit; 201, loading assembly; 2011, fixing frame 1; 2012, guide member; 2013, connecting block; 2014, guide block; 2015, loading plate; 2016, unloading chute; 2017, clamping member; 2018, return spring; 2019, squeezing block; 202, cleaning assembly; 2021, electric push rod 1; 2022, moving member; 2023, soft brush plate; 2024, conductive plate; 2025, conductive member; 300, detection and packaging unit; 301 , fixed component; 3011, fixed frame two; 3012, feeding part; 3013, picking part; 3014, motor; 3015, rotating disk; 3016, inspection table; 3017, fixed shell; 3018, electric push rod two; 302, inspection component; 3021, AOI inspection part; 3022, control part; 303, collection component; 3031, waste area; 3032, waste guide part; 304, packaging component; 3041, fixed frame three; 3042, conveying part; 3043, guide plate; 3044, packaging part; 3045, packaging storage part. DETAILED DESCRIPTION

[0030] In order to make the above-mentioned objects, features and advantages of the present invention more obvious and easy to understand, the specific embodiments of the present invention are described in detail below with reference to the accompanying drawings.

[0031] Example 1, reference Figure 1-Figure 3, which is the first embodiment of the present invention, provides an SMD package high-speed AOI testing device, which includes: a supporting unit 100, a loading unit 200, and a packaging detection unit 300.

[0032] The support unit 100 includes an operating table 101; The loading unit 200 includes a loading assembly 201 disposed on the top of the operating table 101 for loading materials, and a cleaning assembly 202 cooperating with the loading assembly 201 to clean and conduct the SMD board; The inspection and packaging unit 300 includes a fixing component 301 provided at the other end of the operating table 101 for inspecting and fixing the SMD boards, a detection component 302 provided on the fixing component 301 for inspecting the SMD boards, a collection component 303 provided at the bottom of the fixing component 301 for recycling unqualified SMD boards, and a packaging component 304 provided at the other end of the fixing component 301 for packaging qualified SMD boards, and the packaging component 304 is connected to the collection component 303. When inspecting the SMD boards that have been produced, the operator places the SMD boards uniformly inside the loading component 201, and the loading component 201 collects the SMD boards uniformly, and, driven by the cleaning component 202, starts to clean the surface dust and remove static electricity on the SMD boards inside the loading component 201 one by one. The SMD board cleaned by the cleaning component 202 is transported to the fixing component 301 through the loading component 201, and the fixing component 301 starts to rotate and starts to evenly load and fix the SMD board. At the same time, the fixing component 301 is driven and starts to cooperate with the detection component 302 to perform AOI detection on the SMD board on the fixing component 301, and the detection result is displayed. At the same time, the fixing component 301 can also complete the detection of the detection component 302, and classify the SMD boards that do not meet the standards, so that the SMD boards that do not meet the standards are uniformly transported to the inside of the collection component 303 for unified collection, and the SMD boards that meet the standards are transported to the packaging component 304 and packaged and collected by the packaging component 304.

[0033] During use, when inspecting the SMD boards that have been produced, the operator places the SMD boards uniformly inside the loading component 201, and the loading component 201 collects the SMD boards uniformly, and under the drive of the cleaning component 202, starts to clean the surface dust and remove static electricity of the SMD boards inside the loading component 201 one by one, and then performs unloading and conveying, completing the automatic loading including the pre-processing before inspection, to ensure the speed and accuracy of the inspection, the SMD boards cleaned by the cleaning component 202 are conveyed to the fixing component 301 through the loading component 201, and the fixing component 301 starts to rotate and starts to evenly load and fix the SMD boards, and at the same time the fixing component 301 is driven to start cooperating with the inspection component 302 to perform AOI inspection on the SMD boards on the fixing component 301, and display the inspection results, and at the same time the fixing component 301 can also complete the inspection of the inspection component 302 and check the SMDs that do not meet the standards. The boards are classified, so that the SMD boards that do not meet the standards are uniformly transported to the inside of the collection component 303 for unified collection, while the SMD boards that meet the standards are transported to the packaging component 304, and are packaged and collected by the packaging component 304, thereby realizing the automatic loading of the SMD boards and the removal of dust and static electricity on the surface of the SMD boards, improving the speed and accuracy of AOI inspection, reducing the interference of dust and static electricity on inspection, and ensuring that the inspection equipment can more clearly and accurately identify defects on the SMD boards, thereby improving inspection efficiency and quality control level. At the same time, after the inspection component 302 completes the inspection, it can automatically classify the SMD boards, push the defective boards to the collection component 303 for unified recycling, and transport the qualified boards to the packaging component 304 for packaging, which not only improves production efficiency and reduces labor costs and labor intensity, but also reduces the error rate caused by manual operation, thereby improving the overall production quality and product reliability.

