Height measurement method and system for circuit board element and storage medium

Abstract

The embodiment of the invention relates to the technical field of semiconductors, in particular to a circuit board element height measurement method and system and a storage medium, the height of an element on a normal circuit board is obtained by transmitting the normal circuit board, and a normal element angle generated when the element passes through is measured through a first measurement assembly; the normal substrate angle generated when the substrate passes through is measured through the second measuring assembly, the target circuit board is transmitted, the target element angle generated when the element passes through is measured through the first measuring assembly, and the target substrate angle generated when the substrate passes through is measured through the second measuring assembly. Obtaining the actual height of the element on the target circuit board according to the height, the normal element angle, the normal substrate angle, the target element angle and the target substrate angle, and judging whether the height of the element is normal or not based on the actual height. According to the embodiment of the invention, laser is not needed to measure the height of the element, the production efficiency is not influenced, the height measurement cost performance is high, and the accuracy of a measurement result is improved.

Description

Technical Field

[0001] Embodiments of the present invention relate to the field of semiconductor technology, and in particular to a method, system, and storage medium for measuring the height of circuit board components. Background Art

[0002] In the semiconductor industry, the height of components on PCBs significantly impacts PCB quality. Excessively high components can affect PCB installation or indicate issues like improper placement or improperly inserted DIP connectors. Therefore, before using AOI equipment to inspect components on PCBs, it's necessary to first verify that the height of certain specific components on the board meets requirements.

[0003] In the existing technology, line lasers or point lasers are mostly used to detect the height of components on circuit boards. However, using line lasers or point lasers to measure the height of components requires parameter calibration for specific components, and the measured data needs to be submitted to the AOI equipment for calculation, which increases the working time of the AOI equipment and affects production efficiency on the actual production line. In addition, the cost-effectiveness of using relatively expensive line lasers or point lasers to measure the height of a component on a PCB board is low. In addition, since laser measurement uses the reflection of lasers, the surface conditions of the components also need to be considered. When the surface of the component is relatively rough, the component is easily sensed when diffuse reflection occurs. When the surface of the component is relatively smooth, the mirror reflection generated can easily lead to false positives in the measurement process, resulting in errors in the measurement results. Summary of the Invention

[0004] In view of this, one purpose of an embodiment of the present invention is to provide a method, system and storage medium for measuring the height of circuit board components, so as to solve the technical problems in the prior art that the height measurement of components on circuit boards affects production efficiency, has low cost performance, and is prone to errors in measurement results.

[0005] To solve the above technical problems, the embodiments of the present invention provide the following technical solutions:

[0006] In a first aspect, an embodiment of the present invention provides a method for measuring the height of a circuit board component, for measuring a substrate of a circuit board and a component disposed on the substrate, the method comprising:

[0007] Transfer a normal circuit board and obtain the height of the components themselves, and calibrate the positions of the first measuring component and the second measuring component during the transfer process;

[0008] When the normal circuit board arrives at the measurement position, the normal component angle generated by the component passing through is measured by the first measurement component, and the normal substrate angle generated by the substrate passing through is measured by the second measurement component;

[0009] Transporting the target circuit board, when the target circuit board arrives at the measurement position, measuring the target component angle generated by the component passing through by the first measurement component, and measuring the target substrate angle generated by the substrate passing through by the second measurement component;

[0010] Obtain the actual height of the component on the target circuit board based on its own height, normal component angle, normal substrate angle, target component angle and target substrate angle;

[0011] Based on the actual height, it is determined whether the height of the component on the target circuit board is normal.

[0012] In some embodiments, calibrating the positions of the first measurement component and the second measurement component includes:

[0013] Establish a coordinate system based on the normal circuit board movement plane and obtain the coordinates of the components in the coordinate system;

[0014] The positions of the first measuring component and the second measuring component are corrected according to the coordinates of the component, so that the first measuring component and the second measuring component are both located at the coordinates of the corresponding component.

[0015] In some embodiments, before the normal circuit board reaches the measurement position, the method further includes:

[0016] Determine whether the normal circuit board or the circuit board to be tested has reached the sensing position, where the sensing position is the position before the measurement position;

[0017] When in the sensing position, high-frequency pulses are emitted and measurement signals returned from the first measurement component and the second measurement component are collected in real time.

[0018] In some embodiments, the transmitting high-frequency pulses and collecting the measurement signals returned from the first measurement component and the second measurement component in real time include:

[0019] Obtain the model of the components on a normal circuit board or a circuit board to be tested;

[0020] Set the high-frequency pulse of corresponding frequency according to different models;

[0021] High-frequency pulses of corresponding frequencies are emitted and measurement signals returned from the first measurement component and the second measurement component are collected in real time.

[0022] In some embodiments, obtaining the actual height of the component on the target circuit board based on the component's own height, the normal component angle, the normal substrate angle, the target component angle, and the target substrate angle includes:

[0023] Set the angle height comparison table of the target circuit board based on the requirements;

[0024] According to the angle height comparison table, a normal component height corresponding to a normal component angle, a normal substrate height corresponding to a normal substrate angle, a target component height corresponding to a target component angle, and a target substrate height corresponding to a target substrate angle are obtained;

[0025] The actual height of the component on the target circuit board is obtained based on the component's own height, normal component height, normal substrate height, target component height and target substrate height.

[0026] In some embodiments, determining whether the height of the component on the target circuit board is normal based on the actual height includes:

[0027] Set conditional values according to requirements;

[0028] Compare the actual height with the conditional value to determine whether the height of the component is normal;

[0029] When the actual height is greater than or equal to the conditional value, it means that the height of the component is abnormal;

[0030] When the actual height is less than the conditional value, it means that the height of the component is normal.

[0031] In some embodiments, determining whether the height of the component on the target circuit board is normal based on the actual height further includes:

[0032] Set conditional values and normal ranges according to requirements;

[0033] Compare the difference between the actual height and the conditional value to see if it is within the normal range;

[0034] When the difference is within the normal range, it means that the height of the component is normal;

[0035] When the difference is greater than the normal range, it means that the height of the component is too high;

[0036] When the difference is smaller than the normal range, it indicates that the component is missing.

[0037] In some embodiments, the judgment results include excessive height, normal, and missing components. After judging whether the height of the component on the target circuit board is normal based on the actual height, the method further includes:

[0038] As the target circuit board flows to the AOI, the judgment results are stored in the AOI output TXT file and displayed in the maintenance station results output by the AOI;

[0039] Set the overheight and missing parts in the judgment results as abnormal errors;

[0040] If an abnormal error occurs, it will be displayed in front of the maintenance station result output by AOI, and the picture of the component taken by AOI will be called up.