[0034] Example 2, reference Figure 1-Figure 7, which is the second embodiment of the present invention. This embodiment is different from the first embodiment in that: a loading assembly 201 includes a fixing frame 2011 arranged on the top of the operating table 101, a guide member 2012 arranged on the top of the fixing frame 2011, a guide block 2014 arranged on the top of the connecting block 2013, a loading plate 2015 arranged on the top of the guide block 2014, a clamping member 2017 arranged on the top of the loading plate 2015, and a discharge trough 2016 arranged inside the loading plate 2015, and the discharge trough 2016 cooperates with the clamping member 2017, a return spring 2018 is arranged inside the clamping member 2017, and the other end of the return spring 2018 is provided with an extrusion block 2019, and the extrusion block 2019 and the clamping member 20 17 sliding connection, cleaning assembly 202, including an electric push rod 2021 provided at one end of the feeding plate 2015, a moving part 2022 provided at the output end of the electric push rod 2021, a soft brush plate 2023 provided inside the moving part 2022, and a conductive plate 2024 provided inside the moving part 2022, and the soft brush plate 2023 and the conductive plate 2024 are both slidably connected to the clamping part 2017, and a conductive part 2025 is provided at one end of the conductive plate 2024, and the conductive part 2025 penetrates the moving part 2022 and is connected to the feeding plate 2015. When the SMD board is tested, the SMD board is uniformly placed inside the clamping part 2017, and the SMD board is clamped by the soft brush plate 2023 inside the clamping part 2017. The SMD board is placed on the top of the soft brush plate 2023, and the electric push rod 2021 starts to drive at the same time, so that the moving part 2022 moves left and right with the soft brush plate 2023 and the conductive plate 2024 inside the moving part 2022, so that the SMD board inside the card part 2017 falls to the top of the conductive plate 2024 in the mismatch of the soft brush plate 2023, and because the soft brush plates 2023 on both sides of the moving part 2022 can not only stagger the SMD board inside the card part 2017 and fall, but also clean the surface of the SMD board and remove dust on the surface of the SMD board, and when the SMD board falls onto the conductive plate 2024, the conductive plate 2024 contacts the SMD board to absorb the static electricity generated by the SMD board Attached guide, static electricity is discharged through the conductive member 2025, thereby completing the cleaning of the SMD board surface and the removal of static electricity inside. After the static electricity is removed, the moving member 2022 is still moving left and right with the soft brush plate 2023 and the conductive plate 2024, so that the SMD board that has been cleaned and removed falls on the extrusion block 2019 at the bottom of the card member 2017 and is received by the extrusion block 2019. However, under the movement of the conductive plate 2024, the SMD board squeezes the extrusion block 2019, so that the extrusion block 2019 squeezes the reset spring 2018 and slides into the interior of the card member 2017. The SMD board falls on the guide member 2012 through the unloading trough 2016 on the loading plate 2015, and with the cooperation of the guide block 2014 and the connecting block 2013,The SMD board is accurately dropped into the guide 2012, and the cleaning and anti-static treatment before the test are completed. The SMD board is then transported to the fixed component 301 for AOI testing through the guide 2012.