[0041] In a second aspect, an embodiment of the present invention provides a system for measuring the height of a circuit board component, comprising:

[0042] a controller and a first measurement component and a second measurement component in communication with the controller, wherein the first measurement component is used to measure a component angle generated when a component of a circuit board passes through, and the second measurement component is used to measure a substrate angle generated when a substrate of the circuit board passes through;

[0043] The controller includes:

[0044] a processor and a memory communicatively connected to the processor;

[0045] The memory stores computer program instructions executable by the processor. When the computer program instructions are executed by the processor, the controller executes any one of the circuit board component height measurement methods proposed in the first aspect.

[0046] In a third aspect, an embodiment of the present invention provides a computer-readable storage medium, on which computer program instructions executable by a processor are stored. When the computer program instructions are executed by the processor, the computer executes any one of the circuit board element height measurement methods proposed in the first aspect.

[0047] The embodiments of the present invention have the following beneficial effects: Different from the prior art, the method for measuring the height of circuit board components provided by the embodiments of the present invention is used to measure the substrate of the circuit board and the components arranged on the substrate. The method includes: transmitting a normal circuit board and obtaining the inherent height of the component, correcting the positions of a first measuring component and a second measuring component during the transmission process, when the normal circuit board arrives at the measurement position, measuring the normal component angle generated by the passage of the component by the first measuring component, and measuring the normal substrate angle generated by the passage of the substrate by the second measuring component, transmitting a target circuit board, and when the target circuit board arrives at the measurement position, measuring the target component angle generated by the passage of the component by the first measuring component, and measuring the target substrate angle generated by the passage of the substrate by the second measuring component, obtaining the actual height of the component on the target circuit board based on the inherent height, the normal component angle, the normal substrate angle, the target component angle, and the target substrate angle, and judging whether the height of the component on the target circuit board is normal based on the actual height.

[0048] In an embodiment of the present invention, a normal circuit board is transmitted to obtain the native height of a component on the normal circuit board, and the positions of a first measuring component and a second measuring component are corrected. The normal component angle generated when a component of the normal circuit board passes through is measured by the first measuring component, and the normal substrate angle generated when a substrate of the normal circuit board passes through is measured by the second measuring component. A target circuit board is transmitted to a measurement position, and a target component angle generated when a component of the target circuit board passes through is measured by the first measuring component, and a target substrate angle generated when a substrate of the target circuit board passes through is measured by the second measuring component. The actual height of the component on the target circuit board is obtained based on the native height, the normal component angle, the normal substrate angle, the target component angle, and the target substrate angle. Whether the height of the component on the target circuit board is normal is determined based on the actual height. Laser measurement of the component height is not required. The actual height of the component on the target circuit board can be calculated by measuring the angles of the component and the substrate of the normal circuit board, the target circuit board, and thereby determining whether the height of the component is normal. This does not affect production efficiency, provides high cost-effectiveness in height measurement, and improves the accuracy of measurement results. BRIEF DESCRIPTION OF THE DRAWINGS

[0049] To more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the following briefly introduces the drawings required for describing the prior art or embodiments. Obviously, the drawings described below only illustrate certain embodiments of the present invention and should not be construed as limiting the scope of protection. Those skilled in the art can, without inventive effort, derive other relevant drawings based on these drawings.

[0050] Figure 1 Schematic diagram of an application scenario of a method for measuring the height of a circuit board component in some embodiments of the present invention;

[0051] Figure 2 is a schematic structural diagram of a circuit board component height measurement system provided by some embodiments of the present invention;

[0052] Figure 3 yes Figure 2 A schematic diagram of the structure of a controller in the height measurement system shown in the embodiment;

[0053] Figure 4 is a schematic flow chart of a method for measuring the height of a circuit board component provided by some embodiments of the present invention;

[0054] Figure 5 Schematic diagram of a measuring element and a substrate of a height measurement system in some embodiments of the present invention. DETAILED DESCRIPTION

[0055] In order to make the purposes and advantages of the embodiments of the present invention easier to understand, the technical solutions of the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the embodiments described are only part of the embodiments of the present invention, not all of the embodiments. The detailed description of the embodiments of the present invention in the drawings below does not limit the scope of protection claimed by the present invention, but only represents selected embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of the present invention.

[0056] It should be noted that, if no conflict is constituted, the various technical features involved in the embodiments of the present invention described below can be combined with each other and are all within the scope of protection of the present invention. In addition, although the functional modules are divided in the device or structural diagram and the logical order is shown in the flow chart, in some cases, the steps shown or described can be performed in a different module division than in the device or in an order different from that in the flow chart. In addition, the "first", "second", "third" and other similar expressions used herein do not limit the data and execution order, but are only for the purpose of convenience of explanation and to distinguish between the same items or similar items with basically the same functions and effects, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of technical features.

[0057] Unless otherwise defined, the technical and scientific terms used in this specification have the same meanings as those commonly understood by those skilled in the art within the technical field of the present invention. The terms used in this specification are intended solely to describe specific embodiments and are not intended to limit the present invention. It should be understood that the term "and / or" as used in this specification includes any and all combinations of one or more of the listed items.

[0058] See also Figure 1 , Figure 1 A schematic diagram schematically illustrates an application scenario of a method for measuring the height of a circuit board component provided by some embodiments of the present invention.

[0059] Specifically, such as Figure 1 As shown, the application scenario includes a circuit board component height measurement system 1000, a normal circuit board 10, and a target circuit board 20. The height measurement system 1000 is used to measure the substrate of the circuit board and the components arranged on the substrate. Those skilled in the art can set the height measurement system 1000 at any appropriate position on the AOI (Automated Optical Inspection) equipment according to actual needs, such as being set at the gantry of the AOI equipment, and further, being set at the longitudinal screw guide rail of the AOI equipment. The height measurement system 1000 includes a controller ( Figure 1), a first measurement assembly 100 and a second measurement assembly 200, wherein a controller is in communication with the first measurement assembly 100 and the second measurement assembly 200, respectively. A normal circuit board 10 includes a substrate 11 and a component 12 disposed on substrate 11. A target circuit board 20 includes a substrate 21 and a component 22 disposed on substrate 21. The target circuit board 20 is a circuit board having the actual height of the component to be measured.

[0060] In the initial state, the first measuring component 100 and the second measuring component 200 have an initial angle. The initial angle of the first measuring component 100 and the second measuring component 200 is perpendicular to the ground by default, that is, the deflection angle in the initial state is 0 degrees. The deflection angle in the initial state can also be adjusted as needed. When measuring a circuit board, the height measurement system 1000 first transfers a normal circuit board 10 from the loading station to the docking station along the direction M, and obtains the height of the component 12 of the normal circuit board 10 (that is, Figure 1 The height d shown in FIG2 is obtained, and during the process of transporting the normal circuit board 10, the positions of the first measuring component 100 and the second measuring component 200 are corrected so that the first measuring component 100 and the second measuring component 200 are aligned with the normal circuit board 10, that is, the first measuring component 100 and the second measuring component 200 are located in the transport path of the component 12 of the normal circuit board 10, so that the first measuring component 100 and the second measuring component 200 can measure the substrates of the normal circuit board 10 and the target circuit board 20 and the components disposed on the substrates.

[0061] In the embodiment of the present invention, a measuring position is set at any suitable position between the loading station and the docking station. When the normal circuit board 10 reaches the measuring position, the controller measures the normal component angle (i.e., the normal component angle) generated by the component 12 passing through the first measuring component 100. Figure 1 The angle α1 shown is measured, that is, the angle when the first measuring component 100 contacts the element 12, and the normal substrate angle (i.e. Figure 1 The angle β1) shown is the angle measured when the second measuring component 200 contacts the substrate 11.

[0062] After measuring the normal component angle and the normal substrate angle, the target circuit board 20 is continuously transferred from the loading station to the docking station along the direction M. When the target circuit board 20 reaches the measurement position, the controller measures the target component angle (i.e., the target component angle) generated by the component 22 passing through the first measurement component 100. Figure 1 The angle α2 shown is measured, that is, the angle when the first measuring component 100 contacts the element 22 is measured, and the target substrate angle (i.e. Figure 1The angle β2) shown is the angle measured when the second measuring component 200 contacts the substrate 21.

[0063] After measuring the target component angle and the target substrate angle, the actual height of the component 22 on the target circuit board 20 is calculated based on the acquired component's own height, normal component angle, normal substrate angle, target component angle and target substrate angle, and whether the height of the component 22 on the target circuit board 20 is normal is judged based on the actual height. The actual height of the component on the target circuit board can be calculated by measuring the angles generated by the components and substrates of the normal circuit board and the target circuit board during the transmission process (i.e., the normal component angle, the normal substrate angle, the target component angle and the target substrate angle), so as to judge whether the height of the component on the target circuit board is normal. There is no need to use laser height measurement, which reduces the cost caused by laser equipment and reduces the measurement result error caused by mirror reflection of laser measurement, does not affect production efficiency, and has high cost performance and improves the accuracy of height measurement results.

[0064] It should be understood that Figure 1 The application scenario shown only briefly illustrates some components of the height measurement system 1000, and does not impose any limitations on the structure, type and quantity of the height measurement system in other application scenarios or embodiments, the number, height and type of components in the normal circuit board and the target circuit board, and other situations. Those skilled in the art may add, delete or change the components of the height measurement system according to actual needs. For example, in some embodiments, components such as a carrier platform and a transmission mechanism are added for automatically transmitting the normal circuit board and the target circuit board, and the embodiments of the present invention do not impose any limitations on this.

[0065] In order to facilitate understanding of the circuit board component height measurement method provided by the embodiment of the present invention, the circuit board component height measurement system provided by the embodiment of the present invention is first introduced in detail.

[0066] See also Figure 2 , Figure 2 The following schematically shows a structural diagram of a circuit board component height measurement system provided by some embodiments of the present invention.

[0067] Specifically, such as Figure 2As shown, a circuit board component height measurement system 1000 includes a controller 300, and a first measurement component 100 and a second measurement component 200 in communication with the controller 300. The first measurement component 100 is used to measure component angles generated by the passage of components on a circuit board, for example, the normal component angles generated by the passage of components on a normal circuit board. The second measurement component 200 is used to measure substrate angles generated by the passage of substrates on a circuit board, for example, the normal substrate angles generated by the passage of substrates on a normal circuit board. The controller 300 coordinates and controls the various components and modules of the height measurement system 1000, ensuring coordinated operation and execution of various business logic.

[0068] It is understandable that Figure 2 The structure shown in the embodiment is only for illustration and does not impose any limitation on the structure of the height measurement system. The height measurement system may also include Figure 2 The structures shown may have more or fewer components, or may have Figure 2 Different configurations of the structure are shown.

[0069] See also Figure 3 , Figure 3 A schematic structural diagram of a controller in a height measurement system provided by some embodiments of the present invention is shown.

[0070] Specifically, such as Figure 3 As shown, the controller 300 includes at least one processor 310 and a memory 320 that are communicatively connected. Figure 3 In the example, the bus system 330 is connected to a processor. The various components in the controller 300 are coupled together through the bus system 330, and the bus system 330 is used to realize the connection and communication between the various components. It is easy to understand that the bus system 330 includes not only a data bus, but also a power bus, a control bus, and a status signal bus. However, for the sake of clarity and brevity, Figure 3 In FIG, various buses are labeled as bus system 330. It can be understood that Figure 3 The structure shown in the embodiment is only for illustration and does not impose any limitation on the structure of the controller. Figure 3 The structures shown may have more or fewer components, or may have Figure 3 Different configurations of the structure are shown.

[0071] Specifically, the processor 310 is used to provide computing and control capabilities to control the controller 300 to perform corresponding tasks, such as controlling the above-mentioned controller 300 to perform any circuit board component height measurement method provided in the embodiment of the present invention, or to perform any step in any possible implementation method of any circuit board component height measurement method provided in the embodiment of the present invention. Those skilled in the art will understand that the processor 310 can be a general-purpose processor, including a central processing unit (CPU), a network processor (NP), etc.; it can also be a digital signal processor (DSP), an application specific integrated circuit (ASIC), a field programmable gate array (FPGA) or other programmable logic device, discrete gate or transistor logic device, discrete hardware component.

[0072] The memory 320 is a non-transitory computer-readable storage medium that can be used to store non-transitory software programs, non-transitory computer executable programs, instructions, and modules, for example, programs, instructions, and modules corresponding to the circuit board element height measurement method in the embodiment of the present invention. In some embodiments, the memory 320 may include a program storage area and a data storage area. The program storage area may store an operating system, an application program required for at least one function, and the data storage area may store data created according to the use of the processor 310. The processor 310 executes various functional applications and data processing of the controller 300 by running the non-transitory software programs, instructions, and modules stored in the memory 320 to implement any circuit board element height measurement method provided in the embodiment of the present invention, or to perform any possible implementation of any circuit board element height measurement method provided in the embodiment of the present invention. In some embodiments, the memory 320 may include a high-speed random access memory and may also include a non-transitory memory. For example, at least one disk storage device, a flash memory device, or other non-transitory solid-state storage device. In some embodiments, the memory 320 may also include a memory remotely located relative to the processor 310, and these remotely located memories may be connected to the processor 310 via a communication network. It is understood that examples of the above-mentioned communication network include but are not limited to the Internet, corporate intranet, local area network, mobile communication network and combinations thereof.