[0035] During use, when testing the SMD board, the SMD board is uniformly placed inside the clamping part 2017, and the SMD board is clamped by the soft brush plate 2023 inside the clamping part 2017, so that the SMD board is on top of the soft brush plate 2023. At the same time, the electric push rod 2021 starts to drive, so that the moving part 2022 moves left and right with the soft brush plate 2023 and the conductive plate 2024 inside the moving part 2022, so that the SMD board inside the clamping part 2017 falls onto the conductive plate 2024 in the mismatch of the soft brush plate 2023. The top of the moving part 2022 is provided with a plurality of soft brush plates 2023 on both sides of the moving part 2022, which can not only stagger the SMD boards inside the card part 2017 to drop them, but also clean the surface of the SMD boards to remove dust on the surface of the SMD boards. When the SMD boards fall onto the conductive plate 2024, the conductive plate 2024 contacts the SMD boards to absorb and guide the static electricity generated by the SMD boards, and the static electricity is discharged through the conductive part 2025, thereby completing the cleaning of the surface of the SMD boards and the removal of static electricity inside the boards. After the static electricity removal is completed, the moving part 2022 is provided with a plurality of soft brush plates 2023 on both sides of the moving part 2022. 2022 is still moving left and right with the soft brush plate 2023 and the conductive plate 2024, so that the SMD board that has been cleaned and removed falls on the extrusion block 2019 at the bottom of the card 2017 and is received by the extrusion block 2019. However, under the movement of the conductive plate 2024, the SMD board squeezes the extrusion block 2019, so that the extrusion block 2019 squeezes the reset spring 2018 and slides into the interior of the card 2017. The SMD board falls on the guide 2012 through the unloading trough 2016 on the loading plate 2015 and is held between the guide block 2014 and the connecting plate 2015. The cooperation of the connecting block 2013 allows the SMD board to fall accurately into the inside of the guide part 2012, completing the cleaning and anti-static treatment before inspection, and transporting the SMD board to the fixing component 301 for AOI inspection through the guide part 2012, realizing the automatic loading of the SMD board and the removal of dust and static electricity on the surface of the SMD board, improving the speed and accuracy of AOI inspection, reducing the interference of dust and static electricity on inspection, and ensuring that the inspection equipment can more clearly and accurately identify defects on the SMD board, thereby improving the inspection efficiency and quality control level.

[0036] The remaining structures are the same as those of Example 1.

[0037] Example 3, reference Figures 1-10, which is the third embodiment of the present invention. This embodiment is different from the second embodiment in that: the fixing component 301 includes a second fixing frame 3011 arranged on the top of the operating table 101, a feeding piece 3012 arranged on the top of the second fixing frame 3011, and a picking piece 3013 arranged at the rear end of the feeding piece 3012, and the bottom of the picking piece 3013 is connected to the operating table 101, the top of the operating table 101 is provided with a motor 3014, the output end of the motor 3014 is provided with a rotating disk 3015, the top of the rotating disk 3015 is provided with a detection table 3016, the top of the rotating disk 3015 is provided with a fixed shell 3017, the interior of the fixed shell 3017 is provided with an electric push rod 2 3018, and the electric push rod 2 3018 cooperates with the detection table 3016, the detection component 302 includes an AOI detection piece 3021 arranged on the top of the operating table 101, and The control component 3022 on the top of the workbench 101 is electrically connected to the AOI inspection component 3021. After the SMD board is cleaned of dust and static electricity is removed by the loading component 201, it is transported to the feeding component 3012. The picking component 3013 starts to work and puts the SMD boards on the feeding component 3012 into the inspection table 3016 in batches. At the same time, the motor 3014 drives the rotating disk 3015 and the inspection table 3016 to rotate together, and with the cooperation of the picking component 3013, the SMD boards are evenly put. The inspection table 3016 after the placement is driven by the motor 3014 rotates to the bottom of the AOI inspection component 3021, and the SMD board on the top of the inspection table 3016 is inspected by the AOI inspection component 3021, and the inspection data is uniformly transported to the inside of the control component 3022 for collection and processing.