[0073] As can be understood from the foregoing, any circuit board component height measurement method provided in the embodiments of the present invention can be implemented by any suitable type of controller with certain computing and control capabilities. For example, it can be implemented by the controller 300 of the height measurement system 1000 described above. In some embodiments, any circuit board component height measurement method provided in the embodiments of the present invention can be implemented by a processor executing computer program instructions stored in a memory.

[0074] The method for measuring the height of a circuit board component provided by an embodiment of the present invention will be described in detail below in conjunction with exemplary applications and implementations of the system for measuring the height of a circuit board component provided by an embodiment of the present invention.

[0075] See also Figure 4 , Figure 4 The flowchart of the method for measuring the height of a circuit board component provided by some embodiments of the present invention is schematically shown.

[0076] Those skilled in the art will appreciate that the circuit board component height measurement method provided in the embodiments of the present invention can be applied to a controller (e.g., controller 300) in the aforementioned circuit board component height measurement system. Specifically, the circuit board component height measurement method is executed by one or at least two processors of the controller.

[0077] Specifically, such as Figure 4 As shown, the method for measuring the height of a circuit board component provided by the embodiment of the present invention includes but is not limited to the following steps S100-S500:

[0078] S100: transferring a normal circuit board and obtaining the height of the components themselves, and calibrating the positions of the first measuring component and the second measuring component during the transfer process.

[0079] In this step, the intrinsic height of the component refers to the standard value of the intrinsic height of the component measured in advance. The intrinsic height data of the component can be stored in any suitable medium. When needed, the intrinsic height of the component can be obtained from the medium storing the intrinsic height data of the component.

[0080] In this embodiment of the present invention, a conveyor mechanism is provided and communicatively connected to a height measurement system. The conveyor mechanism includes a drive motor, a transmission assembly, and a conveyor belt. The conveyor belt of the conveyor mechanism is equipped with a loading station, a docking station, and a measurement position. The measurement position is located at any suitable position between the loading station and the docking station. The docking station is used to measure the actual height of components on the circuit board before transporting the circuit board to the next process.

[0081] Specifically, a normal circuit board is placed at the loading station of the conveyor mechanism, and the conveyor mechanism is controlled to begin transporting the normal circuit board from the loading station to the docking station. During the transport of the normal circuit board, the positions of the first and second measurement assemblies are adjusted and corrected based on the transport path and direction of the components on the normal circuit board. This ensures that the first and second measurement assemblies are aligned with the normal circuit board. In other words, the first and second measurement assemblies are located on the transport path of the components on the normal circuit board, enabling measurement of the components and substrate of the normal circuit board and subsequent target circuit boards.

[0082] For example, see Figure 5 During the process of transporting the normal circuit board 30, the normal circuit board 30 is transported along the direction N on the conveying mechanism 400. According to the transport path and transport direction of the normal circuit board 30, the position, transport path and transport direction of the components on the normal circuit board 30 are obtained. According to the position, transport path and transport direction of the components on the normal circuit board 30, the positions of the first measuring component 100 and the second measuring component 200 of the height measurement system 1000 are corrected so that the first measuring component 100 and the second measuring component 200 are both located on the transport path of the components of the normal circuit board 30.

[0083] In some embodiments, calibrating the positions of the first measurement component and the second measurement component includes but is not limited to the following steps S110-S120:

[0084] S110: Establishing a coordinate system according to a normal circuit board movement plane, and obtaining the coordinates of the component in the coordinate system.

[0085] Specifically, during the transport of a normal circuit board, the moving plane of the normal circuit board is obtained, where the moving plane is the plane in which the normal circuit board is located when it moves on a conveyor mechanism, such as the plane in which it is located when it moves on a conveyor belt. A coordinate system is established based on the moving plane of the normal circuit board, and the positions of components on the normal circuit board are mapped to the established coordinate system so that the components have corresponding coordinates in the coordinate system. The coordinates of the components in the coordinate system are then obtained from the coordinate system, facilitating real-time quantification of component position transformations using the coordinate system.

[0086] For example, see Figure 5 , the normal circuit board 30 moves along the direction N on the conveying mechanism 400. The moving plane of the normal circuit board 30 is the plane on which the normal circuit board 30 is located when it moves on the conveying mechanism 400. The coordinate system XOY is established based on the moving plane of the normal circuit board 30, and the positions of the components of the normal circuit board 30 are mapped to the coordinate system XOY. It can be understood that Figure 5The coordinate system XOY is only schematically shown, and does not impose any specific limitations on the position of the origin of the coordinate system XOY, the units of the coordinate axes, and the like.

[0087] S120: Correcting the positions of the first measuring component and the second measuring component according to the coordinates of the component, so that the first measuring component and the second measuring component are both located at the coordinates of the corresponding component.

[0088] Specifically, the current locations of the first measurement component and the second measurement component are mapped to the established coordinate system so that the first measurement component and the second measurement component have corresponding current coordinates in the coordinate system. After obtaining the coordinates of the component in the coordinate system, the current coordinates of the first measurement component in the coordinate system are compared with the coordinates of the component in the coordinate system. Based on the difference between the current coordinates of the first measurement component in the coordinate system and the coordinates of the component in the coordinate system, the position of the first measurement component is corrected so that the first measurement component is located on the transmission path of the component, that is, the first measurement component is at the coordinates (Y-axis coordinates) corresponding to the component. Furthermore, the current coordinates of the second measurement component in the coordinate system are compared with the coordinates of the component in the coordinate system. Based on the difference between the current coordinates of the second measurement component in the coordinate system and the coordinates of the component in the coordinate system, the position of the second measurement component is corrected so that the second measurement component is located on the transmission path of the component, that is, the second measurement component is at the coordinates (Y-axis coordinates) corresponding to the component.

[0089] For example, see Figure 5 , the normal circuit board 30 moves along the direction N. In order to make the first measuring component 100 be at the coordinate of the corresponding component (i.e., the Y-axis coordinate), the first measuring component 100 is moved along the Y-axis direction, and the position of the first measuring component 100 is adjusted so that the Y-axis coordinate of the first measuring component 100 in the coordinate system is consistent with the Y-axis coordinate of the component in the coordinate system, thereby completing the correction of the position of the first measuring component 100.

[0090] Similarly, in order to make the second measurement component 200 be located at the coordinates of the corresponding component (i.e., the Y-axis coordinate), the second measurement component 200 is moved along the Y-axis direction, and the position of the second measurement component 200 is adjusted so that the Y-axis coordinate of the second measurement component 200 in the coordinate system is consistent with the Y-axis coordinate of the component in the coordinate system, thereby completing the correction of the position of the second measurement component 200.

[0091] S200: When the normal circuit board arrives at the measurement position, a normal component angle generated by the component passing through is measured by the first measurement component, and a normal substrate angle generated by the substrate passing through is measured by the second measurement component.

[0092] Specifically, when it is detected that a normal circuit board arrives at the measurement position, a first measurement instruction is sent to the first measurement component. After receiving the first measurement instruction, the first measurement component starts working to measure the normal component angle generated when the component of the normal circuit board passes through the measurement position, so as to achieve the measurement of the normal component angle generated by the component of the normal circuit board passing through by the first measurement component. The normal component angle is the angle formed by the first measurement rod of the first measurement component and the vertical direction, for example Figure 1 The first measuring rod 101 shown forms an angle α1 with the vertical direction. A second measurement instruction is sent to the second measuring component. After receiving the second measurement instruction, the second measuring component starts working to measure the normal substrate angle generated when the substrate of a normal circuit board passes through the measurement position. The normal substrate angle generated when the substrate passes through is measured by the second measuring component. The normal substrate angle is the angle formed by the second measuring rod of the second measuring component and the vertical direction, for example Figure 1 The second measuring rod 201 shown forms an angle β1 with the vertical direction.

[0093] It should be understood that the first measuring component and the second measuring component can use height sensors or angle sensors (such as photoelectric encoders) to sense the angles generated by the passage of components and substrates, that is, they can use angle sensors to measure the normal component angle and the normal substrate angle.

[0094] In some embodiments, before the normal circuit board reaches the measurement position, the method for measuring the height of the circuit board components further includes but is not limited to the following steps S201-S202:

[0095] S201: Determine whether a normal circuit board or a circuit board to be tested reaches a sensing position.

[0096] S202: When in the sensing position, high-frequency pulses are emitted and measurement signals returned from the first measurement component and the second measurement component are collected in real time.

[0097] In an embodiment of the present invention, a loading station, a docking station, a measuring position and a sensing position are provided on the conveyor belt of the conveying mechanism. The measuring position is set at any suitable position between the loading station and the docking station, and the sensing position is set at any suitable position between the loading station and the measuring position, that is, the sensing position is a position before the measuring position and after the loading station.

[0098] Specifically, a sensor is positioned at a sensing position to detect whether a normal circuit board or a circuit board under test (i.e., a target circuit board) has reached the sensing position. When the normal circuit board or the circuit board under test reaches the sensing position, i.e., when the normal circuit board or the circuit board under test is in the sensing position, a high-frequency pulse is transmitted to the first and second measurement components, and measurement signals from the first and second measurement components are collected. The measurement signals are signals that measure the component angles and substrate angles generated by the passage of components and substrates on the circuit board. After transmitting the high-frequency pulses to the first and second measurement components, the measurement signals returned by the first and second measurement components are collected in real time and analyzed to obtain the component angles and substrate angles generated by the passage of components and substrates.

[0099] Through the above method, when a normal circuit board or a circuit board to be tested is in the sensing position, a high-frequency pulse is emitted in advance and the measurement signals returned by the first measuring component and the second measuring component are collected, thereby avoiding measurement errors caused by failure to send high-frequency pulses in time to collect measurement signals or delays in collecting measurement signals at the measurement position, thereby improving the accuracy of the measurement results.

[0100] It should be understood that the sensor can be any suitable type of sensor, such as a limit sensor, a pressure sensor, etc. The limit sensor or the pressure sensor senses the position change or pressure change generated when the normal circuit board or the circuit board to be tested reaches the sensing position, thereby determining whether the normal circuit board or the circuit board to be tested has reached the sensing position.

[0101] In some embodiments, transmitting high-frequency pulses and collecting measurement signals returned from the first measurement component and the second measurement component in real time specifically includes but is not limited to the following steps S2021-S2023:

[0102] S2021: Obtain the model of the component on a normal circuit board or a circuit board to be tested.

[0103] S2022: Set the high-frequency pulse of corresponding frequency according to different models.

[0104] S2023: Transmitting high-frequency pulses of corresponding frequencies and collecting measurement signals returned from the first measurement component and the second measurement component in real time.

[0105] In an embodiment of the present invention, different components utilize high-frequency pulses of different frequencies to acquire measurement signals from the first and second measurement components. Component model data on a normal circuit board or a circuit board under test is stored on any suitable medium. When needed, the component model data can be retrieved from the medium storing the component model data.

[0106] In this step, a model-frequency comparison table is pre-constructed. The model-frequency comparison table is used to characterize the correspondence between the model of the component and the frequency of the high-frequency pulse. For example, in some embodiments, the model-frequency comparison table is shown in Table 1 below:

[0107] Table 1:

[0108] Component model Frequency of high-frequency pulses A24 300kHz B52 500kHz C66 1MHz D42 2MHz E84 5MHz F93 10MHz G10 20MHz

[0109] Specifically, the model of the component on the target circuit board or the circuit board to be tested is obtained from the storage medium, and according to the model-frequency comparison table, the target frequency of the high-frequency pulse corresponding to the model of the component is found from the model-frequency comparison table, the high-frequency pulse of the corresponding frequency (i.e., the target frequency) is set, and the high-frequency pulse is transmitted to the first measurement component and the second measurement component to collect the measurement signals returned by the first measurement component and the second measurement component in real time, and then the measurement signals are analyzed to obtain the component angle and substrate angle generated when the component and substrate of the target circuit board or the circuit board to be tested pass through.

[0110] For example, the model-frequency comparison table is shown in Table 1 above. The model of the component is E84. From the model-frequency comparison table, it is found that the target frequency of the high-frequency pulse corresponding to the component model E84 is 5 MHz. The high-frequency pulse with a target frequency of 5 MHz is set as the target transmission pulse, and a high-frequency pulse with a target frequency of 5 MHz is transmitted to the first measurement component and the second measurement component, and the measurement signals returned from the first measurement component and the second measurement component are collected in real time.

[0111] S300: transporting the target circuit board. When the target circuit board arrives at the measurement position, measuring the target component angle generated by the component passing through by the first measurement component, and measuring the target substrate angle generated by the substrate passing through by the second measurement component.

[0112] In an embodiment of the present invention, the target circuit board (i.e., the circuit board to be tested) and the normal circuit board are of the same type. Circuit boards of the same type mean that the positions, quantities, and structures of the components on the substrate are the same in design. Only due to process errors in processing and manufacturing, the actual positions, actual quantities, and actual postures of the components may be different, thereby affecting the signal transmission of the components and further affecting the quality of the circuit board.