[0038] Compared with Example 2, further, the collecting component 303 includes a waste area 3031 arranged on the top of the operating table 101, and a waste guide 3032 arranged on the top of the waste area 3031, and the waste guide 3032 cooperates with the electric push rod 2 3018, the packaging component 304 includes a fixed frame 3041 arranged on the top of the waste area 3031, a conveying member 3042 arranged on the fixed frame 3041, a packaging member 3044 arranged on the conveying member 3042, a packaging storage member 3045 arranged on the packaging member 3044, and a guide plate 3043 arranged at one end of the conveying member 3042, and the guide plate 3043 cooperates with the inspection table 3016. After being inspected by the AOI inspection member 3021, the motor 3014 continues to drive the rotating disk 3015 and the inspection table 3016 to rotate, and in the control member Under the control of 3022, when the rotating disk 3015 rotates to the top of the waste guide 3032, the electric push rod 2 3018 inside the fixed shell 3017 will start to push the SMD board that fails the inspection on the top of the inspection table 3016 into the inside of the waste guide 3032, and transport it to the waste area 3031 through the waste guide 3032, and the SMD boards that fail the inspection will be collected and recycled. When the rotating disk 3015 rotates to the guide plate 3043, the electric push rod 2 3018 pushes the SMD board that passes the inspection on the inspection table 3016 to the guide plate 3043, and transports the SMD board that passes the inspection to the conveying part 3042 through the guide plate 3043. With the cooperation of the packaging part 3044 and the packaging storage part 3045, the qualified SMD boards are packaged and collected.

[0039] During use, after the SMD boards are cleaned of dust and static electricity by the loading component 201, they are transported to the feeding part 3012, and the picking part 3013 starts to work, and the SMD boards on the feeding part 3012 are placed in batches onto the testing table 3016. At the same time, the motor 3014 drives the rotating disk 3015 and the testing table 3016 to rotate together, and with the cooperation of the picking part 3013, the SMD boards are evenly placed. The testing table 3016 after placement is driven by the motor 3014 to rotate to the bottom of the AOI testing part 3021, and the SMD board on the top of the testing table 3016 is inspected by the AOI testing part 3021, and the inspection data is uniformly transported to the inside of the control part 3022 for collection and processing.

[0040] After passing the inspection of the AOI inspection part 3021, the motor 3014 continues to drive the rotating disk 3015 and the inspection table 3016 to rotate, and under the control of the control part 3022, when the rotating disk 3015 rotates to the top of the waste guide 3032, the electric push rod 2 3018 inside the fixed shell 3017 will start to push the unqualified SMD boards on the top of the inspection table 3016 into the inside of the waste guide 3032, and transport them to the waste area 3031 through the waste guide 3032, and the unqualified SMD boards will be collected and recycled. When the rotating disk 3015 rotates to the guide plate 3043, the electric push rod 2 3018 will start to push the unqualified SMD boards on the top of the inspection table 3016 into the inside of the waste guide 3032. 18 pushes the SMD boards that have passed the inspection on the inspection table 3016 to the guide plate 3043, and transports the SMD boards that have passed the inspection to the conveying member 3042 through the guide plate 3043. With the cooperation of the packaging member 3044 and the packaging storage member 3045, the SMD boards that have passed the inspection are packaged and collected. After the fixing component 301 completes the inspection, the SMD boards can be automatically classified, and the defective boards can be pushed to the collection component 303 for unified recycling and processing, and the qualified boards can be transported to the packaging component 304 for packaging. This not only improves production efficiency, reduces labor costs and labor intensity, but also reduces the error rate caused by manual operation.

[0041] The remaining structures are the same as those of Example 2.

[0042] It should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention and are not intended to limit the present invention. Although the present invention has been described in detail with reference to the preferred embodiments, those skilled in the art should understand that the technical solutions of the present invention may be modified or replaced by equivalents without departing from the spirit and scope of the technical solutions of the present invention, which should all be included in the scope of the claims of the present invention.