[0113] Specifically, the target circuit board is manually placed on the loading station of the conveying mechanism, or the target circuit board is automatically transferred from the previous process to the loading station of the conveying mechanism, and then the conveying mechanism is controlled to start transporting the target circuit board, and the target circuit board is transferred from the loading station to the docking station. When it is detected that the target circuit board has arrived at the measurement position, a first measurement instruction is sent to the first measurement component. After receiving the first measurement instruction, the first measurement component starts working to measure the target component angle generated when the component of the target circuit board passes through the measurement position, so that the target component angle generated by the component of the target circuit board passing through is measured by the first measurement component, wherein the target component angle is the angle formed by the first measurement rod of the first measurement component and the vertical direction, for example Figure 1 The first measuring rod 101 shown forms an angle α2 with the vertical direction. A second measurement instruction is sent to the second measuring component. After receiving the second measurement instruction, the second measuring component starts working to measure the target substrate angle generated when the substrate of the target circuit board passes through the measurement position, wherein the target substrate angle is the angle formed by the second measuring rod of the second measuring component and the vertical direction, for example Figure 1 The second measuring rod 201 shown forms an angle β2 with the vertical direction.

[0114] It is easy to understand that the first measuring component and the second measuring component can use height sensors or angle sensors (such as photoelectric encoders) to sense the angles generated by the passage of the component and the substrate, that is, the target component angle and the target substrate angle can be measured using angle sensors.

[0115] S400: Obtaining the actual height of the component on the target circuit board according to the component's own height, a normal component angle, a normal substrate angle, a target component angle, and a target substrate angle.

[0116] For example, a trigonometric relationship formula is pre-designed, and the component's actual height, normal component angle, normal substrate angle, target component angle, and target substrate angle are substituted into the trigonometric relationship formula to calculate the actual height of the component on the target circuit board. It will be readily understood that embodiments of the present invention can design a trigonometric relationship formula based on the length of the first measuring rod of the first measuring assembly, the length of the second measuring rod of the second measuring assembly, the trigonometric relationship, and the like.

[0117] For example, the trigonometric function relationship formula is:

[0118] H t =H0+ΔH1-ΔH2

[0119] ΔH1=R1*(cosθ1-cosθ2)

[0120]

[0121] Among them, H t is the actual height of the component on the target circuit board, H0 is the height of the component itself, θ1 is the target component angle, θ2 is the normal component angle, is the target substrate angle, is a normal substrate angle, R1 is the length of the first measuring rod, R2 is the length of the second measuring rod, and the lengths of the first measuring rod and the second measuring rod are the same or different.

[0122] Of course, other ways or methods can also be used to calculate the actual height of the component on the target circuit board based on its own height, normal component angle, normal substrate angle, target component angle and target substrate angle. The embodiment of the present invention does not impose any limitation on this.

[0123] In some embodiments, obtaining the actual height of a component on a target circuit board based on the component's own height, a normal component angle, a normal substrate angle, a target component angle, and a target substrate angle includes but is not limited to the following steps S410-S430:

[0124] S410: Setting an angle height comparison table of a target circuit board based on requirements.

[0125] In this step, an angle-height comparison table for the target circuit board is pre-set based on the requirements (e.g., the length of the first measuring rod of the first measuring component and the length of the second measuring rod of the second measuring component). The angle-height comparison table is used to characterize the correspondence between angles and heights. Based on the length of the first measuring rod of the first measuring component and the length of the second measuring rod of the second measuring component, trigonometric functions are used to calculate the corresponding component height and substrate height according to the component angle, substrate angle, length of the first measuring rod, and length of the second measuring rod. The component height is matched to the component angle, and the substrate height is matched to the substrate angle, to obtain an angle-height comparison table. The component height, component angle, and length of the first measuring rod satisfy the following relationship: H 11 =R 11 *cosθ 11 , H 11 is the component height, R 11 is the length of the first measuring rod, θ 11 is the component angle. Similarly, the substrate height, substrate angle, and the length of the second measuring rod satisfy the following relationship: H 22 =R 22 *cosθ 22 , H 22 is the substrate height, R 22 is the length of the second measuring rod, θ 22 is the substrate angle.

[0126] For example, the length R of the first measuring rod 11 The length of the second measuring rod is 20 cm. 22 The constructed angle height comparison table is shown in Table 2 below:

[0127] Table 2:

[0128]

[0129]

[0130] S420: Obtaining, according to the angle-height comparison table, a normal component height corresponding to a normal component angle, a normal substrate height corresponding to a normal substrate angle, a target component height corresponding to a target component angle, and a target substrate height corresponding to a target substrate angle.

[0131] S430: Obtaining the actual height of the component on the target circuit board based on the component's own height, the normal component height, the normal substrate height, the target component height, and the target substrate height.

[0132] Specifically, according to the angle height comparison table, the normal component height corresponding to the normal component angle, the normal substrate height corresponding to the normal substrate angle, the target component height corresponding to the target component angle, and the target substrate height corresponding to the target substrate angle are found from the angle height comparison table.

[0133] Then, the component's own height, normal component height, normal substrate height, target component height, and target substrate height are substituted into a height calculation formula, and the actual height of the component on the target circuit board is calculated using the height calculation formula.

[0134] In the embodiment of the present invention, the height calculation formula is:

[0135] H T =H c +(H t11 -H t12 )-(H t21 -H t22 )

[0136] Among them, H T H is the actual height of the component on the target circuit board. c is the height of the component itself, H t11 is the target component height, H t12 is the normal component height, H t21 is the target substrate height, H t22 Normal substrate height.

[0137] S500: Determine whether the height of the component on the target circuit board is normal based on the actual height.

[0138] Specifically, an allowable error range is set. The error is used to compensate for problems that occur during the welding process of the component but do not affect the use of the component, and can also be used to compensate for slight jitters generated during the transmission of the circuit board. In this embodiment, the error range can be [H0-δ, H0+δ], where H0 is the height of the component itself and δ is a preset allowable height error value. After obtaining the actual height of the component on the target circuit board, the actual height is compared with the error range to determine whether the height of the component on the target circuit board is normal. When the actual height is within the error range, it is determined that the height of the component on the target circuit board is normal. When the actual height is not within the error range, it is determined that the height of the component on the target circuit board is abnormal.

[0139] It should be understood that other ways or methods can also be used to determine whether the height of the component on the target circuit board is normal based on the actual height. Those skilled in the art can adopt any appropriate way or method according to actual needs, and the embodiments of the present invention do not impose any limitations on this.

[0140] For example, in some embodiments, determining whether the height of the component on the target circuit board is normal based on the actual height specifically includes but is not limited to the following steps S510-S540:

[0141] S510: Setting conditional values according to requirements.

[0142] S520: Compare the actual height with the conditional value to determine whether the height of the component is normal.

[0143] S530: When the actual height is greater than or equal to the conditional value, it indicates that the height of the component is abnormal.

[0144] S540: When the actual height is less than the conditional value, it indicates that the height of the component is normal.

[0145] In this step, due to the allowable error range of the welding process and installation process, the height of the component on the circuit board may not be the standard value, but within a certain range above and below the standard value, while not affecting the use of the component. Therefore, the conditional value for judging whether the height of the component is normal is set according to actual needs.

[0146] Specifically, after obtaining the actual height of a component on the target circuit board, the actual height is compared with the conditional value to determine whether the component height is normal. If the actual height is greater than or equal to the conditional value, it indicates that the component height is too high and the component protrudes too much on the target circuit board, and the component height is determined to be abnormal. If the actual height is less than the conditional value, it indicates that the component height is appropriate and the component height on the target circuit board is appropriate, and the component height is determined to be normal.

[0147] For example, in some embodiments, determining whether the height of the component on the target circuit board is normal based on the actual height specifically includes but is not limited to the following steps S550-S590:

[0148] S550: Set conditional values and normal ranges according to requirements.

[0149] S560: Compare whether the difference between the actual height and the conditional value is within a normal range.

[0150] S570: When the difference is within the normal range, it indicates that the height of the component is normal.

[0151] S580: When the difference is greater than the normal range, it indicates that the height of the component is too high.

[0152] S590: When the difference is less than the normal range, it indicates that the component is missing.

[0153] In this step, the condition value and normal range for determining whether the height of the component is normal can be set according to actual needs.

[0154] Specifically, after obtaining the actual height of the component on the target circuit board, a target difference between the actual height and the conditional value is calculated, and the target difference is compared with the normal range to determine whether the height of the component is normal. When the target difference is within the normal range, it means that the height of the component is appropriate and the height of the component on the target circuit board is appropriate, and the height of the component is determined to be normal. When the target difference is greater than the normal range, it means that the component is too protruding on the target circuit board, that is, the actual height is too high, and the height of the component is determined to be too high. When the target difference is less than the normal range, it means that the component is too recessed on the target circuit board, that is, the actual height is too low, and it is determined that the component is missing.

[0155] In some embodiments, after determining whether the height of the component on the target circuit board is normal based on the actual height, the circuit board component height measurement method further includes but is not limited to the following steps S501-S503:

[0156] S501: As the target circuit board flows to the AOI, the judgment result is stored in the AOI output TXT and displayed in the maintenance station result output by the AOI.

[0157] In this step, the judgment results of whether the height of the components on the target circuit board is normal include excessive height, normal height and missing components, that is, excessive height, normal height and missing components.

[0158] After measuring the actual height of the components on the target circuit board and determining whether the height of the components on the target circuit board is normal, the target circuit board is transported to the subsequent process, that is, the target circuit board is transferred to the AOI equipment for optical board measurement, and the judgment result is stored in the output TXT of the AOI equipment and displayed in the maintenance station result output by the AOI equipment.

[0159] It can be understood that the output TXT is a file used by the AOI device to store the judgment result of whether the height of the components on the target circuit board is normal. The output TXT can be any suitable file type, and the output TXT can be stored in any suitable medium.

[0160] S502: Set the overheight and missing parts in the judgment result as abnormal errors.

[0161] S503: If an abnormal error is generated, the abnormal error is displayed in front of the maintenance station result output by the AOI, and a picture of the component taken by the AOI is called out.

[0162] Specifically, the system pre-sets abnormal errors for excessive height and missing components in the judgment results. That is, if the judgment result is excessive height or missing components, the height measurement system generates an abnormal error. If the judgment result is excessive height or missing components, the height measurement system generates an abnormal error message. This abnormal error message is displayed in front of the repair station result output by the AOI equipment, and an image of the component on the target circuit board captured by the AOI equipment is retrieved from the AOI equipment to avoid ignoring the abnormal error message due to information overwriting by the AOI equipment. The specific location of the component on the target circuit board is determined based on the component image, and the component is then processed or the target circuit board is discarded.

[0163] In summary, the method for measuring the height of circuit board components provided in an embodiment of the present invention transmits a normal circuit board to obtain the intrinsic height of the components on the normal circuit board, calibrates the positions of the first and second measuring components, measures the normal component angle generated when the components of the normal circuit board pass through the first measuring component, and measures the normal substrate angle generated when the substrate of the normal circuit board passes through the second measuring component, transmits a target circuit board to a measurement position, measures the target component angle generated when the components of the target circuit board pass through the first measuring component, and measures the target substrate angle generated when the substrate of the target circuit board passes through the second measuring component, obtains the actual height of the component on the target circuit board based on the intrinsic height, the normal component angle, the normal substrate angle, the target component angle, and the target substrate angle, and determines whether the height of the component on the target circuit board is normal based on the actual height. In this embodiment of the present invention, the actual height of the component on the target circuit board can be calculated by measuring the angles of the components and the substrate of the normal circuit board, the target circuit board, and thereby determining whether the height of the component is normal. This method does not affect production efficiency, is cost-effective for height measurement, and improves the accuracy of measurement results.

[0164] An embodiment of the present invention provides a computer-readable storage medium, which stores computer program instructions executable by a processor. When the computer program instructions are executed by the processor, the computer executes any one of the circuit board component height measurement methods provided by the embodiment of the present invention, or executes the steps in any one of the implementation methods of any one of the circuit board component height measurement methods provided by the embodiment of the present invention.

[0165] In some embodiments, the storage medium may be a flash memory, a hard disk, an optical disk, a register, a magnetic surface storage, a removable disk, a CD-ROM, a random access memory (RAM), a read-only memory (ROM), an electrically programmable ROM, an electrically erasable programmable ROM or any other form of storage medium known in the art, or various devices including one or any combination of the above storage media.

[0166] In some embodiments, computer program instructions may be in the form of a program, software, software module, script, or code, written in any form of programming language (including compiled or interpreted languages, or declarative or procedural languages), and may be deployed in any form, including as a stand-alone program or as a module, component, subroutine, or other unit suitable for use in a computing environment.

[0167] As an example, computer program instructions may, but do not necessarily, correspond to a file in a file system, may be stored as part of a file that stores other programs or data, for example, in one or more scripts within a HyperText Markup Language (HTML) document, in a single file dedicated to the program in question, or in multiple coordinated files (for example, files storing one or more modules, subroutines, or code portions).