Claims

1. A high-speed A0I test device for SMD packaging, characterized by: include: A support unit (100) comprising an operating table (101); A loading unit (200) comprises a loading assembly (201) disposed on the top of the operating table (101), and a cleaning assembly (202) cooperating with the loading assembly (201) to clean the surface of the SMD board; The cleaning component (202) comprises an electric push rod (2021) provided on the feeding component (201) for driving, a moving part (2022) provided at the output end of the electric push rod (2021), a soft brush plate (2023) provided inside the moving part (222) for cleaning dust from the surface of the SMD board, and a conductive plate (2024) provided inside the moving part (2022) for removing static electricity from the interior of the SMD board, wherein the soft brush plate (2023) and the conductive plate (2024) are both slidably connected to the feeding component (201) and cooperate with the feeding component (201) to clean dust and remove static electricity from the SMD board before detection, thereby ensuring detection accuracy of the SMD board; A conductive member (2025) is provided at one end of the conductive plate (2024), and the conductive member (2025) penetrates the moving member (2022) and is connected to the feeding assembly (201), and is used to guide the static electricity absorbed on the conductive plate (2024) out to prevent static electricity from remaining. The inspection and packaging unit (300) is used for performing AOI inspection and packaging on the SMD board.

2. The SMD package high-speed AOI test equipment according to claim 1, characterized in that: The feeding assembly (201) comprises a fixing frame (2011) arranged on the top of the operating table (101), a guide member (2012) arranged on the top of the fixing frame (2011), a connecting block (2013) arranged on the top of the connecting block (2013), a guide block (2014) arranged on the top of the connecting block (2013), a feeding plate (2015) arranged on the top of the guide block (2014), and a material clamping member (2017) arranged on the top of the feeding plate (2015).

3. The SMD package high-speed AOI test equipment according to claim 2, characterized in that: A material discharge trough (2016) is provided inside the material loading plate (2015), and the material discharge trough (2016) cooperates with the material clamping piece (2017).

4. The SMD package high-speed AOI test equipment according to claim 3, characterized in that: A return spring (2018) is provided inside the clamping member (2017), and an extrusion block (2019) is provided at the other end of the return spring (2018), and the extrusion block (2019) is slidably connected to the clamping member (2017).

5. The SMD package high-speed AOI test equipment according to claim 4, characterized in that: A fixing component (301) is provided on the top of the operating table (101) for detecting and fixing the SMD board, a detection component (302) is provided on the fixing component (301) for detecting the SMD board, a collection component (303) is provided at the bottom of the fixing component (301) for recycling unqualified SMD boards, and a packaging component (304) is provided at the other end of the fixing component (301) for packaging qualified SMD boards, and the packaging component (304) is connected to the collection component (303).

6. The SMD package high-speed AOI test equipment according to claim 5, characterized in that: The fixing assembly (301) comprises a second fixing frame (3011) arranged on the top of the operating table (101), a material feeding member (3012) arranged on the top of the second fixing frame (3011), and a material taking member (3013) arranged at the rear end of the material feeding member (3012), wherein the bottom of the material taking member (3013) is connected to the operating table (101).

7. The SMD package high-speed AOI test equipment according to claim 6, characterized in that: A motor (3014) is provided on the top of the operating table (101), a rotating disk (3015) is provided at the output end of the motor (3014), a detection table (3016) is provided on the top of the rotating disk (3015), a fixed shell (3017) is provided on the top of the rotating disk (3015), a second electric push rod (3018) is provided inside the fixed shell (3017), and the second electric push rod (3018) cooperates with the detection table (3016).

8. The SMD package high-speed AOI test equipment according to claim 7, characterized in that: The detection component (302) comprises an AOI detection component (3021) arranged on the top of the operating table (101), and a control component (3022) arranged on the top of the operating table (101), wherein the control component (3022) is electrically connected to the AOI detection component (3021).

9. The SMD package high-speed AOI test equipment according to claim 8, characterized in that: The collecting assembly (303) includes a waste area (3031) arranged on the top of the operating table (101), and a waste guide (3032) arranged on the top of the waste area (3031), and the waste guide (3032) cooperates with the second electric push rod (3018).

10. The SMD package high-speed AOI test equipment according to claim 9, characterized in that: The packaging assembly (304) comprises a fixing frame (3041) disposed on the top of the waste area (3031), a conveying member (3042) disposed on the fixing frame (3041), a packaging member (3044) disposed on the conveying member (3042), a packaging storage member (3045) disposed on the packaging member (3044), and a guide plate (3043) disposed at one end of the conveying member (3042), wherein the guide plate (3043) cooperates with the detection table (3016).

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