[0168] As an example, computer program instructions can be deployed to be executed on a computing device (including devices such as smart terminals and servers), or on multiple computing devices located in one location, or on multiple computing devices distributed in multiple locations and interconnected by a communication network. It is easy to understand that all or part of the steps of the method described in the embodiments of the present invention can be directly implemented using electronic hardware or processor-executable computer program instructions, or a combination of the two.

[0169] Those skilled in the art will understand that the embodiments provided by the present invention are merely illustrative, and the order in which the steps in the methods of the embodiments are written does not imply a strict order of execution and does not limit the implementation process. The order can be adjusted, merged, and deleted according to actual needs. The modules or submodules, units or subunits in the devices or systems of the embodiments can be merged, divided, and deleted according to actual needs. For example, the division of units is only a logical function division, and there can be other division methods in actual implementation. For another example, multiple units or components can be combined or integrated into another device, or some features can be ignored or not executed.

[0170] Through the description of the above embodiments, those skilled in the art can clearly understand that each embodiment can be implemented by means of software plus a general hardware platform, and of course can also be implemented by hardware. Those skilled in the art can understand that all or part of the processes in the above-mentioned embodiment methods can be completed by instructing the relevant hardware through a computer program, and the computer program can be stored in a computer-readable storage medium. When the computer program is executed, it can include the processes of the embodiments of the above-mentioned methods.

[0171] It should be noted that the above embodiments are intended to illustrate the technical concepts and features of the present invention, and their purpose is to enable people familiar with this technology to understand the content of the present invention and implement it accordingly, and they cannot be used to limit the scope of protection of the present invention. Ordinary technicians in this field can understand that all or part of the processes of the above embodiments can be implemented according to the technical solutions recorded in the embodiments of the present invention, or some of the technical features can be equivalently replaced. It is understandable that these modifications or replacements do not deviate the essence of the corresponding technical solutions from the scope of the technical solutions of the embodiments of the present invention, and should be regarded as equal changes and modifications based on the embodiments of the present invention, and should all fall within the scope of the claims of the present invention.

Claims

1. A method for measuring the height of a circuit board component, for measuring a circuit board substrate and components disposed on the substrate, characterized in that: The method comprises: Transfer a normal circuit board and obtain the height of the components themselves, and calibrate the positions of the first measuring component and the second measuring component during the transfer process; When the normal circuit board arrives at the measurement position, the normal component angle generated by the component passing through is measured by the first measurement component, and the normal substrate angle generated by the substrate passing through is measured by the second measurement component; Transporting the target circuit board, when the target circuit board arrives at the measurement position, measuring the target component angle generated by the component passing through by the first measurement component, and measuring the target substrate angle generated by the substrate passing through by the second measurement component; Obtain the actual height of the component on the target circuit board based on its own height, normal component angle, normal substrate angle, target component angle and target substrate angle; Based on the actual height, it is determined whether the height of the component on the target circuit board is normal.

2. The method according to claim 1, characterized in that The calibrating the positions of the first measurement component and the second measurement component includes: Establish a coordinate system based on the normal circuit board movement plane and obtain the coordinates of the components in the coordinate system; The positions of the first measuring component and the second measuring component are corrected according to the coordinates of the component, so that the first measuring component and the second measuring component are both located at the coordinates of the corresponding component.

3. The method according to claim 1, characterized in that Before the normal circuit board reaches the measurement position, the method further includes: Determine whether the normal circuit board or the circuit board to be tested has reached the sensing position, where the sensing position is the position before the measurement position; When in the sensing position, high-frequency pulses are emitted and measurement signals returned from the first measurement component and the second measurement component are collected in real time.

4. The method according to claim 3, characterized in that The transmitting of high-frequency pulses and real-time acquisition of measurement signals returned from the first measurement component and the second measurement component include: Obtain the model of the components on a normal circuit board or a circuit board to be tested; Set the high-frequency pulse of corresponding frequency according to different models; High-frequency pulses of corresponding frequencies are emitted and measurement signals returned from the first measurement component and the second measurement component are collected in real time.

5. The method according to claim 1, wherein The actual height of the component on the target circuit board is obtained according to the component's own height, the normal component angle, the normal substrate angle, the target component angle and the target substrate angle, including: Set the angle height comparison table of the target circuit board based on the requirements; According to the angle height comparison table, a normal component height corresponding to a normal component angle, a normal substrate height corresponding to a normal substrate angle, a target component height corresponding to a target component angle, and a target substrate height corresponding to a target substrate angle are obtained; The actual height of the component on the target circuit board is obtained based on the component's own height, normal component height, normal substrate height, target component height and target substrate height.

6. The method according to claim 1, characterized in that The determining whether the height of the component on the target circuit board is normal based on the actual height includes: Set conditional values according to requirements; Compare the actual height with the conditional value to determine whether the height of the component is normal; When the actual height is greater than or equal to the conditional value, it means that the height of the component is abnormal; When the actual height is less than the conditional value, it means that the height of the component is normal.

7. The method according to claim 1, characterized in that The determining whether the height of the component on the target circuit board is normal based on the actual height also includes: Set conditional values and normal ranges according to requirements; Compare the difference between the actual height and the conditional value to see if it is within the normal range; When the difference is within the normal range, it means that the height of the component is normal; When the difference is greater than the normal range, it means that the height of the component is too high; When the difference is smaller than the normal range, it indicates that the component is missing.

8. The method according to claim 1, characterized in that The judgment results include overheight, normal, and missing components. After judging whether the height of the component on the target circuit board is normal based on the actual height, the method further includes: As the target circuit board flows to the AOI, the judgment results are stored in the AOI output TXT file and displayed in the maintenance station results output by the AOI; Set the overheight and missing parts in the judgment results as abnormal errors; If an abnormal error occurs, it will be displayed in front of the maintenance station result output by AOI, and the picture of the component taken by AOI will be called up.

9. A circuit board component height measurement system, characterized in that: include: a controller and a first measurement component and a second measurement component in communication with the controller, wherein the first measurement component is used to measure a component angle generated when a component of a circuit board passes through, and the second measurement component is used to measure a substrate angle generated when a substrate of the circuit board passes through; The controller includes: a processor and a memory communicatively connected to the processor; The memory stores computer program instructions executable by the processor. When the computer program instructions are executed by the processor, the controller executes the method for measuring the height of a circuit board component according to any one of claims 1 to 8.

10. A computer-readable storage medium, characterized in that The computer-readable storage medium stores computer program instructions executable by a processor. When the computer program instructions are executed by the processor, the computer executes the method for measuring the height of a circuit board component according to any one of claims 1 to 8.

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